Method for manufacturing half-cutting double-sided adhesive tape

Abstract

A double-sided tape with a peeling substrate is obtained by a simple process without bringing the cutter blade into direct contact with the adhesive layer during the half-cutting process. The process includes: a step of drawing out a double-sided tape with a peeling substrate (100) and a processing peeling paper tape (130) respectively, and bringing them into abutment to form a processing protective layer on the double-sided tape with a peeling substrate (100); a half-cutting step of continuously half-cutting the double-sided tape with a peeling substrate (100) on which the processing protective layer is formed to become a state in which a plurality of double-sided tape pieces of a proper length are held on the peeling substrate (120); and a step of peeling the processing peeling paper tape (130) while winding up the half-cutting finished double-sided tape with a peeling substrate (100A) that has been subjected to the half-cutting process. In the half-cutting step, it is easy to peel if a width direction cut region that has been cut and a width direction uncut region that has not been cut are formed in the width direction.

Description

Technical Field

[0001] This invention relates to a method for manufacturing semi-cut double-sided adhesive tape.

[0002] Typical double-sided tape is a continuous, seamless tape in which the substrate and the adhesive layers on both sides of the substrate are integrated, and the surface is supported by the release liner before application. "Semi-cut double-sided tape" refers to double-sided tape that has been properly cut and is supported by the release liner before application. Background Technology

[0003] Conventional double-sided tapes typically consist of adhesive layers on both sides of a substrate layer, and are rolled up while supported on one side by a release liner before application. If a release agent is applied to both sides of the release liner, the release liner can be a single sheet rolled up sequentially from the inside. These are commonly supplied in the market in this rolled form.

[0004] Double-sided tape is used to bond the two together by being placed between the attachment area and the object to be attached. When using double-sided tape, the tape is pulled out to the required length for bonding and cut. After the adhesive layer not covered by the release liner is attached to the attachment area and positioned, the release liner is peeled off and the adhesive layer on the surface side is attached to the object to be attached.

[0005] Here, considering the industrial use of double-sided tape, the aforementioned general double-sided tape is a continuous whole in the length direction, requiring a cutting process and a peeling process for the paper tape, which is difficult to control mechanically.

[0006] Therefore, in conventional technology, a special type of double-sided tape is known as "semi-cut double-sided tape" (e.g., Japanese Patent Application Publication No. 2016-008262). Semi-cut double-sided tape consists of short strips of double-sided tape that have been appropriately cut, and is supported by a release liner on its surface before application. That is, the double-sided tape is partially cut into multiple short strips along its width and held on the release liner side before application. Since semi-cut double-sided tape is cut into short strips of appropriate length from the beginning, it can be directly applied to the target area or object while simultaneously peeling the release liner, eliminating the need for further cutting and facilitating automation when using double-sided tape. Furthermore, with semi-cut double-sided tape, the release liner is peeled off simultaneously with the application of the double-sided tape to the target area or object, making it easy to recycle the release liner.

[0007] Based on these characteristics, semi-cut double-sided tape is particularly suitable for industrial applications and is expected to become more widely used in the future.

[0008] Figure 14 The diagram is a simplified representation of the manufacturing process of a semi-cut double-sided tape disclosed in Japanese Patent Application Publication No. 2016-008262.

[0009] like Figure 14 As shown in (a), a rolled material, referred to as the adhesive tape 1100, is conveyed from the first conveyor reel 1310 to the first take-up reel 1320. The adhesive tape 1100 consists of an adhesive tape 1120 as a double-sided adhesive tape and a manufacturing tape 1110 that supports one side of the adhesive tape 1120. The adhesive tape 1100 passes between a cutter, such as a die cutting roller 1340 which is provided with multiple cutting blades during the extraction process, and a support table 1330, thereby undergoing a semi-cutting process. Through this semi-cutting process, the material is thus... Figure 14 As shown in (b), the adhesive tape in the adhesive tape 1100 is cut into short strips of appropriate length to become multiple adhesive tape pieces. That is, the adhesive tape 1120, which is a double-sided tape, is first half-cut.

[0010] Here, as Figure 14 As shown in (b), simultaneously with the removal of the adhesive tape 1100, it is conveyed from the second transport reel 1410, called the peeling tape 1200, to the second take-up reel 1420. The adhesive tape 1100, having undergone a semi-cutting process following the die cutting roller 1340, comes into contact with the peeling tape 1200. The adhesive tape sheet 1120 detaches from the manufacturing tape 1110 and attaches to the side of the peeling tape 1200. That is, as... Figure 14 As shown in (c), the half-cut adhesive tape 1120 is transferred from the manufacturing tape 1110 side to the peeling tape 1200 side.

[0011] The peeling tape 1200 is gradually wound onto the second take-up reel 1420, in which a semi-cut double-sided tape is obtained.

[0012] Patent Document 1: Japanese Patent Application Publication No. 2016-008262 Summary of the Invention

[0013] The problem that the invention aims to solve

[0014] However, the manufacturing method for semi-cut double-sided tape disclosed in Japanese Patent Application Publication No. 2016-008262 has issues that need improvement.

[0015] The first problem is that during the semi-cutting process, the cutting edge of the die cutting roller comes into direct contact with the adhesive. If the adhesive has strong adhesion, the semi-cutting process may encounter adverse conditions.

[0016] In the method for manufacturing semi-cut double-sided tape disclosed in Japanese Patent Application Publication No. 2016-008262, the adhesive tape 1100, which has been drawn from the first conveyor reel 1310 toward the first take-up reel 1320, is semi-cut by having the cutting edge of the die cutting roller 1340 directly abut against the adhesive surface of the drawn adhesive tape 1100 in the state where the adhesive has been peeled off. Therefore, as Figure 14 As shown in (b), the cutting edge of the die cutting roller 1340 is in direct contact with the adhesive. Even if the adhesive has relatively weak adhesion, repeated use over a long period of time can cause the adhesive to become entangled on the cutting edge of the die cutting roller 1340 and solidify, preventing sharp cutting. Alternatively, some of the adhesive already attached to the cutting edge of the die cutting roller 1340 may transfer to the adhesive tape 1120 side during half-cutting, potentially causing adverse conditions. In particular, the likelihood of such adverse conditions increases when processing the adhesive tape 1120, which has strong adhesion, in industrial applications or similar situations.

[0017] The second problem is as follows: the transfer of the peeling tape 1200 (for transfer) drawn from the second conveyor reel 1410 cannot proceed smoothly. In the manufacturing method of semi-cut double-sided tape disclosed in Japanese Patent Application Publication No. 2016-008262, the final step is as follows... Figure 14 As shown in (c), the half-cut adhesive tape sheet 1120 must be transferred from the manufacturing tape 1110 (the original peel tape) side to the peel tape 1200 (the transfer peel tape) side. However, this transfer may be affected by factors such as the adhesive strength, the precision of the half-cutting process, and the surface condition of the manufacturing tape 1110 (the original peel tape) and the peel tape 1200 (the transfer peel tape). Not all of the half-cut adhesive tape sheets may be transferred, and some adhesive tape sheets may remain on the manufacturing tape 1110 (the original peel tape) side.

[0018] In view of the above-mentioned problems, the object of the present invention is to provide a manufacturing method in which the cutting edge of the die cutting roller is not in direct contact with the adhesive during the semi-cutting process, and the adhesive tape sheet does not need to be moved such as by transfer after the semi-cutting process. Instead, high-quality semi-cut double-sided tape can be obtained through simple steps without the use of special materials or processing machinery.

[0019] Solution for solving the problem

[0020] To address the aforementioned issues, the present invention comprises the following structure. It should be noted that the constituent elements described below can be used in any combination within feasible limits. Furthermore, the solutions or technical features of the present invention are not limited to the following descriptions, but should be understood as being based on the inventive concept described in the entire specification and accompanying drawings, or on the inventive idea that can be grasped by those skilled in the art from these descriptions.

[0021] As a technical solution to solve the first and second problems mentioned above, the inventors have devised a manufacturing method that prevents the cutting edge of the die cutting roller from directly contacting the adhesive during the semi-cutting process and eliminates the need for transferring or moving the adhesive tape after the semi-cutting process. This method involves pre-setting a processing protective layer by bringing the surface of the processing release paper tape into contact with the surface of the double-sided tape before the semi-cutting process, and then performing the semi-cutting process from above the processing protective layer. Furthermore, the inventors have also devised a manufacturing method for semi-cut double-sided tape that allows for the efficient use of the original double-sided tape material without waste.

