Control device for a motor vehicle and method for producing and measuring the tightness of a control device

Abstract

The invention relates to a control device (12) for a motor vehicle, the control device comprising a printed circuit board (10), the printed circuit board having a first side (14) and an edge (16), wherein the first side (14) of the printed circuit board (10) is delimited by the edge (16); at least one electronic component (18) which is arranged on the first side (14) of the printed circuit board (10) and is electrically conductively connected to the printed circuit board (10); at least one first conductor loop (20) and at least one second conductor loop (22), the first conductor loop being arranged on the printed circuit board (10). The invention relates to a printed circuit board (10) comprising: a first side (14) of the printed circuit board (10), the second conductive ring being arranged at a distance from the first conductor ring (20), wherein the first conductor ring (20) is arranged between the edge (16) and the second conductor ring (22), and the second conductor ring (22) is arranged between the first conductor ring (20) and the at least one electronic component (18); and an injection molded cover (28) of the printed circuit board (10), wherein the injection molded cover (28) at least surrounds the first side (14), the at least one electronic component (18), the first conductor ring (20) and the second conductor ring (22).

Description

Technical Field

[0001] The invention relates to a control device for a motor vehicle, wherein the control device has an injection-molded or overmolded printed circuit board and a plurality of conductor loops are formed on the printed circuit board, wherein the insulation resistance between the conductor loops can be measured in order to be able to detect the tightness or adhesion between the injection-molded coating and the printed circuit board. Background Art

[0002] A control device is known, wherein the control device has a housing and a printed circuit board is arranged within the housing. Due to the housing, such a control device can have an increased sealing. In the process of weight reduction and in order to reduce the size of the components, the control device or the printed circuit board of the control device is usually injection-molded with plastic, and is therefore constructed in a medium-impermeable manner relative to external influences. However, if the adhesion between the printed circuit board and the injection-molded coating should be weakened, a gap may be formed between the printed circuit board and the injection-molded coating. Corrosive media, such as oil, may penetrate through the gap and damage the contact of the electronic components arranged on the printed circuit board, whereby the control device may suddenly and unexpectedly fail. Therefore, it is necessary to avoid and confirm the reduced adhesion between the printed circuit board and the injection-molded coating as early as possible. In particular, it is committed to supervising the adhesion between the injection-molded coating and the printed circuit board during the manufacture of the control device, so that the control device with the reduced adhesion between the injection-molded coating and the printed circuit board is not delivered. Summary of the invention

[0003] The object of the present invention is to provide a control device for a motor vehicle, which has a reliable adhesion between the injection-molded cover and the printed circuit board and / or to provide a method with which the reduced adhesion between the injection-molded cover and the printed circuit board can be determined and / or assessed during the manufacturing process of the control device.

[0004] This object is achieved by a control device for a motor vehicle, a method for producing and measuring the tightness of a control device, and a motor vehicle having a control device. Preferred developments of the invention are described in other exemplary embodiments and in the following description and figures, wherein each feature can represent an aspect of the invention both individually and in combination.

[0005] According to the present invention, a control device for a motor vehicle is provided, the control device having a printed circuit board, the printed circuit board having a first side and an edge, wherein the first side of the printed circuit board is bounded by the edge; at least one electronic component, the electronic component being arranged on the first side of the printed circuit board and being electrically conductively connected to the printed circuit board; at least one first conductor loop and at least one second conductor loop, the first conductor loop being arranged on the first side of the printed circuit board, the second conductive loop being arranged spaced apart from the first conductor loop, wherein the first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component; and an injection-molded cover of the printed circuit board, wherein the injection-molded cover at least surrounds the first side, the at least one electronic component, the first conductor loop, and the second conductor loop.

[0006] In other words, one aspect of the invention is to provide a control device for a motor vehicle, the control device having at least one printed circuit board. The printed circuit board has a first side. The first side is also often referred to as the upper side. The printed circuit board also has an edge, which delimits the first side of the printed circuit board. The edge can therefore also preferably be referred to as an edge. The edge therefore represents an external terminal of an external printed circuit board.

