Magnetic Component and Its Manufacturing Method

Abstract

The present invention discloses a magnetic component and a manufacturing method thereof. The magnetic component includes a magnetic core component and a winding component. The magnetic core component includes a first magnetic column and a second magnetic column, and the first magnetic column and the second magnetic column are independently arranged. The winding component includes a first winding, and the first winding is wound around the first magnetic column. The first winding is formed by at least a part of a substrate. The substrate includes a first accommodation space, a second accommodation space, and a first metal layer. At least a part of the first winding is formed by at least a part of the first metal layer. The first magnetic column and the second magnetic column are respectively arranged in the first accommodation space and the second accommodation space, and the substrate is an integrally formed structure.

Description

Technical Field

[0001] The present invention relates to a magnetic component and a manufacturing method thereof, and particularly to a magnetic component with low magnetic loss and high dimensional accuracy and a manufacturing method thereof. Background Art

[0002] With the improvement of humans' requirements for intelligent life, the demand for data processing is increasing day by day. Among them, high efficiency and high power density are important indicators for data processing.

[0003] Traditional data centers usually use servers for data processing. The main circuit board of the server contains data processing chips such as a central processing unit, a chipset, and memory. In addition, the main circuit board also contains a power supply for the data processing chips and its necessary components. With the improvement of the processing power of the server, the number and integration degree of data processing chips also increase synchronously, resulting in almost all the space in the server being occupied by data processing chips, and the power consumption of the server also increases. Therefore, the power supply for the data processing chips needs to have higher efficiency and power density, and needs to have a smaller volume to reduce the overall volume of the server and make the data center more energy-efficient. In order to meet the requirement of high power density for the power supply, the switching frequency of the power supply needs to be increased accordingly. Therefore, the power supply needs to have low voltage and high current to adapt to the higher switching frequency. However, at present, when the magnetic component is applied to a power supply with low voltage and high current, the power density and conversion efficiency of the magnetic component are still low. Therefore, the magnetic component has become a key factor in the development of high-efficiency and high-power-density data centers.

[0004] Please refer to Figure 1A and Figure 1B where Figure 1A is a schematic three-dimensional structure diagram of a magnetic component of the prior art, Figure 1B is Figure 1A The schematic cross-sectional structure diagram of the magnetic component shown along the A-A' section. As shown in the figure, the magnetic component 1' of the prior art is a horizontal winding process, and includes a substrate 2', a magnetic core 3', and a winding 4'. Among them, the winding 4' is formed in the wiring layer 21' of the substrate 2', and the magnetic core 3' is sleeved on the substrate 2', so that the magnetic core 3' is perpendicular or nearly perpendicular to the substrate 2', and further makes both the magnetic core 3' and the wiring layer 21' of the substrate 2' perpendicular or nearly perpendicular. As Figure 1B shown, the thickness of the wiring layer 21' is W, and the width is H. Among them, the width H of the wiring layer 21' is greater than 10 times the thickness W of the wiring layer 21', that is, H>10W. The winding method of the winding 4' of this magnetic component 1' is called vertical winding. Among them, the impedance of the outer part of the winding 4' far from the magnetic column and the inner part close to the magnetic column will be different due to the inconsistent circumferences of the inner and outer sides of the magnetic column, resulting in uneven current distribution.

[0005] Furthermore, the magnetic core 3' of the magnetic component 1' is composed of a U-shaped magnetic column 31' and an I-shaped magnetic column 32'. The U-shaped magnetic column 31' passes through two holes 22' of the substrate 2' and is assembled with the I-shaped magnetic column 32'. The U-shaped magnetic column 31' includes two longitudinal magnetic columns 33' and a horizontal connecting portion 34'. Among them, the two longitudinal magnetic columns 33' are respectively located inside the substrate 2', and the horizontal connecting portion 34' is connected between the two longitudinal magnetic columns 33'. The length of the horizontal connecting portion 34' is W1, the outer distance between the two longitudinal magnetic columns 33' is W2, the inner distance between the two holes 22' of the substrate 2' is H1, and the outer distance is H2. In order to improve production efficiency, usually a mold is made, and then the end face is finely polished to improve the dimensional accuracy of the magnetic core 3'. Taking the U-shaped magnetic column 31' as an example, its surface will be polished after molding. For example, the left and right side surfaces of the horizontal connecting portion 34' can be polished. However, since the U-shaped magnetic column 31' is integrally formed, the horizontal connecting portion 34' affects the fine polishing of the outer surface of the longitudinal magnetic column 33', resulting in the superposition of tolerances. For example, the outer side surfaces of the two longitudinal magnetic columns 33' are recessed inside the horizontal connecting portion 34', making it impossible to finely polish this surface. Otherwise, the horizontal connecting portion 34' will be damaged when polishing the outer side surfaces of the longitudinal magnetic columns 33'. Similarly, the inner side surfaces of the longitudinal magnetic columns 33' cannot be finely polished, so the formed dimensional tolerances are relatively large.

[0006] Please continue to refer to Figure 1B , where the inner distance between the two longitudinal magnetic columns 33' is W3, the width of each longitudinal magnetic column 33' is W4. When the tolerances of the outer distance W2 between the two longitudinal magnetic columns 33', the inner distance W3 between the two longitudinal magnetic columns 33', and the width W4 of each longitudinal magnetic column 33' are all + / -0.2 mm, this makes the size of the hole 22' that can cooperate with the U-shaped magnetic column 31' relatively large, that is, the value of the outer distance H2 between the two holes 22' needs to be greater than the maximum value of the outer distance W2 between the two longitudinal magnetic columns 33'. Similarly, the value of the inner distance H1 between the two holes 22' should be less than the minimum value of the inner distance W3 between the two longitudinal magnetic columns 33'. In the actual wiring process, due to the tolerance of the inner distance W3 between the two longitudinal magnetic columns 33', the inner distance H1 between the two holes 22' is reduced, reducing the wiring space, thus causing inflexible wiring. Furthermore, since the winding 4' arranged between the two holes 22' needs to meet a certain width, the traditional magnetic component 1' ensures the width of the winding 4' between the two longitudinal magnetic columns 33' by increasing the size of the outer distance W2 between the two longitudinal magnetic columns 33'. Therefore, the tolerances of the length W1 of the horizontal connecting portion 34' and the outer distance W2 between the two longitudinal magnetic columns 33' will accumulate on the inner distance H1 between the two holes 22' and the outer distance H2 between the two holes 22', making the overall size of the substrate 2' relatively large, thereby reducing the power density of the magnetic component 1'.

[0007] Therefore, it is an urgent current need to develop a magnetic component and its manufacturing method that overcome the above-mentioned drawbacks. Summary of the Invention

[0008] An object of the present invention is to provide a magnetic component and its manufacturing method, which are a magnetic component and its manufacturing method with low magnetic loss and high dimensional accuracy.

[0009] To achieve the above object, an embodiment of the present invention provides a magnetic component, including a magnetic core component and a winding component. The magnetic core component includes a first magnetic column and a second magnetic column, and the first magnetic column and the second magnetic column are independently arranged. The winding component includes a first winding, and the first winding is wound around the first magnetic column. The first winding is formed by at least part of a substrate, the substrate includes a first accommodation space, a second accommodation space and a first metal layer, at least part of the first winding is formed by at least part of the first metal layer, at least part of the first magnetic column and at least part of the second magnetic column are respectively arranged in the first accommodation space and the second accommodation space, and the substrate is an integrally formed structure.

[0010] To achieve the above object, another embodiment of the present invention provides a manufacturing method of a magnetic component. First, a substrate is provided, where the substrate is an integrally formed structure and at least part of the substrate forms the winding component of the magnetic component. The substrate includes a first accommodation space, a second accommodation space and a first metal layer, and at least part of the first metal layer forms at least part of the first winding of the winding component. Then, a magnetic core component is provided, the magnetic core component includes a first magnetic column and a second magnetic column, where the first magnetic column and the second magnetic column are independently arranged, at least part of the first magnetic column and at least part of the second magnetic column are respectively arranged in the first accommodation space and the second accommodation space, and the first winding is wound around the first magnetic column.

[0011] The beneficial effect of the present invention is that the first magnetic column and the second magnetic column of the magnetic component of the present invention are respectively arranged in the first accommodation space and the second accommodation space of the substrate. For the three-layer winding structure corresponding to any magnetic column, the distance between each layer of winding and the magnetic column is approximately equal, so that the current sharing effect of the magnetic core component of the magnetic component of the present invention is better, and the overall magnetic loss of the magnetic component is lower. Description of the Drawings

[0012] Figure 1A Schematic perspective view of a magnetic component of the prior art.

[0013] Figure 1B For Figure 1A Schematic cross-sectional view of the magnetic component shown along the A-A' section.

[0014] Figure 2 Schematic perspective view of the magnetic component of the present invention.

[0015] Figure 3 For Figure 2 the exploded structural schematic diagram of the magnetic component shown in

[0016] Figure 4 For Figure 2 the sectional structural schematic diagram of the magnetic component shown in along the A-A' section

[0017] Figure 5 For Figure 2 the sectional structural schematic diagram of the magnetic component shown in along the B-B' section

[0018] Figure 6 For Figure 2 the flowchart of the manufacturing method of the magnetic component shown in

[0019] Figure 7A For Figure 2 the assembly schematic diagram of the first embodiment of the substrate and the core component of the magnetic component shown in

[0020] Figure 7B For Figure 2 the assembly schematic diagram of the second embodiment of the substrate and the core component of the magnetic component shown in

[0021] Figure 7C For Figure 2 the assembly schematic diagram of the third embodiment of the substrate and the core component of the magnetic component shown in

[0022] Figure 7D For Figure 2 the assembly schematic diagram of the fourth embodiment of the substrate and the core component of the magnetic component shown in

[0023] Figure 7E For Figure 2 the assembly schematic diagram of the fifth embodiment of the substrate and the core component of the magnetic component shown in

[0024] Figure 7F For Figure 2 the assembly schematic diagram of the sixth embodiment of the substrate and the core component of the magnetic component shown in

[0025] Figures 8A to 8G For Figure 2 the sectional structural schematic diagram of the manufacturing method of the first embodiment of the magnetic component shown in

[0026] Figure 9A For Figure 8C the structural schematic diagram of the bonding method of the first embodiment of the top plate and the base of the substrate shown in

[0027] Figure 9B For Figure 8C the structural schematic diagram of the bonding method of the second embodiment of the top plate and the base of the substrate shown in

[0028] Figure 9C For Figure 8C Schematic structural diagram of the bonding method of the top plate and the base of the substrate shown in

[0029] Figure 10 For Figure 2 Schematic cross-sectional structure diagram of the second embodiment of the magnetic component shown in

[0030] Figure 11 For Figure 2 Schematic cross-sectional structure diagram of the third embodiment of the magnetic component shown in

[0031] Figures 12A to 12G For Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the fourth embodiment of the magnetic component shown in

[0032] Figure 13 For Figure 2 Schematic cross-sectional structure diagram of the fifth embodiment of the magnetic component shown in

[0033] Figures 14A to 14G For Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the sixth embodiment of the magnetic component shown in

[0034] Figures 15A to 15G For Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the seventh embodiment of the magnetic component shown in

[0035] Figure 16 For Figure 2 Schematic cross-sectional structure diagram of the eighth embodiment of the magnetic component shown in

[0036] Figure 17 For Figure 2 Schematic cross-sectional structure diagram of the ninth embodiment of the magnetic component shown in

[0037] Figures 18A to 18F For Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the tenth embodiment of the magnetic component shown in

[0038] Figures 19A to 19F For Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the eleventh embodiment of the magnetic component shown in

[0039] Figures 20A to 20E For Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the twelfth embodiment of the magnetic component shown in

[0040] Figure 21A For Figure 20CTop view of the magnetic component shown

[0041] Figure 21B is Figure 20D Top view of the magnetic component shown

[0042] Figure 22 is Figure 2 Schematic cross-sectional structure diagram of the thirteenth embodiment of the magnetic component shown

[0043] Figures 23A to 23F is Figure 2 Schematic cross-sectional structure diagram of the manufacturing method of the fourteenth embodiment of the magnetic component shown

[0044] Figure 24 is Figure 2 Schematic cross-sectional structure diagram of the fifteenth embodiment of the substrate of the magnetic component shown

[0045] Figure 25 This invention Figure 2 Schematic circuit structure diagram of the power module to which the magnetic component shown is applied

[0046] Figure 26 is Figure 8G Top view of the structure of the magnetic component shown

[0047] Figure 27A is Figure 26 Schematic diagram of the composition of the primary winding and secondary winding of the magnetic component shown

[0048] Figure 27B is Figure 26 Schematic diagram of the composition of the primary winding and secondary winding of the magnetic component shown from another perspective

[0049] Figure 28 This invention Figure 25 Schematic cross-sectional structure diagram of the first embodiment of the power module shown

[0050] Figure 29 This invention Figure 25 Schematic cross-sectional structure diagram of the second embodiment of the power module shown

[0051] Reference numerals are as follows:

[0052] 1’: Magnetic component of the prior art

[0053] 2’: Substrate

[0054] 21’: Wiring layer

[0055] 22’: Hole

[0056] 3’: Magnetic core

[0057] 31’: U-shaped magnetic column

[0058] 32’: I-shaped magnetic column

[0059] 33’: Longitudinal magnetic column

[0060] 34’: Horizontal connection part

[0061] 4’: Winding

[0062] W: Thickness of the wiring layer

[0063] H: Width of the wiring layer

[0064] W1: Length of the horizontal connection part

[0065] W2: Outer distance between two longitudinal magnetic columns

[0066] W3: Inner distance between two longitudinal magnetic columns

[0067] W4: Width of the longitudinal magnetic column

[0068] H1: Inner distance between two conductive columns

[0069] H2: Outer distance between two conductive columns

[0070] 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1m, 1n, 1o: Magnetic components

