Molding die, resin molding device, and method for producing resin molded product

Abstract

The present invention provides a molding die, a resin molding device and a method for manufacturing a resin molded product with improved molding accuracy. The molding die comprises a molding die main body (M), which holds a molding object (Sa) on which a chip (13) is arranged in the central area of ​​a substrate (11), and has a cavity (MC) which is rectangular in top view and to which resin material is supplied, and the molding die main body (M) comprises: a barrel (21) for filling the resin material; a gate (23) arranged on one side (S) of the cavity (MC) for supplying the resin material to the cavity (MC); and a flow path limiting mechanism (R) for limiting a lateral flow path (15) on both sides intersecting with one side (S), wherein the lateral flow path (15) is a flow path of the resin material flowing inside the cavity (MC) and in which the chip (13) is not arranged.

Description

Technical Field

[0001] The present invention relates to a molding die, a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Lead frames, substrates with chips mounted thereon, etc. are generally used as electronic components by being sealed with resin. Conventionally, resin molding devices for sealing substrates with resin, etc., are known that have a transfer molding mold for manufacturing semiconductor packages by sealing substrates such as BGA (ball grid array) with resin (for example, see Patent Documents 1 to 2).

[0003] The mold described in Patent Document 1 has a molding die composed of an upper mold and a lower mold, wherein a cavity is formed in the upper mold and a concave portion for placing a substrate is formed in the lower mold. In addition, a pot to which a resin tablet is supplied is provided in the lower mold, and a cull block is provided in the upper mold, wherein the cull block includes a runner and a gate for allowing molten resin to flow from the pot to the cavity. In the mold described in Patent Document 1, the chip is arranged at a resin supply position of a plurality of gates formed in the cull block, so that the flow of the molten resin is dispersed.

[0004] The mold described in Patent Document 2 has a molding mold composed of an upper mold and a lower mold, wherein a cavity is formed in the upper mold and a BGA substrate is placed in the lower mold. In addition, a barrel for resin filling is provided in the lower mold, and a residual material block (upper mold cavity block) is provided in the upper mold to allow molten resin to flow from the barrel to the cavity; and a gate is provided to temporarily accumulate molten resin from the residual material block. The gate is formed as a gap along the long side portion with a length substantially equal to that of the long side portion of the cavity, and molten resin is simultaneously supplied to the cavity from the entire long side portion of the gate.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2014-204082

[0008] Patent Document 2: Japanese Patent Application Publication No. 2000-12578 Summary of the invention

[0009] Problems to be solved by the invention

[0010] However, even if the molten resin is caused to collide with the chip and the molten resin is diverted as in the mold described in Patent Document 1, the flow rate of the molten resin in the side area of ​​the substrate where there is no chip is faster than that in the chip area where there is a chip. Due to the speed difference, the molten resin goes around from the side area to the chip area and surrounds the air (including the gas generated from the molten resin), so it is easy to produce a void. Similarly, in the mold described in Patent Document 2, even if the molten resin is supplied from the entire area of ​​the long side portion of the cavity, the molten resin goes around from the side area of ​​the substrate to the chip area and surrounds the air (including the gas generated from the molten resin), so it is easy to produce a void. As a result, the molding accuracy of the resin molded product may be reduced. In particular, in the case of a flip chip substrate having a chip on the substrate in a manner separated by a protruding electrode, the flow rate of the molten resin in the narrow area between the substrate and the chip is low, and the molten resin goes around from the side area to the narrow area and easily produces a void.

[0011] Therefore, a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product with improved molding accuracy are desired.

[0012] Solutions for solving problems

[0013] The characteristic structure of the molding mold of the present invention is that the molding mold has a molding mold body, which holds a molding object with a chip arranged in the central area of ​​a substrate and has a cavity which is rectangular in top view and is supplied with resin material, and the molding mold body includes: a barrel for filling the resin material; a gate, which is arranged on one side of the cavity and supplies the resin material to the cavity; and a flow path limiting mechanism, which limits the lateral flow path on both side sides intersecting with the one side, and the lateral flow path is a flow path of the resin material flowing inside the cavity and is not equipped with the chip.

[0014] The resin molding device of the present invention is characterized in that the resin molding device includes the molding die and a mold clamping mechanism for clamping the molding die.

[0015] The manufacturing method of the resin molded product of the present invention is characterized in that the manufacturing method of the resin molded product includes: a supply process, supplying the molding object and the resin material to the molding mold; a mold closing process, closing the molding mold while the resin material is heated; and a molding process, resin molding the molding object by allowing the resin material to flow from the gate to the cavity, and in the molding process, the side flow path is restricted by the flow path restriction mechanism.

[0016] Effects of the Invention

[0017] According to the present invention, it is possible to provide a molding die, a resin molding device, and a method for manufacturing a resin molded product with improved molding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram showing a resin molding device.

[0019] Figure 2 This is a schematic diagram of the molding module.

[0020] Figure 3 This is a schematic top view of the molding die body.

[0021] Figure 4 yes Figure 3 A schematic cross-sectional view of line IV-IV.

[0022] Figure 5 This is a schematic diagram of a molding module according to another first embodiment.

[0023] Figure 6 This is a schematic cross-sectional view of a molding die according to another first embodiment.

[0024] Figure 7 This is a schematic plan view of a molding die according to another second embodiment.

[0025] Figure 8 This is a schematic plan view of a molding die according to another third embodiment.

[0026] Fig. 9 This is a schematic plan view of a molding die according to another fourth embodiment. DETAILED DESCRIPTION

[0027] Hereinafter, embodiments of the molding die, resin molding apparatus, and method for manufacturing a resin molded product of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.

