Wireless test system for testing microelectronic devices with integrated antennas

Abstract

The present invention provides a wireless test system, comprising: a load board having an upper surface and a lower surface, wherein the load board comprises a test antenna arranged on the load board; a slot for receiving a device under test DUT having an antenna structure, the slot being arranged on the upper surface of the load board, wherein the antenna structure corresponds to the test antenna; a processor for picking up the DUT and transferring the DUT to the slot, wherein the processor comprises a fixture for holding and pressing the DUT, during the test, the fixture is grounded and acts as a ground reflector, and the ground reflector reflects the radiation pattern of the DUT, so that the radiation pattern of the DUT is reversed from an upward direction to a downward direction toward the test antenna. The technical solution of the present invention can reduce the path loss between the antenna structure of the DUT and the test antenna.

Description

Technical Field

[0001] The present invention relates to an over-the-air (OTA) test system for semiconductor devices in wireless communication equipment. The semiconductor devices may be, for example, millimeter-wave (mmW) based antenna-in-package (AiP) devices. Background Art

[0002] As the demand for mmW-based RF systems increases, there is a corresponding interest in integrating these RF systems on silicon-based integrated circuits rather than using discrete III / V-based semiconductor components. Millimeter wave frequencies are generally defined between about 30 GHz and 300 GHz. Common applications for mmWave-based RF systems include, for example, automotive radar and high-frequency communication systems.

[0003] Semiconductor devices that have undergone complex processing are subjected to various types of electrical tests to test their characteristics and their defects. RF automatic test equipment is usually used to test the radio frequency (RF) of microelectronic devices (such as chip packages with integrated RF transceiver circuits). In order to test such chip packages with integrated antennas or wireless devices under test (DUT), a load board conductively connected to the RF instrument circuit is usually used. The RF instrument circuit is arranged under the load board. The load board can be coupled to a socket to receive the chip package. The processor arm is used to pick up the DUT and place the DUT on the socket.

[0004] However, the final test of mmW-based AiP devices using traditional RF automatic test equipment is problematic. For example, the clamp of the handler arm of traditional RF automatic test equipment may reduce or block the radiation of the DUT. The handler arm may hinder the external test antenna setup. To avoid this, special and complex mechanical design is required. In addition, since the RF instrument circuit is set under the load board, a long cable is required to connect the test antenna. The long cable hinders the movement of the handler arm. The long distance and long cable between the DUT antenna and the test antenna result in significant signal path loss, which limits the maximum excitation power (stim power) entering the DUT and reduces the test coverage. Summary of the invention

[0005] An object of the present invention is to provide an improved Over-the-Air (OTA) wireless test system with high accuracy and high performance.

[0006] According to one aspect of the present invention, a wireless test system includes a load board having an upper surface and a lower surface. The load board has a test antenna arranged on the load board. A slot for receiving a device under test (DUT) having an antenna structure is arranged on the upper surface of the load board. The antenna structure is aligned with the test antenna. The wireless test system also includes a handler for picking up the DUT and transferring the DUT to the slot. The handler has a pressing component for holding and pressing the DUT. The pressing component is grounded during testing and acts as a grounded reflector to reflect the radiation pattern of the DUT so that the radiation pattern of the DUT is reversed from an upward direction to a downward direction toward the test antenna. In various embodiments of the present invention, the pressing component may also be referred to as a clamp, for example, in the subsequent Figure 1 The fixture in.

[0007] According to some embodiments, the RF instrumentation circuit is disposed beneath the load board.

[0008] According to some embodiments, the load board is electrically connected to the RF instrumentation circuitry via a cable or a connector.

[0009] According to some embodiments, the test antenna is electrically coupled to the RF instrument circuitry via a cable.

[0010] According to some embodiments, the connection between the test antenna and the RF instrument circuit is achieved through wireless transmission.

[0011] According to some embodiments, an air-purge cover is disposed below the load plate, the air-purge cover defining an inner space filled with room temperature dry air.

[0012] According to some embodiments, the RF instrument circuit is disposed in the interior space.

[0013] According to some embodiments, the DUT includes a packaged semiconductor die or integrated circuit module having an integrated mmW antenna structure therein.

[0014] According to some embodiments, the DUT includes a system-on-chip (SoC), an antenna-in-package (AiP), a system-in-a-package (SiP), a package-on-package (PoP), or a module with at least one integrated RF die.

[0015] According to some embodiments, the pressing member is a metal pressing member.

[0016] According to some embodiments, the load board includes first and second connection pads on an upper surface of the load board. According to some embodiments, the socket includes a plurality of first spring pins for providing temporary conductive connections to the DUT and the first connection pads on the load board.

