Resin sealing device and resin sealing method

Abstract

The present invention provides a resin sealing device, a resin supply and conveying fixture, and a resin sealing method. The resin sealing device includes: an outer frame fixture (3) having a first through hole (3b) and adsorbing and holding a monolithic film (2d) such that it covers the lower part of the first through hole (3b); an inner frame fixture (4) having a second through hole (4b) and mounted on the inner peripheral surface of the first through hole (3b) of the outer frame fixture (3); a resin supply section (D) for supplying particulate resin (R) to the monolithic film (2d) from the inside of the inner frame fixture (4) mounted on the outer frame fixture (3); a first transfer mechanism (9) for loading and unloading the inner frame fixture (4) from the inside of the outer frame fixture (3); and a conveying mechanism (7) for holding the outer frame fixture (3) after the inner frame fixture (4) has been unloaded and conveying the particulate resin (R) on the monolithic film (2d) from the resin supply section (D) to the sealing mold (2).

Description

Technical Field

[0001] This invention relates to a resin sealing device, a resin supply and conveying fixture, and a resin sealing method, which conveys a single-piece film carrying a workpiece and granular resin to a sealing mold for resin sealing. Background Technology

[0002] A compression molding apparatus for manufacturing resin-sealed electronic components with plate-shaped members such as heat sinks has been proposed. A heat sink and a rectangular frame-shaped tray cover are placed on a release film, and the release film is held by an XY platform and the tray cover. Particulate resin is placed on the portion of the heat sink not covered by the tray cover, so that the particulate resin is surrounded by the tray cover. In this state, the release film, heat sink, particulate resin, and tray cover are held together and transported to a lower mold by a resin handler. The release film is then transferred to the lower mold, and the particulate resin is placed in the lower mold cavity while still on the heat sink. Afterwards, the upper and lower molds holding the workpiece are closed for compression molding. Furthermore, the tray cover is transported to a cleaning platform, cleaned, and reused (see Patent Document 1).

[0003] [Existing technical documents]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2013-187340 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] In the compression molding apparatus shown in Patent Document 1, the material is maintained within the rectangular frame of the tray cover and supported by a heat sink plate. It is then conveyed downward through a resin processor, and the heat sink plate and the release film are transferred together to the recess of the mold cavity.

[0008] When the granular resin is transported to the sealing mold by the resin processor, the granular resin is transported to the lower mold while being supported by the heat sink at the bottom and surrounded by the tray cover. As a result, the softened resin adheres to the inner wall of the tray cover and easily generates resin dirt. Once it adheres, it is difficult to remove during the cleaning process, reducing maintainability.

[0009] [Technical means to solve the problem]

[0010] In view of the above, the object of the present invention is to provide a resin sealing device and resin sealing method that can achieve highly maintainable resin sealing.

[0011] To achieve the stated objective, the present invention includes the following structure.

[0012] A resin sealing device is disclosed, which conveys a monolithic film and a workpiece loaded with granular resin to a sealing mold and performs resin sealing by heating and pressurizing at a specified forming temperature. The resin sealing device is characterized by comprising: an outer frame clamp having a first through hole and adsorbing and holding the monolithic film such that it covers the area below the first through hole; an inner frame clamp having a second through hole and mounted on the inner circumferential surface of the first through hole of the outer frame clamp; a resin supply unit that supplies granular resin to the monolithic film through the second through hole of the inner frame clamp mounted on the outer frame clamp; a first transfer mechanism that loads and unloads the inner frame clamp within the first through hole of the outer frame clamp; and a conveying mechanism that holds the outer frame clamp after the inner frame clamp has been removed and conveys the granular resin supplied to the monolithic film from the resin supply unit to the sealing mold.

[0013] Therefore, the supply area of ​​granular resin supplied to the monolithic film through the inner frame clamp can be set arbitrarily. Moreover, the conveying mechanism keeps the outer frame clamp removed from the inner frame clamp and conveys it from the resin supply section to the sealing mold. As a result, the granular resin will not move and adhere to the inner circumferential surface of the outer frame clamp, which can prevent the formation of resin dirt on the outer frame clamp and improve maintainability.

[0014] Preferably, a heating element is included to heat the granular resin supplied to the monolithic film covering the lower surface of the inner frame clamp. This softens the granular resin supplied to the monolithic film, preventing it from splashing and spreading even when it falls continuously, thereby maintaining the shape of the granular resin within the second through-hole of the inner frame clamp.

[0015] Preferably, the heating element heats the granular resin from below the outer frame clamp through a single-layer membrane. This reduces the installation area and simplifies the device structure compared to a device structure with a separate heating element.

[0016] The heating element preferably heats the granular resin at a predetermined temperature lower than the molding temperature (e.g., a temperature at which thermosetting resins such as epoxy resins do not undergo melting and hardening reactions). This allows the granular resin to soften without affecting the thermal process of the resin supplied to the monolithic film, and maintains its shape within the second through-hole of the inner frame clamp even after the inner frame clamp is removed from the outer frame clamp. Therefore, when the outer frame clamp is transported to the sealing mold using a conveying mechanism, there is no concern about resin powder flying, preventing contamination within the device.

[0017] It may also include a second transfer mechanism that supplies plate-shaped members to the monolithic membrane from the inside of the outer frame clamp after the inner frame clamp has been removed.

[0018] Therefore, when the plate-shaped component is placed on the monolithic membrane before the supply of granular resin, the outer frame clamp can be positioned on the monolithic membrane as a guide for supply.

