Splicing System and Splicing Method

Abstract

The present application discloses a splicing system and a splicing method, which includes a mask plate placed on a support platform, and a plurality of backplane adsorption areas are provided on the mask plate, and at least one first positioning point is provided on each backplane adsorption area; a backplane picking device arranged on one side of the support platform, the backplane picking device is used to obtain the backplane and carry the backplane to move, and at least one second positioning point is provided on the backplane; an image acquisition device, which acquires images of the second positioning point on the backplane and the first positioning point on the mask plate at a specified position; a vision alignment device performs image analysis and controls the backplane picking device to move the backplane until the first positioning point coincides with the second positioning point. According to the technical solution provided by the embodiments of the present application, by means of a mask plate with a first positioning point, a matching second positioning point is set on the corresponding backplane, and after accurately positioning, multiple backplanes are adsorbed on the mask plate and then pasted with a film, eliminating the seam after splicing a single backplane pasted with a film.

Description

Technical Field

[0001] The present invention generally relates to the technical field of product splicing, and particularly relates to a splicing system and a splicing method. Background Art

[0002] At present, the splicing technology for multiple backplanes is to attach single products, and after attachment, a black film is cut by laser to form small modules. An aluminum frame structure is attached to the back of each small module structure after laser cutting. Then, multiple small modules are assembled into a box, and the aluminum frame structures between adjacent modules also need to be spliced. Therefore, it is impossible to ensure that the adjacent backplanes are closely connected during splicing, and the seam widths between adjacent backplanes are prone to be inconsistent and uneven, resulting in obvious gaps on the surface of the assembled box, and seamless splicing inside the box cannot be achieved. Summary of the Invention

[0003] In view of the above defects or deficiencies in the prior art, it is desirable to provide a splicing system and a splicing method.

[0004] In a first aspect, there is provided a splicing system, including:

[0005] A support platform, on which a mask plate is placed. The mask plate is provided with a plurality of backplane adsorption areas, and at least one first positioning point is provided on each backplane adsorption area;

[0006] A backplane picking device disposed on one side of the support platform, which is used to obtain a backplane and move the backplane. At least one second positioning point is provided on the backplane;

[0007] An image acquisition device, which is movably disposed on one side of the support platform and is used to acquire images of the second positioning point on the backplane and the first positioning point on the mask plate at a specified position;

[0008] A vision alignment device, which is used to analyze the images of the first positioning point and the second positioning point acquired by the image acquisition device, and control the backplane picking device to move the backplane until the first positioning point coincides with the second positioning point.

[0009] In a second aspect, there is provided a splicing method, which uses the above splicing system for splicing, including the steps of:

[0010] Moving a backplane to an identification position, and acquiring an image of the first positioning point on the mask plate and an image of the second positioning point on the backplane;

[0011] Identifying the acquired images and moving the backplane according to the identification result until the first positioning point coincides with the second positioning point;

[0012] Move the backplane so that the backplane is adsorbed on the support platform;

[0013] Repeat the above steps until all the backplanes are adsorbed on the support platform;

[0014] Attach a black film to the side of all the backplanes away from the mask plate, and the black film covers all the backplanes.

[0015] According to the technical solution provided by the embodiment of the present application, by means of a mask plate with a first positioning point, a second positioning point matching it is set on the corresponding backplane. After accurate positioning, multiple backplanes are adsorbed on the mask plate and then pasted with a film, eliminating the seams after splicing of single pasted backplanes. Description of the Drawings

[0016] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, objects and advantages of the present application will become more obvious:

[0017] Figure 1 It is a schematic structural diagram of the splicing system in this embodiment;

[0018] Figure 2 It is a schematic structural diagram of the mask plate in this embodiment;

[0019] Figure 3 It is a schematic structural diagram of four backplanes adsorbed on the support platform in this embodiment;

[0020] Figure 4 It is a schematic structural diagram of the fitting of the backplane with the black film and the aluminum frame in this embodiment. Detailed Embodiments

[0021] The present application will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related invention, rather than limiting the invention. In addition, it should be noted that for the convenience of description, only the parts related to the invention are shown in the drawings.

[0022] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and embodiments.