[0017] According to some embodiments, during testing, a DUT having an antenna structure facing (also referred to as toward) the pressing component is held against the first spring pins such that the plurality of first spring pins are aligned with and electrically connected to corresponding contact points on the lower surface of the DUT.

[0018] According to some embodiments, at least some of the first plurality of spring pins are disposed around the test antenna to define a wave-guiding channel in the slot and directly above the test antenna.

[0019] According to some embodiments, the waveguide channel is a through hole in the slot.

[0020] According to some embodiments, the wireless testing system further includes a plurality of second pogo pins disposed in the vertical wall portion of the slot.

[0021] According to some embodiments, a lower end of each of the plurality of second spring pins is electrically connected to a second connection pad on the load board, and an upper end of each of the plurality of second spring pins is electrically connected to the pressing member.

[0022] According to some embodiments, the second connection pad is a ground pad, and the pressing member is grounded through the second connection pad and the plurality of second spring pins.

[0023] According to another aspect of the present invention, a wireless test system includes a load board having an upper surface and a lower surface, for receiving a slot of a device under test (DUT) having an antenna structure, wherein the slot is arranged on the upper surface of the load board, and the wireless test system also includes a processor for picking up the DUT and transferring the DUT to the slot. The processor includes a pressing component for holding and pressing the DUT. The substrate having a test circuit is embedded in the pressing component.

[0024] According to some embodiments, the substrate is sandwiched by the upper and lower portions of the pressing member, and the lower portion of the pressing member is located between the substrate and the top surface of the DUT.

[0025] According to some embodiments, the test circuit includes a test antenna, a detector, a transceiver, an upconverter and / or a downconverter.

[0026] According to some embodiments, a load board includes a first connection pad and a second connection pad located on an upper surface of the load board.

[0027] According to some embodiments, the socket includes a first plurality of spring pins for providing temporary conductive connections to the DUT and first connection pads on the load board.

[0028] According to some embodiments, during testing, the DUT having the antenna structure facing the pressing component is held against the first spring pins such that the plurality of first spring pins are aligned with and electrically connected to corresponding contact points on the lower surface of the DUT.

[0029] According to some embodiments, the wireless testing system further includes a plurality of second pogo pins disposed in the vertical wall portion of the slot.

[0030] According to some embodiments, a lower end of each of the plurality of second spring pins is electrically connected to a second connection pad on the load board, and an upper end of each of the plurality of second spring pins is electrically connected to the substrate.

[0031] According to another aspect of the present invention, a wireless test system includes a load board having an upper surface and a lower surface. The load board includes a test antenna disposed on the load board. A slot is disposed on the upper surface of the load board. A flipped device under test (DUT) having an antenna structure is mounted in a cavity of the slot. The wireless test system also includes a processor for picking up the DUT and transferring the DUT to the slot. The processor includes a pressing component for holding and pressing the DUT. The substrate is embedded in the pressing component.

[0032] According to some embodiments, the substrate is sandwiched by an upper portion and a lower portion of the pressing member, and wherein the lower portion is located between the substrate and the DUT.

[0033] According to some embodiments, the substrate is sandwiched by an upper portion and a lower portion of the pressing member, and wherein the lower portion is located between the substrate and the DUT.

[0034] According to some embodiments, the wireless test system further includes a plurality of first spring pins in the lower portion for providing temporary conductive connections with the DUT and the substrate.

[0035] According to some embodiments, the wireless testing system further includes a plurality of second pogo pins disposed in the vertical wall portion of the slot.

[0036] According to some embodiments, a lower end of each of the plurality of second spring pins is electrically connected to a second connection pad on the load board, and an upper end of each of the plurality of second spring pins is electrically connected to the substrate.

[0037] According to another aspect of the present invention, a wireless test system includes a load board having an upper surface and a lower surface. A slot for receiving a device under test (DUT) having an antenna structure is arranged on the upper surface of the load board. The wireless test system also includes a processor for picking up the DUT and transferring the DUT to the slot. The processor includes a pressing component for holding and pressing the DUT. The waveguide channel is at least arranged in the slot.

[0038] According to some embodiments, the waveguide channel is provided in the pressing member and in the slot.

[0039] According to some embodiments, the waveguide channel is disposed in the slot and in the load plate.

[0040] According to some embodiments, the waveguide channel is disposed in the press member, in the slot and in the load plate.

[0041] According to some embodiments, the wireless testing system further includes an air purge cover disposed below the load board, the air purge cover defining an inner space filled with room temperature dry air.

[0042] According to some embodiments, the wireless test system further includes a radio frequency (RF) instrumentation circuit disposed below the load board and in the interior space.

