Capacitor assembly, circuit board assembly and display device

Abstract

The present application provides a capacitor assembly, a circuit board assembly and a display device. The capacitor assembly includes: a capacitor, the capacitor includes a dielectric part, a first electrode and a second electrode, the first electrode wraps one end of the dielectric part, the second electrode wraps the other end of the dielectric part, and the second electrode is arranged opposite to the first electrode, the second electrode, the first electrode and the dielectric part together form a first accommodating space; and a first vibration damper, the first vibration damper is arranged in the first accommodating space, and the first vibration damper is fixedly connected to the dielectric part. The capacitor assembly provided in the present application can reduce the vibration amplitude and frequency of the capacitor by the first vibration damper to suppress or even eliminate the howling generated during the operation of the capacitor.

Description

Technical Field

[0001] The present application relates to the field of display panels, and in particular to a capacitor assembly, a circuit board assembly and a display device. Background Art

[0002] With the advancement of technology, electronic devices with display devices have become daily necessities in people's lives. Display devices will make a "chirping" sound during operation, and this phenomenon is called "howling". One of the reasons for the "howling" is the vibration of the capacitor. It can be seen that due to the existence of "howling", the quality of the display device in the related art is not high. Summary of the invention

[0003] In a first aspect, the present application provides a capacitor assembly, comprising a capacitor and a first vibration damper, wherein the capacitor comprises a dielectric portion, a first electrode and a second electrode, wherein the first electrode wraps one end of the dielectric portion, the second electrode wraps the other end of the dielectric portion, and the second electrode is arranged opposite to the first electrode, the second electrode, the first electrode and the dielectric portion together form a first accommodating space, the first vibration damper is arranged in the first accommodating space, and the first vibration damper is fixedly connected to the dielectric portion.

[0004] A second accommodating space is provided inside the first electrode, and the second accommodating space and the first accommodating space are both located on the same side of the dielectric part. The capacitor assembly also includes a second vibration damper, which is provided in the second accommodating space and abuts against the dielectric part and the first electrode.

[0005] Among them, a third accommodating space is provided inside the first electrode, and the third accommodating space is provided on the side of the dielectric part away from the first vibration damping member, and the third accommodating space is far away from the second electrode relative to the second accommodating space. The capacitor component also includes a third vibration damping member, and the third vibration damping member is provided in the third accommodating space, and the third vibration damping member abuts against the dielectric part and the first electrode.

[0006] A fourth accommodating space is provided inside the first electrode, and the fourth accommodating space is provided on a side of the dielectric portion away from the second electrode. The capacitor assembly also includes a fourth vibration damper, and the fourth vibration damper is provided in the fourth accommodating space, and the fourth vibration damper abuts against the dielectric portion and the first electrode.

[0007] A fifth accommodating space is provided inside the second electrode, and the fifth accommodating space is provided on the side of the dielectric part facing the first vibration damper. The capacitor assembly also includes a fifth vibration damper, and the fifth vibration damper is provided in the fifth accommodating space, and the fifth vibration damper abuts against the dielectric part and the second electrode.

[0008] Among them, a sixth accommodating space is provided inside the second electrode, the sixth accommodating space is provided on the side of the dielectric portion away from the first vibration damping member, and the sixth accommodating space is far away from the first electrode relative to the fifth accommodating space, and the capacitor component also includes a sixth vibration damping member, the sixth vibration damping member is provided in the sixth accommodating space, and the sixth vibration damping member abuts against the dielectric portion and the second electrode.

[0009] A seventh accommodating space is provided inside the second electrode, and the seventh accommodating space is provided on a side of the dielectric portion away from the first electrode. The capacitor assembly also includes a seventh vibration damper, and the seventh vibration damper is provided in the seventh accommodating space, and the seventh vibration damper abuts against the dielectric portion and the second electrode.

[0010] There is a gap between the first vibration dampening member and the first electrode, and there is a gap between the first vibration dampening member and the second electrode.

[0011] In a second aspect, the present application further provides a circuit board assembly, which includes a circuit board and a capacitor assembly as described in the first aspect, wherein the capacitor assembly is electrically connected to the circuit board.

[0012] In a third aspect, the present application further provides a display device, comprising a display panel and a circuit board assembly as described in the second aspect, wherein the circuit board assembly is electrically connected to the display panel.

[0013] The capacitor assembly provided in the first aspect of the present application includes a capacitor and a first vibration damper. The capacitor includes a dielectric part, a first electrode and a second electrode, a first accommodating space is formed between the first electrode, the second electrode and the dielectric part, the first vibration damper is arranged in the first accommodating space, and the first vibration damper is fixedly connected to the dielectric part. Since the first vibration damper is fixedly connected to the dielectric part of the capacitor, the vibration amplitude and frequency of the capacitor are reduced. In addition, when the capacitor is working, the vibration of the capacitor will drive the first vibration damper to vibrate together, thereby transferring the deformation generated by the vibration of the capacitor to the air in the first accommodating space, and the air in the first accommodating space is repeatedly compressed and released with the vibration of the first vibration damper. In this process, friction occurs between the air and the first vibration damper and the air molecules themselves, which will form a damping force on the vibration of the first vibration damper, suppressing the amplitude and frequency of the vibration of the first vibration damper. Therefore, the capacitor assembly provided by the present application can reduce the vibration amplitude and frequency of the capacitor through the first vibration damper to suppress or even eliminate the howling generated during the operation of the capacitor. When the capacitor assembly is applied to a display device, the quality of the display device is high.

[0014] The circuit board assembly provided in the second aspect of the present application includes a circuit board and a capacitor assembly as described in the first aspect, wherein the capacitor assembly is applied to the circuit board assembly, and the first vibration dampening member can not only reduce the vibration amplitude and frequency of the capacitor, but also play a buffering role between the capacitor and the circuit board to suppress or even eliminate the resonance between the capacitor and the circuit board, thereby suppressing or even eliminating the howling generated by the capacitor when working on the circuit board.

