Wafer stage

Abstract

The present invention provides a wafer mounting table capable of preventing a power supply component from falling off from a terminal located at a mounting position on a plate side. A ceramic heater (10) comprises a ceramic plate (20), electrodes (first and second heater electrodes (21, 22)), first and second power supply components (31, 32), first and second terminal holes (23a, 24a) on the plate side, first and second mounting holes (61, 62) on the power supply side, and a direction conversion component (50). The first and second mounting holes (61, 62) deviate from the first and second terminal holes (23a, 24a) when viewed from above. The direction conversion component (50) holds the first power supply component (31) in a posture in which the direction is forcibly changed from the first mounting hole (61) to the first terminal hole (23a), and holds the second power supply component (32) in a posture in which the direction is forcibly changed from the second mounting hole (62) to the second terminal hole (24a).

Description

Technical Field

[0001] The present invention relates to a wafer mounting table. Background Art

[0002] In a semiconductor manufacturing device, a ceramic heater is used to heat a wafer. As such a ceramic heater, as disclosed in Patent Document 1, there is known a ceramic heater in which a ceramic shaft is joined to the back of a ceramic plate in which an inner circumferential side resistive heating element and an outer circumferential side resistive heating element are embedded. In this ceramic heater, by applying a voltage to each resistive heating element via a power supply component, the heat generated by each resistive heating element can be independently controlled.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-133195 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In such a ceramic heater, sometimes the installation positions of the power supply components arranged on the installation table where the ceramic heater is installed are arranged more densely than the installation positions of the power supply components arranged on the ceramic plate. In this case, the power supply components are bent in the ceramic shaft, but since the joint between the sheet body embedded in the ceramic heater and the power supply components is subjected to load (torque), there is a problem that the joint may fall off. This problem may occur when the installation position of the power supply component and the installation position of the ceramic shaft corresponding thereto deviate when viewed from above. In addition, although there is also a structure that uses a cable as a power supply component, although the cable can bend, its rigidity is high to a certain extent, and the load on the joint cannot be sufficiently reduced, so the problem cannot be fully solved.

[0008] The present invention has been made to solve such a problem, and a main object of the present invention is to prevent a power supply component from falling off from a terminal located at a mounting position on a board side in a wafer mounting table.

[0009] Solutions to Solve Problems

[0010] The wafer stage of the present invention comprises:

[0011] a ceramic plate having a wafer mounting surface;

[0012] an electrode embedded in the ceramic plate;

[0013] a hollow ceramic shaft disposed on a surface of the ceramic plate opposite to the wafer mounting surface;

[0014] A power supply component, which is disposed in the ceramic shaft and connected to the terminal of the electrode to supply power from a power source;

[0015] A plate-side mounting position, in an area of ​​the ceramic plate surrounded by the ceramic shaft, is provided corresponding to a terminal of the electrode and is used for mounting the power supply component;

[0016] a power supply side mounting position, which is provided on the free end side of the ceramic shaft, corresponding to the plate side mounting position and deviated from the plate side mounting position when viewed from above, and is used for mounting the power supply component; and

[0017] The direction changing member is provided in the ceramic shaft and holds the power supply member in a posture in which the direction is forcibly changed from the power supply side mounting position to the board side mounting position.

[0018] In the wafer stage, the board side mounting position and the power side mounting position corresponding to each other deviate when viewed from above. In addition, a direction conversion component is provided in the ceramic shaft. The direction conversion component holds the power supply component in a posture in which the direction is forcibly changed from the power side mounting position to the board side mounting position. The direction conversion component suppresses the load (torque) applied to the power supply component that causes the power supply component to fall off from the terminal located at the board side mounting position. Therefore, the power supply component can be prevented from falling off from the terminal. It should be noted that the power side mounting position only needs to be provided on the free end side of the ceramic shaft. For example, it can be a hole provided on a component installed on the free end side of the ceramic shaft, or it can be a position defined by the space on the free end side of the ceramic shaft in the absence of such a component.

[0019] In the wafer stage of the present invention, the electrodes may be a plurality of electrodes including heater electrodes, a plurality of power supply components may be provided in a manner connected to respective terminals of the plurality of electrodes, a plurality of board-side mounting positions may be provided in the region corresponding to respective terminals of the plurality of electrodes, a plurality of power supply-side mounting positions may be provided corresponding to the plurality of board-side mounting positions, at least one of the plurality of power supply-side mounting positions may deviate from the corresponding board-side mounting position when viewed from above, and the direction conversion component may hold the power supply components installed at the deviated power supply-side mounting position and the board-side mounting position in a posture in which the direction is forcibly converted from the power supply-side mounting position to the board-side mounting position. In this way, the power supply components installed at the deviated power supply-side mounting position and the board-side mounting position in the plurality of power supply components may be prevented from falling off from the terminals.

[0020] In this case, the plurality of power supply side mounting positions may also deviate from the corresponding plate side mounting positions when viewed from above. In this way, all power supply components are maintained in a posture in which the direction is forcibly changed by the direction conversion component. In addition, the power supply component may also have a flange on the ceramic plate side. The flange of the power supply component is used, for example, to press the power supply component toward the plate side mounting position when the power supply component is press-bonded or heated and press-bonded to the plate side mounting position. The diameter of such a flange is larger than the diameter of the power supply component. The flanges of adjacent power supply components need to ensure insulation from each other, and adjacent plate side mounting positions need not have surface discharge. Therefore, when using a power supply component with a flange, the plate side mounting position needs to be sparser than the power supply side mounting position (in other words, the power supply side mounting position is denser than the plate side mounting position), and the plate side mounting position is easy to deviate from the power supply side mounting position when viewed from above. Therefore, it is suitable for applying the present invention.