[0022] The manufacturing method of the semi-cut double-sided tape of the present invention uses the following steps as basic steps: "processing protective layer formation step", "semi-cutting step" and "semi-cut double-sided tape winding step", and further applies design in each step.

[0023] The "processing protective layer formation process" is a process in which a double-sided adhesive tape with a release substrate and a processing release paper tape having a release surface are respectively extracted, and the processing release paper tape is brought into contact with the double-sided adhesive tape with the release substrate to form a processing protective layer on the double-sided adhesive tape with the release substrate. The double-sided adhesive tape with the release substrate includes: a double-sided adhesive tape having a substrate layer and adhesive layers on both sides of the substrate layer; and a release substrate covering the adhesive layer on one side of the double-sided adhesive tape.

[0024] The “semi-cutting process” is a process in which the processing release paper tape, which serves as the processing protective layer, and the double-sided tape with attached release substrate are continuously semi-cut, leaving only the release substrate, so that multiple pieces of the double-sided tape with appropriate lengths remain on the release substrate.

[0025] The “half-cut double-sided tape winding process” is a process in which, while peeling off the release paper tape for processing, the double-sided tape with the attached release substrate that has undergone the half-cutting process is wound up.

[0026] According to the above structure, through the "processing protective layer formation process," when a commercially available "double-sided tape with a release liner" is pulled out, the adhesive layer on one side is peeled off, and the "processing release paper tape" is placed in contact with and overlapped. This results in a state where the back side of the double-sided tape is covered by the "release liner" as a support layer, and the processed side of the double-sided tape is covered by the "processing release paper tape" as a protective layer. That is, before the semi-cutting process, the adhesive layer side to be semi-cut is covered by the "processing release paper tape," thus the cutting edge for semi-cutting is less affected by the adhesive layer. Furthermore, in the "semi-cut double-sided tape winding process," the "processing release paper tape" is peeled off and wound up simultaneously, thus becoming a "double-sided tape with a release liner" in a semi-cutting state, which is then wound up.

[0027] That is, according to the present invention, the cutting edge of the die cutting roller can be processed without direct contact with the adhesive during the semi-cutting process of the semi-cut double-sided tape. In addition, after the semi-cutting process, the small pieces of the semi-cut double-sided tape are formed in the form of remaining on the original release substrate, without the need for transfer to the processing release paper tape side, and can be manufactured in a simple way.

[0028] In this invention, further, as a processing condition in the manufacturing method of a semi-cut double-sided tape including the above-described basic steps, the width of the processing release paper tape is greater than the width of the double-sided tape with the release substrate attached, and greater than the width of the semi-cut in the semi-cutting step, wherein the width of the semi-cut in the semi-cutting step is greater than or equal to the width of the double-sided tape with the release substrate attached, and smaller than the width of the processing release paper tape.

[0029] According to the above manufacturing method, in the "semi-cutting process", the cutting marks of the semi-cutting cover the entire width direction of the double-sided tape with the release substrate. The material of the double-sided tape with the release substrate can be obtained in the entire area without waste. On the other hand, the processing release paper tape has a part of the uncut area remaining in the width direction, so the processing release paper tape can be connected into one and easily peeled off.

[0030] If the width of the double-sided tape with the release liner is the same as the width of the processing release paper tape, then in order to utilize the entire area of ​​the double-sided tape with the release liner without wasting material, when the double-sided tape with the release liner is completely halved in the width direction, the processing release paper tape is also completely halved in the width direction. The processing release paper tape itself becomes a small piece and cannot be easily peeled off. In this invention, the processing release paper tape is wider than the double-sided tape with the release liner, so the ends of the processing release paper tape are ensured to be areas that remain uncut in the width direction (uncut areas in the width direction). The processing release paper tape can be easily peeled off starting from these uncut areas. It should be noted that if the width of the half-cut in the half-cutting process is greater than or equal to the width of the double-sided tape with the release liner, then the entire double-sided tape with the release liner becomes a small piece after half-cutting. If the processing release paper tape is peeled off and removed, the material can be used entirely as short strips without wasting material.

[0031] It should be noted that the cutting edge used for half-cutting is not limited to, for example, a Thomson cutting edge or a die cutting roller cutting edge. Furthermore, there are no restrictions on the interval of the half-cuts; they can be selected according to the application. For example, it can be several millimeters or several centimeters.

[0032] In the above process, preferably, the cutting mark of the semi-cutting process is as follows: the double-sided adhesive tape with attached release substrate is cut in the width direction without any uncut area, at least a portion of the processing release paper tape is formed in the width direction without being cut and leaving an uncut area in the width direction, and the processing release paper tape maintains a continuous state with at least a portion uncut in the length direction.

[0033] For example, the uncut area in the width direction of the peeling paper tape for processing may be formed at both ends in the width direction, or formed only on one side in the width direction, etc.

[0034] By setting up the uncut area in the width direction in this way, it is easy to peel off the "processing release paper tape" in the "half-cut double-sided tape winding process" if the uncut area in the width direction is used as the starting point.

[0035] The shape of the cutting edge in the "semi-cutting process" is not limited. For example, the cutting mark of a semi-cut can be a straight line at a right angle in the width direction, at least a part of the cutting mark of a semi-cut has an angle in the width direction, at least a part of the cutting mark of a semi-cut is curved, and so on.

[0036] Next, the semi-cut double-sided tape application apparatus of the present invention is characterized in that, as described above, the semi-cut double-sided tape with a release liner is applied to the application target area. The semi-cut double-sided tape with a release liner has been semi-cut into multiple small pieces and a release liner covering one side of the semi-cut double-sided tape. The semi-cut double-sided tape application apparatus includes a roller mounting part that supports the roll of the semi-cut double-sided tape with a release liner in a rotatable manner, a rotary application rolling part through which the pulled-out semi-cut double-sided tape with a release liner passes, and a release liner recovery part that recovers the release liner. The rotary application rolling part includes a rotating body and a support mechanism that supports the rotating body in a rotatable manner.

[0037] Here, a structure in which the support mechanism has a height control mechanism can be adopted, which controls the height at which the rotating body is supported.

[0038] The height control mechanism controls the height of the rotating body. During the application of the semi-cut double-sided adhesive tape with a peel-off substrate via the rotating application roller, the application control switches between the "contact height" at the point of contact with the object to be applied and the "separation height" at the point of separation from the object to be applied.

[0039] The pre-cut double-sided tape with a release liner of the present invention is already cut into small pieces. Therefore, by maintaining the height of the rotating body at the "abutment height" and applying the pre-cut double-sided tape with a release liner to the application area via the rotating application roller, when the pre-cut double-sided tape application device itself is pulled upwards, the pre-cut double-sided tape with a release liner can be pulled off while keeping the applied double-sided tape on the application area. That is, the application process can be completed without using a cutter or the like.

[0040] Here, in the attachment control performed by the height control mechanism, the change from "contact height" to "separation height" may take different forms.

[0041] One is a vertical upward movement. The simplest action is to pull the half-cut double-sided tape applicator upward directly from the application area.

[0042] Furthermore, the partially cut double-sided tape, after application, moves diagonally upwards and forwards. For example, it's a forward pulling motion. Since the partially cut double-sided tape with the release liner is already cut into individual pieces, it's pulled diagonally upwards and forwards while maintaining a portion of the applied piece of partially cut double-sided tape with the release liner remaining at the application site. The end of the partially cut double-sided tape with the release liner at the boundary of the application site follows diagonally upwards and forwards, but with minimal friction against the release paper, it peels off and remains at the application site.

[0043] Furthermore, the partially cut double-sided tape, after application, moves diagonally upwards and backwards. For example, a reverse pulling motion. Since the partially cut double-sided tape with the release liner is already cut into individual pieces, it is pulled diagonally upwards and backwards in a reversible manner while maintaining a portion of the applied piece of partially cut double-sided tape with the release liner remaining at the application site. The end of the partially cut double-sided tape with the release liner at the boundary of the application site follows diagonally upwards and backwards, but with minimal friction against the release paper, it peels off the release paper and remains at the application site.

[0044] Furthermore, the linkage between the pull-out action of the half-cut double-sided adhesive tape with the peeling substrate attached to the roller mounting part and the attachment action of the rotating attachment roller part can also be controlled here.

[0045] First, the roller mounting section is designed with an automatic rotation control mechanism to control the rotation of the semi-cut double-sided tape with a release liner attached. While some roller mounting sections rotate in response to the removal of the semi-cut double-sided tape with a release liner attached, this design incorporates a motor or similar drive device and actively controls its own rotation, thereby controlling the removal of the semi-cut double-sided tape with a release liner attached.

