Integrated structure of thick film micro-power DC conversion circuit
By improving the materials and processes of thick-film micro-power DC-DC converter circuits, the reliability and lifespan issues in aerospace applications have been resolved, achieving a highly reliable and long-life integrated structure that meets the high standards required for aerospace-grade products.
CN114421738BActive Publication Date: 2026-05-26北京华创七星微电子股份有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 北京华创七星微电子股份有限公司
- Filing Date
- 2021-12-29
- Publication Date
- 2026-05-26
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Figure CN114421738B_ABST
Abstract
This application provides an integrated structure for a thick-film micropower DC-DC converter circuit, belonging to the technical field of hybrid integrated circuits, to solve the problems of low reliability and short lifespan in related technologies. In this integrated structure, all surface-mount devices are connected to the substrate by soldering, and the bonding wires are all made of aluminum wire bonding. The internal assembly process does not include processes prohibited or restricted in aerospace products, such as bonding organic materials or using leads with different metal materials from the chip bonding area. Furthermore, the packaged optocoupler allows for advance parameter measurement and reduces the possibility of differences in transmission ratio, thus enabling the integrated structure to have high reliability and long lifespan.
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