[0019] The resin supply unit may also include a resin supply platform, which carries the outer frame fixture on which the inner frame fixture is mounted. The resin supply unit scans the resin supply platform along the XY direction while supplying granular resin required for one resin sealing into the frame opening of the inner frame fixture and onto the monolithic film.

[0020] If, as described above, a resin supply platform arranged in the resin supply section is scanned along the XY direction while granular resin is supplied, the device structure can be simplified and designed compactly. Furthermore, the difference in the thermal process accompanying the heating of the granular resin on the resin supply platform will not affect the molding quality, so the supply mode of the granular resin can be freely selected.

[0021] The inner frame clamp is preferably assembled with the concave-convex fitting part provided on the inner periphery of the outer frame clamp, and is reused by circulating the single-piece film supply section, resin supply section and cleaning section.

[0022] The inner frame fixture is assembled with the interlocking parts provided on the inner periphery of the outer frame fixture, so the distribution area of ​​the granular resin can be freely set by adjusting the thickness of the inner frame fixture. In addition, the inner frame fixture acts as a frame to intercept the granular resin supplied to the monolithic film, but even if the granular resin is softened and the surface is solidified by heating to a temperature lower than the molding temperature, the inner frame fixture has little resin contamination, and can be easily cleaned in the cleaning unit.

[0023] Multiple of the aforementioned outer frame clamps can also be used to supply the membrane from the sealing mold to the membrane supply unit that supplies single-piece membranes via the conveying mechanism for reuse.

[0024] Therefore, if multiple outer frame fixtures are used, the work efficiency can be improved by simultaneously supplying granular resin to the sealing mold and to the inner frame fixtures.

[0025] A resin supply and conveying fixture, characterized in that it comprises: an outer frame fixture having a first through hole and adsorbing and holding a monolayer film in a manner covering the area below the first through hole; and an inner frame fixture having a second through hole and mounted on the inner peripheral surface of the first through hole of the outer frame fixture, and supplying particulate resin to the monolayer film within the second through hole of the inner frame fixture mounted on the outer frame fixture.

[0026] Therefore, the supply area of ​​granular resin on the monolithic film can be arbitrarily set by the inner frame clamp installed on the inner circumferential surface of the first through hole of the outer frame clamp.

[0027] In addition, by removing the inner frame fixture from the outer frame fixture for transport, no resin dirt will be generated on the outer frame fixture.

[0028] The first through hole of the outer frame fixture can also be formed to match the shape of the cavity recess of the sealing mold, and the stepped portion carved on the inner periphery of the first through hole is assembled to coincide with the flange portion provided on the outer periphery of the inner frame fixture.

[0029] Therefore, the inner frame fixture can be reliably aligned and overlapped when being loaded and unloaded relative to the outer frame fixture. In addition, the first through hole of the outer frame fixture corresponds to the recess of the mold cavity, making it easy to transfer the single film carrying the granular resin to the molding die.

[0030] A resin sealing method, characterized by comprising: a membrane supply step, supplying a single-piece membrane; a step of overlapping the single-piece membrane to cover the area below a first through-hole of an outer frame clamp; a step of installing an inner frame clamp on the inner circumferential surface of the first through-hole of the outer frame clamp; a step of supplying granular resin into a second through-hole of the inner frame clamp; a step of transferring the outer frame clamp to a sealing mold via a conveying mechanism after removing the inner frame clamp from the outer frame clamp; a step of aligning the granular resin with the cavity recess and transferring the single-piece membrane to the sealing mold for adsorption and retention; and a resin sealing step, using the sealing mold to clamp the workpiece and the single-piece membrane, and heating and hardening the granular resin.

[0031] If the resin sealing method described above is used, the conveying mechanism holds the outer frame clamp with the inner frame clamp removed and conveys it from the resin supply section to the sealing mold. Therefore, the granular resin will not move and adhere to the inner circumferential surface of the outer frame clamp, which can prevent the formation of resin dirt on the outer frame clamp and improve maintainability.

[0032] Preferably, the granular resin supplied to the monolithic film covering the lower surface of the inner frame fixture is heated.

[0033] Therefore, there is no need to worry about resin powder flying during transportation, which is easy to handle and will not generate resin dirt on the outer frame clamp. In addition, it can soften the granular resin supplied to the monolithic membrane, preventing it from splashing and spreading even if the granular resin falls continuously, thereby maintaining the shape of the granular resin in the second through hole of the inner frame clamp.

[0034] Ideally, the granular resin is heated to a first temperature lower than the molding temperature through a monolithic membrane covering the first through-hole of the outer frame fixture.

[0035] Therefore, the granular resin supplied to the monolithic membrane is not softened by the heating process, and even after the inner frame clamp is removed from the outer frame clamp, the shape retention of the granular resin can be maintained within the second through hole of the inner frame clamp. In addition, compared with the device structure that has a separate heating unit, the installation area can be reduced and the device structure can be simplified.

[0036] [The effects of the invention]

[0037] A resin sealing device and resin sealing method that can achieve highly maintainable resin sealing can be provided. Attached Figure Description

[0038] Figure 1 (a)~ Figure 1 (h) is an explanatory diagram showing the process up to the point where the granular resin is supplied to the outer frame fixture.

[0039] Figure 2 (a)~ Figure 2 (e) is an illustration of the process of conveying an outer frame fixture supplied with granular resin to a sealing mold for resin sealing.

