A vibration-driven heat dissipation structure and electronic device

Abstract

This invention discloses a vibration heat dissipation structure and an electronic device. The vibration heat dissipation structure includes a heat sink and multiple oscillating blade assemblies. The heat sink includes a back plate and multiple rows of parallel heat dissipation fins spaced apart on the back plate. The end face of the back plate between adjacent heat dissipation fins has mounting slots for mounting the oscillating blade assemblies. The oscillating blade assemblies are mounted on the back plate in the area in front of adjacent heat dissipation fins, causing them to oscillate when the product mounted on the heat sink vibrates. The resonant point of the oscillating blade assemblies is determined based on the vibration spectrum of the vehicle carrying the product, and is used to generate the maximum energy vibration frequency band of the vehicle when the product mounted on the vibration heat dissipation structure vibrates due to the vehicle's vibration. This invention solves the problem of limited heat dissipation capacity and poor heat dissipation effect for electronic devices installed in automobiles and aircraft using existing heat dissipation methods.

Description

Technical Field

[0001] This invention relates to, but is not limited to, the field of electronic device structural design technology, and in particular to a vibration heat dissipation structure and an electronic device. Background Technology

[0002] When electronic devices are running, their internal components generate heat. This heat is transferred to the surface of the device through the internal components and is finally carried away by air or other cooling media.

[0003] Most electronic devices currently use natural heat dissipation cooling, which dissipates heat into the air through air convection on the surface of the electronic device. However, the heat dissipation capacity of natural heat dissipation cooling is limited.

[0004] Electronic devices installed in cars and airplanes are often exposed to harsh vibration environments. As the cars and airplanes move, the electronic devices vibrate, which can exacerbate the loosening of solder joints of the components and cause structural damage. Summary of the Invention

[0005] The purpose of this invention is to provide a vibration-based heat dissipation structure and electronic device to address the problem that existing heat dissipation methods have limited heat dissipation capacity and poor heat dissipation effect for electronic devices installed in automobiles and airplanes.

[0006] The technical solution of the present invention: The present invention provides a vibration heat dissipation structure, including: a heat dissipation plate 1 and a plurality of swing blade assemblies 2;

[0007] The heat sink 1 includes a back plate and multiple rows of heat sink fins 11 arranged parallel to each other on the back plate. The end face of the back plate between adjacent heat sink fins 11 is provided with mounting slots 12 for mounting the swing blade assembly 2 through the mounting slots 12.

[0008] The swing blade assembly 2 is installed on the back plate in the area in front of the adjacent heat sink fins 11, and is used to make the swing blade assembly 2 swing when the product installed on the heat sink 1 vibrates.

[0009] The resonant point of the swing blade assembly 2 is determined based on the vibration spectrum of the vehicle on which the product is installed, and is used to generate resonance within the maximum energy vibration frequency band of the vehicle when the product installed on the vibration heat dissipation structure vibrates due to the vibration of the vehicle.

[0010] Optionally, in the vibration heat dissipation structure described above, the mounting slot 12 of the back plate includes a threaded hole and a mounting slot located on the mounting end face; used to mount the swing blade assembly 2 on the end face of the heat dissipation plate 1 through the threaded hole and the mounting slot, and the mounting structure makes the swing blade assembly 2 rotatable as a whole.

[0011] Optionally, in the vibration heat dissipation structure described above,

[0012] The oscillating blade assembly 2 includes: a mounting base 21, a torsion spring 22, a rotating cylinder 23, a washer 24, a blade 25, and a screw 26;

[0013] The shape of the card holder 21 matches the shape of the mounting slot on the back plate and is embedded in the mounting slot;

[0014] The rotating drum 23 includes a sleeve portion and a mounting plate arranged radially and vertically on the outside of the sleeve portion, which is used to bond a heat dissipation fin 11 through the mounting plate. The end of the screw 26 passes through the gasket 24, the sleeve portion of the rotating drum 23, the torsion spring 22 and the card seat 21 in sequence, and the swing blade assembly 2 is installed as a whole onto the end face of the back plate through a threaded connection with the mounting slot 12.

