Display device

Abstract

A display device is disclosed, the display device comprising a base member, a circuit layer, a display layer, a thin film encapsulation layer and a touch sensor layer. The base member comprises a first region and a second region disposed adjacent to the first region. The circuit layer is disposed on the base member to cover the first region and expose the second region. The display layer is disposed on the circuit layer to display an image. The thin film encapsulation layer is disposed on the display layer. The touch sensor layer is disposed on the thin film encapsulation layer and comprises an organic layer extending from an upper portion of the thin film encapsulation layer to cover at least a portion of the exposed second region.

Description

[0001] This application is a divisional application of a patent application with an application date of July 21, 2017, application number 201710598957.4, and invention name “Display Device”. Technical Field

[0002] The exemplary embodiments relate to a display device. More particularly, the present disclosure relates to a display device capable of preventing or reducing cracks occurring in the device. Background Art

[0003] Various display devices have been developed for multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game consoles. As input devices for display devices, keyboards or mice are widely used. In recent years, touch panels are often used as input devices for display devices.

[0004] The above information disclosed in this Background section is only for enhancement of understanding of the background of the inventive concept and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art. Summary of the invention

[0005] Exemplary embodiments provide a display device capable of preventing breakage from occurring when the display device is bent or folded.

[0006] Additional aspects will be set forth in the detailed description which follows, and in part will be apparent from the disclosure, or may be learned by practice of the inventive concepts.

[0007] An exemplary embodiment of the present invention discloses a display device, the display device comprising a base member, a circuit layer, a display layer, a thin film encapsulation layer and a touch sensor layer. The base member comprises a first region and a second region disposed adjacent to the first region. The circuit layer is disposed on the base member to cover the first region and expose the second region. The display layer is disposed on the circuit layer to display an image. The thin film encapsulation layer is disposed on the display layer. The touch sensor layer is disposed on the thin film encapsulation layer and comprises an organic layer extending from an upper portion of the thin film encapsulation layer to cover at least a portion of the exposed second region.

[0008] According to the above, it is possible to prevent breakage in a display device when the device is bent or folded.

[0009] The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings, which are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept.

[0011] Figure 1A is a perspective view showing a display device according to an exemplary embodiment of the present disclosure.

[0012] Figure 1B is a cross-sectional view showing a display device according to an exemplary embodiment of the present disclosure.

[0013] Figure 2A is a perspective view showing a display device according to an exemplary embodiment of the present disclosure.

[0014] Figure 2B is a cross-sectional view showing a display device according to an exemplary embodiment of the present disclosure.

[0015] Figure 3A and Figure 3B is a perspective view showing a display device according to an exemplary embodiment of the present disclosure.

[0016] Figure 4A is a plan view showing an organic light emitting display panel according to an exemplary embodiment of the present disclosure.

[0017] Figure 4B is a cross-sectional view showing a display module according to an exemplary embodiment of the present disclosure.

[0018] Figure 5A is an equivalent circuit diagram showing a pixel according to an exemplary embodiment of the present disclosure.

[0019] Figure 5B is a cross-sectional view illustrating a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure.

[0020] Figure 5C is a cross-sectional view illustrating a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure.

[0021] Fig. 6A , Figure 6B and Figure 6C is a cross-sectional view illustrating a thin film encapsulation layer according to an exemplary embodiment of the present disclosure.

[0022] Fig. 7A is a cross-sectional view showing a touch sensor layer according to an exemplary embodiment of the present disclosure.

[0023] Figure 7B , Figure 7C , Fig.7D and Fig. 7Eis a plan view showing a touch sensor layer according to an exemplary embodiment of the present disclosure.

[0024] Figure 7F It shows Fig. 7E A local enlarged view of area BB.

[0025] Fig. 8A , Figure 8B , Figure 8C and Fig.8D It shows Figure 4B A local enlarged view of area AA.

[0026] Fig.9A , Fig. 9B , Fig. 9C , Fig.9D , Fig.9E , Fig.9F , Figure 9G , Figure 9H and Fig.9I It shows the manufacturing Figure 8C A cross-sectional view of a method of displaying a module is shown. DETAILED DESCRIPTION

[0027] In the following description, for the purpose of illustration, many specific details are set forth to provide a deep understanding of various exemplary embodiments. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring various exemplary embodiments.

[0028] In the drawings, the size and relative sizes of layers, films, panels, regions, etc. may be exaggerated for clarity and descriptive purposes. Additionally, like reference numerals denote like elements.

[0029] When an element or layer is referred to as being "on" another element or layer, "connected to" or "bonded to" another element or layer, the element or layer may be directly on other elements or layers, directly connected to or directly bonded to another element or layer, or there may be an intermediate element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bonded to" another element or layer, there is no intermediate element or layer. For the purposes of this disclosure, "at least one (kind) of X, Y, and Z" and "at least one (kind) selected from the group consisting of X, Y, and Z" may be interpreted as any combination of only X, only Y, only Z, or two (kinds) or more (kinds) of X, Y, and Z, such as taking XYZ, XYY, YZ, and ZZ as examples. The same reference numerals always represent the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0030] Although the terms first, second, etc. can be used here to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer and / or part from another element, component, region, layer and / or part. Therefore, without departing from the teaching of the present disclosure, the first element, component, region, layer and / or part discussed below can be referred to as the second element, component, region, layer and / or part.

[0031] Spatially relative terms such as "under ...", "below ...", "below ...", "above ...", "above ...", etc. may be used for descriptive purposes to describe the relationship between an element or feature as shown in the figure and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms are also intended to include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings flips, then the elements described as "below" or "below" other elements or features will be oriented as "above" other elements or features. Therefore, the exemplary term "below ..." may include both above and below orientations. In addition, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), so the spatially relative descriptors used herein are interpreted accordingly.

[0032] The terms used herein are only for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "a", and "the" are also intended to include plural forms. In addition, when the terms "include", "comprising", and their various variations are used in this specification, the existence of the features, wholes, steps, operations, elements, components, and / or combinations thereof is indicated, but the existence or addition of one or more features, wholes, steps, operations, elements, components, and / or combinations thereof is not excluded.

[0033] Various exemplary embodiments are described herein with reference to cross-sections that are schematic representations of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances, are contemplated. Thus, the exemplary embodiments disclosed herein should not be construed as limited to the shapes of the specifically illustrated regions, but rather include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shape of a region of a device nor are they intended to be limiting.

[0034] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure is a part. Unless so explicitly defined herein, terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not interpreted in an idealized or overly formalized sense.

[0035] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0036] Figure 1A is a perspective view showing a display device DD according to an exemplary embodiment of the present disclosure.

[0037] Reference Figure 1A , the display device DD includes a plurality of areas. The display device DD includes a display area DD-DA displaying an image IM and a non-display area DD-NDA disposed adjacent to the display area DD-DA. The image IM is not displayed in the non-display area DD-NDA. FIG. 1 shows an image of a vase as the image IM. The display area DD-DA has, for example, a substantially quadrilateral shape, and the non-display area DD-NDA surrounds the display area DD-DA, but the present invention is not limited thereto or thereby.

[0038] The display device DD has a shape in which a portion thereof is bent. Figure 1A As shown in FIG. 1 , the display device DD includes a bending area BA having a curved shape and a non-bending area NBA having a flat shape. The bending area BA is disposed adjacent to at least one side of the non-bending area NBA. According to another exemplary embodiment, the bending area BA and the non-bending area NBA may be omitted.

[0039] The non-bending area NBA is substantially parallel to a surface defined by the first direction DR1 and the second direction DR2. A direction orthogonal to the non-bending area NBA represents a third direction DR3. In each member, the front surface is distinguished from the rear surface by the third direction DR3. The bending area BA bent from the non-bending area NBA displays an image IM toward a fourth direction DR4 intersecting the first direction DR1, the second direction DR2, and the third direction DR3. However, the directions indicated by the first direction DR1 to the fourth direction DR4 are terms relative to each other, and therefore, the first direction DR1 to the fourth direction DR4 may be changed to other directions.

[0040] Figure 1B Shows Figure 1A sectional view of a display device DD shown in FIG. Figure 1B A cross section defined by the first direction DR1 and the third direction DR3 is shown.

[0041] Reference Figure 1B The display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 combines the display module DM and the protective film PM, the second adhesive member AM2 combines the display module DM and the optical member LM, and the third adhesive member AM3 combines the optical member LM and the window WM.

