Open evaporative cooling device and electronic equipment thereof

Abstract

The present invention relates to the field of heat dissipation technology for power electronic equipment, and in particular to an open evaporative heat dissipation device and electronic equipment thereof. The open evaporative heat dissipation device includes an evaporation module, a micro air pump, and a waterproof and breathable unit. The evaporation module has an evaporation space for accommodating a liquid working medium. The inlet of the micro air pump is connected to the evaporation space. The waterproof and breathable unit is arranged on the communication path between the inlet of the micro air pump and the evaporation space. The open evaporative heat dissipation device of the present invention is equipped with a micro air pump on the evaporation module to promote the formation of a micro vacuum in the evaporation space, which is beneficial to promoting the evaporation of the liquid working medium in the evaporation device, improving the heat dissipation efficiency, thereby maintaining efficient heat dissipation, and avoiding the problem of damage to the evaporation module caused by the continuous increase in air pressure in the evaporation space.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of power electronic equipment, and in particular to an open evaporative heat dissipation device. In addition, the present invention also relates to an electronic device comprising the open evaporative heat dissipation device. Background Art

[0002] In recent years, with the rapid development of electronic technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have led to a rapid increase in the heat generation of electronic devices per unit volume, a sharp increase in the heat power of the entire device and the local heat flux density. The resulting energy consumption and heat dissipation problems have become increasingly prominent. Excessive temperatures have seriously affected the stability, reliability and service life of electronic components. Efficient heat dissipation technology has become the key to promoting the further development and application of electronic technology.

[0003] Currently, pump-driven microchannel two-phase flow circulation cooling technology is considered to be one of the most effective cooling technologies for high-power circuits such as integrated circuits. It can effectively solve the cooling problems of small channels, high heat loads, high precision, multiple heat sources or complex distributed heat sources through high-performance power equipment and circulating working fluids. However, existing pump-driven microchannel two-phase flow circulation cooling systems mostly use mechanical pumps to provide circulation power, requiring an additional liquid reservoir before the mechanical pump inlet pipe. At the same time, the inlet liquid temperature must have a certain degree of supercooling to avoid cavitation and affect the reliability of the system. At the same time, the mechanical pump itself has high energy consumption, large size, difficult integration, and produces a lot of noise during operation. In short, the overall performance has not met expectations. Against this background, in recent years, microchannel two-phase circulation cooling systems have emerged that use micropumps (such as piezoelectric pumps) instead of mechanical pumps. For example, the phase change heat transfer cooling system described in Patent No. CN207519054U "A Microchannel Phase Change Heat Transfer Cooling System Based on Piezoelectric Pump" structurally includes a piezoelectric pump, a microchannel evaporator and a radiator. The liquid working fluid absorbs heat and changes phase in the microchannel evaporator, forming a gas-liquid two-phase flow. After reaching the radiator, it condenses into a liquid phase, releasing latent heat, and then reaches the next cycle through the piezoelectric pump. This structure can achieve the advantages of compact structure, low noise and low power consumption by introducing a micro pump to replace the traditional mechanical pump. At the same time, the phase change heat transfer of the liquid working fluid can theoretically improve the heat exchange and heat transfer efficiency, but the phase change process is uncontrollable: on the one hand, since the phase change heat transfer working fluid in the pipeline is a single working fluid, when flowing through the microchannel evaporator, the heat load of the microchannel evaporator is directly related to the evaporation rate of the single working fluid. A relatively low heat load may cause the working fluid to not undergo a phase change, and the purpose of efficient heat dissipation cannot be achieved. Excessive heat load may cause the entire working fluid to undergo a phase change and evaporate to dryness. The fluctuation of the heat load will have a great impact on the stability of the system operation, which is very It is difficult to find a suitable single working fluid for fluctuating heat loads, especially heat loads with large fluctuations, and the filling rate of the working fluid and the vacuum degree in the circulation flow channel are difficult to determine; on the other hand, the input and output performance of the piezoelectric pump is greatly affected by the composition of the fluid. When pure liquid phase fluid flows through the piezoelectric pump, the inlet of the piezoelectric pump can provide a continuous and stable high negative pressure. When gas-liquid two-phase fluid flows through the piezoelectric pump, the negative pressure at the inlet of the piezoelectric pump continues to decrease with the increase of the amount of gas phase working fluid mixed in, and the output performance of the piezoelectric pump decreases accordingly, which greatly weakens the flow limit of the microchannel phase change heat cooling system, thereby causing evaporation or liquid plugging problems, seriously affecting the working stability and reliability of the system.

[0004] In this regard, there are records in the prior art of using heat dissipation devices that directly discharge evaporated gas to the outside to solve the technical indicators such as the working fluid type, liquid filling rate and vacuum degree in the pipeline that are difficult to control in traditional two-phase circulation heat dissipation technology; however, the defect thereof is that: when the heat load of the heat source remains at a high state for a long time, the liquid working fluid of the evaporation device continues to absorb heat and undergoes phase change rapidly. If the formed gaseous working fluid cannot be discharged from the evaporation device in time, the air pressure in the evaporation device will continue to rise. On the one hand, it will cause heat to accumulate in the evaporation device for a long time, the temperature difference between the heat source and the evaporation device will decrease, and the heat transferred from the heat source to the evaporation device will decrease, thereby failing to achieve the purpose of efficient heat dissipation. On the other hand, the continuously rising air pressure may also cause damage to the structural parts of the evaporation device. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: in order to solve the problem that the evaporation device in the prior art is easily damaged due to heat accumulation, resulting in a decrease in heat dissipation efficiency and a high pressure, an open evaporative heat dissipation device and an electronic device including the above-mentioned open evaporative heat dissipation device are provided.

[0006] The technical solution adopted by the present invention to solve the technical problem is: an open evaporative heat dissipation device, comprising:

[0007] An evaporation module having an evaporation space for accommodating a liquid working medium, wherein the evaporation module is used to absorb heat from a heat source, causing the liquid working medium in the evaporation space to undergo a heat absorption phase change and form a gaseous working medium;

[0008] A micro air pump, wherein the inlet of the micro air pump is connected to the evaporation space and is used to evacuate the evaporation space, and the outlet of the micro air pump is connected to the outside world;

[0009] and a waterproof and breathable unit, which is arranged on the communication path between the inlet of the micro air pump and the evaporation space, and is used for preventing liquid working medium from passing through and allowing gaseous working medium to pass through.

