Display panel and manufacturing method thereof, and display device

Abstract

The embodiments of the present disclosure provide a display panel and a method for preparing the same, and a display device, which can improve the overall light extraction efficiency of OLEDs. The display panel includes a substrate, a display structure layer disposed on the substrate, and an anti-glare layer disposed on a side of the display structure layer away from the substrate, the display structure layer includes a light extraction area and a non-light extraction area, the anti-glare layer includes a light-transmitting layer and a protruding structure layer, the protruding structure layer is located on a side of the light-transmitting layer away from the substrate, the protruding structure layer includes a protrusion toward the substrate, the orthographic projection of the protrusion on the substrate at least partially overlaps with the orthographic projection of the non-light extraction area of ​​the display structure layer on the substrate, and the refractive index of the light-transmitting layer is higher than the refractive index of the protruding structure layer. By sacrificing the side-view light extraction, the front-view light extraction gain is improved.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to but are not limited to the field of display technology, and in particular to a display panel and a method for manufacturing the same, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is an active light-emitting display device with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, bendability and low cost. With the continuous development of display technology, flexible display devices (Flexible Display) using OLED as the light-emitting device and thin film transistor (TFT) for signal control have become the mainstream products in the current display field.

[0003] However, the overall light extraction efficiency of OLED in the related art is low. Summary of the invention

[0004] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0005] The technical problem to be solved by the embodiments of the present disclosure is to provide a display panel and a method for manufacturing the same, and a display device to improve the overall light extraction efficiency of OLEDs.

[0006] On the one hand, an embodiment of the present disclosure provides a display panel, comprising a substrate, a display structure layer arranged on the substrate, and an anti-glare layer arranged on a side of the display structure layer away from the substrate, the display structure layer comprising a light emitting area and a non-light emitting area, the anti-glare layer comprising a light-transmitting layer and a convex structure layer, the convex structure layer being located on a side of the light-transmitting layer away from the substrate, the convex structure layer comprising a convexity toward the substrate, the orthographic projection of the convexity on the substrate at least partially overlapping with the orthographic projection of the non-light emitting area of ​​the display structure layer on the substrate, and the refractive index of the light-transmitting layer is higher than the refractive index of the convex structure layer.

[0007] On the other hand, an embodiment of the present disclosure further provides a display device, comprising the aforementioned display panel.

[0008] In another aspect, the present disclosure also provides a method for preparing a display panel, comprising:

[0009] Forming a display structure layer on a substrate, wherein the display structure layer includes a light emitting area and a non-light emitting area;

[0010] An anti-glare layer is formed on a side of the display structure layer away from the substrate, the anti-glare layer includes a light-transmitting layer and a convex structure layer, the convex structure layer is located on a side of the light-transmitting layer away from the substrate, the convex structure layer includes a convexity facing the substrate, the orthographic projection of the convexity on the substrate at least partially overlaps with the orthographic projection of the non-light-emitting area of ​​the display structure layer on the substrate, and the refractive index of the light-transmitting layer is higher than the refractive index of the convex structure layer.

[0011] The exemplary embodiments of the present disclosure disclose a display panel and a method for preparing the same, and a display device. By providing a convex structure layer with a low refractive index and a light-transmitting layer with a high refractive index, the total internal reflection of light in the oblique viewing direction is reduced by utilizing the total reflection principle, thereby improving the light output efficiency in the normal viewing direction. That is, when light emitted from the light output area is irradiated on the convex part, when the incident angle is greater than the critical angle, total reflection occurs, so that the light is emitted from the normal viewing direction, and the light output gain at the normal viewing angle is improved by sacrificing the side viewing angle.

[0012] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0013] Other aspects will be apparent upon reading and understanding the drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the contents of the present disclosure.