[0042] The protective film PM protects the display module DM. The protective film PM includes a first outer surface OS-L exposed to the outside and an adhesive surface adhered to the first adhesive member AM1. The protective film PM prevents external moisture from entering the display module DM and absorbs external impact.

[0043] The protective film PM may include a plastic film as a base substrate. The protective film PM may include a plastic film, the plastic film including one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly (arylene ether sulfone) and a mixture thereof.

[0044] The material of the protective film PM may include a mixed material of an organic material and an inorganic material, and is not limited to a plastic resin. The protective film PM includes a porous organic layer and an inorganic material filled into the pores of the organic layer. The protective film PM may also include a functional layer formed in a plastic film. The functional layer includes a resin layer. The functional layer is formed by a coating method. In an exemplary embodiment, the protective film PM may be omitted.

[0045] The window WM protects the display module DM from external impact and provides an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface adhered to the third adhesive member AM3. Figure 1A The display surface IS shown in FIG. 1 may be Figure 1B The second outer surface OS-U shown in .

[0046] The window WM may include a plastic film. The window WM may have a multilayer structure, which may include a glass substrate, a plastic film or a plastic substrate. The window WM may also include a frame pattern. The multilayer structure of the window WM may be formed by a continuous process or a bonding process using an adhesive.

[0047] The optical member LM reduces the reflectivity of external light. The optical member LM includes at least a polarizing film. The optical member LM also includes a retardation film. In the present exemplary embodiment, the optical member may be omitted.

[0048] The display module DM includes an organic light emitting display panel DP and a touch sensor layer TS. The touch sensor layer TS is directly disposed on the organic light emitting display panel DP. In the following description, the expression "a first component is directly disposed on a second component" means that the first component and the second component are formed by a continuous process without being adhered to each other by using a separate adhesive layer.

[0049] The organic light emitting display panel DP generates an image IM corresponding to the image data input thereto (refer to Figure 1A ). The organic light emitting display panel DP includes a first display panel surface BS1-L and a second display panel surface BS1-U facing the first display panel surface BS1-L in the thickness direction DR3. In the present exemplary embodiment, the organic light emitting display panel DP will be described as a representative example of a display panel, but the display panel should not be limited to the organic light emitting display panel.

[0050] The touch sensor layer TS acquires coordinate information of an external input. The touch sensor layer TS senses the external input in a capacitive manner.

[0051] Although not shown in the figure, the display module DM according to the present exemplary embodiment may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a stacked structure of a conductive layer / insulating layer / conductive layer. The anti-reflection layer absorbs light from outside thereof or polarizes light from outside thereof to reduce external light reflectivity. The anti-reflection layer may replace the function of the optical member LM.

[0052] Each of the first bonding member AM1, the second bonding member AM2, and the third bonding member AM3 may be, but is not limited to, an organic bonding layer such as an optically transparent adhesive film (OCA), an optically transparent resin (OCR), or a pressure-sensitive adhesive film (PSA). The organic bonding layer may include a polyurethane-based bonding material, a polyacrylic-based bonding material, a polyester-based bonding material, a polyepoxy-based bonding material, or a polyvinyl acetate-based bonding material. Therefore, the organic bonding layer may correspond to one organic layer.

[0053] Although not shown in the figure, the display device DD may further include a frame structure that supports the functional layer to maintain Figure 1A and Figure 1B The frame structure may include an articulated structure or a hinge structure.

[0054] The bending area BA of the display device DD may have a shape bent at a predetermined radius of curvature. Alternatively, the bending area BA may have a shape bent such that the radius of curvature decreases as the distance from the non-bending area NBA increases. However, the bending area BA may be bent at various radii of curvature.

[0055] In the present exemplary embodiment, at least one of the protective film PM, the adhesive members AM1, AM2, and AM3, the optical member LM, and the window WM may be omitted. The display device according to the present exemplary embodiment may include a combination of various members and should not be limited to a specific structure.

[0056] Figure 2A is a perspective view showing a display device DD-1 according to an exemplary embodiment of the present disclosure. Figure 2B is a cross-sectional view showing a display device DD-1 according to an exemplary embodiment of the present disclosure. Figure 2A and Figure 2B The display device DD-1 is described in detail. Figure 2A and Figure 2B In the figure, the same reference numerals denote Figure 1A and Figure 1B The elements in FIG. 1 are the same elements, so the detailed description of the same elements will be omitted.

[0057] Reference Figure 2A , the display device DD-1 includes a non-bending area NBA and a first bending area BA1 and a second bending area BA2 disposed at opposite side surfaces of the non-bending area NBA. Figure 2B A cross section defined by the first direction DR1 and the third direction DR3 is shown.

[0058] The display device DD-1 includes a first bending area BA1 and a second bending area BA2. The first bending area BA1 and the second bending area BA2 are defined to be spaced apart from each other so that a non-bending area NBA is disposed between the first bending area BA1 and the second bending area BA2. The first bending area BA1 is disposed adjacent to one side of the non-bending area NBA and is bent in a convex shape toward a fourth direction DR4. The second bending area BA2 is disposed adjacent to the other side of the non-bending area NBA and is bent in a convex shape toward a fifth direction DR5.

[0059] The display device DD-1 has a generally convex shape toward the third direction DR3. Meanwhile, according to an exemplary embodiment, the display device DD-1 may have an upwardly concave shape according to the shape of each of the first bending area BA1 and the second bending area BA2. The display device DD-1 according to the present exemplary embodiment may have various shapes and should not be limited to a specific embodiment.

[0060] Although Figures 1A to 2B A curved display device is shown as a representative example of the display devices DD and DD-1, but the display devices DD and DD-1 may be foldable display devices or rollable display devices. In addition, although the present exemplary embodiment shows a flexible display device, it should not be limited to or thereby. That is, the display device DD according to the present exemplary embodiment may be a flat rigid display device or a curved rigid display device. The display device DD according to the present exemplary embodiment may be applied to large-sized electronic products such as televisions, monitors, etc., and small-sized and medium-sized electronic products such as mobile phones, tablet computers, car navigation systems, game consoles, smart watches, etc.

[0061] Figure 3A and Figure 3B is a perspective view showing a display device DD-2 according to an exemplary embodiment of the present disclosure. Figure 3A The display device DD-2 is shown in an unfolded state. Figure 3B The display device DD-2 is shown in a bent state.

[0062] The display device DD-2 includes one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD-2 is curved. However, the bending area of ​​the display device DD-2 may be changed in the present exemplary embodiment.

[0063] The display device DD-2 can be fixed in one state during operation. Figure 3B The display device DD-2 can be fixed on the frame when bent, and the frame can be coupled to the housing of the electronic device.

[0064] The display device DD-2 according to the present exemplary embodiment may have Figure 1B However, the non-bending area NBA and the bending area BA may have stacking structures different from each other. For example, the non-bending area NBA may have a stacking structure different from that of the bending area BA. Figure 1B The cross-sectional structure shown in FIG. 1 is substantially the same as that shown in FIG. 1 , and the bending area BA may have a cross-sectional structure similar to that shown in FIG. Figure 1B The cross-sectional structure shown in FIG. 2 is different from the cross-sectional structure shown in FIG. The optical member LM and the window WM may not be disposed in the curved area BA. That is, the optical member LM and the window WM may be disposed only in the non-curved area NBA. The second adhesive member AM2 and the third adhesive member AM3 may not be disposed in the curved area BA. As described above, due to Figure 1BAt least one of the elements shown in FIG. 4 may overlap only the non-bending area NBA and may not overlap the bending area BA, so the bending area BA may have a relatively small thickness compared to the non-bending area NBA. Therefore, the bending area may be easily bent.

[0065] Figure 4A is a plan view showing an organic light emitting display panel DP according to an exemplary embodiment of the present disclosure, Figure 4B is a cross-sectional view showing a display module DM according to an exemplary embodiment of the present disclosure.

[0066] Reference Figure 4A When viewed in a plan view, the organic light emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and the non-display area NDA of the organic light emitting display panel DP correspond to the display device DD (refer to Figure 1A ) display area DD-DA (refer to Figure 1A ) and non-display area DD-NDA (refer to Figure 1A The display area DA and the non-display area NDA of the organic light emitting display panel DP do not need to be connected to the display device DD (refer to Figure 1A ) display area DD-DA (refer to Figure 1A ) and non-display area DD-NDA (refer to Figure 1A ) are the same, the display area DA and the non-display area NDA of the organic light emitting display panel DP may be changed according to the structure and design of the organic light emitting display panel DP.