[0043] According to some embodiments, the wireless test system further includes an adapter secured to a lower surface of the load board, and the adapter is connected to the RF instrument circuit via a coaxial cable.

[0044] According to some embodiments, a distal end of the waveguide channel is aligned with the adapter.

[0045] The technical solution of the present invention can reduce the path loss between the antenna structure of the DUT and the test antenna. These and other objects of the present invention will undoubtedly become apparent to those skilled in the art after reading the following detailed description of the preferred embodiments shown in the various drawings and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

[0047] Figure 1 is a schematic cross-sectional view of an exemplary OTA mmW test system for testing a DUT with an integrated mmW antenna structure according to an embodiment of the present invention;

[0048] Figure 2is a schematic cross-sectional view of a wireless test system for testing a DUT having an integrated mmW antenna structure according to another embodiment of the present invention;

[0049] Figure 3 is a schematic cross-sectional view of a wireless test system for testing a DUT having an integrated mmW antenna structure according to another embodiment of the present invention; and

[0050] Figure 4 is a schematic cross-sectional view of a wireless test system for testing a DUT with an integrated mmW antenna structure according to yet another embodiment of the present invention. DETAILED DESCRIPTION

[0051] In the following detailed description of the present invention, reference is made to the accompanying drawings, which form a part of the present invention and in which are shown by way of illustration certain preferred embodiments in which the present invention may be practiced. These embodiments are described in appropriate detail to enable those skilled in the art to implement them, and it should be understood that other embodiments may be used and mechanical, structural, and procedural changes may be made without departing from the spirit and scope of the present application. The subsequent detailed description should not be construed as limiting the present invention, the scope of which shall be defined by the appended claims.

[0052] It should be understood that although the terms first, second, third, primary, secondary, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts are not limited to use of these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the creative concept of the present invention, the first or primary element, component, region, layer or part discussed later may also be referred to as the second or secondary element, component, region, layer or part.

[0053] Spatially relative terms such as "below", "under...", "lower than", "below...", "above", "above", "on...", etc. may be used to simply describe the relationship of one element or feature to another element or feature. It should be understood that in addition to the directions described in the figures, spatially relative terms also cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "under..." or "under..." or "under..." relative to other elements or features will be oriented to be above or above other elements or features. Therefore, the exemplary terms "under..." and "under..." "below" can cover both above and below directions. The device can be oriented in any way (rotated 90 degrees or in other directions) and the spatially relative descriptors used are interpreted accordingly. In addition, it should be understood that when a layer is referred to as being between two layers, it may be that the layer is the only layer between the two layers, or there may also be one or more intervening layers.

[0054] The terms described herein are only used to describe specific embodiments and are not intended to limit the present invention. If not explicitly stated otherwise herein, the singular forms "a", "an" and "the" used herein are also intended to include plural forms. It will be further understood that when used in this specification, the terms "include" and / or "comprise" specify the presence of the features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items and may be abbreviated as " / ".

[0055] It will be understood that when an element or layer is referred to as being “on / over,” “connected to,” “coupled to,” or “adjacent to” another element or layer, it can be directly above, connected to, coupled to, adjacent to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on / over,” “directly connected to,” “directly coupled to,” or “immediately adjacent to” another element or layer, there are no intervening elements or layers present.

[0056] It should be noted that: (i) like features will be indicated by like reference numerals throughout the figures and will not necessarily be described in detail in each figure in which they appear, and (ii) a series of figures may show different aspects of a single item, with each aspect being associated with various reference numerals that may appear throughout the sequence, or with reference numerals that appear only in selected figures of the sequence.

[0057] Wireless microelectronic devices typically undergo a variety of tests to ensure adequate performance and verify their RF functionality. Some tests are mandated by standards, while others are performed as part of product development and validation. A specific category of testing is testing the over-the-air (OTA) performance of communications between one or more wireless transmitters and receivers.

[0058] When a radio frequency signal is transmitted from a transmitter to a receiver, the signal propagates in the radio channel along one or more paths with different arrival angles, signal delays, polarizations, and powers, which results in fades of different durations and strengths in the received signal. In addition, noise and interference due to other transmitters can interfere with the radio connection.

[0059] The present invention relates to wireless testing of semiconductor integrated circuit devices, such as millimeter wave (mmW) based in-package antenna (AiP) devices. An improved OTA wireless test system or OTA mmW test system is provided to address the shortcomings and deficiencies of prior art wireless test systems. The present invention is particularly suitable for OTA testing or radiation testing of RF microelectronic devices under test or integrated circuit devices under test with integrated mmW antenna structures. The integrated antenna structure can have multiple elements designed in an array, which can be driven and / or sensed by an integrated RF transmitter and / or receiver circuit. The integrated antenna structure can operate or have a radiation field pattern in the range of 20 GHz to 300 GHz (millimeter wave frequencies). For example, the antenna structure can operate in a frequency band of approximately 24 GHz, 60 GHz, 77 GHz or 79 GHz, but is not limited thereto.

