Earplug and manufacturing method thereof

Abstract

The earplugs and their manufacturing method disclosed herein first use a jig in conjunction with a first substrate to inject liquid silicone to form a flexible carrier, leaving a portion of the first substrate exposed. Conductive adhesive (silver adhesive) is then applied to the first substrate. This prevents the liquid silicone from covering the conductive adhesive (silver adhesive) and hindering sensing, thereby ensuring process yield and conductivity. Furthermore, because the conductive adhesive (silver adhesive) can be sprayed and cured at a relatively low temperature in atmospheric conditions, it not only maintains its softness for improved wearer comfort but also minimizes contact resistance when the earplug contacts the skin, enhancing the product's practicality.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to earplugs and methods for manufacturing the same. Background Art

[0002] Current headphone technology integrates a SiP (System in Package) into the eartips. In one case, the conductive silicone used in the eartips (e.g., a mixture of two colloids) can become hardened after thermal oxidation, causing discomfort. Furthermore, the hardened conductive silicone does not fit snugly into the jig, and during injection molding, the liquid silicone can easily cover the conductive silicone, hindering sensing. Summary of the Invention

[0003] The present disclosure provides earplugs and methods of manufacturing the same.

[0004] In a first aspect, the present disclosure provides an earplug, comprising:

[0005] A flexible carrier having a side surface and a bottom surface, wherein the side surface is used to contact the object to be tested and the side surface is provided with conductive glue;

[0006] The first substrate is embedded in the flexible carrier, exposed from the side surface to sense the object to be detected, exposed from the bottom surface to connect to an external device, and connected to the conductive adhesive.

[0007] In some optional embodiments, the conductive paste is conductive silver paste.

[0008] In some optional embodiments, the first substrate has a sensing pad, and the sensing pad is exposed from the side surface.

[0009] In some optional embodiments, the sensing pad extends from the top end of the flexible carrier to the bottom end of the flexible carrier.

[0010] In some optional embodiments, the sensing pads are discretely distributed around the central symmetry axis of the flexible carrier.

[0011] In some optional embodiments, the soft carrier has a sound guide hole, the sound guide hole has an inner surface, the bottom surface extends from the side surface to the inner surface, and the sound guide hole is used to conduct audio from a side close to the bottom surface to a side away from the bottom surface.

[0012] In some optional embodiments, the first substrate is a flexible circuit board, and the flexible circuit board extends from the bottom surface to the inner surface and is exposed from the inner surface.

[0013] In some optional embodiments, the method further includes:

[0014] The second substrate is provided on the bottom surface, the second substrate is connected to the first substrate, and the second substrate is symmetrical with the sound guide hole as the center.

[0015] In some optional embodiments, the second substrate has a through hole, and the through hole is used to conduct audio from the outside to the sound guide hole.

[0016] In some optional embodiments, the method further includes:

[0017] The electronic component is embedded in the flexible carrier, and is used for receiving a sensing signal from the first substrate.

[0018] In some optional embodiments, a connector is provided on a side of the second substrate away from the flexible carrier, and the connector is used to transmit electronic signals to an external device.

[0019] In some optional embodiments, the second substrate is a printed circuit board.

[0020] In a second aspect, the present disclosure provides a method for manufacturing an earplug, comprising:

[0021] Providing a flexible carrier, in which a first substrate is embedded, the flexible carrier having a side surface and a bottom surface, and the first substrate is exposed from the side surface;

[0022] Conductive glue is coated on the side of the flexible carrier.

[0023] In some optional embodiments, the conductive paste is conductive silver paste.

