Electronic device and method of manufacturing the same

Abstract

The present application provides an electronic device and a manufacturing method thereof. The electronic device includes a driving substrate, the driving substrate includes a plurality of circular grooves and a plurality of square grooves, and a plurality of disc-shaped electronic elements, at least one disc-shaped electronic element of the plurality of disc-shaped electronic elements is located in at least one circular groove of the plurality of circular grooves, the at least one disc-shaped electronic element includes an alignment element located on a top surface of the at least one disc-shaped electronic element, wherein a diameter of the at least one disc-shaped electronic element is defined as R, a diameter of the alignment element is defined as r, a width of at least one square groove of the plurality of square grooves is defined as W, a height of the at least one square groove is defined as H, and the at least one disc-shaped electronic element and the at least one square groove satisfy a condition.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic device, and more particularly, to a method of combining electronic components using fluid assembly to manufacture an electronic device. BACKGROUND

[0002] Electronic components, as essential components of electronic devices or light emitting devices, are widely used in electronic products, such as mobile phones, tablet computers, vehicle displays, etc. After the circuit of the driving substrate of the electronic device or light emitting device is manufactured, a fluid assembly procedure can be used to install a large number of electronic components on the driving substrate. However, because the fluid is not easy to control, the stability of using the fluid assembly procedure needs to be improved, for example, some electronic components may not be installed in the unit area (pixel) of the driving substrate and cause defects. Therefore, it is necessary to provide a repair method for electronic components to improve the yield of installing electronic components on the driving substrate. SUMMARY

[0003] The present application provides an electronic device, comprising a driving substrate, the driving substrate comprising a plurality of circular grooves and a plurality of square grooves, and a plurality of disc-shaped electronic components, at least one disc-shaped electronic component of the plurality of disc-shaped electronic components being located in at least one circular groove of the plurality of circular grooves, the at least one disc-shaped electronic component comprising an alignment element located on a top surface of the at least one disc-shaped electronic component, wherein a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one square groove of the plurality of square grooves is defined as W, a height of the at least one square groove is defined as H, and the at least one disc-shaped electronic component and the at least one square groove satisfy the condition of .

[0004] The present application provides a manufacturing method of an electronic device, comprising providing a driving substrate, the driving substrate comprising a plurality of circular grooves and a plurality of square grooves, and disposing a plurality of disc-shaped electronic components in the plurality of circular grooves by a fluid assembly procedure, at least one disc-shaped electronic component of the plurality of disc-shaped electronic components comprising an alignment element located on a top surface of the at least one disc-shaped electronic component, wherein a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one square groove of the plurality of square grooves is defined as W, a height of the at least one square groove is defined as H, and the at least one disc-shaped electronic component and the at least one square groove satisfy the condition of .

[0005] According to some embodiments, the present application forms different shaped recesses on a driving substrate of an electronic device, which correspond to different shaped electronic components and different mounting methods. For example, a large number of disc-shaped electronic components are mounted into circular recesses by fluid assembly, and a small number of square-shaped electronic components are mounted into some square-shaped recesses by pick and place, so as to achieve the effect of repairing defects. In addition, since the present application limits the size relationship between the square-shaped recesses and the disc-shaped electronic components, the possibility of the disc-shaped electronic components falling into the square-shaped recesses during the fluid assembly process can be reduced, and the process efficiency can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1 Fig. 1 is a top view of a driving substrate of an electronic device according to the present application.

[0007] Figure 2 Fig. 2 is a cross-sectional view of a driving substrate of an electronic device according to the present application.

[0008] Figure 3A Fig. 3 is a perspective view of a disc-shaped electronic component according to the present application.

[0009] Figure 3B Fig. 4 is a cross-sectional view of a disc-shaped electronic component according to the present application.

[0010] Figure 4 Fig. 5 is a cross-sectional view of a driving substrate of an electronic device according to the present application.

[0011] Figure 5 Fig. 6 is a size relationship diagram of a disc-shaped electronic component and a square-shaped recess according to the present application.

[0012] Figure 6 Fig. 7 is a diagram of a disc-shaped electronic component entering a square-shaped recess from a side direction according to the present application.