[0015] The display device provided in the third aspect of the present application includes a display panel and a circuit board assembly as described in the second aspect, wherein the circuit board assembly is applied to the display device, and the vibration amplitude and frequency of the capacitor and the circuit board are reduced by the first vibration dampening member, and the resonance between the capacitor and the circuit board is suppressed or even eliminated, thereby suppressing or even eliminating the howling generated by the capacitor when working in the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the structure of a chip multilayer capacitor in the related art.

[0018] Figure 2 It is a schematic diagram of vibration of a chip multilayer capacitor in the related art.

[0019] Figure 3 A schematic structural diagram of a capacitor assembly provided in the first embodiment of the present application.

[0020] Figure 4 A schematic structural diagram of a capacitor assembly provided in the second embodiment of the present application.

[0021] Figure 5 for Figure 4 A schematic structural diagram of a second vibration damping member disposed in a second accommodating space in a capacitor assembly provided in an embodiment.

[0022] Figure 6 A schematic structural diagram of a capacitor assembly provided in the third embodiment of the present application.

[0023] Figure 7 for Figure 6 A schematic structural diagram of a third vibration damping member disposed in a third accommodating space in a capacitor assembly provided in an embodiment.

[0024] Figure 8This is a schematic structural diagram of a capacitor assembly provided in the fourth embodiment of the present application.

[0025] Fig. 9 for Figure 8 A schematic structural diagram of a fourth vibration damping member disposed in a fourth accommodating space in a capacitor assembly provided in an embodiment.

[0026] Fig.10 This is a schematic structural diagram of a capacitor assembly provided in the fifth embodiment of the present application.

[0027] Fig.11 for Fig.10 A schematic structural diagram of a fifth vibration damping member disposed in a fifth accommodating space in a capacitor assembly provided in an embodiment.

[0028] Fig.12 This is a schematic structural diagram of a capacitor assembly provided in the sixth embodiment of the present application.

[0029] Fig.13 for Fig.12 A schematic structural diagram of a sixth vibration damping member disposed in a sixth accommodating space in a capacitor assembly provided in an embodiment.

[0030] Fig.14 This is a schematic structural diagram of a capacitor assembly provided in the seventh embodiment of the present application.

[0031] Fig.15 for Fig.14 A schematic structural diagram of a seventh vibration damping member disposed in the seventh accommodating space of the capacitor assembly provided in an embodiment.

[0032] Fig.16 A schematic structural diagram of a capacitor assembly provided in the eighth embodiment of the present application.

[0033] Fig.17 It is a schematic diagram of the structure of a circuit board assembly provided in one embodiment of the present application.

[0034] Fig.18 A circuit block diagram of a display device provided in one embodiment of the present application.

[0035] Figure numerals: display device 1; circuit board assembly 10; display panel 20; capacitor assembly 100; circuit board 200; capacitor 110; first vibration damper 120; second vibration damper 130; third vibration damper 140; fourth vibration damper 150; fifth vibration damper 160; sixth vibration damper 170; seventh vibration damper 180; dielectric portion 111; first electrode 112; second electrode 113; first accommodating space 114; gap 115; inner electrode 1111; dielectric 1112; second accommodating space 1121; third accommodating space 1122; fourth accommodating space 1123; fifth accommodating space 1131; sixth accommodating space 1132; seventh accommodating space 1133. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0038] Reference to "embodiment" or "implementation" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] Please refer to Figure 1 and Figure 2 , Figure 1 It is a schematic diagram of the structure of a chip multilayer capacitor in the related art; Figure 2 It is a schematic diagram of the vibration of the chip multilayer capacitor in the related art. The capacitor 110 generally includes the dielectric part 111, the first electrode 112 and the second electrode 113. Among them, the dielectric part 111 includes the inner electrode 1111 and the dielectric 1112. The dielectric 1112 can be but is not limited to ceramic. The capacitor 110 is made of dielectric diaphragms provided with inner electrodes 1111, which are stacked in an offset manner, and a dielectric part 111 in which the inner electrode 1111 is wrapped by the dielectric 1112 after a one-time high-temperature sintering, and then the first electrode 112 and the second electrode 113 are sealed at both ends of the dielectric part 111. When the capacitor 110 is energized, the voltage will generate an electric field on the inner electrode 1111 (such as Figure 2 E1 and E2 in the figure), and the electric field acts on the inner electrode 1111 to form a mechanical force (such as Figure 2The mechanical force generated by the electric field on the inner electrode 1111 causes the inner electrode 1111 to expand and contract slightly (e.g. Figure 2 d), although the expansion and contraction of the inner electrode 1111 is small and changes at the nanometer level, the inner electrode 1111 will expand and contract repeatedly during the power-on process, thereby accelerating the vibration frequency of the capacitor 110, so that the capacitor 110 emits a whistling sound. It should be noted that the expansion and contraction of the inner electrode 1111 is mainly in the stacking direction of the inner electrode 1111, that is, the vibration of the capacitor 110 in the stacking direction of the inner electrode 1111 is the main reason for the capacitor 110 to produce a whistling sound.

[0040] An embodiment of the present application provides a capacitor assembly 100. Please refer to Figure 3 , Figure 3 A schematic diagram of the structure of a capacitor assembly provided in the first embodiment of the present application. The capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112, and the dielectric portion 111 together form a first accommodating space 114. The first vibration damper 120 is disposed in the first accommodating space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111.

