Power conversion device

Abstract

A power conversion device includes a capacitor, a substrate for mounting a plurality of switching elements for power conversion, a cooler for cooling the plurality of switching elements, a housing for accommodating the capacitor, the substrate, and the cooler, a power supply connector exposed from the housing, an output connector exposed from the housing, and a plurality of wirings including a plurality of power supply wirings electrically connected to the capacitor, the plurality of switching elements, and the power supply connector, and a plurality of output wirings electrically connected to the plurality of switching elements and the output connector, at least one of the plurality of wirings being a wiring including a conductive pattern formed on the substrate.

Description

Technical Field

[0001] This invention relates to power conversion devices. Background Technology

[0002] Known power conversion devices include electrical components mounted on a circuit board, a heat sink for dissipating heat generated by the electrical components, and a box-shaped housing for housing the electrical components and the heat sink (e.g., see Patent Document 1). Additionally, known power conversion devices include a cooler for cooling multiple semiconductor modules and a support frame disposed on the cooler, with the multiple semiconductor modules supported by the support frame (e.g., see Patent Document 2). Furthermore, known power conversion devices include multiple semiconductor modules, a cooler for cooling the multiple semiconductor modules, and a housing for housing the multiple semiconductor modules and the cooler (e.g., see Patent Document 3).

[0003] <Prior art documents>

[0004] <Patent Documents>

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-191388

[0006] Patent Document 2: Japanese Patent Application Publication No. 2016-15863

[0007] Patent Document 3: Japanese Patent Application Publication No. 2011-182628 Summary of the Invention

[0008] <Problem to be solved by this invention>

[0009] Sometimes end users request changes to the location of connectors exposed from the housing of the power conversion device. However, if the change in connector location necessitates design changes such as changes to the layout of internal components of the power conversion device, then losses in time and cost will result from these new design changes.

[0010] This invention provides a power conversion device that can flexibly adapt to design changes that accompany changes in the position of the connector.

[0011] <Methods for solving problems>

[0012] This invention provides a power conversion device, comprising:

[0013] Capacitor;

[0014] A substrate for mounting multiple switching elements for power conversion;

[0015] A cooler is used to cool the aforementioned multiple switching elements;

[0016] A housing for accommodating the capacitor, the substrate, and the cooler;

[0017] A power connector, which protrudes from the aforementioned housing;

[0018] The output connector is exposed from the aforementioned housing; and

[0019] Multiple wirings, including:

[0020] Multiple power wirings electrically connected to the aforementioned capacitors, multiple switching elements, and power connectors; and

[0021] Multiple output wirings are electrically connected to the aforementioned multiple switching elements and the aforementioned output connectors.

[0022] At least one of the aforementioned wirings is a wiring that includes a conductive pattern formed on the aforementioned substrate.

[0023] <The Effects of the Invention>

[0024] According to the present invention, a power conversion device is provided that can flexibly adapt to design changes that accompany changes in the position of the connector. Attached Figure Description

[0025] Figure 1 This is a circuit diagram illustrating an example configuration of a power conversion device in one embodiment.

[0026] Figure 2 This is an exploded perspective view showing a first construction example of a power conversion device in a comparative mode.

[0027] Figure 3 This is a top view showing a first construction example of a power conversion device in a comparative manner.

[0028] Figure 4 This is a top view showing a second construction example of a power conversion device in a comparative manner.

[0029] Figure 5 This is an exploded perspective view showing a first construction example of a power conversion device in one embodiment.

[0030] Figure 6 This is a top view showing a first construction example of a power conversion device in one embodiment.

[0031] Figure 7 This is a top view showing a second construction example of a power conversion device in one embodiment.

[0032] Figure 8 This is an exploded perspective view showing a first modified example of a power conversion device in one embodiment.

[0033] Figure 9 This is a perspective view showing the way the switching element is arranged.

[0034] Figure 10 This is an exploded perspective view showing a second modified example of a power conversion device in one embodiment.

[0035] Figure 11 This is a front view showing a second variation of the power conversion device in one embodiment.

[0036] Figure 12 This is an exploded perspective view showing a third variation of the power conversion device in one embodiment.

[0037] Figure 13 This is a front view showing a fourth variation of the power conversion device in one embodiment. Detailed Implementation

[0038] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that deviations in directions such as parallel, right angle, orthogonal, horizontal, vertical, up / down, and left / right are permissible without impairing the effectiveness of the present invention. Furthermore, the X-axis, Y-axis, and Z-axis directions respectively represent directions parallel to the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis directions are orthogonal to each other. The XY plane, YZ plane, and ZX plane respectively represent imaginary planes parallel to the X-axis and Y-axis, Y-axis and Z-axis, and Z-axis, respectively. Additionally, the shapes of the parts shown in each figure are examples, and the present invention is not limited to these examples.

[0039] Figure 1 This is a circuit diagram illustrating an example configuration of a power conversion device in one embodiment. Figure 1 The power conversion device 101 shown is an inverter that converts DC input power supplied from a pair of power supply terminals, namely the positive terminal 8p and the negative terminal 9n, into desired AC output power. The power conversion device 101 is used, for example, as an inverter to drive an electric motor M2 that rotates the wheels of a vehicle. The applications of the power conversion device of the present invention are not limited thereto.

[0040] The power conversion device 101 includes a positive terminal 8p, a negative terminal 9n, multiple output terminals 2u, 2v, and 2w, a capacitor 56, a power conversion circuit 20, a positive wiring 83, a negative wiring 93, multiple current sensors 28u, 28v, and 28w, a control circuit 17, and a drive circuit 18. The positive wiring 83 has a first positive wiring 80 and a second positive wiring 57. The negative wiring 93 has a first negative wiring 90 and a second negative wiring 58. The control circuit 17, or both the control circuit 17 and the drive circuit 18, can be located in an external device different from the power conversion device 101.

[0041] The positive terminal 8p and the negative terminal 9n are external terminals through which a DC power supply voltage is applied, but not shown. The potential of the positive terminal 8p is higher than that of the negative terminal 9n. Specific examples of DC power supplies include batteries, converters, and regulators.