[0015] The torsion spring 22 is located between the card holder 21 and the sleeve, so that there is a gap between the heat dissipation fins 11 and the back plate. When the heat dissipation plate 1 vibrates, the rotating drum 23 rotates around the screw 26, causing the torsion spring 22 to twist and generate a torsional force that turns the rotating drum to the initial position. During the rotation of the rotating drum 23, the blades 25 are driven to oscillate back and forth.

[0016] Optionally, in the vibration heat dissipation structure described above,

[0017] The sleeve portion of the rotating drum 23 and the end face of the mounting base 21 near the torsion spring 22 are both provided with spring slots, which are used to fix one end of the torsion spring 22 to the outer end face of the mounting base 21 and the other end to the inner end face of the sleeve portion of the rotating drum 23 after the swing blade assembly 2 is installed as a whole.

[0018] Optionally, in the vibration heat dissipation structure described above,

[0019] The mass of the mounting plate of the rotating drum 23 is preset and serves as the vibration mass parameter of its associated swing blade assembly 2, so that when the heat sink 1 vibrates, the center of gravity of the rotating drum 23 deviates from the rotation center, thereby applying a rotational torque to the rotating drum 23.

[0020] Optionally, in the vibration heat dissipation structure described above,

[0021] The blade 25 is made of thin and lightweight plastic or metal material and is specifically bonded to the mounting plate of the rotating cylinder 23. It is used to deform when the heat sink 1 vibrates, thereby driving the flow of surrounding air during reciprocating swing, and generating a heat dissipation effect on the installed electronic equipment.

[0022] Optionally, in the vibration heat dissipation structure described above,

[0023] One or more oscillating blade assemblies 2 are mounted on two adjacent heat dissipation fins 11; or,

[0024] Multiple oscillating blade assemblies 2 are installed in an array on the back plate of the heat sink 1.

[0025] Optionally, in the vibration heat dissipation structure described above,

[0026] The resonant frequency ωn of the oscillating blade assembly 2 is determined based on the stiffness of the torsion spring 22 and the rotational inertia of the rotating cylinder 23 and the blade 25. Its resonant frequency ωn is:

[0027]

[0028] Where K is the torsional stiffness of the torsion spring 22; J is the moment of inertia of the rotating cylinder 23 and the blade 25 about the center of rotation.

[0029] Optionally, in the vibration heat dissipation structure described above,

[0030] The resonant point of the oscillating blade assembly 2 is determined based on the vibration spectrum characteristics of the vehicle, specifically:

[0031] The resonant point of the oscillating blade assembly 2 is located in the high-energy frequency range of the vibration spectrum of the vehicle; when the vehicle is a car or a jet aircraft, the resonant point of the oscillating blade assembly 2 is at the lowest point in the high vibration energy frequency range of the vibration spectrum; when the vehicle is a propeller aircraft, the resonant point of the oscillating blade assembly 2 is in the lowest frequency band of the frequency range.

[0032] This invention also provides an electronic device on a vehicle, comprising: a vibration heat dissipation structure as described in any one of the above embodiments is disposed on one end face of the electronic device;

[0033] The heat sink 1 of the vibration heat dissipation structure is installed on the heat dissipation end face of the electronic device. When the vehicle is in a vibration state, the heat sink 1 vibrates in a direction perpendicular to the swing blade assembly 2, and the swing blade assembly 2 generates torque, which acts on the torsion spring 22 through the rotating cylinder 23, causing the torsion spring 22 to be torsional deformed. The torsion spring 22 generates a torsional force towards the equilibrium position, causing the rotating cylinder 23 to rotate towards the equilibrium position, thereby driving the blade 25 to swing back and forth, driving the surrounding airflow.