[0015] Figure 1 is a structural schematic diagram of a display device;

[0016] Figure 2 It is a schematic diagram of a planar structure of a display substrate;

[0017] Figure 3 A schematic diagram of a cross-sectional structure of a display substrate;

[0018] Figure 4 It is a schematic diagram of OLED light emission in the related technology;

[0019] Figure 5 This is a schematic diagram of a display panel structure according to an embodiment of the present disclosure;

[0020] Figure 6 This is another schematic diagram of the structure of a display panel according to an embodiment of the present disclosure;

[0021] Figure 7 This is a schematic diagram of another display panel structure according to an embodiment of the present disclosure;

[0022] Figure 8a This is a real picture after the raised structure layer is prepared on the glass cover;

[0023] Figure 8b It is a local enlarged view of the raised structure layer;

[0024] Figure 9a A schematic diagram of a patterning process of an exemplary embodiment of the present disclosure;

[0025] Figure 9b is a schematic diagram of an exemplary embodiment of the present disclosure after a patterning process;

[0026] Fig.9c A schematic diagram of a glass cover plate according to an exemplary embodiment of the present disclosure;

[0027] Figure 9d This is a schematic diagram of a glass cover plate after a light-transmitting layer is coated on an exemplary embodiment of the present disclosure;

[0028] Fig.9e FIG. 2 is a schematic diagram of another glass cover according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail in conjunction with the accompanying drawings below. Note that the embodiments can be implemented in multiple different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0030] In the drawings, the size of each component, the thickness of a layer, or the area is sometimes exaggerated for the sake of clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to this size, and the shape and size of each component in the drawings do not reflect the true proportion. In addition, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes or values ​​shown in the drawings.

[0031] In the present specification, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.

[0032] In this specification, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which each constituent element is described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.

[0033] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0034] In this specification, a transistor refers to an element including at least three test terminals: a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (drain electrode test terminal, drain region, or drain electrode) and a source electrode (source electrode test terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to a region where current mainly flows.

[0035] In this specification, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using transistors with opposite polarities or when the direction of current changes during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in this specification, the "source electrode" and the "drain electrode" may be interchanged.

[0036] In this specification, "electrical connection" includes the case where components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0037] In this specification, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.

[0038] In this specification, "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced by "conductive film". Similarly, "insulating film" may be replaced by "insulating layer".

[0039] The term "about" in the present disclosure refers to a numerical value that is not strictly limited to allow for process and measurement errors.

[0040] Figure 1 FIG. 1 is a schematic diagram of the structure of a display device. Figure 1As shown, the display device may include a timing controller, a data driver, a scan driver, a light emitting driver and a pixel array, the timing controller is respectively connected to the data driver, the scan driver and the light emitting driver, the data driver is respectively connected to a plurality of data signal lines (D1 to Dn), the scan driver is respectively connected to a plurality of scan signal lines (S1 to Sm), and the light emitting driver is respectively connected to a plurality of light emitting signal lines (E1 to Eo). The pixel array may include a plurality of sub-pixels Pxij, i and j may be natural numbers, at least one sub-pixel Pxij may include a circuit unit and a light emitting device connected to the circuit unit, the circuit unit may include at least one scan signal line, at least one data signal line, at least one light emitting signal line and a pixel driving circuit. In an exemplary embodiment, the timing controller may provide a grayscale value and a control signal suitable for the specifications of the data driver to the data driver, may provide a clock signal suitable for the specifications of the scan driver, a scan start signal, etc. to the scan driver, and may provide a clock signal suitable for the specifications of the light emitting driver, an emission stop signal, etc. to the light emitting driver. The data driver may generate a data voltage to be provided to the data signal lines D1, D2, D3, ... and Dn using the grayscale value and the control signal received from the timing controller. For example, the data driver may sample the grayscale value using the clock signal, and apply the data voltage corresponding to the grayscale value to the data signal lines D1 to Dn in units of pixel rows, where n may be a natural number. The scan driver may generate a scan signal to be provided to the scan signal lines S1, S2, S3, ... and Sm by receiving a clock signal, a scan start signal, etc. from the timing controller. For example, the scan driver may sequentially provide a scan signal with a conduction level pulse to the scan signal lines S1 to Sm. For example, the scan driver may be constructed in the form of a shift register, and may sequentially transmit the scan start signal provided in the form of a conduction level pulse to the next level circuit under the control of the clock signal to generate a scan signal, where m may be a natural number. The light emitting driver may generate an emission signal to be provided to the light emitting signal lines E1, E2, E3, ... and Eo by receiving a clock signal, an emission stop signal, etc. from the timing controller. For example, the light emitting driver may sequentially provide an emission signal having a cut-off level pulse to the light emitting signal lines E1 to Eo. For example, the light emitting driver may be constructed in the form of a shift register, and may generate an emission signal in a manner of sequentially transmitting an emission stop signal provided in the form of a cut-off level pulse to a next stage circuit under the control of a clock signal, and o may be a natural number.