[0046] Furthermore, for each application stroke of the semi-cut double-sided tape with a release substrate, the control roller mounting part pulls out the semi-cut double-sided tape with a release substrate and the application action of the rotating application roller is linked.

[0047] For example, at the beginning of the application stroke, the rotation is initiated under the rotation control of the roller mounting section, and the rotation of the rotating body in the application control of the height control mechanism of the rotary application roller is linked to the movement from the "separation height" to the "contact height". Furthermore, at the end of the application stroke, the rotation is stopped under the rotation control of the roller mounting section, and the movement from the "contact height" to the "separation height" is linked to the movement of the rotating body under the application control of the height control mechanism of the rotary application roller.

[0048] By actively controlling the rotation of the roller mounting section in this way, at the end of the application stroke, the partially cut double-sided tape with the peel-off substrate is not excessively pulled out under the torque of the roller mounting section, preventing slack and deflection, thus maintaining a good extraction state. Furthermore, the height control linkage of the rotating body via the height control mechanism of the rotating application roller prevents slack and deflection of the partially cut double-sided tape with the peel-off substrate caused by changes in the height of the rotating body, thus maintaining a good extraction state.

[0049] As mentioned above, in addition to the active switching control between the "contact height" and "separation height" caused by the height control mechanism of the rotating attachment roller, there is also a follower control based on the concavity and convexity of the attached object under the "contact height". That is, it is a "suspension motion mechanism" that can follow the concavity and convexity of the attached object. Because the height control mechanism in the support mechanism of the rotating attachment roller has a "suspension motion mechanism", it is not limited to the attached object always being a plane, and it is also possible to attach three-dimensional objects.

[0050] It should be noted that, as a suspension motion mechanism, the elasticity of a rotating body can also be used (for example, the rotating body is made of rubber, silicone, or sponge with high elasticity).

[0051] Alternatively, the suspension mechanism can also be a swing mechanism that swings up and down, which is part of the support mechanism (such as a suspension mechanism for the tires of a vehicle).

[0052] Furthermore, it can also have a "steering motion mechanism" that can change the angle of the rotating body in the horizontal plane.

[0053] As a "steering motion mechanism," there exists a steering motion mechanism in which a rotation mechanism capable of changing the angle of the rotating body in the horizontal plane is assembled in the support mechanism of the rotating application rolling section. Alternatively, there exists a steering motion mechanism in which a rotation mechanism capable of changing the angle in the horizontal plane is assembled in a robotic arm that supports the entire half-cut double-sided tape application device, thereby changing the angle of the entire half-cut double-sided tape application device in the horizontal plane.

[0054] Here, the rotating body used as the rotating attachment rolling part can be a single rotating body or two rotating bodies in a pair, left and right.

[0055] Based on the above structure, in conventional technology, although the rotating attachment roller is a fixed roller capable of rotation, the present invention includes a steering mechanism that changes angle in the horizontal plane and a suspension mechanism that swings up and down. The trajectory drawn by the rotating attachment roller can draw curves in the horizontal plane and curves up and down, thus forming a so-called three-dimensional trajectory. If it is a pair of rotating bodies moving left and right, a trajectory can be drawn like that of a vehicle. In the three-dimensional trajectory of this rotating attachment roller, small pieces of double-sided tape that have been partially cut can be transferred and attached to the object being attached on the three-dimensional trajectory.

[0056] As a further design step, the rotary application rolling section employs a structure where, in addition to a rotating body, a non-rotating rolling body is also included in the rolling area where the semi-cut double-sided tape is rolled onto the object to be applied. The structure is as follows: the width of the rotating body is smaller than the width of the semi-cut double-sided tape, and the non-rotating rolling body applies rolling pressure to a portion of the semi-cut double-sided tape that is not in contact with the rotating body. Preferably, the heights of the rotating body and the non-rotating rolling body, i.e., the heights of the contact surfaces that contact the release substrate of the semi-cut double-sided tape, are approximately the same.

[0057] According to the above structure, the rotating body rotates as a roller while being pressed, while the non-rotating rolling body works like the edge of a scraper or rubber roller to rub the attachment surface of the double-sided tape piece cut in half from above the peeling paper tape, thus supporting the attachment to the object being attached.

[0058] As described above, the rotating body can be positioned near the center of the half-cut double-sided tape in the width direction, while the non-rotating rolling bodies can be positioned at both ends of the half-cut double-sided tape in the width direction. Generally, when small pieces of half-cut double-sided tape are attached, a portion of their ends may sometimes curl up or float up. However, by pre-positioning non-rotating rolling bodies at such ends, the attachment state of the half-cut double-sided tape can be well-maintained.

[0059] As a further design option, a structure with a "flattening roller" can be adopted. This "flattening roller" rolls and moves over the partially cut double-sided tape after it has been applied, thus smoothing out its application. By placing the flattening roller behind the rotating application roller, the application of the partially cut double-sided tape pieces can be made flat, resulting in a well-organized application.

[0060] Invention Effects

[0061] By using the manufacturing method of the semi-cut double-sided tape of the present invention, according to the above structure, after the "processing protective layer formation process", when performing semi-cutting processing using "double-sided tape with release substrate" which is generally available in the market, the cutting edge of the die cutting roller can be processed without direct contact with the adhesive, and the cutting edge of the semi-cutting is not easily affected by the adhesive layer.

[0062] In addition, it is possible to form a double-sided tape sheet that has undergone a semi-cutting process on the original release substrate without having to move the double-sided tape sheet by transferring it.

[0063] The processing release paper tape is wider than the double-sided tape with a release substrate, thus ensuring that no area (uncut area in the width direction) remains after the ends are partially cut. The processing release paper tape can be easily peeled off by starting from the uncut area in the width direction.

[0064] The manufacturing method of the semi-cut double-sided tape of the present invention can obtain high-quality semi-cut double-sided tape through a simple process without the use of special materials or processing machinery.

[0065] According to the present invention, the trajectory drawn by the rotating application roller can draw curves in the horizontal plane and vertical curves, forming a so-called three-dimensional trajectory. Within this three-dimensional trajectory of the rotating application roller, small pieces of the semi-cut double-sided tape can be transferred and applied relative to the object being applied.

[0066] By pre-configuring a non-rotating roller and a flat roller, the adhesion state of the semi-cut double-sided tape can be well arranged. Attached Figure Description

[0067] Figure 1 This diagram illustrates the steps in the manufacturing method 100 for semi-cut double-sided tape of the present invention, from the "processing protective layer formation step" to the "semi-cut double-sided tape winding step".

[0068] Figure 2 It is a diagram that illustrates, in an easy-to-understand way, the objects that have been cut through the half-cutting process and the objects that remain uncut.

[0069] Figure 3 This is a diagram showing examples of cutting marks from several semi-cut processes.

[0070] Figure 4 This is a simple diagram illustrating the peeling of the processing release paper tape 130 during the winding process of the double-sided tape after half-cutting.

[0071] Figure 5This diagram simply illustrates the situation where a partially cut double-sided tape 100A is applied to the object being applied using the application tool 300, and the situation where the partially cut double-sided tape 100A is separated.

[0072] Figure 6 This diagram simply illustrates the situation where the double-sided tape 100A is partially cut and separated from the object to be adhered to using the application tool 300 in a forward-sloping or backward-sloping manner.

[0073] Figure 7 This is a simple diagram showing the application mark of a half-cut double-sided tape 100A applied to the object being applied.

[0074] Figure 8 This is a very simple diagram showing the steering and suspension mechanisms of an improved attaching device 400 with a semi-cut double-sided tape 100A attached to a peeling substrate.

[0075] Figure 9 This is a very simple diagram showing the overall steering mechanism of the robotic arm 440 of the improved attaching device 400 with a half-cut double-sided tape 100A attached to the peeling substrate.

[0076] Figure 10 This diagram shows the situation where a curve can be drawn and the tape moves up and down in the application marks of the double-sided tape A after it has been partially cut.

[0077] Figure 11 This is a diagram showing an example of the arrangement of the rotating body 521 and the non-rotating rolling body 523 in the rotating attachment rolling section 520.

[0078] Figure 12 This is a diagram illustrating a structural example in which a rotating body 521 moves ahead of a non-rotating rolling body 523.

[0079] Figure 13 This is a simple diagram illustrating a structural example with a flattening roller 524.