[0023] Please refer to Figure 1 and Figure 2 , this embodiment provides a splicing system, including:

[0024] A support platform 3, on which a mask plate 1 is placed, and a plurality of backplane adsorption areas 11 are provided on the mask plate 1, and at least one first positioning point 12 is provided on each backplane adsorption area 11;

[0025] A backplane picking device 4 disposed on one side of the support platform 3, the backplane picking device 4 being configured to acquire a backplane 2 and carry the backplane 2 to move, and at least one second positioning point 21 being provided on the backplane 2;

[0026] An image acquisition device 6, the image acquisition device 6 being movably disposed on one side of the support platform 3 and configured to acquire images of the second positioning point 21 on the backplane 2 and the first positioning point 12 on the mask plate 1 at a specified position;

[0027] A vision alignment device, configured to analyze the images of the first positioning point and the second positioning point acquired by the image acquisition device, and control the backplane picking device to move the backplane until the first positioning point 12 coincides with the second positioning point 21.

[0028] The splicing system provided in this embodiment provides a support platform for placing a mask plate. For example, Figure 2 As shown, a plurality of backplane adsorption areas are provided on the mask plate. Each backplane adsorption area adsorbs and positions different backplanes at the position of the adsorption area, so that multiple backplanes are adsorbed on the support platform, achieving simultaneous adsorption of multiple backplanes and waiting for the subsequent black film 7 pasting process. When the subsequent black film 7 is pasted on multiple backplanes, the gaps between adjacent backplanes are also covered by the black film 7, and there are no uneven gaps between adjacent backplanes. Moreover, the distance between adjacent backplanes is determined by the gaps between the respective adsorption areas on the mask plate 1, and the gaps between the respective adsorption areas on the mask plate 1 can be accurately determined, ensuring the precise gap between adjacent mask plates 1; at the same time, at least one first positioning point 12 is provided on the mask plate. Since the manufacturing accuracy of the mask plate is relatively high, the position of the first positioning point 12 can be accurately marked on the mask plate, and when positioning through the first positioning point 12, a relatively high positioning accuracy is achieved.

[0029] The splicing system further includes a backplane material taking device 6, which is arranged on one side of the support platform. One side of the support platform mentioned here refers to one of the two side surfaces in the direction of the plane of the support platform. Generally, the support platform is set as a horizontally placed structure. Specifically, whether the backplane material taking device 6 is arranged above or below the support platform can be selected and adjusted according to actual needs. The backplane material taking device 6 acquires the backplane and moves it to the corresponding position, aligns the backplane with the mask plate 1 and adsorbs it on the mask plate 1 for positioning. Specifically, a second positioning point 21 is set on the backplane, and the second positioning point 21 matches the first positioning point 12 to perform positioning between the backplane and the mask plate 1. Since the mask plate 1 can perform etching with high precision, the position of the first positioning point 12 can be determined with high precision, and further, the position of the backplane with the second positioning point 21 can be determined. Specifically, the backplane material taking device 6 can be provided with crossed moving tracks and a bracket for carrying the backplane, and the bracket is set to be movable in a direction closer to or farther from the support platform, and the multi-directional movement of the backplane is realized through the backplane material taking device 6.

[0030] In the splicing system of this embodiment, when the backplane moves to the specified position, the image acquisition device is used to acquire the images of the second positioning point 21 on the backplane and the first positioning point 12 on the mask plate 1, and the movement of the backplane to the target position is realized through the positioning between the first positioning point 12 and the second positioning point 21. Specifically, the visual alignment device can be used to analyze the acquired images. After multiple corrections, the first positioning point 12 and the second positioning point 21 are made to coincide. At this time, the position where the backplane is located is the target position. Under the target position, the backplane material taking device 6 is used to push the backplane so that it adheres to the support platform or the mask plate 1. Multiple backplanes are subjected to the same operation and adhere to their respective positions, ensuring that there is a gap with the set requirements between adjacent backplanes. And during the subsequent film pasting process, multiple backplanes are film-pasted at one time, and seamless effect is achieved after multiple backplanes are spliced.

[0031] Optionally, a plurality of recognition positions are provided on the backplane material taking device 6, and the recognition positions correspond to the backplane adsorption areas one by one. The backplane material taking device 6 is used to acquire the backplane and then move the backplane to the corresponding recognition position.