[0067] The organic light emitting display panel DP includes a plurality of pixels PX. A region where the pixels PX are arranged is referred to as a display region DA. In the present exemplary embodiment, a non-display region NDA is defined along an edge of the display region DA.

[0068] The organic light emitting display panel DP includes a gate line GL, a data line DL, a light emitting line EL, a control signal line SL-D, an initialization voltage line SL-Vint, a voltage line SL-VDD, a power supply line E-VSS, and a pad portion PD.

[0069] Each of the gate lines GL is connected to a corresponding pixel in the pixel PX, and each of the data lines DL is connected to a corresponding pixel in the pixel PX. Each of the luminous lines EL may be arranged substantially parallel to a corresponding gate line in the gate lines GL. The control signal line SL-D applies a control signal to the gate drive circuit GDC. The initialization voltage line SL-Vint applies an initialization voltage to the pixel PX. The voltage line SL-VDD is connected to the pixel PX to apply a first voltage to the pixel PX. The voltage line SL-VDD includes a plurality of lines extending in a first direction DR1 and a plurality of lines extending in a second direction DR2. The power line E-VSS is disposed in the non-display area NDA to surround three sides of the display area DA. The power line E-VSS applies a common voltage (e.g., a second voltage) to the pixel PX. The common voltage has a level lower than that of the first voltage.

[0070] The gate driving circuit GDC is disposed at one side of the non-display area NDA and is connected to the gate line GL and the light emitting line EL. Some of the gate line GL, the data line DL, the light emitting line EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD are disposed on the same layer, while other of the gate line GL, the data line DL, the light emitting line EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD are disposed on different layers.

[0071] The pad portion PD is connected to ends of the data line DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD.

[0072] Reference Figure 4B , the organic light emitting display panel DP includes a base member BSM, a circuit layer DP-CL disposed on the base member BSM, a display layer DP-OLED, and a thin film encapsulation layer TFE.

[0073] The base member BSM includes at least one plastic film. The base member BSM may be a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate or an organic / inorganic hybrid material substrate. The plastic substrate includes at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin and perylene resin.

[0074] The circuit layer DP-CL includes a plurality of insulating layers, a plurality of conductive layers and a semiconductor layer. The conductive layer of the circuit layer DP-CL may form a signal line or a control circuit of a pixel.

[0075] The display layer DP-OLED includes a plurality of organic light emitting diodes.

[0076] The thin film encapsulation layer TFE encapsulates the display layer DP-OLED. The thin film encapsulation layer TFE includes an inorganic layer and an organic layer. The thin film encapsulation layer TFE includes at least two inorganic layers and an organic layer disposed therebetween. The inorganic layer protects the display layer DP-OLED from moisture and oxygen, and the organic layer protects the display layer DP-OLED from foreign substances such as dust. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. The organic layer may include an acryl-based organic material, but the organic layer is not limited thereto or thereby.

[0077] The touch sensor layer TS is directly disposed on the thin film encapsulation layer TFE. The touch sensor layer TS includes a touch sensor and a touch signal line. The touch sensor and the touch signal line have a single-layer structure or a multi-layer structure.

[0078] The touch sensor and the touch signal line may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The touch sensor and the touch signal line may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensor and the touch signal line may have the same layer structure or different layer structures. The touch sensor layer TS will be described in detail later.

[0079] Figure 5A is an equivalent circuit diagram showing a pixel according to an exemplary embodiment of the present disclosure.

[0080] Figure 5A The i-th pixel PXi connected to the k-th data line DLk among the data lines DL is shown (refer to Figure 4A ).

[0081] The i-th pixel PXi includes an organic light emitting diode OLED and a pixel driving circuit for controlling the organic light emitting diode OLED. The pixel driving circuit includes seven thin film transistors T1 to T7 and a storage capacitor Cst. The first thin film transistor T1 controls the driving current applied to the organic light emitting diode OLED. The output electrode of the second thin film transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second thin film transistor T2 directly contacts the first electrode of the organic light emitting diode OLED, or is connected to the first electrode of the organic light emitting diode OLED via another transistor (e.g., the sixth thin film transistor T6).

[0082] The control electrode of the control transistor receives a control signal. The control signal applied to the i-th pixel PXi includes the (i-1)th gate signal Si-1, the i-th gate signal Si, the (i+1)th gate signal Si+1, the data signal Dk, and the i-th light emission control signal Ei. In the present exemplary embodiment, the control thin film transistor includes a first thin film transistor T1 and third to seventh thin film transistors T3 to T7.

[0083] The first thin film transistor T1 includes an input electrode connected to the kth data line DLk, a control electrode connected to the ith gate line GLi, and an output electrode connected to the output electrode of the second thin film transistor T2. The first thin film transistor T1 is turned on by a gate signal Si (hereinafter, referred to as an "ith gate signal") applied to the ith gate line GLi to apply the data signal Dk applied to the kth data line to the storage capacitor Cst.

[0084] Figure 5B is a cross-sectional view showing a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure, Figure 5C is a cross-sectional view showing a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure. In detail, Figure 5B Shown with Figure 5A The cross section of the portion corresponding to the first thin film transistor T1 of the equivalent circuit shown in FIG. Figure 5C Shown with Figure 5A 0 is a cross-section of the corresponding parts of the second thin film transistor T2, the sixth thin film transistor T6 and the organic light emitting diode OLED in the equivalent circuit shown in FIG.

[0085] Reference Figure 5B and Figure 5C , a buffer layer BFL is disposed on the base layer SUB. The buffer layer BFL improves the bonding force between the base layer SUB and the conductive pattern or the semiconductor pattern. The buffer layer BFL includes an inorganic layer. Although not shown in the figure, a barrier layer may be further disposed on the base layer SUB to prevent foreign substances from entering. The buffer layer BFL and the barrier layer may be selectively disposed or omitted.

[0086] The semiconductor pattern OSP1 of the first thin film transistor T1 (hereinafter, referred to as a "first semiconductor pattern"), the semiconductor pattern OSP2 of the second thin film transistor T2 (hereinafter, referred to as a "second semiconductor pattern"), and the semiconductor pattern OSP6 of the sixth thin film transistor T6 (hereinafter, referred to as a "sixth semiconductor pattern") are disposed on the buffer layer BFL. The first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6 may include amorphous silicon, polycrystalline silicon, or a metal oxide semiconductor.

[0087] The first insulating layer 10 is disposed on the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6. Figure 5B and Figure 5C In the embodiment, the first insulating layer 10 is provided in a layer shape to cover the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6, but the present invention should not be limited thereto or thereby. That is, the first insulating layer 10 may be provided in a pattern shape corresponding to the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6.

[0088] The first insulating layer 10 may include a plurality of inorganic thin layers, including a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer.

[0089] The control electrode GE1 of the first thin film transistor T1 (hereinafter, referred to as the "first control electrode"), the control electrode GE2 of the second thin film transistor T2 (hereinafter, referred to as the "second control electrode"), and the control electrode GE6 of the sixth thin film transistor T6 (hereinafter, referred to as the "sixth control electrode") are disposed on the first insulating layer 10. The first control electrode GE1, the second control electrode GE2, and the sixth control electrode GE6 are connected to the gate line GL (refer to Figure 4A ) are formed by the same photolithography process.

[0090] The second insulating layer 20 is disposed over the first insulating layer 10 to cover the first control electrode GE1, the second control electrode GE2, and the sixth control electrode GE6. The second insulating layer 20 provides a flat upper surface. The second insulating layer 20 includes an organic material and / or an inorganic material.

[0091] The input electrode SE1 (hereinafter referred to as the “first input electrode”) and the output electrode DE1 (hereinafter referred to as the “first output electrode”) of the first thin film transistor T1, the input electrode SE2 (hereinafter referred to as the “second input electrode”) and the output electrode DE2 (hereinafter referred to as the “second output electrode”) of the second thin film transistor T2, and the input electrode SE6 (hereinafter referred to as the “sixth input electrode”) and the output electrode DE6 (hereinafter referred to as the “sixth output electrode”) of the sixth thin film transistor T6 are arranged on the second insulating layer 20.