[0013] BRIEF DESCRIPTION OF DRAWINGS 10 - support substrate; 12 - unit definition layer; 13 - driving substrate; 14 - unit area; 14A - unit area; 16A - circular recess; 16B - square-shaped recess; 17 - main body; 18A - disc-shaped electronic component; 18B - square-shaped electronic component; 19 - alignment element; 19a - side edge; 19b - side edge; 21 - side surface; 21a - side edge; 22 - mechanical arm; 23 - top surface; 24 - partial area; 25 - bottom surface; 30 - electronic device; 31 - first electrode; 33 - second electrode; H - depth; r - diameter; R - diameter; S - hypotenuse length; W - width; X - length; LQ - fluid; TR - triangle. DETAILED DESCRIPTION

[0014] The present application can be understood with reference to the following detailed description and drawings in which:

[0015] Throughout this specification and claims, certain terminology can be used for the sake of readability and recitation, which is intended to be in no way limiting. The terms "comprising," "comprise," "including," "include," and "contain" or variations thereof are inclusive, in that they specify the presence of stated features, integers, steps, operations, elements, or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. The singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

[0016] It should be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements or layers present. It will also be understood that, when a range is given, all the possible sub-ranges are included.

[0017] The terms "about," "substantially," "approximately," or "essentially" generally mean within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0018] In addition, the term "in a range from a first value to a second value" means that the range includes the first value, the second value, and all the other values in between.

[0019] Although terms such as first, second, third, etc. can be used to describe different components, these components should not be limited by these terms. These terms are only used to distinguish one component from another. The claims can not use the same terms when the elements are defined in the order. Therefore, in the following description, the first component can be the second component in the claims.

[0020] It should be understood that the following examples can be substituted, reorganized, mixed, and other examples can be completed without departing from the spirit or conflict of the present application.

[0021] The electronic device of the present application can include a display device, a backlight device, an antenna device, a sensing device, or a tiled device, but is not limited thereto. The electronic device can be a foldable or flexible electronic device. The display device can be a non-self-emissive display device or a self-emissive display device. The antenna device can be a liquid crystal type antenna device or a non-liquid crystal type antenna device, and the sensing device can be a sensing device that senses capacitance, light, heat energy, or ultrasound, but is not limited thereto. The electronic elements can include passive elements and active elements, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode can include a light-emitting diode or a photodiode. The light-emitting diode can include, for example, an organic light-emitting diode (OLED), a mini LED, a micro LED, or a quantum dot LED, but is not limited thereto. The tiled device can be, for example, a display tiled device or an antenna tiled device, but is not limited thereto. Note that the electronic device can be any combination of the above, but is not limited thereto. Hereinafter, the display device will be described as the electronic device or the tiled device to explain the present application, but the present application is not limited thereto.

[0022] Figure 1 FIG. 1 illustrates a top view of a driving substrate 13 of an electronic device 30 of the present application, Figure 2 FIG. 2 illustrates a cross-sectional view along the cross-sectional line A-A’ of FIG. 1, in which a disc-shaped electronic element is mounted on the driving substrate 13 by a fluid assembly process. Please refer to Figure 1 Figure 1 Figure 2 FIGS. 1 and 2 provide a support substrate 10, in which the material of the support substrate can include glass, sapphire, polyimide (PI), polycarbonate (PC), polyethylenenaphthalate (PEN), triacetate (TAC), polyethyleneterephthalate (PET), or a combination thereof, but is not limited thereto. The support substrate 10 can be a hard substrate or a soft substrate, and the present application is not limited thereto. The support substrate 10 can be a single layer or a multi-layer, and the present application is not limited thereto. In the present embodiment, a buffer layer (not shown) and a circuit layer (not shown) can be disposed on the support substrate 10, in which the circuit layer can also be directly disposed on the support substrate. The material of the buffer layer can include inorganic materials such as a silicon nitride layer, a silicon oxide layer, etc. The circuit layer disposed on the support substrate can include various traces (such as, but not limited to, gate lines, signal lines, power lines), electronic units (such as, but not limited to, thin film transistors, capacitors), and the circuit layer can be used to connect electronic elements (such as LEDs, etc.) formed subsequently. ​​