[0042] Multiple output terminals 2u, 2v, and 2w are external terminals used for inputting and outputting three-phase AC power, and they are connected to the motor M2.

[0043] Capacitor 56 is a capacitive element that smooths the DC power supply voltage applied between the positive terminal 8p and the negative terminal 9n. An example of such a capacitor is an electrolytic capacitor. Capacitor 56 has a first capacitor electrode 51 and a second capacitor electrode 52. The first capacitor electrode 51 is a terminal electrically connected to the positive terminal wiring 83 (first positive terminal wiring 80 and second positive terminal wiring 57), and the second capacitor electrode 52 is a terminal electrically connected to the negative terminal wiring 93 (first negative terminal wiring 90 and second negative terminal wiring 58).

[0044] The power conversion circuit 20 is an inverter circuit used to convert the direct current input from the positive terminal 8p and the negative terminal 9n into the positive wiring 83 and the negative wiring 93 into three-phase alternating current supplied to the motor M2.

[0045] The power conversion circuit 20 is a three-phase bridge circuit with multiple switching elements 21u, 21v, 21w, 22u, 22v, and 22w. It generates three-phase alternating current through the switching of these multiple switching elements. The power conversion circuit 20 has multiple switching elements 21u, 21v, 21w, 22u, 22v, and 22w, as well as multiple output wirings 1u, 1v, and 1w.

[0046] The switching elements 21u and 22u of phase U are connected in series, with their intermediate connection point connected to the output terminal 2u of phase U, which is connected to the phase U coil of motor M2. The switching elements 21v and 22v of phase V are connected in series, with their intermediate connection point connected to the output terminal 2v of phase V, which is connected to the phase V coil of motor M2. The switching elements 21w and 22w of phase W are connected in series, with their intermediate connection point connected to the output terminal 2w of phase W, which is connected to the phase W coil of motor M2.

[0047] Switching elements 21u, 21v, and 21w are semiconductor elements having first main electrodes 23u, 23v, and 23w, second main electrodes 25u, 25v, and 25w, and first control electrodes 14u, 14v, and 14w, respectively. The first main electrodes 23u, 23v, and 23w are all electrically connected to the second positive terminal wiring 57. The second main electrodes 25u, 25v, and 25w are respectively electrically connected to their corresponding output wirings 1u, 1v, and 1w, and are also electrically connected to their corresponding output terminals 2u, 2v, and 2w via their respective output wirings 1u, 1v, and 1w. The first control electrodes 14u, 14v, and 14w are all electrically connected to the drive circuit 18.

[0048] Switching elements 22u, 22v, and 22w are semiconductor elements having third main electrodes 29u, 29v, and 29w, fourth main electrodes 24u, 24v, and 24w, and second control electrodes 15u, 15v, and 15w, respectively. The third main electrodes 29u, 29v, and 29w are electrically connected to their corresponding output lines 1u, 1v, and 1w, and are also electrically connected to their corresponding output terminals 2u, 2v, and 2w via their respective output lines 1u, 1v, and 1w. The fourth main electrodes 24u, 24v, and 24w are all electrically connected to the second negative electrode line 58. The second control electrodes 15u, 15v, and 15w are all electrically connected to the drive circuit 18.

[0049] For each switching element 21u, 21v, and 21w, the diodes are connected in reverse parallel between the first and second main electrodes. For each switching element 22u, 22v, and 22w, the diodes are connected in reverse parallel between the third and fourth main electrodes.

[0050] Switching elements 21u, 21v, and 21w are voltage-driven semiconductor devices having a control electrode (gate), a first main electrode (collector or drain), and a second main electrode (emitter or source). Switching elements 22u, 22v, and 22w are voltage-driven semiconductor devices having a control electrode (gate), a third main electrode (collector or drain), and a fourth main electrode (emitter or source). Specific examples of switching elements include MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and IGBTs (Insulated Gate Bipolar Transistors). Figure 1 Examples are shown where the switching elements 21u, 21v, 21w, 22u, 22v, and 22w are IGBTs with gate, collector, and emitter.

[0051] The switching elements 21u, 21v, 21w, 22u, 22v, and 22w can be switching elements made of semiconductors such as Si (silicon), or wide-bandgap semiconductors such as SiC (silicon carbide), GaN (gallium nitride), Ga2O3 (gallium oxide), and diamond. By applying wide-bandgap semiconductors to the switching elements, the effect of reducing switching losses is improved.

[0052] Positive wiring 83 and negative wiring 93 are conductive wiring components that are supplied with DC power from a DC power source (not shown) connected via positive terminal 8p and negative terminal 9n.

[0053] The positive terminal wiring 83 is a conductive component electrically connected to the positive terminal 8p, the first capacitor electrode 51, and the first main electrodes 23u, 23v, and 23w. The positive terminal wiring 83 is formed by one or more components; in this example, it includes a first positive terminal wiring 80 and a second positive terminal wiring 57. The first positive terminal wiring 80 is a wiring component electrically connected between the positive terminal 8p and the first capacitor electrode 51. The second positive terminal wiring 57 is a wiring component electrically connected between the first capacitor electrode 51 and the first main electrodes 23u, 23v, and 23w.

[0054] The negative terminal wiring 93 is a conductive component electrically connected to the negative terminal 9n, the second capacitor electrode 52, and the fourth main electrodes 24u, 24v, and 24w. The negative terminal wiring 93 is formed by one or more components; in this example, it includes a first negative terminal wiring 90 and a second negative terminal wiring 58. The first negative terminal wiring 90 is a wiring component electrically connected between the negative terminal 9n and the second capacitor electrode 52. The second negative terminal wiring 58 is a wiring component electrically connected between the second capacitor electrode 52 and the fourth main electrodes 24u, 24v, and 24w.