[0021] In the wafer mounting table of the present invention, the direction changing component may include: a plate side hole portion, which is provided on the ceramic plate side and extends from a position opposite to the plate side mounting position to a direction parallel to the axial direction of the ceramic shaft; and an inclined hole portion, which extends obliquely from the plate side hole portion to a position opposite to the power supply side mounting position. In this way, the direction changing component can firmly hold the power supply component in a posture in which the direction is forcibly changed from the power supply side mounting position to the plate side mounting position. In this case, the direction changing component may include a power supply side hole portion, which is provided on the power supply side and extends from a position opposite to the power supply side mounting position to a direction parallel to the axial direction of the ceramic shaft, and the inclined hole portion is provided between the plate side hole portion and the power supply side hole portion, and obliquely connects the plate side hole portion and the power supply side hole portion. The direction changing component having three holes may be composed of two components obtained by cutting the inclined hole portion with one surface parallel to the wafer mounting surface. In this way, the direction changing component can be easily manufactured. It should be noted that “parallel” includes not only completely parallel but also substantially parallel (for example, within a tolerance range, etc.) (the same applies hereinafter).

[0022] In the wafer stage of the present invention, the direction changing component may also include: a plate side hole portion, which is provided on the ceramic plate side and extends from a position opposite to the plate side mounting position to a direction parallel to the axial direction of the ceramic axis; a power supply side hole portion, which is provided on the power supply side and extends from a position opposite to the power supply side mounting position to a direction parallel to the axial direction of the ceramic axis; and a space portion provided between the plate side hole portion and the power supply side hole portion. In this way, the direction changing component can also firmly hold the power supply component in a posture in which the direction is forcibly changed from the power supply side mounting position to the plate side mounting position. In this case, the direction changing component may also be composed of a first component having the plate side hole portion, a second component having the power supply side hole portion, and a third component forming the space portion. In this way, the direction changing component can be easily manufactured.

[0023] In the wafer stage of the present invention, the power supply component and the terminal of the electrode may be welded. Compared with mechanical joining such as screws, welding is easy to fall off when a load is applied to the power supply component. Therefore, it is suitable for application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a perspective view of the ceramic heater 10 .

[0025] Figure 2 is a top view of the ceramic plate 20 .

[0026] Figure 3 It is a longitudinal sectional view of the ceramic heater 10 .

[0027] Figure 4 yes Figure 3 A partial enlarged view of .

[0028] Figure 5 A schematic plan view showing the positional relationship between the terminal holes 23 a , 24 a , and 27 a and the mounting holes 61 to 63 .

[0029] Figure 6 3 is a top view of the direction changing component 50 .

[0030] Figure 7 It is a longitudinal sectional view of the components 54 and 55 constituting the direction changing member 50 .

[0031] Figure 8 It is a longitudinal sectional view of the direction changing member 80 .

[0032] Fig. 9 1 is a top view of the direction changing component 80 .

[0033] Fig.10 2 is a longitudinal sectional view of the direction changing member 150 .

[0034] Explanation of symbols

[0035] 10: Ceramic heater, 20: Ceramic plate, 20a: Wafer mounting surface, 20b: Back surface, 20c: Imaginary boundary, 20d: Cylindrical member, 21: First heater electrode, 22: Second heater electrode, 23: First terminal, 23a: First terminal hole, 24: Second terminal, 24a: Second terminal hole, 26: RF electrode, 27: RF terminal, 27a: RF terminal hole, 28: Air hole, 29: Ejector hole, 31: First power supply member, 31a: Metal member, 31b: Buffer member, 31c: Oxidation-resistant conductive member, 31d: Flange, 31e: Insertion hole, 31f: Cable, 31g: Rod, 32: Second power supply member, 33: RF power supply member, 40: Ceramic shaft, 40a: Flange portion, 50: Direction change member, 51: First direction change hole, 51a: Plate Side hole portion, 51b: power supply side hole portion, 51c: inclined hole portion, 52: second direction conversion hole, 52a: plate side hole portion, 52b: power supply side hole portion, 52c: inclined hole portion, 53: RF direction conversion hole, 53a: plate side hole portion, 53b: power supply side hole portion, 53c: inclined hole portion, 54, 55: component, 60: setting table, 61: first mounting hole, 62: second mounting hole, 63: RF mounting hole, 80: direction conversion component, 81a~83a: plate side hole portion, 81b~83b: power supply side hole portion, 84: space portion, 86: first component, 87: second component, 88: third component, 150: direction conversion component, 151a, 152a: plate side hole portion, 151c, 152c: inclined hole portion, C1, C2: circumference, W: chip, Z1: first area, Z2: second area. DETAILED DESCRIPTION

[0036] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 is a perspective view of the ceramic heater 10, Figure 2 is a top view of the ceramic plate 20, Figure 3 is a longitudinal sectional view of the ceramic heater 10 (a sectional view when the ceramic heater 10 is cut along a plane including the central axis), Figure 4 yes Figure 3 A partially enlarged view of (illustrative view showing the front end and periphery of the first power supply component 31), Figure 5 2 is a schematic top view showing the positional relationship between each terminal hole 23a, 24a, 27a and each mounting hole 61 to 63. Figure 6 is a top view of the direction conversion component 50. Figure 2 In FIG. 1 , the RF electrode 26 , the ceramic shaft 40 , etc. are omitted and indicated by hidden lines.