[0023] To simplify the figures, the circuit layer and the buffer layer of the support substrate 10 are omitted in the present disclosure. In the present disclosure, a pixel definition layer (PDL) 12 can be disposed above the support substrate 10, and the pixel definition layer 12 includes a plurality of openings (recesses) arranged and defining a plurality of pixel regions 14. In the present disclosure, the support substrate 10 and the pixel definition layer 12 can be combined to be defined as a driving substrate 13, and the driving substrate 13 can further include the buffer layer and the circuit layer described above. The recesses described herein are used to accommodate electronic elements in subsequent processes. That is, the driving substrate 13 includes a plurality of openings (recesses). Figure 1 A plurality of pixel regions 14 are shown, and at least one circular recess 16A and at least one square recess 16B are disposed in at least one pixel region 14. As shown in Figure 1 and Figure 2 The driving substrate 13 is placed on an XY plane, and the pixel definition layer 12 is disposed above the support substrate 10 in the Z direction. The X direction, the Y direction, and the Z direction are perpendicular to each other. The pixel region 14 can be an area in which one or more electronic elements are disposed in subsequent processes, for example, a pixel region 14 can include a blue (B) light emitting element, and subsequent processes can convert part of the blue light into other colors (for example, into red (R) or green (G)) in a quantum dot (QD) conversion, color filter (CF), or the like, but are not limited thereto. Specifically, according to some embodiments, at least one circular recess 16A and at least one square recess 16B can be disposed in each pixel region 14. According to some embodiments, a plurality of circular recesses 16A and a plurality of square recesses 16B can be disposed in each pixel region 14. Figure 1 For example, three circular recesses 16A and three square recesses 16B are disposed in one pixel region 14, but are not limited thereto. The circular recess 16A is used to accommodate a disc-shaped electronic element (not shown in Figure 1 ) to be subsequently disposed on the driving substrate 13, and the square recess 16B is used to accommodate a square electronic element (not shown in Figure 1 ) to be subsequently disposed on the driving substrate 13.

[0024] The electronic elements (including disc-shaped electronic elements or square disc-shaped electronic elements) described in the present disclosure, for example, light emitting diodes, can include inorganic light emitting diodes (for example, quantum dot light emitting diodes (quantum dot LEDs), mini light emitting diodes (mini LEDs), micro light emitting diodes (micro LEDs), or nano light emitting diodes (nano LEDs), but are not limited thereto. The pixel definition layer 12 can include suitable insulating materials, such as silicon oxide, silicon nitride, silicon oxynitride, organic insulating layers, or any other suitable insulating materials or combinations thereof, but are not limited thereto.

[0025] Please refer to Figure 2 , Figure 2 A cross-sectional view illustrating a fluid assembly (FA) process of assembling a plurality of disc-shaped electronic elements 18A onto the drive substrate 13 is shown. The plurality of disc-shaped electronic elements 18A are placed in a fluid LQ for flow by the fluid assembly process, and during the flow, the plurality of disc-shaped electronic elements 18A are disposed within the plurality of circular recesses 16A by the fluid assembly process. Specifically, each disc-shaped electronic element 18A can fall into each circular recess 16A, respectively, such that each disc-shaped electronic element 18A is assembled onto the drive substrate 13 and electrically connected to the aforementioned circuit layer. According to some embodiments, the size of the circular recess 16A can be larger than the size of each disc-shaped electronic element 18A, and thus can accommodate the disc-shaped electronic element 18A.