[0024] The earplugs and their manufacturing method disclosed herein first use a jig in conjunction with a first substrate to inject liquid silicone to form a flexible carrier, leaving a portion of the first substrate exposed. Conductive adhesive (silver adhesive) is then applied to the first substrate. This prevents the liquid silicone from covering the conductive adhesive (silver adhesive) and hindering sensing, thereby ensuring process yield and conductivity. Furthermore, because the conductive adhesive (silver adhesive) can be sprayed and cured at a relatively low temperature in atmospheric conditions, it not only maintains its softness for improved wearer comfort but also minimizes contact resistance when the earplug contacts the skin, enhancing the product's practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Other features, objects and advantages of the present disclosure will become more apparent from a reading of the detailed description of non-limiting embodiments made with reference to the following drawings:

[0026] Figure 1 is a schematic diagram of the internal structure of an earplug according to an embodiment of the present disclosure;

[0027] Figure 2is a schematic diagram of a first external structure of an earplug according to an embodiment of the present disclosure;

[0028] Figure 3 is a schematic diagram of a second external structure of an earplug according to an embodiment of the present disclosure;

[0029] Figure 4 3D is a schematic diagram of the three-dimensional structure of an earplug according to an embodiment of the present disclosure.

[0030] Explanation of symbols:

[0031] 1-flexible carrier, 11-side surface, 12-bottom surface, 13-sound guide hole, 14-conductive adhesive, 15-liquid silicone rubber, 2-first substrate, 21-sensing pad, 3-second substrate, 31-through hole, 4-electronic component, 5-connector. DETAILED DESCRIPTION

[0032] The following describes specific embodiments of the present disclosure in conjunction with the accompanying drawings and examples. Those skilled in the art will readily understand the technical problems solved by the present disclosure and the technical effects produced by the present disclosure through the contents of this specification. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. Furthermore, for ease of description, only portions relevant to the relevant invention are shown in the accompanying drawings.

[0033] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for understanding and reading by those skilled in the art, and are not used to limit the conditions for implementation of the present disclosure. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present disclosure without affecting the efficacy and purpose that can be achieved by the present disclosure. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of implementation of the present disclosure. Changes or adjustments in their relative relationships should also be regarded as the scope of implementation of the present disclosure without substantially changing the technical content.

[0034] It should also be noted that the longitudinal section corresponding to the embodiment of the present disclosure may be a section corresponding to the front view direction, the transverse section may be a section corresponding to the right view direction, and the horizontal section may be a section corresponding to the top view direction.

[0035] It should be readily understood that the meanings of “on,” “over,” and “over…” in this disclosure should be interpreted in the broadest manner, such that “on” not only means “directly on something,” but also means “on something” including intermediate components or layers therebetween.

[0036] Furthermore, for ease of description, spatially relative terms, such as "below," "beneath," "lower," "above," and "upper," may be used in this disclosure to describe the relationship of one element or component to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used in this disclosure should be interpreted accordingly.

[0037] In addition, the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0038] Figure 1 Schematic diagram of the internal structure of an earplug according to an embodiment of the present disclosure. Figure 2 FIG. 1 is a schematic diagram of the first external structure of the earplug according to an embodiment of the present disclosure. Figure 1 and Figure 2 As shown, the earplug includes a flexible carrier 1, conductive adhesive 14, and a first substrate 2. The flexible carrier 1 has a side surface 11 and a bottom surface 12. The side surface 11 is used to contact the object under test. The conductive adhesive 14 is applied to the side surface 11. The first substrate 2 is embedded in the flexible carrier 1. The first substrate 2 is exposed from the side surface 11 to sense the object under test. The first substrate 2 is exposed from the bottom surface 12 to connect to an external device. The first substrate 2 is connected to the conductive adhesive 14.

[0039] In this embodiment, the soft carrier 1 can be silicone, such as LSR (Liquid Silicone Rubber). The conductive adhesive 14 can be used to contact and sense the object to be measured. The conductive adhesive 14 can be sufficiently soft so that it contacts the object to be measured (e.g., the human ear canal), thereby improving the wearing comfort of the user and enabling the user to wear it for a long time. The external device can be a wearable device (e.g., headphones).