[0055] Output wiring 1u is a conductive wiring component electrically connected to output terminal 2u, the second main electrode 25u, and the third main electrode 29u. Output wiring 1v is a conductive wiring component electrically connected to output terminal 2v, the second main electrode 25v, and the third main electrode 29v. Output wiring 1w is a conductive wiring component electrically connected to output terminal 2w, the second main electrode 25w, and the third main electrode 29w. Output wirings 1u, 1v, and 1w are each formed by one or more components.

[0056] The current sensor 28u for phase U detects the phase U current flowing through the output wiring 1u of phase U and outputs a phase U current detection signal, indicating the magnitude of the detected phase U current, to the control circuit 17. The current sensor 28v for phase V detects the phase V current flowing through the output wiring 1v of phase V and outputs a phase V current detection signal, indicating the magnitude of the detected phase V current, to the control circuit 17. The current sensor 28w for phase W detects the phase W current flowing through the output wiring 1v of phase W and outputs a phase W current detection signal, indicating the magnitude of the detected phase W current, to the control circuit 17.

[0057] The control circuit 17 uses at least two of the current detection signals from the U-phase current detection signal, the V-phase current detection signal, and the W-phase current detection signal to generate a control signal (e.g., a pulse width modulation signal) for generating three-phase AC power from DC power using a known method.

[0058] The drive circuit 18 generates multiple drive signals for driving the switching elements 21u, 21v, 21w, 22u, 22v, and 22w using a known method, in order to generate three-phase alternating current, based on the control signal supplied by the self-control circuit 17. The drive circuit 18 supplies these multiple drive signals to the corresponding control electrodes 14u, 14v, 14w, 15u, 15v, and 15w. This allows three-phase alternating current to flow through the motor M2.

[0059] Next, before describing the power conversion device in one embodiment, refer to Figure 2 , 3A first construction example of a power conversion device in a comparison method will be described. Figure 2 This is an exploded perspective view showing a first construction example of a power conversion device in a comparative mode. Figure 3 This is a top view showing a first construction example of a power conversion device in a comparative configuration. For clarity, the internal structure of the housing 6 that forms the shape of the power conversion device is shown below. Figure 2 The illustration of casing 6 is omitted. Figure 3 The diagram of the control board 16 is omitted. Figure 2 , 3 The power conversion device 100 in one of the comparison methods shown has Figure 1 The circuit shown is constructed as follows.

[0060] The power conversion device 100 includes a housing 6, a power connector 7, an output connector 2, a capacitor 56, a power conversion module 19, a control board 16, multiple buses such as a first positive bus 80b, a current sensor module 28, and a cooler 30.

[0061] Housing 6 houses various internal components of the power conversion device 100. Power connector 7 connects to a power harness (not shown) via which a DC power source (not shown) is connected. Output connector 2 connects to an output harness (not shown) via which a motor M2 (see reference 1) is connected. Figure 1 Connection. In this example, the power connector 7 and the output connector 2 are separate components, but they can also be integrated as one unit.

[0062] The power connector 7 protrudes from the housing 6 and is fixed to the housing 6. The power connector 7 has a positive terminal 8p and a negative terminal 9n.

[0063] The output connector 2 protrudes from the housing 6 and is fixed to the housing 6. The output connector 2 has multiple output terminals 2u, 2v, and 2w.

[0064] The capacitor 56 is housed within the housing 6. The capacitor 56 has a first capacitor electrode 51 and a second capacitor electrode 52 that are separated from each other in the Y-axis direction.

[0065] The power conversion module 19 is a packaged component for the built-in switching elements 21u, 21v, 21w, 22u, 22v, and 22w.

[0066] The control board 16 is used to mount the drive circuit 18 and the control circuit 17. The drive circuit 18 drives the switching elements 21u, 21v, 21w, 22u, 22v, and 22w in the power conversion module 19 by generating three-phase alternating current according to the control signal supplied by the control circuit 17.

[0067] The first positive busbar 80b is a first positive wiring 80 used to form an electrical connection between the positive terminal 8p and the first capacitor electrode 51. Figure 1 The first negative busbar 90b is a component used to form the first negative wiring 90 (for making an electrical connection between the negative terminal 9n and the second capacitor electrode 52). Figure 1 ) components.

[0068] The second positive busbar 23ub, the third positive busbar 23vb, and the fourth positive busbar 23wb are components used to form a second positive wiring 57 that electrically connects the first capacitor electrode 51 and the first main electrodes 23u, 23v, and 23w. At least a portion of the busbars used to form the second positive wiring 57 is covered by the capacitor 56.

[0069] The second negative busbar 24ub, the third negative busbar 24vb, and the fourth negative busbar 24wb are components used to form the second negative wiring 58, which electrically connects the second capacitor electrode 52 and the fourth main electrodes 24u, 24v, and 24w. A portion of the busbars used to form the second negative wiring 58 is covered by the capacitor 56.

[0070] The first U-phase bar 27ub and the second U-phase bar 26ub are used to form an output wiring 1u that electrically connects the output terminal 2u to the second main electrode 25u and the third main electrode 29u. Figure 1 The first V-phase bar 27vb and the second V-phase bar 26vb are components used to form the output wiring 1v that electrically connects the output terminal 2v to the second main electrode 25v and the third main electrode 29v. Figure 1 The first W phase bar 27wb and the second W phase bar 26wb are components used to form the output wiring 1w that electrically connects the output terminal 2w to the second main electrode 25w and the third main electrode 29w. Figure 1 ) components.

[0071] The current sensor module 28 is a packaged component for housing current sensors 28u, 28v, and 28w.

[0072] Cooler 30 is used to cool power conversion module 19. Cooler 30 has cooling pipe 33, supply pipe 34, and discharge pipe 35. Cooling pipe 33 extends in the Y-axis direction and has one or more flow paths through which refrigerant such as cooling water flows. Supply pipe 34 is a component for supplying refrigerant flowing in from the inlet to cooling pipe 33. Discharge pipe 35 is a component for discharging refrigerant flowing out of cooling pipe 33 from the outlet.