[0041] The capacitor 110 provided in one embodiment of the present application is a chip-type multilayer ceramic capacitor (Multi-layer Ceramic Capacitors, MLCC). The capacitor 110 is a static charge storage medium. The capacitor 110 has a wide range of uses and is an indispensable electronic component in the fields of electronics and electricity. The capacitor 110 is mainly used in circuits such as power filtering, signal filtering, signal coupling, resonance, filtering, compensation, charging and discharging, energy storage, and DC isolation.

[0042] The first vibration damper 120 is a deformation damping material, that is, the first vibration damper 120 has good elasticity and toughness, can damp vibration and resist pressure, and can quickly recover to its original shape after deformation, so as to dissipate the energy generated by the vibration of the capacitor 110 into the air through deformation and deformation recovery. For example, the first vibration damper 120 is expanded polypropylene (EPP), expandable polyethylene (EPE) or expanded polystyrene (EPS).

[0043] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. In addition, the EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0044] In this embodiment, the first vibration damper 120 is fixedly connected to the dielectric part 111, which can prevent the first vibration damper 120 from loosening, and is conducive to the first vibration damper 120 to dampen the capacitor 110. For example, the first vibration damper 120 can be fixedly connected to the capacitor 110 by, but not limited to, bonding or welding.

[0045] In this embodiment, the first electrode 112, the second electrode 113 and the dielectric part 111 together form the first accommodating space 114, and the accommodating space is used to accommodate the first vibration damper 120, and the first vibration damper 120 is fixedly connected to the dielectric part 111. The size of the first vibration damper 120 in the direction from the first electrode 112 to the second electrode 113 is larger than the size of the first vibration damper 120 in the direction from the first vibration damper 120 to the capacitor 110, so that the first vibration damper 120 has a larger contact area with the surface of the capacitor 110 facing the first vibration damper 120, which is beneficial for the first vibration damper 120 to damp the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120.

[0046] The capacitor assembly 100 provided in the present application includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112 and a second electrode 113. A first accommodating space 114 is formed between the first electrode 112, the second electrode 113 and the dielectric portion 111. The first vibration damper 120 is disposed in the first accommodating space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. Since the first vibration damper 120 is fixedly connected to the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced. In addition, when the capacitor 110 is working, the vibration of the capacitor 110 will drive the first vibration damper 120 to vibrate together, thereby transferring the deformation generated by the vibration of the capacitor 110 to the air in the first accommodating space 114. In addition, the air in the first accommodating space 114 is repeatedly compressed and released as the first vibration damper 120 vibrates. During this process, friction occurs between the air and the first vibration damper 120 and the air molecules themselves, which forms a damping force on the vibration of the first vibration damper 120, suppressing the amplitude and frequency of the vibration of the first vibration damper 120. Since the first vibration damper 120 is fixedly connected to the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced. Therefore, the capacitor assembly 100 provided in the present application can reduce the vibration amplitude and frequency of the capacitor 110 through the first vibration damper 120, so as to suppress or even eliminate the howling generated during the operation of the capacitor 110. When the capacitor assembly 100 is applied to a display device, the quality of the display device is higher.

[0047] Please refer to Figure 4 and Figure 5 , Figure 4 A schematic diagram of the structure of a capacitor assembly provided in the second embodiment of the present application; Figure 5 for Figure 4A schematic diagram of the structure in which a second vibration damper is arranged in the second accommodation space of a capacitor assembly provided in an embodiment. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is arranged opposite to the first electrode 112. The second electrode 113, the first electrode 112, and the dielectric portion 111 together form a first accommodation space 114. The first vibration damper 120 is arranged in the first accommodation space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. In addition, in this embodiment, a second accommodating space 1121 is provided inside the first electrode 112, and the second accommodating space 1121 and the first accommodating space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 also includes a second vibration damper 130, which is provided in the second accommodating space 1121, and the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112.

[0048] Please refer to the previous description for the capacitor 110 and the first vibration damping member 120 , which will not be described in detail here.

[0049] The second vibration damper 130 is a deformation vibration damping material, that is, the second vibration damper 130 has good elasticity and toughness, can reduce vibration and resist pressure, and can quickly restore its original shape after deformation, so that the energy generated by the vibration is dissipated into the air through deformation and deformation recovery. For example, the second vibration damper 130 is EPP, EPE or EPS. In this embodiment, the material of the second vibration damper 130 is the same as that of the first vibration damper 120. For example, the material of the second vibration damper 130 and the first vibration damper 120 are both EPP. In other embodiments, the material of the second vibration damper 130 is different from that of the first vibration damper 120.

[0050] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. In addition, the EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0051] In this embodiment, the dimension of the second vibration damper 130 in the direction from the first electrode 112 to the second electrode 113 is larger than the dimension of the second vibration damper 130 in the direction from the second vibration damper 130 to the capacitor 110, so that the second vibration damper 130 has a larger contact area with the surface of the capacitor 110 facing the second vibration damper 130, which is beneficial for the second vibration damper 130 to dampen the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120.

[0052] In this embodiment, the second vibration damper 130 is disposed in the second accommodating space 1121. Specifically, the second vibration damper 130 fills the entire second accommodating space 1121, so that the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112. In addition, due to its own material characteristics, the second vibration damper 130 has pores inside. Therefore, when the second vibration damper 130 vibrates with the capacitor 110, the second vibration damper 130 can be deformed and restored through its own internal pores, thereby reducing the vibration of the capacitor 110.

[0053] When the capacitor 110 is working, the vibration of the capacitor 110 drives the first vibration damper 120 and the second vibration damper 130 to vibrate together, thereby transferring the deformation amount generated by the vibration of the capacitor 110 to the air in the first accommodating space 114 and the internal pores of the second vibration damper 130. In addition, the air in the first accommodating space 114 and the air in the internal pores of the second vibration damper 130 are repeatedly compressed and released as the first vibration damper 120 vibrates and the second vibration damper 130 vibrates. During this process, friction occurs between the air and the first vibration damper 120, the second vibration damper 130, and the air molecules themselves, thereby forming a damping force on the vibration of the first vibration damper 120 and the second vibration damper 130, thereby suppressing the amplitude and frequency of the vibration of the first vibration damper 120 and the second vibration damper 130. Since the first vibration damper 120 is fixedly connected to the dielectric portion 111 of the capacitor 110 and the second vibration damper 130 abuts against the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced, further suppressing or even eliminating the howling generated during the operation of the capacitor 110.