[0034] The beneficial effects of this invention are as follows: This invention provides a vibration heat dissipation structure and an electronic device. The vibration heat dissipation structure uses multiple rows of parallel heat dissipation fins 11 arranged at intervals on a back plate to form a heat dissipation plate 1, and a swing blade assembly 2 is installed through mounting slots 12 on the heat dissipation plate 1. In this invention, the resonance point of the swing blade assembly 2 is specifically determined based on the vibration spectrum of the vehicle carrying the installed product, i.e., the electronic device. When the product installed in the vibration heat dissipation structure vibrates due to the vehicle's vibration, it can resonate within the maximum energy vibration frequency band of the vehicle. The vibration heat dissipation structure provided by this invention is small in size and light in weight, and can be applied to various electronic devices. When applied to the heat dissipation of vehicle-mounted and airborne electronic devices, the vibration heat dissipation structure applied to the electronic device will not affect the original heat dissipation effect when the electronic device is not vibrating; when the electronic device vibrates with the vehicle, the vibration energy can be used to enhance the heat dissipation effect and improve the natural heat dissipation performance of the electronic device. Attached Figure Description

[0035] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of the present invention and do not constitute a limitation on the technical solutions of the present invention.

[0036] Figure 1 This is a schematic diagram of a vibration heat dissipation structure provided in an embodiment of the present invention;

[0037] Figure 2 for Figure 1 A schematic diagram of the heat sink in the vibration heat dissipation structure provided in the embodiment shown;

[0038] Figure 3 for Figure 1 A schematic diagram of the oscillating blade assembly in the vibration heat dissipation structure provided in the embodiment shown;

[0039] Figure 4 This is a schematic diagram of the structure of an electronic device on a vehicle provided in an embodiment of the present invention;

[0040] Figure 5 This is a schematic diagram of the vibration spectrum of a type of wheeled vehicle.

[0041] Figure 6 This is a schematic diagram of the vibration spectrum of a typical jet aircraft.

[0042] Figure 7 This is a schematic diagram of the vibration spectrum of a typical propeller aircraft.

[0043] Figure 8 This is a schematic diagram of the flow field velocity distribution generated by the oscillation of the blades of the vibration heat dissipation structure in the electronic equipment on the vehicle provided in the embodiment of the present invention. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

[0045] As explained in the background section, the heat dissipation capacity of most electronic devices currently using natural heat dissipation is limited. Furthermore, electronic devices installed in automobiles and aircraft typically face harsh vibration environments. The vibrations caused by the movement of these vehicles can exacerbate issues such as loose solder joints and structural damage to components.

[0046] Specifically, automotive and airborne electronic equipment often faces harsh environments, including high temperatures and vibrations. Many automotive and airborne electronic devices use natural convection for heat dissipation, dissipating heat into the surrounding air to ensure that the electronic components inside the device remain within a suitable temperature range. For example, many airborne computer devices use various types of heat dissipation fins on their casings to increase the heat exchange area with the air and dissipate heat from the fins into the air through convection. However, because the driving force relies solely on the density change of heated air, the airflow speed is relatively slow, and the heat dissipation capacity of natural convection is quite limited. When the thermal load of electronic equipment increases, natural heat dissipation methods often fail to meet the heat dissipation requirements of the electronic equipment.

[0047] In view of the limited heat dissipation capacity of the aforementioned electronic devices and the problems existing when electronic devices are installed on vibrating vehicles such as automobiles and airplanes, this invention proposes a vibration heat dissipation structure and electronic devices. It can utilize vibration energy to enhance the heat dissipation effect and improve the heat dissipation performance of electronic devices. Moreover, the vibration heat dissipation structure provided by the embodiments of this invention is small in size and light in weight, and can be applied to various electronic devices.

[0048] The present invention provides the following specific embodiments, which can be combined with each other. For the same or similar concepts or processes, they may not be described again in some embodiments.

[0049] Figure 1 This is a schematic diagram of a vibration heat dissipation structure provided in an embodiment of the present invention. The main structure of the vibration heat dissipation structure provided in this embodiment of the present invention includes: a heat dissipation plate 1 and multiple oscillating blade assemblies 2.