[0060] In a non-limiting example, the configuration depicted by the figures may be applicable to wireless testing of a DUT or AiP having a transmitter that generates electromagnetic waves in the radio or microwave domain, a transmitting antenna, a receiving antenna, a receiver, and a processor for determining properties of an object. For example, radio waves from the transmitter reflect from an object and return to the receiver, providing information about the position and velocity of the object.

[0061] Figure 1 FIG. 1 is a schematic cross-sectional view of an exemplary OTA wireless test system for testing a DUT having an integrated mmW antenna structure according to an embodiment of the present invention. Figure 1 As shown, an OTA wireless test system (hereinafter referred to as a "wireless test system") 1a includes a load board 10, such as a printed wiring board or printed circuit board having an upper surface 10a and a lower surface 10b. The load board 10 may also be referred to as a test board, which generally includes a core (e.g., an FR4 copper-clad laminate core), a plurality of dielectric build layers, and traces on opposite surfaces of the core. The traces in different layers of the printed circuit board are electrically connected to each other through plated through holes.

[0062] The load board 10 may be mechanically connected to an air purge cover (or housing) 20 so as to define an interior space 210 that may be filled with room temperature dry air. According to one embodiment, an RF instrument circuit 220 may be installed in the interior space 210, but is not limited thereto. According to one embodiment, the load board 10 may contain a customized circuit dedicated to testing a specific DUT 100. For example, the load board 10 may be a customized RF load board that has been specifically modified for the radiation, electrical, and physical properties of a specific DUT 100. According to one embodiment, for example, the load board 10 is electrically connected to the RF instrument circuit 220 via an RF cable and / or connector. It should be understood that the load board 10 may also be connected to a DC power supply, ground, digital input / output, and / or a computer, which are not shown for simplicity.

[0063] According to one embodiment, the DUT 100 may be a packaged semiconductor die or integrated circuit module having an integrated mmW antenna structure 101 (hereinafter referred to as an “antenna structure”). The DUT 100 may be a system-on-chip (SoC), antenna-in-package (AiP), system-in-a-package (SiP), package-on-package (PoP), or module having at least one integrated RF die 102. The RF die 102 may have on-chip RF transmitter and / or receiver circuitry associated with and coupled to the antenna structure 101.

[0064] According to one embodiment, the socket 30 is provided on the upper surface 10a of the load board 10 to receive the DUT 100 that has been picked up and transferred thereto by the automatic handler 50. According to one embodiment, the socket (e.g., a custom test socket) may include a cavity 310 that receives and accommodates the DUT 100 and at least a lower portion of a fixture 502 of the handler 50 that directly holds and presses the DUT 100. According to one embodiment, the DUT 100 may be mounted in the socket 30 by the automatic handler 50 that may pick up the DUT 100 and place it on the socket 30. In some embodiments, the automatic handler 50 may grip or hold a combination of the DUT 100 and the socket 30, and may mount them on the load board 10.

[0065] Once the DUT 100 has been installed in the socket 30, the power and signal pins of the DUT 100 are conductively coupled to the DUT side of the RF instrument circuit 220. A computer (not shown) is connected to the tester side of the RF instrument circuit 220. The computer then runs software to perform a test procedure in which the RF instrument circuit 220 is commanded to stimulate the DUT 100 and capture the RF output response of the DUT, which is then stored in digital form.

[0066] According to one embodiment, the fixture 502 may be made of metal or a metal alloy. The slot 30 is used to electrically connect the metal wire or contact pad of the load board 10 with the contact point 106 of the DUT 100. For example, the slot 30 includes a plurality of spring pins 301 for providing a temporary conductive connection with the DUT 100 and the connection pad 111 on the load board 10. During testing, the DUT 100 has the antenna structures 101a and 101b facing the fixture 502, and the DUT 100 is held against the spring pins 301 so that these spring pins 301 are aligned with and electrically connected to the corresponding contact points 106 on the lower surface of the DUT 100. According to one embodiment, a plurality of spring pins 302 are provided in the vertical wall portion 30a of the slot 30. One end (lower end) of each spring pin 302 is electrically connected to the connection pad 112 on the load board 10. The other end (upper end) of each spring pin 302 is electrically connected to the fixture 502.