[0040] In one embodiment, the conductive adhesive 14 may be conductive silver adhesive. Since the conductive silver adhesive can be sprayed in an atmospheric environment and cured by baking at a relatively low temperature, it not only maintains its softness to improve the user's wearing comfort, but also minimizes the contact resistance between the earplug and the skin, thereby improving the practicality of the product.

[0041] In one embodiment, the first substrate 2 may be an FPC (Flexible Printed Circuit). The FPC may be used as the first substrate 2 to form a conductive pad and a conductive path with the second substrate 3. In another embodiment, the first substrate 2 may have a sensing pad 21. The sensing pad 21 may be exposed from the side 11. The first substrate 2 may be made of conductive silver glue. Since conductive silver glue has good ductility, the first substrate 2 can be folded multiple times without breaking. In addition, when the sensing pad 21 can be in contact with the object to be measured, the sensing pad 21 may be made of conductive silver glue to improve the comfort of the user.

[0042] In one embodiment, the conductive adhesive 14 and the sensing pad 21 form a pathway for signal transmission. The sensing pad 21 and the conductive adhesive 14 may be positioned such that the outer surface of the sensing pad 21 is flush with the outer surface of the conductive adhesive 14. In another embodiment, the sensing pad 21 and the conductive adhesive 14 may be positioned such that the outer surface of the sensing pad 21 protrudes relative to the outer surface of the conductive adhesive 14. In yet another embodiment, the outer surface of the conductive adhesive 14 protrudes relative to the outer surface of the sensing pad 21.

[0043] In one embodiment, the flexible carrier 1 may have a sound guide hole 13. The sound guide hole 13 may have an inner surface. The bottom surface 12 of the flexible carrier 1 extends from the side surface 11 of the flexible carrier 1 to the inner surface of the sound guide hole 13. The sound guide hole 13 can be used to conduct audio from the side closer to the bottom surface 12 to the side farther from the bottom surface 12. The sound guide hole 13 can conduct external sound (e.g., sound emitted by headphones) to the interior of the human ear canal.

[0044] In one embodiment, the first substrate 2 may extend from the bottom surface 12 of the flexible carrier 1 to the inner surface of the sound guide hole 13 and be exposed from the inner surface of the sound guide hole 13 .

[0045] In one embodiment, the earplug may further include a second substrate 3. The second substrate 3 may be provided on the bottom surface 12. The second substrate 3 may be connected to the first substrate 2. The second substrate 3 may be symmetrical with the sound guide hole 13 as the center. In another embodiment, the second substrate 3 may be a printed circuit board. Here, the second substrate 3 may be a PCB (Printed Circuit Board). The PCB may be, for example, a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. In another embodiment, the second substrate 3 may have a through hole 31. The through hole 31 can be used to conduct audio from the outside to the sound guide hole 13.

[0046] In one embodiment, the earbud may further include an electronic component 4. The electronic component 4 may be embedded in the flexible carrier 1. The electronic component 4 may be configured to receive sensing signals from the first substrate 2. The electronic component 4 may be an active component or a passive component. Active components may include, for example, various chips (e.g., application-specific integrated circuit chips, high-bandwidth memory chips, power management chips, logic function chips, storage chips, communication chips, microprocessor chips, and graphics chips). Passive components may include, for example, capacitors, resistors, and inductors.

[0047] In one embodiment, Figure 2 and Figure 3 As shown, the sensing pads 21 may be discretely distributed around the central symmetry axis of the flexible carrier 1. The distribution of the plurality of sensing pads 21 is designed to achieve enhanced functionality.

[0048] In one embodiment, Figure 3 As shown, the sensing pad 21 may extend from the top end of the flexible carrier 1 to the bottom end of the flexible carrier 1 .

[0049] In one embodiment, Figure 4 As shown, the second substrate 3 may be provided with a connector 5 on a side away from the flexible carrier 1. The connector 5 may be used to transmit electronic signals to an external device.