[0041] Figure 2 FIG. 1 is a schematic diagram of a planar structure of a display substrate. Figure 2As shown, the display substrate may include a plurality of pixel units P arranged in a matrix, at least one of the plurality of pixel units P includes a first sub-pixel P1 emitting a first color light, a second sub-pixel P2 emitting a second color light, a third sub-pixel P3 emitting a third color light, and a fourth sub-pixel P4 emitting a fourth color light, and the four sub-pixels may each include a circuit unit and a light-emitting device, the circuit unit may include a scan signal line, a data signal line, and a pixel driving circuit, the pixel driving circuit is respectively connected to the scan signal line and the data signal line, the pixel driving circuit is configured to receive a data voltage transmitted by the data signal line under the control of the scan signal line, and output a corresponding current to the light-emitting device. The light-emitting device in each sub-pixel is respectively connected to the pixel driving circuit of the sub-pixel, and the light-emitting device is configured to emit light of corresponding brightness in response to the current output by the pixel driving circuit of the sub-pixel.

[0042] In an exemplary embodiment, the first subpixel P1 may be a red subpixel (R) emitting red light, the second subpixel P2 may be a white subpixel (W) emitting white light, the third subpixel P3 may be a blue subpixel (B) emitting blue light, and the fourth subpixel P4 may be a green subpixel (G) emitting green light.

[0043] In an exemplary embodiment, the shape of the sub-pixel may be a rectangle, a diamond, a pentagon, or a hexagon. In an exemplary embodiment, four sub-pixels may be arranged in parallel horizontally to form a RWBG pixel arrangement. In another exemplary embodiment, the four sub-pixels may be arranged in a square, a diamond, or in parallel vertically, which is not limited in the present disclosure.

[0044] In an exemplary embodiment, a plurality of sub-pixels sequentially arranged in a horizontal direction are referred to as a pixel row, a plurality of sub-pixels sequentially arranged in a vertical direction are referred to as a pixel column, and the plurality of pixel rows and the plurality of pixel columns constitute an array-arranged pixel array.

[0045] Figure 3 FIG. 1 is a schematic diagram of a cross-sectional structure of a display substrate, illustrating the structure of three sub-pixels of an OLED display substrate. Figure 3 As shown, on a plane perpendicular to the display substrate, each sub-pixel in the display substrate may include a display structure layer disposed on a substrate 101, wherein the display structure layer includes a driving circuit layer 102, a light emitting structure layer 103 disposed on a side of the driving circuit layer 102 away from the substrate, and an encapsulation layer 104 disposed on a side of the light emitting structure layer 103 away from the substrate. In some possible implementations, the display substrate may include other film layers, such as spacers, etc., which are not limited in the present disclosure.

[0046] In an exemplary embodiment, the substrate 101 may be a flexible substrate or a rigid substrate. The driving circuit layer 102 of each sub-pixel may include a plurality of signal lines and a pixel driving circuit, and the pixel driving circuit may include a plurality of transistors and a storage capacitor. Figure 3 Only part of the driving transistor 210 and the storage capacitor 211 are used as examples for illustration. The light-emitting structure layer 103 of each sub-pixel may include multiple film layers constituting a light-emitting device, and the multiple film layers may include an anode 301, a pixel definition layer 302, an organic light-emitting layer 303 and a cathode 304. The anode 301 is connected to the drain electrode of the driving transistor 210 through a via, the organic light-emitting layer 303 is connected to the anode 301, and the cathode 301 is connected to the organic light-emitting layer 303. The organic light-emitting layer 303 emits light of corresponding colors under the drive of the anode 301 and the cathode 304. The encapsulation layer 104 may include a first encapsulation layer 401, a second encapsulation layer 402 and a third encapsulation layer 403 stacked together. The first encapsulation layer 401 and the third encapsulation layer 403 may be made of inorganic materials, and the second encapsulation layer 402 may be made of organic materials. The second encapsulation layer 402 is arranged between the first encapsulation layer 401 and the third encapsulation layer 403, which can ensure that external water vapor cannot enter the light-emitting structure layer 103.

[0047] In an exemplary embodiment, the organic light emitting layer 303 may include a stacked hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), an emitting layer (EML), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL). In an exemplary embodiment, the hole injection layer and the electron injection layer of all sub-pixels may be a common layer connected together, the hole transport layer and the electron transport layer of all sub-pixels may be a common layer connected together, the hole blocking layer of all sub-pixels may be a common layer connected together, and the emitting layer and the electron blocking layer of adjacent sub-pixels may have a small overlap, or may be isolated.