[0010] In this solution, a micro air pump is configured on the evaporation module to form a micro vacuum in the evaporation space, which is beneficial to promote the evaporation of the liquid working medium in the evaporation device, improve the heat dissipation efficiency, thereby maintaining efficient heat dissipation and avoiding the problem of damage to the evaporation module caused by the continuous increase in air pressure in the evaporation space.

[0011] Furthermore, the outlet attachment of the micro air pump is provided with a micro fan to ensure the timely discharge of the gaseous working medium, guarantee the heat dissipation performance, and promote the heat absorption phase change of the liquid working medium in the evaporation module.

[0012] Furthermore, an exhaust channel is provided at the outlet of the micro air pump, the micro fan is arranged in the exhaust channel, and the exhaust channel is connected to the outside world at one end away from the micro air pump; thereby the gaseous working medium is discharged in a centralized manner and the discharge direction is constrained.

[0013] Furthermore, the evaporation space is connected to the exhaust channel, and the exhaust channel is connected to the outside world at one end away from the evaporation space. The micro fan is arranged in the exhaust channel, and the exhaust channel has a waterproof and breathable unit on the communication path between the micro fan and the evaporation space. The hydraulic working fluid in the evaporation space will be blocked by the waterproof and breathable unit to prevent it from flowing out of the exhaust channel.

[0014] Furthermore, the evaporation space is connected to a gas leakage channel, on which a safety valve is provided, and one end of the gas leakage channel away from the evaporation space is connected to the outside world; when the gas pressure in the evaporation module reaches a certain set critical value, the safety valve opens and the gaseous working medium is discharged through the gas leakage channel, thereby ensuring that the heat dissipation device operates in a stable and safe state; wherein, the safety valve can control the size of the critical value of the gas pressure in the evaporation module.

[0015] Furthermore, the air release channel is connected to a flexible bag whose volume can be increased or decreased, and the flexible bag is located between the safety valve and the evaporation space; the flexible bag plays a certain buffering role.

[0016] Furthermore, the outer surface of the evaporation module has a heat transfer / heat dissipation component.

[0017] Furthermore, the evaporation module is a microchannel evaporator.

[0018] Furthermore, the waterproof and breathable unit is a waterproof and breathable membrane, a capillary net or a sponge.

[0019] Furthermore, it also includes a liquid supply module and a micro pump, the liquid supply module has a second inlet, a second outlet and a storage space for storing liquid working medium, the second inlet and the second outlet are both connected to the storage space, and the evaporation module has a first inlet connected to the evaporation space;

[0020] The fluid inlet of the micro pump is connected to the second outlet through the second flow channel, and the fluid outlet of the micro pump is connected to the first inlet through the first flow channel;

[0021] By using a micro pump to supply liquid to the evaporation module, the liquid supply volume can be precisely controlled according to changes in the heat load, realizing active control of the heat dissipation process. The entire device has a higher ability to resist thermal flow shock and higher stability.

[0022] By using a micro pump to supply liquid to the evaporation module, the liquid supply volume can be precisely controlled, thereby controlling the thickness of the liquid film on the evaporation surface, reducing thermal resistance, promoting evaporation, and improving heat dissipation efficiency.

[0023] Furthermore, a one-way valve is provided at the second inlet; liquid can only enter the accommodating space from the outside through the second inlet, and the reverse direction is blocked.

[0024] Furthermore, a filter is provided at the second inlet to remove tiny particles, bubbles or other impurities in the liquid, gaseous or gas-liquid two-phase working fluid entering the accommodation space, to avoid accumulation of impurities and blockage, or mixed impurities or bubbles entering the micro pump and affecting the input and output performance of the micro pump.

[0025] Furthermore, the second inlet is connected to a flexible liquid storage bottle; thereby, fluid replenishment is performed through the flexible liquid storage bottle; or, the second inlet is connected to a rigid liquid storage bottle, and the interior of the rigid liquid storage bottle is connected to the outside through a breathable valve; thereby, fluid replenishment is performed through the rigid liquid storage bottle. When the rigid liquid storage bottle is replenished with fluid, the breathable valve can balance the internal and external air pressure to ensure that the liquid in the rigid liquid storage bottle smoothly enters the liquid supply module.

[0026] Furthermore, a gas-isolating and liquid-permeable membrane is provided in the accommodating space to prevent the liquid working medium that is about to flow through the micro pump from mixing with the gaseous working medium, thereby affecting the stable operation of the micro pump.

[0027] Furthermore, a refrigeration component is integrated on the liquid supply module; the refrigeration component cools the surrounding air to prepare liquid working medium to supply liquid to the evaporation module.

[0028] Furthermore, the invention further comprises a flow channel module, wherein the flow channel module is composed of at least one flow channel unit, wherein the first flow channel and the second flow channel are formed in the flow channel unit, and the flow channel module is provided with a first liquid inlet, a second liquid inlet, a first liquid outlet, and a second liquid outlet on the outside, wherein the first liquid inlet and the first liquid outlet are both in communication with the first flow channel, and the second liquid inlet and the second liquid outlet are both in communication with the second flow channel;

[0029] The first liquid inlet is connected to the fluid outlet of the micro pump, the first liquid outlet is connected to the first inlet of the evaporation module, the second liquid inlet is connected to the second outlet of the liquid supply module, and the second liquid outlet is connected to the fluid inlet of the micro pump.

[0030] Furthermore, the micro pump is integrated on the flow channel module to improve the integration level, which is beneficial to the miniaturization of application-end products.

[0031] Furthermore, the evaporation module and the flow channel module are integrally formed, or the evaporation module is fixedly connected to the flow channel module, so as to improve the integration level and facilitate the miniaturization of application-end products.

[0032] Furthermore, the liquid supply module and the flow channel module are integrally formed, or the liquid supply module is fixedly connected to the flow channel module.