[0040] Figure 3 This is a conceptual diagram showing the layout and structure of a resin sealing device.

[0041] Figure 4 It is a plan view of the outer frame fixture and the inner frame fixture.

[0042] [Explanation of Symbols]

[0043] A: Pressing Department

[0044] B: Workpiece Supply Department

[0045] C: Membrane Supply Department

[0046] D: Resin Supply Department

[0047] E: Heat sink supply department

[0048] F: Cleaner Department

[0049] G: Membrane waste box

[0050] W: Workpiece

[0051] 1: Compression forming device

[0052] 2: Sealing mold

[0053] 2a: Upper mold

[0054] 2a1: Upper mold clamping surface

[0055] 2b: Lower mold

[0056] 2c: Recessed part of lower mold cavity

[0057] 2d: monolayer membrane

[0058] 3: Outer frame fixture

[0059] 3a, 4a: Frame

[0060] 3b: First through hole

[0061] 3c: Membrane adsorption pores

[0062] 3d: Step difference part

[0063] 3e: concave part

[0064] 4: Inner frame fixture

[0065] 4b: Second through hole

[0066] 4c: Flange portion

[0067] 5: Resin Supply Platform

[0068] 5a: Heater

[0069] 6: Heat sink

[0070] 7: Moving and transporting organizations

[0071] 8: Resin dispenser

[0072] 8a: Supply nozzle

[0073] 9: Frame Pickup and Placement Mechanism

[0074] 10: Heat sink pickup and placement mechanism. Detailed Implementation

[0075] [Overall Structure]

[0076] The following is for reference Figure 1 (a)~ Figure 1 The embodiments of the present invention will be described in section (h). Figure 3 This is a conceptual diagram of the layout structure of the resin sealing device according to an embodiment of the present invention. The following description describes a compression molding apparatus 1 of the mold cavity type, where the workpiece W is assumed to be mounted on a thin plate-like carrier (e.g., a resin substrate, copper plate, glass plate, resin multilayer substrate, etc.) and resin sealing is performed. Furthermore, in the compression molding apparatus 1, the workpiece W, which serves as the carrier for transferring electronic components, can also be integrated with a heat sink (plate-like member) during resin sealing.

[0077] exist Figure 3In this compression molding apparatus 1, there are: a pressing unit A, a workpiece supply unit B, a membrane supply unit C, a resin supply unit D, a heat sink supply unit E, a cleaner unit F, and a membrane waste box G. These components can be connected as modular units or assembled integrally into the main body of the apparatus. The structure of each component will be described below.

[0078] [Suppression Department A]

[0079] like Figure 2 As shown in (d), the pressing section A includes a sealing mold 2 having an upper mold 2a and a lower mold 2b. In this embodiment, a lower mold cavity recess 2c is formed in the lower mold 2b, and the workpiece W is held in place by the upper mold 2a. After the sealing mold 2 is closed, it is heated to, for example, about 170°C for compression molding. The lower mold 2b may be a movable mold and the upper mold 2a may be a fixed mold, or the lower mold 2b may be a fixed mold and the upper mold 2a may be a movable mold, or both may be movable molds. Furthermore, although the lower mold 2b is depicted as an integral part, it is actually a segmented mold structure. The lower mold cavity recess 2c is configured such that the mold cavity block constituting the bottom of the mold cavity and the clamping member (clamper) surrounding it and constituting the side of the mold cavity can move relative to each other. Thus, the resin can be pressurized by the relative rise of the mold cavity block.

[0080] The sealing mold 2 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism is configured to include: a pair of pressure plates, multiple connecting mechanisms (tie bars or columns) that support the pair of pressure plates, a drive source (e.g., an electric motor) that makes the pressure plates movable (lifted) and a drive transmission mechanism (e.g., a toggle link), etc. (the drive mechanisms are not shown).

[0081] The lower mold clamping surface, including the lower mold cavity recess 2c, of the sealing mold 2 adsorbs and holds the monolithic film 2d (described later). The monolithic film 2d uses a film material with excellent heat resistance, ease of peeling, flexibility, and stretchability, typically around 50 μm in thickness, and is connected in a slender shape. Preferred materials include polytetrafluoroethylene (PTFE), ethylene tetrafluoroethylene (ETFE), polyethylene terephthalate (PET), and fluorinated ethylene propylene (FEP). The monolithic film 2d is supplied from a film roll wound into a slender shape at the film supply section C (described later) by cutting the front end of the film into a strip shape corresponding to the workpiece W to the required dimensions for forming.

[0082] As described later, the monolithic film 2d carrying the granular resin R is aligned with the recess 2c of the lower mold cavity and transferred to the lower mold 2b for adsorption and retention. The sealing mold 2 hardens the granular resin by clamping the workpiece W and the monolithic film 2d and heating and pressurizing it to the molding temperature (e.g., about 170°C: the second temperature).

[0083] [Workpiece Supply Department B]

[0084] Workpiece supply section B is equipped with workpiece supply boxes that hold workpieces W at predetermined intervals. Workpieces W delivered from the workpiece supply boxes are transported to the mold-opening sealed mold 2 by a workpiece loader (not shown), and are held in place by the upper mold clamping surface 2a1 (see reference). Figure 2 (d)

[0085] [Membrane Supply Department C]

[0086] The membrane supply unit C supplies a single-piece membrane 2d, which covers the clamping surface of the lower mold, including the recessed portion 2c of the lower mold cavity. The membrane is drawn from a rolled, elongated roll onto a support platform via a membrane feeding mechanism (not shown), and cut into strips of the required dimensions corresponding to the workpiece W (or mold cavity). An outer frame fixture 3 is then placed on top of the single-piece membrane 2d.