[0050] In one embodiment, Figure 4 As shown, part of the conductive adhesive 14 can be replaced by part of the liquid silicone of the flexible carrier 1 , that is, the spraying range and shape of the conductive adhesive 14 can be changed according to the design, and the thickness of the conductive adhesive 14 can be changed according to demand.

[0051] The earplug can be manufactured by the following method:

[0052] The first step is to provide a flexible carrier. The flexible carrier may have a first substrate embedded therein. The flexible carrier may have a side surface and a bottom surface. The sensing pads of the first substrate are exposed from the side surface.

[0053] The second step is to apply conductive glue on the side of the flexible carrier. The conductive glue is connected to the sensing pad. In one embodiment, the conductive glue can be conductive silver glue.

[0054] The earplugs and their manufacturing method disclosed herein first use a jig in conjunction with a first substrate to inject liquid silicone to form a flexible carrier, exposing a portion of the first substrate (sensing pads). Conductive adhesive (silver adhesive) is then applied to the first substrate (sensing pads). This prevents the liquid silicone from covering the conductive adhesive (silver adhesive) and hindering sensing, thereby ensuring process yield and conductivity. Furthermore, because the conductive adhesive (silver adhesive) can be sprayed and cured at a relatively low temperature in atmospheric conditions, it not only maintains its softness for improved wearer comfort but also minimizes contact resistance when the earplug contacts the skin, enhancing the product's practicality.

[0055] Although the present disclosure has been described and illustrated with reference to specific embodiments of the present disclosure, these descriptions and illustrations do not limit the present disclosure. It will be clearly understood by those skilled in the art that various changes may be made and equivalent elements may be substituted within the embodiments without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present disclosure and the actual device. There may be other embodiments of the present disclosure that are not specifically described. The description and drawings should be regarded as illustrative, not restrictive. Modifications may be made to adapt specific circumstances, materials, compositions of matter, methods or processes to the objectives, spirit and scope of the present disclosure. All such modifications fall within the scope of the claims appended hereto. Although the methods disclosed in the present disclosure have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically indicated in the present disclosure, the order and grouping of operations do not limit the present disclosure.

Claims

1. An earplug comprising: A flexible carrier having a side surface and a bottom surface, the side surface being used to contact the object to be tested, the side surface being provided with conductive silver paste, wherein the flexible carrier has a sound guide hole, the sound guide hole having an inner surface, the bottom surface extending from the side surface to the inner surface, the sound guide hole being used to conduct audio from a side close to the bottom surface to a side away from the bottom surface; A first substrate is embedded in the flexible carrier, the first substrate is exposed from the side surface to sense the object to be detected, the first substrate is exposed from the bottom surface to connect to an external device, and the first substrate is connected to the conductive silver paste, wherein the first substrate has a sensing pad, and the sensing pad is exposed from the side surface. The first substrate is a flexible circuit board, and the flexible circuit board extends from the bottom surface to the inner surface and is exposed from the inner surface.

2. The earplug according to claim 1, wherein The sensing pad extends from the top end of the flexible carrier to the bottom end of the flexible carrier.

3. The earplug according to claim 1, wherein The sensing pads are discretely distributed around the central symmetry axis of the flexible carrier.

4. The earplug according to claim 1, further comprising: The second substrate is provided on the bottom surface, the second substrate is connected to the first substrate, and the second substrate is symmetrical with the sound guide hole as the center.

5. The earplug according to claim 4, wherein The second substrate has a through hole, and the through hole is used to conduct audio from the outside to the sound guide hole.

6. The earplug according to claim 4, further comprising: The electronic component is embedded in the flexible carrier, and is used for receiving a sensing signal from the first substrate.

7. The earplug according to claim 6, wherein: A connecting piece is provided on a side of the second substrate away from the flexible carrier, and the connecting piece is used to transmit electronic signals to an external device.

Images