[0007] At least one electronic component is arranged on the first side of the printed circuit board and is electrically conductively connected to the printed circuit board. Typically, the first side of the printed circuit board has a plurality of electronic components arranged spaced apart from each other on the first side. Electronic components are also typically referred to as electronic assemblies.

[0008] Furthermore, it is provided that at least one first conductor loop and a second conductor loop arranged spaced apart from the first conductor loop are arranged on a first side of the printed circuit board. The first conductor loop and the second conductor loop are arranged spaced apart from each other in a direction parallel to the plane of the printed circuit board. The first conductive loop is constructed between the edge of the printed circuit board and the second conductive loop. The second conductor loop is arranged between the first conductor loop and at least one electronic component. Therefore, both the first conductor loop and the second conductor loop are arranged between the edge of the printed circuit board and the electronic component.

[0009] In addition, it is provided that the first side of the printed circuit board is injection molded. The injection molding of the printed circuit board is also referred to as "molding". The injection molding coating is constructed so that the injection molding coating at least surrounds the electronic component, the first conductor loop and the second conductor loop. If the adhesion between the injection molding coating and the first side of the printed circuit board is reduced, a small gap can be formed between the injection molding coating and the printed circuit board. If the control device is now immersed in a conductive medium, such as an electrolyte, the conductive medium can penetrate into the gap and provide a conductive connection between the first conductor loop and the second conductor loop, so that the insulation resistance between the first conductor loop and the second conductor loop is reduced. It is also conceivable that, for example, the insulation resistance of the first conductor loop relative to the conductive medium is measured and / or determined. In this way, a control device for a motor vehicle is provided, wherein the reduced adhesion between the injection molding coating and the printed circuit board can be determined by measuring the insulation resistance between the first conductor loop and the second conductor loop or by measuring the insulation resistance of the first conductor loop relative to the conductive medium during the manufacture of the control device. Therefore, the quality monitoring of the manufacturing process of the control device can be improved.

[0010] An advantageous improvement of the present invention is that the first conductor loop and the second conductor loop are open circuited and are connected by means of a through-contact for four-point resistance measurement. In other words, the first conductor loop and the second conductor loop have contact points respectively. These contact points are through-contacted. This means that the contact points are through-contacted or guided through the printed circuit board to the second side of the printed circuit board. The second side is different from the first side. The first side is preferably constructed at a distance from the second side. The first side and the second side can be constructed parallel to each other. The insulation resistance between the first conductor loop and the second conductor loop can be measured from the second side of the printed circuit board by through-contacting the contact points of the first conductor loop and the second conductor loop. In this way, the weakening of the injection molding on the first side for measuring the insulation resistance between the first conductor loop and the second conductor loop or for measuring the insulation resistance of the first conductor loop to the conductive medium can be avoided because the injection molding is performed from the second side of the printed circuit board.

[0011] According to a preferred improvement of the present invention, it is provided that the printed circuit board has a second side arranged at a distance from the first side, the second side being bounded by an edge, and a third conductor loop and a fourth conductor loop are arranged on the second side, the fourth conductor loop being arranged at a distance from the third conductor loop, wherein the third conductor loop is arranged between the edge and the fourth conductor loop. In other words, similar to the first side, two conductor loops are constructed on the second side, which are arranged side by side, so that the insulation resistance between the conductor loops on the second side and / or between the third conductor loop and the conductive medium can also be measured. The third conductor loop and the fourth conductor loop preferably have contact points, via which a voltage can be applied to the respective conductor loops in order to measure the insulation resistance between the third conductor loop and the fourth conductor loop.

[0012] The distance between the first conductor loop and the second conductor loop arranged on the first side and / or the third conductor loop and the fourth conductor loop arranged on the second side is preferably greater than 100 μm and less than 750 μm, preferably greater than 150 μm and less than 500 μm, including the boundaries. The distance between the first conductor loop and the second conductor loop can be different from the distance between the third conductor loop and the fourth conductor loop. However, it is also conceivable that the distance between the first conductor loop and the second conductor loop is equal to the distance between the third conductor loop and the fourth conductor loop.