[0067] According to one embodiment, the load board 10 further includes at least one test antenna 121. Figure 1 , for the purpose of illustration, two test antennas 121a and 121b corresponding to RF transmit (Tx) and RF receive (Rx) signals are shown. According to one embodiment, the connection pad 112 and the test antenna 121 may be fabricated in the top metal layer of the load board 10, but are not limited thereto. In some embodiments, the connection pad 112 and the test antenna 121 may be fabricated in the inner metal layer or the bottom metal layer of the load board 10. According to one embodiment, the two test antennas 121a and 121b may be electrically coupled to the RF instrument circuit 220 via cables 240a and 240b, respectively. In some embodiments, the connection between the test antenna 121 and the RF instrument circuit 220 may be achieved by wireless transmission instead of the cable 240.

[0068] According to one embodiment, the connection pad 112 can be a ground pad, and the fixture 502 can be grounded during testing. By providing such a configuration, the metal fixture 502 can be used as a ground reflector, which reflects the radiation pattern of the DUT 100, so that the radiation pattern of the DUT 100 is reversed from the upward direction to the downward direction (as shown by arrow 610).

[0069] According to one embodiment of the present invention, the spring pins 301 and 302 may be made of a metal material, such as copper, but not limited thereto. According to one embodiment, at least some of the spring pins 301 may be designed to surround each of the two test antennas 121a and 121b so as to define waveguide channels C1 and C2 (also referred to as defining waveguide channels C1 and C2) directly above the two test antennas 121a and 121b, respectively. According to one embodiment, the waveguide channels C1 and C2 are two through openings or through holes 330a and 330b in the slot 30. The through openings or through holes 330a and 330b are surrounded by at least some of the spring pins 301 so as to reduce the path loss between the DUT 100 and the test antenna 121. Therefore, the antenna structure 101 corresponds to the test antenna 121. In other embodiments, the antenna structure 101 is aligned with the test antenna 121.

[0070] Figure 2 FIG. 1 is a schematic cross-sectional view of a wireless test system for testing a DUT having an integrated mmW antenna structure according to another embodiment of the present invention. Figure 2 As shown, the wireless test system 1b includes a load board 10, such as a printed wiring board or printed circuit board having an upper surface 10a and a lower surface 10b. The load board 10 generally includes a core (e.g., an FR4 copper-clad laminate core), a plurality of dielectric building layers, and traces on opposite surfaces of the core. The traces in different layers of the printed circuit board are electrically connected to each other through plated through holes.

[0071] The load board 10 may be mechanically connected to an air purge cover or housing 20 so as to define an interior space 210 that may be filled with room temperature dry air. According to one embodiment, the load board 10 may contain custom circuitry dedicated to testing a particular DUT 100. For example, the load board 10 may be a custom RF load board that has been specifically modified for the radiation, electrical, and physical characteristics of a particular DUT 100. It should be understood that the load board 10 may also be connected to a DC power source, ground, digital input / output, and / or a computer, which are not shown for simplicity.

[0072] According to one embodiment, the DUT 100 may be a packaged semiconductor die or integrated circuit module with an integrated mmW antenna structure 101. The DUT 100 may be a system-on-chip (SoC), antenna-in-package (AiP), system-in-a-package (SiP), package-on-package (PoP), or module with at least one integrated RF die 102. The RF die 102 may have on-chip RF transmitter and / or receiver circuitry associated with and coupled to the antenna structure 101.

[0073] According to one embodiment, the socket 30 is provided on the upper surface 10a of the load board 10 to receive the DUT 100 that has been picked up and transferred thereto by the automatic handler 50. According to one embodiment, the socket 30 (e.g., a customized test socket) may include a cavity 310 that receives and accommodates the DUT 100 and at least a lower portion of a fixture 502 of the handler 50 that directly holds and presses the DUT 100. According to one embodiment, the DUT 100 may be mounted in the socket 30 by the automatic handler 50 that may pick up the DUT 100 and place it on the socket 30. In some embodiments, the automatic handler 50 may grip or hold a combination of the DUT 100 and the socket 30, and may mount them on the load board 10.

[0074] According to one embodiment, a substrate 510 having a test circuit 520 is embedded in a fixture 502. According to one embodiment, the substrate 510 may be sandwiched by an upper portion 502a and a lower portion 502b of the fixture 502. According to one embodiment, the upper portion 502a of the fixture 502 may be made of a metal or a metal alloy. According to one embodiment, the lower portion 502b of the fixture 502 may be made of a non-metallic material that allows RF signals to pass through. The lower portion 502b and the DUT 100 are disposed in the cavity 310 of the slot 30.

[0075] According to one embodiment, the substrate 510 may be a printed wiring board or a printed circuit board, but is not limited thereto. According to one embodiment, the test circuit 520 may include a test antenna, a detector, a transceiver, an up-converter and a down-converter capable of converting signals between mmW and non-mmW. For example, the test circuit 520 may be a test antenna corresponding to the antenna structure 101 below. In other embodiments, the antenna structure 101 is aligned with the test antenna 121. The direction of the mmW radiated by the antenna structure 101 is the upward direction, indicated by the arrow 610.