[0048] In exemplary embodiments, the pixel driving circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C structure.

[0049] In an exemplary embodiment, the light-emitting device can be an OLED, including a stacked first electrode (anode), an organic light-emitting layer, and a second electrode (cathode), or can be a QLED, including a stacked first electrode (anode), a quantum dot light-emitting layer, and a second electrode (cathode).

[0050] In an exemplary embodiment, the light emitting device may be an organic light emitting diode (OLED) including a first electrode (anode), an organic light emitting layer, and a second electrode (cathode) stacked.

[0051] In related technologies, such as Figure 4 As shown, light is emitted from the glass cover (CG) of the OLED display panel into the air. Since the refractive index of the glass cover is higher than that of the air, when the incident angle of the light at the glass cover interface reaches or exceeds the critical angle of total reflection, total internal reflection will occur, that is, most of the emitted light is totally reflected and scattered in the device and consumed, among which the light extraction efficiency of red and green light is less than 30%, and the light extraction efficiency of blue light is less than 20%, resulting in low overall light extraction efficiency.

[0052] To this end, the present disclosure provides a display panel, such as Figure 5 As shown, it includes a substrate 10, a display structure layer 20 arranged on the substrate, and an anti-glare layer 30 arranged on the side of the display structure layer 20 away from the substrate 10, the display structure layer 20 includes a light emitting area 21 and a non-light emitting area 22, the anti-glare layer 30 includes a light-transmitting layer 31 and a convex structure layer, the convex structure layer is located on the side of the light-transmitting layer 31 away from the substrate 10, the convex structure layer includes a convexity 32 facing the substrate 10, the orthographic projection of the convexity 32 on the substrate 10 is at least partially overlapped with the orthographic projection of the non-light emitting area 22 of the display structure layer on the substrate, and the refractive index of the light-transmitting layer 31 is higher than the refractive index of the convex structure layer.

[0053] By setting a raised structural layer with a low refractive index and a light-transmitting layer with a high refractive index, the principle of total reflection is used to adjust the incident angle of the light when it reaches the interface, and the total internal reflection of the light in the oblique viewing direction is reduced, thereby improving the light output efficiency in the normal viewing direction. That is, when the light emitted from the light output area shines on the protrusion, when the incident angle is greater than the critical angle, total reflection occurs, so that the light is emitted from the normal viewing direction, and the light output gain at the normal viewing angle is improved by sacrificing the side viewing angle.

[0054] The protrusion structure layer includes regularly arranged protrusion structures. In a direction perpendicular to the substrate, the protrusion structure includes a plurality of protrusions facing the substrate.

[0055] Taking the example that the sub-pixel includes a red sub-pixel, a blue sub-pixel and a green sub-pixel, the light-emitting area includes a red light-emitting area, a blue light-emitting area and a green light-emitting area, and the light-emitting efficiency of different colors of light can be adjusted by adjusting the position of the protrusion 32. In an exemplary embodiment, the orthographic projection of the protrusion 32 on the substrate is within the orthographic projection range of the non-light-emitting area 22 of the display structure layer on the substrate.

[0056] In an exemplary embodiment, in a direction perpendicular to the substrate, the cross section of the protrusion 32 is a square, a rectangle or a trapezoid; when the cross section of the protrusion 32 is a trapezoid, as shown in FIG. Figure 6 As shown, the side of the trapezoid close to the base is the lower base. When the cross section of the protrusion is a trapezoid, the incident angle of the light irradiated on the cross section of the protrusion can be increased, which is conducive to the occurrence of full emission.

[0057] In an exemplary embodiment, the convex structure layer may be a flat layer (OC), and the convex structure layer material may be a transparent insulating material as long as it can meet the refractive index requirement less than that of the light-transmitting layer, for example, it may include one or more of the following materials: bright transparent resin, polyimide (PI) and glass.

[0058] In an exemplary embodiment, the material of the light-transmitting layer can be a transparent insulating material as long as it can meet the refractive index requirement greater than that of the protruding structure layer, for example, including one or more of the following: optically transparent resin, optically transparent glue, polyimide, acrylic ink and other flat layer materials.