[0037] The ceramic heater 10 is an example of a wafer stage of the present invention. The ceramic heater 10 is used to heat a wafer W that has been subjected to etching, CVD or other treatments, and is disposed in a vacuum chamber (not shown). The ceramic heater 10 includes: a disc-shaped ceramic plate 20 having a wafer mounting surface 20a; and a cylindrical ceramic shaft 40, which is coaxially joined to a surface (back surface) 20b of the ceramic plate 20 opposite to the wafer mounting surface 20a.

[0038] The ceramic plate 20 is a disk-shaped plate made of a ceramic material represented by aluminum nitride, aluminum oxide, etc. The diameter of the ceramic plate 20 is, for example, about 300 mm. Although not shown in the figure, the wafer mounting surface 20a of the ceramic plate 20 is provided with fine concave and convex by molding. The ceramic plate 20 is provided with an imaginary boundary 20c (see Figure 2 ) is divided into a first area Z1 of a small circle on the inner circumference side and a second area Z2 of annular shape on the outer circumference side. The diameter of the imaginary boundary 20c is, for example, about 200 mm. A first heater electrode 21 is buried in the first area Z1 of the ceramic plate 20, and a second heater electrode 22 is buried in the second area Z2. The heater electrodes 21 and 22 are arranged on the same plane parallel to the wafer mounting surface 20a. An RF electrode 26 is also buried in the ceramic plate 20 (see Figure 3 ).

[0039] like Figure 2 As shown, the ceramic plate 20 has a plurality of air holes 28. The air holes 28 penetrate from the back side 20b of the ceramic plate 20 to the wafer mounting surface 20a, and supply gas to the gap generated between the concavo-convex provided on the wafer mounting surface 20a and the wafer W mounted on the wafer mounting surface 20a. The gas supplied to the gap plays a role in improving the heat conduction between the wafer mounting surface 20a and the wafer W. In addition, the ceramic plate 20 has a plurality of ejector holes 29. The ejector holes 29 penetrate from the back side 20b of the ceramic plate 20 to the wafer mounting surface 20a, and are used to insert an ejector pin (not shown). The ejector pin plays a role in lifting the wafer W mounted on the wafer mounting surface 20a. In the present embodiment, three ejector holes 29 are provided at equal intervals on the same circumference.

[0040] like Figure 2As shown, the first heater electrode 21 is obtained by wiring the resistive heating element in the following manner: starting from one of a pair of first terminals 23, 23 arranged in the central part of the ceramic plate 20 (the area surrounded by the ceramic axis 40 in the back side 20b of the ceramic plate 20), it is folded back at multiple folding parts in a one-stroke manner and wired in substantially the entire area of ​​the first area Z1, and then reaches the other of the pair of first terminals 23, 23. The resistive heating element constituting the first heater electrode 21 is arranged in a manner that bypasses the ejector hole 29. The resistive heating element is mainly composed of a high melting point metal or its carbide. As examples of the high melting point metal, tungsten, molybdenum, tantalum, platinum, rhenium, hafnium and alloys thereof can be cited. As examples of the carbide of the high melting point metal, tungsten carbide, molybdenum carbide and the like can be cited. The first terminal 23 is exposed at the bottom surface of the first terminal hole 23a provided on the back side 20b of the ceramic plate. The first terminal 23 is formed of the same material as the resistive heating element. The front end portion of the first power supply member 31 is inserted into the first terminal hole 23 a and welded to the first terminal 23 .

[0041] like Figure 2 As shown, the second heater electrode 22 is obtained by wiring the resistive heating element in the following manner: starting from one of a pair of second terminals 24, 24 arranged in the central part of the ceramic plate 20, it is folded back at multiple folding parts in a one-stroke manner and wired in substantially the entire area of ​​the second area Z2, and then reaches the other of the pair of second terminals 24, 24. The resistive heating element constituting the second heater electrode 22 is arranged in a manner that bypasses the pores 28. The resistive heating element is mainly composed of a high melting point metal or its carbide. Among them, the section from the second terminal 24, 24 to the second area Z2 is formed by a wire of a high melting point metal or its carbide. The second terminals 24, 24 are exposed at the bottom surfaces of the second terminal holes 24a, 24a respectively arranged on the back side 20b of the ceramic plate. The second terminal 24 is formed of the same material as the resistive heating element. The front end of the second power supply component 32 is inserted into the second terminal hole 24a and welded to the second terminal 24.

[0042] The RF electrode 26 is a disk-shaped thin-layer electrode having a diameter slightly smaller than that of the ceramic plate 20, and is formed of a mesh obtained by weaving fine metal wires into a mesh and forming the mesh into a sheet. Figure 3 As shown in FIG. 1 , the RF electrode 26 is buried between the first and second heater electrodes 21, 22 in the ceramic plate 20 and the wafer mounting surface 20a in a manner substantially parallel to the wafer mounting surface 20a. The RF electrode 26 is mainly composed of a high melting point metal or its carbide. The RF terminal 27 of the RF electrode 26 is exposed at the bottom surface of the RF terminal hole 27a provided on the back surface 20b of the ceramic plate 20. The RF terminal 27 is formed of the same material as the RF electrode 26. The front end portion of the RF power supply component 33 is inserted into the RF terminal hole 27a and welded to the RF terminal 27.

[0043] The ceramic shaft 40 is formed of ceramics such as aluminum nitride and aluminum oxide, similarly to the ceramic plate 20. The inner diameter of the ceramic shaft 40 is, for example, about 40 mm, and the outer diameter is, for example, about 60 mm. The upper end of the ceramic shaft 40 is joined to the ceramic plate 20. Inside the ceramic shaft 40, there are arranged first power supply components 31, 31 respectively connected to a pair of first terminals 23, 23 of the first heater electrode 21, second power supply components 32, 32 respectively connected to a pair of second terminals 24, 24 of the second heater electrode 22, and an RF power supply component 33 connected to the RF terminal 27. The first power supply components 31, 31 are connected to a first power supply not shown in the figure, the second power supply components 32, 32 are connected to a second power supply not shown in the figure, and the RF power supply component 33 is connected to an RF power supply not shown in the figure. Therefore, the temperature of the first area Z1 heated by the first heater electrode 21 and the second area Z2 heated by the second heater electrode 22 can be controlled separately. It should be noted that each power supply is arranged outside the setting table 60.