[0032] In this embodiment, the backplane feeding device 6 moves the backplane to the corresponding position, facilitating the acquisition of the first positioning point 12 on the backplane and the second positioning point 21 on the mask plate 1. In order to make the distance between the first positioning point 12 and the second positioning point 21 relatively small before acquiring the images of the above-mentioned positioning points, facilitating the acquisition of the corresponding images, an identification position is set on the backplane feeding device 6. Each backplane to be adsorbed, that is, each backplane adsorption area on the mask plate 1 has an identification position. The backplane feeding device 6 first moves the backplane to this identification position for a preliminary determination of the backplane position. At this identification position, the error between the first positioning point 12 and the second positioning point 21 can be corrected through multiple fine adjustments.

[0033] Optionally, it further includes: an aluminum frame transfer platform 5, which is used to obtain the aluminum frame and carry the aluminum frame to the side of the support platform where the backplane is adsorbed, and push the aluminum frame to move closer to or away from the support platform.

[0034] The system in this embodiment adsorbs multiple backplanes on the support platform or the mask plate 1 in order to be able to adsorb multiple backplanes at one time, for example Figure 3 As shown, four backplanes are adsorbed at one time, and then the black film 7 is attached, as well as the subsequent attachment of the aluminum frame. Among them, the attachment of the black film 7 can be carried out by a vacuum laminating device, specifically, it can be implemented by using existing equipment, or by means of the above-mentioned backplane moving device, etc. for attachment;

[0035] Among them, by setting the aluminum frame transfer platform 5 to obtain and move the aluminum frame, the aluminum frame needs to be attached to the side of the black film 7 away from the backplane. Therefore, the installation position of the aluminum frame transfer platform 5 also needs to meet the above requirements. Specifically, the aluminum frame transfer platform 5 can be provided with crossed moving tracks and a bracket for carrying the aluminum frame, and the bracket is set to be movable in the direction of approaching or departing from the support platform. Through the aluminum frame transfer platform 5, multi-directional movement of the aluminum frame is realized, and finally a structure as shown in Figure 4 is formed. Here, it is similar to the above-mentioned backplane feeding device 6, and both can be used, but not limited to using a high-precision linear motor to achieve the above movement, and the precision can be controlled within 1 micron.

[0036] Optionally, the number of the image acquisition devices is the same as the number of the first positioning points 12 on each backplane adsorption area.

[0037] In this embodiment, the position of the backplane is determined by the positioning between the first positioning point 12 and the second positioning point 21. Preferably, a plurality of first positioning points 12 are arranged in each backplane adsorption area on the mask plate 1. Multi-point positioning improves the accuracy. At the same time, an image acquisition device is arranged at each corresponding first positioning point 12 to collect corresponding images, and the image acquisition device is arranged in a movable structure. When splicing backplanes of different sizes, the image acquisition system can move to adapt to backplanes of different sizes, increasing the practicability of the whole system; at the same time, referring to Figure 2 As shown, preferably, four first positioning points 12 are arranged on the outer periphery of each backplane adsorption area, four second positioning points 21 are arranged on the corresponding backplane, and four image acquisition devices are arranged movably at corresponding positions. Multi-point positioning improves the accuracy of backplane adsorption. Among them, adjacent backplane adsorption areas can share the same first positioning point 12 or can be set separately. Here, no limitation is made.

[0038] Optionally, through holes are provided on both the support platform and the mask plate, and the through holes on the support platform are arranged in a penetrating manner with the through holes 13 on the mask plate. The through holes are connected to an air extraction device for adsorbing the backplane.

[0039] The splicing system in this embodiment provides a mask plate 1 structure with high precision. Corresponding first positioning points 12 are arranged on the mask plate 1 structure. Positioning is achieved between the first positioning points 12 and the backplane, and multiple backplanes are adsorbed on the support platform or the mask plate 1. Subsequently, operations such as laminating multiple backplanes can be performed at one time; among them, the backplane structure is attached to the mask plate 1 by adsorption. Preferably, a through hole structure is arranged on the mask plate 1 for adsorbing the backplane. The setting positions between the mask plate 1 and the support platform can be selected according to actual situations. For example, the mask plate 1 is directly placed on the support platform, and the backplane is placed above the mask plate 1 for adsorption, or the backplane is placed below the support platform for adsorption, and the positioning between the first positioning point 12 and the second positioning point 21 can also be achieved; preferably, through holes are also arranged on the support platform to facilitate the adsorption of the backplane.