[0013] In principle, it can be provided that both the first side and the second side of the printed circuit board are injection molded. In other words, it can be provided that the first conductor loop and the second conductor loop arranged on the first side are injection molded or overmolded, and the third conductor loop and the fourth conductor loop arranged on the second side are injection molded or overmolded. The material used for injection molding the first side and the second side can be the same. However, it is also conceivable that the first side is injection molded with a first material and the second side is injection molded with a second material different from the first material.

[0014] An advantageous improvement of the present invention is that the printed circuit board is arranged on the substrate via an intermediate layer, wherein the intermediate layer is arranged between the second side and the substrate. The intermediate layer can preferably be configured as a thermally conductive adhesive and / or a laminate and / or a no-flow prepreg. The substrate is preferably constructed of aluminum so that heat can be dissipated through the substrate. The substrate can therefore also be considered and / or configured as a cooler.

[0015] An advantageous development of the invention is that a recess and / or an opening is arranged and / or formed in the substrate so that the contact points of the second conductor loop and / or the contact points of the through-hole of the first conductor to the second side are accessible through the opening. In this way, access to the contact points of the conductor loops is provided so that a voltage can be applied to the contact points of the respective conductor loops in order, for example, to determine the insulation resistance between the first conductor loop and the second conductor loop and / or between the third conductor loop and the fourth conductor loop and / or between the first conductor loop and the conductive medium and / or between the third conductor loop and the conductive medium.

[0016] It is conceivable that the contact points of the first conductor loop and the second conductor loop formed on the first side of the printed circuit board are accessible from the first side in order to be acted upon by voltage. For this purpose, it is provided that the injection molding overmolding is omitted in the region of the contact points of the first conductor loop and the second conductor loop on the first side of the printed circuit board, so that the contact points are accessible and can be acted upon by voltage for the four-point resistance measurement.

[0017] A preferred development of the invention is that the contact points of the first conductor loop, the second conductor loop, the third conductor loop and / or the fourth conductor loop can be charged with voltage via a plug connector and / or a plug connector of the printed circuit board in order to be able to determine and / or measure the insulation resistance between the respectively adjacent conductor loops on one side of the printed circuit board. In this way, in addition to electrically contacting the printed circuit board via the plug connector, the conductor loops can also be electrically contacted.

[0018] In principle, the conductor loops can be designed to be electrically conductive so that the insulation resistance of the respective conductor loops can be measured, preferably relative to a conductive medium and / or between conductor loops arranged side by side on one side of a printed circuit board. An advantageous improvement of the invention is that the first conductor loop and / or the second conductor loop and / or the third conductor loop and / or the fourth conductor loop have silver, brass, copper and / or a silver alloy. Copper is a good and inexpensive electrical conductor, so that a voltage can be applied to the respective conductor loops via the contact points of the respective conductor loops, so that, for example, the insulation resistance between the respective conductor loops on one side of the printed circuit board can be determined. In addition, since copper is an inexpensive electrical conductor, the cost of the control device can be reduced.

[0019] In a preferred development of the invention, it is provided that the width and / or thickness of the first, second, third and / or fourth conductor loop is <500 μm, preferably <250 μm and particularly preferably <100 μm, in each case including the boundaries.

[0020] An advantageous improvement of the invention is that the control device is constructed without a housing. In other words, the printed circuit board with the electronic components arranged thereon is not surrounded by a housing part with a housing wall to protect the electronic components from external influences, such as corrosive media. Instead, the control device with the electronic components arranged thereon or the printed circuit board of the control device is protected from external media by the injection molded cover. Due to the housing-less construction, not only the manufacturing costs of the control device but also the installation space of the control device can be reduced.