[0092] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern OSP1 through the first contact hole CH1 and the second contact hole CH2 formed through the first insulating layer 10 and the second insulating layer 20, respectively. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern OSP2 through the third contact hole CH3 and the fourth contact hole CH4 formed through the first insulating layer 10 and the second insulating layer 20, respectively. The sixth input electrode SE6 and the sixth output electrode DE6 are connected to the sixth semiconductor pattern OSP6 through the fifth contact hole CH5 and the sixth contact hole CH6 formed through the first insulating layer 10 and the second insulating layer 20, respectively. Meanwhile, according to another exemplary embodiment, each of the first thin film transistor T1, the second thin film transistor T2, and the sixth thin film transistor T6 may have a bottom gate structure.

[0093] The third insulating layer 30 is disposed over the second insulating layer 20 to cover the first input electrode SE1, the second input electrode SE2, the sixth input electrode SE6, the first output electrode DE1, the second output electrode DE2, and the sixth output electrode DE6. The third insulating layer 30 may include an organic layer and / or an inorganic layer. Specifically, the third insulating layer 30 may include an organic material to provide a flat surface.

[0094] One of the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30 may be omitted according to the circuit structure of the pixel. The second insulating layer 20 and the third insulating layer 30 may be referred to as an intermediate layer. The intermediate layer is disposed between conductive patterns (e.g., between an upper conductive pattern and a lower conductive pattern) to insulate the conductive patterns from each other.

[0095] The pixel defining layer PDL and the organic light emitting diode OLED are disposed on the third insulating layer 30. The first electrode AE ​​is disposed on the third insulating layer 30. The first electrode AE ​​is connected to the sixth output electrode DE6 through a seventh contact hole CH7 defined by the third insulating layer 30. The pixel defining layer PDL has an opening OP defined therethrough. At least a portion of the first electrode AE ​​is exposed through the opening OP of the pixel defining layer PDL.

[0096] When viewed in a plan view, the pixel PX is disposed in a pixel region. The pixel region includes a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-light emitting region NPXA surrounds the light emitting region PXA. In the present exemplary embodiment, the light emitting region PXA is defined as a portion corresponding to the first electrode AE ​​exposed by the opening OP.

[0097] The hole control layer HCL is commonly disposed in the light emitting region PXA and the non-light emitting region NPXA. Although not shown in the figure, a common layer such as the hole control layer HCL may be commonly formed in the pixel PX (refer to Figure 4A).

[0098] The organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML is disposed in a region corresponding to the opening OP. That is, the organic light emitting layer EML may be patterned into a plurality of portions, which may be respectively disposed in a plurality of pixels PX. In the present exemplary embodiment, the patterned organic light emitting layer EML is shown as a representative example, but the organic light emitting layer EML may be commonly disposed on a plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. In addition, the organic light emitting layer EML may have a multilayer structure.

[0099] The electronic control layer ECL is disposed on the organic light emitting layer EML. Although not shown in the figure, the electronic control layer ECL may be commonly disposed in a plurality of pixels PX (refer to Figure 4A ).

[0100] The second electrode CE is disposed on the electron control layer ECL. The second electrode CE is commonly disposed in the plurality of pixels PX.

[0101] The thin film encapsulation layer TFE is disposed on the second electrode CE. The thin film encapsulation layer TFE is commonly disposed in a plurality of pixels PX. The thin film encapsulation layer TFE includes at least one inorganic layer and at least one organic layer. The thin film encapsulation layer TFE may include a plurality of inorganic layers and a plurality of organic layers alternately stacked with the plurality of inorganic layers.

[0102] In the present exemplary embodiment, the thin film encapsulation layer TFE may directly cover the second electrode CE. In the present exemplary embodiment, a cover layer may be further disposed between the thin film encapsulation layer TFE and the second electrode CE to cover the second electrode CE. In this case, the thin film encapsulation layer TFE may directly cover the cover layer.

[0103] FIG. 6A to FIG. 6C is a cross-sectional view showing a thin film encapsulation layer according to an exemplary embodiment of the present disclosure. FIG. 6A to FIG. 6C The thin film encapsulation layers TFE1, TFE2, and TFE3 according to the present disclosure are described in detail.

[0104] Reference Fig. 6A The thin film encapsulation layer TFE1 includes n inorganic thin layers IOL1 to IOLn, wherein the first inorganic thin layer IOL1 of the n inorganic thin layers IOL1 to IOLn is connected to the second electrode CE (refer to Figure 6C The first inorganic thin layer IOL1 may be referred to as a “lower inorganic thin layer”, and the inorganic thin layers other than the first inorganic thin layer IOL1 among the n inorganic thin layers IOL1 to IOLn may be referred to as “upper inorganic thin layers”.

[0105] The thin film encapsulation layer TFE1 includes n-1 organic thin layers OL1 to OLn-1, which are alternately arranged with n inorganic thin layers IOL1 to IOLn. Each of the n-1 organic thin layers OL1 to OLn-1 may have a thickness greater than that of each of the n inorganic thin layers IOL1 to IOLn.

[0106] Each of the n inorganic thin layers IOL1 to IOLn may have a single-layer structure including one type of material or a multi-layer structure including a plurality of different types of materials. Each of the n-1 organic thin layers OL1 to OLn-1 may be formed by depositing an organic monomer. For example, each of the n-1 organic thin layers OL1 to OLn-1 may be formed using an inkjet printing method or by coating a component containing an acryl-based monomer. In the present exemplary embodiment, the thin film encapsulation layer TFE1 may further include an nth organic thin layer.

[0107] Reference Figure 6B and Figure 6C The inorganic thin layers included in each of the thin film encapsulation layers TFE2 and TFE3 may contain the same inorganic material or inorganic materials different from each other, and may have the same thickness or different thicknesses. The organic thin layers included in each of the thin film encapsulation layers TFE2 and TFE3 may contain the same organic material or organic materials different from each other, and may have the same or different thicknesses.

[0108] like Figure 6B As shown in FIG. 1 , the thin film encapsulation layer TFE2 includes a first inorganic thin layer IOL1 , a first organic thin layer OL1 , a second inorganic thin layer IOL2 , a second organic thin layer OL2 , and a third inorganic thin layer IOL3 which are sequentially stacked.

[0109] The first inorganic thin layer IOL1 may have a double-layer structure. The first sub-layer S1 and the second sub-layer S2 may have different inorganic materials.

[0110] like Figure 6C As shown in , the thin film encapsulation layer TFE2 includes a first inorganic thin layer IOL10, a first organic thin layer OL1, and a second inorganic thin layer IOL20 stacked sequentially. The first inorganic thin layer IOL10 may have a double-layer structure. The first sublayer S10 and the second sublayer S20 may have different inorganic materials. The second inorganic thin layer IOL20 may have a double-layer structure. The second inorganic thin layer IOL20 may include a first sublayer S100 and a second sublayer S200 deposited in different environments from each other. The first sublayer S100 may be deposited at a low power level, and the second sublayer S200 may be deposited at a high power level. The first sublayer S100 and the second sublayer S200 may include the same inorganic material.

[0111] Fig. 7Ais a cross-sectional view showing a touch sensor layer according to an exemplary embodiment of the present disclosure.

[0112] Reference Fig. 7A , the touch sensor layer TS includes a first conductive layer TS-CL1, a first insulating layer (hereinafter, referred to as a "first touch insulating layer") TS-IL1, a second conductive layer TS-CL2, and a second insulating layer (hereinafter, referred to as a "second touch insulating layer") TS-IL2. The first conductive layer TS-CL1 is directly disposed on the thin film encapsulation layer TFE, but the present invention should not be limited to or thereby. That is, another inorganic layer (e.g., a buffer layer, not shown) may be further disposed between the first conductive layer TS-CL1 and the thin film encapsulation layer TFE.

[0113] Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 has a single-layer structure or a multilayer structure in which multiple layers are stacked in the third direction DR3. The conductive layer having the multilayer structure includes two or more layers of a transparent conductive layer and a metal layer. The conductive layer having the multilayer structure includes a metal layer containing metals different from each other. The transparent conductive layer includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires or graphene. The metal layer includes molybdenum, silver, titanium, copper, aluminum or an alloy thereof.

[0114] Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, the first conductive layer TS-CL1 includes a first conductive pattern, and the second conductive layer TS-CL2 includes a second conductive pattern. Each of the first conductive pattern and the second conductive pattern includes a touch electrode and a touch signal line.