[0054] Please refer to Figure 6 and Figure 7 , Figure 6 A schematic diagram of the structure of a capacitor assembly provided in the third embodiment of the present application; Figure 7 for Figure 6A schematic diagram of a structure in which a third vibration damper is arranged in a third accommodation space in a capacitor assembly provided in an embodiment. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is arranged opposite to the first electrode 112. The second electrode 113, the first electrode 112, and the dielectric portion 111 together form a first accommodation space 114. The first vibration damper 120 is arranged in the first accommodation space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. A second accommodation space 1121 is arranged inside the first electrode 112. The second accommodation space 1121 and the first accommodation space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 also includes a second vibration damper 130. The second vibration damper 130 is disposed in the second accommodating space 1121, and the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112. In addition, in this embodiment, a third accommodating space 1122 is disposed inside the first electrode 112. The third accommodating space 1122 is disposed on the side of the dielectric portion 111 away from the first vibration damper 120, and the third accommodating space 1122 is away from the second electrode 113 relative to the second accommodating space 1121. The capacitor assembly 100 further includes a third vibration damper 140. The third vibration damper 140 is disposed in the third accommodating space 1122, and the third vibration damper 140 abuts against the dielectric portion 111 and the first electrode 112.

[0055] The capacitor 110 , the first vibration damping member 120 , and the second vibration damping member 130 are described above and will not be described again herein.

[0056] The third vibration damper 140 is a deformation damping material, that is, the third vibration damper 140 has good elasticity and toughness, can damp vibration and resist pressure, and can quickly restore its original shape after deformation, so that the energy generated by the vibration is dissipated into the air through deformation and deformation recovery. For example, the third vibration damper 140 is EPP, EPE or EPS. The material of the third vibration damper 140 is the same as or different from that of the first vibration damper 120. The material of the third vibration damper 140 is the same as or different from that of the second vibration damper 130. In this embodiment, the third vibration damper 140, the second vibration damper 130 and the first vibration damper 120 are schematically described as having the same material, for example, all are EPP.

[0057] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. In addition, the EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0058] In this embodiment, the dimension of the third vibration damper 140 in the direction from the first electrode 112 to the second electrode 113 is larger than the dimension of the third vibration damper 140 in the direction from the third vibration damper 140 to the capacitor 110, so that the third vibration damper 140 has a larger contact area with the surface of the capacitor 110 facing the side of the third vibration damper 140, which is beneficial for the third vibration damper 140 to dampen the vibration of the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120.

[0059] In this embodiment, the third vibration damper 140 is disposed in the third accommodating space 1122. Specifically, the third vibration damper 140 fills the entire third accommodating space 1122, so that the third vibration damper 140 abuts against the dielectric portion 111 and the first electrode 112. In addition, due to its own material characteristics, the third vibration damper 140 has pores inside. Therefore, when the third vibration damper 140 vibrates with the capacitor 110, the third vibration damper 140 can be deformed and restored through its own internal pores, thereby reducing the vibration of the capacitor 110.

[0060] In this embodiment, the third accommodating space 1122 is disposed on the side of the dielectric portion 111 away from the first vibration damper 120, and the third accommodating space 1122 is farther away from the second electrode 113 relative to the second accommodating space 1121. Therefore, the third vibration damper 140 is farther away from the second electrode 113 relative to the second vibration damper 130, that is, relative to the third vibration damper 140, the second vibration damper 130 is closer to the surface of the first electrode 112 facing the second electrode 113. Please refer to Figure 1 and Fig.17, the capacitor 110 is usually connected to the circuit board 200 through the first electrode 112 and the second electrode 113. When the capacitor 110 vibrates, the capacitor 110 will cause the circuit board 200 to deform together, and the deformation of the capacitor 110 in the area where the first electrode 112 and the second electrode 113 are close to the circuit board 200 is greater than that in other areas. The second vibration damper 130 is arranged on the surface close to the first electrode 112 facing the second electrode 113, which is more conducive to the second vibration damper 130 to damp the vibration of the capacitor 110. In addition, the second vibration damper 130 forms a fulcrum when the capacitor 110 vibrates. The connection line between the third vibration damper 140 and the second vibration damper 130 can be regarded as a lever arm of the third vibration damper 140 with the second vibration damper 130 as a fulcrum. The third vibration damper 140 can form a longer lever arm relative to the second vibration damper 130 away from the second electrode 113, so that the third vibration damper 140 can generate a greater damping force on the capacitor 110 under the same deformation amount, thereby suppressing the amplitude and frequency of the vibration of the capacitor 110, so as to suppress or even eliminate the howling generated by the capacitor 110 during operation.