[0044] Since the first power supply component 31, the second power supply component 32 and the RF power supply component 33 all have the same structure, the following description will be made taking the first power supply component 31 as an example. Figure 4As shown, the first power supply component 31 includes a metal member 31a and a cable 31f. A cylindrical member 20d made of metal (for example, Ni) is embedded in the first terminal hole 23a provided on the back side 20b of the ceramic plate 20. The front end of the metal member 31a is welded to the first terminal 23 while being inserted into the cylindrical member 20d. The metal member 31a is a member having high rigidity and being non-flexible, and includes a buffer member 31b and an oxidation-resistant conductive member 31c. The buffer member 31b is provided on the front end side of the metal member 31a. The buffer member 31b is used to mitigate the thermal expansion difference between the first terminal 23 and the oxidation-resistant conductive member 31c. As a material of the buffer member 31b, for example, Kovar alloy can be cited. The oxidation-resistant conductive member 31c has a flange 31d used when welding the first power supply component 31 to the first terminal 23, and an insertion hole 31e into which the cable 31f can be inserted. As a material of the oxidation-resistant conductive member 31c, for example, nickel can be cited. The cable 31f is a conductor that is rigid but also flexible, and is made of, for example, a strand of nickel metal thin wires. The front end of the cable 31f is joined in a state of being inserted into the insertion hole 31e. When joining the first power supply component 31 to the first terminal 23, heat and pressure joining is performed with solder disposed between the front end surface of the metal component 31a and the first terminal 23. Pressurization is performed by pressing the flange 31d of the metal component 31a toward the first terminal 23 with a clamp. In order to maintain the insulation state between the first power supply component 31 and the adjacent first power supply component 31, it is necessary to maintain the insulation state between the flanges 31d of both. In addition, it is also necessary to avoid surface discharge between the first terminal holes 23a. Therefore, the intervals between the first terminal holes 23a need to be relatively wide. In this regard, the same applies to adjacent second terminal holes 24a, adjacent first terminal holes 23a and second terminal holes 24a, adjacent RF terminal holes 27a and first terminal holes 23a, and adjacent RF terminal holes 27a and second terminal holes 24a. As Figure 5 As shown, the centers of the two first terminal holes 23a, the centers of the two second terminal holes 24a, and the center of the one RF terminal hole 27a are arranged on a circumference C1 having a diameter D1.

[0045] like Figure 3 As shown, the ceramic shaft 40 is fixed to the setting table 60. Specifically, the flange portion 40a provided at the free end (lower end) of the ceramic shaft 40 is mechanically fixed to the setting table 60 by screws or the like. In the area surrounded by the ceramic shaft 40 on the upper surface of the setting table 60, a first mounting hole 61 for mounting the first power supply component 31, a second mounting hole 62 for mounting the second power supply component 32, and an RF mounting hole 63 for mounting the RF power supply component 33 are provided (see Figure 5 ).like Figure 5As shown, the centers of the two first mounting holes 61, the centers of the two second mounting holes 62, and the center of the RF mounting hole 63 are arranged on a circumference C2 of a diameter D2 (<D1). The first mounting holes 61, 61, the second mounting holes 62, 62, and the RF mounting hole 63 are arranged more densely than the first terminal holes 23a, 23a, the second terminal holes 24a, 24a, and the RF terminal hole 27a. Specifically, the intervals between adjacent first mounting holes 61 are narrower than the intervals between adjacent first terminal holes 23a, the intervals between adjacent second mounting holes 62 are narrower than the intervals between adjacent second terminal holes 24a, and the intervals between the first mounting hole 61 and the second mounting hole 62 adjacent thereto are narrower than the intervals between the first terminal hole 23a and the second terminal hole 24a adjacent thereto. In addition, the interval between the RF mounting hole 63 and the adjacent first mounting hole 61 is narrower than the interval between the RF terminal hole 27a and the adjacent first terminal hole 23a, and the interval between the RF mounting hole 63 and the adjacent second mounting hole 62 is narrower than the interval between the RF terminal hole 27a and the adjacent second terminal hole 24a.

[0046] The direction changing component 50 is a cylindrical component made of ceramic and is fixed in the ceramic shaft 40. Figure 6 As shown, the direction conversion component 50 includes a first direction conversion hole 51, a second direction conversion hole 52 and an RF direction conversion hole 53. Figure 3 As shown, the first direction conversion hole 51 forces the first power supply component 31 to change direction from a position opposite to the first mounting hole 61 of the setting table 60 (a line parallel to the axial direction of the ceramic shaft 40 is extended from the center of the first mounting hole 61 to a position on the lower surface of the direction conversion component 50) to a position opposite to the first terminal hole 23a of the ceramic board 20 (a line parallel to the axial direction of the ceramic shaft 40 is extended from the center of the first terminal hole 23a to a position on the upper surface of the direction conversion component 50). The second direction conversion hole 52 forces the second power supply component 32 to change direction from a position opposite to the second mounting hole 62 of the setting table 60 to a position opposite to the second terminal hole 24a of the ceramic board 20. Although Figure 3 Although not shown, the RF direction change hole 53 forces the RF power supply component 33 to change direction from a position facing the RF mounting hole 63 of the installation table 60 to a position facing the RF terminal hole 27 a of the ceramic board 20 .