[0033] Furthermore, it also includes a swing module, which includes a swing blade and an actuator;

[0034] The swing blade has a fixed portion and a swing portion, the fixed portion is fixed, and the swing portion is suspended and can swing back and forth. The actuator is arranged corresponding to the swing blade, and the actuator provides power for the swing of the swing portion. At least a portion of the evaporation module is arranged on the swing portion of the swing module.

[0035] The swing module is used to drive the evaporation module to swing, which can promote the evaporation of the liquid working medium in the evaporation module, thereby further improving the heat dissipation efficiency.

[0036] The present invention also provides an electronic device, comprising a heat source and a heat dissipation device, wherein the heat dissipation device is an open evaporative heat dissipation device as described above, and the evaporation module is directly or indirectly connected to the heat source.

[0037] The beneficial effects of the present invention are as follows: the open evaporative heat dissipation device of the present invention is equipped with a micro air pump on the evaporation module, which promotes the formation of a micro vacuum in the evaporation space, which is beneficial to promoting the evaporation of the liquid working medium in the evaporation device, improving the heat dissipation efficiency, thereby maintaining efficient heat dissipation, and avoiding the problem of damage to the evaporation module caused by the continuous increase in air pressure in the evaporation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The present invention will be further described below with reference to the accompanying drawings and examples.

[0039] Figure 1 is a schematic diagram of the evaporation module in Example 1;

[0040] Figure 2 is a schematic diagram of an evaporation module of the present invention;

[0041] Figure 3 is a schematic diagram of the open evaporative heat dissipation device in Example 1;

[0042] Figure 4 This is a schematic diagram of the artificial water injection with an integrated one-way valve in the liquid supply module in Example 1;

[0043] Figure 5 This is a schematic diagram of the liquid supply module integrated with the one-way valve in Example 1 injecting water through the external flexible liquid storage bottle;

[0044] Figure 6 Schematic diagram of the liquid supply module in Example 1 preparing liquid working medium by sucking air through the integrated refrigeration component;

[0045] Figure 7 The flow channel unit with the through groove in Example 2;

[0046] Figure 8The flow channel unit with grooves in Example 2;

[0047] Figure 9 The flow channel unit having the through groove and the groove in embodiment 2;

[0048] Figure 10 is a schematic diagram of a flow channel module formed by connecting multiple flow channel units in parallel in Example 2;

[0049] Figure 11 is a schematic diagram of the flow channel module of the integrated micro pump in Example 2;

[0050] Figure 12 This is a schematic diagram of the evaporation module in Example 2 being fixedly connected to the flow channel module;

[0051] Figure 13 This is a schematic diagram of the evaporation module in Example 2 being integrally formed with the flow channel module;

[0052] Figure 14 This is a schematic diagram of the liquid supply module in Example 2 being fixedly connected to the flow channel module;

[0053] Figure 15 This is a schematic diagram of the evaporation module in Example 3 being formed on the swing portion;

[0054] Figure 16 is a schematic diagram of the evaporation module in Example 3 being fixedly connected to the swing portion;

[0055] Figure 17 is a schematic diagram of the flow channel module in Example 3 formed as a swing blade;

[0056] Figure 18 This is a schematic diagram of the flow channel module in Example 3 being fixedly connected to the swing blade;

[0057] Figure 19 is a schematic diagram of the evaporation module in Example 4;

[0058] Figure 20 is a schematic diagram of the evaporation module in Example 5;

[0059] Figure 21 is a schematic diagram of the evaporation module in Example 6;

[0060] In the figure: 1, evaporation module, 101, evaporation space, 102, upper cover, 103, middle layer, 104, lower cover, 105, first inlet;

[0061] 2. Liquid supply module, 201. Second inlet, 202. Second outlet, 203. Accommodation space;

[0062] 3. Micro pump, 301, fluid inlet, 302, fluid outlet;

[0063] 4. Flow channel module, 401, flow channel unit, 4011, panel, 4011a, first liquid inlet, 4011b, second liquid inlet, 4011c, first liquid outlet, 4011d, second liquid outlet, 4012, substrate, 4012a, guide groove;

[0064] 5. Swing module, 501, swing blade, 501a, fixed part, 501b, swing part, 502, actuator;

[0065] 6. First flow channel, 7. Second flow channel, 8. Micro air pump, 9. Waterproof and breathable unit, 10. Micro fan, 11. Discharge channel, 12. Degassing channel, 13. Safety valve, 14. Flexible bag, 15. Heat transfer / heat equalization component, 16. One-way valve, 17. Filter, 18. Flexible liquid storage bottle, 19. Air-barrier and liquid-permeable membrane, 20. Refrigeration component. DETAILED DESCRIPTION

[0066] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams that illustrate the basic structure of the present invention only in a schematic manner. Therefore, they only show components relevant to the present invention, and directions and references (e.g., up, down, left, right, etc.) may be used solely to facilitate the description of features in the drawings. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0067] Example 1

[0068] like Figure 1-6 As shown, an open evaporative heat dissipation device includes:

[0069] The evaporation module 1 has an evaporation space 101 for accommodating a liquid working medium. The evaporation module 1 is used to absorb heat from a heat source, causing the liquid working medium in the evaporation space 101 to absorb heat and undergo phase change to form a gaseous working medium.

[0070] A micro air pump 8, wherein the inlet of the micro air pump 8 is connected to the evaporation space 101 and is used to evacuate the evaporation space 101, and the outlet of the micro air pump 8 is connected to the outside;

[0071] The waterproof and breathable unit 9 is arranged on the communication path between the inlet of the micro air pump 8 and the evaporation space 101. The waterproof and breathable unit 9 is used to prevent the liquid working medium from passing through and allow the gaseous working medium to pass through.