[0076] The slot 30 is used to electrically connect the metal wires or contact pads of the load board 10 with the contact points 106 of the DUT 100. For example, the slot 30 includes a plurality of spring pins 301 for providing temporary conductive connections with the DUT 100 and the connection pads 111 on the load board 10. During testing, the DUT 100 with the antenna structure 101 facing the fixture 502 is held against the spring pins 301 so that these spring pins 301 are aligned with and electrically connected to the corresponding contact points 106 on the lower surface of the DUT 100. According to one embodiment, a plurality of spring pins 302 are provided in the vertical wall portion 30a of the slot 30. One end (lower end) of each spring pin 302 is electrically connected to the connection pad 112 on the load board 10. The other end (upper end) of each spring pin 302 is electrically connected to the substrate 510.

[0077] Figure 3 FIG. 1 is a schematic cross-sectional view of a wireless test system for testing a DUT having an integrated mmW antenna structure according to another embodiment of the present invention. Figure 3 As shown, similarly, the wireless test system 1c includes a load board 10, such as a printed wiring board or printed circuit board having an upper surface 10a and a lower surface 10b. The load board 10 generally includes a core (e.g., an FR4 copper-clad laminate core), a plurality of dielectric building layers, and traces on opposite surfaces of the core. The traces in different layers of the printed circuit board are electrically connected to each other through plated through holes.

[0078] The load board 10 may be mechanically connected to an air purge cover or housing 20 so as to define an interior space 210 that may be filled with room temperature dry air. According to one embodiment, an RF instrument circuit 220 may be mounted in the interior space 210, but is not limited thereto. According to one embodiment, the load board 10 may contain customized circuitry dedicated to testing a particular DUT 100. For example, the load board 10 may be a customized RF load board that has been specifically modified for the radiation, electrical, and physical characteristics of a particular DUT 100. It should be understood that the load board 10 may also be connected to a DC power supply, ground, digital input / output, and / or a computer, which are not shown for simplicity.

[0079] According to one embodiment, the DUT 100 may be a packaged semiconductor die or integrated circuit module with an integrated mmW antenna structure 101. The DUT 100 may be a system-on-chip (SoC), antenna-in-package (AiP), system-in-a-package (SiP), package-on-package (PoP), or module with at least one integrated RF die 102. The RF die 102 may have on-chip RF transmitter and / or receiver circuitry associated with and coupled to the antenna structure 101.

[0080] According to one embodiment, the socket 30 is provided on the upper surface 10a of the load board 10 to receive the flipped DUT 100 that has been picked up and transferred thereto by the automatic handler 50. According to one embodiment, the socket (e.g., a customized test socket) may include a cavity 310 that receives and accommodates the flipped DUT 100, and at least a lower portion 502b of a fixture 502 that directly presses the DUT 100. According to one embodiment, the DUT 100 may be mounted in the socket 30 by the automatic handler 50, which may pick up the DUT 100 and place the DUT 100 on the socket 30. In some embodiments, the automatic handler 50 may fasten or hold the combination of the DUT 100 and the socket 30, and may mount them on the load board 10.

[0081] According to one embodiment, a substrate 510 having interconnected circuits is embedded in a fixture 502. According to one embodiment, the substrate 510 may be sandwiched by an upper portion 502a and a lower portion 502b of the fixture 502. According to one embodiment, the upper portion 502a of the fixture 502 may be composed of a metal, a metal alloy, or a non-metal material. According to one embodiment, the lower portion 502b of the fixture 502 may be composed of a metal, a metal alloy, or a non-metal material. The lower portion 502b and the DUT 100 are disposed in the cavity 310 of the socket 30.

[0082] According to one embodiment, the substrate 510 may be a printed wiring board or a printed circuit board, but is not limited thereto. According to one embodiment, the substrate 510 is electrically connected to the contact point 106 of the flipped DUT 100 through the spring pin 301 disposed in the lower portion 502b of the fixture 502. According to one embodiment, the substrate 510 is electrically connected to the load board 10 through the spring pin 302 disposed in the vertical wall portion 30a of the slot 30. The power supply signal and / or the control signal from the load board 10 may be provided to the substrate 510 through the spring pin 302.