[0021] The present invention further relates to a method for producing and measuring the tightness of a control device according to the invention, wherein the control device is immersed in a conductive medium, preferably an electrolyte, after production of the control device, and the insulation resistance between a first conductor loop and a second conductor loop and / or between the first conductor loop and the conductive medium is measured.

[0022] In other words, the control device according to the present invention is immersed in a conductive medium, such as an electrolyte. In addition, for example, a voltage is applied to the conductor loops on the first side and / or the second side to measure the insulation resistance between the respective conductor loops on the first side or the second side of the printed circuit board. It is also conceivable that a voltage is applied to the first conductor loop or the third conductor loop to determine the insulation resistance between the first conductor loop and the conductive medium and / or the third conductor loop and the conductive medium. If the adhesion between the injection molded cover and the printed circuit board is reduced, a gap may be formed between the injection molded cover and the printed circuit board. This results in that an electrolyte or a conductive medium can penetrate through the gap between the injection molded cover and the printed circuit board. The conductive medium or electrolyte can be squeezed forward into the gap so that the conductive medium or electrolyte (er) connects the first conductor loop and the second conductor loop and / or the third conductor loop and the fourth conductor loop to each other in an electrically conductive manner, thereby reducing the insulation resistance between the respective conductor loops on one side of the printed circuit board. This is a sign that the adhesion between the injection molded cover and the printed circuit board is reduced and the control device should not be delivered. In this way, production errors can be identified early so that risky parts can be rejected. This can provide improved quality monitoring.

[0023] An advantageous improvement of the invention is to measure the insulation resistance between the third conductor loop and the fourth conductor loop. Depending on whether the insulation resistance on the first side or the second side of the printed circuit board decreases, it can be determined where the reduced adhesion is present, so that the printed circuit board or the substrate can be adapted during the overmolding.

[0024] It is also conceivable to measure and / or determine the insulation resistance between the first conductor loop and the conductive medium and / or between the third conductor loop and the conductive medium.

[0025] According to an advantageous improvement of the invention, it is provided that the insulation resistance between the first conductor loop and the second conductor loop and / or between the third conductor loop and the fourth conductor loop and / or between the first conductor loop and the conductive medium and / or between the third conductor loop and the conductive medium is determined during or after the immersion process of the control device into the conductive medium or electrolyte. It is therefore possible in principle to determine the insulation resistance between the conductor loops on one side of the printed circuit board or the conductor loops on the respective side relative to the conductive medium during the immersion process. Alternatively, it can be provided that after the immersion process of the control device into the conductive medium or electrolyte, the insulation resistance between the conductor loops on the respective side or the conductor loops on the side relative to the conductive medium is determined. It is only necessary to ensure that the contact points or contact pads (contact pads) of the respective conductor loops are free of electrolyte. This method is preferred because it can be carried out separately from the immersion process of the control device into the conductive medium.

[0026] The invention furthermore relates to a motor vehicle having a control device according to the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Further features of the invention are derived from the dependent claims and the following embodiments. The embodiments should not be understood as limiting, but rather as exemplary. The embodiments should enable a person skilled in the art to carry out the invention. The applicant reserves the right to make one or more of the features disclosed in the embodiments the subject of a patent claim or to incorporate such features into existing patent claims. The embodiments are explained in more detail with reference to the figures.

[0028] In the diagram:

[0029] Figure 1 A top view showing a printed circuit board of a control device according to a preferred embodiment of the present invention;

[0030] Figure 2 Show Figure 1 A cross section of a printed circuit board of a control device shown in;

[0031] Figure 3 shows a longitudinal section through a printed circuit board of a control device according to a second preferred embodiment of the present invention;

[0032] Figure 4 shows a longitudinal section through a printed circuit board of a control device according to a third preferred embodiment of the present invention;

[0033] Figure 5 A method for determining insulation resistance is shown. DETAILED DESCRIPTION