[0073] In the power conversion device 100, since the capacitor 56 and the power conversion module 19 are connected with the shortest possible distance, and the output side of the power conversion module 19 is connected to the output connector 2 via the current sensor module 28, various internal components such as Figure 2 , 3 The input / output connectors are arranged as shown. However, there are cases where customers request changes to the positions of the input / output connectors (power connector 7 and output connector 2). In such cases, to accommodate changes to the positions of the input / output connectors, it is sometimes necessary to modify the layout of components, buses, etc., and the terminal positions of the power conversion module 19.

[0074] For example, suppose there is the following customer requirement: They want the input / output connectors to be positioned on the side facing the housing 6 in the positive X-axis direction ( Figure 3 The side facing the positive Y-axis direction of housing 6 has been changed. Figure 4 In this case, in addition to changes in the layout of the cooler 30, power conversion module 19, current sensor module 28, and various busbars, it is sometimes necessary to customize the terminal positions of the power conversion module 19. Thus, in a power conversion device 100 in a comparative embodiment, changes in the positions of the input and output connectors can result in losses in time and cost due to the new design changes.

[0075] In contrast, in a power conversion device according to one embodiment of the present invention, at least a portion of the plurality of wirings is not formed via busbars, but rather via conductive patterns formed on a substrate. Therefore, changes in the connector position can be addressed by changing the conductive patterns formed on the substrate, thus providing greater flexibility in responding to design changes accompanying connector position changes compared to addressing changes via busbar changes. Next, various structural examples of a power conversion device according to one embodiment will be described in detail.

[0076] Figure 5 This is an exploded perspective view showing a first construction example of a power conversion device in one embodiment. Figure 6 This is a top view showing a first structural example of a power conversion device in one embodiment. For clarity, the internal structure of the housing 6 that forms the shape of the power conversion device is shown below. Figure 5 The illustration of housing 6 is omitted. Figure 5 , 6 The power conversion device 101 in one embodiment shown has Figure 1 The circuit shown is constructed as follows.

[0077] The power conversion device 101 includes a housing 6, a power connector 7, an output connector 2, a capacitor 56, switching elements 21u, 21v, 21w, 22u, 22v, 22w, a substrate 40, multiple patterns such as a first positive electrode pattern 80p, a current sensor circuit 28p, and a cooler 30.

[0078] The housing 6 is used to house various internal components of the power conversion device 101 (in this case, capacitor 56, cooler 30, and substrate 40 for mounting switching elements 21u, etc.). In this example, the housing 6 is a hexahedral box, but it can also be a polyhedral box other than a hexahedron. The housing 6 has housing surfaces 6a and 6b opposite each other in the X-axis direction, 6c and 6d opposite each other in the Y-axis direction, and housing surfaces opposite each other in the Z-axis direction. The housing 6, for example, has a structure including a box for directly or indirectly mounting various internal components, and a cover covering the various internal components on the box.

[0079] Power connector 7 connects to a power harness (not shown) and is connected via this power harness to a DC power source (not shown). Output connector 2 connects to an output harness (not shown) and is connected via this output harness to motor M2 (see reference). Figure 1 Connection. In this example, the power connector 7 and the output connector 2 are separate components, but they can be integrated as one unit.

[0080] The power connector 7 is a component that protrudes from the housing surface 6a. The power connector 7 is exposed from and fixed to the housing surface 6a. The power connector 7 has a positive terminal 8p and a negative terminal 9n. The positive terminal 8p and the negative terminal 9n are exposed from the housing surface 6a of the housing 6.

[0081] The output connector 2 is a component that protrudes from the housing surface 6a. That is, the output connector 2 is located on the same housing surface 6a as the power connector 7. The output connector 2 protrudes from and is fixed to the housing surface 6a. The output connector 2 has multiple output terminals 2u, 2v, and 2w. These multiple output terminals 2u, 2v, and 2w protrude from the housing surface 6a of the housing 6.

[0082] Capacitor 56 is housed within housing 6. Capacitor 56 has a first capacitor electrode 51 and a second capacitor electrode 52 disposed separately from each other in the Y-axis direction. The first capacitor electrode 51 is a terminal located on the negative Y-axis side of capacitor 56, protruding from the positive Z-axis side of capacitor 56's front surface 56a. The second capacitor electrode 52 is a terminal located on the positive Y-axis side of capacitor 56, protruding from the positive Z-axis side of capacitor 56's front surface 56a.

[0083] Switching elements 21u, 21v, and 21w are arranged in the Y-axis direction. Switching elements 22u, 22v, and 22w are arranged in the Y-axis direction on the X-axis side (positive X-axis direction in this example) relative to switching elements 21u, 21v, and 21w. The multiple switching elements 21u, 21v, 21w, 22u, 22v, and 22w for power conversion are chip-type surface mount devices mounted on the lower surface 46 of the substrate 40.

[0084] The substrate 40 has a lower surface 46 opposite to the upper surface 33a of the cooler 30 and an upper surface 47 opposite to the lower surface 46. The substrate 40 is used for mounting, for example, a drive circuit 18 and a control circuit 17. The drive circuit 18 drives the switching elements 21u, 21v, 21w, 22u, 22v, and 22w in a manner that generates three-phase alternating current according to the control signal supplied by the control circuit 17.

[0085] The first positive electrode pattern 80p is used to form the first positive electrode wiring 80, which electrically connects the positive terminal 8p and the first capacitor electrode 51. Figure 1 The first positive electrode pattern 80p is a conductive power supply wiring pattern formed on the substrate 40. The first negative electrode pattern 90p is used to form the first negative electrode wiring 90, which electrically connects the negative terminal 9n and the second capacitor electrode 52. Figure 1 The first negative electrode pattern 90p is a conductive power wiring pattern formed on the substrate 40.

[0086] The second positive electrode pattern 23up, the third positive electrode pattern 23vp, and the fourth positive electrode pattern 23wp are used to form a second positive electrode wiring 57 that electrically connects the first capacitor electrode 51 and the first main electrodes 23u, 23v, and 23w. The second positive electrode pattern 23up, the third positive electrode pattern 23vp, and the fourth positive electrode pattern 23wp are conductive power supply wiring patterns formed on the substrate 40.

