LED integrated chip, LED light strip and preparation method thereof

Abstract

The present application provides an LED integrated chip, an LED light strip, and a method for manufacturing the same. The LED integrated chip includes a packaging substrate, a pin assembly disposed on the front of the packaging substrate, a chip assembly disposed on the surface of the pin assembly, and power pins, ground pins, input pins, and output pins disposed on the back of the packaging substrate; the ground pins, power pins, output pins, and input pins are electrically connected to the pin assembly via vias disposed within the packaging substrate; two opposing sides of the packaging substrate are provided with trimming notches; the power pins and ground pins are disposed on the sides of the packaging substrate surface provided with a first trimming notch, and are disposed oppositely with the first trimming notch as an interval; the input pins and output pins are disposed on the sides of the packaging substrate surface provided with a second trimming notch, and are disposed oppositely with the second trimming notch as an interval. The present application can effectively save the number of wires during soldering, reducing production costs.

Description

Technical Field

[0001] The present application relates to the technical field of LED chips, and in particular to an LED integrated chip, an LED light strip, and a preparation method thereof. Background Art

[0002] High-voltage light strips, also known as AC light strips, are powered by AC power, unlike low-voltage light strips (DC light strips), which use DC power. High-voltage light strips have a rectifier, allowing them to be connected directly to the mains. The rectifier rectifies the mains power before supplying it to the LEDs.

[0003] Existing high-voltage light strip circuits generally adopt a control method of parallel connection of lamp beads. When the number of parallel lamp beads is large, the voltage through the end lamp bead drops, resulting in a decrease in the brightness of the end lamp bead and inconsistent brightness of different lamp beads, which in turn affects the overall luminous effect of the high-voltage light strip; and, when used in light strips, existing LED (Light-Emitting Diode) integrated chips generally use four wires for welding, two of which are power lines and the other two are signal lines. Since the four electrical connection points of the LED integrated chip (i.e., power pin, ground pin, input pin and output pin) are located at the four corners, the LED integrated chip needs to be rotated a certain angle and then welded to the wires, resulting in a large volume of this type of high-voltage light strip and a high preparation cost. Summary of the Invention

[0004] In view of the above problems, the present application is proposed to provide an LED integrated chip, an LED light strip, and a method for manufacturing the same that overcome or at least partially solve the above problems, including:

[0005] An LED integrated chip comprises: a packaging substrate, a pin assembly arranged on the front surface of the packaging substrate, a chip assembly arranged on the surface of the pin assembly, and a power supply solder pin, a ground solder pin, an input solder pin, and an output solder pin arranged on the back surface of the packaging substrate;

[0006] The ground solder pin, the power solder pin, the output solder pin and the input solder pin are electrically connected to the pin assembly through vias provided inside the package substrate; the pin assembly is electrically connected to the chip assembly;

[0007] Two opposite sides of the packaging substrate are respectively provided with trimming notches; the power solder pin and the ground solder pin are respectively arranged on the side of the packaging substrate surface provided with the first trimming notch, and the power solder pin and the ground solder pin are arranged opposite to each other with the first trimming notch as an interval, wherein the first trimming notch is any one of the two trimming notches; the input solder pin and the output solder pin are respectively arranged on the side of the packaging substrate surface provided with the second trimming notch, and the input solder pin and the output solder pin are arranged opposite to each other with the second trimming notch as an interval, wherein the second trimming notch is the trimming notch of the two trimming notches other than the first notch;

[0008] When several of the LED integrated chips are connected in series with a power supply, the grounding pin of the LED integrated chip is electrically connected to the power pin of an adjacent LED integrated chip; the output pin of the LED integrated chip is electrically connected to the input pin of an adjacent LED integrated chip.

[0009] Preferably, the pin assembly includes a power pin, a ground pin, an input pin and an output pin;

[0010] The power pin and the ground pin are respectively arranged on the side of the packaging substrate surface where the first trimming notch is provided, and the power pin and the ground pin are arranged opposite to each other with the first trimming notch as an interval, wherein the power pin corresponds to the position of the power solder leg, and the ground pin corresponds to the position of the ground solder leg; the input pin and the output pin are respectively arranged on the side of the packaging substrate surface where the second trimming notch is provided, and the input pin and the output pin are arranged opposite to each other with the second trimming notch as an interval, wherein the input pin corresponds to the position of the input solder leg, and the output pin corresponds to the position of the output solder leg;

[0011] The power pin is electrically connected to the power solder pin; the ground pin is electrically connected to the ground solder pin; the input pin is electrically connected to the input solder pin; and the output pin is electrically connected to the output solder pin.

[0012] Preferably, the first trimming notch and the second trimming notch are respectively arranged on the center line of the packaging substrate; the first trimming notch and the second trimming notch are arched, rectangular, trapezoidal or triangular.