[0115] The first touch insulating layer TS-IL1 includes an inorganic material or an organic material. The inorganic material includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0116] The second touch insulating layer TS-IL2 has a single layer structure or a multi-layer structure. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin and perylene resin.

[0117] Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 has a single layer structure or a multi-layer structure. The first touch insulating layer TS-IL1 includes at least one of an inorganic layer and an organic layer. The second touch insulating layer TS-IL2 includes at least one organic layer. The inorganic layer and the organic layer are formed by a chemical vapor deposition method.

[0118] If the first touch insulating layer TS-IL1 insulates the first conductive layer TS-CL1 from the second conductive layer TS-CL2, the first touch insulating layer TS-IL1 should not be limited to a specific shape. The shape of the first touch insulating layer TS-IL1 is determined according to the shapes of the first conductive pattern and the second conductive pattern. The first touch insulating layer TS-IL1 completely covers the thin film encapsulation layer TFE or includes a plurality of insulating patterns. The insulating pattern overlaps the first connection portion CP1 and the second connection portion CP2 described later.

[0119] In the present exemplary embodiment, although a two-layer touch sensor layer has been described, the touch sensor layer should not be limited to the two-layer type. The single-layer touch sensor layer includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes a touch sensor and a touch signal line connected to the touch sensor. The single-layer touch sensor layer acquires coordinate information using a self-capacitance method.

[0120] FIG. 7B to FIG. 7E A plan view of a touch sensor layer according to an exemplary embodiment of the present disclosure is shown.

[0121] Reference Figure 7B The touch sensor layer TS includes first touch electrodes TE1-1 to TE1-4, first touch signal lines SL1-1 to SL1-4 connected to the first touch electrodes TE1-1 to TE1-4, second touch electrodes TE2-1 to TE2-5, second touch signal lines SL2-1 to SL2-5 connected to the second touch electrodes TE2-1 to TE2-5, and pad portions PADa connected to the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5. Figure 7B The touch sensor layer TS configured to include four first touch electrodes TE1-1 to TE1-4 and five second touch electrodes TE2-1 to TE2-5 is shown, but the number of the first touch electrodes and the number of the second touch electrodes should not be limited thereto or thereby.

[0122] Each of the first touch electrodes TE1-1 to TE1-4 has a grid shape defining a plurality of touch openings. Each of the first touch electrodes TE1-1 to TE1-4 includes a plurality of first touch sensor portions SP1 and a plurality of first connection portions CP1. The first touch sensor portions SP1 are arranged in a first direction DR1. Each of the first connection portions CP1 connects two first touch sensor portions SP1 adjacent to each other among the first touch sensor portions SP1. Although not shown in detail, the first touch signal lines SL1-1 to SL1-4 may have a grid shape.

[0123] The second touch electrodes TE2-1 to TE2-5 are insulated from the first touch electrodes TE1-1 to TE1-4, while crossing the first touch electrodes TE1-1 to TE1-4. Each of the second touch electrodes TE2-1 to TE2-5 has a mesh shape through which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-5 includes a plurality of second touch sensor portions SP2 and a plurality of second connection portions CP2. The second touch sensor portions SP2 are arranged in the second direction DR2. Each of the second connection portions CP2 connects two second touch sensor portions SP2 adjacent to each other in the second touch sensor portions SP2. Although not shown in detail, the second touch signal lines SL2-1 to SL2-5 may have a mesh shape.

[0124] The first touch electrodes TE1-1 to TE1-4 are capacitively coupled to the second touch electrodes TE2-1 to TE2-5. When a touch sensing signal is applied to the first touch electrodes TE1-1 to TE1-4, a capacitor is formed between the first touch sensor portion SP1 and the second touch sensor portion SP2.

[0125] The first touch sensor section SP1, the first connection section CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor section SP2, the second connection section CP2, and a portion of the second touch signal lines SL2-1 to SL2-5 are connected by Fig. 7A The first conductive layer TS-CL1 shown in FIG. 1 is patterned to form the first touch sensor portion SP1, the first connection portion CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portion SP2, the second connection portion CP2, and the other portions of the second touch signal lines SL2-1 to SL2-5 are formed by using Fig. 7A The second conductive layer TS-CL2 shown in FIG. 1 is formed by patterning.

[0126] In order to electrically connect the conductive patterns arranged on different layers, it is possible to pass through Fig. 7A The first touch insulating layer TS-IL1 shown in FIG. 1 is used to form a contact hole. FIG. 7C to FIG. 7E The touch sensor layer TS is described.

[0127] Reference Figure 7C , the first conductive pattern is disposed on the thin film encapsulation layer TFE. The first conductive pattern includes a second connection portion CP2. The second connection portion CP2 is directly disposed on the thin film encapsulation layer TFE. Fig.7D , a first touch insulating layer TS-IL1 is disposed on the thin film encapsulation layer TFE to cover the second connection part CP. A contact hole CH is defined by the first touch insulating layer TS-IL1 to partially expose the second connection part CP2. The contact hole CH is formed by a photolithography process.

[0128] Reference Fig. 7E , the second conductive pattern is disposed on the first touch insulating layer TS-IL1. The second conductive pattern includes the first touch sensor portion SP1, the first connection portion CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portion SP2, and the second touch signal lines SL2-1 to SL2-5. Although not shown separately, the second touch insulating layer TS-IL2 is further disposed on the first touch insulating layer TS-IL1 to cover the second conductive pattern. The second touch insulating layer TS-IL2 will be described in detail later.

[0129] According to another exemplary embodiment of the present disclosure, the first conductive pattern includes first touch electrodes TE1-1 to TE1-4 and first touch signal lines SL1-1 to SL1-4. The second conductive pattern includes second touch electrodes TE2-1 to TE2-5 and second touch signal lines SL2-1 to SL2-5. In this case, the contact hole CH is not defined in the first touch insulating layer TS-IL1.

[0130] In addition, according to another exemplary embodiment of the present disclosure, the first conductive pattern and the second conductive pattern may be exchanged with each other. That is, the second conductive pattern may include the second connection portion CP2.

[0131] Figure 7F It shows Fig. 7E A local enlarged view of area BB.

[0132] Reference Figure 7F , the first touch sensor portion SP1 overlaps the non-light emitting area NPXA. The first touch sensor portion SP1 includes a plurality of first extension portions SP1-A extending along a sixth direction DR6 crossing the first direction DR1 and the second direction DR2, and a plurality of second extension portions SP1-B extending along a seventh direction DR7 crossing the sixth direction DR6. The first extension portions SP1-A and the second extension portions SP1-B may be defined as grid lines. Each grid line has a line width of several micrometers.

[0133] The first extension portion SP1-A is connected to the second extension portion SP1-B to define a plurality of touch openings TS-OP. In other words, the first touch sensor portion SP1 has a grid shape defined by the touch openings TS-OP. The touch openings TS-OP correspond to the light emitting areas PXA one-to-one, but they should not be limited thereto or thereby. That is, one touch opening TS-OP may correspond to two or more light emitting areas PXA.

[0134] The light emitting area PXA may have various sizes. For example, among the light emitting areas PXA, the size of the light emitting area PXA emitting blue light may be different from the size of the light emitting area PXA emitting red light. Therefore, the touch opening TS-OP may have various sizes. Figure 7F In the embodiment, the light emitting areas PXA have various sizes, but the light emitting areas PXA may all have the same size, and the touch openings OP may all have the same size.

[0135] FIG. 8A to FIG. 8D is a cross-sectional view showing a display device according to an exemplary embodiment of the present disclosure. For ease of explanation, FIG. 8A to FIG. 8D Shown corresponding to Figure 4B In the following, reference will be made to FIG. 8A to FIG. 8D The display device according to various embodiments of the present disclosure is described in detail. FIG. 8A to FIG. 8D In the figure, the same reference numerals denote Figures 1A to 7F The same elements as the elements in , therefore, detailed description of the same elements will be omitted.

[0136] Reference FIG. 8A to FIG. 8D The display device includes a base member BSM, a circuit layer DP-CL, a display layer DP-OLED, a thin film encapsulation layer TFE and a touch sensor layer TS.

[0137] The base member BSM includes a first area AR1 and a second area AR2. The first area AR1 includes a first sub-area AR1-1 and a second sub-area AR1-2. The first area AR1 includes a display area and a non-display area. The first sub-area AR1-1 corresponds to the display area. The second sub-area AR1-2 corresponds to the first non-display area. The second area AR2 corresponds to the second non-display area. The second area AR2 may correspond to the outermost area of ​​the display device.