[0050] Figure 2 for Figure 1 A schematic diagram of the heat sink in the vibration cooling structure provided in the illustrated embodiment. (Refer to...) Figure 1 and Figure 2In the vibration heat dissipation structure shown, the heat dissipation plate 1 includes a back plate and multiple rows of heat dissipation fins 11 arranged parallel to each other on the back plate. The end face of the back plate between adjacent heat dissipation fins 11 is provided with mounting slots 12 for mounting the swing blade assembly 2 through the mounting slots 12.

[0051] It can be seen that the oscillating blade assembly 2 is installed in the area of ​​the back plate in front of the adjacent heat sink fin 11, and is used to make the oscillating blade assembly 2 oscillate when the product installed on the heat sink 1 vibrates.

[0052] In this embodiment of the invention, the resonant point of the oscillating blade assembly 2 is determined based on the vibration spectrum of the vehicle on which the product is installed, and is used to generate resonance within the maximum energy vibration frequency band of the vehicle when the product installed on the vibration heat dissipation structure vibrates due to the vehicle.

[0053] In one embodiment of the present invention, the mounting slot 12 of the back plate includes a threaded hole and a mounting slot located on the mounting end face. In this embodiment, the oscillating blade assembly 2 is mounted on the end face of the heat sink 1 through the threaded hole and the mounting slot, and the mounting structure makes the oscillating blade assembly 2 rotatable as a whole.

[0054] In one implementation of this invention, such as Figure 3 As shown, Figure 1 A schematic diagram of the oscillating blade assembly in the vibration heat dissipation structure provided in the illustrated embodiment. (Refer to...) Figure 1 and Figure 3 In the vibration heat dissipation structure shown, the oscillating blade assembly 2 may include: a mounting base 21, a torsion spring 22, a rotating cylinder 23, a gasket 24, a blade 25, and a screw 26.

[0055] like Figure 3 In the specific structure of the swing blade assembly 2 shown, the shape of the card holder 21 matches the shape of the mounting slot on the back plate, and the card holder 21 can be embedded in the mounting slot during installation.

[0056] In this implementation, the rotating drum 23 includes a sleeve portion and a mounting plate that is radially and vertically disposed on the outside of the sleeve portion. A heat dissipation fin 11 can be bonded to the mounting plate. The end of the screw 26 passes through the gasket 24, the sleeve portion of the rotating drum 23, the torsion spring 22 and the retainer 21 in sequence, and the swing blade assembly 2 is installed as a whole onto the end face of the back plate through a threaded connection with the mounting slot 12.

[0057] In the mounting structure of the oscillating blade assembly 2, the torsion spring 22 is located between the card holder 21 and the sleeve, so that there is a gap between the heat dissipation fins 11 and the back plate. Its function is: when the heat dissipation plate 1 vibrates, the rotating cylinder 23 rotates around the screw 26, causing the torsion spring 22 to twist and generate a torsional force that turns the rotating cylinder to the initial position. During the rotation of the rotating cylinder 23, the blade 25 is driven to oscillate back and forth.

[0058] In an optional implementation of this method, spring slots are provided on the end face of the sleeve portion of the rotating drum 23 near the torsion spring 22 and the end face of the retainer 21 near the torsion spring 22. After the swing blade assembly 2 is installed as a whole, one end of the torsion spring 22 is fixed to the outer end face of the retainer 21, and the other end is fixed to the inner end face of the sleeve portion of the rotating drum 23.

[0059] In a preferred embodiment of this implementation, the mass of the mounting plate of the rotating drum 23 is preset as a vibration mass parameter of the swing blade assembly 2 to which it belongs, so that when the heat sink 1 vibrates, the center of gravity of the rotating drum 23 deviates from the center of rotation, thereby applying a rotational torque to the rotating drum 23.