[0028] [Device configuration]

[0029] Molding objects such as lead frames and substrates with semiconductor chips (hereinafter sometimes referred to as "chips") mounted thereon are used as electronic components by resin sealing. The electronic components are used, for example, as high-frequency module substrates for portable communication terminals, module substrates for power control, substrates for device control, and the like. As one of the techniques for resin sealing of molding objects, there is a transfer method for manufacturing semiconductor packages by resin sealing of BGA (ball grid array) substrates and the like. The transfer method is as follows: a substrate with a chip mounted thereon is accommodated in a cavity of a molding mold, a resin sheet formed by solidifying a powdery resin is supplied to the barrel of the molding mold, heated, and melted, and then, while the molding mold is closed, a molten resin formed by melting the resin sheet is supplied to the cavity and solidified, and the mold is opened to manufacture a resin molded product.

[0030] In the conventional transfer method, if voids (bubbles) are generated in the resin molded product, it will lead to poor molding. Therefore, it is necessary to provide an air vent in the molding die. In order to prevent voids, the position of the air vent is designed to be the most appropriate position according to the shape of the substrate and the chip. In addition, even if the most appropriate air vent is provided, the flow rate of the molten resin is relatively faster than that of the area where the chip, the resistor, the capacitor, etc. are not present in the substrate. Due to the speed difference, the molten resin goes around from the side area to the area where the chip is present and surrounds the air (including the gas generated from the molten resin), so it is easy to generate voids. In particular, in the case of molded underfilling (Molded Underfill) of a flip chip substrate having a chip on the substrate in a manner separated by a protruding electrode, the flow rate of the molten resin in the narrow area between the substrate and the chip becomes low, so the molten resin goes around from the side area where the chip is not present to the narrow area and it is easy to generate voids. As a result, there is a problem of poor molding of the resin molded product.

[0031] Therefore, in the present embodiment, a molding die C, a resin molding device D, and a method for manufacturing a resin molded product with improved molding accuracy are provided. Hereinafter, a flip chip substrate having a rectangular shape when viewed from above is described as an example of a molding object, and sometimes the gravity direction is set as the bottom and the direction opposite to the gravity direction is set as the top.

[0032] Figure 1, a schematic diagram of a resin molding device D is shown. The resin molding device D in this embodiment includes a molding module 3, a supply module 4, a control unit 6, and a conveying mechanism. The molding module 3 includes a molding die C, which is used to resin-seal the molding object with a powdery resin or a liquid resin. The control unit 6 is software for controlling the operation of the resin molding device D, and is composed of a program stored in hardware such as a HDD (Hard Disk Drive) and a memory, and is executed by the CPU (Central Processing Unit) of the computer. In other words, the control unit 6 controls the operation of the molding module 3, the supply module 4, and the conveying mechanism.

[0033] It should be noted that the powdery resin includes not only powdery resin, but also a resin sheet formed by a solid resin formed by pressing the powdery resin, all of which are melted into a liquid molten resin by heating. The powdery resin can be a thermoplastic resin or a thermosetting resin. The viscosity of the thermosetting resin decreases when heated, and if further heated, it will polymerize and solidify to become a cured resin. Considering the ease of operation, the powdery resin in this embodiment is preferably a resin sheet formed by a solid resin, and further, in order to reliably fill the molten resin between the chip and the substrate, it is preferably a thermosetting resin with high fluidity containing a micronized filler.

[0034] The molding module 3 performs resin sealing on the pre-resin-sealed substrate Sa (an example of a molding object) to mold a resin-sealed finished substrate Sb (an example of a resin molded product). The molding modules 3 are provided in plurality (three in this embodiment), and each molding module 3 can be independently attached or detached. The molding modules 3 will be described in detail below.

[0035] The supply module 4 includes a substrate supply mechanism 43, a substrate arrangement mechanism 44, a resin supply mechanism 45, and a substrate storage portion 46, which serves as a standby position for the loader 41 and the unloader 42 included in the conveying mechanism. The substrate supply mechanism 43 delivers the stored resin-sealed pre-substrate Sa to the substrate arrangement mechanism 44. One semiconductor chip or a plurality of semiconductor chips are mounted on the resin-sealed pre-substrate Sa in a longitudinal and / or transverse arrangement. The substrate arrangement mechanism 44 makes the resin-sealed pre-substrate Sa delivered from the substrate supply mechanism 43 into a state suitable for conveying. The resin supply mechanism 45 stores a resin sheet T (an example of a resin material) and configures the resin sheet T into a state suitable for conveying.

[0036] The conveying mechanism includes a loader 41 and an unloader 42. The loader 41 conveys a pre-resin-sealed substrate Sa on which semiconductor chips are mounted before resin sealing and a resin sheet T, and the unloader 42 conveys a resin-sealed substrate Sb after resin sealing. The loader 41 can receive a plurality of (four in this embodiment) pre-resin-sealed substrates Sa from a substrate arrangement mechanism 44, and a plurality of (six in this embodiment) resin sheets T from a resin supply mechanism 45, and move from a supply module 4 to each molding module 3 on a track, and deliver the pre-resin-sealed substrate Sa and the resin sheet T to each molding module 3. The unloader 42 can take out the resin-sealed substrate Sb from the molding module 3, and move from each molding module 3 to a substrate receiving section 46 on a track, and receive the resin-sealed substrate Sb in the substrate receiving section 46. In the resin-sealed substrate Sb, the semiconductor chips are sealed by solidified resin formed by solidifying the molten resin.