[0013] Preferably, the chip assembly includes a first light-emitting chip, a second light-emitting chip, a third light-emitting chip and a light-emitting control chip; the light-emitting control chip includes a chip substrate and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin provided on the chip substrate;

[0014] The first light-emitting chip and the second light-emitting chip are electrically connected to the power pin respectively; the first pin is electrically connected to the cathode of the first light-emitting chip; the second pin is electrically connected to the anode of the first light-emitting chip; the third pin is electrically connected to the cathode of the third light-emitting chip; the fourth pin is electrically connected to the ground pin; the fifth pin is electrically connected to the power pin; the sixth pin is electrically connected to the output pin; and the seventh pin is electrically connected to the input pin.

[0015] Preferably, it also includes a spare solder foot arranged on the back side of the packaging substrate; the spare solder foot is arranged on the surface of the packaging substrate at a position corresponding to between the first trimming notch and the second trimming notch; the spare pin is electrically connected to the pin assembly through a via hole arranged inside the packaging substrate.

[0016] A method for preparing an LED integrated chip as described in any one of the above, comprising:

[0017] Opening a via hole on the surface of the substrate and burying a conductive column in the via hole;

[0018] The first cutting notch and the second cutting notch are respectively formed on two opposite sides of the substrate where the conductive pillars are embedded, to obtain the packaging substrate;

[0019] Mounting the power solder pins and the ground solder pins on the back of the package substrate at positions corresponding to both sides of the first cutting notch, and mounting the input solder pins and the output solder pins on the back of the package substrate at positions corresponding to both sides of the second cutting notch;

[0020] The pin assembly is mounted on the front surface of the packaging substrate, and the chip assembly is mounted on the surface of the pin assembly to obtain the LED integrated chip.

[0021] An LED light strip, comprising: a plurality of LED lamp beads arranged in sequence; the LED lamp beads comprising an encapsulating colloid and an LED integrated chip as described above; the encapsulating colloid being adhered to the surface of the LED integrated chip;

[0022] The grounding solder pin of the LED integrated chip is electrically connected to the power solder pin of the adjacent LED integrated chip; the output solder pin of the LED integrated chip is electrically connected to the input solder pin of the adjacent LED integrated chip.

[0023] Preferably, it further comprises a rectifier; the rectifier is electrically connected to the power supply and the power supply soldering pins of the first LED integrated chip respectively.

[0024] Preferably, the device further comprises a controller; the output end of the controller is electrically connected to the input solder pin of the first LED integrated chip.

[0025] A method for preparing an LED light strip as described in any one of the above items, comprising:

[0026] Removing the insulation layers of the power conductor and the signal conductor respectively at preset lengths and preset intervals, exposing the conductor core of the power conductor to form a plurality of power welding segments, and exposing the conductor core of the signal conductor to form a plurality of signal welding segments;

[0027] sequentially coating welding material on the surfaces of the plurality of power welding segments and the plurality of signal welding segments;

[0028] transporting the plurality of LED integrated chips to below the power supply welding section and the signal welding section coated with the welding material;

[0029] Sequentially soldering the power pin and the ground pin of the LED integrated chip to the power soldering segment, and soldering the input pin and the output pin of the LED integrated chip to the signal soldering segment;

[0030] Sequentially disconnecting the power supply welding segment between the power supply welding pin and the ground welding pin through the first cutting notch, and disconnecting the signal welding segment between the input welding pin and the output welding pin through the second cutting notch;

[0031] A plurality of the LED integrated chips are encapsulated in the encapsulation colloid to obtain the LED light strip.

[0032] This application has the following advantages:

[0033] In an embodiment of the present application, a packaging substrate is provided, a pin assembly is provided on the front side of the packaging substrate, a chip assembly is provided on the surface of the pin assembly, and a power supply pin, a grounding pin, an input pin and an output pin are provided on the back side of the packaging substrate; the grounding pin, the power supply pin, the output pin and the input pin are electrically connected to the pin assembly through vias provided inside the packaging substrate respectively; the pin assembly is electrically connected to the chip assembly; two opposite sides of the packaging substrate are respectively provided with trimming notches; the power supply pin and the grounding pin are respectively provided on the sides of the packaging substrate surface provided with a first trimming notch, and the power supply pin and the grounding pin are relatively arranged with the first trimming notch as an interval, wherein the first trimming notch is any one of the two trimming notches; the input pin and the output pin are respectively provided on the packaging substrate surface provided with a second trimming notch The side of the trimming notch, and the input solder pin and the output solder pin are relatively arranged with the second trimming notch as an interval, wherein the second trimming notch is the trimming notch of the two trimming notches except the first trimming notch. When the series welding mode is selected, only two wires (one power wire and one signal wire) can be used for welding, so that the ground solder pin and the power solder pin are respectively connected to the power wire, and the output solder pin and the input solder pin are respectively connected to the signal wire, and the wire between the ground solder pin and the power solder pin is cut through the first trimming notch, and the wire between the output solder pin and the input solder pin is cut through the second trimming notch, so as to realize the series connection of several LED integrated chips and the power supply, effectively saving the number of wires and reducing production costs, and at the same time ensuring that the output power of different LED integrated chips is the same, thereby achieving overall uniform light emission. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for the description of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 This is a schematic diagram of the front structure of an LED integrated chip provided by an embodiment of the present application;