[0061] Please refer to Figure 8 and Fig. 9 , Figure 8 A schematic diagram of the structure of a capacitor assembly provided in a fourth embodiment of the present application; Fig. 9 for Figure 8 A schematic diagram of a structure in which a fourth vibration damping member is arranged in a fourth accommodation space in a capacitor assembly provided in an embodiment. The capacitor assembly 100 further includes a fourth vibration damping member 150 which can be combined with the capacitor assembly 100 provided in any of the previous embodiments. In this embodiment, the capacitor assembly 100 further includes a fourth vibration damping member 150 combined with one of the embodiments ( Figure 6The capacitor assembly 100 provided in the present application and its related embodiments is used as an example for illustration, and should not be understood as a limitation that the capacitor assembly 100 provided in the present application also includes a fourth vibration damper 150. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112 and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is arranged opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first vibration damper 120 is arranged in the first accommodating space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. A second accommodating space 1121 is provided inside the first electrode 112. The second accommodating space 1121 and the first accommodating space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a second vibration damper 130. The second vibration damper 130 is disposed in the second accommodating space 1121, and the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112. A third accommodating space 1122 is provided inside the first electrode 112. The third accommodating space 1122 is provided on the side of the dielectric portion 111 away from the first vibration damper 120, and the third accommodating space 1122 is away from the second electrode 113 relative to the second accommodating space 1121. The capacitor assembly 100 further includes a third vibration damper 140. The third vibration damper 140 is disposed in the third accommodating space 1122, and the third vibration damper 140 abuts against the dielectric portion 111 and the first electrode 112. In addition, in this embodiment, a fourth accommodating space 1123 is provided inside the first electrode 112. The fourth accommodating space 1123 is disposed on a side of the dielectric portion 111 away from the second electrode 113 . The capacitor assembly 100 further includes a fourth vibration damper 150 . The fourth vibration damper 150 is disposed in the fourth accommodating space 1123 and abuts against the dielectric portion 111 and the first electrode 112 .

[0062] The capacitor 110 , the first vibration damper 120 , the second vibration damper 130 , and the third vibration damper 140 are described above and will not be described again.

[0063] The fourth vibration damper 150 is a deformation vibration damping material, that is, the fourth vibration damper 150 has good elasticity and toughness, can damp vibration and resist pressure, and can quickly restore its original shape after deformation, so that the energy generated by vibration is dissipated into the air through deformation and deformation recovery. For example, the fourth vibration damper 150 is EPP, EPE or EPS. The fourth vibration damper 150 may be made of the same material as the first vibration damper 120, or may be different. The fourth vibration damper 150 may be made of the same material as the second vibration damper 130, or may be different. The fourth vibration damper 150 may be made of the same material as the third vibration damper 140, or may be different. In this embodiment, the fourth vibration damper 150, the third vibration damper 140, the second vibration damper 130 and the first vibration damper 120 are schematically described as having the same material, for example, all of which are EPP.

[0064] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. In addition, the EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0065] In this embodiment, the dimension of the fourth vibration damper 150 in the direction where the capacitor 110 is directed toward the first vibration damper 120 is larger than the dimension of the fourth vibration damper 150 in the direction where the fourth vibration damper 150 is directed toward the capacitor 110, so that the fourth vibration damper 150 has a larger contact area with the surface of the capacitor 110 facing the side of the fourth vibration damper 150, which is beneficial for the fourth vibration damper 150 to dampen the vibration of the capacitor 110 in the direction where the fourth vibration damper 150 is directed toward the capacitor 110.

[0066] In this embodiment, the fourth vibration damper 150 is disposed in the fourth accommodating space 1123. Specifically, the fourth vibration damper 150 fills the entire fourth accommodating space 1123, so that the fourth vibration damper 150 abuts against the dielectric portion 111 and the first electrode 112. In addition, due to its own material characteristics, the fourth vibration damper 150 has pores inside. Therefore, when the fourth vibration damper 150 vibrates with the capacitor 110, the fourth vibration damper 150 can be deformed and restored through its own internal pores, thereby damping the capacitor 110.

[0067] In this embodiment, the first vibration damper 120, the second vibration damper 130 and the third vibration damper 140 dampen the vibration of the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120, and the fourth vibration damper 150 dampens the vibration of the capacitor 110 in the direction from the first electrode 112 to the second electrode 113, wherein the direction from the first electrode 112 to the second electrode 113 is different from the direction from the capacitor 110 to the first vibration damper 120, therefore, the fourth vibration damper 150 increases the vibration damping of the capacitor 110 in different directions, further suppresses the amplitude and frequency of the vibration of the capacitor 110, thereby suppressing or even eliminating the howling generated by the capacitor 110 during operation.

[0068] Please refer to Fig.10 and Fig.11 , Fig.10 A schematic diagram of the structure of a capacitor assembly provided in a fifth embodiment of the present application; Fig.11 for Fig.10 A schematic diagram of a structure in which a fifth vibration damper is arranged in a fifth accommodation space in a capacitor assembly provided in an embodiment. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is arranged opposite to the first electrode 112. The second electrode 113, the first electrode 112, and the dielectric portion 111 together form a first accommodation space 114. The first vibration damper 120 is arranged in the first accommodation space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. In addition, in this embodiment, a fifth accommodation space 1131 is arranged inside the first electrode 112. The fifth accommodation space 1131 and the first accommodation space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a fifth vibration damper 160 . The fifth vibration damper 160 is disposed in the fifth accommodating space 1131 , and the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112 .

[0069] Please refer to the previous description for the capacitor 110 and the first vibration damping member 120 , which will not be described in detail here.

[0070] The fifth vibration damper 160 is a deformation damping material, that is, the fifth vibration damper 160 has good elasticity and toughness, can damp vibration and resist pressure, and can quickly restore its original shape after deformation, so that the energy generated by vibration is dissipated into the air through deformation and deformation recovery. For example, the fifth vibration damper 160 is EPP, EPE or EPS. In this embodiment, the fifth vibration damper 160 is made of the same material as the first vibration damper 120, for example, the fifth vibration damper 160 and the first vibration damper 120 are both made of EPP. In other embodiments, the fifth vibration damper 160 is made of different materials from the first vibration damper 120.

[0071] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. In addition, the EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0072] In this embodiment, the dimension of the fifth vibration damper 160 in the direction from the first electrode 112 to the second electrode 113 is larger than the dimension of the fifth vibration damper 160 in the direction from the fifth vibration damper 160 to the capacitor 110, so that the fifth vibration damper 160 has a larger contact area with the surface of the capacitor 110 facing the side of the fifth vibration damper 160, which is beneficial for the fifth vibration damper 160 to dampen the vibration of the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120.