[0071] 2: Magnetic core assembly

[0072] 21: First magnetic column

[0073] 22: Second magnetic column

[0074] 23: Third magnetic column

[0075] 24: Fourth magnetic column

[0076] 3: Substrate

[0077] 301: First side

[0078] 302: Second side

[0079] 303: Third side

[0080] 304: Fourth side

[0081] 305: Third opening

[0082] 306: Fourth opening

[0083] 31: First accommodation space

[0084] 32: Second accommodation space

[0085] 34, 81: The first metal layer

[0086] 35: The first opening

[0087] 36: The second opening

[0088] S1 - S2: Steps

[0089] L1: The length of the substrate 3

[0090] L2: The length of the first magnetic post 21

[0091] L3: The width of the third magnetic post 23

[0092] L4: The width of the fourth magnetic post 24

[0093] W1: The length of the third magnetic post 23

[0094] W2: The width of the first magnetic post 21

[0095] 30a: The base

[0096] 30b: The groove

[0097] 30c: The top plate

[0098] 30d: The first through - hole

[0099] 30e: The second through - hole

[0100] 30f: The bottom surface

[0101] 30g: The first side wall

[0102] 30h: The second side wall

[0103] 30y: The gap

[0104] 30z: The insulating glue

[0105] 34a: The first horizontal copper foil

[0106] 341a: The first upper horizontal copper foil

[0107] 342a: The first lower horizontal copper foil

[0108] 343a: The first vertical conductive post

[0109] 34b: The second horizontal copper foil

[0110] 34c: The first connecting copper foil

[0111] 34d: The second connecting copper foil

[0112] 34e: The etching hole

[0113] 34f: First transition horizontal part

[0114] 34g: First conductive post

[0115] 34h: Sixth transition horizontal part

[0116] 34i: Connecting rib

[0117] 37, 82: Second metal layer

[0118] 37a, 81a: Third horizontal copper foil

[0119] 371a: Conductive post

[0120] 37b, 81b: Fourth horizontal copper foil

[0121] 371b: Conductive post

[0122] 37c, 81c: Third connecting copper foil

[0123] 37d, 81d: Fourth connecting copper foil

[0124] 37e: First insulating material

[0125] 37f: Second insulating material

[0126] 37g: Etching hole

[0127] 38: Third metal layer

[0128] 38a, 82a: Fifth horizontal copper foil

[0129] 381a: Conductive post

[0130] 38b, 82b: Sixth horizontal copper foil

[0131] 381b: Conductive post

[0132] 38c, 82c: Fifth connecting copper foil

[0133] 38d, 82d: Sixth connecting copper foil

[0134] 38e: Third insulating material

[0135] 38f: Fourth insulating material

[0136] 38g: Etching hole

[0137] m: First horizontal wiring layer

[0138] n: Second horizontal wiring layer

[0139] o: Third horizontal wiring layer

[0140] p: Fourth horizontal wiring layer

[0141] q: The fifth horizontal wiring layer

[0142] r: The sixth horizontal wiring layer

[0143] s: The seventh horizontal wiring layer

[0144] 21a: Chamfer

[0145] 39: Metal protective layer

[0146] 39a: Surface pattern

[0147] 39b: Pattern structure

[0148] 40: The seventh horizontal copper foil

[0149] 40a: The fifth transition horizontal part

[0150] 41a: The second transition horizontal part

[0151] 41b: The third transition horizontal part

[0152] 41c: The second conductive post

[0153] 41d: The fourth transition horizontal part

[0154] 41e: The third conductive post

[0155] 41f: The fourth conductive post

[0156] 41g: The fifth conductive post

[0157] 50a: The first mechanical blind hole

[0158] 50b: The second mechanical blind hole

[0159] 51: The third mechanical blind hole

[0160] 50c: The first blind hole

[0161] 50d: The second blind hole

[0162] 50e: The first back drill hole

[0163] 50f: The second back drill hole

[0164] 50g: The third blind hole

[0165] 60a: Gap

[0166] 61a: Anti-corrosion coating

[0167] 61b: Insulating sheet

[0168] 62a: The first common conductive post

[0169] 62b: Second common conductive post

[0170] 63a: Third through-hole

[0171] 63b: Fourth through-hole

[0172] 80: Waist-shaped groove

[0173] 83: Fourth metal layer

[0174] 83a: Eighth horizontal copper foil

[0175] 83b: Ninth horizontal copper foil

[0176] 83c: Eighth connecting copper foil

[0177] 83d: Ninth connecting copper foil

[0178] 7: Power module

[0179] Vin+: Positive input terminal

[0180] Vin-: Negative input terminal

[0181] Vo+: Positive output terminal

[0182] Vo-: Negative output terminal

[0183] P: Primary winding

[0184] P1: First end

[0185] P2: Second end

[0186] S1: First secondary winding

[0187] D1: First end

[0188] S2: Second secondary winding

[0189] D2: Second end

[0190] M: Common terminal

[0191] SR1, SR2: Power switches

[0192] A1: First end

[0193] A2: Second end

[0194] B1: First end

[0195] B2: Second end

[0196] C: Capacitor

[0197] D1a: First surface-mounted pin

[0198] Va: Second surface-mounted pin

[0199] A2a: The third surface-mounted pin

[0200] Vb: The fourth surface-mounted pin

[0201] D2a: The fifth surface-mounted pin

[0202] B2a: The sixth surface-mounted pin

[0203] P1a: The seventh surface-mounted pin

[0204] P2a: The eighth surface-mounted pin

[0205] 71: Circuit board

[0206] 72: Primary-side device

[0207] 73: Secondary-side device

[0208] 11: Upper surface

[0209] 12: Lower surface Detailed implementation manners

[0210] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different ways, all of which do not depart from the scope of the present invention, and the descriptions and illustrations therein are for illustrative purposes in essence, rather than being construed to limit the present invention.

[0211] Please refer to Figures 2 to 5 , in which Figure 2 is a three-dimensional structural schematic diagram of the magnetic component of the present invention, Figure 3 is Figure 2 the exploded structural schematic diagram of the magnetic component shown in Figure 4 is Figure 2 the cross-sectional structural schematic diagram of the magnetic component shown in Figure 5 is Figure 2Schematic cross-sectional structure diagram of the magnetic component along the B-B' section. As shown in the figure, the magnetic component 1 includes a magnetic core component 2 and a winding component. The magnetic core component 2 includes a first magnetic column 21 and a second magnetic column 22. The first magnetic column 21 and the second magnetic column 22 are independently arranged. In this embodiment, the first magnetic column 21 and the second magnetic column 22 are respectively located on opposite sides of the magnetic component 1. The winding component is composed of a substrate 3. The substrate 3 is an integrally formed structure and can be, but is not limited to, a printed circuit board, a ceramic substrate, or a substrate formed by manually winding copper foil flat. The substrate 3 includes a first accommodation space 31, a second accommodation space 32, and a first metal layer 34. The first accommodation space 31 and the second accommodation space 32 are located within the first metal layer 34, and the first accommodation space 31 and the second accommodation space 32 are respectively located on opposite sides of the substrate 3. Among them, the first magnetic column 21 is arranged in the first accommodation space 31, and the second magnetic column 22 is arranged in the second accommodation space 32 (as Figure 4 and Figure 5 shown). In this embodiment, the winding component includes at least a first winding, and the first metal layer 34 can form at least part of the first winding of the winding component.

[0212] In this embodiment, the substrate 3 further includes a first opening 35 and a second opening 36. The first opening 35 is located on the first side 301 of the substrate 3, and the second opening 36 is located on the second side 302 of the substrate 3. Among them, the first side 301 and the second side 302 of the substrate 3 are oppositely arranged, which means that the first opening 35 and the second opening 36 are oppositely arranged. The first accommodation space 31 and the second accommodation space 32 are located between the first opening 35 and the second opening 36, and the first opening 35 is respectively connected to the first accommodation space 31 and the second accommodation space 32, and the second opening 36 is respectively connected to the first accommodation space 31 and the second accommodation space 32. That is, the first opening 35, the first accommodation space 31, the second opening 36, and the second accommodation space 32 form a mouth-shaped space.

[0213] The magnetic core component 2 further includes a third magnetic column 23 and a fourth magnetic column 24 (as Figure 3 and Figure 5 shown). The third magnetic column 23 is located in the first opening 35, and the fourth magnetic column 24 is located in the second opening 36. The first magnetic column 21 and the second magnetic column 22 are respectively located between the third magnetic column 23 and the fourth magnetic column 24. Among them, the two ends of the third magnetic column 23 are respectively connected to one end of the first magnetic column 21 and one end of the second magnetic column 22, and the two ends of the fourth magnetic column 24 are respectively connected to the other end of the first magnetic column 21 and the other end of the second magnetic column 22. In this embodiment, the first magnetic column 21, the second magnetic column 22, the third magnetic column 23, and the fourth magnetic column 24 are independently arranged from each other. And in some embodiments, the quadrilateral formed by the first magnetic column 21, the second magnetic column 22, the third magnetic column 23, and the fourth magnetic column 24 can be a quadrilateral of any shape, such as a rectangle, a parallelogram, or a trapezoid, etc.

[0214] Please refer to Figure 6 , which is a flowchart of a manufacturing method of the magnetic component shown in FIG. 1. First, step S1 is executed to provide a substrate 3. The substrate 3 is an integrally formed structure and constitutes the winding assembly of the magnetic component 1. The substrate 3 includes a first accommodation space 31, a second accommodation space 32, and a first metal layer 34, wherein the first metal layer 34 constitutes at least part of the first winding of the winding assembly. Among them, as Figure 5 shown, the width dimensions of the first accommodation space 31 and the second accommodation space 32 are W0 respectively, the distance between the first accommodation space 31 and the second accommodation space 32 is W0', the width dimension tolerances of the actually processed first accommodation space 31 and the second accommodation space 32 can be controlled within + / -50um, and the tolerance of the relative position W0' between the first accommodation space 31 and the second accommodation space 32 can also be within + / -50um. Therefore, the dimensional accuracy of the formed first accommodation space 31 and the second accommodation space 32 is very high. Then step S2 is executed to provide a magnetic core assembly 2. The magnetic core assembly 2 includes a first magnetic post 21 and a second magnetic post 22. The first magnetic post 21 and the second magnetic post 22 are independently arranged from each other. The first magnetic post 21 and the second magnetic post 22 are respectively arranged in the first accommodation space 31 and the second accommodation space 32, and the first winding is wound around the first magnetic post 21. In step S2, the first magnetic post 21 and the second magnetic post 22 of the magnetic core assembly 2 can be directly formed by a mold to achieve the advantage of easy processing, or the required shapes of the first magnetic post 21 and the second magnetic post 22 can be directly cut out on a magnetic core substrate (not shown) to achieve the advantage of high dimensional accuracy. In order to achieve both the advantages of easy processing and high dimensional accuracy, the first magnetic post 21 and the second magnetic post 22 can be selected to be finely polished on a machine tool after being formed by a mold, so that the dimensional tolerance is controlled within 0um to 50um.

[0215] As can be seen from the above, the first magnetic post 21 and the second magnetic post 22 of the magnetic component 1 of the present invention are independently arranged, and the first magnetic post 21 and the second magnetic post 22 are respectively arranged in the first accommodation space 31 and the second accommodation space 32 of the substrate 3. Therefore, the first magnetic post 21 and the second magnetic post 22 can be polished separately. And because the first magnetic post 21 and the second magnetic post 22 are respectively limited in the substrate 3 by the first accommodation space 31 and the second accommodation space 32, and there is no mutual influence between the first magnetic post 21 and the second magnetic post 22. Therefore, the first magnetic post 21 and the second magnetic post 22 only need to be polished separately to satisfy the assembly relationship with the corresponding first accommodation space 31 and second accommodation space 32. The position accuracy of the first magnetic post 21 has nothing to do with the position accuracy of the second magnetic post 22, and the position accuracy between the first magnetic post 21 and the second magnetic post 22 is completely determined by the position accuracy between the first accommodation space 31 and the second accommodation space 32. The dimensional accuracy and position accuracy of the first accommodation space 31 and the second accommodation space 32 formed on the substrate 3 are very high, and the relative position accuracy between the finally formed first magnetic post 21 and the second magnetic post 22 is high. Therefore, the size of the magnetic element 1 realized by the present invention is smaller than the size of the magnetic element described in the existing solution, thereby improving the power density of the module.

[0216] Of course, in some embodiments, the magnetic component 1 may only include a single magnetic post and a single accommodation space, that is, the magnetic component 1 only includes the first magnetic post 21 and does not include the other magnetic posts, and the magnetic component 1 only includes the first accommodation space 31 and does not include the second accommodation space, and its technical features are also similar to those of the magnetic component 1 with multiple magnetic posts and multiple accommodation spaces, so it will not be elaborated here.

[0217] Please refer to Figure 7A and cooperate with Figures 2 to 6 , where Figure 7A is Figure 2Assembly schematic diagram of the substrate of the magnetic component and the first embodiment of the magnetic core component. As shown in the figure, the first magnetic post 21, the second magnetic post 22, and the third magnetic post 23 of the magnetic core component 2 are disposed within the substrate 3 via the first opening 35 on the first side 301 of the substrate 3, while the fourth magnetic post 24 of the magnetic core component 2 is disposed within the substrate 3 via the second opening 36 on the second side 302 of the substrate 3. The first magnetic post 21 and the second magnetic post 22 are respectively located on the two long sides of the overall substrate 3, that is, in the first accommodation space 31 and the second accommodation space 32 of the substrate 3, wherein the first magnetic post 21 and the second magnetic post 22 are approximately parallel to each other. For example, the included angle between the first magnetic post 21 and the second magnetic post 22 is between 0 and 5 degrees. The third magnetic post 23 and the fourth magnetic post 24 are respectively located on the two short sides of the overall substrate 3, that is, in the first opening 35 and the second opening 36 of the substrate 3, wherein the third magnetic post 23 and the fourth magnetic post 24 are approximately parallel to each other. For example, the included angle between the third magnetic post 23 and the fourth magnetic post 24 is between 0 and 5 degrees. In some embodiments, both sides of the first magnetic post 21 can be respectively connected to the third magnetic post 23 and the fourth magnetic post 24 via an insulating medium (not shown), and both sides of the second magnetic post 22 can be respectively connected to the third magnetic post 23 and the fourth magnetic post 24 via another insulating medium (not shown), wherein the magnetic component 1 can obtain the required inductance value by adjusting the thickness of the insulating medium. Since the first magnetic post 21, the second magnetic post 22, the third magnetic post 23, and the fourth magnetic post 24 in this embodiment are all located within the substrate 3, the insulating medium connecting between each magnetic post is also located within the substrate 3. To avoid an increase in magnetic loss of the magnetic component 1, the insulating medium can be kept not in contact with the substrate 3. In addition, since the first magnetic post 21, the second magnetic post 22, the third magnetic post 23, and the fourth magnetic post 24 are all disposed within the substrate 3, the areas of the upper surface and the lower surface of the substrate 3 are large enough. Compared with the prior art where the magnetic core is sleeved on the substrate resulting in limited planar routing, the technical feature of the present invention enables flexible routing within the size range of the entire magnetic component 1. Further, more devices can be placed on the substrate 3 to meet the device performance.

[0218] In this embodiment, the length L1 of the substrate 3 is equal to the length L2 of the first magnetic column 21, the width L3 of the third magnetic column 23 plus the width L4 of the fourth magnetic column 24 (i.e., L1 = L2 + L3 + L4), such that the first magnetic column 21 is completely located within the first accommodation space 31, the second magnetic column 22 is completely located within the second accommodation space 32, the third magnetic column 23 is completely located within the first opening 35, and the fourth magnetic column 24 is completely located within the second opening 36. In some other embodiments, the length L1 of the substrate 3 is less than the sum of the length L2 of the first magnetic column 21, the width L3 of the third magnetic column 23, and the width L4 of the fourth magnetic column 24 (i.e., L1 < L2 + L3 + L4), such that the first magnetic column 21 is completely located within the first accommodation space 31, a part of the third magnetic column 23 is located within the first opening 35, another part of the third magnetic column 23 is exposed outside the substrate 3, and a part of the fourth magnetic column 24 is located within the second opening 36, and another part of the fourth magnetic column 24 is exposed outside the substrate 3.

[0219] Please refer to Figure 7B and cooperate with Figures 2 to 6 , where Figure 7B is Figure 2 the assembly schematic diagram of the second embodiment of the substrate of the magnetic component and the magnetic core component as shown. As shown, the substrate 3 further has a third side 303 and a fourth side 304. Both the third side 303 and the fourth side 304 are located between the first side 301 and the second side 302, and the third side 303 and the fourth side 304 are oppositely arranged. In this embodiment, the third side 303 of the substrate 3 may have two third openings 305. The first magnetic column 21 and the second magnetic column 22 are disposed within the substrate 3 through the first opening 35 on the first side 301 of the substrate 3, while the third magnetic column 23 and the fourth magnetic column 24 are respectively disposed within the substrate 3 through the two third openings 305 on the third side 303 of the substrate 3. Therefore, the substrate 3 of this embodiment may only have the first opening 35 and the third opening 305, and does not have the second opening.

[0220] Please refer to Figure 7C and cooperate with Figures 2 to 6 , where Figure 7C is Figure 2Assembly schematic diagram of the substrate of the magnetic component and the third embodiment of the magnetic core component as shown. As shown, the substrate 3 further has a third side 303 and a fourth side 304. Both the third side 303 and the fourth side 304 are located between the first side 301 and the second side 302, and the third side 303 and the fourth side 304 are oppositely arranged. In this embodiment, the third side 303 of the substrate 3 may have a third opening 305, and the fourth side 304 of the substrate 3 has a fourth opening 306. The first magnetic post 21 and the second magnetic post 22 are disposed within the substrate 3 through the first opening 35 on the first side 301 of the substrate 3, while the third magnetic post 23 is disposed within the substrate 3 through the third opening 305 on the third side 303 of the substrate 3, and the fourth magnetic post 24 is disposed within the substrate 3 through the fourth opening 306 on the fourth side 304 of the substrate 3. Therefore, the substrate 3 of this embodiment may only have the first opening 35, the third opening 305, and the fourth opening 306, and does not have a second opening.