[0036] Figure 2 This is a schematic diagram of the back structure of an LED integrated chip provided by an embodiment of the present application;

[0037] Figure 3 This is a flowchart of a method for preparing an LED integrated chip provided in one embodiment of the present application;

[0038] Figure 4 This is a schematic diagram of the front structure of an LED light strip provided by an embodiment of the present application;

[0039] Figure 5 This is a schematic side structural diagram of an LED light strip provided in one embodiment of the present application;

[0040] Figure 6 This is a flowchart of the steps of a method for preparing an LED light strip provided in one embodiment of the present application.

[0041] The reference numerals in the drawings of the specification are as follows:

[0042] 100. LED integrated chip; 101. Packaging substrate; 1011. First cutting notch; 1012. Second cutting notch; 102. Ground pin; 103. Power pin; 104. Spare pin; 105. Output pin; 106. Input pin; 107. First light-emitting chip; 108. Second light-emitting chip; 109. Third light-emitting chip; 110. Light-emitting control chip; 111. Power solder pin; 112. Ground solder pin; 113. Spare solder pin; 114. Input solder pin; 115. Output solder pin; 200. Packaging colloid; 300. Power wire; 400. Signal wire. DETAILED DESCRIPTION

[0043] To make the objectives, features, and advantages of this application more readily apparent, the present application is further described below in conjunction with the accompanying drawings and specific embodiments. It is apparent that the embodiments described are only a portion of the embodiments of this application, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments in this application without inventive effort are also within the scope of protection of this application.

[0044] Reference Figure 1-2 , shows an LED integrated chip 100 provided in an embodiment of the present application, comprising: a package substrate 101, a pin assembly arranged on the front surface of the package substrate 101, a chip assembly arranged on the surface of the pin assembly, and a power supply solder pin 111, a ground solder pin 112, an input solder pin 114, and an output solder pin 115 arranged on the back surface of the package substrate 101;

[0045] The ground solder pin 112, the power solder pin 111, the output solder pin 115 and the input solder pin 114 are electrically connected to the pin assembly through vias provided inside the package substrate 101; the pin assembly is electrically connected to the chip assembly;

[0046] The two opposite sides of the packaging substrate 101 are respectively provided with trimming notches; the power solder pin 111 and the ground solder pin 112 are respectively arranged on the sides of the packaging substrate 101 surface on which the first trimming notch 1011 is provided, and the power solder pin 111 and the ground solder pin 112 are relatively arranged with the first trimming notch 1011 as a spacing, wherein the first trimming notch 1011 is any one of the two trimming notches; the input solder pin 114 and the output solder pin 115 are respectively arranged on the sides of the packaging substrate 101 surface on which the second trimming notch 1012 is provided, and the input solder pin 114 and the output solder pin 115 are relatively arranged with the second trimming notch 1012 as a spacing, wherein the second trimming notch 1012 is the trimming notch of the two trimming notches other than the first trimming notch 1011.

[0047] In an embodiment of the present application, a packaging substrate 101 is provided, a pin assembly is provided on the front surface of the packaging substrate 101, a chip assembly is provided on the surface of the pin assembly, and a power solder pin 111, a ground solder pin 112, an input solder pin 114 and an output solder pin 115 are provided on the back surface of the packaging substrate 101; the ground solder pin 112, the power solder pin 111, the output solder pin 115 and the input solder pin 114 are respectively electrically connected to the pin assembly through a via hole provided inside the packaging substrate 101; the pin assembly is electrically connected to the chip assembly; a cutting notch is respectively provided on two opposite sides of the packaging substrate 101; the power solder pin 111 and the ground solder pin 112 are respectively provided on the surface of the packaging substrate 101 The side of the packaging substrate 101 is provided with a first trimming notch 1011, and the power solder pin 111 and the ground solder pin 112 are arranged opposite to each other with the first trimming notch 1011 as an interval, wherein the first trimming notch 1011 is any one of the two trimming notches; the input solder pin 114 and the output solder pin 115 are respectively arranged on the side of the packaging substrate 101 with a second trimming notch 1012, and the input solder pin 114 and the output solder pin 115 are arranged opposite to each other with the second trimming notch 1012 as an interval, wherein the second trimming notch 1012 is the trimming notch of the two trimming notches other than the first trimming notch 1011. During welding, a parallel or series welding mode can be selected as needed;