[0026] Please refer to Figure 2 and Figure 3A , Figure 3B , Figure 3A A perspective view illustrating a disc-shaped electronic element 18A is shown, Figure 3BThis is a cross-sectional view of a dish-shaped electronic component 18A. In this invention, each dish-shaped electronic component 18A is dish-shaped or disc-shaped, for example, circular when viewed from above (or possibly elliptical in other embodiments). The dish-shaped electronic component 18A includes a body 17, an alignment element 19, a first electrode 31, and a second electrode 33. The body 17 has a top surface 23, a bottom surface 25, and a side surface 21, with the side surface 21 disposed between the top surface 23 and the bottom surface 25, and connecting the top surface 23 and the bottom surface 25. The alignment element (post) 19 is disposed on the top surface 23 of the body 17. The first electrode 31 and the second electrode 33 may be disposed on the bottom surface 25 of the body 17. For example, the first electrode 31 may be disposed in the middle of the bottom surface 25, and the second electrode 33 may be disposed around the bottom surface 25. For example, the second electrode 33 may be disposed around the first electrode 31, but this invention is not limited thereto. The first electrode 31 and the second electrode 33 may be made of conductive materials, for example, metal. The first electrode 31 and the second electrode 33 can be used to electrically connect the dish-shaped electronic component 18A and the driving substrate 13. According to some embodiments, a bonding pad (not shown) may be disposed below the first electrode 31 and the second electrode 33 (in the -Z direction) to facilitate the electrical connection between the dish-shaped electronic component 18A and the driving substrate 13. According to some embodiments, the bonding pad may be disposed between the first electrode 31 and the driving substrate 13, and / or between the second electrode 33 and the driving substrate 13. The bonding pad may be, for example, a conductive adhesive. The alignment element 19 may be a material with a specific density that helps to maintain the dish-shaped electronic component 18A approximately in a fixed vertical orientation as it flows in a fluid. For example, the alignment element 19 may be made of a material with a density lower than that of the fluid LQ, so that when the dish-shaped electronic component 18A flows in a fluid, the alignment element 19 is easily maintained above the body 17 of the dish-shaped electronic component 18A. Figure 2 (in the positive Z direction), and the first electrode 31 and the second electrode 33 are easily maintained below the body 17 of the dish-shaped electronic component 18A ...). Figure 2 (in the negative Z direction). The dish-shaped electronic component 18A is maintained in this direction, making it easy to install into the lower circular recesses 16A without easily causing it to flip. According to some embodiments, the dish-shaped electronic component 18A may be perfectly circular. According to some embodiments, the dish-shaped electronic component 18A may be elliptical.

[0027] The fluidic assembly process allows for rapid or high volume mounting of the plurality of disc-shaped electronic elements 18A onto the drive substrate 13. However, the fluidic assembly process is not perfect and can result in some of the circular recesses 16A in some of the cell regions 14 not being filled with disc-shaped electronic elements 18A, insufficient number of disc-shaped electronic elements 18A being filled, or disc-shaped electronic elements 18A not being connected to the circuitry. Such a condition can be referred to as a defect in the cell region. This can result in the cell region not lighting up or lighting up with insufficient brightness.

[0028] To reduce the occurrence of defects in the cell regions 14, at least one square recess 16B is included in each of the cell regions 14 of the drive substrate 13 in addition to the at least one circular recess 16A for receiving the disc-shaped electronic elements 18A. The square recess 16B is formed to repair defects in the cell regions. The square recess 16B can be a square or a rectangle, and the present application is not limited to this.

[0029] Referring to Figure 4 , Figure 4 a partial cross-sectional view of the electronic device 30 along the cross-sectional line A-A' of Figure 1 is shown. In Figure 4 , some of the cell regions 14 can not have disc-shaped electronic elements 18A, insufficient number of disc-shaped electronic elements 18A, or disc-shaped electronic elements 18A not being connected to the circuitry. For example, Figure 4 , in the cell region 14A, two circular recesses 16A and one square recess 16B are shown. Two disc-shaped electronic elements 18A are disposed in the two circular recesses 16A, and the square recess 16B is empty and does not have any electronic element disposed therein. Specifically, the two disc-shaped electronic elements 18A are disposed in the two circular recesses 16A and are electrically connected to the drive substrate 13, and the square recess 16B is empty and can be considered as a defect in the cell region 14A. Therefore, after the fluidic assembly process, a repair process can be performed to repair the defect. According to some embodiments, the location of the defect in the cell region 14A can be detected, and the repair can be performed at the location of the defect. For example, the disc-shaped electronic elements 18A can be driven to emit light, and a camera can be used to find the cell regions that do not emit light or emit light with insufficient brightness. The repair can then be performed on the cell regions using a pick and place process.