[0059] In an exemplary embodiment, the refractive index range of the protruding structure layer may be greater than or equal to 1.45 and less than or equal to 1.55, that is, [1.45, 1.55]; the refractive index range of the light-transmitting layer may be greater than or equal to 1.6 and less than or equal to 1.75, that is, [1.6, 1.75]. This ensures that the refractive index of the protruding structure layer is lower than the refractive index of the light-transmitting layer, so that when light enters a low-refractive-index medium from a high-refractive-index medium, the light is reflected instead of refracted, thereby improving the light-exiting efficiency of the light-exiting area, and further improving the light-exiting efficiency of the entire OLED.

[0060] In an exemplary embodiment, the display panel further comprises a cover plate located on a side of the anti-glare layer away from the substrate, and the raised structure layer and the cover plate may be an integral structure, such as Figure 7 When preparing the glass cover plate, micrometer-scale patterned protrusions can be formed on the glass cover plate by etching process, such as Figure 8a and 8b shown.

[0061] In an exemplary embodiment, the display structure layer further includes a polarizer, and the polarizer is located on a side of the display structure layer close to the anti-glare layer.

[0062] The following is an exemplary description using the preparation process of a display panel.

[0063] The "patterning process" mentioned in the present disclosure includes the processes of coating photoresist, mask exposure, development, etching, stripping photoresist, etc. for metal materials, inorganic materials or transparent conductive materials, and includes the processes of coating organic materials, mask exposure and development, etc. for organic materials. Deposition can be any one or more of sputtering, evaporation, and chemical vapor deposition, coating can be any one or more of spraying, spin coating and inkjet printing, and etching can be any one or more of dry etching and wet etching, which are not limited in the present disclosure. "Thin film" refers to a layer of thin film made by deposition, coating or other processes of a certain material on a substrate. If the "thin film" does not require a patterning process during the entire production process, the "thin film" can also be called a "layer". If the "thin film" requires a patterning process during the entire production process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". The "A and B are arranged in the same layer" mentioned in the present disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer is the size of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of the present disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0064] In an exemplary embodiment, taking the preparation of patterned protrusions on a glass substrate as an example, the preparation process of a display panel may include the following operations.

[0065] 1. Prepare a substrate on a glass carrier 1. In an exemplary embodiment, the substrate may be a flexible substrate, or may be a rigid substrate. The rigid substrate may be, but is not limited to, one or more of glass and quartz. The flexible substrate may, for example, be coated with a layer of flexible material on the glass carrier 1, solidified into a film, and form a first flexible material layer. In other embodiments, the flexible substrate may include a first flexible material layer, a first inorganic material layer, a base semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked on the glass carrier. The materials of the first and second flexible material layers may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, and the materials of the first and second inorganic material layers may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the substrate. The first and second inorganic material layers may be referred to as barrier layers, and the material of the base semiconductor layer may be amorphous silicon (a-si). In an exemplary embodiment, taking the stacked structure PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, its preparation process may include: first coating a layer of polyimide on the glass carrier 1, and forming a first flexible (PI1) layer after curing; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing a layer of amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating the amorphous silicon layer with another layer of polyimide, and forming a second flexible (PI2) layer after curing; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, thereby completing the preparation of the substrate.

[0066] 2. Forming a display structure layer:

[0067] (1) forming a driving structure layer, including:

[0068] Forming a semiconductor layer pattern: A first insulating film and a semiconductor film are sequentially deposited on a substrate, and the semiconductor film is patterned by a patterning process to form a first insulating layer covering the substrate and a semiconductor layer disposed on the first insulating layer, wherein the semiconductor layer serves as an active layer of a transistor in a display area circuit unit.

[0069] A first conductive layer pattern is formed. On the substrate formed with the aforementioned pattern, a second insulating film and a first conductive film are sequentially deposited, and the first conductive film is patterned by a patterning process to form a second insulating layer covering the semiconductor layer pattern, and a first conductive layer pattern disposed on the second insulating layer, wherein the first conductive layer may be referred to as a first gate metal (GATE1) layer.

[0070] A second conductive layer pattern is formed. On the substrate formed with the aforementioned pattern, a third insulating film and a second conductive film are sequentially deposited, and the second conductive film is patterned using a patterning process to form a third insulating layer covering the first conductive layer, and a second conductive layer pattern disposed on the third insulating layer. The second conductive layer can be referred to as a second gate metal (GATE2) layer.