[0037] Hereinafter, the molding module 3 will be described in detail.

[0038] like Figure 2 As shown, in the molding module 3, tie-bars 32 are erected at the four corners of the lower fixed plate 31 which is rectangular in plan view, and an upper fixed plate 33 which is rectangular in plan view is provided near the upper end of the tie-bar 32. A movable platen 34 which is rectangular in plan view is provided between the lower fixed plate 31 and the upper fixed plate 33. The movable platen 34 is provided with holes at the four corners for the tie-bar 32 to pass through, and can move up and down along the tie-bar 32. A clamping mechanism 35 which is a device for moving the movable platen 34 up and down is provided on the lower fixed plate 31. The clamping mechanism 35 can clamp the molding mold C by moving the movable platen 34 upward, and can open the molding mold C by moving the movable platen 34 downward. The driving source of the clamping mechanism 35 is not particularly limited, and for example, an electric motor such as a servo motor can be used.

[0039] The molding die C includes a molding die main body M having a lower die LM and an upper die UM. The lower die LM and the upper die UM are constituted by dies and the like disposed to face each other.

[0040] The lower mold LM is provided with a substrate setting portion, which places the resin-sealed pre-substrate Sa in a manner in which the surface on which the semiconductor chip or the like is mounted faces upward. In addition, the lower mold LM is provided with a lower heater 36, which heats the resin-sealed pre-substrate Sa and the resin sheet T. Furthermore, a cylindrical barrel 21 filled with the resin sheet T (resin melted by heating) is fixed to the lower mold LM by heat-pressing or the like. A plunger 25 driven by an electric motor (not shown) such as a servo motor is inserted into the lower cylindrical space of the barrel 21 so as to be movable up and down.

[0041] A cavity MC which is rectangular in plan view and to which molten resin is supplied is formed in the upper mold UM, and an upper heater 37 for heating the cavity MC is built in. The upper mold UM includes a cavity block in which the cavity MC is formed, and a scrap block, wherein the scrap block has a flow channel 22 for allowing the molten resin to flow from the barrel 21 to the cavity MC, and a vent 26 for exhausting air from the cavity MC is provided in the cavity block. The cavity block and the scrap block are fixed to the upper mold UM as separate components. The scrap block is provided with an inlet, i.e., a gate 23, for the molten resin to flow from the flow channel 22 to the cavity MC. In addition, the upper mold UM is provided with a flow path limiting mechanism R described later. It should be noted that the cavity block and the scrap block may also be configured as an integral component. In addition, the vent 26 may also be configured as a vent block separate from the cavity block.

[0042] use Figure 3-4 The molding die body M is described in detail. Figure 3 Schematic top view of the cavity MC as viewed from above is shown in FIG. Figure 4 is with Figure 3 It should be noted that in this embodiment, the case where the surface of the chip 13 is exposed to form is described (refer to Figure 4 ), but the surface of the chip 13 may also be sealed with resin.

[0043] like Figure 3 As shown, the gate 23 is provided at the central portion of one side S of the cavity MC, and the molten resin flowing from the barrel 21 to the runner 22 is supplied to the cavity MC via the gate 23. A vent 26 is provided on the other side E of the cavity MC opposite to the one side S, and air can be exhausted from the cavity MC via the vent 26. Figure 3-4 As shown, the resin-sealed substrate Sa in this embodiment is composed of the following substrate (flip chip substrate): the chip 13 is electrically connected to a plurality of protruding electrodes 12 arranged in a two-dimensional array on the substrate 11. The protruding electrodes 12 and the chip 13 are mounted in the central area of ​​the substrate 11 when viewed from above, and the central area of ​​the substrate 11 becomes the chip existence area, and the peripheral area surrounding the central area of ​​the substrate 11 becomes the chip non-existence area. The chip 13 is composed of an IC chip or the like in which many electronic components and wiring are mounted on a semiconductor.

[0044] In such a flip chip substrate, the molten resin supplied from the gate 23 flows from one side S (flow start end) of the cavity MC to the other side E (flow end end). At this time, in the side area of ​​the substrate 11 where the chip 13 is not arranged (the area along the two sides connected from the one side S to the other side E of the cavity MC), the flow speed of the molten resin is relatively faster than the chip existence area (the central area of ​​the substrate 11) where the chip 13 is present. Due to this speed difference, the molten resin goes around from the side area to the chip existence area and surrounds the air (including the gas generated from the molten resin), so that a gap is easily generated. In particular, in the case of a flip chip substrate having a chip 13 on the substrate 11 in a manner of sandwiching a protruding electrode 12, in the narrow area between the substrate 11 and the chip 13 (the area where the protruding electrode 12 is present), the flow speed of the molten resin is relatively slower than the side area where the chip 13 is not present, so the molten resin goes around from the side area to the narrow area and a gap is easily generated.