[0030] Further, as Figure 4As shown, one or several square electronic components 18B can be picked up and placed into the square recesses 16B in the partial cell area 14, for example by a mechanical arm 22 or a suction nozzle, or by other methods, to make up the number or color of electronic components in the cell area 14, to repair the cell area 14. In particular, square electronic components 18B can be placed into the empty square recesses 16B in the cell area 14A by the above picking and placing procedure, to make the square electronic components 18B electrically connected to the driving substrate 13. That is, the above plurality of square recesses 16B are used as spare space for repairing electronic components. Figure 4 As shown, square electronic components 18B are placed into the square recesses 16B. The square electronic components 18B can be placed at a later time than the disc-shaped electronic components 18A. Figure 4 As shown, in the electronic device 30, at least one disc-shaped electronic component 18A is placed in at least one circular recess 16A in the cell area 14A, and at least one square electronic component 18B is placed in at least one square recess 16B in the cell area 14A.

[0031] After sufficient electronic components (disc-shaped electronic components 18A and square electronic components 18B) are installed in each cell area 14, other steps can be performed, for example, removing each alignment component 19, and then forming other components, including color filters, passivation layers, quantum dot conversion layers, or combinations thereof. That is, the electronic device 30 of the present application can include color filters, passivation layers, quantum dot conversion layers, combinations thereof. The plurality of components and the manufacturing method thereof belong to the prior art in the art, and will not be described in detail here.

[0032] According to some embodiments, the above picking and placing procedure is performed first. Figure 2 As shown, the fluid assembly procedure is used to install a large number of disc-shaped electronic components 18A into each circular recess 16A on the driving substrate 13. In this process, the probability of disc-shaped electronic components 18A falling into square recesses 16B can be reduced, to avoid subsequent difficulties in repairing defective cell areas. That is, if disc-shaped electronic components 18A fall into square recesses 16B, it is difficult to place square electronic components 18B into square recesses 16B during the above picking and placing procedure. Figure 4 As shown, the fluid assembly procedure is used to install a large number of disc-shaped electronic components 18A into each circular recess 16A on the driving substrate 13. In this process, the probability of disc-shaped electronic components 18A falling into square recesses 16B can be reduced, to avoid subsequent difficulties in repairing defective cell areas. That is, if disc-shaped electronic components 18A fall into square recesses 16B, it is difficult to place square electronic components 18B into square recesses 16B during the above picking and placing procedure.

[0033] Therefore, in order to reduce the probability of disc-shaped electronic components 18A falling into square recesses 16B during the fluid assembly procedure, some embodiments of the present application have a special design for the size relationship between disc-shaped electronic components 18A and square recesses 16B. Please refer to Figure 5 , Figure 5 A size relationship between a disc-shaped electronic component 18A and a square recess 16B is shown. If the disc-shaped electronic component 18A is a disc, the diameter of the disc-shaped electronic component 18A is defined as R (referenceFigure 5 The diameter R of the alignment element 19 is defined as the distance from the center of the circular top surface 23 or bottom surface 25 of the disc-shaped electronic component 18A, i.e. the diameter of the circular top surface 23 or bottom surface 25 of the disc-shaped electronic component 18A. For example, in Figure 6 , the top surface 23 of the disc-shaped electronic component 18A is circular, and the distance from the center of the circular top surface 23 is defined as the diameter R.