[0071] A fourth insulating layer pattern is formed. A fourth insulating film is deposited on the substrate with the aforementioned pattern, and the fourth insulating film is patterned by a patterning process to form a fourth insulating layer covering the second conductive layer, wherein a plurality of vias are arranged on the fourth insulating layer.

[0072] Forming a third conductive layer pattern. On the substrate formed with the aforementioned pattern, a third conductive film is deposited, and the third conductive film is patterned using a patterning process to form a third conductive layer pattern disposed on the fourth insulating layer. The third conductive layer can be called a source-drain metal (SD) layer.

[0073] At this point, the drive circuit layer is prepared on the substrate. In an exemplary embodiment, in a plane perpendicular to the display substrate, the drive circuit layer may include a semiconductor layer, a first conductive layer, a second conductive layer, and a third conductive layer sequentially arranged on the substrate. The semiconductor layer includes an active layer of multiple transistors, the first conductive layer includes gate electrodes of multiple transistors and a first plate of a test storage capacitor, the second conductive layer includes a second plate of a storage capacitor, and the third conductive layer includes a first electrode and a second electrode of multiple transistors.

[0074] In an exemplary embodiment, the driving circuit layer may include a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer as a first planar layer, the first insulating layer is arranged between the substrate and the semiconductor layer, the second insulating layer is arranged between the semiconductor layer and the first conductive layer, the third insulating layer is arranged between the first conductive layer and the second conductive layer, and the fourth insulating layer is arranged between the second conductive layer and the third conductive layer.

[0075] In an exemplary embodiment, the first conductive layer, the second conductive layer, and the third conductive layer may be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may be a single layer structure, or a multi-layer composite structure, such as Mo / Cu / Mo, etc. The first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer may be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multi-layer, or a composite layer. The first insulating layer may be called a buffer layer, which is used to improve the water and oxygen resistance of the substrate, the second insulating layer and the third insulating layer may be called a gate insulating (GI) layer, and the fourth insulating layer may be called an interlayer insulating (ILD) layer.

[0076] (2) After the driving circuit layer is prepared, a light emitting structure layer is prepared on the driving circuit layer, including:

[0077] A planar layer pattern is formed, and at least an anode via hole is arranged on the planar layer.

[0078] An anode pattern is formed, and the anode is connected to the anode connection electrode through the anode via hole.

[0079] A pixel definition layer (PDL) is formed, and a pixel opening is provided on the pixel definition layer, and the pixel opening exposes the anode. The spacing between two adjacent sub-pixel openings in the pixel definition layer is Figure 5 The non-light emitting area 22 shown in is the PDL gap.

[0080] An organic light-emitting layer is formed by evaporation or inkjet printing process, and a cathode is formed on the organic light-emitting layer.

[0081] An encapsulation layer is formed, which may include a stacked first encapsulation layer, a second encapsulation layer and a third encapsulation layer. The first encapsulation layer and the third encapsulation layer may be made of inorganic materials, and the second encapsulation layer may be made of organic materials. The second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer to ensure that external water vapor cannot enter the light-emitting structure layer.

[0082] A polarizer layer is formed.

[0083] After the above steps, a Figure 3 The display substrate shown. Figure 5 The substrate 10 and the display structure layer 20 are provided.

[0084] 3. Prepare the cover plate

[0085] (1) Forming a boss structure layer

[0086] As shown in FIG. 9 , a photoresist 502 is coated on the surface of a glass substrate 501. Figure 9a As shown, a patterning process (such as mask exposure) is used to obtain Figure 9b The structure shown in FIG. 1 is then subjected to an etching process (such as hydrofluoric acid etching) to form a patterned protrusion on the glass substrate, such as Fig.9c shown.

[0087] A light-transmitting material with a high refractive index is coated on the glass substrate with the above pattern to form a light-transmitting layer, such as Figure 9d As shown, the light-transmitting layer material may be optically transparent resin (OCR) or optically transparent adhesive (OCA). In other embodiments, acrylic ink may be sprayed on the glass substrate.

[0088] There is no necessary sequence relationship between step 3 and the above steps 1 and 2. In other embodiments, step 3 may be performed first and then steps 1 and 2.

[0089] In other embodiments, when forming a raised structure, a low-refractive-index OC material can be first coated on a glass substrate, and then the OC material layer is patterned through a patterning process (such as a mask exposure method) to form a patterned raised structure layer, that is, the raised structure layer can be an OC layer material, such as an optically transparent resin or polyimide.