[0048] When the parallel welding mode is selected, only three wires (two power wires 300 and one signal wire 400) can be used for welding, with the grounding pin 112 connected to one power wire 300, the power pin 111 connected to another power wire 300, and the output pin 115 and the input pin 114 respectively connected to the signal wire 400. The wire between the output pin 115 and the input pin 114 is cut through the second cutting notch 1012 to achieve parallel connection of several LED integrated chips 100 and the power supply, effectively saving the number of wires and reducing production costs.

[0049] When the series welding mode is selected, only two wires (one power wire 300 and one signal wire 400) can be used for welding, so that the grounding welding pin 112 and the power welding pin 111 are respectively connected to the power wire 300, and the output welding pin 115 and the input welding pin 114 are respectively connected to the signal wire 400, and the wire between the grounding welding pin 112 and the power welding pin 111 is cut through the first cutting notch 1011, and the wire between the output welding pin 115 and the input welding pin 114 is cut through the second cutting notch 1012, so that several of the LED integrated chips 100 are connected in series with the power supply, which effectively saves the number of wires and reduces production costs. At the same time, it can ensure that the output power of different LED integrated chips 100 is the same, thereby achieving overall uniform light emission.

[0050] Next, an LED integrated chip 100 in this exemplary embodiment will be further described.

[0051] As an example, the power pin 111 and the input pin 114 are disposed on the same side of the surface of the package substrate 101; the ground pin 112 and the output pin 115 are disposed on the same side of the surface of the package substrate 101. When multiple LED integrated chips 100 are connected in series with a power source, the ground pin 112 of the preceding LED integrated chip 100 is electrically connected to the power pin 111 of the succeeding LED integrated chip 100; and the output pin 115 of the preceding LED integrated chip 100 is electrically connected to the input pin 114 of the succeeding LED integrated chip 100.

[0052] As another example, the power pin 111 and the output pin 115 are disposed on the same side of the surface of the package substrate 101; and the ground pin 112 and the input pin 114 are disposed on the same side of the surface of the package substrate 101. When multiple LED integrated chips 100 are connected in series with a power source, the ground pin 112 of the preceding LED integrated chip 100 is electrically connected to the power pin 111 of the succeeding LED integrated chip 100; and the input pin 114 of the preceding LED integrated chip 100 is electrically connected to the output pin 115 of the succeeding LED integrated chip 100.

[0053] In this embodiment, the first trimming notch 1011 and the second trimming notch 1012 are respectively arranged on the center line of the packaging substrate 101; the first trimming notch 1011 and the second trimming notch 1012 are arched, rectangular, trapezoidal or triangular. Specifically, the packaging substrate 101 is rectangular; the distance between the upper and lower sides of the packaging substrate 101 is greater than the distance between the left and right sides; the first trimming notch 1011 and the second trimming notch 1012 are respectively arranged on the upper and lower sides of the packaging substrate 101; the first trimming notch 1011 is an arch with the arc side facing downward; the second trimming notch 1012 is an arch with the arc side facing upward; the distance between the upper and lower sides of the first trimming notch 1011 and the second trimming notch 1012 is 1 / 5-1 / 3 of the length of the packaging substrate 101, preferably 1 / 4; the distance between the left and right sides of the first trimming notch 1011 and the second trimming notch 1012 is 1 / 5-1 / 2 of the width of the packaging substrate 101, preferably 1 / 3.

[0054] In this embodiment, the pin assembly includes a power pin 103, a ground pin 102, an input pin 106 and an output pin 105;

[0055] The power pin 103 and the ground pin 102 are respectively arranged on the side of the first trimming notch 1011 provided on the surface of the packaging substrate 101, and the power pin 103 and the ground pin 102 are arranged opposite to each other with the first trimming notch 1011 as an interval, wherein the power pin 103 corresponds to the position of the power solder pin 111, and the ground pin 102 corresponds to the position of the ground solder pin 112; the input pin 106 and the output pin 105 are respectively arranged on the side of the second trimming notch 1012 provided on the surface of the packaging substrate 101, and the input pin 106 and the output pin 105 are arranged opposite to each other with the second trimming notch 1012 as an interval, wherein the input pin 106 corresponds to the position of the input solder pin 114, and the output pin 105 corresponds to the position of the output solder pin 115;

[0056] The power pin 103 is electrically connected to the power solder foot 111 through a power via provided inside the packaging substrate 101; the ground pin 102 is electrically connected to the ground solder foot 112 through a ground via provided inside the packaging substrate 101; the input pin 106 is electrically connected to the input solder foot 114 through the input via provided inside the packaging substrate 101; the output pin 105 is electrically connected to the output solder foot 115 through an output via provided inside the packaging substrate 101.