[0047] The first direction-changing hole 51 includes a plate-side hole portion 51a, a power-side hole portion 51b, and an inclined hole portion 51c. The plate-side hole portion 51a is provided on the ceramic plate 20 side of the first direction-changing hole 51. The plate-side hole portion 51a extends to a predetermined depth from a position on the upper surface of the direction-changing component 50 that is opposite to the first terminal hole 23a in a direction parallel to the axial direction of the ceramic shaft 40. The power-side hole portion 51b is provided on the power-supply side (the side of the mounting table 60) of the first direction-changing hole 51. The power-supply side hole portion 51b extends to a predetermined depth from a position on the lower surface of the direction-changing component 50 that is opposite to the first mounting hole 61 in a direction parallel to the axial direction of the ceramic shaft 40. It should be noted that the depth of the plate-side hole portion 51a and the depth of the power-supply side hole portion 51b may be the same or different. The inclined hole portion 51c is provided between the bottom surface of the plate-side hole portion 51a and the bottom surface of the power-supply side hole portion 51b, and connects the plate-side hole portion 51a and the power-supply side hole portion 51b obliquely.

[0048] The second direction-changing hole 52 includes a plate-side hole portion 52a, a power-side hole portion 52b, and an oblique hole portion 52c. The plate-side hole portion 52a is provided on the ceramic plate 20 side of the second direction-changing hole 52. The plate-side hole portion 52a extends to a predetermined depth from a position on the upper surface of the direction-changing component 50 that is opposite to the second terminal hole 24a in a direction parallel to the axial direction of the ceramic shaft 40. The power-side hole portion 52b is provided on the power-supply side (the side of the setting table 60) of the second direction-changing hole 52. The power-supply side hole portion 52b extends to a predetermined depth from a position on the lower surface of the direction-changing component 50 that is opposite to the second mounting hole 62 in a direction parallel to the axial direction of the ceramic shaft 40. It should be noted that the depth of the plate-side hole portion 52a and the depth of the power-supply side hole portion 52b may be the same or different. The oblique hole portion 52c is provided between the bottom surface of the plate-side hole portion 52a and the bottom surface of the power-supply side hole portion 52b, and obliquely connects the plate-side hole portion 52a and the power-supply side hole portion 52b.

[0049] The RF direction conversion hole 53 includes a plate side hole portion 53a, a power supply side hole portion 53b, and an inclined hole portion 53c. The plate side hole portion 53a is provided on the ceramic plate 20 side of the RF direction conversion hole 53. The plate side hole portion 53a extends from a position on the upper surface of the direction conversion component 50 that is opposite to the RF terminal hole 27a in a direction parallel to the axial direction of the ceramic shaft 40 to a predetermined depth. The power supply side hole portion 53b is provided on the power supply side (setting table 60 side) of the RF direction conversion hole 53. The power supply side hole portion 53b extends from a position on the lower surface of the direction conversion component 50 that is opposite to the RF mounting hole 63 in a direction parallel to the axial direction of the ceramic shaft 40 to a predetermined depth. It should be noted that the depth of the plate side hole portion 53a and the depth of the power supply side hole portion 53b may be the same or different. The inclined hole portion 53c is provided between the bottom surface of the plate-side hole portion 53a and the bottom surface of the power-side hole portion 53b, and connects the plate-side hole portion 53a and the power-side hole portion 53b obliquely.

[0050] like Figure 7 As shown in FIG. 1 , the direction changing member 50 may be a member formed by laminating two members 54 and 55 obtained by cutting the oblique hole portions 51c to 53c with one surface parallel to the wafer mounting surface 20a. If the direction changing member 50 is made of one member, it is difficult to form the oblique hole portions 51c to 53c. Figure 7 As shown, the manufacturing becomes easy by dividing into two members 54 and 55. It should be noted that the members 54 and 55 may be bonded or joined, or may not be joined or joined but just in contact.

[0051] The first power supply component 31 reaches the first terminal hole 23a from the first mounting hole 61 on the power supply side through the power supply side hole portion 51b, the oblique hole portion 51c and the plate side hole portion 51a of the first direction change hole 51 of the direction change component 50. Therefore, the first power supply component 31 is forcibly bent at the boundary between the power supply side hole portion 51b and the oblique hole portion 51c, and at the boundary between the oblique hole portion 51c and the plate side hole portion 51a. The force generated by this bending is applied to the direction change component 50. The second power supply component 32 and the RF power supply component 33 are also the same. Each power supply component 31 to 33 starts from the mounting holes 61 to 63 of the setting table 60 which are densely arranged, is bent in the direction change component 50, and reaches the terminal holes 23a, 24a, and 27a of the ceramic plate 20 which are sparsely arranged. The force generated by this bending is not (or hardly) applied to the joints between the first terminal 23 and the first power supply member 31 , the joints between the second terminal 24 and the second power supply member 32 , and the joints between the RF terminal 27 and the RF power supply member 33 .

[0052] Although not shown in the figure, the direction changing member 50 is also provided with a hole for passing a gas pipe for supplying gas to the gas hole, a hole for passing a thermocouple, and the like.