[0034] exist Figure 11 shows a top view of a printed circuit board 10 for a control device 12 of a motor vehicle. The printed circuit board 10 has a first side 14 and an edge 16. The first side 14 is, for example, the upper side of the printed circuit board 10. The edge 16 delimits the first side 14 of the printed circuit board 10 or the printed circuit board 10. In other words, the edge 16 is the outer edge of the printed circuit board 10. A plurality of electronic components 18 are arranged on the first side 14 of the printed circuit board 10. The electronic components 18 are connected to the printed circuit board 10 both mechanically and electrically conductively. It can also be seen that a first conductor loop 20 and a second conductor loop 22 are arranged on the first side 14 of the printed circuit board 10, wherein the first conductor loop 20 is arranged between the edge 16 and the second conductor loop 22, and the second conductor loop 22 is arranged between the first conductor loop 20 and the electronic components 18. In other words, the two conductor loops 20, 22 are located between the edge 16 and the electronic components 18, wherein the first conductor loop 20 has a reduced distance from the edge 16 compared to the second conductor loop 22. Both the first conductor loop 20 and the second conductor loop 22 are each designed as an open conductor loop and have contact points 24 at their respective ends for applying voltage to the respective conductor loop 20 , 22 .

[0035] exist Figure 2 It is shown in Figure 1 . The printed circuit board 10 is designed as a multilayer printed circuit board and has a plurality of conductor tracks 26 arranged spaced apart from one another in a direction perpendicular to the plane of the printed circuit board 10. The electronic component 18 is arranged on the first side 14 of the printed circuit board 10. A first conductor loop 20 is formed near the edge 16 of the first side 14 of the printed circuit board 10. A second conductor loop 22 is arranged on the first side 14 of the printed circuit board 10 spaced apart from the first conductor loop 20, wherein the second conductor loop 22 has a greater distance from the edge 16 of the printed circuit board 10 than the first conductor loop 20. An injection molded coating 28 is arranged on the first side 14 of the printed circuit board 10, wherein the injection molded coating 28 is also referred to as an "overmold". The injection molded coating 28 is configured so that at least the electronic component 18, the first conductor loop 20 and the second conductor loop 22 are injection molded over the first side 14 of the printed circuit board 10. For example, the injection molding coating 28 can be a plastic, a synthetic resin or a resin. In this way, the contacting of the electronic components 18 on the printed circuit board 10 can be protected from external media. Likewise, the conductor loops 20, 22 are protected from external media.

[0036] Compared to the second conductor loop 22, the first conductor loop 20 has a reduced distance from the edge 16. The first conductor loop 20 and the second conductor loop 22 are spaced apart from one another in a direction parallel to the plane of the printed circuit board 10. An injection molded coating is formed between the first conductor loop 20 and the second conductor loop 22, which is also guided to the first side 14 of the printed circuit board 10.

[0037] In order to check the adhesion between the injection molded cover 28 and the printed circuit board 10, the control device 12 or the injection molded printed circuit board 10 is immersed in a conductive medium, preferably an electrolyte. If the adhesion between the injection molded cover 28 and the printed circuit board 10 is reduced, a gap is formed between the injection molded cover 28 and the first side 14. The conductive medium may penetrate into this gap. If the gap is constructed so that the gap leads to the second conductor loop 22, the conductive medium penetrates into the gap and establishes a conductive connection between the first conductor loop 20 and the second conductor loop 22. If the insulation resistance between the first conductor loop 20 and the second conductor loop 22 is now measured and if the insulation resistance is reduced, this is a sign that the adhesion between the injection molded cover 28 and the printed circuit board 10 is reduced or damaged. Therefore, the reduced insulation resistance is a sign that the control device 12 should be rejected. Therefore, the quality monitoring of the injection molded cover can be ensured.