[0087] The second negative electrode pattern 24up, the third negative electrode pattern 24vp, and the fourth negative electrode pattern 24wp are used to form a second negative electrode wiring 58 that electrically connects the second capacitor electrode 52 and the fourth main electrodes 24u, 24v, and 24w. The second negative electrode pattern 24up, the third negative electrode pattern 24vp, and the fourth negative electrode pattern 24wp are conductive power supply wiring patterns formed on the substrate 40.

[0088] U-phase pattern 27up is used to form output wiring 1u that is electrically connected to output terminal 2u, second main electrode 25u, and third main electrode 29u. Figure 1 The V-phase pattern 27vp is used to form the output wiring 1v, which is electrically connected to the output terminal 2v, the second main electrode 25v, and the third main electrode 29v. Figure 1Phase W pattern 27wp is used to form output wiring 1w that is electrically connected to output terminal 2w, second main electrode 25w, and third main electrode 29w. Figure 1 The U-phase pattern 27up, V-phase pattern 27vp, and W-phase pattern 27wp are conductive power wiring patterns formed on the substrate 40.

[0089] The current sensor circuit 28p is used to detect the U-phase current flowing through the U-phase pattern 27up, the W-phase current flowing through the V-phase pattern 27vp, and the W-phase current flowing through the W-phase pattern 27wp. The current sensor circuit 28p is electrically connected to the control circuit 17, and it outputs the current detection signals of each phase to the control circuit 17.

[0090] Cooler 30 is used to cool switching elements 21u, 21v, 21w and switching elements 22u, 22v, 22w. Cooler 30 extends in the Y-axis direction and is located between capacitor 56 and input / output connectors (power connector 7 and output connector 2). Cooler 30 has cooling pipe 33, supply pipe 34 and discharge pipe 35.

[0091] Cooling pipe 33 extends in the Y-axis direction and has only one or more flow paths through which refrigerant such as cooling water flows. Supply pipe 34 is a component for supplying refrigerant flowing in from the inlet to cooling pipe 33. Discharge pipe 35 is a component for discharging refrigerant flowing out of cooling pipe 33 from the outlet.

[0092] The cooling pipe 33 has an upper surface 33a that is opposite to the lower surface 46 of the substrate 40 in the Z-axis direction. The upper surface 33a of the cooler 30 is in contact with a plurality of switching elements 21u, 21v, 21w, 22u, 22v, 22w (specifically, the back side opposite to the mounting surface), thereby enabling efficient cooling through heat exchange with the plurality of switching elements 21u, 21v, 21w, 22u, 22v, 22w.

[0093] Thus, the power conversion device 101 includes a plurality of wirings, including a plurality of power wirings electrically connected to the capacitor 56, a plurality of switching elements, and the power connector 7, and a plurality of output wirings electrically connected to the plurality of switching elements and the output connector 2. Furthermore, at least one of the plurality of wirings includes a wiring comprising a conductive pattern formed on the substrate 40.

[0094] More specifically, in the power conversion device 101, the plurality of first power lines electrically connecting the power connector 7 and the capacitor 56 are wirings that include conductive power wiring patterns formed on the substrate 40. In this example, the plurality of first power lines (first positive wire 80 and first negative wire 90) are wirings that include conductive power wiring patterns (first positive pattern 80p and first negative pattern 90p) formed on the substrate 40. Therefore, changes in the position of the power connector 7 can be addressed by changing the first positive pattern 80p and the first negative pattern 90p, thus allowing for flexible adaptation to design changes accompanying changes in the position of the power connector 7. For example, for the housing surface 6a (where the position of the power connector 7 is on the positive X-axis direction of the housing 6) Figure 6 The shell surface 6c on the positive Y-axis side of the shell 6 is changed. Figure 7 This allows for flexible adaptation by changing the wiring layout of the first positive electrode pattern 80p and the first negative electrode pattern 90p. It should be noted that at least one of the first positive electrode wiring 80 and the first negative electrode wiring 90 may be a wiring that includes a conductive power supply wiring pattern formed on the substrate 40. Alternatively, neither the first positive electrode wiring 80 nor the first negative electrode wiring 90 may be a wiring that includes a conductive power supply wiring pattern formed on the substrate 40.

[0095] Furthermore, in the power conversion device 101, the multiple second power supply lines electrically connecting the capacitor 56 and multiple switching elements are wirings that include conductive power supply wiring patterns formed on the substrate 40. In this example, the multiple second power supply lines (second positive line 57 and second negative line 58) are wirings that include conductive power supply wiring patterns (second positive pattern 23up, third positive pattern 23vp, fourth positive pattern 23wp, second negative pattern 24up, third negative pattern 24vp, and fourth negative pattern 24wp) formed on the substrate 40. Therefore, changes in the position of the power connector 7 can be addressed by changing the second positive pattern 23up, etc., thereby allowing for flexible adaptation to design changes accompanying changes in the position of the power connector 7. For example, for the housing surface 6a (where the position of the power connector 7 is on the positive X-axis direction of the housing 6) Figure 6 The shell surface 6c on the positive Y-axis side of the shell 6 is changed. Figure 7 This allows for flexible adaptation by changing the wiring layout of the second positive electrode pattern 23up, etc. It should be noted that at least one of the second positive electrode wiring 57 and the second negative electrode wiring 58 can be a wiring that includes a conductive power supply wiring pattern formed on the substrate 40. Alternatively, neither the second positive electrode wiring 57 nor the second negative electrode wiring 58 may be a wiring that includes a conductive power supply wiring pattern formed on the substrate 40.