[0221] Please refer to Figure 7D and cooperate with Figures 2 to 6 , wherein Figure 7D is Figure 2 Assembly schematic diagram of the substrate of the magnetic component and the fourth embodiment of the magnetic core component as shown. In this embodiment, the length L1 of the substrate 3 is equal to the length L2 of the first magnetic post 21, which means that the length L1 of the substrate 3 is equal to the length of the second magnetic post 22. Therefore, in this embodiment, both sides of the first magnetic post 21 are respectively located on the first side 301 and the second side 302 of the substrate 3, and both sides of the second magnetic post 22 are respectively located on the first side 301 and the second side 302 of the substrate 3, so that the third magnetic post 23 and the fourth magnetic post 24 are located outside the substrate 3. In some embodiments, both sides of the first magnetic post 21 may be respectively connected to the third magnetic post 23 and the fourth magnetic post 24 through an insulating medium (not shown), and both sides of the second magnetic post 22 may be respectively connected to the third magnetic post 23 and the fourth magnetic post 24 through another insulating medium (not shown), wherein the magnetic component 1 can obtain the required inductance value by adjusting the thickness of the insulating medium. Since the third magnetic post 23 and the fourth magnetic post 24 in this embodiment are located outside the substrate 3, the insulating medium connecting each magnetic post is also located outside the substrate 3. Therefore, the amount of the insulating medium in this embodiment does not need to be additionally controlled, and the process can be made more flexible. In addition, since the third magnetic post 23 and the fourth magnetic post 24 in this embodiment are located outside the substrate 3, only the first magnetic post 21 and the second magnetic post 22 need to be polished with high precision, so that the first magnetic post 21 and the second magnetic post 22 of the magnetic core component 2 can be accurately assembled into the first accommodation space 31 and the second accommodation space 32 of the substrate 3. In other embodiments, the length L1 of the substrate 3 is less than the length of the first magnetic post 21, and a part of the first magnetic post 21 is located within the first accommodation space 31 and a part is located outside the accommodation space 31. A part of the second magnetic post 22 is located within the second accommodation space 32 and a part is located outside the accommodation space 32.

[0222] Please refer to Figure 7E and cooperate with Figures 2 to 6 , where Figure 7E is Figure 2 the assembly schematic diagram of the substrate of the magnetic component and the fifth embodiment of the magnetic core component shown. In this embodiment, the first magnetic post 21 and the third magnetic post 23 are integrally formed structures to form an L-shaped structure, and the second magnetic post 22 and the fourth magnetic post 24 are integrally formed structures to form an L-shaped structure. In this structure, only the first magnetic post 21 and the third magnetic post 23 need to correspond to the sizes of the first accommodating space 31 and the second accommodating space 32 respectively to complete the assembly. In this embodiment, after the L-shaped structure formed by the first magnetic post 21 and the third magnetic post 23 is processed by a mold, it is necessary to control the dimensional accuracy of the long side of the L-shaped structure formed by the length L2 of the first magnetic post 21 and the width L3 of the third magnetic post 23, and control the dimensional accuracy of the length W1 of the third magnetic post 23 and the width W2 of the first magnetic post 21. For example, all sides are polished by a machine tool so that the long side of the L-shaped structure formed by the length L2 of the first magnetic post 21 and the width L3 of the third magnetic post 23 and the length W1 of the third magnetic post 23 are within the preset accuracy range. In addition, by finely polishing the length L2 of the first magnetic post 21, the width W2 of the first magnetic post 21 can be controlled within the preset accuracy range at the same time. In this way, the L-shaped structure formed by the first magnetic post 21 and the third magnetic post 23 can be completely assembled into the substrate 3. Similarly, in the L-shaped structure formed by the second magnetic post 22 and the fourth magnetic post 24, by controlling the dimensional accuracy of the long side of the L-shaped structure formed by the length L2 of the second magnetic post 22 and the width L4 of the fourth magnetic post 24, and controlling the dimensional accuracy of the length W1 of the fourth magnetic post 24 and the width W2 of the second magnetic post 22, the L-shaped structure formed by the second magnetic post 22 and the fourth magnetic post 24 can also be completely assembled into the substrate 3.

[0223] Please refer to Figure 7F and cooperate with Figures 2 to 6 , where Figure 7F is Figure 2 the assembly schematic diagram of the substrate of the magnetic component and the sixth embodiment of the magnetic core component shown. In this embodiment, the second side 302 of the substrate 3 is a closed structure. The fourth magnetic post 24 is embedded in the substrate 3, and the fourth magnetic post 24 is adjacent to the second side 302 of the substrate 3, while the first magnetic post 21, the second magnetic post 22 and the third magnetic post 23 are respectively disposed in the substrate 3 through the first opening 35 on the first side 301 of the substrate 3.

[0224] The magnetic component 1 of the present invention obtains independent magnetic columns with high-precision dimensions by the means of the above six embodiments, that is, the first magnetic column 21, the second magnetic column 22, the third magnetic column 23 and the fourth magnetic column 24 which are independently arranged and have high-precision dimensions. Therefore, when the first magnetic column 21, the second magnetic column 22, the third magnetic column 23 and the fourth magnetic column 24 of the magnetic component 2 are assembled with the substrate 3, only the dimensional assembly accuracy of each magnetic column and the corresponding accommodation space needs to be satisfied. In addition, after the first magnetic column 21, the second magnetic column 22, the third magnetic column 23 and the fourth magnetic column 24 are assembled with the substrate 3, the relative position tolerance between the first magnetic column 21 and the second magnetic column 22 can be completely determined by the first accommodation space 31 and the second accommodation space 32. Therefore, the formation positions of the first accommodation space 31 and the second accommodation space 32 of the substrate 3 only need to consider the assembly methods of the first magnetic column 21 and the second magnetic column 22 with the corresponding first accommodation space 31 and the second accommodation space 32. Moreover, the dimensional accuracy and position accuracy of the first accommodation space 31 and the second accommodation space 32 formed on the substrate 3 are very high, and the relative position tolerance between the finally formed first magnetic column 21 and the second magnetic column 22 will be very small. Therefore, the size of the magnetic component 1 realized by the present invention will be smaller than the size of the magnetic component described in the existing solution, thereby improving the power density of the module. In other words, when the module size remains unchanged, the reduced size can be given to the magnetic core, thereby increasing the cross-sectional area of the magnetic core and effectively reducing the magnetic loss. In addition, the first magnetic column 21, the second magnetic column 22, the third magnetic column 23 and the fourth magnetic column 24 of the magnetic core component 2 of the magnetic component 1 of the present invention can adopt stress-sensitive materials, and a certain gap needs to be satisfied between the magnetic core component 2 and the substrate 3, so that the acting force of the substrate 3 on the magnetic core component 2 during the process or in the product use process is small. Therefore, the magnetic loss of the magnetic core component 2 of the magnetic component 1 of the present invention is low, thereby improving the efficiency of the power module to which the magnetic component 1 is applied.

[0225] The manufacturing method of the substrate 3 will be disclosed below. For the sake of easy understanding, the following embodiments all take the substrate 3 of the manufacturing part as an example, such as the substrate 3 of the part accommodating the first magnetic column 21. It can be clearly known that the same method can also be used to manufacture the other part of the substrate 3 accommodating the second magnetic column 22, and will not be repeated. Please refer to Figures 8A to 8G , which is Figure 2 a schematic cross-sectional structure diagram of the manufacturing method of the first embodiment of the magnetic component shown. First, as shown in Figure 8A , a base 30a is provided, where the base 30a can be composed of a printed circuit board. Then, as shown in Figure 8B , a groove 30b is formed in the base 30a, and the way of forming the groove 30b can be machining milling or laser drilling, etc.

[0226] Next, as shown in Figure 8CAs shown, a top plate 30c is provided on a base 30a and covers a groove 30b, and a first horizontal copper foil 34a is formed on the top plate 30c. The base 30a and the top plate 30c together define a first accommodation space 31, and the top plate 30c is made of an insulating material. In this embodiment, the top plate 30c is pressed and bonded to the base 30a via an insulating adhesive. After high temperature, the insulating adhesive undergoes a cross-linking reaction, causing the top plate 30c and the base 30a to be adhered to each other. The manner in which the top plate 30c and the base 30a are adhered to each other via the insulating adhesive will be described later. Figures 9A to 9C And the materials of the top plate 30c, the insulating adhesive, and the base 30a can all be reinforced fiber composite materials. Alternatively, the materials of the top plate 30c and the base 30a can be reinforced fiber composite materials, and the material of the insulating adhesive can be an epoxy resin material, which is not limited thereto. In this embodiment, the cross-sectional area of the first accommodation space 31 is comparable to the cross-sectional area of the first magnetic column 21 to be assembled, that is, the cross-sectional area of the first accommodation space 31 and the cross-sectional area of the first magnetic column 21 to be assembled satisfy a certain assembly relationship. For example, the cross-sectional area of the first accommodation space 31 is designed to have the same size as the cross-sectional area of the first magnetic column 21. During actual processing, the tolerance control increases the cross-sectional size of the first accommodation space 31 and reduces the cross-sectional size of the first magnetic column 21, so that the first magnetic column 21 can be completely assembled in the first accommodation space 31, and the overall space of the substrate 3 can be saved.

[0227] In some embodiments, in order to prevent the area of the first accommodation space 31 from being compressed due to bending when the top plate 30c and the base 30a are pressed and bonded, the overall thickness of the top plate 30c and the first horizontal copper foil 34a needs to meet a certain thickness, such as being greater than 0.2 mm. And in some embodiments, since the thickness of the original material substrate for forming the top plate 30c and the first horizontal copper foil 34a is relatively thin and cannot meet the actual current-carrying requirements, before the top plate 30c and the base 30a are adhered to each other, the top plate 30c can be pre-treated first, and the pre-treatment includes the following three methods. Please refer to Figure 9A , which is Figure 8C a schematic structural diagram of the bonding method of the top plate and the base of the substrate shown in the first embodiment. As Figure 9A shown, the top plate 30c is pressed and bonded to the base 30a via an insulating adhesive 30z, causing the top plate 30c and the base 30a to be adhered to each other. And through a metallization process, copper foil is continuously grown on the surface of the top plate 30c, so that the thickness of the first horizontal copper foil 34a reaches 0.07 mm, and the thickness of the top plate 30c reaches 0.13 mm, and the overall thickness of the top plate 30c and the first horizontal copper foil 34a reaches 0.2 mm. Therefore, this embodiment satisfies both the requirements of the pressing and bonding process and the actual current-carrying requirements. Another pre-treatment method, please refer to Figure 9B , which is Figure 8C a schematic structural diagram of the bonding method of the top plate and the base of the substrate shown in the second embodiment. AsFigure 9B As shown, the first horizontal copper foil 34a includes a first upper horizontal copper foil 341a, a first lower horizontal copper foil 342a, and a first vertical conductive post 343a. The first upper horizontal copper foil 341a is located on one side of the top plate 30c, and the first lower horizontal copper foil 342a is located on the other side of the top plate 30c. The first lower horizontal copper foil 342a is pressed against the base 30a via an insulating adhesive 30z. The first vertical conductive post 343a penetrates through the top plate 30c to connect between the first upper horizontal copper foil 341a and the first lower horizontal copper foil 342a. Among them, the first upper horizontal copper foil 341a and the first lower horizontal copper foil 342a can achieve a parallel connection effect, and the thicknesses of the first upper horizontal copper foil 341a and the first lower horizontal copper foil 342a are both 1 oz, so that a current-carrying capacity of 2 oz can be achieved to meet the current-carrying requirements. For the third pretreatment method, please refer to Figure 9C , which is Figure 8C a schematic structural diagram of the bonding method of the top plate and the base of the substrate shown in. As Figure 9C shown, the bonding method of the third embodiment is similar to that of the second embodiment. The difference is only that the top plate 30c of this embodiment is pressed against the base 30a via an insulating adhesive 30z, and there is a gap 30y between the first lower horizontal copper foil 342a and the insulating adhesive 30z. The gap 30y is the flow space of the insulating adhesive 30z to prevent part of the insulating adhesive 30z from overflowing into the first accommodating space 31 when the top plate 30c and the base 30a are pressed together, resulting in a reduction in the available space of the first accommodating space 31 and thus causing difficulties in subsequent assembly.

[0228] The above metallization process includes electroplating and electroless plating. When the required thickness of the first metal layer 34 is relatively thin, it can be achieved by electroless plating, but the current-carrying requirement is small. When the current-carrying requirement is large, it can be achieved by electroplating. Of course, before electroplating, a seed layer can be set by methods such as electroless plating, sputtering, or evaporation plating to play the functions of surface conduction and increasing the bonding force.

[0229] In the actual application process, the voltage required by the terminal load is relatively low and the current is relatively large, which puts forward higher requirements for the current-carrying capacity of the power supply module. To meet the current-carrying capacity, the copper plating thickness needs to reach a certain specification value, for example, it needs to reach 70 um. In Figure 9B and 9CThere are several feasible forming methods for the bonding method between the top plate and the base in []. The first forming method: The first upper horizontal copper foil 341a and the first vertical conductive column 343a are electroplated to the required thickness at one time. However, since the electroplating speed of the surface copper (i.e., electroplating the first upper horizontal copper foil 341a) is usually faster than that of the sidewall copper (i.e., electroplating the first vertical conductive column 343a), when the thickness of the first vertical conductive column 343a reaches 70um, the thickness of the first upper horizontal copper foil 341a will exceed 70um, and the board thickness will increase. Another feasible implementation method: The method of through-hole plating is adopted. Mainly considering that the electroplating speed of the surface copper (i.e., electroplating the first upper horizontal copper foil 341a) is faster than that of the sidewall copper (i.e., electroplating the first vertical conductive column 343a), in order to solve the problem of the excessive thickness of the first upper horizontal copper foil 341a, the copper thickness of the first upper horizontal copper foil 341a and the first vertical conductive column 343a can be made less than 70um during the first electroplating. For example, the thickness of the first upper horizontal copper foil 341a is 40um, and at this time, the corresponding thickness of the first vertical conductive column 343a will be less than 40um. Then, a mask is covered on the outer surface of the first upper horizontal copper foil 341a, and the through-hole area is exposed. Using the metallization process, copper foil continues to grow at the through-hole position, and finally, the first vertical conductive column 343a with a thickness of 70um is formed. The thickness of the first upper horizontal copper foil 341a can be achieved through subsequent electroplating processes. This method can effectively control the thickness of the electroplated copper. Another feasible method: Apply a through-hole filling electroplating line. This method can make the growth speed of the first vertical conductive column 343a faster than that of the first upper horizontal copper foil 341a. Therefore, the thickness of the first vertical conductive column 343a can reach 70um at one time, while the thickness of the first upper horizontal copper foil 341a will be less than 70um. The thickness of the first upper horizontal copper foil 341a can be achieved through subsequent electroplating processes.

[0230] Please refer back to Figure 8D, a second horizontal copper foil 34b is formed on the base 30a, and the second horizontal copper foil 34b and the first horizontal copper foil 34a are located on opposite sides of the first accommodation space 31. In addition, the base 30a further has a plurality of first through holes 30d, each first through hole 30d penetrating through the top plate 30c and the base 30a and being located between the first horizontal copper foil 34a and the second horizontal copper foil 34b. A first connecting copper foil 34c and a second connecting copper foil 34d are formed in the corresponding first through holes 30d to penetrate through the top plate 30c and the base 30a, wherein the first connecting copper foil 34c is connected between one end of the first horizontal copper foil 34a and one end of the second horizontal copper foil 34b, the second connecting copper foil 34d is respectively connected between the other end of the first horizontal copper foil 34a and the other end of the second horizontal copper foil 34b, and the first connecting copper foil 34c, the second connecting copper foil 34d, the first horizontal copper foil 34a and the second horizontal copper foil 34b constitute a first metal layer 34. Herein, the part of the base 30a and the part of the top plate 30c covered by the first metal layer 34 are defined as a first insulating layer. In this step, in order to take into account engineering stability and avoid the first through holes 30d being too close to the first accommodation space 31, so as to avoid pulling the glass fibers in the insulating material along the drilling direction during drilling and causing the magnetic core placed in the first accommodation space 31 to break, and at the same time avoid the tolerances generated during the mechanical drilling process, the shortest distance between the first through holes 30d and the first accommodation space 31 needs to be greater than 0.2 mm.

[0231] Next, as Figure 8E shown, etching holes 34e are formed on the first horizontal copper foil 34a by chemical etching.