[0060] In one embodiment of the present invention, the blade 25 is made of a thin, lightweight plastic or metal material, for example, 0.1 mm to 0.25 mm thick, and is specifically bonded to the mounting plate of the rotating cylinder 23. It is used to deform when the heat sink 1 vibrates, thereby driving the flow of surrounding air during reciprocating swing, and generating a heat dissipation effect on the installed electronic equipment.

[0061] Implementation Example 1: In this embodiment of the invention, one or more swing blade assemblies 2 may be installed between two adjacent heat dissipation fins 11.

[0062] Implementation Example 2: In this embodiment of the invention, multiple oscillating blade assemblies 2 are installed in an array on the back plate of the heat sink 1.

[0063] The following explains the calculation of the resonant frequency ωn of the oscillating blade assembly 2 in this embodiment of the invention: The oscillating blade assembly 2, as an independent torsional oscillation system, has a resonant frequency ωn. n Its resonant frequency ω n The resonant frequency ω is determined by the stiffness of the torsion spring 22 and the moment of inertia of the rotating cylinder 23 and the blade 25. n The specific calculation method is as follows:

[0064]

[0065] In the formula, K is the torsional stiffness of the torsion spring 22; J is the moment of inertia of the rotating cylinder 23 and the blade 25 about the center of rotation.

[0066] The torsional stiffness K of the torsion spring 22 can be calculated using the following method:

[0067]

[0068] In the formula, E is the shear modulus of the spring material, d is the diameter of the spring material, D is the mean diameter of the spring, and n is the effective number of coils of the spring.

[0069] The moment of inertia J of the rotating drum 23 and the blade 25 about the center of rotation is negligible since the mass of the blade 25 is smaller than that of the rotating drum 23. Therefore, the moment of inertia J can be calculated using the following method:

[0070] J=∫∫∫ V r 2 ρdV;

[0071] In the formula, r is the radius from the center of rotation of the volume element on the rotating cylinder 23, ρ is the density of the volume element, and V is the total volume of the rotating cylinder 23.

[0072] Based on the above calculations, it can be seen that in this embodiment of the invention, by changing the shear modulus of the torsion spring 22, the spring material diameter, the spring mean diameter, the effective number of spring coils, and by changing the density, shape, and size of the rotating cylinder 23, the resonant frequency ω of the oscillating blade assembly 2 can be adjusted. n The resonant frequency ω will also change accordingly. n Adjust to the design values ​​of the applied electronic equipment.

[0073] As explained in the above embodiments, the resonant point of the oscillating blade assembly 2 is determined based on the vibration spectrum characteristics of the vehicle. The following describes the method for selecting the resonant frequency range of the oscillating blade assembly 2 in this embodiment of the invention:

[0074] The vibration characteristics of vehicle-mounted and airborne electronic equipment vary depending on the type of vehicle or aircraft, specific operating conditions, and environmental influences. Under different conditions, the vibration spectrum of the vehicle-mounted and airborne vibration environments differs significantly. Therefore, the optimal resonant frequency ω of the oscillating blade assembly 2 should be determined based on the characteristics of the vibration spectrum. n This causes the oscillating blade assembly 2 to resonate, thereby maximizing the oscillation amplitude of the blade 25 and achieving the best heat dissipation effect.

[0075] In a specific selection method, the resonant point of the oscillating blade assembly 2 should be located in the high-energy frequency range of the vibration spectrum of the vehicle. For example, when the vehicle is a car or a jet aircraft, the resonant point of the oscillating blade assembly 2 is at the lowest point in the high vibration energy frequency range of the vibration spectrum; as another example, when the vehicle is a propeller aircraft, the resonant point of the oscillating blade assembly 2 is in the lowest frequency band of the frequency range.

[0076] Based on the vibration heat dissipation structure provided in the above embodiments, this invention also provides an electronic device on a vehicle, such as... Figure 4 The diagram shown is a structural schematic of an electronic device provided in a vehicle according to an embodiment of the present invention. One end face of the electronic device is configured with a vibration heat dissipation structure as provided in any of the above embodiments.