[0080] Figure 14 This is a diagram illustrating the steps of a manufacturing method for semi-cut double-sided tape disclosed in Japanese Patent Application Publication No. 2016-008262, which is a prior art technique. Detailed Implementation

[0081] The method for manufacturing the semi-cut double-sided adhesive tape of the present invention will now be described with reference to the accompanying drawings. However, it is understood that the scope of the present invention is not limited to the embodiments shown below.

[0082] As Example 1, a method for manufacturing a semi-cut double-sided tape comprising three steps: "processing protective layer formation step", "semi-cutting step", and "semi-cut double-sided tape winding step".

[0083] Example 1

[0084] This invention describes a method for manufacturing a semi-cut double-sided adhesive tape according to Embodiment 1 of the present invention.

[0085] It should be noted that in the following description, the pull-out direction and winding direction of the double-sided adhesive tape with the attached release substrate and the release tape for processing are referred to as the "length direction," and the direction orthogonal to the length direction is referred to as the "width direction." In the short strip-shaped pieces that have been partially cut, the direction along the original length direction of the adhesive tape will also be referred to as the length direction, and the direction corresponding to the original width direction of the adhesive tape will be referred to as the width direction.

[0086] Figure 1 This is a diagram illustrating the process flow of the manufacturing method 100 for manufacturing semi-cut double-sided tape according to Example 1, from the "processing protective layer formation process" to the "semi-cutting process" and the "semi-cut double-sided tape winding process". Figure 1 (a) is a side view of the manufacturing process, simply viewed from the side. Figure 1 (b) is a top view of the manufacturing process when simply observing the flow from the top surface.

[0087] Figure 2 The diagram illustrates, in an easily understandable manner, the object cut by the half-cutting process and the object remaining after being uncut in Example 1.

[0088] First, let's explain the "processing protective layer formation process".

[0089] The double-sided adhesive tape 100 with a release liner is the primary material used in this invention. This double-sided adhesive tape 100 with a release liner may not be a special type of double-sided tape, but may be any double-sided tape available on the general market as a so-called double-sided adhesive tape material with a release liner. The double-sided adhesive tape 100 with a release liner will be described later. Figure 2 As shown, the double-sided tape 110 is overlapped with the release substrate 120 to form a tape shape. The double-sided tape 110 includes a substrate layer 111 and adhesive layers 112 and 113 disposed on both sides of the substrate layer 111. This double-sided tape 100 with a release substrate is a general double-sided tape and is available on the market. In addition, depending on the selection of the substrate layer 111, adhesive layers 112 and 113, it may sometimes become a special double-sided tape, but the structure is that of a general double-sided tape. In this example, the double-sided tape 100 with a release substrate, which is in roll form, is mounted on the transport reel 210 and pulled from the transport reel 210 to the take-up reel 220.

[0090] In the "processing protective layer formation process", the double-sided adhesive tape 100 with attached release substrate is covered by a processing release paper tape 130 with at least the contact surface being the release surface.

[0091] The release paper tape 130 for processing does not have an adhesive layer, etc., and covers the side of the double-sided tape 100 without the release substrate 120 (on the side with the release substrate attached). Figure 2 The adhesive layer 112 is located on the upper side. A processing release paper tape 130 temporarily covers the adhesive layer 112, and it is peeled off again during the "half-cut double-sided tape winding process" for recycling. Therefore, for easy peeling, it is preferable that at least the covered surface is coated with a release agent. In this example, the processing release paper tape 130, now in a roll, is mounted on a conveyor reel 230 and pulled from the conveyor reel 230 to the winding reel 240.

[0092] Here, the relationship (processing conditions) between the width of the double-sided adhesive tape 100 with attached release substrate, the width of the processing release paper tape 130, and the width of the half-cut performed by the half-cutting processing machine 250 is explained.

[0093] In this example, such as Figure 1 As shown in (b), the width of the processing release paper tape 130 is greater than the width of the double-sided adhesive tape 100 with the release substrate attached. That is, when the processing release paper tape 130 covers the double-sided adhesive tape 100 with the release substrate attached, the processing release paper tape 130 covering the upper surface is wider, and the two ends of the processing release paper tape 130 extend outward in the width direction than the two ends of the double-sided adhesive tape 100 with the release substrate attached.

[0094] Furthermore, if the width of the half-cut performed by the half-cutting processing machine 250 in the half-cutting process is greater than or equal to the width of the double-sided adhesive tape 100 with the attached release substrate, but smaller than the width of the processing release paper tape 130, then as Figure 1 As shown in (b), after the semi-cutting process performed by the semi-cutting processing machine 250, uncut areas remain at both ends of the width direction on the upper processing release paper tape 130. On the other hand, the double-sided adhesive tape 100 with a release substrate attached, which is covered below, is cut in its entirety in the width direction, and there are no uncut areas. That is, the double-sided adhesive tape 100 with a release substrate is completely semi-cut into small pieces in a short strip shape.

[0095] Under the above conditions, the process of "forming a protective layer" will be briefly explained.

[0096] First, such as Figure 1As shown, in the "processing protective layer formation process", the double-sided adhesive tape 100 with attached peeling substrate and the processing peeling paper tape 120 are simultaneously drawn from the transport roll 210 and the transport roll 230, respectively.

[0097] For the extracted double-sided adhesive tape 100 with attached release substrate and the processing release paper tape 130, such as Figure 1 As shown, the peeling surface of the processing release paper tape 130 abuts against and covers the side of the double-sided tape 100 with the attached release substrate that is not provided with the release substrate 120 (in Figure 1 and Figure 2 The upper surface is in the middle, thereby forming a processing protective layer for the double-sided tape 100 with attached release substrate.

[0098] When a double-sided adhesive tape 100 with a release liner, which is generally available in the market, is directly pulled out, the adhesive layer on one side is peeled off. However, in this invention, the release paper tape 130 is stacked against the ground through the aforementioned "processing protective layer formation process," as shown in the example. Figure 2 As shown, the double-sided tape 110 is in a state where a release substrate 120 serving as a support layer is present on one side (the lower surface in this case), and a processing release paper tape 130 serving as a protective layer is covered on the other side (the upper surface in this case). In this state, it is conveyed to the "semi-cutting process".

[0099] It should be noted that in the "semi-cutting process", the surface of the adhesive layer 112 undergoing semi-cutting is covered by the processing peel paper tape 130, so the cutting edge undergoing semi-cutting is not easily affected by the adhesive layer.

[0100] "Semi-cutting process" is a process in which a double-sided adhesive tape 100 with an attached release substrate is semi-cut, and the tape is covered by a release paper tape 130 serving as a processing protective layer. For example... Figure 1 and Figure 2 As shown, the half-cutting processing machine 250 performs half-cutting processing at specified intervals.

[0101] The semi-cutting processing machine 250 can also be a non-special semi-cutting processing machine, or a semi-cutting processing machine that is available on the market. As a semi-cutting processing machine, it can also be a Thomson-type semi-cutting processing machine using a Thomson cutting edge, a die-cutting type semi-cutting processing machine using a die-cutting roller cutting edge, etc. Here, for example, a Thomson-type semi-cutting processing machine using a Thomson cutting edge is used.

[0102] Figure 2 It is a diagram that easily illustrates, in a longitudinal section, the object that has been cut through a partial cut and the object that remains uncut. For example... Figure 2As shown, the semi-cutting process here refers to cutting up to the adhesive layer 112 of the processing release paper tape 130, double-sided adhesive tape 110, substrate 111, and adhesive layer 112, leaving the release substrate 120 below uncut. The interval in the length direction of the semi-cuts is not limited and can be selected according to the application. For example, it can be 1 millimeter, several millimeters, or several centimeters.

[0103] By continuously performing this semi-cutting process, the result of the "semi-cutting process" is that, up to the point where the processing release paper tape 130, the adhesive layer 112 of the double-sided tape 110, the substrate 111, and the adhesive layer 112 above the release substrate 120 are cut into a state where multiple small pieces of double-sided tape remain in the shape of short strips of appropriate length. That is, when the component in which the "processing release paper tape 130" and the "double-sided tape 100 with release substrate" are in a layered overlapping state is passed through the semi-cutting processing machine 250, it is processed into a component in which the "semi-cut processing release paper tape 130A" and the "semi-cut processing double-sided tape 100A with release substrate" are in a layered overlapping state.