[0072] Specifically, the evaporation module 1 is connected to or adjacent to the heat source, that is, the evaporation module 1 can be directly connected to the heat source, and the heat of the heat source is directly transferred to the evaporation module 1; or the outer surface of the evaporation module 1 has a heat transfer / heat equalization component 15, and the evaporation module 1 is connected to the heat source through the heat transfer / heat equalization component 15; the heat of the heat source is transferred to the evaporation module 1 through the heat transfer / heat equalization component 15. Specifically, the heat transfer / heat equalization component 15 can be a film material with high thermal conductivity applied to the outer surface of the evaporation module 1, such as copper foil, graphene film, etc., or a thermal conductive coating with high thermal conductivity, such as thermal grease, graphene coating, etc. The heat transfer / heat equalization component 15 can also be a heat spreader, such as VC or the liquid cooling heat dissipation module described in Patent No. CN202021646835 "A Liquid Cooling Heat Dissipation Module and Electronic Equipment", which is conducive to the rapid and uniform distribution of heat from the heat source to the evaporation module 1, thereby improving the heat dissipation efficiency.

[0073] The waterproof and breathable unit 9 can be a waterproof and breathable membrane, a capillary network or a sponge; the liquid working medium in the evaporation space 101 absorbs heat and undergoes phase change, and the resulting gaseous working medium can pass through the waterproof and breathable membrane, the capillary network or the sponge, and then enter the micro air pump 8. Under the pumping action of the micro air pump 8, it eventually quickly escapes into the external environment, while the liquid working medium that has not undergone phase change cannot pass through the liquid-isolating breathable membrane, the capillary network or is absorbed and locked by the sponge, thereby avoiding the overflow of the liquid working medium and causing damage to the electronic components of the product. Preferably, the waterproof and breathable unit 9 is a liquid-isolating breathable membrane, which can be a polytetrafluoroethylene membrane. More preferably, a layer of non-woven fabric or other tough fiber breathable material can be pressed at high temperature on the surface of the polytetrafluoroethylene membrane to prevent the polytetrafluoroethylene membrane from being damaged by external pulling or scratching.

[0074] The evaporation module 1 can be a microchannel evaporator, specifically a microchannel evaporator composed of at least one evaporation unit, each evaporation unit is composed of multiple layers of film materials or plates that do not produce physical and chemical reactions with the liquid working medium. The film material used can be a metal material, a polymer material, or a composite material composed of a polymer material and a metal material, which is not limited here. The evaporation unit of the stacked structure, such as Figure 2 As shown, the middle layer 103 constructs an evaporation flow channel, and the upper and lower sides of the evaporation flow channel are sealed by the upper cover plate 102 and the lower cover plate 104 respectively. A first inlet 105 for the liquid working medium to enter the evaporation flow channel is left on the middle layer 103 or the lower cover plate 104. The material of the upper cover plate 102 can be the above-mentioned polytetrafluoroethylene film composited with a non-woven fabric or other fiber breathable tough material layer. The material of the lower cover plate 104 is a waterproof material, which can isolate the liquid working medium from the heat source and prevent the working medium from contacting the heat source device in the form of liquid or gas and causing damage. The lower cover plate 104 can be made of aluminum-plastic film, waterproof composite PET film or metal thin plate, etc., wherein the evaporation flow channel is the above-mentioned evaporation space 101.

[0075] like Figure 3 This embodiment further includes a liquid supply module 2 and a micro pump 3. The liquid supply module 2 has a second inlet 201, a second outlet 202, and a receiving space 203 for receiving a liquid working medium. The second inlet 201 and the second outlet 202 are both connected to the receiving space 203. Liquid working medium, gaseous working medium, or gas-liquid two-phase working medium can enter the receiving space 203 through the second inlet 201. Subsequently, only the liquid working medium flows out through the second outlet 202. The evaporation module 1 has a first inlet 105 connected to the evaporation space 101. Preferably, the second inlet 20 A filter 17 is provided at 1 to remove tiny particles, bubbles or other impurities in the liquid, gaseous or gas-liquid two-phase working medium entering the accommodating space 203, to prevent the accumulation of impurities and blockage of the second outlet 202, and at the same time, to prevent impurities or bubbles from entering the micro pump 3 and affecting the input and output performance of the micro pump 3; further, a gas-proof and liquid-permeable membrane 19 is provided in the accommodating space 203 to prevent the liquid working medium about to flow through the micro pump 3 from mixing with the gaseous working medium and affecting the stable operation of the micro pump 3. The gas-proof and liquid-permeable membrane 19 can specifically be a liquid degassing membrane;

[0076] The fluid inlet 301 of the micro pump 3 is connected to the second outlet 202 through the second flow channel 7; the fluid outlet 302 of the micro pump 3 is connected to the first inlet 105 through the first flow channel 6, and the first flow channel 6 and the second flow channel 7 are formed inside the pipeline;

[0077] The liquid working medium in the liquid supply module 2 can be replenished by manually adding water. Liquid can be directly injected from the second inlet 201 and then the second inlet 201 is blocked; or the liquid can be replenished by connecting the bottle mouth of the flexible liquid storage bottle 18 outside the product to the second inlet 201. Preferably, a one-way valve 16 can be provided at the second inlet 201, so that the liquid can only enter the accommodating space 203 from the outside through the second inlet 201, and the reverse flow is blocked. Figure 4-5 shown.

[0078] It should be noted that the second inlet 201 can also be connected to a rigid liquid storage bottle, which is equipped with a vent valve. Therefore, when the rigid liquid storage bottle is replenished with liquid, the vent valve can balance the internal and external air pressures to ensure that the liquid in the rigid liquid storage bottle can smoothly enter the liquid supply module 2.

[0079] In addition, the liquid supply module 2 can also be integrated with a refrigeration component 20; the refrigeration component 20 cools the surrounding air to prepare a liquid working medium, and the prepared liquid working medium is replenished by the micro pump 3. At this time, the refrigeration component 20 integrated in the liquid supply module 2 can be a semiconductor refrigerator, a micro air compressor, a thermoacoustic refrigerator or other refrigeration equipment, such as Figure 6 shown.

[0080] It is not difficult to understand that the liquid working medium in the liquid supply module 2 is pumped to the evaporation module 1 under the driving force of the micro pump 3. The evaporation module 1 is connected to or adjacent to the heat source. The liquid working medium pumped into the evaporation space 101 absorbs heat and undergoes a phase change. The resulting gaseous working medium, carrying heat, is sucked into the inlet of the micro air pump 8 and flows out from the outlet of the micro air pump 8. Finally, it escapes into the external environment, completing the heat dissipation. Using the micro pump 3 to supply liquid to the evaporation module 1 can accurately control the liquid supply amount according to the change of the heat load, realize active control of the heat dissipation process, and the entire device has a higher resistance to thermal shock and higher stability. At the same time, using the micro pump 3 to supply liquid to the evaporation module 1 can realize precise control of the liquid supply amount, thereby controlling the thickness of the liquid film on the evaporation surface of the evaporator, reducing thermal resistance, promoting evaporation, and improving heat dissipation efficiency.