[0040] Preferably, the first positioning point 12 and the second positioning point 21 are cross points.

[0041] As Figure 2 shown, in this embodiment, preferably, the first positioning point 12 is set as a cross point, and at the same time, the second positioning point 21 is also a cross point. While being convenient to set, the two lines where the cross points intersect have clear directions, which is more convenient for positioning.

[0042] Preferably, the positions of the first positioning points 12 on each backplane adsorption area correspond to the positions of the second positioning points 21 on the backplane one by one, and the distances between adjacent backplane adsorption areas are the same.

[0043] In the mask plate 1 of this embodiment, a plurality of backplane adsorption areas are provided on the structure, which can be determined according to the actual number of backplanes to be spliced. At least one positioning point is set in each backplane adsorption area. Preferably, four first positioning points 12 are set. The first positioning points 12 are used for comparative positioning with the second positioning points 21 on the backplane. Among them, the positions of the second positioning points 21 on each backplane correspond one-to-one with the positions of the first positioning points 12 on the corresponding backplane adsorption area to ensure the accuracy of positioning and recognition. Preferably, the distance between adjacent backplane adsorption areas is set to be the same to ensure that the distance between adjacent backplanes after splicing is the same.

[0044] The system in this embodiment uses the mask plate 1 with the first positioning points 12 to set the matching second positioning points 21 on the corresponding backplane. After accurate positioning, multiple backplanes are adsorbed on the mask plate 1 and then film is applied, eliminating the seams after splicing individual film-applied backplanes.

[0045] This embodiment also provides a splicing method, which uses the above splicing system for splicing, including the steps:

[0046] Move a backplane to the recognition position, and obtain the images of the first positioning points on the mask plate and the images of the second positioning points 21 on this backplane;

[0047] Identify the obtained images and move the backplane according to the recognition result until the first positioning point coincides with the second positioning point 21;

[0048] Move the backplane so that the backplane is adsorbed on the support platform;

[0049] Repeat the above steps until all backplanes are adsorbed on the support platform;

[0050] Attach a black film 7 to the side of all backplanes away from the mask plate, and the black film 7 covers all backplanes.

[0051] In the splicing method provided in this embodiment, multiple backplanes are moved in a certain order, and each backplane is moved to the recognition position. When at the recognition position, the images of the first positioning points on the mask plate and the images of the second positioning points 21 on the backplane are obtained. By identifying the obtained images and adjusting the position of the backplane, the first positioning point and the second positioning point 21 are made to coincide, realizing the accurate determination of the position of the backplane. When the positional relationship between the backplane and the mask plate is determined, push the backplane so that the backplane is adsorbed on the support platform. At this time, the movement of the backplane is only in one direction, that is, the direction close to the support platform, and no movement occurs in other directions to ensure the stability of the position of the backplane. Multiple backplanes, such as four backplanes, form a structure as shown in Figure 3 after positioning and moving; Subsequently, a black film 7 is attached to the side of the backplane away from the mask plate, realizing the splicing between the backplanes and having no seams.

[0052] Further, it further includes the steps of:

[0053] Move the aluminum frame and attach the aluminum frame to the side of the black film 7 away from the backplane, and the aluminum frame covers all the backplanes;

[0054] Cut the black film 7 on the outside of the backplane;

[0055] Remove multiple backplanes from the support platform.

[0056] Subsequently, the aluminum frame also needs to be attached to the black film 7. At this time, the aluminum frame structure is a complete aluminum frame structure. The aluminum frame is set to cover all the backplanes. Although the aluminum frame structure is attached to the black film at this time, the aluminum frame needs to cover the position of the backplane on the black film. At this time, all the spliced backplanes are covered by an aluminum frame structure. Therefore, there is no gap for the aluminum frame to be spliced between adjacent backplanes, fundamentally removing the seam between adjacent backplanes, forming as Figure 4 the structure shown. The area of the attached black film 7 is larger than the area of all the backplanes. It is also necessary to cut the black film 7 on the outside of the backplane and remove the backplane.