[0104] It should be noted that, here, as Figure 1 As shown in (b), the half-cut width of the half-cutting machine 250 is approximately the same as the width of the double-sided tape 100 with the attached release substrate. The double-sided tape 100 with the attached release substrate is completely cut into slices without any uncut areas remaining. However, the half-cut width of the half-cutting machine 250 is smaller than the width of the processing release paper tape 130, and "uncut areas in the width direction" are formed at both ends of the processing release paper tape 130.

[0105] Here, we will explain the cutting marks from the semi-cutting process.

[0106] Figure 3 This is a diagram showing examples of cutting marks from several semi-cut processes. Figure 3 This is a top view taken from the top surface. Therefore, only the wide processing release paper tape 130 covering the top surface is shown in solid lines, while the double-sided tape 100 with the release substrate attached below is shown in dashed lines to make the state of the double-sided tape 100 with the release substrate attached easier to understand.

[0107] like Figure 3As shown, the cutting marks themselves for the semi-cutting process may vary, but in this example, they all consist of a width-direction cut region 131 that cuts the entire width of the lower double-sided adhesive tape 100 with the attached release substrate, and a width-direction uncut region 132 remaining on a portion of the upper processing release paper tape 130 that has not been cut. The width-direction uncut region 132 of the processing release paper tape 130 remains uncut and continuous in the length direction.

[0108] Figure 3 Example (a) is an example where the half-cutting mark is a straight line perpendicular to the width direction. It becomes an example where a width-direction cut area 131 is provided on the central side to align the upper processing release paper tape 130 and the lower double-sided adhesive tape 100 with an attached release substrate, and uncut width-direction areas 132 are formed at both ends in the width direction. If this... Figure 3 The cutting marks of (a) are as described later. Figure 7 As shown in (a), the attached double-sided tape pieces are in the form of short strips.

[0109] It should be noted that, in Figure 7 In (a) to (c), to make the shape of each individual double-sided tape sheet of the semi-cut double-sided tape 100A easy to understand, a large gap is temporarily shown between the slices. However, in reality, the cutting edge of the semi-cutting machine is sharp, so the spacing between the individual short strips of double-sided tape on the peeling substrate 120 is small. Figure 7 The spacing between the short strips of double-sided tape is deliberately increased to make the shapes and markings easier to understand.

[0110] Figure 3 Example (b) is an example where the cutting mark of the width-direction cut region 131 has an angle in the width direction. Figure 3 Example (b) also includes a width-direction cut-off region 131 provided on the central side for aligning and partially cutting the upper processing release paper tape 130 and the lower double-sided adhesive tape 100 with attached release substrate, and width-direction uncut regions 132 formed at both ends of the width direction. If this... Figure 3 The cutting marks of (b) are as described later. Figure 7 As shown in (b), the attached double-sided tape pieces form a V-shape.

[0111] exist Figure 3 In example (c), the cutting imprint of the cut region 131 in the width direction becomes a curve. Figure 3Example (c) also has a width-direction cut area 131 provided on the central side to align and partially cut the upper processing release paper tape 130 and the lower double-sided adhesive tape 100 with attached release substrate, and width-direction uncut areas 132 are formed at both ends of the width direction. If this Figure 3 The cutting marks of (c) are as described later. Figure 7 As shown in (c), the attached double-sided tape pieces form a curve.

[0112] In this way, the shape of each individual double-sided tape sheet is not particularly limited.

[0113] By setting an uncut area 132 in the width direction, in the "half-cut double-sided tape winding process", if the uncut area 132 in the width direction is used as the starting point to peel the "half-cut processing release paper tape 130A" from the "half-cut double-sided tape 100A with release substrate", it is easy to peel.

[0114] Next, the process moves to the "double-sided tape winding process after semi-cutting".

[0115] The "half-cut double-sided tape winding process" is a process in which the half-cut double-sided tape 100A with a release substrate is wound up while the unwanted half-cut release paper tape 130A is peeled off.

[0116] like Figure 1 As shown, as a "semi-cut double-sided tape winding process", the semi-cut double-sided tape 100A with a release substrate is first peeled off from the semi-cut double-sided tape 100A covered by the semi-cut processing release paper tape 130A, thereby separating the semi-cut double-sided tape 100A with a release substrate and the semi-cut processing release paper tape 130A.

[0117] Figure 4 This is a simplified diagram illustrating the peeling of the release paper tape 130A used in the semi-cut double-sided tape winding process.

[0118] Figure 4 (a) shows a vertical cross-sectional view of the portion where the uncut area 132 in the width direction is provided, directly showing the cut end face of the semi-cut release paper tape 130A above, but the layers of the semi-cut double-sided tape 100A with the release substrate are not present below. Figure 4 In (a), dashed lines depict portions corresponding to the layers of the double-sided adhesive tape 100A with the attached release substrate after half-cutting, but these layers do not actually exist. Figure 4As shown in (a), the half-cut strip 130A for processing is continuous in the length direction within the uncut region 132 in the width direction. Therefore, by taking the peeling of the half-cut strip 130A in the uncut region 132 in the width direction as a starting point for progressively advancing the peeling process, the half-cut strip 130A is easily peeled progressively in the length direction when being peeled.

[0119] Figure 4 (b) shows a vertical cross-sectional view at the location where the upper processing release paper tape 130 and the lower double-sided adhesive tape 100 with a release substrate are cut together in the width direction after half-cutting. The half-cut processing release paper tape 130A is continuous in the length direction, so when the upper half-cut processing release paper tape 130A is peeled off, it is gradually peeled off in the length direction, and it is easy to separate into the half-cut processing double-sided adhesive tape 100A with a release substrate and the half-cut processing release paper tape 130A. At the bottom, the half-cut processing double-sided adhesive tape 100A with a release substrate remains on the release substrate 120.

[0120] In contrast to the conventional Japanese Patent Application Publication No. 2016-008682, the process of transferring the partially cut double-sided tape sheet to the other side is required. However, in the manufacturing method of the partially cut double-sided tape of the present invention, it is only necessary to peel off the partially cut processing release paper tape 130A that is temporarily covering the partially cut processing step, without the need for the difficult operation of transferring the partially cut double-sided tape sheet to the other side.

[0121] After the peeling of the 130A peeling paper tape used for semi-cutting is completed, as follows: Figure 1 As shown, the semi-cut double-sided adhesive tape 100A with the peeling substrate attached, in the state of semi-cutting, is wound by the winding reel 220. On the other hand, the semi-cutting processing peeling paper tape 130A is wound by the winding reel 240, but the semi-cutting processing peeling paper tape 130A is no longer needed after completing its task and can be discarded.

[0122] Next, the application of the semi-cut double-sided tape 100A with a release substrate obtained by the manufacturing method of the semi-cut double-sided tape of the present invention will be described.

[0123] Figure 5 The figure shows, from the side, an applicator 300 for attaching a roll of semi-cut double-sided tape 100A with a release liner attached.

[0124] Figure 5Figure (a) shows a case in which a semi-cut double-sided tape 100A with a release substrate, obtained by the manufacturing method of the semi-cut double-sided tape of the present invention, is applied to the attachment target area. Figure 5 (b) is a diagram showing the situation where the attachment device 300 is separated after the half-cut double-sided tape 100 is applied to the attachment object.

[0125] like Figure 5 As shown in (a), the application device 300 includes a roller mounting section 310 that supports the roll of semi-cut double-sided tape 100A with a release substrate in a rotatable manner, a rotary application roller section 320 through which the semi-cut double-sided tape 100A with a release substrate is pulled out, and a release substrate recovery section 330 for recovering the release substrate 120.

[0126] The rotary attachment rolling part 320 includes a rotating body 321 and a support mechanism 322 that supports the rotating body 321 so that it can rotate. Other device structures can also be used.

[0127] It should be noted that the support mechanism 322 is shown in a very simple manner, showing only a portion of the support mechanism 322 located near the rotating attachment rolling portion 320.

[0128] like Figure 5 As shown, the partially cut double-sided tape 100A with a release liner is in roll form and is mounted on the roller mounting part 310 of the application device 300 in a retractable manner. During application, the tape, peeled off from the adhesive layer 112, is pressed onto the application target area. While the application roller 320 rotates, the release liner 120 is rolled downwards to adhere the partially cut double-sided tape 100A to the application target area. If the surface of the application target area has properties that strongly adhere to the adhesive layer 112, the partially cut double-sided tape 100A is simultaneously peeled off from the release liner 120 during application. The release liner 120 is then recycled to the release liner recycling part 320, etc.