[0073] In this embodiment, the fifth vibration damper 160 is disposed in the fifth accommodating space 1131. Specifically, the fifth vibration damper 160 fills the entire fifth accommodating space 1131, so that the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112. In addition, due to its own material characteristics, the fifth vibration damper 160 has pores inside. Therefore, when the fifth vibration damper 160 vibrates with the capacitor 110, the fifth vibration damper 160 can be deformed and restored through its own internal pores, thereby damping the capacitor 110.

[0074] When the capacitor 110 is working, the vibration of the capacitor 110 drives the first vibration damper 120 and the fifth vibration damper 160 to vibrate together, thereby transferring the deformation amount generated by the vibration of the capacitor 110 to the air in the first accommodating space 114 and the internal pores of the fifth vibration damper 160. In addition, the air in the first accommodating space 114 and the air in the internal pores of the fifth vibration damper 160 are repeatedly compressed and released with the vibration of the first vibration damper 120 and the fifth vibration damper 160. During this process, friction occurs between the air and the first vibration damper 120, the fifth vibration damper 160 and the air molecules themselves, thus forming a damping force on the vibration of the first vibration damper 120 and the fifth vibration damper 160, thereby suppressing the amplitude and frequency of the vibration of the first vibration damper 120 and the fifth vibration damper 160. Since the first vibration damper 120 is fixedly connected to the dielectric portion 111 of the capacitor 110 and the fifth vibration damper 160 abuts against the dielectric portion 111 of the capacitor 110 , the vibration amplitude and frequency of the capacitor 110 are reduced, further suppressing or even eliminating the howling generated during the operation of the capacitor 110 .

[0075] It should be noted that the relative position of the fifth accommodation space 1131 in the first electrode 112 may be the same as or different from the relative position of the second accommodation space 1121 in the second electrode 113. In this embodiment, the relative position of the fifth accommodation space 1131 in the first electrode 112 is the same as the relative position of the second accommodation space 1121 in the second electrode 113 for description and illustration.

[0076] Please refer to Fig.12 and Fig.13 , Fig.12 A schematic diagram of the structure of a capacitor assembly provided in a sixth embodiment of the present application; Fig.13 for Fig.12A schematic diagram of a structure in which a sixth vibration damper is arranged in a sixth accommodation space in a capacitor assembly provided in an embodiment. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is arranged opposite to the first electrode 112. The second electrode 113, the first electrode 112, and the dielectric portion 111 together form a first accommodation space 114. The first vibration damper 120 is arranged in the first accommodation space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. A fifth accommodation space 1131 is arranged inside the first electrode 112. The fifth accommodation space 1131 and the first accommodation space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 also includes a fifth vibration damper 160. The fifth vibration damper 160 is disposed in the fifth accommodating space 1131, and the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112. In addition, in this embodiment, a sixth accommodating space 1132 is disposed inside the first electrode 112. The sixth accommodating space 1132 is disposed on the side of the dielectric portion 111 away from the first vibration damper 120. The sixth accommodating space 1132 is away from the second electrode 113 relative to the fifth accommodating space 1131. The capacitor assembly 100 further includes a sixth vibration damper 170. The sixth vibration damper 170 is disposed in the sixth accommodating space 1132, and the sixth vibration damper 170 abuts against the dielectric portion 111 and the first electrode 112.

[0077] The capacitor 110 , the first vibration damper 120 , and the fifth vibration damper 160 are described above and will not be described again herein.

[0078] The sixth vibration damper 170 is a deformation damping material, that is, the sixth vibration damper 170 has good elasticity and toughness, can damp vibration and resist pressure, and can quickly restore its original shape after deformation, so that the energy generated by the vibration is dissipated into the air through deformation and deformation recovery. For example, the sixth vibration damper 170 is EPP, EPE or EPS. The sixth vibration damper 170 may be made of the same material as the first vibration damper 120, or may be different. The sixth vibration damper 170 may be made of the same material as the fifth vibration damper 160, or may be different. In this embodiment, the sixth vibration damper 170, the fifth vibration damper 160 and the first vibration damper 120 are schematically described as having the same material, for example, all are EPP.

[0079] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. The EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0080] In this embodiment, the dimension of the sixth vibration damper 170 in the direction from the first electrode 112 to the second electrode 113 is larger than the dimension of the sixth vibration damper 170 in the direction from the sixth vibration damper 170 to the capacitor 110, so that the sixth vibration damper 170 has a larger contact area with the surface of the capacitor 110 facing the side of the sixth vibration damper 170, which is beneficial for the sixth vibration damper 170 to dampen the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120.

[0081] In this embodiment, the sixth vibration damper 170 is disposed in the sixth accommodating space 1132. Specifically, the sixth vibration damper 170 fills the entire sixth accommodating space 1132, so that the sixth vibration damper 170 abuts against the dielectric portion 111 and the first electrode 112. In addition, due to its own material characteristics, the sixth vibration damper 170 has pores inside. Therefore, when the sixth vibration damper 170 vibrates with the capacitor 110, the sixth vibration damper 170 can be deformed and restored through its own internal pores, thereby damping the capacitor 110.