[0038] exist Figure 3 It is shown in Figure 2 , wherein the printed circuit board 10 has a second side 30 arranged at a distance from the first side 14. A third conductor loop 32 and a fourth conductor loop 34 are arranged at a distance from each other on the second side 30. It is provided that the third conductor loop 32 is arranged and / or is formed between the fourth conductor loop 34 and the edge 16 of the printed circuit board 10. The third conductor loop 32 and the fourth conductor loop 34 are each formed as an open conductor loop and have corresponding contact points on the second side 30 for applying a voltage to the respective conductor loop 32, 34 in order to measure the insulation resistance between the conductor loops 32, 34 on the second side 30.

[0039] The printed circuit board 10 is arranged on a substrate 38 in a material-dependent manner via an intermediate layer 36, which is preferably designed as a thermally conductive adhesive. The substrate 38 is preferably made of aluminum and serves as a cooler for the control device 12. It can also be seen that the first conductor loop 20 and the second conductor loop 22 have a through-hole, so that the connecting contacts or contact points of the first conductor loop 20 and the second conductor loop 22 are led from the first side 14 of the printed circuit board 10 to the second side 30 of the printed circuit board 10. The substrate 38 has an opening 40, which is arranged and / or designed such that the contact points 24 are exposed. Thus, access to the contact points 24 is provided through the opening 40 in order to apply a voltage to the first conductor loop 20 and the second conductor loop 22 in order to detect or measure the insulation resistance between the two conductor loops 20, 22 on the first side 14 of the printed circuit board 10. Although not shown, the contact points of the third conductor loop 32 and the fourth conductor loop 34 are also accessible through the opening 40 in order to apply a voltage to the conductor loops 32 , 34 on the second side 30 in order to detect or measure the insulation resistance between the two conductor loops 32 , 34 arranged on the second side 30 .

[0040] exist Figure 4 1 shows a longitudinal section through a printed circuit board 10 according to a third exemplary embodiment. The printed circuit board 10 has a plurality of electronic components 18 both on the first side 14 and on the second side 28. A first conductor loop 20 and a second conductor loop 22 are arranged on the first side 14 at a distance from the edge 16. Compared to the second conductor loop 22, the first conductor loop 20 has a reduced distance from the edge 16. In the present exemplary embodiment, the distance between the first conductor loop 20 and the second conductor loop 22 is 500 μm.

[0041] The third conductor loop 32 and the fourth conductor loop 34 are arranged on the second side 30 at a distance from the edge 16, wherein the distance of the third conductor loop 32 from the edge 16 is smaller than the distance of the fourth conductor loop 34 from the edge 16. The distance between the third conductor loop 32 and the fourth conductor loop 34 is 500 μm. The first side 14 and the second side 30 of the printed circuit board 10 are protected from external media by the injection molding coating 28. The contact points 24 of the first conductor loop 20, the second conductor loop 22, the third conductor loop 32 and the fourth conductor loop 34 can be charged with a voltage via a plug connector (not shown) of the printed circuit board 10 in order to be able to detect and / or determine the insulation resistance of the conductor loops.

[0042] exist Figure 5 In a first step S100 , an injection molded printed circuit board 10 of a control device 12 is provided, wherein a first conductor loop 20 and a second conductor loop 22 arranged at a distance from the first conductor loop 20 are arranged on a first side 14 of the printed circuit board 10 .

[0043] In a second step S200 , control unit 12 or injection-molded printed circuit board 10 is immersed in a conductive medium, for example an electrolyte.

[0044] In a third step S300, the insulation resistance between the first conductor loop 20 and the second conductor loop 22 is determined. If the insulation resistance between the first conductor loop 20 and the second conductor loop 22 decreases or is equal to zero, this is a sign that the adhesion between the injection molding 28 and the printed circuit board 10 has decreased and that an electrolyte has penetrated through the gap formed between the injection molding 28 and the first side 14 of the printed circuit board 10. It is also conceivable to determine the insulation resistance between the first conductor loop 20 and the conductive medium.

[0045] Thus, a method is provided by which the adhesion of injection-molded covering 28 of housing-less control unit 12 can be checked in a simple manner. Thus, the risk of delivering faulty control unit 12 can be reduced even during the production method.