[0034] If the disc-shaped electronic component 18A is an elliptical disc, the diameter R can be the length of the major axis of the disc-shaped electronic component 18A. The diameter r of the alignment element 19 is defined as the distance from the center of the circular top surface 23 or bottom surface 25 of the disc-shaped electronic component 18A, i.e. the diameter of the circular top surface 23 or bottom surface 25 of the disc-shaped electronic component 18A. For example, in Figure 5 , the top surface 23 of the disc-shaped electronic component 18A is circular, and the distance from the center of the circular top surface 23 is defined as the diameter R. Figure 5 The depth H of the square-shaped recess 16B is defined as the depth in the Z direction (as shown in Figure 5 , i.e. the vertical distance from the top surface of the unit-defining layer 12 to the top surface of the support substrate 10). When the square-shaped recess 16B is rectangular, the width W of the square-shaped recess 16B is the length of the shorter side in the XY plane. The depth H of the square-shaped recess 16B is the depth in the Z direction. In addition, as viewed in the cross-sectional view, the diagonal length S of the square-shaped recess 16B is defined as the diagonal length of the square-shaped recess 16B as viewed in the cross-sectional view (as shown in Figure 5 , i.e. the diagonal length S of the square-shaped recess 16B as viewed in the cross-sectional view), i.e. the diagonal length S of the square-shaped recess 16B as viewed in the cross-sectional view.

[0035] According to some embodiments, as shown in Figure 5 , the side dimension X of the disc-shaped electronic component 18A in the cross-sectional view can be designed to be greater than the diagonal length S of the square-shaped recess 16B to reduce the probability of the disc-shaped electronic component 18A falling into the square-shaped recess 16B during the fluid assembly process. In the cross-sectional view of the disc-shaped electronic component 18A, the alignment element 19 has a side edge 19a closer to the side edge 21a of the disc-shaped electronic component 18A and a side edge 19b farther from the side edge 21a of the disc-shaped electronic component 18A. The positions of the side edges 19a, 19b and the side edge 21a are referred to the relative positions shown in Figure 5 . The side dimension X is the distance from the side edge 21a of the disc-shaped electronic component 18A to the side edge 19b of the alignment element 19. The side dimension X is R / 2 + r / 2, i.e. (R + r) / 2. When the side dimension X > the diagonal length S, i.e. the side dimension X of the disc-shaped electronic component 18A (i.e. R / 2 + r / 2) will be greater than the length S of the hypotenuse of the square-shaped recess 16B. That is, even if the disc-shaped electronic component 18A partially falls into the square-shaped recess 16B, the probability of the disc-shaped electronic component 18A being stuck in the square-shaped recess 16B can be reduced because the side dimension X of the disc-shaped electronic component 18A is greater than the hypotenuse S of the square-shaped recess 16B. Moreover, during the process of fluidic assembly, the disc-shaped electronic component 18A has a chance to be moved out of the square-shaped recess 16B again with the fluid.

[0036] In the present application, the diameter R of the disc-shaped electronic component 18A can range between 30 μm and 60 μm, the width W of the square-shaped recess 16B can range between 10 μm and 20 μm, and the depth H of the square-shaped recess 16B can range between 10 μm and 20 μm. However, the present application is not limited thereto.

[0037] In addition, each disc-shaped electronic component 18A can also enter the square-shaped recess in a side direction or a vertical direction from the side 21 (refer to FIG. 2B, the side 21). Figure 3A That is, the side 21 of the body 17 of the disc-shaped electronic component 18A enters the square-shaped recess 16B in the -Z direction. Figure 6 An example of the disc-shaped electronic component entering the square-shaped recess in a side direction or a vertical direction is shown. In the present embodiment, the disc-shaped electronic component 18A falls into the square-shaped recess 16B in an area (refer to the portion 24 indicated by the diagonal line) that is smaller than the area of the square-shaped recess 16B. Figure 6 The size of the portion 24 indicated by the diagonal line will affect the success rate of the disc-shaped electronic component 18A being mounted in the circular-shaped recess 16A during the process of fluidic assembly. Furthermore, during the process of fluidic assembly, according to some embodiments, even if the aforementioned condition has been satisfied, the disc-shaped electronic component 18A can still not be mounted in the circular-shaped recess 16A. The area of the partial region 24 of the disc-shaped electronic component 18A is less than 50% of the cross-sectional area of the square-shaped recess 16B, so that the disc-shaped electronic component 18A can smoothly move out of the square-shaped recess 16B even if it partially falls into the square-shaped recess 16B. According to experimental results, the ratio of the depth H of the square-shaped recess 16B to the diameter of the disc-shaped electronic component 18A is adjusted to satisfy the condition of H / (R / 2) < 0.292, so that the area of the partial region 24 of the disc-shaped electronic component 18A is appropriately less than 50% of the cross-sectional area of the square-shaped recess 16B, and the probability of the disc-shaped electronic component 18A being blocked by the square-shaped recess 16B when flowing in the fluid can be reduced. The depth H of the square-shaped recess 16B and the diameter R of the disc-shaped electronic component 18A are designed to satisfy a certain ratio, so that the probability of the square-shaped electronic component 18B having a low luminous efficiency when being repaired due to the square-shaped recess 16B and the square-shaped electronic component 18B being too small can be reduced.