[0081] In this embodiment, a temperature sensor can be provided on the heat source and / or a pressure sensor can be provided within the evaporation module 1 to monitor the heat source temperature and / or the gas pressure within the evaporation module 1 in real time, and transmit the monitoring information to the drive control portion of the micropump 3. This effectively enables the drive control portion of the micropump 3 to precisely control the input and output performance of the micropump 3 based on the signals detected by the sensors provided on the heat source and / or evaporation module 1, thereby achieving active control of the heat dissipation process. Of course, it should be noted that the number and location of the temperature sensors and / or pressure sensors can be configured according to actual application requirements.

[0082] Example 2

[0083] like Figure 7-9 As shown, the difference between Example 2 and Example 1 is that the first flow channel 6 and the second flow channel 7 are formed in different ways. Specifically, Example 2 further includes a flow channel module 4, which is composed of at least one flow channel unit 401. The first flow channel 6 and the second flow channel 7 are formed in the flow channel unit 401. The flow channel module 4 is provided with a first liquid inlet 4011a, a second liquid inlet 4011b, a first liquid outlet 4011c, and a second liquid outlet 4011d on the outside. The first liquid inlet 4011a and the first liquid outlet 4011c are both in communication with the first flow channel 6, and the second liquid inlet 4011b and the second liquid outlet 4011d are both in communication with the second flow channel 7.

[0084] The first liquid inlet 4011a is connected to the fluid outlet 302 of the micro pump 3, the first liquid outlet 4011c is connected to the first inlet 105 of the evaporation module 1, the second liquid inlet 4011b is connected to the second outlet 202 of the liquid supply module 2, and the second liquid outlet 4011d is connected to the fluid inlet 301 of the micro pump 3.

[0085] Specifically, the flow channel unit 401 includes a flow channel layer, which includes a substrate 4012 and a guide groove 4012a formed on the substrate 4012; a panel layer, which includes at least one panel 4011, and the panel 4011 covers the guide groove 4012a, and the first flow channel 6 and the second flow channel 7 are defined between the guide groove 4012a and the panel layer.

[0086] It should be noted that in this embodiment, there is at least one guide groove 4012a for defining the first flow channel 6 and at least one guide groove 4012a for defining the second flow channel 7. When there are multiple guide grooves 4012a, the multiple guide grooves 4012a can be interconnected to form a flow channel. Of course, the guide groove 4012a defining the first flow channel 6 and the guide groove 4012a defining the second flow channel 7 cannot be interconnected. When the heat dissipation device is equipped with multiple micropumps 3 and there are multiple corresponding first inlet 105, second outlet 202, first liquid inlet 4011a, second liquid inlet 4011b, first liquid outlet 4011c, and second liquid outlet 4011d, the multiple guide grooves 4012a can also be independent of each other, and each guide groove 4012a can form an independent flow channel. The specific layout is not limited.

[0087] The flow channel module 4 in this embodiment has various forms according to the different configurations of the flow channel units 401 that constitute it, as follows:

[0088] First, as Figure 7 As shown, the guide groove 4012a is a through groove, the panel layer comprises two panels 4011, a substrate 4012 is disposed between the two panels 4011, and a first flow channel 6 and a second flow channel 7 are formed between the two panels 4011 and the substrate 4012. Specifically, the flow channel unit 401 is a basic unit formed by sequentially stacking and bonding three layers of thin films or plates, wherein one panel 4011 is provided with a first liquid inlet 4011a, a second liquid inlet 4011b, a first liquid outlet 4011c, and a second liquid outlet 4011d; the guide groove 4012a on the substrate 4012 is a groove formed completely through the panel; and the other panel 4011 is a thin plate without any features. The liquid working medium enters the second flow channel 7 through the second liquid inlet 4011b connected to the second outlet 202, and then enters the pump chamber of the micropump 3 through the second liquid outlet 4011d and the fluid inlet 301 of the micropump 3. Under the pumping action of the micropump 3, the liquid working medium passes through the fluid outlet 302 of the micropump 3, the first liquid inlet 4011a, the first flow channel 6 and the first inlet 105, and is pumped to the evaporation space 101 of the evaporation module 1.

[0089] Second, if Figure 8As shown, the guide groove 4012a is a groove, and the panel layer includes a panel 4011. The panel 4011 and the groove cooperate to form the first flow channel 6 and the second flow channel 7. Specifically, the flow channel unit 401 is a basic unit formed by sequentially stacking and bonding the panel 4011 and the substrate 4012, wherein the panel 4011 is provided with a first liquid inlet 4011a, a second liquid inlet 4011b, a first liquid outlet 4011c, and a second liquid outlet 4011d, and the guide groove 4012a on the substrate 4012 is a groove having a certain depth. The liquid working medium enters the second flow channel 7 through the second liquid inlet 4011b connected to the second outlet 202, and then enters the pump chamber of the micropump 3 through the second liquid outlet 4011d and the fluid inlet 301 of the micropump 3. Under the pumping action of the micropump 3, the liquid working medium passes through the fluid outlet 302 of the micropump 3, the first liquid inlet 4011a, the first flow channel 6 and the first inlet 105, and is pumped to the evaporation space 101 of the evaporation module 1.

[0090] Thirdly, of course, the present invention can also combine the configurations of the flow channel units 401 in the above two flow channel modules 4, which can also play the role of guiding the flow. Figure 9 As shown, the first flow channel 6 and the second flow channel 7 are a flow channel unit 401 formed by sequentially stacking and bonding three layers of film or thin plates. The three layers of film or thin plates are respectively a panel 4011, a substrate 4012 in which the guide groove 4012a is a through groove, and a substrate 4012 in which the guide groove 4012a is a groove. The panel 4011 is provided with a first liquid inlet 4011a, a second liquid inlet 4011b, a first liquid outlet 4011c, and a second liquid outlet 4011d. The panel 4011 may or may not be provided with a groove of a certain depth on the side of the substrate 4012 in which the guide groove 4012a is a through groove. The shape of the groove is consistent with the groove of the through groove, and the through groove has the same shape as the groove.