[0045] Therefore, the molding die body M of the present embodiment has a flow path limiting mechanism R, which limits the lateral flow path 15 of the molten resin flowing inside the cavity MC on both sides intersecting with one side S and the other side E of the cavity MC. The flow path limiting mechanism R limits the lateral flow path 15 (reduces the flow path cross-sectional area of ​​the lateral flow path 15) within a predetermined time from the start of the supply of the molten resin, thereby reducing the flow rate of the molten resin flowing in the lateral flow path 15. The flow path limiting mechanism R is composed of a pair of movable blocks 16 (an example of a limiting member). The movable block 16 in the present embodiment is a rectangular parallelepiped, and the width W2 of the movable block 16 is about 90% of the width W1 of the lateral flow path 15 (i.e., the minimum width from the side of the chip 13 to the wall of the cavity MC). The ratio of the width W2 of the movable block 16 to the width W1 of the lateral flow path 15 can be appropriately set in consideration of the viscosity of the molten resin, the size of the gap between the chip 13 and the substrate 11, the size and number of the protruding electrodes 12, etc., but is preferably about 50% or more. When viewed from the side, the top 16a (the end surface on the lower side) of each movable block 16 is located at the height of the narrow area between the substrate 11 and the chip 13 (the gap area between the substrate 11 and the chip 13), thereby becoming a state of restricting the lateral flow path 15. In other words, when the movable block 16 restricts the lateral flow path 15, the top 16a overlaps with the narrow area between the substrate 11 and the chip 13 when viewed from the side. The movable block 16 can be inserted into or removed from the cavity MC by the driving force of a cylinder, a servo motor, etc. (not shown), and can be changed between a state of restricting the lateral flow path 15 of the cavity MC and a state of fully opening the lateral flow path 15. The movable block 16 in the present embodiment is provided in the upper mold UM so as to be movable up and down, and is provided in substantially the entire region facing the core piece 13 in the lateral flow passage 15 of the cavity MC.

[0046] It should be noted that, when viewed from the side, the height of the top 16a of the movable block 16 located in the narrow area between the substrate 11 and the chip 13 from the substrate 11 is set in such a way that the flow speed of the molten resin in the narrow area between the substrate 11 and the chip 13 and the lateral flow path 15 is close. After a predetermined time, the movable block 16 is moved, and the state of restricting the lateral flow path 15 is changed to the state of fully opening the lateral flow path 15. Considering factors such as the size of the gap between the chip 13 and the substrate 11, the size and number of the protruding electrodes 12, and the viscosity of the molten resin, the timing can be adjusted in such a way that the molten resin does not go around from the outside of the cavity MC to the inside. For example, the movable block 16 can be in a fully open state at the time when the molten resin reaches the end of the flow (the other side E), or it can be changed to a fully open state when the molten resin is injected into the entire narrow area between the substrate 11 and the chip 13. Alternatively, the flow speeds of the molten resin in the narrow region between the substrate 11 and the chip 13 and in the side flow path 15 may be set to be close to each other through simulation.

[0047] In this way, the flow rate of the molten resin in the side flow path 15 is reduced by the flow path restriction mechanism R, which restricts the side flow path 15 of the molten resin flowing inside the cavity MC on both sides intersecting with one side S and the other side E of the cavity MC. As a result, even when the chip 13 and the protruding electrode 12 that become the flow resistance of the molten resin are mounted on the substrate Sa before resin sealing, the flow speed of the molten resin outside the cavity MC where the chip 13 is not present can be made close to the flow speed of the molten resin inside the cavity MC where the chip 13 is present. As a result, at the end of the flow of the molten resin flowing inside the cavity MC (the other side E), the front end portions of the molten resin outside the cavity MC and inside the cavity MC are close to each other, which prevents the molten resin from going around from the outside to the inside and surrounding the air. Therefore, it is not easy to generate gaps in the resin-sealed substrate Sb (resin molded product), and the molding accuracy can be improved.

[0048] Furthermore, if the flow path limiting mechanism R is composed of a movable block 16, the flow rate of the molten resin in the side flow path 15 can be reliably reduced. The movable block 16 has a top end 16a located in the narrow area between the substrate 11 and the chip 13 when viewed from the side while restricting the side flow path 15. As a result, the flow rate of the molten resin outside the cavity MC where the chip 13 does not exist can be made close to the flow rate of the molten resin in the narrow area between the substrate 11 and the chip 13. Thus, even if the molding object is a flip-chip substrate, the flow end end (the other side E) of the molten resin flowing inside the cavity MC is close to the front end portion of the molten resin outside the cavity MC and inside the cavity MC, and the molten resin is prevented from going from the outside to the inside and surrounding the air.

[0049] [Method for producing resin molded article]

[0050] use Figure 1 to Figure 4 A method for producing a resin molded article will be described.

[0051] like Figure 1 As shown, the loader 41 is heated in advance while the storage space for the resin sheet T is insulated. In addition, the heaters 36 and 37 are powered on in advance to heat the molding die main body M. Then, a plurality of resin-sealed front substrates Sa taken out from the substrate supply mechanism 43 are placed on the loader 41. In addition, the resin sheet T arranged by the resin supply mechanism 45 is accommodated in the storage space for the resin sheet T of the loader 41. Then, the loader 41 conveys the resin-sealed front substrate Sa to the molding module 3, places the resin-sealed front substrate Sa on the substrate setting portion of the lower mold LM in such a manner that the side on which the semiconductor chip is mounted faces upward, and accommodates the resin sheet T in the barrel 21 (supply process, refer to Figure 2 ).

[0052] Then, if Figure 2 As shown in FIG. 1 , the mold clamping mechanism 35 is used to move the movable platen 34 upward to relatively move the lower mold LM toward the upper mold UM, thereby clamping the molding mold C (mold clamping process). At this time, the movable block 16 is used to preliminarily restrict the side flow path 15, and the air is exhausted from the cavity MC through the vent 26 (see FIG. 1 ). Figure 3 Next, the resin sheet T contained in the cylinder 21 is heated and melted by the lower heater 36 built into the lower mold LM, and the resin-sealed front substrate Sa fixed to the lower mold LM is heated (molding process, see Figure 2 ).