[0087] For example, the outer frame clamp 3 has a first through hole 3b in the rectangular frame 3a. Around the outer periphery of the first through hole 3b in the frame 3a, a plurality of membrane adsorption holes 3c are arranged along the circumferential direction (see reference). Figure 2 (a)). If the outer frame clamp 3 is placed on the monolithic membrane 2d, it adsorbs and holds the monolithic membrane 2d from the membrane adsorption pore 3c in a manner that covers the lower part of the first through hole 3b (refer to). Figure 1 (b)). The outer frame clamp 3 may be a rectangular frame made of aluminum or stainless steel, or a film that is difficult for particulate resin R to adhere to (e.g., a fluoropolymer (PTFE: polytetrafluoroethylene) film) may be formed on its surface. Multiple outer frame clamps 3 may be used, and the film may be recycled from the sealing mold 2 to the film supply section C.

[0088] Additionally, the inner frame clamp 4 is concentrically overlapped and mounted on the inner circumferential surface through the opening of the first through hole 3b of the outer frame clamp 3 (see reference). Figure 1 (b)). In Figure 4In the design, the outer frame clamp 3 is a rectangular frame. A pair of first through holes 3b (rectangular holes) are formed on the frame 3a to match the shape of the lower mold cavity recess 2c of the sealing mold 2. A stepped portion 3d, larger on its lower side than its upper side, is provided on the inner periphery of the pair of first through holes 3b. Furthermore, recesses 3e are formed at multiple locations (e.g., four locations) on the inner periphery of the first through holes 3b, etched towards the outer periphery. These recesses 3e are recessed further outward than the shape of the stepped portion 3d. The outer frame clamp 3 is specifically connected by a conveying mechanism 7 (see below). Figure 2 (a)) transportation.

[0089] Additionally, for example, the inner frame clamp 4 has a second through hole 4b in the rectangular frame 4a (see reference). Figure 1 (c)). In Figure 4 In this design, the inner frame clamp 4 has a frame body 4a mounted on the inner circumferential surface of a pair of first through holes 3b provided in the outer frame clamp 3; these are used in pairs. A flange portion 4c protrudes from the outer circumferential edge of the frame body 4a of the inner frame clamp 4. The second through hole 4b is formed into a rectangular shape smaller than the shape of the lower mold cavity recess 2c. The frame bodies 4a of the pair of inner frame clamps 4 are respectively inserted into the first through holes 3b, and the flange portion 4c is assembled to coincide with the stepped portion 3d. Thus, by fitting the outer shape of the flange portion 4c with the inner shape of the stepped portion 3d, the inner frame clamp 4 and the outer frame clamp 3 are aligned and assembled. The inner frame clamp 4 is specifically designed to... Figure 1 The frame pick and place mechanism (first transfer mechanism) 9 shown in (c) performs the transport (transfer). Specifically, with the flange 4c and the step portion 3d overlapping, the hooks of the frame pick and place mechanism 9 are inserted into the multiple gaps formed between the recess 3e of the outer frame clamp 3 and the outer periphery of the inner frame clamp 4 (see reference). Figure 1 (c) The inner frame clamp 4 is held by the hook, thereby performing the transfer. Furthermore, the transfer method of the inner frame clamp 4 is not limited to the method described above; it can also be performed by adsorption or using other structures for transfer (transfer).

[0090] As described above, the frame 4a is respectively aligned and inserted into the first through hole 3b of the outer frame clamp 3 to supply particulate resin. Thus, the area where the particulate resin is distributed (described later) becomes an area further inward than the inner circumferential surface of the first through hole 3b. By changing the shape or arrangement of the second through hole 4b of the frame 4a of the inner frame clamp 4, the area where the particulate resin R is distributed can be easily set. For example, the through hole 4b can be located at a position offset from the center, rather than being concentric with the first through hole 3b of the outer frame clamp 3. Furthermore, the through hole 4b can be one as described above, or it can be divided into two or three and provided as multiple. In this case, the area where the particulate resin R is distributed can be arbitrarily set by using inner frame clamps 4 with different shapes of through holes 4b. The inner frame clamp 4 also uses a rectangular frame made of aluminum or stainless steel, similar to the outer frame clamp 3, and a coating (e.g., a fluoropolymer (PTFE: polytetrafluoroethylene) coating, which makes it difficult for particulate resin R to adhere, can also be formed on its surface.

[0091] [Resin Supply Department D]

[0092] The resin supply unit D includes a resin dispenser 8, which meteres particulate resin R through a supply nozzle 8a (see reference). Figure 1 (f) The amount of resin required for one resin seal is supplied to the monolithic membrane 2d. A resin supply platform 5 is provided in the resin supply section D. An outer frame clamp 3, on which an inner frame clamp 4 is mounted, is placed on the resin supply platform 5. Particulate resin R required for one resin seal is supplied to the monolithic membrane 2d through the second through hole 4b of the inner frame clamp 4. Furthermore, the particulate resin R referred to here is assumed to be granular resin with a particle size of about 1 mm to several mm, but it can also be powdered resin with smaller particles.