[0096] Furthermore, in the power conversion device 101, the multiple output wirings electrically connecting the output connector 2 and multiple switching elements are wirings that include conductive output wiring patterns formed on the substrate 40. In this example, the multiple output wirings (output wirings 1u, 1v, 1w) are wirings that include conductive output wiring patterns (U-phase pattern 27up, V-phase pattern 27vp, and W-phase pattern 27wp) formed on the substrate 40. Therefore, changes in the position of the output connector 2 can be addressed by changing the U-phase pattern 27up, V-phase pattern 27vp, and W-phase pattern 27wp, thereby allowing for flexible adaptation to design changes accompanying changes in the position of the output connector 2. For example, for housing surface 6a (where the position of the output connector 2 is on the positive X-axis direction of the housing 6) Figure 6 The shell surface 6c on the positive Y-axis side of the shell 6 is changed. Figure 7 It can flexibly adapt to changes in the wiring layout, such as the U-phase pattern 27up. It should be noted that at least one of the output wirings 1u, 1v, and 1w can be wiring that includes a conductive power wiring pattern formed on the substrate 40. Alternatively, the output wirings 1u, 1v, and 1w may not all include a conductive power wiring pattern formed on the substrate 40.

[0097] Additionally, the current sensor circuit 28p is a current sensor mounted on the substrate 40, used to detect the current flowing through the U-phase pattern 27up, V-phase pattern 27vp, and W-phase pattern 27wp. By employing such a current sensor circuit 28p, design changes accompanying changes in the position of the output connector 2 can be flexibly accommodated.

[0098] Furthermore, the capacitor 56 has multiple capacitor electrodes (first capacitor electrode 51 and second capacitor electrode 52) disposed on its upper surface (in this example, the front surface 56a of the capacitor) opposite the lower surface 46 of the substrate 40. The first capacitor electrode 51 is electrically connected to the power wiring patterns of multiple second power wirings (in this example, the second positive pattern 23up, the third positive pattern 23vp, and the fourth positive pattern 23wp). The second capacitor electrode 52 is electrically connected to the power wiring patterns of multiple second power wirings (in this example, the second negative pattern 24up, the third negative pattern 24vp, and the fourth negative pattern 24wp). Thus, since the multiple capacitor electrodes are electrically connected to the power wiring patterns of multiple second power wirings, design changes that accompany changes in the position of the power connector 7 can be flexibly accommodated.

[0099] Furthermore, the substrate 40 has a lower surface 46 opposite to the upper surface 33a of the cooler 30, and a plurality of switching elements 21u and the like are mounted on the lower surface 46. As a result, the individual configuration positions of the plurality of switching elements 21u and the like in the lower surface 46 can be easily changed, thereby enabling flexible adaptation to design changes that accompany changes in the position of the power connector 7 or the output connector 2.

[0100] Furthermore, the drive circuit 18 for driving multiple switching elements 21u, etc., can be mounted on a common substrate 40 for mounting multiple switching elements 21u, etc., or it can be mounted on other substrates. By mounting the drive circuit 18 on the common substrate 40 shared with multiple switching elements 21u, etc., the power conversion device 101 can be miniaturized compared to mounting it on other substrates.

[0101] Furthermore, the control circuit 17, which supplies control signals to the drive circuit 18, can be mounted on a common substrate 40 for mounting multiple switching elements 21u, or it can be mounted on other substrates. By mounting the control circuit 17 on the common substrate 40 shared with multiple switching elements 21u, compared to mounting it on other substrates, the power conversion device 101 can be miniaturized.

[0102] Figure 8 This is an exploded perspective view showing a first modified example of a power conversion device in one embodiment. Figure 8 The power conversion device 101A shown is a first modification of the aforementioned power conversion device 101. It should be noted that... Figure 8 The illustration of the conductive pattern formed on the substrate 40 is omitted.

[0103] The upper surface 33a of the cooler 30 has recesses 33aa for inserting multiple switching elements 21u, 21v, 21w, 22u, 22v, and 22w. With the multiple switching elements 21u, etc., inserted into the recesses 33aa, the substrate 40 is fixed relative to the cooler 30, thereby enabling efficient cooling of the multiple switching elements 21u, etc., from their surroundings. The recesses 33aa can be holes or grooves. Figure 5 In its configuration, the switching element is cooled by single-sided cooling, where heat exchange occurs between the single side in contact with the cooler 30. In contrast, in... Figure 8 In its configuration, since the switching element is inserted into the cooler 30, the cooling method of the switching element is double-sided cooling, which involves heat exchange between at least two surfaces. Therefore, with Figure 5 Compared to its composition, Figure 8 In its composition, cooling efficiency is improved.

[0104] Figure 8The multiple switching elements 21u shown are through-hole mounting components with the Z-axis as the length direction, and each is electrically connected in multiple through-holes 48 formed on the substrate 40 by welding or the like. Figure 9 As shown, multiple switching elements 21u, etc., can be surface-mount components with the Z-axis as the length direction.

[0105] Figure 10 This is an exploded perspective view showing a second modified example of a power conversion device in one embodiment. Figure 11 This is a front view showing a second variation of the power conversion device in one embodiment. Figure 10 , 11 The power conversion device 101B shown is a second modification of the aforementioned power conversion device 101. It should be noted that... Figure 10 The illustration of the second positive electrode pattern 23up formed on the substrate 40 is omitted. Furthermore, although... Figure 10 The diagram shows the power connector 7 and the output connector 2 as a single unit, but they can also be separate components.

[0106] Connector 10 is an integrated component of power connector 7 and output connector 2, and is mounted on the lower surface 46 side of substrate 40. Connector 10 has multiple terminals for electrical connection with conductive patterns of multiple wirings formed on substrate 40. Connector 10 has a positive terminal 8p, a negative terminal 9n, and output terminals 2u, 2v, and 2w, and multiple connection terminals 10p, 10n, 10u, 10v, and 10w. The multiple connection terminals 10p, 10n, 10u, 10v, and 10w are electrodes electrically connected to the positive terminal 8p, the negative terminal 9n, and the output terminals 2u, 2v, and 2w, respectively, and are located on the connector surface 10a of connector 10 facing the positive Z-axis direction.