[0232] Next, as Figure 8F shown, a third horizontal copper foil 37a and a first insulating material 37e are formed on the top plate 30c and the first horizontal copper foil 34a, wherein the first insulating material 37e is located between the third horizontal copper foil 37a and the first horizontal copper foil 34a. And a fourth horizontal copper foil 37b and a second insulating material 37f are formed on the base 30a and the second horizontal copper foil 34b, wherein the second insulating material 37f is located between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b, and the second insulating material 37f is located between the fourth horizontal copper foil 37b and the base 30a. In this embodiment, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b are located on opposite sides of the first accommodation space 31.

[0233] In addition, the base 30a further has a plurality of second through holes 30e, each of the second through holes 30e penetrating through the top plate 30c and the base 30a, and each of the second through holes 30e is located between the third horizontal copper foil 37a and the fourth horizontal copper foil 37b. A third connecting copper foil 37c and a fourth connecting copper foil 37d are formed in the corresponding second through hole 30e to penetrate through the top plate 30c and the base 30a, wherein the third connecting copper foil 37c is connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, the fourth connecting copper foil 37d is respectively connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b, and the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b constitute a second metal layer 37. Among them, the first insulating material 37e, the second insulating material 37f, a part of the base 30a and a part of the top plate 30c covered by the second metal layer 37 are defined as a second insulating layer. Then, as Figure 8F shown, there are a plurality of conductive posts 371a between the third horizontal copper foil 37a and the first horizontal copper foil 34a, and each conductive post 371a penetrates through the first insulating material 37e and is connected to the first horizontal copper foil 34a. There are a plurality of conductive posts 371b between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b, and each conductive post 371b penetrates through the second insulating material 37f and is connected to the second horizontal copper foil 34b.

[0234] In addition, a fifth horizontal copper foil 38a, a sixth horizontal copper foil 38b, a fifth connecting copper foil 38c, a sixth connecting copper foil 38d, a third insulating material 38e and a fourth insulating material 38f are formed outside the second metal layer 37, wherein the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, and the fourth insulating material 38f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b. The fifth connecting copper foil 38c is connected between one side of the fifth horizontal copper foil 38a and one side of the sixth horizontal copper foil 38b, the sixth connecting copper foil 38d is connected between the other side of the fifth horizontal copper foil 38a and the other side of the sixth horizontal copper foil 38b, and the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c and the sixth connecting copper foil 38d constitute a third metal layer 38. Among them, the third insulating material 38e, the fourth insulating material 38f, a part of the base 30a and a part of the top plate 30c covered by the third metal layer 38 are defined as a third insulating layer. Then, as Figure 8F shown, there are a plurality of conductive posts 381a between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, and each conductive post 381a penetrates through the third insulating material 38e and is connected to the third horizontal copper foil 37a. There are a plurality of conductive posts 381b between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b, and each conductive post 381b penetrates through the fourth insulating material 38f and is connected to the fourth horizontal copper foil 37b. And Figure 8FIts structure then forms the substrate 3. Next, as Figure 8G shown, the first magnetic post 21 is disposed in the first accommodation space 31 of the substrate 3 to form a part of the magnetic component 1, and as Figure 8G can be seen, the first magnetic post 21 is surrounded by the first horizontal copper foil 34a, the first connecting copper foil 34c, the second horizontal copper foil 34b, and the second connecting copper foil 34d.

[0235] Please continue to refer to Figure 8G . In this embodiment, the plane where the first horizontal copper foil 34a is located forms the first horizontal wiring layer m, and the plane where the second horizontal copper foil 34b is located forms the second horizontal wiring layer n, where the first horizontal wiring layer m and the second horizontal wiring layer n are located on opposite sides of the first magnetic post 21. The plane where the third horizontal copper foil 37a is located forms the third horizontal wiring layer o, and the plane where the fourth horizontal copper foil 37b is located forms the fourth horizontal wiring layer p, where the third horizontal wiring layer o and the fourth horizontal wiring layer p are located on opposite sides of the first magnetic post 21, and the third horizontal wiring layer o is located outside the first horizontal wiring layer m, and the fourth horizontal wiring layer p is located outside the second horizontal wiring layer n. The plane where the fifth horizontal copper foil 38a is located forms the fifth horizontal wiring layer q, and the plane where the sixth horizontal copper foil 38b is located forms the sixth horizontal wiring layer r, where the fifth horizontal wiring layer q and the sixth horizontal wiring layer r are located on opposite sides of the first magnetic post 21, and the fifth horizontal wiring layer q is located outside the third horizontal wiring layer o, and the sixth horizontal wiring layer r is located outside the fourth horizontal wiring layer p.

[0236] In this embodiment, the first winding of the magnetic component 1 is composed of a part of the fifth horizontal copper foil 38a, the fifth connecting copper foil 38c, a part of the sixth horizontal copper foil 38b, the conductive post 381a, a part of the third horizontal copper foil 37a, the conductive post 371a, a part of the first horizontal copper foil 34a, the second connecting copper foil 34d, a part of the second horizontal copper foil 34b, the conductive post 371b, a part of the fourth horizontal copper foil 37b, and the conductive post 381b. The second winding of the magnetic component 1 is composed of a part of the third horizontal copper foil 37a, the third connecting copper foil 37c, a part of the fourth horizontal copper foil 37b, and the fourth connecting copper foil 37d. And the composition and connection relationship of the third winding of the magnetic component 1 are the same as those of the first winding. In some embodiments, since the second winding is located between the first winding and the third winding, the second horizontal wiring layer n can be connected to the third horizontal wiring layer o through a conductive post, that is, a pad (not shown in the figure) is formed on the surface layer of the magnetic component 1. In the subsequent description, the connection method of each segment of copper foil included in each winding will be described based on the topological structure.

[0237] In some other embodiments, the first winding is entirely constituted by the first metal layer 34, the second winding is entirely constituted by the second metal layer 37, and the third winding is entirely constituted by the third metal layer 38. In some embodiments, the magnetic component 1 may include only the first winding, or the magnetic component 1 includes only the first winding and the second winding. In some other embodiments, the first winding is constituted by a part of the first metal layer 34 and a part of the second metal layer 37, and the second winding is constituted by a part of the first metal layer 34 and a part of the second metal layer 37. And both the second winding and the third winding are wound around the first magnetic post 21. In some other embodiments, the first winding is constituted by a part of the first metal layer 34 and a part of the third metal layer 38, and the third winding is constituted by another part of the first metal layer 34 and another part of the third metal layer 38, wherein the first windings are connected by conductive posts, and the third windings are connected by another conductive post.

[0238] Please refer to Figure 10 , which is Figure 2 a schematic cross-sectional structure diagram of the second embodiment of the magnetic component shown. As Figure 10 shown, this embodiment is similar to Figure 8G the first embodiment, the difference is only that, in this embodiment, a chamfer 21a is provided at at least one edge of the first magnetic post 21, and the chamfer 21a is adjacent to the corner of the first metal layer 34, so that when the top plate 30c is pressed against the base 30a via an insulating adhesive, and part of the insulating adhesive (such as Figure 10 the two quarter black circles in

[0239] ) flows into the first accommodation space 31, it can prevent the insulating adhesive from contacting the first magnetic post 21.

[0239] In some embodiments, due to the fact that in the actual processing process, mechanical drilling is likely to cause deformation of the first accommodation space 31, that is, the dimensional tolerance of the formed first accommodation space 31 is relatively large. Therefore, in some embodiments, a transition horizontal part and a conductive post connected to the first connection copper foil 34c and the second connection copper foil 34d can be pre-formed on the base 30a to reduce the possibility of deformation caused by mechanical drilling. Please refer to Figure 11 , which is Figure 2 a schematic cross-sectional structure diagram of the third embodiment of the magnetic component shown. As Figure 11 shown, this embodiment is similar to Figure 8GThe first embodiment is different only in that the substrate 3 further includes a seventh horizontal wiring layer s, which is located between the first horizontal wiring layer m and the second horizontal wiring layer n, and the seventh horizontal wiring layer s is adjacent to the top plate 30c. In addition, in addition to the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connection copper foil 34c, and the second connection copper foil 34d, the first metal layer 34 of this embodiment further includes two first transition horizontal portions 34f, which are located in the seventh horizontal wiring layer s and are respectively located between the base 30a and the top plate 30c. In some embodiments, the two first transition horizontal portions 34f are further located on opposite sides of the first magnetic post 21. The two first transition horizontal portions 34f are respectively connected to both ends of the first horizontal copper foil 34a through corresponding first conductive posts 34g, and the two first transition horizontal portions 34f are respectively connected to the first connection copper foil 34c and the second connection copper foil 34d.

[0240] Please refer to Figures 12A to 12G , which is Figure 2 a schematic cross-sectional structure diagram of a manufacturing method of a fourth embodiment of the substrate of the magnetic component shown in. First, as Figure 12A shown, a base 30a is provided, and a groove 30b is formed in the base 30a. The base 30a can be composed of a printed circuit board, and the groove 30b can be formed by machining milling or laser drilling, etc. In this embodiment, the groove 30b can be formed by controlled-depth drilling, and the depth-to-width ratio of the groove 30b can be less than 1 to achieve good copper plating quality and copper plating thickness. Then, as Figure 12B shown, a second horizontal copper foil 34b, a first connection copper foil 34c, and a second connection copper foil 34d are formed on the inner wall of the groove 30b. The second horizontal copper foil 34b, the first connection copper foil 34c, and the second connection copper foil 34d are respectively disposed on multiple sides of the inner wall of the first accommodating space 31, and both ends of the second horizontal copper foil 34b are respectively connected to one end of the first connection copper foil 34c and one end of the second connection copper foil 34d. In addition, two first transition horizontal portions 34f are further formed outside the groove 30b. One of the two first transition horizontal portions 34f, the first transition horizontal portion 34f, is connected to the other end of the first connection copper foil 34c, and the other first transition horizontal portion 34f of the two first transition horizontal portions 34f is connected to the other end of the second connection copper foil 34d.

[0241] Next, as Figure 12CAs shown, a top plate 30c is provided on a base 30a and covers a groove 30b, and two first transition horizontal portions 34f are respectively located between the top plate 30c and the base 30a. Among them, the base 30a and the top plate 30c jointly define a first accommodation space 31, and a second horizontal copper foil 34b, a first connection copper foil 34c, and a second connection copper foil 34d are located on the inner wall of the first accommodation space 31. And in this step, a first horizontal copper foil 34a is formed on the top plate 30c. Therefore, the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connection copper foil 34c, and the second connection copper foil 34d are respectively arranged on multiple sides of the inner wall of the first accommodation space 31.

[0242] Next, as Figure 12D shown, both ends of the first horizontal copper foil 34a are respectively connected to the corresponding first transition horizontal portions 34f through first conductive posts 34g. Among them, the first connection copper foil 34c, the second connection copper foil 34d, the second horizontal copper foil 34b, two first transition horizontal portions 34f, the first horizontal copper foil 34a, and two first conductive posts 34g constitute a first metal layer 34. Only a part of the first metal layer 34 is arranged on the inner wall of the first accommodation space 31. And in this embodiment, a part of the first metal layer 34 is arranged on multiple sides of the inner wall of the first accommodation space 31. And in this step, etching holes 34e are formed on the first horizontal copper foil 34a by chemical etching. And Figures 12E to 12G the manufacturing method of Figure 8F and Figure 8G is similar to the manufacturing method of

[0243] and will not be elaborated herein.

[0243] As can be seen from the above, in the foregoing embodiment (as Figure 8E shown), the width dimension of the first metal layer 34 of the magnetic component 1 adjacent to one side of the first accommodation space 31 is W1'. In this embodiment, the magnetic component 1c directly forms the first connection copper foil 34c and the second connection copper foil 34d in the first accommodation space 31. The width dimension of the formed first metal layer 34 adjacent to one side of the first accommodation space 31 is W1". As Figure 12D shown. Among them, W1' is the width dimension required for the mechanical through-hole process, and W1" is the width dimension required for the laser blind-hole process. Since the size of the laser blind hole is smaller than that of the mechanical through hole itself, and the drilling accuracy of the blind hole is higher than that of the mechanical through hole, so W1" < W1'. Similarly, the width of the first metal layer 34 on the other side of the first accommodation space 31 will also be correspondingly reduced, and the size of the finally formed entire module is further reduced compared with the foregoing embodiment, so that the power density of the magnetic component 1c is further improved. In addition, since the width dimension of the magnetic component 1c is reduced, the current path can be shortened, so that the winding loss will be correspondingly reduced and the efficiency is improved.

[0244] In this embodiment, since the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are disposed on the inner wall of the first accommodating space 31, it can be known that only a part of the first metal layer 34 is disposed on the inner wall of the first accommodating space 31. In some other embodiments, only a part of the copper foils among the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d may be disposed on the inner wall of the first accommodating space 31. For example, only the first connecting copper foil 34c and the second connecting copper foil 34d are disposed on the inner wall of the first accommodating space 31, or only the first connecting copper foil 34c is disposed on the inner wall of the first accommodating space 31, or only a part of the first connecting copper foil 34c is disposed on the inner wall of the first accommodating space 31. Therefore, it will not be elaborated herein.

[0245] In some embodiments, a thin insulating layer (not shown) may be formed on the surface of the first metal layer 34 by means of spraying, dipping, electrophoresis, electrostatic spraying, chemical vapor deposition, physical vapor deposition, sputtering, evaporation plating, or printing. The thickness of the insulating layer needs to be less than half of the thickness of the second insulating layer, where the second insulating layer is composed of the first insulating material 37e, the second insulating material 37f, a part of the base 30a, and a part of the top plate 30c covered by the second metal layer 37, so as to avoid the possibility of oxidation of the first metal layer 34 and also meet the insulation condition between the first metal layer 34 and the first magnetic column 21.

[0246] Please refer to Figure 13 , which is Figure 2 a schematic cross-sectional structure diagram of the fifth embodiment of the magnetic component shown. As Figure 13 shown, the magnetic component 1d of this embodiment is similar to the magnetic component 1c of the fourth embodiment. The difference is that in the magnetic component 1d of this embodiment, the hole for accommodating the first conductive column 34g is a mechanical blind hole formed by mechanical means, and the mechanical means may be a controlled-depth drilling or a controlled-depth milling method. And after the mechanical blind hole is formed, the first conductive column 34g is further formed by a metallization process.

[0247] Please refer to Figures 14A to 14G , which is Figure 2 a schematic cross-sectional structure diagram of the manufacturing method of the sixth embodiment of the magnetic component shown. First, as Figure 14A shown, a base 30a is provided, and a groove 30b is formed in the base 30a. This step is similar to Figure 12A , so it will not be elaborated herein. Next, as Figure 14B shown, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are formed on the inner wall of the groove 30b, and two first transition horizontal portions 34f are formed outside the groove 30b. This step is similar to Figure 12B , so it will not be elaborated herein.

[0248] Next, asFigure 14C As shown, a metal protection layer 39 is formed on the second horizontal copper foil 34b, the first connecting copper foil 34c, the second connecting copper foil 34d, and the two first transition horizontal portions 34f. In this embodiment, since tin has low cost and extremely slow reaction rate in strongly oxidizing solvents and excellent protection effect, the metal protection layer 39 can be composed of tin. Of course, the metal protection layer 39 can also be composed of materials such as tin alloy, gold or gold alloy, without limitation. And in this embodiment, in order to perform the next pattern definition on the first metal layer 34 surrounding the first accommodating space 31, the metal protection layer 39 can be formed by electroplating or electroless plating technology, so that the surface conforming ability of the metal protection layer 39 is better, and the bubbles generated when using organic materials as the protection layer can be avoided, and the protection layer effect can be achieved without removing the organic materials. In some other embodiments, the thickness of the metal protection layer 39 can be adjusted according to the protection capabilities of different materials of the metal protection layer 39. For example, if the metal protection layer 39 is composed of tin or tin alloy, the thickness of the metal protection layer 39 can be between 1um and 20um. Or, for example, if the metal protection layer 39 is composed of gold or gold alloy, the thickness of the metal protection layer 39 can be between 0.1um and 2um.