[0053] Next, an example of using the ceramic heater 10 is described. First, the ceramic heater 10 is set on the setting table 60 in the vacuum chamber (not shown), and a nozzle (not shown) is arranged above the wafer mounting surface 20a with a space therebetween. In addition, a wafer W is mounted on the wafer mounting surface 20a. Furthermore, the power supplied to the first heater electrode 21 is adjusted by the first power supply (not shown) so that the temperature of the first area Z1 detected by the inner peripheral thermocouple (not shown) becomes a predetermined inner peripheral target temperature. Furthermore, the power supplied to the second heater electrode 22 is adjusted by the second power supply (not shown) so that the temperature of the second area Z2 detected by the outer peripheral thermocouple (not shown) becomes a predetermined outer peripheral target temperature. Thus, the temperature of the wafer W is controlled in such a way that it becomes the desired temperature. Then, the vacuum chamber is set to a vacuum atmosphere or a reduced pressure atmosphere, and RF power is supplied from the RF power supply to the RF electrode 26. Thus, plasma is generated between the parallel plate electrodes formed by the nozzle and the RF electrode 26. The wafer W is subjected to CVD film formation or etching using the plasma.

[0054] Here, the correspondence between the components of the present embodiment and the components of the present invention (part) is described. The first heater electrode 21, the second heater electrode 22, and the RF electrode 26 of the present embodiment are equivalent to the electrodes of the present invention. In addition, the first power supply component 31, the second power supply component 32, and the RF power supply component 33 are equivalent to the power supply component, the first terminal hole 23a, the second terminal hole 24a, and the RF terminal hole 27a are equivalent to the board side mounting position, and the first mounting hole 61, the second mounting hole 62, and the RF mounting hole 63 are equivalent to the power supply side mounting position.

[0055] In the ceramic heater 10 of the present embodiment described above, when viewed from above, Figure 5As shown, the corresponding mounting holes and terminal holes (the first mounting hole 61 and the first terminal hole 23a, the second mounting hole 62 and the second terminal hole 24a, the RF mounting hole 63 and the RF terminal hole 27a) are offset. Here, the first mounting hole 61, the second mounting hole 62 and the RF mounting hole 63 are more densely arranged than the first terminal hole 23a, the second terminal hole 24a and the RF terminal hole 27a. In addition, a direction conversion component 50 is provided in the ceramic shaft 40. The direction conversion component 50 holds the first power supply component 31 in a posture in which the direction is forcibly changed from the first mounting hole 61 to the first terminal hole 23a, holds the second power supply component 32 in a posture in which the direction is forcibly changed from the second mounting hole 62 to the second terminal hole 24a, and holds the RF power supply component 33 in a posture in which the direction is forcibly changed from the RF mounting hole 63 to the RF terminal hole 27a. The direction changing member 50 suppresses the load (moment) that causes the power supply members 31 to 33 to fall off from the terminals 23, 24, 27 from being applied to the power supply members 31 to 33. Therefore, the power supply members 31 to 33 can be prevented from falling off from the terminals 23, 24, 27.

[0056] In addition, the direction change component 50 has a first direction change hole 51, a second direction change hole 52, and an RF direction change hole 53. Therefore, the direction change component 50 firmly holds the power supply components 31 to 33 in a posture in which the directions are forcibly changed from the mounting holes 61 to 63 on the power supply side to the terminal holes 23a, 24a, and 27a on the board side. Figure 7 As shown, the direction changing member 50 may be formed by stacking two members 54 and 55. In this way, the direction changing member 50 can be easily manufactured.

[0057] Furthermore, the first power supply component 31 has a flange 31d on the ceramic plate 20 side. The flange 31d is used to press the first power supply component 31 to the first terminal 23 when the first power supply component 31 is press-bonded or heat-press-bonded to the first terminal 23 of the first terminal hole 23a. The diameter of such a flange 31d is larger than the diameter of the cable 31f of the first power supply component 31. The other power supply components 32 and 33 also have the same flange. The flanges of the adjacent power supply components among the power supply components 31 to 33 need to ensure insulation from each other. In addition, it is also necessary to avoid the generation of surface discharge between adjacent terminal holes. Therefore, the first terminal hole 23a, the second terminal hole 24a and the RF terminal hole 27a of the ceramic plate 20 need to be sparser than the first mounting hole 61, the second mounting hole 62 and the RF mounting hole 63 of the setting table 60, and the positions are easily deviated from each other when viewed from above. Therefore, it is suitable for applying the present invention.

[0058] It should be noted that even when a power supply component without a flange is used, the first terminal hole 23a, the second terminal hole 24a, and the RF terminal hole 27a of the ceramic plate 20 are preferably sparser than the first mounting hole 61, the second mounting hole 62, and the RF mounting hole 63 of the setting table 60. This is because the ceramic plate 20 side in the ceramic shaft 40 is more likely to become hotter than the setting table 60 side, and gas discharge is more likely to occur.

[0059] In addition, the first power supply component 31, the second power supply component 32 and the RF power supply component 33 are welded to the corresponding first terminal 23a, the second terminal 24a and the RF terminal 27a respectively. Compared with mechanical joints such as screws, welding is easy to fall off when a load is applied. Therefore, it is suitable for application of the present invention.

[0060] It should be noted that the present invention is not limited to the above-mentioned embodiments, and it goes without saying that the present invention can be implemented in various forms as long as it belongs to the technical scope of the present invention.