[0082] In this embodiment, the sixth accommodating space 1132 is disposed on the side of the dielectric portion 111 away from the first vibration damper 120, and the sixth accommodating space 1132 is farther from the second electrode 113 than the fifth accommodating space 1131, so the sixth vibration damper 170 is farther from the second electrode 113 than the fifth vibration damper 160, that is, the fifth vibration damper 160 is closer to the surface of the first electrode 112 facing the second electrode 113 than the sixth vibration damper 170. Please refer to Figure 1The capacitor 110 is usually connected to a circuit board through the first electrode 112 and the second electrode 113. When the capacitor 110 vibrates, the capacitor 110 will cause the circuit board to deform, and the deformation of the capacitor 110 in the area near the circuit board of the first electrode 112 and the second electrode 113 is greater than that in other areas. The fifth vibration damper 160 is arranged on the surface close to the first electrode 112 facing the second electrode 113, which is more conducive to the fifth vibration damper 160 to reduce the vibration of the capacitor 110. The fifth vibration damper 160 forms a fulcrum when the capacitor 110 vibrates, and the connection line between the sixth vibration damper 170 and the fifth vibration damper 160 can be regarded as a lever arm of the sixth vibration damper 170 with the fifth vibration damper 160 as the fulcrum. The sixth vibration damper 170 can form a longer lever arm relative to the fifth vibration damper 160 away from the second electrode 113, so that the sixth vibration damper 170 can generate a greater damping force on the capacitor 110 under the same deformation amount, thereby suppressing the amplitude and frequency of the vibration of the capacitor 110, so as to suppress or even eliminate the howling generated by the capacitor 110 during operation.

[0083] It should be noted that the relative position of the sixth accommodation space 1132 in the first electrode 112 may be the same as or different from the relative position of the third accommodation space 1122 in the second electrode 113. In this embodiment, the relative position of the sixth accommodation space 1132 in the first electrode 112 is the same as the relative position of the third accommodation space 1122 in the second electrode 113 for description and illustration.

[0084] Please refer to Fig.14 and Fig.15 , Fig.14 A schematic diagram of the structure of a capacitor assembly provided in a seventh embodiment of the present application; Fig.15 for Fig.14 A schematic diagram of a structure in which a seventh damping member is arranged in the seventh accommodation space of a capacitor assembly provided in an embodiment. The capacitor assembly 100 further includes a seventh damping member 180 which can be combined with the capacitor assembly 100 provided in the above-mentioned various embodiments. In this embodiment, the capacitor assembly 100 further includes a seventh damping member 180 which can be combined with one of the embodiments ( Fig.12The capacitor assembly 100 provided in the present application and its related embodiments is used as an example for illustration, and should not be understood as a limitation that the capacitor assembly 100 provided in the present application also includes a seventh vibration damper 180. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112 and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is arranged opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first vibration damper 120 is arranged in the first accommodating space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. A fifth accommodating space 1131 is provided inside the first electrode 112. The fifth accommodating space 1131 and the first accommodating space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a fifth vibration damper 160. The fifth vibration damper 160 is disposed in the fifth accommodating space 1131, and the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112. A sixth accommodating space 1132 is disposed inside the first electrode 112. The sixth accommodating space 1132 is disposed on the side of the dielectric portion 111 away from the first vibration damper 120, and the sixth accommodating space 1132 is away from the second electrode 113 relative to the fifth accommodating space 1131. The capacitor assembly 100 further includes a sixth vibration damper 170. The sixth vibration damper 170 is disposed in the sixth accommodating space 1132, and the sixth vibration damper 170 abuts against the dielectric portion 111 and the first electrode 112. In addition, in this embodiment, a seventh accommodating space 1133 is disposed inside the first electrode 112. The seventh accommodating space 1133 is disposed on a side of the dielectric portion 111 away from the second electrode 113 . The capacitor assembly 100 further includes a seventh vibration damper 180 . The seventh vibration damper 180 is disposed in the seventh accommodating space 1133 and abuts against the dielectric portion 111 and the first electrode 112 .

[0085] The capacitor 110 , the first vibration damper 120 , the fifth vibration damper 160 , and the sixth vibration damper 170 are described above and will not be described again herein.

[0086] The seventh vibration damper 180 is a deformation vibration damping material, that is, the seventh vibration damper 180 has good elasticity and toughness, can damp vibration and resist pressure, and can quickly restore its original shape after deformation, so that the energy generated by vibration is dissipated into the air through deformation and deformation recovery. For example, the seventh vibration damper 180 is EPP, EPE or EPS. The material of the seventh vibration damper 180 is the same as or different from that of the first vibration damper 120. The material of the seventh vibration damper 180 is the same as or different from that of the fifth vibration damper 160. The material of the seventh vibration damper 180 is the same as or different from that of the sixth vibration damper 170. In this embodiment, the seventh vibration damper 180, the sixth vibration damper 170, the fifth vibration damper 160 and the first vibration damper 120 are schematically described as being of the same material, for example, all of which are EPP.

[0087] Specifically, the EPP material has good elasticity, good toughness, vibration and compression resistance, high deformation recovery rate, good absorption performance, and is also resistant to high temperatures (can work normally at least at -40 to 130°C), and can adapt to the high temperature working environment of the capacitor 110. The EPP material is also resistant to corrosion, acid and oil, and can adapt to harsh working environments. In addition, the EPP material is also an environmentally friendly material.

[0088] In this embodiment, the dimension of the seventh vibration damper 180 in the direction from the capacitor 110 to the first vibration damper 120 is larger than the dimension of the seventh vibration damper 180 in the direction from itself to the capacitor 110, so that the seventh vibration damper 180 has a larger contact area with the surface of the capacitor 110 facing the side of the seventh vibration damper 180, which is beneficial for the seventh vibration damper 180 to dampen the vibration of the capacitor 110 in the direction from the fourth vibration damper 150 to the capacitor 110.

[0089] In this embodiment, the seventh vibration damper 180 is disposed in the seventh accommodating space 1133. Specifically, the seventh vibration damper 180 fills the entire seventh accommodating space 1133, so that the seventh vibration damper 180 abuts against the dielectric portion 111 and the first electrode 112. In addition, due to its own material characteristics, the seventh vibration damper 180 has pores inside. Therefore, when the seventh vibration damper 180 vibrates with the capacitor 110, the seventh vibration damper 180 can be deformed and restored through its own internal pores, thereby reducing the vibration of the capacitor 110.