[0129] Here, the support mechanism 322 is designed with a height control mechanism (not shown) that controls the height of the support rotating body 321.

[0130] The height control mechanism controls the height of the rotating body 321. It is a mechanism for switching between a "contact height" and a "separation height" in the rotary attachment roller section 320. The "contact height" is the height at which the partially cut double-sided tape with the peeling substrate contacts the object to be attached, and the "separation height" is the height at which the partially cut double-sided tape with the peeling substrate separates from the object to be attached.

[0131] The attaching device 300 repeatedly performs the following process using a partially cut double-sided adhesive tape with an attached release liner: the partially cut double-sided adhesive tape is applied as the relatively gradually shifted attaching object comes directly below it. For example, the process of "attachment start" - "attachment period" - "attachment end" - "attachment preparation" is repeated as one attachment process. Here, "attachment start" means that when the shifted attaching object comes directly below, the height of the rotating body 321 is set to the "abutment height" and the partially cut double-sided adhesive tape is applied. "Attachment period" means that the attaching object is moved relatively within a specified length range and the partially cut double-sided adhesive tape 100 is applied. "Attachment end" means that when the specified length of attachment is completed, the rotating body 321 is pulled upwards to separate it so that the height is set to the "separation height". "Attachment preparation" means waiting for the next attaching object to be moved.

[0132] Many designs can be applied during this attachment process.

[0133] First, there is a control design that links the pulling action of the half-cut double-sided tape with the peeling substrate attached to the roller mounting part with the application action of the rotating application roller.

[0134] If the roller mounting section 310 and the substrate removal and recovery section 320 are equipped with an automatic rotation control mechanism, the extraction control of the semi-cut double-sided tape with the substrate attached can be performed. Alternatively, the roller mounting section may rotate in response to the extraction of the semi-cut double-sided tape with the substrate attached, but here, by providing a drive device such as a motor, it actively controls its own rotation to control the extraction of the semi-cut double-sided tape with the substrate attached.

[0135] like Figure 5 As shown in (a), for each application stroke of the half-cut double-sided tape with a release liner attached, the rotation of the roller mounting section 310 and the release liner recovery section 320 is synchronized at the beginning of the application stroke (application start). If the transfer action from "separation height" to "contact height" under the application control of the height control mechanism is linked, the half-cut double-sided tape with a release liner attached will not be excessively pulled out during the application stroke, resulting in slack or flexing, and a good extraction state can be maintained. A good extraction state can be maintained without slack or flexing of the half-cut double-sided tape with a release liner attached.

[0136] like Figure 5As shown in (b), the rotation of the roller mounting section 310 and the substrate removal and recovery section 320 stops synchronously at the end of the application stroke (application end). If the rotation of the rotating body 321 under the application control of the height control mechanism is linked to the movement from the "contact height" to the "separation height", the half-cut double-sided tape with the substrate attached will not be excessively pulled out under the torque of the roller mounting section at the end of the application stroke, resulting in slack or deflection, and a good extraction state can be maintained. In addition, the height control of the rotating body is linked to the height control mechanism of the rotating application roller section, so the half-cut double-sided tape with the substrate attached will not slack or deflect due to changes in the height of the rotating body, and a good extraction state can be maintained.

[0137] Next, for example, is the design of height control for the rotating body 321 by a height control mechanism.

[0138] Figure 5 (b) shows the situation where the height of the rotating body 321 is pulled up to the "separation height" by the height control mechanism at the "end of attachment".

[0139] During the attachment stroke, from "attachment start" to "attachment period," the height control mechanism maintains the height of the rotating body 321 at the "abutment height." However, at the end of the "attachment period," i.e., the "attachment end" process, the height control mechanism pulls the height of the rotating body 321 up to the "separation height." For example... Figure 5 As shown in (b), when the height of the rotating body 321 is pulled up to the "separation height" by the height control mechanism, the half-cut double-sided tape 100A with the release substrate, which is still placed on the release paper 120, remains as is, but the half-cut double-sided tape 100 that has been applied to the application area remains attached to the application area and is left behind, and the two are separated.

[0140] In this way, the half-cut double-sided tape 100A becomes an independent half-cut double-sided tape sheet, which remains independent on the surface of the area to be adhered to after application. If the desired length of the half-cut double-sided tape 100A is applied to the area to be adhered to, and the application tool 300 is simply pulled upwards, each half-cut double-sided tape sheet remains independently on the surface of the area to be adhered to.

[0141] As described above, the height control mechanism performs attachment control by switching the height of the rotating body 321 to a "contact height" that abuts against the object to be attached and a "separation height" that separates it from the object to be attached. Here, during the switching between the "contact height" and the "separation height", the height control mechanism pulls the rotating body 321 upward, but there can be several modes of pulling up.

[0142] Figure 5 (b) shows the first mode of attachment control performed by the height control mechanism, where the change from "contact height" to "separation height" is a vertical upward mode. This has already been described above.

[0143] then, Figure 6 (a) shows the second mode of attachment control performed by the height control mechanism. The change from "contact height" to "separation height" is in the upward-sloping direction in front of the half-cut double-sided tape after attachment. For example, a forward pulling action.

[0144] The semi-cut double-sided tape with release liner is already cut into small pieces. Therefore, when pulling it diagonally upwards while still having some of the applied small pieces of the semi-cut double-sided tape with release liner remaining at the attachment point, it is assumed that the end of the semi-cut double-sided tape with release liner at the attachment point will follow diagonally upwards. However, in reality, the friction between the semi-cut double-sided tape with release liner and the release paper is minimal. Figure 6 As shown in (a), it peels off from the release paper and remains on the adhesive site.

[0145] then, Figure 6 (b) shows the third mode of attachment control performed by the height control mechanism. The change from "contact height" to "separation height" is in the upward-sloping direction behind the half-cut double-sided tape after attachment. For example, a reverse pulling action.

[0146] As described above, the semi-cut double-sided tape with the release liner is already cut into individual pieces. Therefore, while retaining some of the applied pieces of the semi-cut double-sided tape with the release liner at the attachment site, it is pulled back diagonally upwards in a reversible manner. It is assumed that the end of the semi-cut double-sided tape with the release liner at the attachment site will follow diagonally upwards and backwards; however, the friction between the semi-cut double-sided tape with the release liner and the release paper is minimal. Figure 6 As shown in (b), it peels off from the release paper and remains on the adhesive site.

[0147] Next, the double-sided tape 100 after being applied and partially cut will be described.

[0148] Figure 7 This diagram shows a partially cut double-sided tape 100 attached to the object being adhered to.

[0149] Figure 7 (a) shows the presentation Figure 3The short strips of double-sided tape 100A are in a semi-cut state after being applied. Each strip of double-sided tape is short and independent. It should be noted that the cutting edge of the semi-cutting machine is actually sharp, so the spacing between the short strips of double-sided tape on the release substrate 120 is small. However, the spacing is deliberately enlarged for simplicity in order to easily understand the shape and application marks of each strip of double-sided tape.

[0150] Figure 7 (b) shows that the implementation was carried out Figure 3 (b) The half-cut double-sided tape 100A is attached. Each double-sided tape sheet has an angle and is independent.

[0151] Figure 7 (c) shows the implementation Figure 3 (c) The half-cut double-sided tape 100A is attached after the half-cut is completed. Each double-sided tape sheet is curved and independent.

[0152] Next, the improved application apparatus 400 for the semi-cut double-sided adhesive tape 100A of the present invention will be described. The improved application apparatus 400 of the present invention has the same roller mounting part 410, rotary application rolling part 420 and peeling substrate recovery part 430 as the application apparatus 300 described above, but there are structural improvements in the rotary application rolling part 420.

[0153] Figure 8 This is a simplified diagram showing a portion of the modified adhesive tape 100A, which is half-cut and has a release liner attached, in both longitudinal and cross-sectional sections. Other components are omitted from the diagram; only the parts necessary for illustration are shown.

[0154] Figure 8 In the example shown in (a), the improved application apparatus 400 includes a roller mounting section 410 that supports the roll of semi-cut double-sided tape 100A with a release substrate for rotation, a rotary application roller section 420 through which the pulled-out semi-cut double-sided tape 100A with a release substrate passes, and a release substrate recovery section 430 for recovering the release substrate 120. Other apparatus structures may also be used.

[0155] Here, as Figure 8 As shown, the rotary attachment rolling part 420 has a rotating body 421 and a support mechanism 422 that supports the rotation axis of the rotating body 421, which is similar to... Figure 5 Similarly, it also includes a suspension mechanism that allows the rotating body 421 to move up and down relative to the object being attached, and a steering mechanism that allows the rotating body 421 to change its angle in the horizontal plane.