[0249] Next, as Figure 14D shown, part of the metal protection layer 39 is removed by direct writing technology to form a surface pattern 39a, so as to expose the second horizontal copper foil 34b of part of the first metal layer 34. In this embodiment, the direct writing technology can be laser direct writing technology, which is characterized by directly performing pattern definition using a focused light beam, electron beam or ion beam, etc. It does not require a mask, is flexible in production, and can produce serialized products according to different application requirements, thus greatly improving the time to market of the product. In addition, due to the use of direct writing technology, the sample and the surface state of the sample can be accurately positioned by optical recognition technology before the direct writing technology, and the direct writing path of each sample can be optimized separately based on this, so as to increase the yield and reduce the requirements for the previous process, thereby improving the competitiveness of the product. In addition, in this embodiment, since the metal protection layer 39 is disposed on the first metal layer 34, the first metal layer 34 can play a good role in thermal isolation during the laser direct writing technology process to avoid affecting the magnetic column.

[0250] Next, as Figure 14E shown, the second horizontal copper foil 34b of the first metal layer 34 of the part exposed by the surface pattern 39a is etched to form a pattern structure 39b, and part of the base 30a is exposed, wherein the second horizontal copper foil 34b of the first metal layer 34 is divided into two parts by the pattern structure 39b, that is, the part representing the first metal layer 34 on the inner wall of the first accommodating space 31 is segmented.

[0251] Next, as Figure 14F shown, the remaining metal protection layer 39 is removed. In some embodiments, whether to remove the metal protection layer 39 can also be selected according to the material of the metal protection layer 39. For example, when the metal protection layer 39 is made of tin, after etching the relevant pattern on the covered first metal layer 34, whether to remove the metal protection layer 39 made of tin with an etching solution can be selected as needed. Of course, if the metal protection layer 39 is made of gold, the metal protection layer 39 can be selected to be retained. Since the thickness of the metal protection layer 39 made of gold is extremely thin, the edge part can also be removed by processes such as water jet, sandblasting or ultrasonic. In some other embodiments, the first metal layer 34 can also be divided by mechanical means. And Figure 14G the manufacturing method is similar to Figures 12C to 12G the manufacturing method, so it will not be elaborated here.

[0252] Please refer to Figures 15A to 15G which is a cross-sectional structural schematic diagram of the manufacturing method of the seventh embodiment of the magnetic component shown in Figure 2 . First, as Figure 15A shown, a base 30a is provided, and a groove 30b is formed in the base 30a. This step is similar to Figure 12A , so it will not be elaborated here. Next, as Figure 15B shown, a second horizontal copper foil 34b, a first connecting copper foil 34c and a second connecting copper foil 34d are formed on the inner wall of the groove 30b. The two ends of the second horizontal copper foil 34b are respectively connected to one end of the first connecting copper foil 34c and one end of the second connecting copper foil 34d. In addition, two first transition horizontal parts 34f are formed outside the groove 30b. One of the two first transition horizontal parts 34f of the two first transition horizontal parts 34f is connected to the other end of the first connecting copper foil 34c, and the other first transition horizontal part 34f of the two first transition horizontal parts 34f is connected to the other end of the second connecting copper foil 34d. In addition, in this step, a fifth connecting copper foil 38c, a sixth connecting copper foil 38d, a seventh horizontal copper foil 40 and two second transition horizontal parts 41a are further formed on the outside of the base 30a. The fifth connecting copper foil 38c and the sixth connecting copper foil 38d are located on opposite sides of the base 30a, and the two ends of the seventh horizontal copper foil 40 are respectively connected to one end of the fifth connecting copper foil 38c and one end of the sixth connecting copper foil 38d. One of the two second transition horizontal parts 41a is connected to the other end of the fifth connecting copper foil 38c, and the other of the two second transition horizontal parts 41a is connected to the other end of the sixth connecting copper foil 38d. In Figure 15BIn the step, a mask may be added to the bottom surface of the base 30a, and then a metal wiring layer is formed on the side surface, the upper surface and the inner wall of the groove 30b of the base 30a through a metallization process, wherein the bottom surface of the base 30a will not continue to grow copper foil due to the mask, that is, only the base copper of the base 30a is retained, and the connection of the wiring layer is blocked by etching to form the required fifth connecting copper foil 38c, sixth connecting copper foil 38d, seventh horizontal copper foil 40 and second transition horizontal portion 41a.

[0253] Then, if Figure 15C As shown, a top plate 30c is provided on the base 30a and covers the groove 30b, and also covers the two first transition horizontal portions 34f and the two second transition horizontal portions 41a, wherein the top plate 30c and the base 30a together define the first accommodation space 31. In this step, a first horizontal copper foil 34a is formed on the top plate 30c, and both ends of the first horizontal copper foil 34a are respectively connected to the corresponding first transition horizontal portions 34f through the first conductive pillars 34g, wherein the first connecting copper foil 34c, the second connecting copper foil 34d, the second horizontal copper foil 34b, the two first transition horizontal portions 34f, the first horizontal copper foil 34a and the two first conductive pillars 34g constitute the first metal layer 34. In this step, two third transitional horizontal portions 41b are formed on the top plate 30c, one of the two third transitional horizontal portions 41b is connected to the corresponding second transitional horizontal portion 41a via the second conductive column 41c, and the other of the two third transitional horizontal portions 41b is connected to the corresponding second transitional horizontal portion 41a via another second conductive column 41c. The second horizontal copper foil 34b, the first connecting copper foil 34c and the second connecting copper foil 34d are located on the inner wall of the first accommodating space 31.

[0254] Then, if Figure 15DAs shown, a third horizontal copper foil 37a and a first insulating material 37e are formed on the top plate 30c and the first horizontal copper foil 34a, wherein the first insulating material 37e is located between the third horizontal copper foil 37a and the first horizontal copper foil 34a. In addition, the base 30a further has a plurality of second through holes 30e, each of the second through holes 30e penetrating through the top plate 30c and the base 30a and located between the third horizontal copper foil 37a and the seventh horizontal copper foil 40. A third connecting copper foil 37c and a fourth connecting copper foil 37d are formed in the corresponding second through holes 30e to penetrate through the top plate 30c and the base 30a, wherein the third connecting copper foil 37c is connected between one end of the third horizontal copper foil 37a and one end of the seventh horizontal copper foil 40, and the fourth connecting copper foil 37d is respectively connected between the other end of the third horizontal copper foil 37a and the other end of the seventh horizontal copper foil 40. There are a plurality of conductive posts 371a between the third horizontal copper foil 37a and the first horizontal copper foil 34a, each of the conductive posts 371a penetrating through the first insulating material 37e to be connected to the first horizontal copper foil 34a, and there are a plurality of conductive posts 371b between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b, each of the conductive posts 371b penetrating through the second insulating material 37f to be connected to the second horizontal copper foil 34b.

[0255] Next, as Figure 15E shown, the two ends of the third horizontal copper foil 37a are segmented by an etching method, so that two fourth transition horizontal parts 41d are formed at the two ends of the third horizontal copper foil 37a, and the two fourth transition horizontal parts 41d are respectively connected to the corresponding third transition horizontal parts 41b through third conductive posts 41e. In addition, the seventh horizontal copper foil 40 is segmented into a fourth horizontal copper foil 37b and two fifth transition horizontal parts 40a by an etching method, wherein one of the two fifth transition horizontal parts 40a is connected to a fifth connecting copper foil 38c, the other of the two fifth transition horizontal parts 40a is connected to a sixth connecting copper foil 38d, and the fourth horizontal copper foil 37b is located between the two fifth transition horizontal parts 40a, wherein the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b constitute a second metal layer 37.

[0256] Next, as Figure 15FAs shown, a fifth horizontal copper foil 38a and a third insulating material 38e are formed on the third horizontal copper foil 37a and two fourth transition horizontal portions 41d, wherein a part of the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, and another part of the third insulating material 38e is located between the fifth horizontal copper foil 38a and the two fourth transition horizontal portions 41d. And the fifth horizontal copper foil 38a is connected to the corresponding fourth transition horizontal portion 41d via two fourth conductive posts 41f. And in this step, a sixth horizontal copper foil 38b and a second insulating material 37f are formed on the fourth horizontal copper foil 37b and two fifth transition horizontal portions 40a, wherein a part of the second insulating material 37f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b, and another part of the second insulating material 37f is located between the sixth horizontal copper foil 38b and the two fifth transition horizontal portions 40a. The sixth horizontal copper foil 38b is respectively connected to the corresponding fifth transition horizontal portion 40a via two fifth conductive posts 41g. Among them, the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, the sixth connecting copper foil 38d, the two fifth transition horizontal portions 40a, the two second transition horizontal portions 41a, the two third transition horizontal portions 41b, the two second conductive posts 41c, the two fourth transition horizontal portions 41d, the two third conductive posts 41e, the two fourth conductive posts 41f and the two fifth conductive posts 41g constitute the third metal layer 38. In this embodiment, since part of the first metal layer 34 and part of the third metal layer 38 can be formed simultaneously during one electroplating process, the manufacturing time and manufacturing cost are both reduced.

[0257] In addition, as Figure 15F can be seen, one of the two second transition horizontal portions 41a, one of the two third transition horizontal portions 41b, one of the two fourth transition horizontal portions 41d and one end of the fifth horizontal copper foil 38a are connected by a first conductive portion, wherein the first conductive portion is constituted by one of the two second conductive posts 41c, one of the two third conductive posts 41e and one of the two fourth conductive posts 41f. One of the two fifth transition horizontal portions 40a and the sixth horizontal copper foil 38b are connected by a second conductive portion, wherein the second conductive portion is constituted by one of the two fifth conductive posts 41g. The other of the two second transition horizontal portions 41a, the other of the two third transition horizontal portions 41b, the other of the two fourth transition horizontal portions 41d and the other end of the fifth horizontal copper foil 38a are connected by a third conductive portion, wherein the third conductive portion is constituted by the other of the two second conductive posts 41c, the other of the two third conductive posts 41e and the other of the two fourth conductive posts 41f. The other of the two fifth transition horizontal portions 40a and the sixth horizontal copper foil 38b are connected by a fourth conductive portion, wherein the fourth conductive portion is constituted by the other of the two fifth conductive posts 41g.

[0258] Next, as Figure 15G shown, the first magnetic post 21 is disposed within the first accommodating space 31 of the substrate 3 to form a partial magnetic component 1f. In addition, in this embodiment, the plane where the first horizontal copper foil 34a and the two third transition horizontal portions 41b are located forms a first horizontal wiring layer m, and the first horizontal copper foil 34a is located between the two third transition horizontal portions 41b. The plane where the second horizontal copper foil 34b is located forms a second horizontal wiring layer n, where the first horizontal wiring layer m and the second horizontal wiring layer n are located on opposite sides of the first magnetic post 21. The plane where the third horizontal copper foil 37a and the two fourth transition horizontal portions 41d are located forms a third horizontal wiring layer o, and the third horizontal copper foil 37a is located between the two fourth transition horizontal portions 41d. The plane where the fourth horizontal copper foil 37b and the two fifth transition horizontal portions 40a are located forms a fourth horizontal wiring layer p, and the fourth horizontal copper foil 37b is located between the two fifth transition horizontal portions 40a, where the third horizontal wiring layer o and the fourth horizontal wiring layer p are located on opposite sides of the first magnetic post 21, and the third horizontal wiring layer o is located outside the first horizontal wiring layer m, and the fourth horizontal wiring layer p is located outside the second horizontal wiring layer n. The plane where the fifth horizontal copper foil 38a is located forms a fifth horizontal wiring layer q, and the plane where the sixth horizontal copper foil 38b is located forms a sixth horizontal wiring layer r, where the fifth horizontal wiring layer q and the sixth horizontal wiring layer r are located on opposite sides of the first magnetic post 21, and the fifth horizontal wiring layer q is located outside the third horizontal wiring layer o, and the sixth horizontal wiring layer r is located outside the fourth horizontal wiring layer p. In addition, the plane where the two second transition horizontal portions 41a and the two first transition horizontal portions 34f are located forms a seventh horizontal wiring layer s, and the seventh horizontal wiring layer s is located between the first horizontal wiring layer m and the second horizontal wiring layer n and adjacent to the top plate 30c, and the two first transition horizontal portions 34f are located between the two second transition horizontal portions 41a.

[0259] Please refer to Figure 16 , which is Figure 2 a schematic cross-sectional structure diagram of an eighth embodiment of the magnetic component shown. As Figure 16 shown, the magnetic component 1g of this embodiment is similar to Figure 8G the magnetic component 1, the difference being only that the substrate 3 of the magnetic component 1g in this embodiment is connected between the fifth horizontal copper foil 38a and the first horizontal copper foil 34a by the first mechanical blind hole 50a, and is connected between the sixth horizontal copper foil 38b and the second horizontal copper foil 34b by the second mechanical blind hole 50b. The substrate 3 connected by the mechanical blind hole can have a thicker allowable thickness and a wider application range.

[0260] Please refer to Figure 17 , which is Figure 2 a schematic cross-sectional structure diagram of a ninth embodiment of the magnetic component shown. AsFigure 17 As shown, the magnetic component 1h of this embodiment is similar to Figure 12G the magnetic component 1c. The difference is only that the substrate 3 of the magnetic component 1h of this embodiment is connected between the fifth horizontal copper foil 38a and the first horizontal copper foil 34a by the first mechanical blind hole 50a, and is connected between the sixth horizontal copper foil 38b and the second horizontal copper foil 34b by the second mechanical blind hole 50b, and is further connected between the first horizontal copper foil 34a and the corresponding first transition horizontal portion 34f by the third mechanical blind hole 51. The substrate 3 connected by the mechanical blind hole can have a thicker allowable thickness and a wider application range.

[0261] Please refer to Figures 18A to 18F which is Figure 2 a schematic cross-sectional structure diagram of the manufacturing method of the tenth embodiment of the magnetic component shown in. First, as Figure 18A shown, provide a top plate 30c and a base 30a. The base 30a includes a bottom surface 30f, a first side wall 30g, and a second side wall 30h. The first side wall 30g and the second side wall 30h are located between the top plate 30c and the bottom surface 30f. And in this step, form two first transition horizontal portions 34f, two sixth transition horizontal portions 34h, a first connection copper foil 34c, and a second connection copper foil 34d. One of the two first transition horizontal portions 34f is located between the top plate 30c and the first side wall 30g, and the other of the two first transition horizontal portions 34f is located between the top plate 30c and the second side wall 30h. One of the two sixth transition horizontal portions 34h is located between the bottom surface 30f and the first side wall 30g, and the other of the two sixth transition horizontal portions 34h is located between the bottom surface 30f and the second side wall 30h. The first connection copper foil 34c is located on the inner wall of the first side wall 30g and is connected between one of the two first transition horizontal portions 34f and one of the two sixth transition horizontal portions 34h. The second connection copper foil 34d is located on the inner wall of the second side wall 30h and is connected between the other of the two first transition horizontal portions 34f and the other of the two sixth transition horizontal portions 34h.

[0262] In addition, please continue to refer to Figure 18A, form a first horizontal copper foil 34a and a third horizontal copper foil 37a on both sides of the top plate 30c, where the first horizontal copper foil 34a is located between the top plate 30c and two first transitional horizontal portions 34f. And form a second horizontal copper foil 34b and a fourth horizontal copper foil 37b on both sides of the bottom surface 30f, where the second horizontal copper foil 34b is located between the bottom surface 30f and two sixth transitional horizontal portions 34h. In this embodiment, the top plate 30c, the bottom surface 30f, the first side wall 30g and the second side wall 30h can be bonded by a pressing method through an insulating medium (not shown) to form an integral structure, so as to define a first accommodating space 31, where the first side wall 30g and the second side wall 30h are arranged on the continuous structure in a connecting rib 34i manner to ensure that the first side wall 30g and the second side wall 30h are an integral structure.

[0263] Next, as Figure 18B shown, form a plurality of second through holes 30e, a plurality of first blind holes 50c and a plurality of second blind holes 50d, where each second through hole 30e is connected between the third horizontal copper foil 37a and the fourth horizontal copper foil 37b, each first blind hole 50c is connected between the third horizontal copper foil 37a, the first horizontal copper foil 34a and the corresponding first transitional horizontal portion 34f, and each second blind hole 50d is connected between the fourth horizontal copper foil 37b, the second horizontal copper foil 34b and the corresponding sixth transitional horizontal portion 34h. And in this step, conductive posts can be further arranged in the plurality of second through holes 30e, and conductive posts can also be arranged in the plurality of first blind holes 50c and the plurality of second blind holes 50d.