[0093] Additionally, a heating element (heater 5a) is provided in the resin supply platform 5. In this embodiment, the heater 5a is built into the resin supply platform 5. The heater 5a heats the epoxy-based granular resin R from below the outer frame clamp 3 through the monolithic membrane 2d to a predetermined temperature (e.g., about 60°C to 80°C: a first temperature) lower than the molding temperature (e.g., about 170°C). Specifically, the granular resin R is heated from below the platform through the monolithic membrane 2d and the heat sink 6, thereby softening its surface. Thus, even when the granular resin R is fed from the supply nozzle 8a (see reference 8a), the surface remains soft. Figure 1The resin particles (f) fall sequentially onto the single-piece film 2d, preventing them from splashing and spreading. Furthermore, the resin particles R on the heat sink 6 soften due to heating, allowing them to adhere closely together and maintain their shape within the second through-hole 4b of the inner frame clamp 4. Additionally, the built-in heater 5a in the resin supply platform 5 eliminates the need for a separate heating process, improving productivity. Furthermore, preheating the heat sink 6 shortens the heating time in the sealing mold 2, further improving productivity. Moreover, compared to a device structure with a separate heating element, the installation area can be reduced, and the device structure can be simplified. Furthermore, the heating element (heater 5a) is optional and can be omitted.

[0094] In the embodiment described, a heater 5a (e.g., an infrared heater, a sheathed heater, a cartridge heater, etc.) is built into the resin supply platform 5. Alternatively, a heater for heating can be provided on the upper part or around the resin supply platform 5 to heat the granular resin R when the resin supply platform 5 moves along the XY direction.

[0095] In this embodiment, the supply nozzle 8a of the resin dispenser 8 is fixed. With the outer frame clamp 3 holding the monolithic membrane 2d placed on the resin supply platform 5, granular resin R is supplied while scanning the resin supply platform 5 in the XY direction. Granular resin R is also supplied to the inside of the inner frame clamp 4 while scanning the resin supply platform 5 in the XY direction. The inner frame clamp 4 defines the shape of the supply area of ​​granular resin R that intercepts the granular resin R when it is supplied to the monolithic membrane 2d.

[0096] If, as described above, the resin supply platform 5, which is arranged in the resin supply section D, is scanned along the XY direction while supplying granular resin R, the device structure can be made compact. Furthermore, since heating is performed at a predetermined temperature sufficiently lower than the molding temperature of the granular resin R, although the surface of the granular resin R softens, there is no melting of the granular resin R. Even if the granular resin R is supplied in a single stroke, the difference in the thermal process accompanying the heating of the granular resin R on the resin supply platform 5 will not affect the molding quality. Therefore, productivity can be improved by simultaneously supplying and heating the granular resin R. Alternatively, the resin supply platform 5 can be fixed, and the supply nozzle 8a of the resin dispenser 8 can be scanned along the XY direction.

[0097] [Heat Discharge Plate Supply Department E]

[0098] A heat dissipation plate supply section (plate-shaped component supply section) E is provided near the membrane supply section C. The heat dissipation plate is housed in a cassette (not shown). A heat dissipation plate 6, delivered from the cassette, is supplied to the monolithic membrane 2d through the first through-hole 3b of the outer frame clamp 3 (after the inner frame clamp 4 is removed from the membrane supply section C) via a heat dissipation plate pickup and placement mechanism (second transfer mechanism) 10. In the heat dissipation plate pickup and placement mechanism 10, multiple guide pins guiding the shape of the heat dissipation plate 6 and L-shaped handles supporting the lower surface of the heat dissipation plate 6 are arranged within the first through-hole 3b of the outer frame clamp 3. Thus, the heat dissipation plate pickup and placement mechanism 10, with the heat dissipation plate 6 held by the L-shaped handles within the first through-hole 3b of the outer frame clamp 3, moves the heat dissipation plate 6 to the vicinity of the monolithic membrane 2d. Furthermore, by retracting the handles from below the heat dissipation plate 6 to the outside and guiding it using the guide pins, the heat dissipation plate 6 is placed at a predetermined position on the monolithic membrane 2d. Furthermore, by providing a recess 3e in the outer frame clamp 3, the guide pins and L-shaped hand can move within the recess 3e. The heat sink 6 is conveyed to the resin supply section D while being laminated on the monolithic film 2d. The heat sink supply section E is optional and can be omitted. Alternatively, the frame pick-and-place mechanism (first transfer mechanism) 9 and the heat sink pick-and-place mechanism (second transfer mechanism) 10 can be integrated. That is, the heat sink 6 can also be supplied from the heat sink supply section (plate member supply section) E via the frame pick-and-place mechanism 9.

[0099] [Cleaner Section F]

[0100] The cleaning unit F cleans the inner frame clamp 4 for reuse. The inner frame clamp 4 is reused by being transported between the membrane supply unit C, resin supply unit D, and cleaning unit F. The inner frame clamp 4 is loaded and unloaded relative to the outer frame clamp 3 via the frame pick-and-place mechanism 9, and then transferred to the cleaning unit F after use. The cleaning unit F is equipped with a cleaning brush or air blower driven by a drive source, a dust collection mechanism, etc., to remove resin dust and other contaminants adhering to the inner frame clamp 4 or the outer frame clamp 3. The outer frame clamp 3 is transported again from the sealing mold 2 to the membrane supply unit C, but it can also be cleaned by the cleaning unit F before being transported to the membrane supply unit C. The outer frame clamp 3 is... Figure 2 The conveying mechanism 7 shown in (a) holds and circulates between processes. The conveying mechanism 7 holds and transports the frame 3a with the monolithic membrane 2d attached to the outer frame clamp 3 on the opposite side of the opening.