[0091] Preferably, at least one flow channel unit 401 constituting the flow channel module 4 is a flow channel unit 401 having a through groove, which facilitates the molding and processing of the guide groove 4012a.

[0092] Of course, the flow channel module 4 can also be arranged as a composite of multiple flow channel units 401, and multiple flow channel units 401 can be connected in series to form the flow channel module 4, or can be connected in parallel to form the flow channel module 4. Figure 10 The stacked structure shown is a flow channel module 4 formed by connecting multiple flow channel units 401 in parallel.

[0093] In this embodiment, the substrate 4012 and / or panel 4011 constituting the flow channel unit 401 are thin plates or films. The thin plates or films may be metal materials, polymer materials, or composite materials composed of metal materials and polymer materials. Polymer materials are preferred, such as PP, PPS, PET, etc. When polymer materials are preferentially used in communication equipment or electromagnetic products, they can effectively avoid interference and shielding of communication signals and electromagnetic signals, which is in line with the current application environment of 5G signal transmission. Compared with the use of metal materials, it is more in line with the development trend and design concept of lightweight products. Preferably, the flow channel module 4 is formed into a stacked structure, which is bendable and plastic, and has stronger applicability.

[0094] Preferably, if Figure 11 As shown, the micro pump 3 is integrated on the flow channel module 4 by bonding or welding; this improves the degree of integration and is conducive to the miniaturization of application-end products; it is worth noting that the micro pump 3 can specifically adopt a liquid cooling module, liquid cooling system and power pump in electronic equipment disclosed in Chinese patent publication number CN111818770A, which will not be repeated here; the micro pump 3 of this embodiment is preferably a micro piezoelectric diaphragm pump, which has a stacked structure as a whole and is easy to be highly integrated with the flow channel module 4, without the need for separate pipeline connection, and has a compact structure that meets the installation requirements of narrow spaces.

[0095] Preferably, the micro pump 3 has an external dimension not exceeding 40 mm×40 mm×10 mm (length×width×thickness).

[0096] Preferably, the thickness of the flow channel module 4 is 0.1 mm to 5 mm, and the equivalent diameter of the flow channel is 10 μm to 3 mm. From the above, it can be seen that the micro pump 3 and the flow channel module 4 of this embodiment can be designed as a stacked structure, which is conducive to the miniaturization of the product.

[0097] In this embodiment, the evaporation module 1 and the flow channel module 4 are integrally formed or fixedly connected to improve the integration level, which is conducive to the miniaturization of the application end product. Specifically, the evaporation module 1 can be fixedly connected to the flow channel module 4 by bonding or welding. Figure 12 As shown, the evaporation module 1 is integrally formed with the flow channel module 4, that is, the evaporation module 1 is formed on the flow channel module 4, and the evaporation module 1 is made of the same material as the flow channel module 4 except for the upper cover 102, as shown in FIG. Figure 13 As shown, the integration of the heat dissipation device can be further improved;

[0098] Preferably, the liquid supply module 2 is integrated with the flow channel module 4. Specifically, the liquid supply module 2 can be fixedly connected to the flow channel module 4 by bonding or welding. Figure 14 As shown, the integration of the heat dissipation device can be further improved.

[0099] Preferably, the liquid supply module 2 and the evaporation module 1 are respectively located at two ends of the flow channel module 4 .

[0100] In this embodiment, the flow channel module 4 is introduced. On the one hand, the micro pump 3, evaporation module 1, and liquid supply module 2 can be integrated into the flow channel module 4, making the entire heat dissipation device highly integrated. The flow channel is formed inside the flow channel module 4, without external piping connections. The flow channel design is free from spatial constraints, is more flexible, and has higher space utilization. This is conducive to the miniaturization of application-end products. On the other hand, the flow channel module 4 has an overall laminated structure, constructed of thin films or plates, which can be bent and shaped, and has excellent flexibility. This ensures that the heat dissipation device fits tightly with the surface heat source or body heat source, effectively improving heat transfer and heat dissipation performance.

[0101] Example 3

[0102] like Figure 15-18 As shown, the difference between embodiment 3 and embodiment 1 or 2 is that: it further includes a swing module 5, and the swing module 5 includes a swing blade 501 and an actuator 502;

[0103] The pendulum blade 501 has a fixed portion 501a and a swinging portion 501b. The fixed portion 501a is fixed, and the swinging portion 501b is suspended and can swing back and forth. The actuator 502 is arranged corresponding to the pendulum blade 501, and the actuator 502 provides power for the swinging portion 501b to swing.

[0104] It is worth noting that the cooperation structure between the swing blade 501 and the actuator 502 of the swing module 5 can specifically adopt the cooperation structure between the swing blade 501 and the actuator 502 in the swing type heat sink disclosed in Chinese Patent Publication No. CN214481933U, and will not be repeated here.

[0105] At least part or all of the evaporation module 1 is arranged on the swinging portion 501b of the swing blade 501, that is, the reciprocating swing of the swinging portion 501b at least drives the evaporation module 1 to swing back and forth together, so as to promote the heat absorption phase change of the liquid working medium in the evaporation module 1 and further improve the heat dissipation efficiency.

[0106] When the heat dissipation device does not have the flow channel module 4, the evaporation module 1 and the swing module 5 are integrally formed, or the evaporation module 1 and the swing module 5 are fixedly connected. Specifically, the structural components of the evaporation module 1 and at least the swing blade 501 of the swing module 5 are made of the same material, and the evaporation module 1 is partially or completely formed on the swing portion 501b. Figure 15 As shown; the evaporation module 1 is formed separately, and the evaporation module 1 is fixedly connected to the swing portion 501b by bonding or welding, as shown Figure 16 shown.