[0061] For example, you can also use Figure 8 and Fig. 9 The direction conversion component 80 shown in the figure replaces the direction conversion component 50 used in the above embodiment. Figure 8 In the embodiment, the same reference numerals are given to the same components as those in the above-mentioned embodiment. Figure 2 and Figure 5 The direction changing component 80 includes: a plate side hole portion 81a and a power side hole portion 81b for holding the first power supply component 31, a plate side hole portion 82a and a power side hole portion 82b for holding the second power supply component 32, a plate side hole portion 83a and a power side hole portion 83b for holding the RF power supply component 33, and a space portion 84 provided between the bottom surfaces of the plate side holes 81a to 83a and the bottom surfaces of the power side holes 81b to 83b. The direction changing component 80 is composed of a first disc-shaped member 86 having the plate side holes 81a to 83a, a second disc-shaped member 87 having the power side holes 81b to 83b, and a cylindrical third member 88 disposed between the first member 86 and the second member 87, and the hollow interior of the third member 88 is the space portion 84. Therefore, the direction changing component 80 can be easily manufactured by combining the first to third members 86 to 88 after they are manufactured separately. The direction-changing component 80 can also firmly hold each power supply component 31-33 in a posture where the direction is forcibly changed from the mounting holes 61-63 on the power supply side to the terminal holes 23a, 24a, 27a on the board side. In addition, the direction-changing component 80 also suppresses the load (torque) applied to each power supply component 31-33 that may cause the power supply components 31-33 to fall off from the terminals 23, 24, 27. Therefore, it is possible to prevent each power supply component 31-33 from falling off from the terminals 23, 24, 27. Figure 8As shown, the first power supply component 31 has a rod 31g, and the other power supply components 32 and 33 also have the same rod. The rod 31g is, for example, a nickel rod, which is connected to the lower end of the cable 31f between the direction change component 80 and the setting table 60, and is installed in the first installation hole 61. When assembling the direction change component 80, with the front ends of the power supply components 31 to 33 of the ceramic plate 20 connected to the corresponding terminals 23, 24, and 27, the power supply components 31 to 33 are first passed through the plate side holes 81a to 83a of the first component 86, and then the third component 88 is placed in the ceramic shaft 40, and finally the power supply components 31 to 33 are passed through the power supply side holes 81b to 83b of the second component 87. It should be noted that a cylindrical shape is illustrated as the shape of the third component 88, but it is not particularly limited to this. For example, the cylinder can also be divided longitudinally into a plurality of parts (for example, 6 or 8 parts), and the plurality of columnar bodies obtained by removing the divided parts every other one are used as the third component 88. In addition, in Figure 8 In the embodiment, as each of the power supply members 31 to 33 , the members described in the above embodiment (members without a rod) may be used.

[0062] In the above-mentioned embodiment, the direction conversion component 50 may also be as follows Figure 7 In addition to stacking two components 54 and 55 as shown in the figure, three components may be stacked. Specifically, the boundaries between the plate side holes 51a to 53a and the oblique holes 51c to 53c of the direction changing component 50 may be cut with a surface parallel to the wafer mounting surface 20a, and the boundaries between the oblique holes 51c to 53c and the power supply side holes 51b to 53b may be cut with a surface parallel to the wafer mounting surface 20a, and the obtained three components may be stacked. In this way, the direction changing component 50 can also be easily manufactured.

[0063] In the above-mentioned embodiment, the direction changing member 50 is provided with the plate side holes 51a to 53a, the power source holes 51b to 53b and the oblique holes 51c to 53c, but it is also possible to use Fig.10 The direction conversion component 150 shown. Fig.10 In the embodiment, the same reference numerals are used for the same components as those in the above-mentioned embodiment. The direction change component 150 has plate side holes 151a, 152a and oblique holes 151c, 152c, but does not have a power supply hole. In this way, the first and second power supply components 31, 32 can also be forced to change direction. Fig.10 Although not shown in the figure, the direction changing component 150 is also provided with a plate side hole portion and an oblique hole portion for inserting the RF power supply component 33.

[0064] In the above embodiment, it is described that the centers of the two first terminal holes 23a, the centers of the two second terminal holes 24a, and the center of the RF terminal hole 27a are arranged on the circumference C1 of the diameter D1, and the centers of the two first mounting holes 61, the centers of the two second mounting holes 62, and the center of the RF mounting hole 63 are arranged on the circumference C2 of the diameter D2 (<D1), but it is not particularly limited to this. As long as the corresponding terminal holes and mounting holes are offset when viewed from above, the centers of the terminal holes may not be arranged on the same circumference, and the centers of the mounting holes may not be arranged on the same circumference. Alternatively, the first terminal hole 23a and the first mounting hole 61 where the first power supply component 31 is mounted may be offset when viewed from above, but the second terminal hole 23b and the second mounting hole 62, and the RF terminal hole 27a and the RF mounting hole 63 may not be offset when viewed from above. In this case, the first power supply component 31 can be turned in direction by using the direction conversion component 50 so that the second and RF power supply components 32 and 33 pass through the direction conversion component 50 straightly in the vertical direction.

[0065] In the above-mentioned embodiment, the direction changing member 50 made of ceramic is used, but it is not particularly limited to ceramic. For example, when the use temperature is low, the direction changing member 50 may be made of a resin that can withstand the use temperature.

[0066] In the above-mentioned embodiment, an electrostatic electrode may be built in the ceramic plate 20. In this case, by applying a voltage to the electrostatic electrode after the wafer W is placed on the wafer placement surface 20a, the wafer W can be electrostatically attracted to the wafer placement surface 20a. A power supply component is mounted on the electrostatic electrode, and the power supply component is also mounted in a manner that extends from a mounting hole on the power supply side (with the center passing through the mounting hole). Figure 5 The hole is arranged in a circle C2) toward the terminal hole on the ceramic plate 20 side (with the center passing through Figure 5 The posture in which the direction change is forcibly performed by the hole arranged in the manner of the circle C1 is maintained by the direction change component.

[0067] In the above embodiment, the RF electrode 26 is connected to the RF power supply, but the RF electrode 26 may be grounded and a shower head (not shown) may be connected to the RF power supply. In the above embodiment, the RF electrode 26 may be omitted.