[0090] In other embodiments, no matter what material the protruding structure layer is made of, the protruding structure layer can be formed by controlling the etching process. Fig.9e The inverted trapezoidal protrusion structure is shown to increase the incident angle of light irradiating on the cross section of the protrusion, which is more conducive to the occurrence of full emission.

[0091] 4. Box matching

[0092] The glass cover plate obtained in step 3 is flipped over and bonded to the display substrate obtained in step 2, and the protrusion position corresponds to the PDL GAP in the display substrate, that is, the orthographic projection of the protrusion on the base in the display substrate is within the range of the orthographic projection of the non-luminous area on the base in the display substrate.

[0093] In an exemplary embodiment, if the raised structure layer and the glass cover plate are an integral structure, the refractive index of the glass cover plate, i.e., the raised structure layer, is n1=1.5, and the refractive index of the selected light-transmitting layer material (such as OCR or OCA) is n2=1.7, then the critical angle of total reflection is arcsin n1 / n2=61.9°. When the light emitted by the light-emitting device is irradiated on the lens cross-section formed by the protrusion, total reflection can occur as long as the incident angle is greater than 61.9°, thereby increasing the front light output gain.

[0094] In an exemplary embodiment, if the protruding structure layer is an OC material, the refractive index of OC is n1=1.4-1.55, and the refractive index of the selected light-transmitting layer material (such as OCR or OCA) is n2=1.6-1.75. Taking mass-produced materials as an example, n1=1.47, n2=1.7, and the critical angle of total reflection is arcsin n1 / n2=59.8°. When the light emitted by the light-emitting device is irradiated on the lens cross section formed by the protrusion, total reflection can occur as long as the incident angle is greater than 59.8°, thereby increasing the front light gain.

[0095] In an exemplary embodiment, after the protrusions on the inner side of the CG are made, a high refractive index OC flat layer is coated or a high refractive index ink (such as acrylic ink) is printed to form a light-transmitting layer, and then the glass cover plate and the display substrate are bonded by ordinary OCR (or OCA). In this case, the light-transmitting layer is a flat layer (OC) or an acrylic layer.

[0096] The structure and preparation process shown above in the present disclosure are merely exemplary illustrations. In an exemplary embodiment, the corresponding structure can be changed and the patterning process can be increased or decreased according to actual needs. The display substrate of the present disclosure can be applied to other display devices with pixel driving circuits, such as quantum dot displays, etc., and the present disclosure does not limit this.

[0097] From the structure and preparation process of the display substrate described above, it can be seen that the display panel provided by the present disclosure adjusts the incident angle of light when it reaches the interface by setting a convex structure layer with a low refractive index and a light-transmitting layer with a high refractive index using the total reflection principle, reduces the total internal reflection of light in the oblique viewing direction, and thus improves the light extraction efficiency in the normal viewing direction. The preparation process disclosed in the present disclosure is well compatible with the existing preparation process, and the process is simple to realize, easy to implement, high in production efficiency, low in production cost, and high in yield rate.

[0098] The present disclosure also provides a method for manufacturing a display panel to manufacture the display panel provided by the aforementioned exemplary embodiment. The manufacturing method may include:

[0099] Forming a display structure layer on a substrate, wherein the display structure layer includes a light emitting area and a non-light emitting area;

[0100] An anti-glare layer is formed on a side of the display structure layer away from the substrate, the anti-glare layer includes a light-transmitting layer and a convex structure layer, the convex structure layer is located on a side of the light-transmitting layer away from the substrate, the convex structure layer includes a convexity facing the substrate, the orthographic projection of the convexity on the substrate at least partially overlaps with the orthographic projection of the non-light-emitting area of ​​the display structure layer on the substrate, and the refractive index of the light-transmitting layer is higher than the refractive index of the convex structure layer.

[0101] In an exemplary embodiment, forming an anti-glare layer on a side of the display structure layer away from the substrate includes:

[0102] A raised structure layer and a light-transmitting layer are formed on a cover plate, and the cover plate formed with the raised structure layer and the light-transmitting layer is adhered to the display structure layer, with the protrusions in the raised structure layer facing the substrate, and the orthographic projection of the protrusions on the substrate is within the orthographic projection range of the non-light-emitting area of ​​the display structure layer on the substrate.