[0156] It should be noted that the "suspension motion mechanism" of the rotating body 421 mentioned here is not the height control mechanism of the support mechanism described above that causes the rotating body to change to the "abutment height" and "separation height". Rather, it is a suspension in which the height control mechanism maintains the rotating body at the "abutment height" during the "attachment start" to "attachment period" of the attachment stroke, and passively follows the concavity and convexity of the attached body.

[0157] Various suspension motion mechanisms exist that enable the rotating body 421 to move up and down relative to the attached object. For example, there are mechanisms where the rotating body 421 is entirely composed of elastomers such as rubber, silicone, or sponge, and which mimics a suspension motion mechanism by utilizing its elasticity; and suspension motion mechanisms where the rotating body 421 has a multi-layered structure, with at least the surface layer composed of elastomers such as rubber, silicone, or sponge (illustration omitted). Alternatively, it could be as follows... Figure 8 As shown in (c), the support mechanism 422 that supports the rotating body 421 may have a structure that assembles an elastic body such as a spring that causes the rotation axis to swing in the up and down direction, or a structure that assembles an air spring, etc.

[0158] Next, the steering mechanism will be described.

[0159] The “steering motion mechanism” is a steering motion mechanism that changes the angle of a rotating body in the horizontal plane. However, the “steering motion mechanism” can also be a steering motion mechanism assembled in the support mechanism 422, or a steering motion mechanism assembled in the robotic arm that supports the entire half-cut double-sided tape attaching device 400 and changes the angle of the entire half-cut double-sided tape attaching device 400 in the horizontal plane.

[0160] Figure 8 (b) shows the situation where the support mechanism 422, which supports the rotating shaft, can change its angle in the horizontal plane. Figure 8 As shown in (b), it can be a mechanism that actively changes the angle through external support, or it can be a mechanism that follows the angle change according to the direction of travel of the modified attachment 400.

[0161] Figure 9 The diagram shows a "steering motion mechanism" assembled within a robotic arm that supports the entire half-cut double-sided tape applicator 400 and changes the angle of the entire half-cut double-sided tape applicator 400 in the horizontal plane. Figure 9 In the example, the structure is as follows: the modified attachment device 400 is located at the head 440 of the robotic arm. The head 440 as a whole can rotate in the horizontal plane through the steering mechanism 450, and can actively make the attachment direction a curved direction.

[0162] The rotating body 421 of the rotating attachment rolling part 420 can be a single rotating body or a pair of rotating bodies on the left and right.

[0163] Thus, if the rotating attachment roller 420 becomes equipped with Figure 8 of (b) Figure 9 The "turning motion" shown is a change of angle within the horizontal plane. Figure 8 The so-called "suspension motion" structure that swings up and down as shown in (c) allows for so-called curved, up-and-down movement between the rotating attachment rolling part 420 and the surface of the attachment part. It can draw curves in the attachment imprint of the half-cut double-sided tape A, just like the tire tracks of a vehicle, or even follow in three dimensions if the attachment part has a curved surface with unevenness.

[0164] Next, an example is shown in which a three-dimensional track is drawn in the attachment imprint of a semi-cut double-sided tape A manufactured by the manufacturing method of the present invention, and the tape is then attached.

[0165] Each half-cut double-sided tape sheet with a release substrate manufactured by the manufacturing method of the present invention can be attached to the attachment target area in an independent state, so that it can be peeled and attached in a way that draws a curve as a whole when peeling from the release substrate 120.

[0166] Figure 10 This diagram illustrates the curves and up-and-down movement that can be drawn in the adhesion imprint of the semi-cut double-sided tape A. It should be noted that, in reality, the cutting edge of the semi-cutting machine is sharp, so the spacing between the various short strips of double-sided tape on the release substrate 120 is small. However, the spacing is deliberately increased here for ease of understanding of the shape and adhesion imprint of each short strip of double-sided tape.

[0167] Figure 10 (a) is a simplified illustration of a half-cut double-sided tape A being applied along an arc-shaped curve to the surface of a planar object to be applied. Figure 10 (b) is a simplified diagram illustrating the case where a half-cut double-sided tape A is applied along the curved surface of the object to be adhered to. Thus, according to... Figure 8 The improved applicator 400 of the present invention can draw an applicator mark along curves and surfaces on the double-sided tape, thus enabling the application of a partially cut double-sided tape A on the surface of a variety of objects to be applicated, thereby expanding the uses of the double-sided tape.

[0168] Next, a further improved application apparatus 500 for the semi-cut double-sided adhesive tape 100A of the present invention will be described. This improved application apparatus 500 of the present invention, like the application apparatus 300 described above, includes a roller mounting portion 510, a rotary application rolling portion 520, and a substrate peeling and recovery portion 530, but further has additional structural improvements.

[0169] Its structure is as follows: In the rotary application rolling part 520, in addition to the rotating body 521, the rolling part where the double-sided tape is rolled onto the object after being half-cut also has a non-rotating rolling body 523 that cannot rotate.

[0170] In this example, the following configuration is used: the width of the rotating body 521 is smaller than the width of the half-cut double-sided tape 100A, and the non-rotating rolling body 523 is configured to apply rolling to at least a portion of the half-cut double-sided tape 100A that is not in contact with the rotating body 521.

[0171] Figure 11 This diagram shows an example of the arrangement of the rotating body 521 and the non-rotating rolling body 523 in the rotary attachment rolling section 520. Figure 11 (a) shows a front view (viewed from the direction of travel) and a side view. In the view to the left of the front view, the partially cut double-sided tape 100A and the recovered peel-off substrate 120 are not shown for ease of understanding. The view to the right of the front view is shown so that the partially cut double-sided tape 100A can be seen. The partially cut double-sided tape 100A and the recovered peel-off substrate 120 are simply shown in the side view.

[0172] The front end shape of the non-rotating roller 523 can be the same as that of the object to be attached. In this example, the front end of the non-rotating roller 523 is made to have the same shape as the rotating body 521 in order to smoothly rub over the surface of the peeling substrate 120, but it is different from the rotating body 521 and cannot rotate.

[0173] In this example, such as Figure 11 As shown in (a), the structure is as follows: the rotating body 521 is disposed near the center in the width direction of the half-cut double-sided tape 100A, and the non-rotating rolling body 523 is disposed at both ends in the width direction of the half-cut double-sided tape 100A.

[0174] It should be noted that the height of the non-rotating rolling body 523 is configured such that the heights of the contact surfaces of the rotating body 521 and the non-rotating rolling body 523 in contact with the release substrate 120 of the half-cut double-sided adhesive tape 100A are approximately the same.

[0175] When Figure 11As shown in (b), when the rotating attachment roller 520 of the improved attachment device 500 of the present invention moves on the surface of the object to be attached, the rotating body 521 smoothly presses the peeling substrate 120 while rotating, and the non-rotating roller 523 presses by wiping over the peeling substrate 120 without rotating, and the double-sided tape 100A is transferred to the surface of the object to be attached after half-cutting.

[0176] Here, the rotating body 521 and the non-rotating roller 523 are pulled out while they are in contact with the back side (the side of the peeling tape 120) of the half-cut double-sided tape 100A. The rotating body 521 is positioned near the center in the width direction of the half-cut double-sided tape 100A, so it can obtain sufficient driving force to pull out the half-cut double-sided tape 100A. On the other hand, the non-rotating roller 521 is positioned at both ends in the width direction of the half-cut double-sided tape 100A, so it presses the two ends of the half-cut double-sided tape 100A, which is a short strip of tape to be attached, in a firm rubbing manner, so that the end parts do not curl up or float up, and the attachment state of the half-cut double-sided tape 100A can be well arranged.

[0177] The following structure can be adopted as a design: the position of the rotating body 521 in the direction of travel is different from the position of the non-rotating rolling body 523, and the rotating body 521 travels ahead of the non-rotating rolling body 523.

[0178] Figure 12 This is a diagram illustrating a structural example where the rotating body 521 advances before the non-rotating rolling body 523. Figure 12 (a) shows a front view (viewed from the direction of travel) and a side view. In the view to the left of the front view, the partially cut double-sided tape 100A and the recovered peel-off substrate 120 are not shown for ease of understanding. The view to the right of the front view shows the partially cut double-sided tape 100A so that it can be seen. The partially cut double-sided tape 100A and the recovered peel-off substrate 120 are simply shown in the side view.