[0053] Next, when the resin sheet T is melted to become molten resin, the plunger 25 is moved upward to allow the molten resin to flow from the barrel 21 to the gate 23 through the runner 22 (molding process, see Figure 2The molten resin is supplied to the cavity MC from the gate 23. The cavity MC is further heated by the heaters 36 and 37, whereby the molten resin in the cavity MC is solidified, and the pre-resin-sealed substrate Sa is sealed with resin to form a resin-sealed substrate Sb (resin molded product) (molding process, see Figure 2 ). In this molding process, Figure 3 As shown, the molten resin supplied from the gate 23 flows from one side S to the other side E of the cavity MC. Then, the molten resin that reaches the chip existence area enters the narrow area between the substrate 11 and the chip 13 in the central area of ​​the substrate 11 and the flow rate is reduced. The protruding electrode 12 between the chip 13 and the substrate 11 also blocks the flow of the molten resin, thereby reducing the flow rate. At this time, in the side area of ​​the substrate 11, the flow path restriction mechanism R is used to limit the side flow path 15 for a specified time, thereby reducing the flow rate of the molten resin. As a result, the flow speed of the molten resin in the narrow area between the substrate 11 and the chip 13 and the side flow path 15 is close, and the front end of the molten resin flowing inside the cavity MC is roughly parallel to the other side E of the cavity MC. As a result, the molten resin is prevented from going from the outside to the inside at the flow end (the other side E) and surrounding the air. Therefore, it is not easy to generate gaps in the resin-sealed substrate Sb, which can improve the molding accuracy.

[0054] After a specified period of time (for example, when the molten resin reaches one side of the chip 13 located at the flow end end (the other side E) of the cavity MC), the movable block 16 is raised (the flow path restriction mechanism R is released) to open the lateral flow path 15. Then, the open space of the lateral flow path 15 (the space in the cavity MC closed by the movable block 16) begins to be filled with molten resin. At this time, the gas generated by the molten resin flowing in the narrow area between the substrate 11 and the chip 13 can also be released into the open space. In this case, it is possible to prevent a gap from being generated in the narrow area between the substrate 11 and the chip 13. It should be noted that the timing for raising the movable block 16 can be set arbitrarily as long as the molten resin is supplied to substantially the entire area of ​​the central area of ​​the substrate 11.

[0055] After the molten resin is filled into the cavity MC, the mold C is opened by moving the movable platen 34 downward, and the resin-sealed substrate Sb is removed from the cavity MC. The resin-sealed substrate Sb is accommodated in the substrate accommodating portion 46 by the unloader 42 (accommodating process, also refer to Figure 1 Before the accommodating step, a gate break mechanism (not shown) may be used to remove unnecessary solidified resin in the residual material block.

[0056] [Other embodiments]

[0057] In the following, for easy understanding, the same terms and reference numerals are used for the same components as those in the above-mentioned embodiment.

[0058] <1> If Figure 5 As shown, the molding module 3 may also have a release film supply mechanism 38. The release film supply mechanism 38 includes: a delivery mechanism 38A that delivers the release film F before use wound on the reel to between the upper mold UM and the lower mold LM; and a winding mechanism 38B that winds up the used release film F for resin molding on the reel. A roller 38Aa is provided between the delivery mechanism 38A and the lower mold LM, and a roller 38Ba is provided between the lower mold LM and the winding mechanism 38B, and the release film F is pressed against the upper mold UM by these rollers 38Aa and 38Ba. The control unit 6 controls the torque (rotation speed) of the motor (not shown) provided in the delivery mechanism 38A and the torque (rotation speed) of the motor (not shown) provided in the winding mechanism 38B. As a result, the release film F can be delivered from the delivery mechanism 38A while applying appropriate tension to the moving direction of the release film F.

[0059] like Figure 6 As shown in the schematic cross-sectional view of the molding die C, in the molding die C in this embodiment, in addition to the cavity block, movable block 16 and vent 26 forming the above-mentioned cavity MC, it also includes: an adsorption mechanism (not shown) to adsorb the release film F to the mold surface of the upper mold UM; and a vent shutter 26A to prevent the molten resin from flowing out of the cavity MC after decompression. In this embodiment, by using the adsorption mechanism to adsorb the release film F to the mold surface of the upper mold UM, it is possible to prevent the molten resin from flowing into the gap (between the movable block 16 and the cavity block) in the upper mold UM for the movable block 16 to move.

[0060] In the method for manufacturing a resin molded product in the present embodiment, the cavity MC is closed by lowering the vent opening and closing portion 26A during the molding process. The timing of lowering the vent opening and closing portion 26A to close the cavity MC can be appropriately set in a manner to prevent the generation of voids, depending on the size of the substrate 11, the width of the narrow area, the ratio of the narrow area to the substrate 11, etc. For example, the timing can be after the molten resin is supplied to at least the substantially entire area of ​​the central area of ​​the substrate 11, or after a predetermined time has passed since it passed through the gate 23. Thus, the molten resin flowing inside the cavity MC can be prevented from leaking to the outside.

[0061] <2> If Figure 7As shown, the molding object in this embodiment has a chip 13 installed in the central area of ​​the substrate 11, and a plurality of independent passive components 14 such as capacitors, coils, and resistors installed in the side areas of the substrate 11. In this case, a plurality of movable blocks 16A (an example of a limiting member) for limiting the side flow path 15 are set at positions avoiding the independent passive components 14. As for the movable block 16A, the size and configuration are determined in consideration of the flow velocity of the molten resin in the narrow area between the substrate 11 and the chip 13, the flow resistance of the independent passive component 14, the installation area, etc. That is, by simulation, the size and configuration of the movable block 16A can be determined in such a way that the flow velocity of the molten resin in the narrow area between the substrate 11 and the chip 13 and the side flow path 15 are close.