[0101] As described above, using multiple outer frame clamps 3 allows for the parallel supply of granular resin R to the sealing mold 2 and to the inner frame clamp 4, improving work efficiency. Furthermore, by using the inner frame clamp 4 to supply granular resin R to the outer frame clamp 3, and then removing the inner frame clamp 4 from the outer frame clamp 3 to supply granular resin R to the sealing mold 2, resin contamination is not generated on the outer frame clamp 3, allowing for easy cleaning using the cleaning unit F before reuse. Since the granular resin R is softened by heating it to a predetermined temperature lower than the molding temperature for shape retention, there is less resin contamination on the inner frame clamp 4, making cleaning easy using the cleaning unit F.

[0102] A membrane waste box G is provided between the pressing section A and the cleaning section F. The membrane waste box G is used to discard the single-piece membrane 2d after it is removed from the molded product. For example, the used single-piece membrane 2d that remains in the lower mold 2b after the resin sealing molding is completed can be transported by a mechanism (not shown) provided on the conveying mechanism 7 that holds the used single-piece membrane 2d and dropped into the membrane waste box G for disposal.

[0103] Next, refer to Figure 1 (a)~ Figure 1 (h) and Figure 2 (a)~ Figure 2 (e) will describe an example of the resin sealing process. The following description illustrates a case where the heat sink 6 and the workpiece W are resin sealed together. Figure 1 In (a), at the membrane supply section C, a monolithic membrane 2d is prepared for use in a single molding process. The monolithic membrane 2d, obtained by cutting an elongated membrane, is held adsorbed and held on a support (platform) not shown. Figure 1 In (b), the outer frame clamp 3 is placed on the monolithic membrane 2d using the conveying mechanism 7, and the inner frame clamp 4 is placed using the frame picking and placing mechanism 9. The inner frame clamp 4 is mounted overlapping the inner circumferential surface of the frame 3a through the first through hole 3b. The outer frame clamp 3 holds the monolithic membrane 2d through the membrane adsorption hole 3c, covering the lower side of the first through hole 3b. Alternatively, the outer frame clamp 3 and the inner frame clamp 4 can be pre-placed and supplied to the monolithic membrane 2d by the conveying mechanism 7.

[0104] like Figure 1 As shown in (c), when the frame picking and placing mechanism 9 retracts after placing the outer frame clamp 3 and the inner frame clamp 4 on the monolithic membrane 2d, it only holds the inner frame clamp 4 and lifts it, causing it to retract from the outer frame clamp 3. In this state, as Figure 1As shown in (d), the heat sink 6 is placed onto the monolithic membrane 2d through the first through hole 3b of the outer frame clamp 3 from the heat sink supply section E via the heat sink pick-up and placement mechanism 10. While holding the heat sink 6 with an L-shaped hand, the heat sink 6 is moved to the vicinity of the monolithic membrane 2d, and the hand is moved from below the heat sink 6 to the outside. Guided by the guide pin, the heat sink 6 is placed at a predetermined position on the monolithic membrane 2d. When placing the heat sink 6, it is as follows... Figure 1 As shown in (e), the inner frame clamp 4, which is picked up and lifted by the placement mechanism 9, is overlapped and mounted on the inner circumferential surface of the outer frame clamp 3. At this time, the inner frame clamp 4 may or may not abut against the heat sink 6, but the granular resin R is then supplied into the second through hole 4b of the inner frame clamp 4. Therefore, it is preferable to make the gap between the inner frame clamp 4 and the heat sink 6 small enough to prevent the granular resin R from entering the gap. If the heat sink 6 is placed, the outer frame clamp 3 is transported together with the inner frame clamp 4 to the resin supply section D by the conveying mechanism 7 and placed on the resin supply platform 5.

[0105] Next, as Figure 1 As shown in (f), while metering the granular resin R using the resin dispenser 8, the granular resin R required for one resin seal is supplied from the supply nozzle 8a to the outer frame clamp 3 on the resin supply platform 5. Specifically, while moving the resin supply platform 5 in the XY direction via the XY drive mechanism, the granular resin R is supplied from the supply nozzle 8a into the second through hole 4b of the inner frame clamp 4 and onto the monolithic membrane 2d, for example, in a stroke-like manner.

[0106] At this time, as Figure 1 As shown in (g), the resin supply platform 5 is heated by the built-in heating unit (heater) to a predetermined temperature (e.g., about 60°C to 80°C: the first temperature) lower than the molding temperature (e.g., about 170°C: the second temperature), and the granular resin R is softened by heating through the monolithic film 2d and the heat sink 6. At this time, even if the granular resin R falls sequentially from the supply nozzle 8a to the monolithic film 2d, particle splashing and diffusion can be prevented, thereby maintaining the shape of the granular resin R within the second through hole 4b of the inner frame clamp 4. Therefore, when the inner frame clamp 4 is removed and the outer frame clamp 3 is transported to the sealing mold 2 by the conveying mechanism 7, there is no need to worry about resin powder flying, and contamination within the device can be prevented. In addition, the softening of the granular resin R by heating can also be performed after the supply of granular resin R is completed. Furthermore, by heating the heat sink 6 through the monolithic film 2d by the built-in heating unit, the heating time of the sealing mold 2 can be shortened.