[0057] In this embodiment, the package substrate 101 further includes a spare solder pin 113 disposed on the back surface thereof and a spare pin 104 disposed on the front surface thereof. The spare solder pin 113 is disposed on the surface of the package substrate 101 at a position corresponding to between the first cutting notch 1011 and the second cutting notch 1012. The spare pin 104 is disposed on the surface of the package substrate 101 at a position corresponding to between the first cutting notch 1011 and the second cutting notch 1012.

[0058] The spare pin 104 is electrically connected to the spare solder foot 113 through a spare via hole provided inside the package substrate 101 .

[0059] In this embodiment, the chip assembly includes a first light-emitting chip 107, a second light-emitting chip 108, a third light-emitting chip 109, and a light-emitting control chip 110; the first light-emitting chip 107, the second light-emitting chip 108, and the third light-emitting chip 109 are respectively arranged on the surface of the power pin 103; the light-emitting control chip 110 is arranged on the surface of the spare pin 104; the light-emitting control chip 110 includes a chip substrate and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, and an eighth pin arranged on the chip substrate;

[0060] The first light-emitting chip 107 and the second light-emitting chip 108 are electrically connected to the power pin 103, respectively; the first pin is electrically connected to the cathode of the first light-emitting chip 107; the second pin is electrically connected to the anode of the first light-emitting chip 107; the third pin is electrically connected to the cathode of the third light-emitting chip 109; the fourth pin is electrically connected to the ground pin 102; the fifth pin is electrically connected to the power pin 103; the sixth pin is electrically connected to the output pin 105; and the seventh pin is electrically connected to the input pin 106. Specifically, the first light-emitting chip 107 is a red light-emitting chip; the second light-emitting chip 108 is a green light-emitting chip; the third light-emitting chip 109 is a blue light-emitting chip; and the light control chip 110 is a programmable control chip.

[0061] Reference Figure 3 , shows a method for preparing the LED integrated chip 100 as described above, provided in one embodiment of the present application, comprising:

[0062] S310, opening a via hole on the surface of the substrate and embedding a conductive pillar in the via hole;

[0063] S320, respectively forming the first cutting notch 1011 and the second cutting notch 1012 on two opposite sides of the substrate where the conductive pillars are embedded, to obtain the packaging substrate 101;

[0064] S330, mounting the power solder pins 111 and the ground solder pins 112 on the back side of the package substrate 101 at positions corresponding to both sides of the first cutting notch 1011, and mounting the input solder pins 114 and the output solder pins 115 on the back side of the package substrate 101 at positions corresponding to both sides of the second cutting notch 1012;

[0065] S340 , mounting the pin assembly on the front surface of the packaging substrate 101 , and mounting the chip assembly on the surface of the pin assembly to obtain the LED integrated chip 100 .

[0066] Reference Figure 4-5 , shows an LED light strip provided by an embodiment of the present application, comprising: a plurality of LED lamp beads arranged in sequence; the LED lamp beads include a packaging colloid 200 and an LED integrated chip 100 as described in any one of the above items; the packaging colloid 200 is adhered to the surface of the LED integrated chip 100;

[0067] The grounding solder pin 112 of the LED integrated chip 100 is electrically connected to the power solder pin 111 of the adjacent LED integrated chip 100 ; the output solder pin 115 of the LED integrated chip 100 is electrically connected to the input solder pin 114 of the adjacent LED integrated chip 100 .

[0068] In an embodiment of the present application, a plurality of LED lamp beads are arranged in sequence; the LED lamp beads include a packaging colloid 200 and an LED integrated chip 100 as described in any one of the above items; the packaging colloid 200 is adhered to the surface of the LED integrated chip 100; the grounding solder pin 112 of the LED integrated chip 100 is electrically connected to the power solder pin 111 of the adjacent LED integrated chip 100; the output solder pin 115 of the LED integrated chip 100 is electrically connected to the input solder pin 114 of the adjacent LED integrated chip 100, so that the plurality of LED integrated chips 100 are connected in series with the power supply, which can ensure that the output power of different LED integrated chips 100 is the same, thereby achieving overall uniform light emission.

[0069] Next, an LED light strip in this exemplary embodiment will be further described.

[0070] This embodiment further includes a rectifier, which is electrically connected to the power supply and the power pins 111 of the first LED integrated chip 100. The rectifier is used to rectify high-voltage alternating current and then supply it to the LED integrated chip 100.