[0062] <3> If Figure 8 As shown, the molding object in this embodiment has a chip 13 mounted in the central area of ​​the substrate 11, and a plurality of independent passive components 14 such as capacitors, coils, and resistors are densely mounted in the entire area on both sides of the chip 13. In this case, the flow path restriction mechanism R cannot be arranged in the side area of ​​the chip 13, so a pair of movable blocks 16B (an example of a restriction member) that restrict the side flow path 15 is arranged in the side area of ​​the substrate 11 on the side of the gate 23 of the chip 13. As a result, the flow path of the molten resin in the side area of ​​the substrate 11 is restricted from the gate 23 to the chip 13, and the flow speed of the molten resin outside the cavity MC where the chip 13 does not exist can be made close to the flow speed of the molten resin in the narrow area between the substrate 11 and the chip 13. In the movable block 16B in this embodiment, the size and arrangement are determined in consideration of the flow speed of the molten resin in the narrow area between the substrate 11 and the chip 13, the flow resistance of the independent passive components 14, the mounting area, etc.

[0063] <4>In Fig. 9 In, with Figure 8Similarly, the molding object has a chip 13 mounted in the central area of ​​the substrate 11, and a plurality of independent passive components 14 are densely mounted in the entire area on both sides of the chip 13. A pair of movable blocks 16C (an example of a limiting member) for limiting the lateral flow path 15 is arranged on the side of the lateral area of ​​the substrate 11 closer to the gate 23 than the chip 13. The pair of movable blocks 16C in this embodiment are formed with inclined surfaces 16Ca whose intervals become smaller as they move from the gate 23 to the chip 13. By using the inclined surfaces 16Ca, a part of the molten resin in the lateral area of ​​the substrate 11 between the gate 23 and the chip 13 is guided to the central area of ​​the substrate 11, and the flow rate of the molten resin in the narrow area between the substrate 11 and the chip 13 can be increased. As a result, the flow rate of the molten resin outside the cavity MC where the chip 13 does not exist can be made close to the flow rate of the molten resin in the narrow area between the substrate 11 and the chip 13. The movable block 16C in this embodiment is also dimensioned and arranged in consideration of the flow velocity of the molten resin in the narrow region between the substrate 11 and the chip 13 and the flow resistance of the independent passive component 14. It should be noted that the inclined surface 16Ca can also be applied to the movable blocks 16 and 16A in the above-mentioned embodiments.

[0064] <5> In the above-mentioned molding process, the top 16a of the movable block 16, 16A, 16B, 16C of the flow path limiting mechanism R may be brought into close contact with the substrate 11. In this case, the molten resin also flows in the gap between the movable block 16 and the cavity MC (the difference between the width W1 of the lateral flow path 15 and the width W2 of the movable block 16), and the flow path cross-sectional area is smaller than that in the case where there is no movable block 16, so the lateral flow path 15 is constricted. In addition, a concave-convex portion may be applied to the top 16a of the movable block 16 of the flow path limiting mechanism R. In this case, when the movable block 16 is brought into close contact with the substrate 11, the concave-convex portion can be used to constrict the lateral flow path 15. In these cases, the top 16a and the concave-convex portion abut against the substrate 11, so there is no need to precisely control the gap between the movable block 16 and the substrate 11. Furthermore, the flow path restriction mechanism R may be constituted by a fixed block that is always fixed in a state of restricting the side flow path 15 instead of the movable block 16. In this way, as long as the flow rate of the molten resin in the side flow path 15 is reduced by restricting the side flow path 15, the structure of the flow path restriction mechanism R is not particularly limited.

[0065] <6> The lower mold LM may also be provided with a cavity MC so that both surfaces of the molding object are sealed with resin.

[0066] <7> The barrel 21, the cavity block and the residual block may be provided in either the upper mold UM or the lower mold LM. In addition, the gate 23 may be provided over the entire area of ​​one side S of the cavity MC, and the arrangement and number of the gate 23 are not particularly limited.

[0067] <8> The molding object to be sealed with resin is not limited to the flip chip substrate, and can be any molding object as long as it is a lead frame or a substrate on which a semiconductor chip is mounted. In addition, the above-mentioned molding die C and resin molding device D can also be used to manufacture MAP (molded array packaging) in which a substrate on which a plurality of semiconductor chips are mounted is sealed with resin at the same time.

[0068] <9> In the above embodiment, the face-up transfer method is described, but as a face-down transfer method, the molding object such as the resin-sealed front substrate Sa may be fixed to the upper mold UM and the cavity MC may be provided in the lower mold LM.

[0069] <10> In the above-mentioned embodiment, the method of molding is described in which the surface of the chip 13 is exposed, but it is also possible to seal the surface of the chip 13 with resin. In this case, a movable block (flow path restriction mechanism R) may be provided above the chip 13 to temporarily block the flow of molten resin flowing from the gate 23 to the vent 26 and passing through the upper surface of the chip 13.

[0070] [Overview of the above embodiment]

[0071] Hereinafter, the outline of the molding die C, the resin molding device D, and the method for manufacturing a resin molded product described in the above-mentioned embodiment will be described.