[0107] Next, as Figure 1As shown in (h), the inner frame clamp 4 is lifted and removed from the inner circumferential surface of the outer frame clamp 3 by the frame pick-up and placement mechanism 9. At this time, the granular resin R softens due to heating, becoming a state of micro-powder or resin particles closely attached to each other, thereby preventing the granular resin R from adhering to the inner frame clamp 4 while removing it. As a result, the granular resin R softened in an area about 1 mm to 5 mm inward from the inner circumferential surface of the outer frame clamp 3 can be supplied to the heat dissipation plate 6 in a surface-solidified state. Furthermore, the frame pick-up and placement mechanism 9 transports the inner frame clamp 4 to the cleaning unit F while holding the inner frame clamp 4, and the inner frame clamp 4 is cleaned and transported again to the membrane supply unit C for reuse along with the outer frame clamp 3.

[0108] Next, as Figure 2 As shown in (a), the conveying mechanism 7 holds the outer frame clamp 3 (with the inner frame clamp 4 removed) from the resin supply platform 5 and conveys it to the molded sealing mold 2. Here, the conveying mechanism 7 holds the outer frame clamp 3 by hooks (not shown) and holds the monolithic film 2d by a vacuum pump (not shown), thereby conveying the granular resin R. At this time, the granular resin R softens due to heating and maintains its shape retention, so it will not move and adhere to the inner wall surface of the outer frame clamp 3. There is no need to worry about resin powder flying during the conveying process, and resin contamination of the outer frame clamp 3 can be prevented.

[0109] Next, as Figure 2 As shown in (b), the conveying mechanism 7 aligns the granular resin R with the recess 2c of the lower mold cavity, transferring the monolithic film 2d to the lower mold 2b and holding it in place. Membrane adsorption holes (not shown) are provided on the periphery of the recess 2c of the lower mold cavity in the lower mold 2b, i.e., the clamping surface. Figure 2 As shown in (c), by releasing the outer frame clamp 3 from the adsorption of the monolithic film 2d, the lower mold 2b begins to adsorb the monolithic film 2d. The heat sink 6 and the granular resin R are together with the monolithic film 2d and housed in the recess 2c of the lower mold cavity. The monolithic film 2d is adsorbed and held in the lower mold 2b. The heat sink 6 and the granular resin R are together with the monolithic film 2d and housed in the recess 2c of the lower mold cavity.

[0110] like Figure 2 As shown in (d), the upper mold clamping surface 2a1 of the workpiece W, on a thin-plate carrier with electronic components such as semiconductor chips mounted on it via a workpiece loader (not shown), holds the carrier with the electronic component mounting surface facing down. Next, the sealing mold 2 is closed. Figure 2 As shown in (e), the workpiece W and the single film 2d are clamped by the upper mold 2a and the lower mold 2b, and the granular resin R is heated and pressurized at the forming temperature (second temperature) to harden it.

[0111] The heat sink 6 and the monolithic film 2d containing granular resin R are transferred to the outer frame clamp 3 of the lower mold 2b and then transported to the cleaner section F (see reference) while being held by the conveying mechanism 7. Figure 3 It is then cleaned and, together with the inner frame clamp 4, is transported back to the membrane supply section C for reuse.

[0112] If the resin sealing method described above is used, the distribution area of ​​the granular resin R relative to the monolayer membrane 2d can be set arbitrarily, without worrying about resin powder flying during transportation, which is easy to handle and will not generate resin dirt on the outer frame clamp 3.

[0113] Furthermore, the structure for supplying the heat sink 6 can be omitted in the membrane supply section C.

[0114] In the described embodiment, the outer frame fixture 3 and the inner frame fixture 4 are rectangular frames, but are not limited to this. As long as the workpiece W is circular or the like, it can also be circular or the like. In addition, the first through hole 3b of the outer frame fixture 3 may not be two, for example, it may be one. The inner frame fixture 4 does not need to be used in pairs, for example, one of each can be used.

[0115] Furthermore, a compression molding apparatus with a lower mold cavity recess 2c in the lower mold 2b has been described for the sealing mold 2, but a compression molding apparatus with an upper mold cavity recess in the upper mold 2a can also be described. In this case, the workpiece W is supplied from the workpiece supply section B to the resin supply section D, and the conveying mechanism 7 serves as both a workpiece loader and a resin loader. The workpiece W and the outer frame clamp 3 are conveyed to the resin supply section D, and the granular resin R required for a single resin seal is supplied from the resin distributor 8 to the workpiece W in the second through hole 4b of the inner frame clamp 4. At this time, the granular resin R is heated at a first temperature and retains its shape in a softened state. The conveying mechanism 7 conveys the outer frame clamp 3 (with the inner frame clamp 4 removed) and the workpiece W together to the sealing mold 2 and transfers them to the lower mold 2b. The workpiece W is clamped by the upper mold 2a and the lower mold 2b, heated and pressurized to the molding temperature, and compressed into shape.

[0116] As explained above, granular resin R, required for one resin sealing, is supplied to the monolithic membrane 2d through the second through hole 4b of the inner frame clamp 4 mounted on the outer frame clamp 3. Simultaneously, the resin granules are heated to a predetermined temperature lower than the molding temperature to soften them. Therefore, even if the resin granules fall, splashing and diffusion are prevented, and the resin granules are kept in shape within the second through hole 4b of the inner frame clamp 4. Thus, when the outer frame clamp 3, after removing the inner frame clamp 4, is transported to the sealing mold 2 using the conveying mechanism 7, there is no need to worry about resin powder flying, preventing contamination within the device.