[0264] Next, as Figure 18C shown, use the back drilling process to remove part of the conductive posts in the plurality of first blind holes 50c to form a plurality of first back drilled holes 50e for disconnecting the electrical connection between the third horizontal copper foil 37a and the first horizontal copper foil 34a; and use the back drilling process to remove part of the conductive posts in the plurality of second blind holes 50d to form a plurality of second back drilled holes 50f for disconnecting the electrical connection between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b, where the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first transitional horizontal portion 34f, the sixth transitional horizontal portion 34h, the first connecting copper foil 34c and the second connecting copper foil 34d constitute the first metal layer 34, and the third horizontal copper foil 37a, the fourth horizontal copper foil 37b and the conductive posts in the plurality of second through holes 30e constitute the second metal layer 37. In this embodiment, the plurality of first back drilled holes 50e and the plurality of second back drilled holes 50f can be further filled flat by the plugging process, where the plugging process includes resin plugging or green oil plugging, etc., and the first back drilled holes 50e and the second back drilled holes 50f are mechanical blind hole structures, and a certain accuracy needs to be ensured during back drilling, for example, controlling the accuracy within + / -50um. Next, as Figure 18DAs shown, the third-level copper foil 37a and the fourth-level copper foil 37b are formed with etching holes 37g through a metallization process. And Figure 18E and Figure 18F The manufacturing method is similar to that of Figure 8F and Figure 8G and will not be elaborated herein.

[0265] In this embodiment, the first metal layer 34 and the second metal layer 37 are formed simultaneously after the first back drill hole 50e and the second back drill hole 50f, greatly reducing the process path and cost. At the same time, the first back drill hole 50e and the second back drill hole 50f are mechanical through holes or mechanical blind holes. Compared with the laser hole structure process of an HDI (High Density Interconnector) board, the process of this structure is a conventional printed circuit board process, and the process production line is very mature, further reducing the cost. In this embodiment, the first metal layer 34 is disposed on four side surfaces of the inner wall of the first accommodation space 31. Compared with Figure 17 the structure shown, the thickness of the substrate above the first magnetic column 21 in this embodiment is significantly reduced. If the overall height of the magnetic component remains unchanged, the reduced size can be given to the height of the magnetic column, increasing the cross-sectional area of the magnetic column, reducing magnetic loss, and significantly improving the efficiency.

[0266] In some cases, in the foregoing first to tenth embodiments, only the first metal layer 34 and the second metal layer 37 may be provided on the substrate 3, without providing the third metal layer.

[0267] Please refer to Figures 19A to 19F which is a schematic cross-sectional structure diagram of the manufacturing method of the eleventh embodiment of the magnetic component shown in Figure 2 . First, as shown in Figure 19A a base 30a is provided, and a groove 30b is formed in the base 30a, where the second-level copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are formed on the inner wall of the groove 30b.

[0268] Next, as shown in Figure 19BAs shown, a top plate 30c, an anti-corrosion plating layer 61a, a first horizontal copper foil 34a, and a third horizontal copper foil 37a are provided. The third horizontal copper foil 37a is located on the first side of the top plate 30c, and the anti-corrosion plating layer 61a and the first horizontal copper foil 34a are located on the second side of the top plate 30c. The anti-corrosion plating layer 61a divides the first horizontal copper foil 34a into two parts. Then, the top plate 30c and the base 30a are pressed together to form a first accommodation space 31. The first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, the second connecting copper foil 34d, and the anti-corrosion plating layer 61a are located in the first accommodation space 31. There is a gap 60a between a part of the first horizontal copper foil 34a and the first connecting copper foil 34c, and there is also a gap 60a between another part of the first horizontal copper foil 34a and the second connecting copper foil 34d. Herein, the anti-corrosion plating layer 61a in this embodiment is used to prevent further plating of excess copper on the first horizontal copper foil 34a during the upper copper process, that is, to ensure that the first horizontal copper foil 34a is divided into two separate left and right parts at the position of the anti-corrosion plating layer 61a.

[0269] Next, as shown in Figure 19C the left figure of, a plurality of second through holes 30e are formed in the base 30a by a drilling process, and each second through hole 30e further penetrates the top plate 30c and the third horizontal copper foil 37a. The drilling process can be a mechanical drilling. In some embodiments, a third blind hole 50g can be formed in the top plate 30c and the third horizontal copper foil 37a by the drilling process, and a fourth blind hole 50h can also be formed in the base 30a. The drilling process can be a laser drilling. Figure 19C The right figure of is a schematic cross-sectional structure diagram of the left figure along the C-C' section. As shown in Figure 19C the right figure of, the substrate 3 further has a waist-shaped groove 80. In some embodiments, the waist-shaped groove 80 can communicate with the first accommodation space 31.

[0270] Next, as shown in Figure 19DAs shown, a fourth horizontal copper foil 37b is formed on the base 30a, wherein the fourth horizontal copper foil 37b and the third horizontal copper foil 37a are located at opposite sides of the first accommodating space 31. A third connecting copper foil 37c and a fourth connecting copper foil 37d are further formed in the corresponding second through hole 30e, so that the third connecting copper foil 37c is connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, and the fourth connecting copper foil 37d is connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b. In addition, in this step, the gap 60a is filled with copper foil, so that the first horizontal copper foil 34a is connected to the first connecting copper foil 34c, and the first horizontal copper foil 34a is connected to the second connecting copper foil 34d, wherein the first connecting copper foil 34c, the second connecting copper foil 34d, the first horizontal copper foil 34a and the second horizontal copper foil 34b constitute the first metal layer 34, and the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b constitute the second metal layer 37. In this embodiment, the first metal layer 34 is completely disposed on the inner wall of the first accommodating space 31. Since the anti-chemical plating layer 61a is set, when the metallization process is performed in this step, the seed copper will not be plated at the position where the anti-chemical plating layer 61a is set, and the electroplating process will not form a connecting copper foil at this position.

[0271] Then, if Figure 19E As shown, a fifth horizontal copper foil 38a, a sixth horizontal copper foil 38b, a fifth connecting copper foil 38c, a sixth connecting copper foil 38d, a third insulating material 38e and a fourth insulating material 38f are formed outside the second metal layer 37, wherein the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, the fourth insulating material 38f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b, and the fifth connecting copper foil 38c is connected between one side of the fifth horizontal copper foil 38a and one side of the sixth horizontal copper foil 38b, and the sixth connecting copper foil 38d is connected between the other side of the fifth horizontal copper foil 38a and the other side of the sixth horizontal copper foil 38b, and the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c and the sixth connecting copper foil 38d constitute the third metal layer 38. In this step, the third metal layer 38 is formed by drilling and metallization processes, and the first metal layer 34 and the second metal layer 37 are connected via conductive pillars, and the second metal layer 37 and the third metal layer 38 are also connected via conductive pillars, wherein the conductive pillars are formed by mechanical drilling or laser drilling. In some embodiments, the fifth connecting copper foil 38c and the sixth connecting copper foil 38d are formed by separating the conductive pillars shared by two adjacent substrates 3 during the sheet-joining process.

[0272] Then, if Figure 19FAs shown, the first magnetic post 21 is placed into the first accommodating space 31 to form the magnetic component 1j. In some embodiments, the magnetic component 1j may only include the first metal layer 34 and the third metal layer 38, without including the second metal layer 37. In other embodiments, the magnetic component 1j may also only include the first metal layer 34, without including the second metal layer 37 and the third metal layer 38.

[0273] In this embodiment, since the first metal layer 34 of the magnetic component 1j is completely formed on the inner wall of the first accommodating space 31, there is no need for additional metal components to connect with other metal layers, such as a transition horizontal part, nor is there a need for an additional insulating layer to disconnect from other metal layers. Therefore, the width of the first metal layer 34 of the magnetic component 1j in this embodiment is shorter and the height is smaller. As a result, the overall size of the magnetic component 1j is further reduced, so the power density of the magnetic component 1j can be increased. If the size of the magnetic component 1j is fixed, the optimized size can be transferred to the magnetic core, increasing the size of the magnetic core and effectively reducing the loss of the magnetic core, thereby improving the efficiency of the magnetic component 1j.

[0274] It should be specifically noted that although the first metal layer 34 is completely located on the inner wall of the first accommodating space 31, the plane where the first horizontal copper foil 34a of the first metal layer 34 is located can still form the first horizontal wiring layer, and the plane where the second horizontal copper foil 34b of the first metal layer 34 is located can still form the second horizontal wiring layer.

[0275] Please refer to Figures 20A to 20E which is Figure 2 a schematic cross-sectional structure diagram of the manufacturing method of the twelfth embodiment of the magnetic component shown. First, as Figure 20A shown, a base 30a is provided, and a groove 30b is formed in the base 30a, where the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are formed on the inner wall of the groove 30b.

[0276] Next, as Figure 20B shown, Figure 20B the manufacturing method of Figure 19B is similar to the manufacturing method of

[0277] Next, as Figure 20CAs shown, a fourth horizontal copper foil 37b is formed on the base 30a, where the third horizontal copper foil 37a and the fourth horizontal copper foil 37b are located on opposite sides of the first magnetic post 21. And in this step, a first common conductive post 62a and a second common conductive post 62b are formed. Among them, the first common conductive post 62a is connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, and penetrates through one of the two insulating sheets 61b, and the second common conductive post 62b is connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b, and penetrates through the other insulating sheet 61b of the two insulating sheets 61b.

[0278] Next, as Figure 20D shown, the first common conductive post 62a and the second common conductive post 62b are respectively cut by a mechanical cutting process, so that the first common conductive post 62a is divided into a third connecting copper foil 37c and a fifth connecting copper foil 38c, and the second common conductive post 62b is divided into a fourth connecting copper foil 37d and a sixth connecting copper foil 38d. And in this step, the two ends of the third horizontal copper foil 37a are respectively cut to form two fourth transition horizontal parts 41d, and the two ends of the fourth horizontal copper foil 37b are respectively cut to form two fifth transition horizontal parts 40a. Among them, the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c and the second connecting copper foil 34d constitute the first metal layer 34, while the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b constitute the second metal layer 37.

[0279] Next, as Figure 20E shown, a fifth horizontal copper foil 38a and a third insulating material 38e are formed on the third horizontal copper foil 37a, where the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, and the two ends of the fifth horizontal copper foil 38a are respectively connected to the two fourth transition horizontal parts 41d through corresponding fourth conductive posts 41f. A sixth horizontal copper foil 38b and a fourth insulating material 38f are formed on the fourth horizontal copper foil 37b, where the fourth insulating material 38f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b, and the two ends of the sixth horizontal copper foil 38b are respectively connected to the two fifth transition horizontal parts 40a through corresponding fifth conductive posts 41g. Among them, the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, the sixth connecting copper foil 38d, the two fifth transition horizontal parts 40a, the two fourth transition horizontal parts 41d, the two fourth conductive posts 41f and the two fifth conductive posts 41g constitute the third metal layer 38. And in this step, the first magnetic post 21 is disposed in the first accommodating space 31 of the substrate 3 to form a part of the magnetic component 1k. In this embodiment, the first common conductive post 62a and the second common conductive post 62b are cut by a mechanical cutting process.Figure 20C and Figure 20D the top views of Figure 21A and Figure 21B are shown respectively as

[0280] In this embodiment, the third connecting copper foil 37c and the fourth connecting copper foil 37d of the second metal layer 37 are formed in the structure of sidewall copper. Therefore, the width dimension of the second metal layer 37 of the magnetic component 1k in this embodiment can be smaller, and it is also a mature mass production process in terms of technology. If continuous sheet processing is adopted, it will facilitate large-scale production. And because the third connecting copper foil 37c and the fourth connecting copper foil 37d of the second metal layer 37, the fifth connecting copper foil 38c and the sixth connecting copper foil 38d of the third metal layer 38 are formed by one-time electroplating and are formed by later mechanical segmentation, the time and cost are both reduced. In this embodiment, the first metal layer 34 is disposed on the four side surfaces of the inner wall of the first accommodating space 31.

[0281] Please refer to Figure 22 , which is Figure 2 a schematic cross-sectional structure diagram of the thirteenth embodiment of the magnetic component shown in Figure 22 As shown in Figure 20E , the substrate 3 of the magnetic component 1m in this embodiment is similar to Figures 20A to 20E the substrate 3 of the magnetic component 1k shown in

[0282] Please refer to Figures 23A to 23F , which is Figure 2 a schematic cross-sectional structure diagram of the manufacturing method of the fourteenth embodiment of the substrate of the magnetic component shown in Figure 23A As shown in

[0283] Next, as shown in Figure 23BAs shown, a fourth horizontal copper foil 37b is formed on the base 30a, and the fourth horizontal copper foil 37b and the third horizontal copper foil 37a are located on opposite sides of the first accommodating space 31. In addition, the base 30a further has a plurality of first through holes 30d, each of the first through holes 30d penetrating through the top plate 30c and the base 30a and being located between the third horizontal copper foil 37a and the fourth horizontal copper foil 37b. A third connecting copper foil 37c and a fourth connecting copper foil 37d are formed in the corresponding first through holes 30d to penetrate through the top plate 30c and the base 30a, wherein two ends of the third connecting copper foil 37c are respectively connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, two ends of the fourth connecting copper foil 37d are respectively connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b, and the third horizontal copper foil 37a, the fourth horizontal copper foil 37b, the third connecting copper foil 37c and the fourth connecting copper foil 37d constitute a second metal layer 37. Then, as Figure 23C shown, etching holes 37g are formed on the third horizontal copper foil 37a and the fourth horizontal copper foil 37b through a metallization process.

[0284] Then, as Figure 23DAs shown, a third insulating material 38e is formed on the third horizontal copper foil 37a, and a fourth insulating material 38f is formed on the fourth horizontal copper foil 37b. Then, a plurality of third through-holes 63a and a plurality of fourth through-holes 63b are formed. Each third through-hole 63a penetrates through the third insulating material 38e and the top plate 30c, and each fourth through-hole 63b penetrates through the fourth insulating material 38f and the base 30a. Then, the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are formed on the inner wall of the first accommodating space 31 via the plurality of third through-holes 63a and the plurality of fourth through-holes 63b. The two ends of the first horizontal copper foil 34a are respectively connected to one end of the first connecting copper foil 34c and one end of the second connecting copper foil 34d. The two ends of the second horizontal copper foil 34b are respectively connected to the other end of the first connecting copper foil 34c and the other end of the second connecting copper foil 34d. And the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d constitute the first metal layer 34. Part of the inner wall of the first accommodating space 31 is protected by an anti-corrosion plating layer 61a and is not plated with the first metal layer 34. And in this step, a fifth horizontal copper foil 38a is formed on the third insulating material 38e, a sixth horizontal copper foil 38b is formed on the fourth insulating material 38f, and a fifth connecting copper foil 38c and a sixth connecting copper foil 38d are formed. The fifth connecting copper foil 38c is connected between one side of the fifth horizontal copper foil 38a and one side of the sixth horizontal copper foil 38b. The sixth connecting copper foil 38d is connected between the other side of the fifth horizontal copper foil 38a and the other side of the sixth horizontal copper foil 38b. And the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, and the sixth connecting copper foil 38d constitute the third metal layer 38. Then, as Figure 23E shown, etching holes 38g are formed on the fifth horizontal copper foil 38a and the sixth horizontal copper foil 38b through a metallization process. Then, as Figure 23F shown, the first magnetic post 21 is disposed in the first accommodating space 31 of the substrate 3 to constitute a part of the magnetic component 1n. In this embodiment, the first metal layer 34 is disposed on the four side surfaces of the inner wall of the first accommodating space 31.

[0285] As can be seen from the above, the magnetic component 1n of this embodiment forms the first metal layer 34 and the third metal layer 38 simultaneously only through one electroplating, and both the manufacturing time and the manufacturing cost are significantly reduced. In some embodiments, when the thickness of the copper layer needs to meet certain requirements, the substrate 3 shown in Figures 23A to 23F can be combined with Figure 19A to pre-form the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d on the inner wall to achieve a certain copper thickness. After subsequent metallization processes, the copper foil at this position will be further thickened to meet the current-carrying requirements.