[0107] When the flow channel module 4 is introduced into the heat dissipation device, the flow channel module 4 is integrally formed with the swing blade 501, or the flow channel module 4 is fixedly connected to at least one side of the swing blade 501 in the thickness direction;

[0108] Given that the flow channel module 4 and the swing blade 501 are integrally formed, that is, the flow channel module 4 itself is formed as the swing blade 501, preferably, the micro pump 3 is integrated into the swing blade 501; at least part or all of the evaporation module 1 is formed on the swing portion 501b of the swing blade 501 or is fixedly connected to the swing portion 501b of the swing blade 501. Further preferably, the evaporation module 1 is formed on the swing portion 501b of the swing blade 501; further preferably, the liquid supply module 2 is fixed to the fixed portion 501a of the swing blade 501, as shown in FIG. Figure 17 shown.

[0109] In view of the fact that the flow channel module 4 is fixedly connected to at least one side in the thickness direction of the pendulum blade 501, it can be understood that a single flow channel module 4 is fixedly connected to one side in the thickness direction of the pendulum blade 501, and multiple flow channel modules 4 are fixedly connected to one side or both sides in the thickness direction of the pendulum blade 501. In this embodiment, a single flow channel module 4 is used for illustration, but it is not a limitation. Preferably, the micro pump 3 is integrated on the pendulum blade 501; at least part or all of the evaporation module 1 is formed on the swinging portion 501b of the pendulum blade 501 or is fixedly connected to the swinging portion 501b of the pendulum blade 501. Further preferably, the evaporation module 1 is formed on the swinging portion 501b of the pendulum blade 501; further preferably, the liquid supply module 2 is fixed to the fixed portion 501a of the pendulum blade 501, as shown in FIG. Figure 18 shown.

[0110] Example 4

[0111] like Figure 19 As shown, the difference between embodiment 4 and embodiments 1, 2 or 3 is that a micro fan 10 is provided near the outlet of the micro air pump 8;

[0112] An exhaust channel 11 is provided at the outlet of the micro air pump 8, and the micro fan 10 is provided in the exhaust channel 11. The exhaust channel 11 is connected to the outside at one end away from the micro air pump 8. That is, the micro air pump 8 and the micro fan 10 are arranged in series; thereby, the gaseous working medium is discharged in a centralized manner and the discharge direction is restricted;

[0113] That is to say, the gaseous working medium in the evaporation space 101 enters the micro air pump 8 after passing through the waterproof and breathable unit 9, and then enters the exhaust channel 11 from the outlet of the micro air pump 8. The micro fan 10 will promote the timely discharge of the gaseous working medium in the exhaust channel 11 to the external environment, ensuring the heat dissipation performance, which is beneficial to the heat absorption phase change of the liquid working medium in the evaporation module 1.

[0114] Example 5

[0115] like Figure 20As shown, the difference between Example 5 and Example 4 is that: the evaporation space 101 is connected to the discharge channel 11, the end of the discharge channel 11 away from the evaporation space 101 is connected to the outside, and the micro fan 10 is arranged in the discharge channel 11. That is, the micro air pump 8 and the micro fan 10 are arranged in parallel. The discharge channel 11 is located on the communication path between the position where the micro fan 10 is located and the evaporation space 101. The waterproof and breathable unit 9 is blocked by the waterproof and breathable unit 9 to prevent it from flowing out of the discharge channel 11;

[0116] It is worth noting that, for the sake of convenience, the communication path between the location of the micro fan 10 and the evaporation space 101 is the first communication path, and the communication path between the inlet of the micro air pump 8 and the evaporation space 101 is the second communication path. When the first communication path and the second communication path partially overlap at one end close to the evaporation space 101, the waterproof breathable unit 9 can be set at the overlap of the first communication path and the second communication path to achieve a shared waterproof breathable unit 9; the first communication path and the second communication path can also be independent and do not overlap with each other. In this case, each of them needs to be equipped with a waterproof breathable unit 9;

[0117] That is to say, the gaseous working medium in the evaporation space 101 forms two paths after passing through the waterproof and breathable unit 9. One path enters the micro air pump 8 and is discharged to the outside from the outlet of the micro air pump 8, prompting the formation of a micro vacuum in the evaporation space 101, which is beneficial to promoting the evaporation of the liquid working medium in the evaporation device, improving the heat dissipation efficiency, and thus maintaining efficient heat dissipation; the other path enters the exhaust channel 11, and the micro fan 10 will promote the timely discharge of the gaseous working medium in the exhaust channel 11 to the external environment, ensuring the heat dissipation performance, which is beneficial to the heat absorption phase change of the liquid working medium in the evaporation module 1.

[0118] Example 6

[0119] like Figure 21 As shown, the difference between Example 6 and Example 4 or 5 is that: the evaporation space 101 is connected to the air leakage channel 12, the air leakage channel 12 is provided with a safety valve 13, and the end thereof away from the evaporation space 101 is connected to the outside;

[0120] The air release channel 12 is connected to a flexible bag 14 whose volume can be increased or decreased. The flexible bag 14 is located between the safety valve 13 and the evaporation space 101.

[0121] When the gas pressure in the evaporation module 1 reaches a certain set critical value, the safety valve 13 opens to allow the gaseous working medium to be discharged through the bleed channel 12, ensuring that the heat dissipation device operates in a stable and safe state; wherein, the safety valve 13 can control the size of the critical value of the gas pressure in the evaporation module 1; the flexible bag 14 plays a certain buffering role when the bleed channel 12 is discharged.

[0122] The outlets of the air leakage channel 12 can converge into the exhaust channel 11 , thereby achieving centralized exhaust from the outlets of the exhaust channel 11 to the outside.

[0123] Example 7

[0124] An electronic device includes a heat source and a heat dissipation device. The heat dissipation device adopts the open evaporation heat dissipation device in any one of the above embodiments 1-6. The evaporation module 1 is directly or indirectly connected to the heat source.