[0138] The base member BSM includes a base layer SUB and a buffer layer BFL.

[0139] The base layer SUB may be a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic hybrid material substrate. The plastic substrate includes at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. The buffer layer BFL includes an inorganic material. The buffer layer BFL may include silicon oxide or silicon nitride.

[0140] exist FIG. 8A to FIG. 8D In the embodiment, the buffer layer BFL is disposed on the base layer SUB as a functional layer, but a barrier layer may also be disposed as a functional layer. According to another exemplary embodiment, the buffer layer BFL may be omitted from the display device.

[0141] exist FIG. 8A to FIG. 8D In the embodiment, the second area AR2 has a planar shape, but the second area AR2 may be curved with a constant curvature in the third direction DR3.

[0142] The circuit layer DP-CL is disposed on the base member BSM. The circuit layer DP-CL covers the first area AR1 and exposes the second area AR2. The circuit layer DP-CL covers the first sub-area AR1-1 and the second sub-area AR1-2. The circuit layer DP-CL exposes the second area AR2.

[0143] The circuit layer DP-CL includes a thin film transistor TR, conductive lines E-VSS and CL, and at least one insulating layer.

[0144] The semiconductor pattern OSP of the thin film transistor TR is disposed on the base layer SUB. The semiconductor pattern OSP includes amorphous silicon, polycrystalline silicon or a metal oxide semiconductor. The insulating layer includes a first insulating layer 10 and a second insulating layer 20. The end of the first insulating layer 10 and the end of the second insulating layer 20 are aligned parallel to each other. In other words, one end of the first insulating layer 10 and one end of the second insulating layer 20 are disposed adjacent to the outside of the display device. The end of the circuit layer DP-CL is defined by the end of the first insulating layer 10 and the end of the second insulating layer 20 disposed at the outermost position. The end of the insulating layer defines the boundary between the first area AR1 and the second area AR2. The end of the insulating layer defines the end of the second sub-area AR1-2 and the second area AR2.

[0145] The first insulating layer 10 is disposed on the base layer SUB to cover the semiconductor pattern OSP. The first insulating layer 10 includes an organic layer and / or an inorganic layer. The first insulating layer 10 includes a plurality of inorganic thin layers. The inorganic thin layers include a silicon nitride layer and a silicon oxide layer.

[0146] The control electrode GE of the thin film transistor TR is disposed on the first insulating layer 10. The control electrode GE is connected to the gate line GL (refer to Figure 4A ) is formed by the same photolithography process. The control electrode GE includes the same material and the same stacking structure as the gate line, and is disposed on the same layer as the gate line.

[0147] The second insulating layer 20 is disposed on the first insulating layer 10 to cover the control electrode GE. The second insulating layer 20 includes an organic layer and / or an inorganic layer. The second insulating layer 20 includes a plurality of inorganic thin layers. The inorganic thin layers include a silicon nitride layer and a silicon oxide layer. The second insulating layer 20 includes a material different from that of the first insulating layer 10.

[0148] The input electrode SE and the output electrode DE of the thin film transistor TR are disposed on the second insulating layer 20. The signal line CL and the power supply line E-VSS are disposed on the second insulating layer 20.

[0149] The first dam DM1 and the second dam DM2 are disposed in the second sub-region AR1-2. When viewed in a plan view, the first dam DM1 and the second dam DM2 are disposed to surround the first sub-region AR1-1. When the organic monomer is printed to form the organic thin layer OL1 of the thin film encapsulation layer TFE, the first dam DM1 and the second dam DM2 can prevent the organic monomer from overflowing.

[0150] The first dam portion DM1 is disposed on the power line E-VSS. The first dam portion DM1 has a single-layer structure and is formed substantially simultaneously with the pixel defining layer PDL.

[0151] The second dam portion DM2 is disposed outside the first dam portion DM1. For example, the distance between the second dam portion DM2 and the first sub-region AR1-1 is greater than the distance between the first dam portion DM1 and the first sub-region AR1-1.

[0152] The second dam portion DM2 covers a portion of the power line E-VSS. The second dam portion DM2 includes a plurality of layers, for example, a first layer DM2-L1 and a second layer DM2-L2.

[0153] The third insulating layer 30 is disposed on the second insulating layer 20 to cover the input electrode SE and the output electrode DE. The third insulating layer 30 includes an organic layer and / or an inorganic layer. The third insulating layer 30 includes an organic material to provide a flat surface.

[0154] One of the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30 may be omitted according to the circuit structure of the pixel. The second insulating layer 20 and the third insulating layer 30 may be referred to as an "intermediate layer". The intermediate layer is disposed between conductive patterns (e.g., upper conductive patterns and lower conductive patterns) to insulate the conductive patterns from each other.

[0155] The display layer DP-OLED is disposed on the third insulating layer 30. The pixel defining layer PDL and the organic light emitting diode OLED are disposed on the third insulating layer 30. The first electrode AE ​​is disposed on the third insulating layer 30. The first electrode AE ​​is connected to the output electrode DE through a contact hole defined by the third insulating layer 30. The light emitting area is defined in the pixel defining layer PDL. At least a portion of the first electrode AE ​​is exposed through the light emitting area of ​​the pixel defining layer PDL.

[0156] The light emitting unit EU is disposed on the first electrode AE. The second electrode CE is disposed on the light emitting unit EU. Although not shown in the figure, the light emitting unit EU may include Figure 5C The hole control layer HCL, the organic light emitting layer EML and the electron control layer ECL are shown in FIG.

[0157] The connection electrode E-CNT is disposed on the same layer as the first electrode AE. The first electrode AE ​​and the connection electrode E-CNT are disposed on the third insulating layer 30. The first electrode AE ​​and the connection electrode E-CNT are formed by the same process. The connection electrode E-CNT is electrically connected to the power line E-VSS. The connection electrode E-CNT receives a second voltage ELVSS (refer to Figure 5A Although not shown in the figure, the connection electrode E-CNT is disposed to partially overlap the first layer DM2 - L1 of the second dam portion DM2 .

[0158] In the present exemplary embodiment, the thin film encapsulation layer TFE directly covers the second electrode CE. In the present exemplary embodiment, the cover layer may be further arranged to cover the second electrode CE. In this case, the thin film encapsulation layer TFE directly covers the cover layer. The thin film encapsulation layer TFE includes a first inorganic thin layer IOL10, a first organic thin layer OL1, and a second inorganic thin layer IOL20 stacked sequentially, but the thin film encapsulation layer TFE should not be limited thereto or thereby. The thin film encapsulation layer TFE may include a plurality of inorganic thin layers and a plurality of organic thin layers.

[0159] The end portion of the thin film encapsulation layer TFE is disposed on the first area AR1. The end portion of the thin film encapsulation layer TFE is disposed closer to the center of the display device than the ends of the first and second insulating layers 10 and 20.

[0160] The touch sensor layer TS is disposed on the thin film encapsulation layer TFE. The touch sensor layer TS includes a first touch insulating layer TS-IL1, a plurality of conductive patterns disposed on the first touch insulating layer TS-IL1, and a second touch insulating layer TS-IL2 disposed on the conductive patterns. The conductive patterns include a touch sensor portion SP disposed in the first sub-region AR1-1 and a touch signal line SL disposed in the second sub-region AR1-2.

[0161] The touch sensor portion SP corresponds to 7A to 7F The touch signal line SL corresponds to the first touch sensor section SP1 and the second touch sensor section SP2 shown in FIG. Fig. 7A and Figure 7F , and the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5 shown in FIG. Although not shown in the figure, the conductive pattern may further include a pattern disposed between the first touch insulating layer TS-IL1 and the thin film encapsulation layer TFE. Hereinafter, repeated descriptions about the touch sensor part SP and the touch signal lines SL will be omitted.

[0162] The end of the first touch insulating layer TS-IL1 is disposed in the first area AR1. The end of the first touch insulating layer TS-IL1 is disposed in the second sub-area AR1-2. The end of the first touch insulating layer TS-IL1 is aligned parallel to the end of the thin film encapsulation layer TFE. The end of the first touch insulating layer TS-IL1 is disposed closer to the center of the display device than the ends of the first insulating layer 10 and the second insulating layer 20.