[0077] like Figure 4 As shown, the heat sink 1 of the vibration heat dissipation structure is installed on the heat dissipation end face of the electronic device. When the vehicle is in a vibration state, the heat sink 1 vibrates in a direction perpendicular to the swing blade assembly 2, and the swing blade assembly 2 generates torque, which acts on the torsion spring 22 through the rotating cylinder 23, causing the torsion spring 22 to be torsional deformed. The torsion spring 22 generates a torsional force towards the equilibrium position, causing the rotating cylinder 23 to rotate towards the equilibrium position, thereby driving the blade 25 to swing back and forth, driving the surrounding airflow.

[0078] Because electronic devices in vehicles and aircraft are subject to vibrations from cars and airplanes, they are in a state of vibration. The heat sink 1 in these electronic devices is also part of the electronic device and is also in a state of vibration.

[0079] When the heat sink 1 vibrates in a direction perpendicular to the oscillating blade assembly 2, the oscillating blade assembly 2 becomes a torsional oscillating system. Since the center of gravity of the rotating cylinder 23 does not coincide with the rotation center line, a torque is generated and acts on the torsion spring 22 through the rotating cylinder 23, causing the torsion spring 22 to undergo torsional deformation. Subsequently, the torsion spring 22 generates an elastic force towards the equilibrium position, causing the rotating cylinder 23 to rotate towards the equilibrium position, and this process repeats. The blades 25 oscillate around the equilibrium position as the rotating cylinder 23 reciprocates, driving the surrounding airflow.

[0080] This invention provides a vibration heat dissipation structure and an electronic device on a vehicle. A heat dissipation plate 1 is formed by multiple rows of parallel heat dissipation fins 11 arranged at intervals on a back plate, and a swing blade assembly 2 is mounted through mounting slots 12 on the heat dissipation plate 1. In this invention, the resonance point of the swing blade assembly 2 is specifically determined based on the vibration spectrum of the vehicle on which the electronic device is mounted. This allows the product mounted on the vibration heat dissipation structure to resonate within the maximum energy vibration frequency band of the vehicle when the vehicle vibrates. The vibration heat dissipation structure provided by this invention is small in size and lightweight, and can be applied to various electronic devices. When applied to the heat dissipation of vehicle-mounted and airborne electronic devices, the vibration heat dissipation structure does not affect the original heat dissipation effect when the electronic device is not vibrating; when the electronic device vibrates with the vehicle, the vibration energy can be used to enhance the heat dissipation effect and improve the natural heat dissipation performance of the electronic device.

[0081] The following is an illustrative description of the implementation of the vibration heat dissipation structure and electronic device provided in the embodiments of the present invention through an example.

[0082] Implementation Example 1:

[0083] like Figure 5 The diagram shows a vibration spectrum of a type of wheeled vehicle. Generally, vibrations occur in all three directions of the vehicle's coordinate system, with slightly different intensities in each direction. The frequencies of these vibrations typically range from a few hertz to several hundred hertz. Therefore, the vibration direction of the oscillating blade assembly 2 should be selected in the low-frequency range of 5 to 100 Hz, where the vibration energy is greatest. The design of the resonant frequency ωn of the oscillating blade assembly 2 should meet the following two requirements:

[0084] First, in the high vibrational energy frequency range of the vibrational spectral lines in this direction;

[0085] Second, based on the above, the frequency should be as low as possible.

[0086] Implementation Example 2:

[0087] like Figure 6 The diagram shows a typical vibration spectrum of a jet aircraft. Generally, the vibration spectrum of a jet aircraft spans a wide frequency range. Therefore, the vibration direction of the oscillating blade assembly 2 should be selected in the direction of maximum vibration energy in the low-frequency range of 15 to 300 Hz. The design of the resonant frequency ωn of the oscillating blade assembly 2 should meet the following two requirements:

[0088] First, in the high vibrational energy frequency range of the vibrational spectral lines in this direction;

[0089] Second, based on the above, the frequency should be as low as possible.