[0103] In an exemplary embodiment, forming a raised structure layer on the cover plate includes:

[0104] The protrusions are formed on the cover plate by etching, and the protrusion structure layer and the cover plate are an integral structure; or the protrusion structure layer is formed on the cover plate by coating a material.

[0105] In an exemplary embodiment, forming a light-transmitting layer on a cover plate includes:

[0106] After the protruding structure layer is formed on the cover plate, a light-transmitting layer is formed in a direction where the protruding structure layer is away from the cover plate.

[0107] In an exemplary embodiment, the refractive index of the material of the protruding structure layer is in the range of [1.45, 1.55]; the refractive index of the material of the light-transmitting layer is in the range of [1.6, 1.75].

[0108] The present disclosure also provides a display device, including the display panel of the above embodiment. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame or a navigator.

[0109] Although the embodiments disclosed in the present disclosure are as above, the contents described are only embodiments adopted to facilitate understanding of the present disclosure and are not intended to limit the present disclosure. Any technician in the field to which the present disclosure belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present disclosure, but the scope of patent protection of this application shall still be subject to the scope defined in the attached claims.

Claims

1. A display panel, characterized in that: The invention comprises a substrate, a display structure layer arranged on the substrate, and an anti-glare layer arranged on a side of the display structure layer away from the substrate, wherein the display structure layer comprises a light emitting area and a non-light emitting area, the anti-glare layer comprises a light-transmitting layer and a convex structure layer, the display structure layer comprises a driving circuit layer, a light-emitting structure layer and an encapsulation layer, the light-transmitting layer is located on a side of the encapsulation layer away from the substrate, the display panel further comprises a cover plate located on a side of the anti-glare layer away from the substrate, the convex structure layer is located on a side of the light-transmitting layer away from the substrate, the convex structure layer and the cover plate are an integral structure, the convex structure layer comprises a convexity facing the substrate, the orthographic projection of the convexity on the substrate is within the orthographic projection range of the non-light emitting area of ​​the display structure layer on the substrate, the refractive index of the light-transmitting layer is higher than the refractive index of the convex structure layer; when the light emitted from the light emitting area irradiates the convexity, when the incident angle is greater than the critical angle, total reflection occurs, so that the light is emitted from the positive viewing angle direction of the display panel.

2. The display panel according to claim 1, characterized in that: In a direction perpendicular to the base, the cross section of the protrusion is square, rectangular or trapezoidal. When the cross section of the protrusion is trapezoidal, a side of the trapezoid close to the base is a lower base.

3. The display panel according to claim 1, characterized in that: The material of the protruding structure layer includes one or more of the following: optically transparent resin, polyimide, and glass.

4. The display panel according to claim 1, characterized in that: The material of the light-transmitting layer includes one or more of the following: optically transparent resin, optically transparent adhesive, polyimide and acrylic ink.

5. The display panel according to claim 1 or 3, characterized in that: The refractive index range of the protruding structure layer is greater than or equal to 1.45 and less than or equal to 1.55; the refractive index range of the light-transmitting layer is greater than or equal to 1.6 and less than or equal to 1.

75.

6. The display panel according to claim 1, characterized in that: The display structure layer further includes a polarizer, and the polarizer is located on a side of the display structure layer close to the anti-glare layer.

7. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 6.

8. A method for preparing a display panel, characterized in that: The display panel is the display panel according to any one of claims 1 to 6, and the method comprises: Forming a display structure layer on the substrate, wherein the display structure layer includes a driving circuit layer, a light emitting structure layer and a packaging layer, and the display structure layer includes a light emitting area and a non-light emitting area; An anti-glare layer is formed on a side of the display structure layer away from the substrate, the anti-glare layer includes a light-transmitting layer and a protruding structure layer, the light-transmitting layer is located on a side of the encapsulation layer away from the substrate, the display panel also includes a cover plate located on a side of the anti-glare layer away from the substrate, the protruding structure layer is located on a side of the light-transmitting layer away from the substrate, the protruding structure layer and the cover plate are an integral structure, the protruding structure layer includes a protrusion facing the substrate, the orthographic projection of the protrusion on the substrate is within the orthographic projection range of the non-light-emitting area of ​​the display structure layer on the substrate, the refractive index of the light-transmitting layer is higher than the refractive index of the protruding structure layer; when the light emitted from the light-emitting area irradiates the protrusion, when the incident angle is greater than the critical angle, total reflection occurs, so that the light is emitted from the positive viewing angle direction of the display panel.

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