[0083] According to one embodiment, the load board 10 further includes at least one test antenna 121. According to one embodiment, the connection pad 112 and the test antenna 121 may be fabricated in the top metal layer of the load board 10, but is not limited thereto. In some embodiments, the connection pad 112 and the test antenna 121 may be fabricated in the inner metal layer or the bottom metal layer of the load board 10. According to one embodiment, the test antenna 121 may be electrically coupled to the RF instrument circuit 220 via the cable 240. In some embodiments, the connection between the test antenna 121 and the RF instrument circuit 220 may be achieved by wireless transmission.

[0084] Once the flipped DUT 100 has been installed in the slot 30, its power and signal pins are conductively coupled to the DUT side of the RF instrument circuit 220. A computer (not shown) is connected to the tester side of the RF instrument circuit 220. The computer then runs software to perform a test procedure in which the RF instrument circuit 220 is commanded to stimulate the DUT 100 and capture the RF output response of the DUT, which is then stored in digital form. The direction of the radiated mmW of the antenna structure 101 is in the downward direction, indicated by arrow 610. Since the DUT 100 is flipped when installed in the slot 30, the distance between the antenna structure 101 and the test antenna 121 is reduced. Therefore, path loss can be minimized and test coverage is higher.

[0085] Figure 4 FIG. 1 is a schematic cross-sectional view of a wireless test system for testing a DUT having an integrated mmW antenna structure according to another embodiment of the present invention. Figure 4 As shown, similarly, the wireless test system 1d includes a load board 10, such as a printed wiring board or printed circuit board having an upper surface 10a and a lower surface 10b. The load board 10 generally includes a core (e.g., an FR4 copper-clad laminate core), a plurality of dielectric building layers, and traces on opposite surfaces of the core. The traces in different layers of the printed circuit board are electrically connected to each other through plated through holes.

[0086] The load board 10 may be mechanically connected to an air purge cover or housing 20 so as to define an interior space 210 that may be filled with room temperature dry air. According to one embodiment, an RF instrument circuit 220 may be mounted in the interior space 210, but is not limited thereto. According to one embodiment, the load board 10 may contain customized circuits dedicated to testing a specific DUT 100. For example, the load board 10 may be a customized RF load board that has been specifically modified for the radiation, electrical, and physical characteristics of a specific DUT 100. According to one embodiment, the load board 10 is electrically connected to the RF instrument circuit 220 via an RF cable and / or connector. It should be understood that the load board 10 may also be connected to a DC power supply, ground, digital input / output, and / or a computer, which are not shown for simplicity.

[0087] According to one embodiment, the DUT 100 may be a packaged semiconductor die or integrated circuit module having at least one integrated mmW antenna structure 101. The DUT 100 may be a system-on-chip (SoC), antenna-in-package (AiP), system-in-a-package (SiP), package-on-package (PoP), or module having at least one integrated RF die 102. The RF die 102 may have on-chip RF transmitter circuitry and / or receiver circuitry associated with and coupled to the antenna structure 101.

[0088] According to one embodiment, the socket 30 is provided on the upper surface 10a of the load board 10 to receive the DUT 100 that has been picked up and transferred thereto by the automatic handler 50. According to one embodiment, the socket 30 (e.g., a customized test socket) may include a cavity 310 that receives and accommodates the DUT 100, and at least a lower portion of a fixture 502 of the handler 50 that directly supports and presses the DUT 100. According to one embodiment, the DUT 100 may be mounted in the socket 30 by the automatic handler 50, which may pick up the DUT 100 and place it on the socket 30. In some embodiments, the automatic handler 50 may grip or hold a combination of the DUT 100 and the socket 30, and may mount them on the load board 10.

[0089] According to one embodiment, the fixture 502 may be made of metal, metal alloy or non-metallic material. According to one embodiment, the socket 30 may be made of phenol formaldehyde (or phenolic plastic) or Teflon, but is not limited thereto. The socket 30 is used to electrically connect the metal wire or contact pad of the load board 10 with the contact point 106 of the DUT 100. For example, the socket 30 includes a plurality of spring pins 301 for providing a temporary conductive connection with the DUT 100 and the connection pads 111 on the load board 10. During testing, the DUT 100 is held against the spring pins 301 so that these spring pins 301 are aligned with and electrically connected to the corresponding contact points 106 on the lower surface of the DUT 100.

[0090] According to one embodiment, at least one waveguide channel is provided in the fixture 502 and the slot 30 for guiding the radiated RF signal to the load board 10. For example, Figure 4The four exemplary waveguide channels WG1, WG2, WG3 and WG4 are shown. The four exemplary waveguide channels WG1, WG2, WG3 and WG4 correspond to the four antenna structures 101a-101d of the DUT 100, respectively. It should be understood that the four antenna structures 101a-101d of the DUT 100 are Figure 4 It should be understood that the four antenna structures 101a-101d are shown to explain that various waveguide channel structures can be used according to different directions, positions or arrangements of the antenna structures 101a-101d.