[0090] Implementation Example 3:

[0091] like Figure 7 The diagram shows a typical vibration spectrum of a propeller aircraft. Generally, the vibration spectrum of a propeller aircraft is a superposition of a broadband random vibration, a narrow band formed by the propeller rotation frequency, and the harmonics of that narrow band. In this case, the vibration direction of the oscillating blade assembly 2 should be selected from the direction of the lowest frequency narrow band vibration energy; the resonant frequency ωn of the oscillating blade assembly 2 should be designed within the frequency range of the lowest frequency narrow band.

[0092] Implementation Example 4:

[0093] This embodiment example 4 illustrates the operation of electronic equipment mounted on a vibration-cooling structure during the movement of a vehicle. When the electronic equipment operates on a car or aircraft platform, the heat generated is transferred to the heat sink 1 via components within the electronic equipment. As the car or aircraft vibrates, the resonant frequency ωn of the oscillating blade assembly 2 falls within the vibration frequency range of the car or aircraft, causing the oscillating blade assembly 2 to resonate. The blades 25 oscillate back and forth continuously at the resonant frequency ωn, driving airflow between the heat sink fins 11. Furthermore, due to the unsteady oscillation characteristics of the blades 25, phenomena such as jets and vortices can be generated in the flow field, such as… Figure 8 The diagram shows the flow field velocity distribution generated by the oscillation of the blades in the vibration heat dissipation structure of the electronic device on the vehicle provided in this embodiment of the invention. It can be seen that by adopting this vibration heat dissipation structure, the convective heat transfer effect of the heat dissipation fins 11 is significantly improved, thereby improving the heat dissipation capacity of the electronic device.

[0094] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A vibration-based heat dissipation structure, characterized in that, include: Heat sink (1) and multiple oscillating blade assemblies (2); The heat sink (1) includes a back plate and multiple rows of heat sink fins (11) arranged parallel to each other on the back plate. The end face of the back plate between adjacent heat sink fins (11) is provided with mounting slots (12) for mounting the swing blade assembly (2) through the mounting slots (12). The swing blade assembly (2) is installed on the back plate in the area between adjacent heat dissipation fins (11) to cause the swing blade assembly (2) to swing when the product installed on the heat dissipation plate (1) vibrates. The resonant point of the swing blade assembly (2) is determined based on the vibration spectrum of the vehicle on which the product is installed, and is used to generate resonance with the maximum energy vibration frequency band of the vehicle when the product installed on the vibration heat dissipation structure vibrates due to the vehicle. The mounting slot (12) of the back plate includes a threaded hole and a mounting slot located on the mounting end face; it is used to mount the swing blade assembly (2) on the end face of the heat sink (1) through the threaded hole and the mounting slot, and the mounting structure makes the swing blade assembly (2) rotate as a whole. The oscillating blade assembly (2) includes: a mounting base (21), a torsion spring (22), a rotating cylinder (23), a washer (24), a blade (25), and a screw (26). The shape of the card holder (21) matches the shape of the mounting slot on the back plate and is embedded in the mounting slot; The rotating drum (23) includes a sleeve portion and a mounting plate arranged radially and vertically on the outside of the sleeve portion, which is used to bond a heat dissipation fin (11) through the mounting plate. The end of the screw (26) passes through the gasket (24), the sleeve portion of the rotating drum (23), the torsion spring (22) and the card seat (21) in sequence, and the swing blade assembly (2) is installed as a whole on the end face of the back plate through the threaded connection with the mounting slot (12). The torsion spring (22) is located between the card holder (21) and the sleeve, so that there is a gap between the heat dissipation fins (11) and the back plate. When the heat dissipation plate (1) vibrates, the rotating drum (23) rotates around the screw (26), causing the torsion spring (22) to twist and generate a torsional force that turns the rotating drum to the initial position. During the rotation of the rotating drum (23), the blades (25) are driven to oscillate back and forth. The heat sink (1) of the vibration heat dissipation structure is installed on the heat dissipation end face of the electronic device. When the vehicle is in a vibration state, the heat sink (1) vibrates in a direction perpendicular to the swing blade assembly (2), and the swing blade assembly (2) generates torque and acts on the torsion spring (22) through the rotating cylinder (23), thereby causing the torsion spring (22) to be torsional deformed. The torsion spring (22) generates a torsional force towards the equilibrium position, causing the rotating cylinder (23) to rotate towards the equilibrium position, thereby driving the blade (25) to swing back and forth, driving the surrounding air flow.