[0125] The above description of the preferred embodiments of the present invention is intended to serve as a guide. Based on the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. An open evaporative heat dissipation device, characterized in that: include: An evaporation module (1) has an evaporation space (101) for accommodating a liquid working medium, wherein the evaporation module (1) is used to absorb heat from a heat source, causing the liquid working medium in the evaporation space (101) to absorb heat and undergo phase change to form a gaseous working medium; A micro air pump (8), wherein the inlet of the micro air pump (8) is connected to the evaporation space (101) and is used to evacuate the evaporation space (101), and the outlet of the micro air pump (8) is connected to the outside world; and a waterproof and breathable unit (9) disposed on a communication path between the inlet of the micro air pump (8) and the evaporation space (101), the waterproof and breathable unit (9) being used to prevent liquid working medium from passing through and to allow gaseous working medium to pass through; A micro fan (10) is provided near the outlet of the micro air pump (8); The evaporation space (101) is connected to a gas leakage channel (12), a safety valve (13) is provided on the gas leakage channel (12), and an end thereof away from the evaporation space (101) is connected to the outside world; When the gas pressure in the evaporation module (1) reaches a certain set critical value, the safety valve (13) opens to allow the gaseous working medium to be discharged through the discharge channel (12); wherein the critical value of the gas pressure in the evaporation module (1) can be controlled by the safety valve (13).

2. The open evaporative heat dissipation device according to claim 1, characterized in that: An exhaust channel (11) is provided at the outlet of the micro air pump (8), the micro fan (10) is arranged in the exhaust channel (11), and the exhaust channel (11) is communicated with the outside at one end away from the micro air pump (8).

3. The open evaporative heat dissipation device according to claim 1, characterized in that: The evaporation space (101) is connected to the discharge channel (11), and one end of the discharge channel (11) away from the evaporation space (101) is connected to the outside world. The micro fan (10) is arranged in the discharge channel (11), and the discharge channel (11) is provided with a waterproof and breathable unit (9) on the communication path between the location of the micro fan (10) and the evaporation space (101).

4. The open evaporative heat dissipation device according to claim 1, characterized in that: The air release channel (12) is connected to a flexible bag (14) whose volume can be increased or decreased, and the flexible bag (14) is located between the safety valve (13) and the evaporation space (101).

5. The open evaporative heat dissipation device according to claim 1, characterized in that: The outer surface of the evaporation module (1) is provided with a heat transfer / heat equalization component (15).

6. The open evaporative heat dissipation device according to claim 1, characterized in that: The evaporation module (1) is a microchannel evaporator.

7. The open evaporative heat dissipation device according to claim 1, characterized in that: The waterproof and breathable unit (9) is a waterproof and breathable membrane, a capillary network or a sponge.

8. The open evaporative heat dissipation device according to claim 1, characterized in that: It also includes a liquid supply module (2) and a micro pump (3), wherein the liquid supply module (2) has a second inlet (201), a second outlet (202), and a receiving space (203) for receiving a liquid working medium, and the second inlet (201) and the second outlet (202) are both in communication with the receiving space (203), and the evaporation module (1) has a first inlet (105) in communication with the evaporation space (101); The fluid inlet (301) of the micro pump (3) is connected to the second outlet (202) via the second flow channel (7), and the fluid outlet (302) of the micro pump (3) is connected to the first inlet (105) via the first flow channel (6).

9. The open evaporative heat dissipation device according to claim 8, characterized in that: A one-way valve (16) is provided at the second inlet (201).

10. The open evaporative heat dissipation device according to claim 8, characterized in that: A filter (17) is provided at the second inlet (201).

11. The open evaporative heat dissipation device according to claim 8, characterized in that: The second inlet (201) is connected to a flexible liquid storage bottle (18); alternatively, the second inlet (201) is connected to a rigid liquid storage bottle, and the interior of the rigid liquid storage bottle is connected to the outside through a breathable valve.

12. The open evaporative heat dissipation device according to claim 8, characterized in that: An air-insulating and liquid-permeable membrane (19) is provided in the accommodating space (203).

13. The open evaporative heat dissipation device according to claim 8, characterized in that: A refrigeration component (20) is integrated on the liquid supply module (2).

14. The open evaporative heat dissipation device according to claim 8, characterized in that: The flow channel module (4) is further comprised of at least one flow channel unit (401), wherein the first flow channel (6) and the second flow channel (7) are formed in the flow channel unit (401), and the flow channel module (4) is provided with a first liquid inlet (4011a), a second liquid inlet (4011b), a first liquid outlet (4011c), and a second liquid outlet (4011d) on the outside, wherein the first liquid inlet (4011a) and the first liquid outlet (4011c) are both in communication with the first flow channel (6), and the second liquid inlet (4011b) and the second liquid outlet (4011d) are both in communication with the second flow channel (7); The first liquid inlet (4011a) is in communication with the fluid outlet (302) of the micro pump (3), the first liquid outlet (4011c) is in communication with the first inlet (105) of the evaporation module (1), the second liquid inlet (4011b) is in communication with the second outlet (202) of the liquid supply module (2), and the second liquid outlet (4011d) is in communication with the fluid inlet (301) of the micro pump (3).

15. The open evaporative heat dissipation device according to claim 14, characterized in that: The micro pump (3) is integrated on the flow channel module (4).

16. The open evaporative heat dissipation device according to claim 14, characterized in that: The evaporation module (1) and the flow channel module (4) are integrally formed, or the evaporation module (1) is fixedly connected to the flow channel module (4).

17. The open evaporative heat dissipation device according to claim 14, characterized in that: The liquid supply module (2) and the flow channel module (4) are integrally formed, or the liquid supply module (2) is fixedly connected to the flow channel module (4).

18. The open evaporative heat dissipation device according to claim 1, characterized in that: It also includes a swing module (5), wherein the swing module (5) includes a swing blade (501) and an actuator (502); The swing blade (501) comprises a fixed portion (501a) and a swing portion (501b), wherein the fixed portion (501a) is fixed, and the swing portion (501b) is suspended and can swing back and forth. The actuator (502) is arranged corresponding to the swing blade (501), and the actuator (502) provides power for the swing of the swing portion (501b). At least a portion of the evaporation module (1) is arranged on the swing portion (501b) of the swing module (5).

19. An electronic device, characterized in that: It comprises a heat source and a heat dissipation device, wherein the heat dissipation device adopts an open evaporative heat dissipation device as described in any one of claims 1 to 18, and the evaporation module (1) is directly or indirectly connected to the heat source.

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