[0163] The second touch insulating layer TS-IL2 includes an organic material. Hereinafter, for ease of explanation, the second touch insulating layer TS-IL2 is referred to as an "organic layer". The organic layer TS-IL2 overlaps the first sub-region AR1-1 and the second sub-region AR1-2. The organic layer TS-IL2 overlaps at least a portion of the second region AR2. The organic layer TS-IL2 covers the second region AR2. The organic layer TS-IL2 is disposed to directly contact the upper portion of the touch sensor layer TS. The organic layer TS-IL2 directly contacts the first touch insulating layer TS-IL1 and the conductive pattern disposed on the first touch insulating layer TS-IL1 and covers the first touch insulating layer TS-IL1 and the conductive pattern disposed on the first touch insulating layer TS-IL1. The organic layer TS-IL2 directly contacts a portion of the first touch insulating layer TS-IL1 and covers the touch sensor portion SP and the touch signal line SL disposed on the first touch insulating layer TS-IL1.

[0164] The organic layer TS-IL2 overlaps the entire surface of the insulating layer. The organic layer TS-IL2 completely overlaps the first insulating layer 10 and the second insulating layer 20. Fig. 8A When viewed in the plan view shown in , the organic layer TS-IL2 completely overlaps the second area AR2 to cover the end of the display device. As another example, when FIG. 8B to FIG. 8D The organic layer TS-IL2 may overlap a portion of the second area AR2 when viewed in the plan view shown. The organic layer TS-IL2 may be disposed to cover end portions of the thin film encapsulation layer TFE and the touch sensor layer TS.

[0165] Although not shown in the figure, the pad portion PD (see Figure 4A ) and control signal line SL-D (refer to Figure 4A ) can be set in FIG. 8A to FIG. 8D The pad portion PD is disposed in the area shown in FIG. 1 and is disposed in other areas of the outermost portion of the display panel DP. The pad portion PD is disposed to overlap with the second area AR2. In this case, the organic layer TS-IL2 may be disposed not to overlap with the pad portion PD. The organic layer TS-IL2 may expose the pad portion PD. The exposed pad portion PD may be easily electrically connected to an external electrical component.

[0166] Reference Figure 8B The display device may further include a shock absorbing member disposed on the second area AR2 of the base layer SUB. The shock absorbing member is disposed on the second area AR2 of the base layer SUB. The shock absorbing member includes a plurality of insulating patterns DM-CP. The shock absorbing member absorbs shock generated outside the display device to prevent fracture in the insulating layer.

[0167] The insulating patterns DM-CP are arranged in the first direction DR1 and are spaced apart from each other. In the present exemplary embodiment, the bending axis of the second area AR2 is defined along the second direction DR2. The insulating patterns DM-CP are spaced apart from each other in the first direction DR1 and extend in the second direction DR2. The insulating patterns DM-CP extend in a direction parallel to the bending axis and are spaced apart from each other in a direction intersecting the bending axis, so that the influence exerted on the display device by the insulating patterns DM-CP can be reduced.

[0168] The organic layer TS-IL2 covers the side surface and the upper surface of the impact absorbing member. The organic layer TS-IL2 covers the insulating patterns DM-CP of the impact absorbing member. A space is defined between the insulating patterns DM-CP. The insulating patterns DM-CP are spaced apart from each other at regular intervals, but the interval between the insulating patterns DM-CP may not be constant. The organic layer TS-IL2 may be filled into the space between the insulating patterns DM-CP. The organic layer TS-IL2 has a thickness equal to or greater than that of the insulating pattern DM-CP to completely cover the insulating pattern DM-CP.

[0169] Each of the insulating patterns DM-CP includes a first layer DM-C1 and a second layer DM-C2. The first layer DM-C1 and the second layer DM-C2 may be sequentially stacked. The first layer DM-C1 has the same thickness as the first insulating layer 10. The second layer DM-C2 has the same thickness as the second insulating layer 20.

[0170] The insulating pattern DM-CP includes the same material as the first insulating layer 10 and the second insulating layer 20. The first layer DM-C1 includes the same material as the first insulating layer 10. The second layer DM-C2 includes the same material as the second insulating layer 20. The first layer DM-C1 and the first insulating layer 10 are formed by the same process, and the second layer DM-C2 and the second insulating layer 20 are formed by the same process.

[0171] Reference Figure 8C , the impact absorbing member DM-C may further include a covering member DM-CC covering the insulating pattern DM-CP. The covering member DM-CC covers the entire surface of the insulating pattern DM-CP to prevent foreign matter from contacting the insulating pattern DM-CP. The covering member DM-CC overlaps the second region. The covering member DM-CC partially overlaps the first region. The covering member DM-CC partially overlaps the second sub-region AR1-2.

[0172] The organic layer TS-IL2 covers the side and upper surfaces of the cover member DM-CC. Since the organic layer TS-IL2 covers the side and upper surfaces of the cover member DM-CC, the organic layer TS-IL2 may completely cover the shock absorbing member DM-C without exposing the shock absorbing member DM-C.

[0173] Reference Fig.8D According to the present exemplary embodiment, the buffer layer BFL of the display device includes a first buffer portion BFL-A and a second buffer portion BFL-B. The first buffer portion BFL-A is spaced apart from the second buffer portion BFL-B. At least one opening BFL-OP is defined between the first buffer portion BFL-A and the second buffer portion BFL-B.

[0174] The first buffer portion BFL-A is disposed in the second area AR2. The first buffer portion BFL-A overlaps the second area AR2. An opening BFL-OP is defined in the second area AR2. The opening BFL-OP has a predetermined width in the first direction DR1 and extends in the second direction DR2.

[0175] The organic layer TS-IL2 is filled in the opening BFL-OP. Since the organic layer TS-IL2 is filled in the opening BFL-OP, the organic layer TS-IL2 covers the exposed side surfaces of the first and second buffer parts BFL-A and BFL-B.

[0176] The organic layer TS-IL2 according to the present exemplary embodiment covers the components causing the step difference on the base member BSM. Fig. 8A The end of the circuit layer DP-CL causing the step difference on the base member BSM as shown in FIG. Figure 8B and Figure 8C In addition, the organic layer TS-IL2 covers the impact absorbing member DM-C shown in FIG. Fig.8D The opening BFL-OP defined by the base member BSM shown in FIG. 1 can therefore cover the concave step difference.

[0177] In the present exemplary embodiment, the organic layer TS-IL2 disposed on the touch sensor layer TS covers the second area AR2 which is the outermost portion of the display module DM, and thus, fracture can be prevented from occurring in the outer portion. Specifically, in the case where the impact absorbing member DM-C is disposed in the second area AR2 or the opening BFL-OP of the buffer layer BFL is defined in the second area AR2, the organic layer TS-IL2 covers the impact absorbing member CM-C or fills in the opening BFL-OP to relieve stress generated when the display device is bent, and thus, fracture can be prevented from occurring in the outer portion.

[0178] Hereinafter, a method of manufacturing a display device will be described in detail.

[0179] FIG. 9A to FIG. 9I It shows the manufacturing Figure 8C A cross-sectional view of a method of displaying a module is shown in FIG.

[0180] Reference Fig.9A and Fig. 9B , prepare a base layer SUB. A functional layer such as a buffer layer BFL may be further provided on one surface of the base layer SUB. A semiconductor pattern OSP is formed at least on the base layer SUB, and a first insulating layer 10 is formed on the base layer SUB to cover the semiconductor pattern OSP.

[0181] Reference Fig. 9C , a control electrode GE is formed on the first insulating layer 10. The control electrode GE is formed to be disposed on the semiconductor pattern OSP. The control electrode GE is formed by a photolithography process. The second insulating layer 20 is formed to cover the control electrode GE formed on the first insulating layer 10. An end portion of the first insulating layer 10 and an end portion of the second insulating layer 20 are aligned parallel to each other. As another example, each of the first insulating layer 10 and the second insulating layer 20 may be formed to completely overlap with the base layer SUB.

[0182] Reference Fig.9D, a manufacturing method of a display device includes etching a portion of a first insulating layer 10 and a second insulating layer 20. In the etching process, the outer portions of the first insulating layer 10 and the second insulating layer 20 are partially etched to form an insulating pattern DM-CP. The insulating pattern DM-CP includes a first layer DM-C1 and a second layer DM-C2. The first layer DM-C1 is formed by etching a portion of the first insulating layer 10, and the second layer DM-C2 is formed by etching a portion of the second insulating layer 20. In the etching process, a through hole TH1 is formed by etching the first insulating layer 10 and the second insulating layer 20 to expose a portion of the semiconductor pattern OSP. The insulating pattern DM-CP may be formed substantially simultaneously with the first insulating layer 10 and the second insulating layer 20 forming the circuit layer DP-CL using one mask. Therefore, the manufacturing time may be shortened, and the manufacturing cost may be reduced.