[0057] Wherein, when one backplane moves to the recognition position, the backplane corresponds to a backplane adsorption area on the mask plate, and the direction of the first positioning point on the mask plate is the same as the direction of the second positioning point 21 on the backplane.

[0058] When each backplane moves to the corresponding recognition position, each backplane corresponds to a backplane adsorption area on the mask plate. And at this time, both the first positioning point and the second positioning point 21 are cross points, and their directions are also the same. Only two-direction adjustments are required to determine the position of the backplane.

[0059] The method in this embodiment adsorbs multiple backplanes on the mask plate after accurate positioning by means of the mask plate and then performs film pasting, eliminating the seam after splicing of single film-pasted backplanes.

[0060] It should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. in the above text is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention; the terms "inner" and "outer" refer to the inside and outside relative to the contour of each component itself. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0061] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "above-mentioned", etc. can be used here to describe the spatial positional relationship of one device or feature shown in the drawings with other devices or features. It should be understood that the spatial relative terms are intended to cover different orientations in use or operation in addition to the orientation described in the drawings for the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned as "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways, rotated 90 degrees or in other orientations, and corresponding interpretations are made for the spatial relative descriptions used here.

[0062] The above description is only the preferred embodiment of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by mutually replacing the above features with the (but not limited to) technical features having similar functions disclosed in the present application.

Claims

1. A splicing system, characterized in that, For splicing multiple backplanes, including: A support platform on which a mask plate is placed. The mask plate is provided with a plurality of backplane adsorption areas, and at least one first positioning point is provided on each backplane adsorption area; A backplane picking device arranged on one side of the support platform. The backplane picking device is used to obtain a backplane and carry the backplane to move. At least one second positioning point is provided on the backplane; An image acquisition device movably arranged on one side of the support platform, used to collect images of the second positioning point on the backplane and the first positioning point on the mask plate at a specified position; A vision alignment device, used to analyze the images of the first positioning point and the second positioning point collected by the image acquisition device, and control the backplane picking device to move the backplane until the first positioning point coincides with the second positioning point; A plurality of recognition positions are provided on the backplane picking device, and the recognition positions correspond to the backplane adsorption areas one by one. The backplane picking device is used to move the backplane to the corresponding recognition position after obtaining the backplane.

2. The splicing system according to claim 1, wherein The number of the image acquisition devices is the same as the number of the first positioning points on each backplane adsorption area.

3. The splicing system according to claim 1, characterized in that, Through holes are provided on both the support platform and the mask plate. The through holes on the support platform are arranged in a penetrating manner with the through holes on the mask plate, and the through holes are connected to an air extraction device for adsorbing the backplane.

4. The splicing system according to claim 1, characterized in that, The first positioning point and the second positioning point are cross points.

5. The splicing system according to claim 1, wherein The positions of the first positioning points on each backplane adsorption area are arranged in one-to-one correspondence with the positions of the second positioning points on the backplane, and the distances between adjacent backplane adsorption areas are the same.

6. The splicing system according to any one of claims 1-5, characterized in that, Also included: An aluminum frame transfer platform, used to obtain an aluminum frame and carry the aluminum frame to move to one side of the support platform where the backplane is adsorbed, and move the aluminum frame closer to or away from the support platform.

7. A splicing method, characterized in that, Using the splicing system according to any one of claims 1-6 for splicing, including the steps: Moving a backplane to a recognition position, and obtaining an image of the first positioning point on the mask plate and an image of the second positioning point on the backplane; Identifying the obtained images and moving the backplane according to the recognition result until the first positioning point coincides with the second positioning point; Moving the backplane so that the backplane is adsorbed on the support platform; Repeating the above steps until all backplanes are adsorbed on the support platform; Attaching a black film to the side of all backplanes away from the mask plate, and the black film covers all backplanes.

8. The splicing method according to claim 7, characterized in that Also including the steps: Moving the aluminum frame, and attaching the aluminum frame to the side of the black film away from the backplane, and the aluminum frame covers all backplanes; Cutting the black film outside the backplane; Removing multiple backplanes from the support platform.

9. The splicing method according to claim 7, characterized in that, When the one backplane is moved to the recognition position, the backplane corresponds to one backplane adsorption area on the mask plate, and the direction of the first positioning point on the mask plate is the same as the direction of the second positioning point on the backplane.

Images