[0179] exist Figure 12 In the side view of (a), the direction of travel is to the right, and the rotating body 521 is positioned forward of the non-rotating rolling body 523. It should be noted that although the positions differ in front and back, they are related to... Figure 11 Similarly, the structure employs a rotating body 523 positioned at the center of the width direction of the half-cut double-sided tape 100A, and a non-rotating rolling body 523 positioned at both ends of the width direction of the half-cut double-sided tape 100A.

[0180] like Figure 12As shown in (b), when the rotating attachment roller 520 of the improved attachment device 500 of the present invention moves on the surface of the object to be attached, the rotating body 521 smoothly presses the peeling substrate 120 while rotating, and the non-rotating roller 523 presses by wiping the peeling substrate 120 without rotating, and the double-sided tape 100A is transferred to the surface of the object to be attached after half-cutting.

[0181] exist Figure 12 In the same structure, the rotating body 521 and the non-rotating rolling body 523 are pulled out while they are in contact with the back side (the side of the peeling tape 120) of the half-cut double-sided tape 100A. The rotating body 521 is positioned near the center in the width direction of the half-cut double-sided tape 100A, thus ensuring sufficient driving force for pulling out the half-cut double-sided tape 100A. Figure 12 As shown in (b), the two ends of the rotating body 521 are not pressed from above, so the two ends of the half-cut double-sided tape 100A are only lightly adhered to the surface of the object to be attached. However, the non-rotating roller body 521 is arranged at both ends in the width direction of the half-cut double-sided tape 100A, so the two ends of the half-cut double-sided tape 100A are pressed firmly after being attached, so that no part of the end side curls up or floats up, and the attachment state of the half-cut double-sided tape 100A can be well arranged.

[0182] As a further design, a structure with a flat roller 524 can be adopted, which rolls and moves on the applied, semi-cut double-sided tape to tidy up the application state.

[0183] Figure 13 This diagram simply illustrates a structure with a flattening roller 524. Figure 13 (a) shows a front view (viewed from the direction of travel) and a side view. In the view on the left side of the front view, the partially cut double-sided tape 100A and the recovered peeling substrate 120 are not shown for ease of understanding. The view on the right side of the front view shows the partially cut double-sided tape 100A so that it can be seen. In the above figures, the leveling roller 524 is hidden behind and is roller-shaped. The partially cut double-sided tape 100A and the recovered peeling substrate 120 are simply shown in the side view. The leveling roller 524 is simply shown as a roller, omitting the illustration of components such as those supporting the rotation axis.

[0184] In this example, such as Figure 13As shown in (a), the structure employs a rotating body 521 disposed near the center of the half-cut double-sided tape 100A in the width direction, and a non-rotating rolling body 523 disposed at both ends of the half-cut double-sided tape 100A in the width direction, and a flat roller 524 is also provided behind it.

[0185] The flat roller 524 is a rotatable structure, supported by a support body (not shown), and capable of applying pressure from above to below. It is designed to roll and press onto the half-cut double-sided tape 100A immediately after application.

[0186] By positioning the flattening roller 524 behind the rotary applicator roller 522, the applied state of the semi-cut double-sided tape pieces can be made flat, resulting in a well-organized application. In this example, as... Figure 13 As shown, a flat roller 524 is provided as a rotating body that can rotate as part of or separate from the rotating attachment rolling part 520.

[0187] like Figure 13 As shown in (b), the flattening roller 524 moves over the half-cut double-sided tape that has been applied by the rotating application roller 520 of the modified application device 500 over the surface of the object to be applied, and smooths out the application state.

[0188] Here, the flattening roller 524 moves while pressing against the short strip of half-cut double-sided tape 100A that has just been applied. Therefore, the surface of the flattening roller 524, like the release substrate, is preferably treated with a release agent based on silicone resin. In addition, in order to prevent loss of adhesion of the half-cut double-sided tape 100A after application, it is preferable to perform a surface treatment that prevents the release agent from moving.

[0189] The above illustrations depict preferred embodiments of the structural examples of the method for manufacturing a semi-cut double-sided tape according to the present invention, but it should be understood that various modifications can be made without departing from the technical scope of the present invention.

[0190] Industrial availability

[0191] The method for manufacturing semi-cut double-sided tape of the present invention does not limit the type of adhesive layer, the width of the tape, the diameter of the roller, etc., and can be widely used as a method for manufacturing semi-cut double-sided tape.

[0192] Explanation of reference numerals in the attached figures

[0193] 100 Double-sided adhesive tape with substrate release assemblies

[0194] 100A comes with double-sided tape for semi-cutting after substrate removal.

[0195] 100B Roller Body

[0196] 131 Width direction cut-off area

[0197] 132 Uncut area in the width direction

[0198] 110 Double-sided tape

[0199] 111 Substrate layer

[0200] 112 Adhesive layer

[0201] 113 Adhesive layer

[0202] 120 Substrate Peeling

[0203] 130 Processing release paper tape

[0204] 210 Conveyor Reel

[0205] 220 winding reels

[0206] 230 Conveyor Reel

[0207] 240 winding reels

[0208] 300 Attachment Devices

[0209] 310 Roller mounting section

[0210] 320 Rotary Applying Roller Section

[0211] 321 Right rotation of the front end

[0212] 322 Left-hand rotation of the front end

[0213] 330 Substrate Recycling Section

[0214] 400 Improved Adhesion Applicator

[0215] 410 Roller mounting section

[0216] 420 Rotary Applying Roller Section

[0217] 421 Rotational body

[0218] 422 Support mechanism

[0219] 430 Substrate Recycling Section

[0220] 500 Improved Adhesion Applicator

[0221] 510 Roller mounting section

[0222] 520 Rotary Adhesive Roller Section

[0223] 521 Rotational Body

[0224] 522 Support Mechanism

[0225] 523 Non-rotating rolling body

[0226] 530 Substrate stripping and recycling section.

Claims

1. A method for manufacturing a partially cut double-sided adhesive tape, characterized in that, The manufacturing method of the semi-cut double-sided tape includes the following steps: As a first step, a processing protective layer forming step is performed by pulling out a double-sided adhesive tape with a release substrate and a processing release paper tape having a release surface, and bringing the processing release paper tape into contact with the double-sided adhesive tape with a release substrate to form a processing protective layer on the double-sided adhesive tape with a release substrate. The double-sided adhesive tape with a release substrate includes: a double-sided adhesive tape having a substrate layer and adhesive layers on both sides of the substrate layer; and a release substrate covering the adhesive layer on one side of the double-sided adhesive tape. As a second step, the double-sided adhesive tape with the attached release substrate and the processing release paper tape, which serves as the processing protective layer, are continuously half-cut, leaving only the release substrate remaining, resulting in a half-cutting process where multiple double-sided adhesive tape pieces of appropriate length remain on the release substrate; and As a third step, the process of winding up the partially cut double-sided adhesive tape with the release substrate while simultaneously peeling the processing release paper tape from the double-sided adhesive tape with the release substrate attached, after the partial cutting treatment has been performed. The width of the release paper tape used in the first step is greater than the width of the double-sided adhesive tape with the attached release substrate, and also greater than the width of the half-cut in the half-cutting step of the second step. In the second process, the width of the half-cut is greater than or equal to the width of the double-sided adhesive tape with the attached release substrate, but smaller than the width of the processing release paper tape.

2. The method for manufacturing semi-cut double-sided adhesive tape according to claim 1, characterized in that, The cutting marks of the semi-cutting process are as follows: the double-sided adhesive tape with attached release substrate is cut in the width direction without any uncut area, the release paper tape for processing forms at least a portion of the uncut area in the width direction, and the release paper tape for processing maintains at least a portion of the uncut area in the length direction.

3. The method for manufacturing semi-cut double-sided adhesive tape according to claim 2, characterized in that, The uncut area in the width direction of the peeling paper tape for processing is formed at both ends in the width direction, or only on one side in the width direction.

4. The method for manufacturing semi-cut double-sided tape according to any one of claims 1 to 3, wherein, The cutting mark of the half-cut is a straight line that is perpendicular to the width direction.

5. The method for manufacturing semi-cut double-sided tape according to any one of claims 1 to 3, wherein, At least a portion of the cutting imprint of the half-cut has an angle in the width direction.

6. The method for manufacturing a semi-cut double-sided adhesive tape according to any one of claims 1 to 3, wherein, At least a portion of the cutting imprint of the semi-cut is curved.

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