[0071] In this embodiment, a controller is further included; the output end of the controller is electrically connected to the input solder pin 114 of the first or last LED integrated chip 100. Specifically, when the power solder pin 111 and the input solder pin 114 are arranged on the same side of the surface of the packaging substrate 101, the output end of the controller is electrically connected to the input solder pin 114 of the first LED integrated chip 100; when the power solder pin 111 and the output solder pin 115 are arranged on the same side of the surface of the packaging substrate 101, the output end of the controller is electrically connected to the input solder pin 114 of the last LED integrated chip 100; the controller is also provided with a power supply end and a ground end; the power supply end of the controller is connected to the power supply; and the ground end of the controller is grounded.

[0072] In this embodiment, the plurality of LED lamp beads are arranged on the same straight line. Specifically, the plurality of LED lamp beads are arranged equidistantly at preset intervals.

[0073] Reference Figure 6 , shows a method for preparing the LED light strip as described above provided in one embodiment of the present application, comprising:

[0074] S610, removing the insulation layers of the power wire 300 and the signal wire 400 at preset lengths and intervals, respectively, so that the core of the power wire 300 is exposed to form a plurality of power welding segments, and the core of the signal wire 400 is exposed to form a plurality of signal welding segments;

[0075] S620, sequentially coating welding material on the surfaces of the plurality of power welding segments and the plurality of signal welding segments;

[0076] S630, transporting a plurality of the LED integrated chips 100 to below the power supply welding section and the signal welding section coated with the welding material;

[0077] S640, sequentially soldering the power soldering pin 111 and the ground soldering pin 112 of the LED integrated chip 100 to the power soldering segment, and soldering the input soldering pin 114 and the output soldering pin 115 of the LED integrated chip 100 to the signal soldering segment;

[0078] S650, sequentially disconnecting the power supply welding section between the power welding pin 111 and the ground welding pin 112 through the first cutting notch 1011, and disconnecting the signal welding section between the input welding pin 114 and the output welding pin 115 through the second cutting notch 1012;

[0079] S660 , encapsulating a plurality of the LED integrated chips 100 in the encapsulation colloid 200 to obtain the LED light strip.

[0080] Next, a method for preparing an LED light strip in this exemplary embodiment will be further described.

[0081] As described in step S610, the insulation layers of the power conductor 300 and the signal conductor 400 are removed at preset lengths and preset intervals, respectively, so that the conductor core of the power conductor 300 is exposed to form a plurality of power welding segments, and the conductor core of the signal conductor 400 is exposed to form a plurality of signal welding segments.

[0082] The power conductor 300 and the signal conductor 400 are fed through a wire feeding mechanism, which includes a coil frame for placing the wire coil material and a tension controller for tension control, wherein the tension controller includes multiple tensioning pulleys. The power conductor 300 and the signal conductor 400 are fed to a wire stripping station, where a wire stripping mechanism is provided. The wire stripping mechanism removes the insulation layers of the power conductor 300 and the signal conductor 400 at predetermined lengths and predetermined intervals, exposing the conductor core of the power conductor 300 to form a plurality of power welding segments, and the conductor core of the signal conductor 400 to form a plurality of signal welding segments. The predetermined length corresponds to the distance between the left and right sides of the LED integrated chip 100, and the number of the power welding segments and the number of the signal welding segments correspond to the number of the LED integrated chips 100.

[0083] As described in step S620, welding material is sequentially coated on the surfaces of the plurality of power welding segments and the plurality of signal welding segments.

[0084] The wire feeding mechanism delivers the power conductors 300 and the signal conductors 400 to a spot welding station. The spot welding station is equipped with a spot welding mechanism that sequentially applies welding material to the surfaces of the power welding segments and the signal welding segments. For example, the spot welding mechanism includes a spot tin syringe, and the welding material is preferably solder paste.

[0085] As described in step S630 , a plurality of the LED integrated chips 100 are respectively transported to below the power supply welding section and the signal welding section coated with the welding material.

[0086] The LED integrated chips 100 on the chip tape are transported to the material picking position by a vibration plate or a feeder; the LED integrated chips 100 are sequentially adsorbed at the material picking position by a flipping robot, and then the flipping robot is rotated 180° so that the power solder pin 111, the ground solder pin 112, the input solder pin 114 and the output solder pin 115 of the LED integrated chip 100 face upward; the flipped LED integrated chip 100 is sucked by a transport robot, and the LED integrated chip 100 is transported to the positioning groove on the rotating feed plate; the rotating feed plate transports the LED integrated chips 100 to the bottom of the power soldering section and the signal soldering section coated with the welding material.