[0107] The connector 10 and the substrate 40 are fixed to each other by a first fixing member. In this example, they are fastened together by a plurality of fastening members 44 such as screws. A plurality of connection terminals 10p, 10n, 10u, 10v, and 10w are electrically connected to conductive patterns of a plurality of wirings via the conductive first fixing member such as the fastening member 44. Thus, the conductive first fixing member can be used for both mechanical and electrical connections. The plurality of connection terminals 10p, 10n, 10u, 10v, and 10w are respectively electrically connected to a first positive electrode pattern 80p, a first negative electrode pattern 90p, a U-phase pattern 27up, a V-phase pattern 27vp, and a W-phase pattern 27wp.

[0108] For example, the externally threaded fastening member 44 is inserted into multiple internally threaded holes formed in multiple connecting terminals 10p, 10n, 10u, 10v, and 10w, and multiple substrate through holes formed in the substrate 40. Thus, the connector 10 and the substrate 40 are fastened together, and the multiple connecting terminals 10p, 10n, 10u, 10v, and 10w are electrically connected to the first positive electrode pattern 80p, the first negative electrode pattern 90p, the U-phase pattern 27up, the V-phase pattern 27vp, and the W-phase pattern 27wp, respectively. It should be noted that the multiple connecting terminals 10p, 10n, 10u, 10v, and 10w can be electrically connected to multiple pads (not shown) formed on the lower surface 46 of the substrate 40.

[0109] The substrate 40 and capacitor 56 are fixed to each other by a second fixing member, which in this example is fastened to each other by a plurality of screws or other fastening members 43. The first capacitor electrode 51 and the second capacitor electrode 52 are electrically connected to a power wiring pattern of a plurality of second power wirings via a conductive second fixing member such as the fastening member 43. Thus, the conductive second fixing member can be used for both mechanical and electrical connections. The first capacitor electrode 51 is electrically connected to the first substrate electrode 41 formed on the substrate 40, and the second capacitor electrode 52 is electrically connected to the second substrate electrode 42 formed on the substrate 40. The first substrate electrode 41 is electrically connected to a conductive power wiring pattern for forming the second positive electrode wiring 57, and the second substrate electrode 42 is electrically connected to a conductive power wiring pattern for forming the second negative electrode wiring 58.

[0110] For example, the externally threaded fastening member 43 is inserted into the internally threaded hole formed in the first capacitor electrode 51 and the substrate through-hole formed in the first substrate electrode 41. Thus, the substrate 40 and the capacitor 56 are fastened together, and the first capacitor electrode 51 is electrically connected to the first substrate electrode 41. Similarly, the externally threaded fastening member 43 is inserted into the internally threaded hole formed in the second capacitor electrode 52 and the substrate through-hole formed in the second substrate electrode 42. Thus, the substrate 40 and the capacitor 56 are fastened together, and the second capacitor electrode 52 is electrically connected to the second substrate electrode 42. It should be noted that the first capacitor electrode 51 and the second capacitor electrode 52 can be electrically connected to a plurality of pads (not shown) formed on the lower surface 46 of the substrate 40.

[0111] Furthermore, although not shown, the first positive electrode pattern 80p and the first negative electrode pattern 90p can be electrically connected to the plurality of electrodes of the capacitor 56, which are provided in the same manner as the second positive electrode wiring 57 and the second negative electrode wiring 58, via the second fixing member. Thus, the conductive second fixing member can be used for both mechanical and electrical connections.

[0112] Figure 12This is an exploded perspective view showing a third variation of the power conversion device in one embodiment. Figure 12 The power conversion device 101C shown is a third modification of the power conversion device 101 described above. In the third modification, the connector 11 replaces the plurality of connection terminals 10p, 10n, 10u, 10v, 10w of the connector 10 in the second modification and has a plurality of lead terminals 11p, 11n, 11u, 11v, 11w.

[0113] Multiple lead terminals 11p, 11n, 11u, 11v, and 11w are fixed in multiple through holes (not shown) formed on the substrate 40 by a first fixing member that is conductive, such as solder, thereby fixing the connector 11 to the substrate 40.

[0114] Figure 13 This is a front view showing a fourth variation of the power conversion device in one embodiment. Figure 13 The power conversion device 101D shown is a fourth modification of the power conversion device 101 described above. In this fourth modification, multiple connection terminals 10p, 10n, 10u, 10v, and 10w are electrically connected to the first positive electrode pattern 80p, the first negative electrode pattern 90p, the U-phase pattern 27up, the V-phase pattern 27vp, and the W-phase pattern 27wp, respectively, via multiple conductive busbars 12. One end of each of the multiple busbars 12 is securely connected to the multiple connection terminals 10p, 10n, 10u, 10v, and 10w via multiple screws or other fastening members 45. The other end of each of the multiple busbars 12 is electrically connected to the first positive electrode pattern 80p, the first negative electrode pattern 90p, the U-phase pattern 27up, the V-phase pattern 27vp, and the W-phase pattern 27wp via multiple screws or other conductive fastening members 44 (an example of a first fixing member).

[0115] While the power conversion device has been described above through embodiments, the present invention is not limited to the above embodiments. Within the scope of the present invention, various modifications and improvements, such as combinations, substitutions, etc., with some or all of the other embodiments are possible.

[0116] For example, the power conversion device of the present invention is not limited to an inverter for generating three-phase AC, but can also be an inverter for generating AC other than three-phase.

[0117] Furthermore, the power conversion device of the present invention is not limited to an inverter for converting DC to AC, but can also be a converter for converting DC to DC. Specific examples include a boost converter that boosts the input voltage, a buck converter that bucks the input voltage, and a buck-boost converter that boosts or bucks the input voltage.

[0118] This international application claims priority to Japanese Patent Application No. 2020-038108, filed on March 5, 2020, and the entire contents of Japanese Patent Application No. 2020-038108 are incorporated herein by reference.