[0117] In addition, when the conveying mechanism 7 holds the outer frame clamp 3 (with the inner frame clamp 4 removed) from the resin supply platform 5 to the sealing mold 2, the granular resin R will not move and will adhere to the inner circumferential surface of the outer frame clamp 3, thus preventing the formation of resin dirt on the outer frame clamp 3.

[0118] Furthermore, by selecting inner frame fixtures 4 with different layouts of the second through hole 4b, the particulate resin distribution area can be set arbitrarily, and the size of the forming area can be easily changed using an outer frame fixture 3. Therefore, manufacturing equipment capable of performing various forming processes can be supplied at low cost.

[0119] Furthermore, when the heat sink 6 is placed on the monolithic membrane 2d before the supply of granular resin R, the outer frame clamp 3 can be positioned on the monolithic membrane 2d as a guide for supply, instead of the method described above using an L-shaped hand and guide pin.

[0120] Furthermore, while a structure was described that heats the resin granules R using a heating unit (heater) built into the resin supply platform 5, a structure in which the resin granules R are not heated during resin supply can also be adopted. For example, in cases where the molding thickness is very thin, it is sometimes necessary to supply the resin granules R in a way that does not require accumulation, i.e., to supply the resin granules R sparsely on the strip film 2d. In this case, it is not a problem to remove the inner frame clamp 4 without heating the resin granules R, and the outer frame clamp 3 can be used to transport the resin granules R and the strip film 2d.

[0121] Alternatively, a plate-shaped component supply section, which supplies other plate-shaped components such as shielding plates instead of heat sinks, may be included instead of the heat sink supply section E. Specifically, the plate-shaped component supply section may supply shielding plates, circuit boards, or antenna plates equipped with antennas to mitigate the effects of electromagnetic waves on the semiconductor package and the external environment. It may also be configured such that plate-shaped components with these functionalities are combined with the workpiece W and sandwiched in molding resin.

Claims

1. A resin sealing device, comprising conveying a single-piece film carrying granular resin and a workpiece to a sealing mold, and performing resin sealing by heating and pressurizing at a specified forming temperature, the resin sealing device being characterized in that it comprises: The outer frame clamp has a first through hole and holds the monolithic membrane in a manner that covers the area below the first through hole; The inner frame fixture has a second through hole and is mounted on the inner circumferential surface of the first through hole of the outer frame fixture; The resin supply unit supplies particulate resin to the monolithic film through the second through hole of the inner frame clamp installed on the outer frame clamp. The first transfer mechanism loads and unloads the inner frame clamp within the first through hole of the outer frame clamp; as well as The conveying mechanism, holding the outer frame clamp after the inner frame clamp has been removed, conveys the granular resin supplied to the monolithic film from the resin supply section to the sealing mold.

2. The resin sealing device according to claim 1, comprising a heating unit that heats the granular resin supplied to a monolithic film covering the lower surface of the inner frame clamp.

3. The resin sealing device according to claim 2, wherein the heating unit heats the particulate resin from below the outer frame clamp through a single membrane.

4. The resin sealing device according to claim 2 or 3, wherein the heating part heats the particulate resin at a predetermined temperature lower than the molding temperature.

5. The resin sealing device according to any one of claims 1 to 3, comprising a second transfer mechanism, the second transfer mechanism supplying a plate-like member to the monolithic film from the inside of the outer frame clamp after the inner frame clamp has been removed.

6. The resin sealing device according to any one of claims 1 to 3, wherein the resin supply section includes a resin supply platform, the resin supply platform supporting the outer frame clamp on which the inner frame clamp is mounted. The resin supply unit scans the resin supply platform along the XY direction while supplying granular resin required for one resin sealing into the frame opening of the inner frame fixture and onto the single-piece film.

7. The resin sealing device according to any one of claims 1 to 3, wherein the inner frame clamp is assembled with the concave-convex fitting portion provided on the inner periphery of the outer frame clamp, and is reused by circulating and conveying the single-piece film supply section, the resin supply section and the frame cleaner section.

8. The resin sealing device according to any one of claims 1 to 3, wherein a plurality of the outer frame clamps are used to supply the membrane from the sealing mold to the membrane supply section for supplying monolithic membranes via the conveying mechanism for reuse.

9. A resin sealing method, characterized in that, include: The membrane supply process supplies single-sheet membranes; The process of overlapping the monolithic film in such a way that it covers the area below the first through hole of the outer frame fixture; The process of installing the inner frame fixture on the inner circumferential surface of the first through hole of the outer frame fixture; The process of supplying particulate resin into the second through hole of the inner frame fixture; The process of transferring the outer frame fixture to the sealing mold via a conveying mechanism after the inner frame fixture is removed from the outer frame fixture; The process of aligning the granular resin with the recessed part of the mold cavity and transferring the monolithic film to a sealing mold for adsorption and retention; and In the resin sealing process, the workpiece and the single-piece film are clamped using the sealing mold, and the granular resin is heated and hardened.

10. The resin sealing method according to claim 9, wherein the granular resin supplied to the monolithic film covering the lower surface of the inner frame fixture is heated, wherein the granular resin is heated to a first temperature lower than the molding temperature through the monolithic film covering the first through hole of the outer frame fixture.

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