Claims

1. A control device (12) for a motor vehicle, the control device having A printed circuit board (10) having a first side (14) and an edge (16), wherein the first side (14) of the printed circuit board (10) is bounded by the edge (16), at least one electronic component (18) which is arranged on a first side (14) of the printed circuit board (10) and is electrically conductively connected to the printed circuit board (10), At least one first conductor loop (20) and at least one second conductor loop (22) arranged at a distance from the first conductor loop (20), the first conductor loop being arranged on a first side (14) of the printed circuit board (10), the first conductor loop (20) being arranged between the edge (16) and the second conductor loop (22), and the second conductor loop (22) being arranged between the first conductor loop (20) and the at least one electronic component (18), and an injection-molded coating (28) of the printed circuit board (10), the injection-molded coating (28) at least surrounding the first side (14), the at least one electronic component (18), the first conductor loop (20) and the second conductor loop (22), wherein the first conductor loop (20) and the second conductor loop (22) have contact points (24) for applying a voltage to the respective conductor loops (20, 22).

2. The control device according to claim 1, characterized in that The first conductor loop (20) and the second conductor loop (22) are open-circuited and are each connected by means of a plated-through contact for four-point resistance measurement.

3. The control device according to claim 1 or 2, characterized in that: The printed circuit board (10) has a second side (30) which is arranged at a distance from the first side (14) and is delimited by the edge (16), and a third conductor loop (32) and a fourth conductor loop (34) which is arranged at a distance from the third conductor loop (32) are arranged on the second side (30), wherein the third conductor loop (32) is arranged between the edge (16) and the fourth conductor loop (34).

4. The control device according to claim 3, characterized in that The printed circuit board (10) is arranged on a substrate (38) via an intermediate layer (36), wherein the intermediate layer (36) is arranged between the second side (30) and the substrate (38).

5. The control device according to claim 4, characterized in that An opening (40) is arranged and / or constructed in the substrate (38) so that the contact points (24) of the third and fourth conductor loops (32, 34) are accessible and / or in the case of a through-contact of the first and second conductor loops (20, 22) to the second side (30), the contact points (24) of the first and second conductor loops (20, 22) are accessible through the opening (40).

6. The control device according to claim 3, characterized in that The first conductor loop (20) and / or the second conductor loop (22) and / or the third conductor loop (32) and / or the fourth conductor loop (34) include silver, brass, copper and / or a silver alloy.

7. The control device according to claim 3, characterized in that The width and / or thickness of the first conductor loop (20), the second conductor loop (22), the third conductor loop (32) and / or the fourth conductor loop (34) is / are less than 500 μm.

8. A method for producing and measuring the tightness of a control device (12) according to any one of claims 1 to 2, wherein the control device (12) is immersed in a conductive medium, and - measuring the insulation resistance between the first conductor loop (20) and the second conductor loop (22), and / or - measuring the insulation resistance of the first conductor loop (20) relative to the conductive medium.

9. A method for producing and measuring the tightness of a control device (12) according to any one of claims 3 to 7, wherein the control device (12) is immersed in a conductive medium, and - measuring the insulation resistance between the first conductor loop (20) and the second conductor loop (22), and / or - measuring the insulation resistance of the first conductor loop (20) relative to the conductive medium.

10. The method according to claim 9, characterized in that - measuring the insulation resistance between the third conductor loop (32) and the fourth conductor loop (34), and / or - measuring the insulation resistance of the third conductor loop (32) relative to the conductive medium.

11. The method according to any one of claims 9 or 10, characterized in that During or after the immersion process of the control device (12) into the conductive medium, the insulation resistance between the first conductor loop (20) and the second conductor loop (22) and / or between the third conductor loop (32) and the fourth conductor loop (34) and / or the insulation resistance between the first conductor loop (20) and the conductive medium and / or the insulation resistance between the third conductor loop (32) and the conductive medium is determined.

12. A motor vehicle having a control device (12) according to any one of claims 1 to 7.

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