2. The vibration heat dissipation structure according to claim 1, characterized in that, The sleeve portion of the rotating drum (23) near the end face of the torsion spring (22) and the end face of the mounting base (21) near the torsion spring (22) are both provided with spring slots, which are used to fix one end of the torsion spring (22) to the outer end face of the mounting base (21) and the other end to the inner end face of the sleeve portion of the rotating drum (23) after the swing blade assembly (2) is installed as a whole.

3. The vibration heat dissipation structure according to claim 2, characterized in that, The mass of the mounting plate of the rotating drum (23) is preset as the vibration mass parameter of its associated swing blade assembly (2), so that when the heat sink (1) vibrates, the center of gravity of the rotating drum (23) deviates from the rotation center, thereby applying a rotational torque to the rotating drum (23).

4. The vibration heat dissipation structure according to any one of claims 1 to 3, characterized in that, The blade (25) is made of thin and lightweight plastic or metal material and is specifically bonded to the mounting plate of the rotating drum (23). It is used to deform when the heat sink (1) vibrates, thereby driving the flow of surrounding air during reciprocating swing and generating a heat dissipation effect on the installed electronic equipment.

5. The vibration heat dissipation structure according to any one of claims 1 to 3, characterized in that, One or more oscillating blade assemblies (2) are mounted on two adjacent heat dissipation fins (11); or, Multiple oscillating blade assemblies (2) are installed in an array on the back plate of the heat sink (1).

6. The vibration heat dissipation structure according to any one of claims 1 to 3, characterized in that, The resonant frequency ωn of the oscillating blade assembly (2) is determined based on the stiffness of the torsion spring (22) and the moment of inertia of the rotating cylinder (23) and the blade (25). Its resonant frequency ωn is: ； Where K is the torsional stiffness of the torsion spring (22); J The moment of inertia of the rotating cylinder (23) and blades (25) about the center of rotation.

7. The vibration heat dissipation structure according to any one of claims 1 to 3, characterized in that, The resonant point of the oscillating blade assembly (2) is determined based on the vibration spectrum characteristics of the vehicle, specifically: The resonant point of the oscillating blade assembly (2) is located in the high-energy frequency range of the vibration spectrum of the vehicle; when the vehicle is a car or a jet aircraft, the resonant point of the oscillating blade assembly (2) is at the lowest point in the high vibration energy frequency range of the vibration spectrum; when the vehicle is a propeller aircraft, the resonant point of the oscillating blade assembly (2) is in the frequency range of the lowest frequency narrow band.

8. An electronic device on a vehicle, characterized in that, include: One end face of the electronic device is provided with a vibration heat dissipation structure as described in any one of claims 1 to 7; The heat sink (1) of the vibration heat dissipation structure is installed on the heat dissipation end face of the electronic device. When the vehicle is in a vibration state, the heat sink (1) vibrates in a direction perpendicular to the swing blade assembly (2), and the swing blade assembly (2) generates torque and acts on the torsion spring (22) through the rotating cylinder (23), thereby causing the torsion spring (22) to be torsional deformed. The torsion spring (22) generates a torsional force towards the equilibrium position, causing the rotating cylinder (23) to rotate towards the equilibrium position, thereby driving the blade (25) to swing back and forth, driving the surrounding air flow.

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