[0183] Reference Fig.9E , an output electrode DE, an input electrode SE, a signal line CL, and a power line E-VSS are formed on the second insulating layer 20. A third insulating layer 30 is formed over the second insulating layer 20 to cover the thin film transistor TR and the signal line CL. The third insulating layer 30 is formed to completely overlap the first insulating layer 10 and the second insulating layer 20 and patterned. In this case, a second dam portion DM2 (refer to Figure 8C ) and a cover member DM-CC of the impact absorbing member DM-C. The first layer DM2-L1 of the second dam portion is formed to overlap with a portion of the power line E-VSS. The third insulating layer 30, the first layer DM2-L1 of the second dam portion, and the cover member DM-CC include the same material. In the etching process, a through hole TH2 is formed through the third insulating layer 30 to expose a portion of the input electrode SE.

[0184] Reference Fig.9F , forming a first electrode AE ​​connected to one of the output electrode DE and the connection electrode E-CNT. The first electrode AE ​​and the connection electrode E-CNT are formed on the same layer. The first electrode AE ​​and the connection electrode E-CNT are formed on the third insulating layer 30. The first electrode AE ​​is connected to the thin film transistor TR through the third insulating layer 30.

[0185] The connection electrode E-CNT is electrically connected to the power line E-VSS. The connection electrode E-CNT receives a second voltage ELVSS (refer to Figure 5A Although not shown in the figure, the connection electrode E-CNT is formed to be partially disposed on the first layer DM2 - L1 of the second dam portion DM2 .

[0186] The light emitting unit EU, the pixel defining layer PDL, and the second electrode CE are formed on the third insulating layer 30. The light emitting unit EU is formed between the first electrode AE ​​and the second electrode CE. In the process of forming the pixel defining layer PDL, a first dam portion DM1 overlapping the power line E-VSS and a second layer DM2-L2 overlapping the first layer DM2-L1 of the second dam portion DM2 are formed. The pixel defining layer PDL, the first dam portion DM1, and the second layer DM2-L2 may be formed by the same material and may include the same material.

[0187] Reference Figure 9G , a thin film encapsulation layer TFE is formed on the display layer DP-OLED. The thin film encapsulation layer TFE is formed by sequentially forming a first inorganic thin layer IOL10, a first organic thin layer OL1, and a second inorganic thin layer IOL20. The first organic thin layer OL1 is formed by providing a liquid organic monomer on the first inorganic thin layer IOL10. The organic monomer does not flow out of the first dam portion DM1 and the second dam portion DM2 through the first dam portion DM1 and the second dam portion DM2, and therefore, the organic monomer is stably formed to have a predetermined thickness.

[0188] Reference Figure 9H A first touch insulating layer TS-IL1 and a conductive pattern are formed on the thin film encapsulation layer TFE. A first touch insulating layer TS-IL1 is formed on the thin film encapsulation layer TFE, and a signal line SL and a touch sensor portion SP are formed on the first touch insulating layer TS-IL1. A touch sensor portion SP is formed on the first sub-region AR1-1, and a signal line SL is formed on the second sub-region AR1-2.

[0189] Reference Fig.9I , an organic layer TS-IL2 is formed on the first touch insulating layer TS-IL1. The organic layer TS-IL2 is formed on the first touch insulating layer TS-IL1 to completely cover the conductive pattern.

[0190] The organic layer TS-IL2 is formed to completely overlap the first insulating layer 10 and the second insulating layer 20. The organic layer TS-IL2 is formed to overlap the first sub-region AR1-1, the second sub-region AR1-2, and the second region AR2.

[0191] The organic layer TS-IL2 is formed to cover the impact absorbing member DM-C formed on the second area AR2. The organic layer TS-IL2 completely covers the circuit layer DP-CL and extends from the touch sensor layer TS to cover the side surface and the upper surface of the impact absorbing member DM-C. As described above, since the organic layer TS-IL2 covers the impact absorbing member DM-C that is disposed at the outermost position and causes a step difference on the base member BSM, stress generated when the display device is bent can be relieved. Therefore, fracture can be prevented from occurring in the outer portion.

[0192] Although specific exemplary embodiments and implementations have been described herein, other embodiments and changes will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but on the contrary, the inventive concept is the larger scope of the provided claims and various obvious modifications and equivalent arrangements.

Claims

1. A display device, comprising: A base component, comprising a first region and a second region; a circuit layer disposed on the base member in the first region; a protective member including a plurality of insulating patterns disposed on the base member in the second region and a covering member covering the plurality of insulating patterns; A display layer, disposed on the circuit layer; as well as an insulating layer disposed on the display layer and covering the protective member, The covering member extends from the second region to cover only an edge portion of the circuit layer in the first region, the insulating layer extends further than the edge portion of the circuit layer to cover the protection member, and the insulating layer covers the upper surface and side surfaces of the covering member. 2 . The display device of claim 1 , further comprising a conductive pattern disposed on the display layer and configured to sense an external input.

3. The display device according to claim 2, further comprising a thin film encapsulation layer disposed between the display layer and the conductive pattern, wherein: The conductive pattern is directly disposed on the thin film encapsulation layer.

4. The display device according to claim 2, further comprising: a thin film encapsulation layer, disposed between the display layer and the conductive pattern; as well as A touch insulating layer is disposed between the thin film encapsulation layer and the conductive pattern, Wherein, the conductive pattern is directly arranged on the touch insulating layer.

5. The display device according to claim 4, wherein: An end of the touch insulating layer is aligned in parallel with an end of the thin film encapsulation layer.

6. The display device according to claim 2, wherein: The conductive pattern is disposed between the display layer and the insulating layer.

7. The display device according to claim 1, wherein: The plurality of insulation patterns are spaced apart from each other in a first direction, and one region of the base member where the plurality of insulation patterns are disposed is bent based on an axis extending in a second direction crossing the first direction.

8. The display device according to claim 1, wherein: The cover member covers an upper surface and a side surface of each of the plurality of insulation patterns.

9. The display device according to claim 1, wherein: The cover member fills in each space between the plurality of insulation patterns.

10. The display device according to claim 1, wherein: A portion of the covering member covers a portion of the circuit layer.

11. The display device according to claim 1, wherein: The insulating layer covers an end portion of the circuit layer, an end portion of the display layer, and an end portion of the protection member.

12. The display device according to claim 1, wherein: A maximum thickness of the insulating layer is thicker than a maximum thickness of the protection member.

13. The display device according to claim 1, wherein: Each of the plurality of insulation patterns includes a first layer and a second layer disposed on the first layer.

14. The display device according to claim 1, wherein: The protection member and the circuit layer do not overlap each other when viewed in a plan view.

15. A display device, comprising: A base component, comprising a first region and a second region; a circuit layer disposed on the base member in the first region; a protection member including a plurality of insulating patterns disposed on the base member in the second region and a covering member covering the plurality of insulating patterns; A display layer, disposed on the circuit layer; A thin film encapsulation layer, disposed on the display layer; as well as a touch sensor layer disposed on the thin film encapsulation layer, and the touch sensor layer includes a conductive pattern and an insulating layer covering the protection member, The covering member extends from the second region to cover only an edge portion of the circuit layer in the first region, and the insulating layer covers an upper surface and a side surface of the covering member.

16. The display device according to claim 15, wherein: When viewed in a plan view, the protection member is spaced apart from the circuit layer.

17. A display device, comprising: A base component, comprising a first region and a second region disposed adjacent to the first region, wherein the first region comprises a first sub-region and a second sub-region surrounding the first sub-region; a circuit layer disposed on the base member to cover the first area and expose the second area; a display layer, disposed on the circuit layer and configured to display an image, and overlapping the first sub-region; a thin film encapsulation layer, disposed on the display layer and encapsulating the display layer; a touch sensor layer, comprising a conductive pattern disposed on the thin film encapsulation layer and an organic layer covering the conductive pattern; as well as a shock absorbing member disposed on the second region, The organic layer extends from a region overlapping the thin film encapsulation layer to cover an end of the thin film encapsulation layer, both an upper surface and a side surface of the impact absorbing member, and at least a portion of the second region.

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