[0119] Explanation of reference numerals in the attached figures

[0120] 1u, 1v, 1w output wiring

[0121] 2 Output Connectors

[0122] 2u, 2v, 2w output terminals

[0123] 6. Shell

[0124] 7 Power connector

[0125] 8p positive extreme

[0126] 9n negative extreme particle

[0127] 10, 11 connectors

[0128] 12 busbars

[0129] 14u, 14v, 14w First control electrode

[0130] 15u, 15v, 15w Second control electrode

[0131] 16 Control board

[0132] 17 Control Circuit

[0133] 18. Drive Circuit

[0134] 19 Power Conversion Module

[0135] 20 Power conversion circuit

[0136] 21u, 21v, 21w, 22u, 22v, 22w switching elements

[0137] 23u, 23v, 23w First main electrode

[0138] 23up Second Positive Pattern

[0139] 23vp Third Positive Electrode Pattern

[0140] 23wp Fourth Positive Electrode Pattern

[0141] 24u, 24v, 24w Fourth main electrode

[0142] 24up Second Negative Electrode Pattern

[0143] 24vp Third negative electrode pattern

[0144] 24wp Fourth negative electrode pattern

[0145] 25u, 25v, 25w Second main electrode

[0146] 27up U-phase pattern

[0147] 27vp V-phase pattern

[0148] 27wp W phase pattern

[0149] 28 Current sensor module

[0150] 28p Current Sensor Circuit

[0151] 28u, 28v, 28w current sensors

[0152] 29u, 29v, 29w Third main electrode

[0153] 30 Cooler

[0154] 33a Upper surface

[0155] 33aa recess

[0156] 40 substrate

[0157] 46 Lower surface

[0158] 48 through holes

[0159] 51 First capacitor electrode

[0160] 52 Second capacitor electrode

[0161] 56 Capacitor

[0162] 56a capacitor front side

[0163] 57 Second positive electrode wiring

[0164] 58 Second negative electrode wiring

[0165] 80 First positive electrode wiring

[0166] 80p First Positive Pattern

[0167] 83 Positive wiring

[0168] 90 First negative electrode wiring

[0169] 90p First negative electrode pattern

[0170] 93 Negative wiring

[0171] 100, 101, 101A, 101B, 101C, 101D Power conversion devices

Claims

1. A power conversion device comprising: a capacitor; a substrate for mounting a plurality of switching elements for power conversion; a cooler for cooling the plurality of switching elements; a housing for accommodating the capacitor, the substrate, and the cooler; a power supply connector exposed from the housing; an output connector exposed from the housing; and a plurality of wirings including: a plurality of power supply wirings electrically connected to the capacitor, the plurality of switching elements, and the power supply connector; and a plurality of output wirings electrically connected to the plurality of switching elements and the output connector, at least one of the plurality of wirings is a wiring including a conductive pattern formed on the substrate, at least a portion of the conductive pattern formed on the substrate is formed in accordance with a position at which at least one of the power supply connector and the output connector is arranged in the power conversion device, the capacitor and the cooler are arranged at positions not overlapping with each other in plan view.

2. The power conversion device according to claim 1, wherein the plurality of switching elements are arranged at positions not overlapping with the power supply connector in plan view on the substrate.

3. The power conversion device according to claim 1, wherein the substrate is fixed to at least one of the connector of the power supply connector and the output connector by a first fixing member, and is fixed to the capacitor by a second fixing member, a position at which the conductive pattern is formed on the substrate is changeable in accordance with a position of any one of the power supply connector and the output connector.

4. The power conversion device according to claim 3, wherein at least one of the power supply connector and the output connector has a plurality of terminals for electrically connecting to the conductive pattern of the plurality of wirings, the plurality of terminals are electrically connected to the conductive pattern of the plurality of wirings by the conductive first fixing member.

5. The power conversion device according to any one of claims 1 to 4, wherein at least one of the plurality of output wirings is a wiring including an output wiring pattern formed on the substrate.

6. The power conversion device according to claim 5, wherein a current sensor is mounted on the substrate, the current sensor is used to detect a current flowing through the output wiring pattern.

7. The power conversion device according to claim 3 or 4, wherein at least one of the plurality of power supply wirings is a wiring including a power supply wiring pattern formed on the substrate.

8. The power conversion device according to claim 7, wherein the plurality of power supply wirings include a plurality of first power supply wirings electrically connected between the power supply connector and the capacitor, and a plurality of second power supply wirings electrically connected between the capacitor and the plurality of switching elements, at least one of the plurality of first power supply wirings and the plurality of second power supply wirings is a wiring including a power supply wiring pattern formed on the substrate.

9. The power conversion device according to claim 8, wherein ​ ​ The plurality of second power supply lines are lines including a power supply line pattern formed of a conductive material on the substrate.

10. The power conversion device according to claim 9, wherein The capacitor has a plurality of capacitor electrodes provided on an upper surface opposite to a lower surface of the substrate, The plurality of capacitor electrodes are electrically connected to the power supply line patterns of the plurality of second power supply lines.

11. The power conversion device according to claim 10, wherein The power supply connector and the output connector are formed as one member.

12. The power conversion device according to claim 10, wherein The plurality of capacitor electrodes are electrically connected to the power supply line patterns of the plurality of second power supply lines via the second fixing member.

13. The power conversion device according to any one of claims 1 to 4, wherein The substrate has a lower surface opposite to an upper surface of the cooler, The plurality of switching elements are mounted on the lower surface.

14. The power conversion device according to claim 13, wherein The upper surface of the cooler is in contact with the plurality of switching elements.

15. The power conversion device according to claim 13, wherein The upper surface of the cooler has recesses into which the plurality of switching elements are inserted.

16. The power conversion device according to any one of claims 1 to 4, wherein A drive circuit is mounted on the substrate, The drive circuit is configured to drive the plurality of switching elements.

17. The power conversion device according to claim 16, wherein A control circuit is mounted on the substrate, The drive circuit is configured to drive the plurality of switching elements in accordance with a control signal supplied from the control circuit.

18. The power conversion device according to claim 1 or 2, wherein At least one of the plurality of power supply lines is a line including a power supply line pattern formed of a conductive material on the substrate.

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