[0087] As described in step S640, the power solder pin 111 and the ground solder pin 112 of the LED integrated chip 100 are soldered to the power solder segment in sequence, and the input solder pin 114 and the output solder pin 115 of the LED integrated chip 100 are soldered to the signal solder segment.

[0088] Detecting whether the LED integrated chip 100 is in the positioning groove and whether the LED integrated chip 100 is placed in the correct position. Specifically, a CCD camera is used to take a picture of the positioning groove, and a computer determines whether the LED integrated chip 100 is in the positioning groove and whether the LED integrated chip 100 is placed in the correct position based on the picture.

[0089] The LED integrated chip 100 is driven to move upward, causing the power solder pin 111 and the ground solder pin 112 of the LED integrated chip 100 to contact or approach the power solder segment, and the input solder pin 114 and the output solder pin 115 to contact or approach the signal solder segment. Specifically, the LED integrated chip 100 is placed in a positioning slot at the upper end of a vertically movable push rod; when the push rod moves below the LED integrated chip 100, a push wheel is driven to move below the push rod, causing the lower end of the push rod to slide along the cylindrical surface of the push wheel, thereby driving the push rod upward.

[0090] Use a welding head to press on the power welding section and the signal welding section from top to bottom to melt the welding material so as to weld the power welding pin 111 and the ground welding pin 112 of the LED integrated chip 100 to the power welding section respectively, and weld the input welding pin 114 and the output welding pin 115 of the LED integrated chip 100 to the signal welding section respectively.

[0091] As described in step S650, the power welding section between the power welding pin 111 and the ground welding pin 112 is disconnected through the first cutting notch 1011, and the signal welding section between the input welding pin 114 and the output welding pin 115 is disconnected through the second cutting notch 1012.

[0092] The power wire 300 and the signal wire 400 welded with the LED integrated chip 100 are transported to the disconnection station by the wire feeding mechanism. The disconnection station is provided with a wire punching mechanism, which includes a punching knife and a cylinder for driving the punching knife to move downward. The power welding section between the power welding pin 111 and the grounding welding pin 112, and the signal welding section between the input welding pin 114 and the output welding pin 115 are respectively disconnected by the punching knife.

[0093] As described in step S660 , a plurality of the LED integrated chips 100 are packaged inside the packaging colloid 200 to obtain the LED light strip.

[0094] The LED integrated chip 100 is transported to the packaging station by the wire feeding mechanism, where it is encapsulated in the packaging body 200 by a dispensing mechanism to form the LED lamp bead. The dispensing mechanism includes a dispensing mechanism for dispensing curable adhesive on the LED integrated chip 100 and a curing mechanism for curing the curable adhesive to form the packaging body 200. The curable adhesive may be UV adhesive.

[0095] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0096] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or terminal device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or terminal device that includes the element.

[0097] The above is a detailed introduction to an LED integrated chip, an LED light strip and a preparation method thereof provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An LED integrated chip, characterized in that: The invention comprises: a packaging substrate, a pin assembly arranged on the front of the packaging substrate, a chip assembly arranged on the surface of the pin assembly, and a power supply solder pin, a ground solder pin, an input solder pin and an output solder pin arranged on the back of the packaging substrate; The ground solder pin, the power solder pin, the output solder pin and the input solder pin are electrically connected to the pin assembly through vias provided inside the package substrate; the pin assembly is electrically connected to the chip assembly; Two opposite sides of the packaging substrate are respectively provided with trimming notches; the power solder pin and the ground solder pin are respectively arranged on the side of the packaging substrate surface provided with the first trimming notch, and the power solder pin and the ground solder pin are arranged opposite to each other with the first trimming notch as an interval, wherein the first trimming notch is any one of the two trimming notches; the input solder pin and the output solder pin are respectively arranged on the side of the packaging substrate surface provided with the second trimming notch, and the input solder pin and the output solder pin are arranged opposite to each other with the second trimming notch as an interval, wherein the second trimming notch is the trimming notch of the two trimming notches other than the first notch; The first trimming notch and the second trimming notch are respectively arranged on the center line of the packaging substrate; the first trimming notch is an arch with the arc side facing downward; the second trimming notch is an arch with the arc side facing upward; the distance between the upper and lower sides of the first trimming notch and the second trimming notch is respectively 1 / 4 of the length of the packaging substrate; the distance between the left and right sides of the first trimming notch and the second trimming notch is respectively 1 / 3 of the width of the packaging substrate; When several of the LED integrated chips are connected in series with a power supply, the grounding pin of the LED integrated chip is electrically connected to the power pin of an adjacent LED integrated chip through a power wire; the output pin of the LED integrated chip is electrically connected to the input pin of an adjacent LED integrated chip through a signal wire; the power wire between the power pin and the grounding pin of the LED integrated chip is cut off by cutting through the first cutting notch; and the signal wire between the input pin and the output pin of the LED integrated chip is cut off by cutting through the second cutting notch.