[0068] In the above-mentioned embodiment, the first and second regions Z1 and Z2 are described as one region, but at least one of the first and second regions Z1 and Z2 may be divided into a plurality of small regions. In this case, the resistive heating element (heater electrode) is independently wired in each small region, and power supply components are installed at both ends of each resistive heating element. These power supply components are also connected by mounting holes (with the center passing through the mounting hole) on the power supply side. Figure 5The hole is arranged in a circle C2) toward the terminal hole on the ceramic plate 20 side (with the center passing through Figure 5 The posture in which the direction change is forcibly performed by the hole arranged in the manner of the circle C1 is maintained by the direction change component.

Claims

1. A wafer stage, comprising: a ceramic plate having a wafer mounting surface; an electrode embedded in the ceramic plate; a hollow ceramic shaft disposed on a surface of the ceramic plate opposite to the wafer mounting surface; A power supply component, which is disposed in the ceramic shaft and connected to the terminal of the electrode to supply power from a power source; a plate-side mounting position, provided in a region of the ceramic plate surrounded by the ceramic shaft and corresponding to a terminal of the electrode, for mounting the power supply component; A power supply side mounting position is provided on the free end side of the ceramic shaft, corresponding to the plate side mounting position and deviated from the plate side mounting position when viewed from above, for mounting the power supply component; as well as A direction conversion component, comprising at least one member disposed in the ceramic shaft, spanning the entire inner diameter of the ceramic shaft, and fixed between one end of the ceramic plate side of the ceramic shaft and the free end side of the ceramic shaft, wherein the power supply component is held in a posture in which the direction is forcibly converted from the power supply side mounting position to the plate side mounting position through at least one direction conversion hole disposed in the direction conversion component, and the ceramic shaft extends above and below the direction conversion component, respectively. Wherein, at least one component of the direction conversion component has: a plate side hole portion, which is disposed below the ceramic plate and does not contact the ceramic plate, and extends from a position opposite to the plate side mounting position in a direction parallel to the axial direction of the ceramic shaft; as well as An inclined hole portion passes through at least a portion of at least one direction-changing hole in the direction-changing member and extends obliquely from the plate-side hole portion toward a position opposite to the power-side mounting position.

2. The wafer stage according to claim 1, wherein the electrode is a plurality of electrodes including a heater electrode, The power supply member is provided in plurality in a manner connected to each terminal of the plurality of electrodes. The board-side mounting positions are provided in the region in a plurality corresponding to the respective terminals of the plurality of electrodes, The power supply side mounting positions are provided in plurality corresponding to the plurality of panel side mounting positions, and at least one of the plurality of power supply side mounting positions deviates from the corresponding panel side mounting position when viewed from above. The direction changing member holds the power supply member, which is mounted at the deviated power supply side mounting position and the panel side mounting position, in a posture in which the direction is forcibly changed from the power supply side mounting position to the panel side mounting position. 3 . The wafer stage according to claim 2 , wherein each of the plurality of power supply side mounting positions is offset from the corresponding board side mounting position in a plan view. 4 . The wafer stage according to claim 2 , wherein the power supply member has a flange on the ceramic plate side.

5. The wafer stage according to claim 1, wherein at least one member of the direction changing component further comprises: A power supply side hole portion, which is arranged above the power supply side and does not contact the power supply, extends from a position opposite to the power supply side mounting position in a direction parallel to the axial direction of the ceramic shaft, The inclined hole portion passes through at least a portion of at least one direction-changing hole in the direction-changing member and is disposed between the plate-side hole portion and the power-side hole portion to obliquely connect the plate-side hole portion and the power-side hole portion.

6. The wafer mounting table according to claim 5, wherein the direction changing member is composed of two members obtained by cutting the inclined hole portion with a surface parallel to the wafer mounting surface. 7 . The wafer mounting table according to claim 1 , wherein the power supply member is welded to a terminal of the electrode.

8. The wafer stage according to claim 1 or 2, wherein the direction changing member is made of ceramic.

9. A wafer stage, comprising: a ceramic plate having a wafer mounting surface; an electrode embedded in the ceramic plate; a hollow ceramic shaft disposed on a surface of the ceramic plate opposite to the wafer mounting surface; A power supply component, which is disposed in the ceramic shaft and connected to the terminal of the electrode to supply power from a power source; a plate-side mounting position, provided in a region of the ceramic plate surrounded by the ceramic shaft and corresponding to a terminal of the electrode, for mounting the power supply component; A power supply side mounting position is provided on the free end side of the ceramic shaft, corresponding to the plate side mounting position and deviated from the plate side mounting position when viewed from above, for mounting the power supply component; as well as A direction conversion component, comprising at least one member and a space portion provided in the ceramic shaft, spanning the entire inner diameter of the ceramic shaft, and fixed between one end of the ceramic plate side of the ceramic shaft and the free end side of the ceramic shaft, so that the power supply component is held in a posture in which the direction is forcibly converted from the power supply side mounting position to the plate side mounting position through the space portion provided between the plate side hole portion and the power supply side hole portion, and the ceramic shaft extends above and below the direction conversion component, respectively. Wherein, at least one component of the direction conversion component has: The plate side hole portion is arranged below the ceramic plate and does not contact the ceramic plate, and extends from a position opposite to the plate side mounting position in a direction parallel to the axial direction of the ceramic shaft; as well as The power supply side hole portion is provided above the power supply and does not contact the power supply, and extends from a position opposite to the power supply side mounting position in a direction parallel to the axial direction of the ceramic shaft.

10. The wafer stage according to claim 9, wherein the direction changing member is composed of a first member having the plate side hole portion, a second member having the power source side hole portion, and a third member forming the space portion. in, The first member and the second member are in contact with the third member, The third member is located between the first member and the second member.

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