[0072] (1) The characteristic structure of the molding die C is that the molding die C has a molding die body M, which holds a resin-sealed front substrate Sa (molding object) on which a chip 13 is arranged in the central area of ​​the substrate 11, and has a cavity MC that is rectangular in top view and is supplied with a resin sheet T (resin material), and the molding die body M includes: a barrel 21 for filling the resin sheet T (resin material); a gate 23, which is arranged on one side S of the cavity MC and supplies molten resin (resin material) to the cavity MC; and a flow path limiting mechanism R, which limits the side flow path 15 on both side sides intersecting with the one side S, and the side flow path 15 is a flow path of the molten resin (resin material) flowing inside the cavity MC and is not equipped with the chip 13.

[0073] In this configuration, a flow path restriction mechanism R is provided on both sides intersecting with one side S of the cavity MC to restrict the lateral flow path 15 of the molten resin flowing inside the cavity MC. The flow path restriction mechanism R reduces the flow rate of the molten resin in the lateral flow path 15 by restricting the lateral flow path 15. As a result, when the chip 13 that becomes the flow resistance of the molten resin is mounted on the central area of ​​the substrate 11, the flow rate of the molten resin outside the cavity MC where the chip 13 does not exist can be reduced, and the flow rate of the molten resin outside the cavity MC where the chip 13 does not exist can be made close to the flow rate of the molten resin inside the cavity MC where the chip 13 exists. As a result, at the flow end end (the other side E) of the molten resin flowing inside the cavity MC, the front end portions of the molten resin outside the cavity MC and inside the cavity MC are close to each other, which prevents the molten resin from going around from the outside to the inside and surrounding the air. Therefore, it is difficult to generate gaps in the resin-sealed substrate Sb (resin molded product), and the molding accuracy can be improved.

[0074] (2) The flow path restriction mechanism R may be configured to be changeable from a state in which the side flow path 15 is restricted to a state in which the side flow path 15 is fully opened.

[0075] As in this configuration, if the flow path restriction mechanism R is configured to be able to change from a state of restricting the side flow path 15 to a state of fully opening the side flow path 15, the flow path restriction mechanism R can be changed to a state of fully opening the side flow path 15 after restricting the side flow path 15, and the gas generated from the molten resin can also flow out to the open space. In this case, it is possible to prevent the gas from mixing into the chip existence area and generating a gap.

[0076] (3) Alternatively, in the substrate Sa (molding object) before resin sealing, the chip 13 is electrically connected to a plurality of protruding electrodes 12 arranged in a two-dimensional array on the substrate 11, and the flow path limiting mechanism R is composed of a movable block 16 (limiting member), which is arranged in the side flow path 15, and is in a state of limiting the side flow path 15 by positioning the top 16a at the height of the narrow area (gap area) between the substrate 11 and the chip 13 when viewed from the side. In the above embodiment, an example in which the protruding electrodes 12 are arranged in a grid shape is shown, but it is sufficient as long as they are arranged in a two-dimensional array shape, for example, a form in which two arrays are arranged may be used.

[0077] In the case of a flip chip substrate having a chip 13 on the substrate 11 with a protruding electrode 12 interposed therebetween, the flow rate of the molten resin in the narrow area between the substrate 11 and the chip 13 is slow, and the molten resin is easily generated by bypassing the narrow area from the side area. As in this configuration, if the flow path restriction mechanism R is composed of a movable block 16, the flow rate of the molten resin in the side flow path 15 can be reliably reduced. The movable block 16 has a top end 16a located in the narrow area between the substrate 11 and the chip 13 when viewed from the side while restricting the side flow path 15. As a result, the flow rate of the molten resin outside the cavity MC where the chip 13 does not exist can be made close to the flow rate of the molten resin in the narrow area. Therefore, even in the case of a flip chip substrate, at the flow end end (the other side E) of the molten resin flowing inside the cavity MC, the front end portions of the molten resin outside the cavity MC and inside the cavity MC are close to each other, and the molten resin is prevented from bypassing from the outside to the inside and surrounding the air.

[0078] (4) A resin molding device D is characterized in that it includes the molding die C according to any one of (1) to (3) above and a mold clamping mechanism 35 for clamping the molding die C.

[0079] In this structure, since the mold is clamped using the above-mentioned molding mold C, the molding accuracy can be improved.

[0080] (5) The method for manufacturing a resin molded product is characterized in that it is a method for manufacturing a resin-sealed substrate Sb (resin molded product) using the resin molding device D of the above-mentioned (4), including: a supply process, supplying a resin-sealed front substrate Sa (molding object) and a resin sheet T (resin material) to a molding mold C; a mold closing process, closing the molding mold C while the resin sheet T (resin material) is heated; and a molding process, resin molding of the resin-sealed front substrate Sa (molding object) is performed by allowing the molten resin (resin material) to flow from a gate 23 to the inside of a cavity MC, and in the molding process, the side flow path 15 is restricted by a flow path restriction mechanism R.

[0081] In this method, in the molding process, the flow rate of the molten resin in the side flow path 15 is reduced by using the flow path restriction mechanism R, so that the flow rate of the molten resin outside the cavity MC where the chip 13 is not present can be made close to the flow rate of the molten resin inside the cavity MC where the chip 13 is present. As a result, at the end of the flow of the molten resin in the cavity MC, the front end portions of the molten resin outside the cavity MC and inside the cavity MC are close to each other, which prevents the molten resin from going around from the outside to the inside and surrounding the air. Therefore, it is not easy to generate gaps in the resin-sealed substrate Sb (resin molded product), and the molding accuracy can be improved.

[0082] (6) In the molding process, after the molten resin (resin material) is filled to substantially the entire central region of the substrate 11 , the flow path restriction mechanism R may be released to open the side flow paths 15 .