2. The LED integrated chip according to claim 1, characterized in that: The pin assembly includes a power pin, a ground pin, an input pin and an output pin; The power pin and the ground pin are respectively arranged on the side of the packaging substrate surface where the first trimming notch is provided, and the power pin and the ground pin are arranged opposite to each other with the first trimming notch as an interval, wherein the power pin corresponds to the position of the power solder leg, and the ground pin corresponds to the position of the ground solder leg; the input pin and the output pin are respectively arranged on the side of the packaging substrate surface where the second trimming notch is provided, and the input pin and the output pin are arranged opposite to each other with the second trimming notch as an interval, wherein the input pin corresponds to the position of the input solder leg, and the output pin corresponds to the position of the output solder leg; The power pin is electrically connected to the power solder pin; the ground pin is electrically connected to the ground solder pin; the input pin is electrically connected to the input solder pin; and the output pin is electrically connected to the output solder pin.

3. The LED integrated chip according to claim 2, characterized in that: The chip assembly includes a first light-emitting chip, a second light-emitting chip, a third light-emitting chip and a light-emitting control chip; the light-emitting control chip includes a chip substrate and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin arranged on the chip substrate; The first light-emitting chip and the second light-emitting chip are electrically connected to the power pin respectively; the first pin is electrically connected to the cathode of the first light-emitting chip; the second pin is electrically connected to the anode of the first light-emitting chip; the third pin is electrically connected to the cathode of the third light-emitting chip; the fourth pin is electrically connected to the ground pin; the fifth pin is electrically connected to the power pin; the sixth pin is electrically connected to the output pin; and the seventh pin is electrically connected to the input pin.

4. The LED integrated chip according to claim 1, characterized in that: It also includes a spare solder foot arranged on the back side of the packaging substrate; the spare solder foot is arranged at a position on the surface of the packaging substrate corresponding to between the first trimming notch and the second trimming notch; the spare pin is electrically connected to the pin assembly through a via hole arranged inside the packaging substrate.

5. A method for preparing an LED integrated chip according to any one of claims 1 to 4, characterized in that: include: Opening a via hole on the surface of the substrate and burying a conductive column in the via hole; The first cutting notch and the second cutting notch are respectively formed on two opposite sides of the substrate where the conductive pillars are embedded, to obtain the packaging substrate; Mounting the power solder pins and the ground solder pins on the back of the package substrate at positions corresponding to both sides of the first cutting notch, and mounting the input solder pins and the output solder pins on the back of the package substrate at positions corresponding to both sides of the second cutting notch; The pin assembly is mounted on the front surface of the packaging substrate, and the chip assembly is mounted on the surface of the pin assembly to obtain the LED integrated chip.

6. An LED light strip, characterized in that: include: A plurality of LED lamp beads are arranged in sequence; the LED lamp beads include a packaging colloid and an LED integrated chip according to any one of claims 1 to 4; the packaging colloid is adhered to the surface of the LED integrated chip; The grounding solder pin of the LED integrated chip is electrically connected to the power solder pin of the adjacent LED integrated chip; the output solder pin of the LED integrated chip is electrically connected to the input solder pin of the adjacent LED integrated chip.

7. The LED light strip according to claim 6, characterized in that: It also includes a rectifier; the rectifier is electrically connected to the power supply and the power supply welding pins of the first LED integrated chip respectively.

8. The LED light strip according to claim 6, characterized in that: It also includes a controller; the output end of the controller is electrically connected to the input soldering pin of the first LED integrated chip.

9. A method for preparing an LED light strip according to any one of claims 6 to 8, characterized in that: include: Removing the insulation layers of the power conductor and the signal conductor respectively at preset lengths and preset intervals, exposing the conductor core of the power conductor to form a plurality of power welding segments, and exposing the conductor core of the signal conductor to form a plurality of signal welding segments; sequentially coating welding material on the surfaces of the plurality of power welding segments and the plurality of signal welding segments; transporting the plurality of LED integrated chips to below the power supply welding section and the signal welding section coated with the welding material; Sequentially soldering the power pin and the ground pin of the LED integrated chip to the power soldering segment, and soldering the input pin and the output pin of the LED integrated chip to the signal soldering segment; Sequentially disconnecting the power supply welding segment between the power supply welding pin and the ground welding pin through the first cutting notch, and disconnecting the signal welding segment between the input welding pin and the output welding pin through the second cutting notch; A plurality of the LED integrated chips are encapsulated in the encapsulation colloid to obtain the LED light strip.

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