[0286] Please refer to Figure 24 , which is Figure 2 a schematic cross-sectional structure diagram of the fifteenth embodiment of the substrate of the magnetic component shown in. As Figure 24 shown, the substrate 3 of the magnetic component 1o in this embodiment includes a first metal layer 81 and a second metal layer 82. The first metal layer 81 in this embodiment includes a third connecting copper foil 81c, a fourth connecting copper foil 81d, a third horizontal copper foil 81a, and a fourth horizontal copper foil 81b. The third connecting copper foil 81c, the fourth connecting copper foil 81d, the third horizontal copper foil 81a, and the fourth horizontal copper foil 81b of the first metal layer 81 in this embodiment are respectively similar to Figure 19F the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a, and the fourth horizontal copper foil 37b of the second metal layer 37 of the magnetic component 1j shown in, so they will not be elaborated here. The second metal layer 82 in this embodiment includes a fifth horizontal copper foil 82a, a sixth horizontal copper foil 82b, a fifth connecting copper foil 82c, and a sixth connecting copper foil 82d, which are respectively similar to Figure 19F the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, and the sixth connecting copper foil 38d of the third metal layer 38 of the magnetic component 1j shown in, so they will not be elaborated here. In addition, the magnetic component 1o in this embodiment further includes a fourth metal layer 83. The fourth metal layer 83 is attached to the first magnetic post 21, and the fourth metal layer 83 includes an eighth horizontal copper foil 83a, a ninth horizontal copper foil 83b, an eighth connecting copper foil 83c, and a ninth connecting copper foil 83d. The eighth horizontal copper foil 83a and the ninth horizontal copper foil 83b are located on opposite sides of the first magnetic post 21, and the eighth connecting copper foil 83c and the ninth connecting copper foil 83d are located on the other opposite sides of the first magnetic post 21. Among them, the eighth connecting copper foil 83c is connected between one side of the eighth horizontal copper foil 83a and one side of the ninth horizontal copper foil 83b, and the ninth connecting copper foil 83d is connected between the other side of the eighth horizontal copper foil 83a and the other side of the ninth horizontal copper foil 83b. It should be noted that the fourth metal layer 83 only partially adheres to the first magnetic post 21. It can be seen from the figure that there is a gap between the two segments of the fifth horizontal copper foil 83a.

[0287] For the magnetic components 1 to 1n in the above embodiments, the magnetic post can be a bare magnetic post, or a fourth insulating layer can be formed on the surface of the magnetic post. For example, the fourth insulating layer can be formed on the surface of the magnetic post by spraying, dipping, electrophoresis, electrostatic spraying, chemical vapor deposition, physical vapor deposition, sputtering, evaporation plating, or printing. The fourth insulating layer can play a good insulating role and meet the electrical insulation requirements. It should be further specified that the fourth insulating layer can completely cover the magnetic post or partially cover the magnetic post. As Figure 5As shown, the magnetic core in the magnetic component is formed by connecting the first magnetic column, the third magnetic column, the second magnetic column, and the fourth magnetic column end to end. In order to obtain the required inductance value, an insulating glue with glass beads needs to be set at the overlapping surfaces of the first magnetic column and the third magnetic column, and the first magnetic column and the fourth magnetic column. The required inductance value is achieved by adjusting the size of the glass beads. Therefore, instead of setting a fourth insulating layer at the overlapping surface of the magnetic columns, an insulating glue with glass beads can be set.

[0288] In the magnetic component 1o of this embodiment, the fourth metal layer 83 is attached to the first magnetic column 21, and no additional metal parts are required to connect with other metal layers, such as the transition horizontal part. If there is an insulation requirement between the fourth metal layer 83 and the first magnetic column 21, an extremely thin insulating layer (not shown) can be set between them. For example, the insulating layer can be formed on the surface of the magnetic column by spraying, dipping, electrophoresis, electrostatic spraying, chemical vapor deposition, physical vapor deposition, sputtering, evaporation plating, or printing. The thickness of the insulating layer can be controlled within 20um. Therefore, the width of the fourth metal layer 83 of the magnetic component 1o in this embodiment is shorter and the height is smaller. As a result, the size of the overall magnetic component 1o is further reduced, so the power density of the magnetic component 1o can be improved. If the size of the magnetic component 1o is fixed, the optimized size can be transferred to the magnetic core, which increases the size of the magnetic core and effectively reduces the loss of the magnetic core, thereby improving the efficiency of the magnetic component 1o.

[0289] It should be specifically pointed out that all the above features can be achieved through combinations between different embodiments, thereby realizing a smaller module size and further improving the power density of the module.

[0290] Please refer to Figure 25 which is a schematic circuit diagram of the power module to which the magnetic component shown in the present invention Figure 2 is applied. The following will be demonstrated by Figure 8GThe magnetic component 1 shown is used as an example for a power module. Of course, magnetic components of other embodiments can also be applied to the power module, which will not be elaborated here. As shown in the figure, the power module 7 of this embodiment is connected between an input terminal (including a positive input terminal Vin+ and a negative input terminal Vin-) and an output terminal (including a positive output terminal Vo+ and a negative output terminal Vo-), and the power module 7 includes a magnetic component and electronic components. The magnetic component includes a primary winding P, a first secondary winding S1, and a second secondary winding S2, and the electronic components include two power switches SR1, SR2, and a capacitor C. The first end P1 and the second end P2 of the primary winding P are respectively connected to the positive input terminal Vin+ and the negative input terminal Vin-. The first end D1 of the first secondary winding S1 is connected to the first end A1 of the power switch SR1, and the second end of the first secondary winding S1 is connected to the first end of the second secondary winding S2 to form a common terminal M. The second end D2 of the second secondary winding S2 is connected to the first end B1 of the power switch SR2, and the common terminal M is connected to the positive output terminal Vo+. The second end A2 of the power switch SR1 and the second end B2 of the power switch SR2 are connected and connected to the negative output terminal Vo-. The capacitor C is connected between the positive output terminal Vo+ and the negative output terminal Vo-. In some embodiments, the first secondary winding S1 can be formed by the first metal layer 34 of the magnetic component 1, the second secondary winding S2 can be formed by the second metal layer 37 of the magnetic component 1, and the primary winding P can be formed by the third metal layer 38 of the magnetic component 1. In other embodiments, the primary winding P, the first secondary winding S1, and the second secondary winding S2 are respectively formed by the first metal layer 34, the second metal layer 37, and the third metal layer 38 of the magnetic component 1 with different compositions.

[0291] Please refer to Figure 26 、 27A and 27B in conjunction with Figure 25 where Figure 26 is Figure 8G the top view of the structure of the magnetic component shown, Figure 27A is Figure 26 the schematic diagram of the composition of the primary winding and secondary windings of the magnetic component shown, Figure 27B is Figure 26 the schematic diagram of the composition of the primary winding and secondary windings of the magnetic component from another perspective shown. As Figure 26 shown, the upper surface 11 of the magnetic component 1 includes a first surface-mounted pin D1a, a third surface-mounted pin A2a, a fifth surface-mounted pin D2a, a sixth surface-mounted pin B2a, a seventh surface-mounted pin P1a, and an eighth surface-mounted pin P2a. The first surface-mounted pin D1a is used to form Figure 25 the first end D1 of the first secondary winding S1 and the first end A1 of the power switch SR1 in Figure 25The second terminal A2 of the power switch SR1 in [[ID= The second terminal D2 of the second secondary winding S2 in ​ The second terminal B2 of the power switch SR2 in ​ The first terminal P1 and the second terminal P2 of the primary winding P in ​ and 27B shown), where the second surface-mounted pin Va is used to form ​ The positive output terminal Vo+ in ​ The negative output terminal Vo- in

[0292] As ​ shown, a part of the first metal layer (such as ​ the solid part of the first metal layer 34 in ​ ) and a part of the third metal layer (such as ​ shown, another part of the first metal layer (such as ​ the solid part of the first metal layer 34 in ​ ) and another part of the third metal layer (such as ​ and ​ The second metal layer 37 in Figure 26The primary winding P in the circuit is connected to the seventh surface-mount pin P1a and the eighth surface-mount pin P2a respectively by the second metal layer 37. The first secondary winding S1 and the second secondary winding S2 are arranged in a staggered manner to improve the symmetry between the first secondary winding S1 and the second secondary winding S2, so that the current balancing effect of the current flowing through the power switches SR1 and SR2 during operation of the circuit is significantly improved.

[0293] See also Figure 28 And cooperate Figure 25 , 26 , 27A and 27B, of which Figure 28 For the present invention Figure 25 The cross-sectional structure diagram of the first embodiment of the power module shown in FIG. The magnetic component of the power module 7 in this embodiment is composed of Figure 8G The magnetic component 1 is taken as an example. Of course, other magnetic components can also be used to form a power module in the same way. In addition to the magnetic component 1, the power module 7 of this embodiment also includes a circuit board 71, a primary device 72, a secondary device 73 and power switches SR1 and SR2, wherein the primary device 72 and the secondary device 73 are both passive devices. The circuit board 71 is arranged on the magnetic component 1. The primary device 72, the secondary device 73 and the power switches SR1 and SR2 are arranged on the circuit board 71. One end of the power switch SR1 is electrically connected to the first surface-mount pin D1a via the circuit board 71, one end of the power switch SR2 is electrically connected to the fifth surface-mount pin D2a via the circuit board 71, and the other end of the power switch SR1 is electrically connected to the other end of the power switch SR2 via the circuit board 71. The present invention is not limited to the above description, and the number of power switches can be equivalent by connecting multiple power switches in parallel according to their power levels. In some embodiments, the power module 7 may not have the circuit board 71, and the primary device 72 and the secondary device 73 may be directly disposed in the first accommodation space 31, such as Figure 29 As shown, a shorter current loop can be achieved.

[0294] It should be noted that the above power module is not limited to the LLC converter, but is also applicable to any circuit containing a transformer module, such as a flyback converter, a full-bridge circuit, etc. Furthermore, the power switch and multiple output ends of the magnetic component are directly connected, and the connection loss is small; the primary and secondary loops of the magnetic component are directly coupled together, the winding AC impedance is small, and the AC loss is small, but the present invention is not limited to this.

[0295] In summary, the first magnetic post and the second magnetic post of the magnetic component of the present invention are respectively disposed in the first accommodation space and the second accommodation space of the substrate 3. For the three-layer winding structure corresponding to any magnetic post, the distance between each layer of winding and the magnetic post is approximately equal, so that the current sharing effect of the magnetic core component of the magnetic component of the present invention is better, and the overall magnetic loss of the magnetic component is lower. In addition, since the first magnetic post and the second magnetic post of the magnetic component of the present invention are independently disposed, and the first magnetic post and the second magnetic post are respectively disposed in the first accommodation space and the second accommodation space of the substrate, therefore, the first magnetic post and the second magnetic post can be polished separately, and since the first magnetic post and the second magnetic post are respectively limited in the substrate by the first accommodation space and the second accommodation space, and there is no mutual influence between the first magnetic post and the second magnetic post, so the first magnetic post and the second magnetic post only need to be polished separately to satisfy the assembly relationship with the corresponding first accommodation space and second accommodation space, and the position accuracy of the first magnetic post has nothing to do with the position accuracy of the second magnetic post, and the position accuracy between the first magnetic post and the second magnetic post is completely determined by the position accuracy between the first accommodation space and the second accommodation space, so that the dimensional accuracy of the magnetic core component of the magnetic component of the present invention is very high, thereby making the loss of the magnetic component of the present invention lower, and making the overall size of the magnetic component smaller.

Claims

1. A magnetic component, comprising: A magnetic core component, comprising a first magnetic column and a second magnetic column, wherein the first magnetic column and the second magnetic column are independently arranged, and the magnetic core component further comprises a third magnetic column and a fourth magnetic column, wherein the first magnetic column and the second magnetic column are both located between the third magnetic column and the fourth magnetic column, two ends of the third magnetic column are respectively connected to one end of the first magnetic column and one end of the second magnetic column, and two ends of the fourth magnetic column are respectively connected to the other end of the first magnetic column and the other end of the second magnetic column; and A winding component, comprising a first winding, and the first winding is wound around the first magnetic column; Among them, The first winding is formed by at least part of a substrate, the substrate comprises a first accommodation space, a second accommodation space and a first metal layer, at least part of the first winding is formed by at least part of the first metal layer, at least part of the first magnetic column and at least part of the second magnetic column are respectively arranged in the first accommodation space and the second accommodation space, the substrate is of an integrally formed structure, and the substrate further comprises a first opening and a second opening, the first opening and the second opening are respectively located on a first side and a second side of the substrate, the first accommodation space and the second accommodation space are located between the first opening and the second opening, and the first opening is respectively communicated with the first accommodation space and the second accommodation space, the second opening is respectively communicated with the first accommodation space and the second accommodation space, at least part of the third magnetic column is arranged in the first opening, and at least part of the fourth magnetic column is arranged in the second opening.

2. The magnetic component according to claim 1, wherein the third magnetic column and the fourth magnetic column are arranged outside the substrate.

3. The magnetic component according to claim 1, wherein the first magnetic column, the second magnetic column, the third magnetic column and the fourth magnetic column are independently arranged from each other.

4. The magnetic component according to claim 1, wherein the first magnetic column and the third magnetic column are of an integrally formed structure, and the second magnetic column and the fourth magnetic column are of an integrally formed structure.

5. The magnetic component according to claim 1, wherein the substrate further comprises a first opening, the first opening is located on a first side of the substrate, the first opening is respectively communicated with the first accommodation space and the second accommodation space, at least part of the third magnetic column is arranged in the first opening, and the fourth magnetic column is embedded on the second side of the substrate.

6. The magnetic component according to claim 1, wherein the substrate comprises a first horizontal wiring layer and a second horizontal wiring layer, the first horizontal wiring layer and the second horizontal wiring layer are respectively located on opposite sides of the first magnetic column, the first metal layer comprises a first horizontal copper foil, a second horizontal copper foil, a first connecting copper foil and a second connecting copper foil, the first horizontal copper foil, the first connecting copper foil, the second horizontal copper foil and the second connecting copper foil are connected and surround the first magnetic column, wherein the first connecting copper foil and the second connecting copper foil are both located between the first horizontal copper foil and the second horizontal copper foil, and the first horizontal copper foil is located on the first horizontal wiring layer, and the second horizontal copper foil is located on the second horizontal wiring layer.

7. The magnetic component as claimed in claim 6, wherein at least part of the first metal layer is disposed on the inner wall of the first accommodating space.

8. The magnetic component as claimed in claim 7, wherein the first metal layer is completely disposed on the inner wall of the first accommodating space.

9. The magnetic component as claimed in claim 6, wherein the substrate further comprises a seventh horizontal wiring layer located between the first horizontal wiring layer and the second horizontal wiring layer. The first metal layer further comprises two first transitional horizontal portions located on the seventh horizontal wiring layer and respectively on opposite sides of the first magnetic post. The two first transitional horizontal portions are respectively connected to two ends of the first horizontal copper foil through a conductive post, and are respectively connected to the first connection copper foil and the second connection copper foil.

10. The magnetic component as claimed in claim 6, wherein the first winding is entirely constituted by the first metal layer.

11. The magnetic component as claimed in claim 6, wherein the substrate comprises a third horizontal wiring layer, a fourth horizontal wiring layer and a second metal layer. The third horizontal wiring layer and the fourth horizontal wiring layer are respectively on opposite sides of the first magnetic post, and the third horizontal wiring layer is outside the first horizontal wiring layer, and the fourth horizontal wiring layer is outside the second horizontal wiring layer. The second metal layer comprises a third horizontal copper foil, a fourth horizontal copper foil, a third connection copper foil and a fourth connection copper foil. The third horizontal copper foil, the third connection copper foil, the fourth horizontal copper foil and the fourth connection copper foil are connected and surround the first magnetic post. The third connection copper foil and the fourth connection copper foil are both between the third horizontal copper foil and the fourth horizontal copper foil, and the second metal layer is outside the first metal layer. The third horizontal copper foil is located on the third horizontal wiring layer, and the fourth horizontal copper foil is located on the fourth horizontal wiring layer.