[0083] It should be noted that the configurations disclosed in the above-mentioned embodiments (including other embodiments, the same below) can be used in combination with the configurations disclosed in other embodiments as long as no contradiction occurs. In addition, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited thereto, and can be appropriately changed within the scope of the purpose of the present invention. For example, in the above-mentioned embodiments ( Figure 4 , Figure 6 In the process, the upper surface of the chip 13 is brought into contact with the mold surface of the upper mold UM for resin sealing, thereby obtaining a resin-sealed substrate Sb with the upper surface of the chip 13 exposed. However, the upper surface of the chip 13 may also be resin-sealed.

[0084] Industrial Applicability

[0085] The present invention can be used for a molding die, a resin molding device, and a method for manufacturing a resin molded product. In particular, it is effective in thick-layer packaging with a sealing resin thickness of 1 mm or more, in automotive packaging, and in molding bottom filling of a flip-chip substrate with a gap of about 10 μm to 100 μm between the substrate and the chip.

[0086] Description of Reference Numerals

[0087] 11: substrate; 12: protruding electrode; 13: chip; 15: lateral flow path; 16: movable block (limiting member); 21: barrel; 23: gate; 35: clamping mechanism; C: molding die; D: resin molding device; M: molding die body; MC: cavity; R: flow path limiting mechanism; S: one side; Sa: substrate before resin sealing (molding object); Sb: substrate after resin sealing (resin molded product); T: resin sheet (resin material).

Claims

1. A molding die comprising a molding die main body, the molding die main body holding a molding object and having a rectangular cavity in a plan view to which a resin material is supplied, wherein in the molding object, a chip is electrically connected to a plurality of protruding electrodes arranged in a two-dimensional array in a central region on a substrate, The molding die body comprises: A barrel for filling the resin material; a gate, disposed on one side of the cavity, for supplying the resin material to the cavity; as well as A flow path limiting mechanism is configured to limit side flow paths on both sides intersecting with the one side, wherein the side flow paths are flow paths of the resin material flowing inside the cavity and where the chip is not arranged. The flow path limiting mechanism has a movable block, and the movable block is arranged in the side flow path, and the side flow path is limited by overlapping the top end and the gap area where the protruding electrode exists between the substrate and the chip when viewed from the side. The width of the movable block is not less than 50% and not more than 90% of the width of the side flow path.

2. A molding die comprising a molding die main body, the molding die main body holding a molding object and having a rectangular cavity in a plan view to which a resin material is supplied, wherein in the molding object, a chip is electrically connected to a plurality of protruding electrodes arranged in a two-dimensional array in a central region on a substrate, The molding die body comprises: A barrel for filling the resin material; a gate, disposed on one side of the cavity, for supplying the resin material to the cavity; as well as A flow path limiting mechanism is configured to limit side flow paths on both sides intersecting with the one side, wherein the side flow paths are flow paths of the resin material flowing inside the cavity and where the chip is not arranged. The flow path limiting mechanism has a movable block, and the movable block is arranged in the side flow path, and the side flow path is limited by overlapping the top end and the gap area where the protruding electrode exists between the substrate and the chip when viewed from the side. The distance between the end surface of the tip of the movable block and the surface of the substrate is set so that the flow speeds of the resin material flowing in the gap region and the side flow path are close to each other.

3. A molding die comprising a molding die main body, the molding die main body holding a molding object having a chip arranged in a central area of ​​a substrate, and having a rectangular cavity in a plan view to which a resin material is supplied, The molding die body comprises: A barrel for filling the resin material; a gate, disposed at one side of the cavity, for supplying the resin material to the cavity; as well as A flow path limiting mechanism is configured to limit side flow paths on both sides intersecting with the one side, wherein the side flow paths are flow paths of the resin material flowing inside the cavity and where the chip is not arranged. The flow channel restriction mechanism includes a pair of movable blocks on the gate side of the side flow channel, and the pair of movable blocks have inclined surfaces whose intervals with each other decrease from the gate toward the chip.

4. The molding die according to any one of claims 1 to 3, wherein: The flow path restriction mechanism is configured to be changeable from a state in which the side flow path is restricted to a state in which the side flow path is fully opened.

5. A resin molding device comprising: The molding die according to any one of claims 1 to 3, and A mold clamping mechanism for clamping the molding die.

6. A method for manufacturing a resin molded product, using a resin molding device for resin molding a molding object, wherein a chip in the molding object is electrically connected to a plurality of protruding electrodes arranged in a two-dimensional array in a central region on a substrate, wherein: The resin molding device comprises: A molding die having a gate and a movable block, wherein the gate supplies a resin material from one side of a cavity which is rectangular in plan view, and the movable block restricts a lateral flow path on two sides intersecting with the one side, wherein the lateral flow path is a flow path of the resin material flowing inside the cavity and where the chip is not arranged; as well as A mold clamping mechanism is used to clamp the molding mold. The method for manufacturing the resin molded product comprises: A supplying step of supplying the molding object and the resin material to the molding die; a mold closing step of closing the molding die while the resin material is heated; and a molding step of causing the resin material to flow from the gate into the cavity to perform resin molding of the molding object; In the molding step, the movable block is moved so that the tip of the movable block overlaps with a gap region between the substrate and the chip where the protruding electrode exists when viewed from the side, thereby restricting the lateral flow path.

7. The method for producing a resin molded article according to claim 6, wherein: In the molding step, after the resin material is supplied to the central region of the substrate, the movable block is moved to open the side flow path.

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