[0038] In summary, according to some embodiments, the driving substrate of the electronic device has recesses with different shapes, which correspond to electronic components with different shapes and different assembly methods. For example, a large number of disc-shaped electronic components are installed in the circular recesses by a fluid assembly process, and a small number of square-shaped electronic components are installed in some of the square-shaped recesses by a pick-and-place process, so that the effect of repairing defects can be achieved. In addition, according to some embodiments, the size relationship between the square-shaped recess and the disc-shaped electronic component is limited, so that the probability of the disc-shaped electronic component falling into the square-shaped recess during the fluid assembly process can be reduced, and the process efficiency can be improved.

[0039] The features of the embodiments of the present application can be arbitrarily mixed and used as long as they do not conflict with each other or the spirit of the present application.

[0040] The above description is only some embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, characterized by comprising: Comprising: a driver substrate comprising a plurality of circular recesses and a plurality of square recesses; and a plurality of disc-shaped electronic components, at least one of the plurality of disc-shaped electronic components being disposed within at least one of the plurality of circular recesses, the at least one disc-shaped electronic component comprising an alignment element disposed on a top surface of the at least one disc-shaped electronic component; wherein a diameter of the at least one disc-shaped electronic element is defined as R, a diameter of the alignment element is defined as r, a width of at least one square-shaped recess of the plurality of square-shaped recesses is defined as W, a height of the at least one square-shaped recess is defined as H, and the at least one disc-shaped electronic element and the at least one square-shaped recess satisfy the conditions of ​ 2.The electronic device of claim 1, wherein, the plurality of disc-shaped electronic components being disposed within the plurality of circular recesses in a flow assembly procedure. 3.The electronic device of claim 1, wherein, further comprising at least one square electronic component disposed within the at least one square recess, the at least one square electronic component being disposed within the at least one square recess in a pick-and-place procedure.

4. The electronic device of claim 1, wherein, the at least one disc-shaped electronic component and the at least one square recess further satisfying a condition of H / (R / 2) < 0.

292. 5.The electronic device of claim 1, wherein, the driver substrate comprising a plurality of cell regions, wherein the at least one circular recess and the at least one square recess are disposed within at least one of the plurality of cell regions. 6.A method for manufacturing an electronic device, comprising: Comprising: providing a driver substrate comprising a plurality of circular recesses and a plurality of square recesses; disposing a plurality of disc-shaped electronic components within the plurality of circular recesses in a flow assembly procedure, at least one of the plurality of disc-shaped electronic components comprising an alignment element disposed on a top surface of the at least one disc-shaped electronic component; wherein a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment component is defined as r, a width of at least one of the plurality of square grooves is defined as W, a height of the at least one square groove is defined as H, and the at least one disc-shaped electronic component and the at least one square groove satisfy the conditions of ​ 7. The method of manufacturing according to claim 6, wherein, after disposing the plurality of disc-shaped electronic components within the plurality of circular recesses, performing a repair step on a portion of the plurality of cell regions.

8. The method of manufacturing according to claim 7, wherein, the repair step comprising disposing at least one square electronic component within at least one of the plurality of square recesses in a pick-and-place procedure.

9. The method of claim 6, wherein, further comprising removing the alignment element of the at least one disc-shaped electronic component.

10. The method of manufacturing according to claim 6, wherein, the at least one disc-shaped electronic component and the at least one square recess further satisfying a condition of H / (R / 2) < 0.292.

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