[0091] It should be understood that the shape and size of the waveguide channels WG1, WG2, WG3 and WG4 can be changed according to various design requirements. For example, one end of the waveguide channel close to the antenna structure in the DUT can have a flared cross-sectional profile. This flared end structure is also Figure 4 In Figure 4 In FIG. 1 , the distal ends of the waveguide channels WG1 and WG2 are flared, which is the end close to the antenna structure in the DUT.

[0092] According to one embodiment, for example, the other end of the waveguide channel WG1 is aligned with the adapter AP1, and the adapter AP1 is fixed on the lower surface 10b of the load board 10. The adapter AP1 can be connected to the coaxial cable CA1. Through the adapter AP1 and the coaxial cable CA1, the guided mmW signal or RF signal can be transmitted to the RF instrument circuit 220. According to one embodiment, for example, the other end of the waveguide channel WG2 can be aligned with the test antenna 121. The test antenna 121 is electrically coupled to the RF instrument circuit 220 through the cable 240. Alternatively, the connection between the test antenna 121 and the RF instrument circuit 220 can be achieved through wireless transmission instead of the cable 240.

[0093] According to one embodiment, for example, the waveguide channel WG1 includes three parts: S 11 , S 12 and S 13 . Part S 11 Set in the fixture 502. Part S 12 Set in slot 30. Part S 13 is disposed in the load plate 10. According to one embodiment, for example, the portion S 11 and part S 12 It is a hollow through hole, and the inner wall of the through hole is plated with a metal layer PM. The portion S in the load board 10 13 The portion S in the load board 10 is not a hollow through hole. 13 is a channel defined by a metal wall MW extending through the entire thickness of the load plate 10. The portion S of the channel 13The dielectric material of the load board 10 may be completely filled. In one embodiment, no metal wiring layer is formed in the channel so as not to hinder the transmission of the mmW signal or the RF signal.

[0094] According to one embodiment, for example, the waveguide channel WG2 comprises two parts: S 21 and S 22 . Part S 21 Set in the fixture 502. Part S 22 According to one embodiment, the portion S of the waveguide channel WG1 12 and the portion S of the waveguide channel WG2 22 The waveguide channel WG3 includes two parts: S 31 and S 32 . Part S 31 Set in the base 30b of the slot 30. Part S 32 According to one embodiment, for example, the waveguide channel WG4 includes two parts: S 41 and S 42 . Part S 41 The portion S is disposed in the vertical wall portion 30a of the slot 30. 42 Set in the load plate 10. Part S 32 and part S 42 Similar to part S 13 Structure of the part S 32 and part S 42 Aligned with adapters AP2 and AP3 respectively. Adapters AP2 and AP3 are fixed on the lower surface 10b of the load board 10. Adapter AP2 can be connected to the coaxial cable CA2. Adapter AP3 can be connected to the coaxial cable CA3.

[0095] The use of the present invention is advantageous because no cables pass through the load board 10 and no hollow holes are formed in the load board 10. Moisture isolation is greatly improved during low temperature testing.

[0096] Those skilled in the art will readily observe that various modifications and changes can be made to the apparatus and method while retaining the teachings of the present invention. Therefore, the above disclosure should be interpreted as being limited only by the scope and limits of the appended claims.

Claims

1. A wireless testing system, characterized in that: include: a load plate having an upper surface and a lower surface; a slot for receiving a device under test (DUT) having an antenna structure, the slot being disposed on an upper surface of the load board; a processor for picking up the DUT and transferring the DUT to the slot, wherein the processor includes a pressing component for holding and pressing the DUT; and a waveguide channel, the waveguide channel having one end close to the antenna structure of the DUT, the waveguide channel being disposed at least in the slot and the load board; wherein the waveguide channel passes through the load board and no hollow hole is formed in the load board; An adapter is fixed on the lower surface of the load board, wherein the adapter is connected to the RF instrument circuit through a cable, wherein the end of the waveguide channel is aligned with the adapter.

2. The wireless test system according to claim 1, characterized in that: The waveguide channel is disposed in the pressing member, the slot and the load plate.

3. The wireless testing system according to claim 2, characterized in that: The waveguide channel in the pressing member is a hollow through hole, and the waveguide channel in the slot is a hollow through hole.

4. The wireless testing system according to claim 1, characterized in that: Further including: An air purification cover is disposed below the load board to define an inner space filled with dry air at room temperature, the RF instrument circuit is disposed in the inner space, and the cable is a coaxial cable.

5. The wireless testing system according to claim 1, characterized in that: One end of the waveguide channel close to the antenna structure of the DUT has a flared cross-sectional profile.

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