12. The magnetic component as claimed in claim 11, wherein the magnetic component further comprises a second winding wound around the first magnetic post. The first winding is constituted by the first metal layer, and the second winding is constituted by the second metal layer.

13. The magnetic component as claimed in claim 11, wherein the magnetic component further comprises a second winding wound around the first magnetic post. The first winding is constituted by at least part of the first metal layer and at least part of the second metal layer, and the second winding is constituted by at least part of the first metal layer and at least part of the second metal layer.

14. The magnetic component as described in claim 11, wherein the substrate includes a fifth horizontal wiring layer, a sixth horizontal wiring layer, and a third metal layer. The fifth horizontal wiring layer and the sixth horizontal wiring layer are respectively located on opposite sides of the first magnetic post, and the fifth horizontal wiring layer is located outside the third horizontal wiring layer, and the sixth horizontal wiring layer is located outside the fourth horizontal wiring layer. The third metal layer includes a fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil, and a sixth connecting copper foil. The fifth horizontal copper foil, the fifth connecting copper foil, the sixth horizontal copper foil, and the sixth connecting copper foil are connected and surround the first magnetic post. Among them, the fifth connecting copper foil and the sixth connecting copper foil are both located between the fifth horizontal copper foil and the sixth horizontal copper foil, and the third metal layer is located outside the second metal layer. The fifth horizontal copper foil is located in the fifth horizontal wiring layer, and the sixth horizontal copper foil is located in the sixth horizontal wiring layer.

15. The magnetic component as described in claim 14, wherein the substrate further includes a seventh horizontal wiring layer, and the third metal layer further includes two second transitional horizontal portions, two third transitional horizontal portions, two fourth transitional horizontal portions, two fifth transitional horizontal portions, and two sixth transitional horizontal portions. The two second transitional horizontal portions are located in the seventh horizontal wiring layer and are respectively located on opposite sides of the first magnetic post. The two third transitional horizontal portions are located in the first horizontal wiring layer and are respectively located on opposite sides of the first magnetic post. The two fourth transitional horizontal portions are located in the third horizontal wiring layer and are respectively located on opposite sides of the first magnetic post. The two fifth transitional horizontal portions are located in the fourth horizontal wiring layer and are respectively located on opposite sides of the first magnetic post. One of the two second transitional horizontal portions, one of the two third transitional horizontal portions, one of the two fourth transitional horizontal portions, and one end of the fifth horizontal copper foil are connected by a first conductive portion. One of the two fifth transitional horizontal portions and the sixth horizontal copper foil are connected by a second conductive portion. One of the two second transitional horizontal portions and one of the two fifth transitional horizontal portions are respectively connected to both ends of the fifth connecting copper foil. The other of the two second transitional horizontal portions, the other of the two third transitional horizontal portions, the other of the two fourth transitional horizontal portions, and the other end of the fifth horizontal copper foil are connected by a third conductive portion. The other of the two fifth transitional horizontal portions and the sixth horizontal copper foil are connected by a fourth conductive portion. The other of the two second transitional horizontal portions and the other of the two fifth transitional horizontal portions are respectively connected to both ends of the sixth connecting copper foil.

16. The magnetic component as described in claim 14, wherein the magnetic component further includes a second winding and a third winding. The second winding and the third winding are both wound around the first magnetic post. The first winding is formed by the first metal layer, the second winding is formed by the first metal layer, and the third winding is formed by the third metal layer.

17. The magnetic component as claimed in claim 14, wherein the magnetic component further comprises a second winding and a third winding, the second winding and the third winding are both wound around the first magnetic post, the second winding is formed by the second metal layer, the first winding is formed by at least part of the first metal layer and at least part of the third metal layer, the first windings are connected by a conductive post, the third winding is formed by another part of the first metal layer and another part of the third metal layer, and the third windings are connected by a conductive post.

18. The magnetic component as claimed in claim 7, wherein the part of the first metal layer located on the inner wall of the first accommodation space is arranged in sections.

19. The magnetic component as claimed in claim 18, wherein an anti-oxidation coating is provided between at least two sections of the first metal layer.

20. The magnetic component as claimed in claim 1, wherein the edge of the first magnetic post has a chamfer, and the chamfer is adjacent to a corner of the first metal layer.

21. The magnetic component as claimed in claim 1, wherein the magnetic component further comprises a circuit board and at least one power switch, the power switch is arranged on the circuit board, and the power switch is electrically connected to the first winding.

22. The magnetic component as claimed in claim 1, wherein the magnetic component further comprises at least one passive device, and the passive device is arranged in the first accommodation space or the second accommodation space.

23. The magnetic component as claimed in claim 1, wherein the magnetic component further comprises a fourth metal layer, and the fourth metal layer is attached to part of the first magnetic post.

24. The magnetic component as claimed in claim 1, wherein the magnetic component further comprises a fourth insulating layer, and the fourth insulating layer is attached to the first magnetic post.

25. A manufacturing method of a magnetic component, comprising the following steps: (a) Providing a substrate, the substrate is an integrally formed structure and at least part of the substrate constitutes a winding assembly of the magnetic component, the substrate comprises a first accommodation space, a second accommodation space and a first metal layer, wherein at least part of the first metal layer constitutes at least part of a first winding of the winding assembly, wherein the substrate further comprises a first opening and a second opening, the first opening and the second opening are respectively located on a first side and a second side of the substrate, the first accommodation space and the second accommodation space are located between the first opening and the second opening, and the first opening is respectively communicated with the first accommodation space and the second accommodation space, and the second opening is respectively communicated with the first accommodation space and the second accommodation space; and (b) Provide a magnetic core assembly, which includes a first magnetic column and a second magnetic column. The first magnetic column and the second magnetic column are independently arranged. At least part of the first magnetic column and at least part of the second magnetic column are respectively arranged in the first accommodation space and the second accommodation space. The first winding is wound around the first magnetic column. The magnetic core assembly further includes a third magnetic column and a fourth magnetic column. The first magnetic column and the second magnetic column are both located between the third magnetic column and the fourth magnetic column. Two ends of the third magnetic column are respectively connected to one end of the first magnetic column and one end of the second magnetic column. Two ends of the fourth magnetic column are respectively connected to the other end of the first magnetic column and the other end of the second magnetic column. At least part of the third magnetic column is arranged in the first opening, and at least part of the fourth magnetic column is arranged in the second opening.

26. The manufacturing method according to claim 25, wherein the following steps are included before step (a): (c1) Provide a base, which has a groove; (c2) Form a first connecting copper foil, a second connecting copper foil and a second horizontal copper foil on the inner wall of the groove. Two ends of the second horizontal copper foil are respectively connected to one end of the first connecting copper foil and one end of the second connecting copper foil; (c3) Form two first transition horizontal parts outside the groove. One of the two first transition horizontal parts is connected to the other end of the first connecting copper foil, and the other of the two first transition horizontal parts is connected to the other end of the second connecting copper foil; (c4) Provide a top plate on the base to cover the groove. The base and the top plate jointly define the first accommodation space. The two first transition horizontal parts are located between the top plate and the base; (c5) Form a first horizontal copper foil on the top plate. Two ends of the first horizontal copper foil are respectively connected to the corresponding first transition horizontal parts through a conductive column. The first connecting copper foil, the second connecting copper foil, the second horizontal copper foil, the two first transition horizontal parts, the first horizontal copper foil and the conductive column constitute the first metal layer; (c6) Form a third horizontal copper foil on the top plate and form a fourth horizontal copper foil on the base. The third horizontal copper foil and the fourth horizontal copper foil are located on opposite sides of the first accommodation space; (c7) Form a third connecting copper foil and a fourth connecting copper foil and respectively penetrate the base. The third connecting copper foil is connected between one end of the third horizontal copper foil and one end of the fourth horizontal copper foil. The fourth connecting copper foil is connected between the other end of the third horizontal copper foil and the other end of the fourth horizontal copper foil. The third horizontal copper foil, the fourth horizontal copper foil, the third connecting copper foil and the fourth connecting copper foil constitute a second metal layer; and (c8) Form a fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil and a sixth connecting copper foil outside the second metal layer, wherein the fifth connecting copper foil is connected between one end of the fifth horizontal copper foil and one end of the sixth horizontal copper foil, the sixth connecting copper foil is connected between the other end of the fifth horizontal copper foil and the other end of the sixth horizontal copper foil, and the fifth horizontal copper foil, the sixth horizontal copper foil, the fifth connecting copper foil and the sixth connecting copper foil constitute a third metal layer, wherein the first metal layer, the second metal layer, the third metal layer, the base and the top plate constitute the substrate.

27. The manufacturing method according to claim 25, wherein the following steps are included before step (a): (c1) Provide a base having a groove; (c2) Provide a top plate on the base to cover the groove, wherein the base and the top plate jointly define the first accommodating space; (c3) Form a first horizontal copper foil on the top plate and form a second horizontal copper foil on the base, wherein the first horizontal copper foil and the second horizontal copper foil are located on opposite sides of the first accommodating space; and (c3) Form a first connecting copper foil and a second connecting copper foil and respectively penetrate the base, wherein the first connecting copper foil is connected between one end of the first horizontal copper foil and one end of the second horizontal copper foil, the second connecting copper foil is connected between the other end of the first horizontal copper foil and the other end of the second horizontal copper foil, and the first connecting copper foil, the second connecting copper foil, the first horizontal copper foil and the second horizontal copper foil constitute the first metal layer; (c4) Form a third horizontal copper foil on the top plate and form a fourth horizontal copper foil on the base, wherein the third horizontal copper foil and the fourth horizontal copper foil are located on opposite sides of the first accommodating space; (c5) Form a third connecting copper foil and a fourth connecting copper foil and respectively penetrate the base, wherein the third connecting copper foil is connected between one end of the third horizontal copper foil and one end of the fourth horizontal copper foil, the fourth connecting copper foil is connected between the other end of the third horizontal copper foil and the other end of the fourth horizontal copper foil, and the third horizontal copper foil, the fourth horizontal copper foil, the third connecting copper foil and the fourth connecting copper foil constitute a second metal layer; and (c6) Form a fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil and a sixth connecting copper foil outside the second metal layer to cover the second metal layer, wherein the fifth connecting copper foil is connected between one end of the fifth horizontal copper foil and one end of the sixth horizontal copper foil, the sixth connecting copper foil is connected between the other end of the fifth horizontal copper foil and the other end of the sixth horizontal copper foil, and the fifth horizontal copper foil, the sixth horizontal copper foil, the fifth connecting copper foil and the sixth connecting copper foil constitute a third metal layer, wherein the first metal layer, the second metal layer, the third metal layer, the base and the top plate constitute the substrate.

28. The manufacturing method according to claim 25, wherein the substrate comprises a top plate and a base, the base comprises a bottom surface and a plurality of side walls, the plurality of side walls at least comprises a first side wall and a second side wall, the plurality of side walls are located between the top plate and the bottom surface, and the following steps are included before step (a): (c1) Form two first transition horizontal portions, two second transition horizontal portions, a first connection copper foil and a second connection copper foil, wherein one of the two first transition horizontal portions is located between the top plate and the first side wall, the other of the two first transition horizontal portions is located between the top plate and the second side wall, one of the two second transition horizontal portions is located between the bottom surface and the first side wall, the other of the two second transition horizontal portions is located between the bottom surface and the second side wall, the first connection copper foil is located on the inner wall of the first side wall and is connected between one of the two first transition horizontal portions and one of the two second transition horizontal portions, and the second connection copper foil is located on the inner wall of the second side wall and is connected between the other of the two first transition horizontal portions and the other of the two second transition horizontal portions; (c2) Form a first horizontal copper foil and a third horizontal copper foil on two sides of the top plate, wherein the first horizontal copper foil is located between the top plate and the two first transition horizontal portions; (c3) Form a second horizontal copper foil and a fourth horizontal copper foil on two sides of the bottom surface, wherein the second horizontal copper foil is located between the bottom surface and the two second transition horizontal portions, and the first horizontal copper foil, the second horizontal copper foil, the first transition horizontal portion, the second transition horizontal portion, the first connection copper foil and the second connection copper foil constitute the first metal layer; (c4) Form a plurality of through holes, a plurality of first blind holes and a plurality of second blind holes, wherein each through hole is connected between the third horizontal copper foil and the fourth horizontal copper foil, each first blind hole is connected between the third horizontal copper foil, the first horizontal copper foil and the corresponding first transition horizontal portion, and each second blind hole is connected between the fourth horizontal copper foil, the second horizontal copper foil and the corresponding second transition horizontal portion; (c5) Form a plurality of first conductive posts, a plurality of second conductive posts and a plurality of third conductive posts, wherein each first conductive post is disposed in the corresponding through hole, each second conductive post is disposed in the corresponding first blind hole, and each third conductive post is disposed in the corresponding second blind hole; (c6) Use a back drilling process to remove part of the plurality of second conductive posts and form a plurality of first back drill holes, and remove part of the plurality of third conductive posts and form a plurality of second back drill holes, wherein the plurality of first back drill holes are used to disconnect the electrical connection between the third horizontal copper foil and the first horizontal copper foil, the plurality of second back drill holes are used to disconnect the electrical connection between the fourth horizontal copper foil and the second horizontal copper foil, and the third horizontal copper foil, the fourth horizontal copper foil and the first conductive posts in the plurality of through holes constitute a second metal layer; and (c7) Form a fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil, and a sixth connecting copper foil outside the second metal layer, wherein the fifth connecting copper foil is connected between one end of the fifth horizontal copper foil and one end of the sixth horizontal copper foil, the sixth connecting copper foil is connected between the other end of the fifth horizontal copper foil and the other end of the sixth horizontal copper foil, and the fifth horizontal copper foil, the sixth horizontal copper foil, the fifth connecting copper foil, and the sixth connecting copper foil constitute a third metal layer, wherein the first metal layer, the second metal layer, the third metal layer, the base, and the top plate constitute the substrate.

29. The manufacturing method according to claim 25, wherein the following steps are included before step (a): (c1) Provide a base having a groove, and form a second horizontal copper foil, a first connecting copper foil, and a second connecting copper foil in the groove; (c2) Provide a top plate, form a third horizontal copper foil on a first side of the top plate, form an anti-corrosion coating and a first horizontal copper foil on a second side of the top plate, and dispose the top plate on the base to cover the groove, wherein the base and the top plate jointly define the first accommodation space, the first horizontal copper foil, the second horizontal copper foil, the first connecting copper foil, the second connecting copper foil, and the anti-corrosion coating are located in the first accommodation space, and there is a first gap between a part of the first horizontal copper foil and the first connecting copper foil, and there is also a second gap between another part of the first horizontal copper foil and the second connecting copper foil; (c3) Form a fourth horizontal copper foil on the base, wherein the third horizontal copper foil and the fourth horizontal copper foil are located on opposite sides of the first accommodation space, and form a third connecting copper foil and a fourth connecting copper foil and respectively penetrate through the base, wherein the third connecting copper foil is connected between one end of the third horizontal copper foil and one end of the fourth horizontal copper foil, the fourth connecting copper foil is connected between the other end of the third horizontal copper foil and the other end of the fourth horizontal copper foil, and the third horizontal copper foil, the fourth horizontal copper foil, the third connecting copper foil, and the fourth connecting copper foil constitute a second metal layer; (c4) Fill the first gap and the second gap with copper foil so that the first horizontal copper foil is connected to the first connecting copper foil and the first horizontal copper foil is connected to the second connecting copper foil, wherein the first connecting copper foil, the second connecting copper foil, the first horizontal copper foil, and the second horizontal copper foil constitute the first metal layer; and (c5) Form a fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil, and a sixth connecting copper foil outside the second metal layer to cover the second metal layer, wherein the fifth connecting copper foil is connected between one end of the fifth horizontal copper foil and one end of the sixth horizontal copper foil, the sixth connecting copper foil is connected between the other end of the fifth horizontal copper foil and the other end of the sixth horizontal copper foil, and the fifth horizontal copper foil, the sixth horizontal copper foil, the fifth connecting copper foil, and the sixth connecting copper foil constitute a third metal layer, wherein the first metal layer, the second metal layer, the third metal layer, the base, and the top plate constitute the substrate.

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