[0090] In this embodiment, the first vibration damper 120, the fifth vibration damper 160 and the sixth vibration damper 170 dampen the vibration of the capacitor 110 in the direction from the capacitor 110 to the first vibration damper 120, and the seventh vibration damper 180 dampens the vibration of the capacitor 110 in the direction from the first electrode 112 to the second electrode 113, wherein the direction from the first electrode 112 to the second electrode 113 is different from the direction from the capacitor 110 to the first vibration damper 120, therefore, the seventh vibration damper 180 increases the vibration damping of the capacitor 110 in different directions, further suppresses the amplitude and frequency of the vibration of the capacitor 110, thereby suppressing or even eliminating the howling generated by the capacitor 110 during operation.

[0091] It should be noted that the relative position of the seventh accommodation space 1133 in the first electrode 112 may be the same as or different from the relative position of the fourth accommodation space 1123 in the second electrode 113. In this embodiment, the relative position of the seventh accommodation space 1133 in the first electrode 112 is the same as the relative position of the fourth accommodation space 1123 in the second electrode 113 for description and illustration.

[0092] Please refer to Fig.16 , Fig.16 A schematic diagram of the structure of a capacitor assembly provided in the eighth embodiment of the present application. In this embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112, and the dielectric portion 111 together form a first accommodating space 114. The first vibration damper 120 is disposed in the first accommodating space 114, and the first vibration damper 120 is fixedly connected to the dielectric portion 111. In addition, in this embodiment, there is a gap 115 between the first vibration damper 120 and the first electrode 112, and there is a gap 115 between the first vibration damper 120 and the second electrode 113.

[0093] In this embodiment, during the vibration of the capacitor 110, the first vibration damper 120 will be driven to vibrate along with the capacitor 110, so that the first vibration damper 120 is deformed. The gap 115 provides a deformation space for the first vibration damper 120 in the direction from the first electrode 112 to the second electrode 113, which is conducive to the deformation of the first vibration damper 120, thereby absorbing the energy of the vibration of the capacitor 110 to suppress the amplitude and frequency of the vibration of the capacitor 110, thereby suppressing or even eliminating the howling generated by the capacitor 110 during operation.

[0094] The present application also provides a circuit board assembly 10. Fig.17 , Fig.17 1 is a schematic diagram of the structure of a circuit board assembly provided in one embodiment of the present application. The circuit board assembly 10 comprises a circuit board 200 and a capacitor assembly 100 as described in any one of the above embodiments, and the capacitor assembly 100 is electrically connected to the circuit board 200 .

[0095] In this embodiment, the circuit board assembly 10 can be used for power filtering, signal filtering, signal coupling, resonance, filtering, compensation, charging and discharging, energy storage, DC isolation, etc.

[0096] When the capacitor 110 is working, it will produce a howl due to its own high vibration frequency. At the same time, when the capacitor 110 is powered on and working on the circuit board 200, the capacitor 110 will also drive the circuit board 200 to vibrate, so that the capacitor 110 and the circuit board 200 will produce a howl due to vibration.

[0097] In this embodiment, the capacitor assembly 100 may be electrically connected to the circuit board 200 by, but not limited to, soldering or conductive adhesive bonding, so that the capacitor assembly 100 is electrically connected to the circuit board 200 .

[0098] In this embodiment, the first vibration damping member 120 can not only reduce the vibration amplitude and frequency of the capacitor 110, but also play a buffering role between the capacitor 110 and the circuit board 200 to suppress or even eliminate the resonance between the capacitor 110 and the circuit board 200, thereby suppressing or even eliminating the howling generated when the capacitor 110 works on the circuit board 200.

[0099] The present application also provides a display device 1. Fig.17 and Fig.18 , Fig.18 The circuit block diagram of a display device provided in one embodiment of the present application is as follows: The display device 1 comprises a display panel 20 and the above-mentioned circuit board assembly 10 , and the circuit board assembly 10 is electrically connected to the display panel 20 .

[0100] In this embodiment, the vibration amplitude and frequency of the capacitor 110 and the circuit board 200 are reduced by the first vibration damping member 120, and the resonance between the capacitor 110 and the circuit board 200 is suppressed or even eliminated, thereby suppressing or even eliminating the howling generated by the capacitor 110 when working in the display device 1.

[0101] In one embodiment, the circuit board 200 includes a filter circuit. The capacitor 110 works on the circuit board 200 as a part of the filter circuit. The filter circuit in the circuit board 200 filters the input first current to obtain a second current, and provides the second current to the display panel 20, thereby driving the display panel 20 to work.

[0102] The filter circuit includes a high-pass filter circuit, a low-pass filter circuit and a band-pass filter circuit. The following describes in detail the case where the filter circuit is a high-pass filter circuit, a low-pass filter circuit, or a band-pass filter circuit.

[0103] In one embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a high-pass filter circuit. Specifically, the cutoff frequency of the high-pass filter circuit is f0, and the frequency f1 of the first current is: fa≤f1≤fb, wherein fa<fb, fa≤f0≤fb, then the frequency f2 of the second current is: f0≤f2≤fb. For example, in one embodiment, the cutoff frequency f0 of the high-pass filter circuit is f0=50Hz, the frequency f1 of the first current is in the range of: 20Hz≤f1≤200Hz, and the frequency f2 of the second current is in the range of: 50Hz≤f2≤200Hz. In other words, the high-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz~200Hz to 50Hz~200Hz. In another embodiment, the cutoff frequency f0 of the high-pass filter circuit is 100 Hz, the frequency f1 of the first current is in the range of 20 Hz ≤ f1 ≤ 200 Hz, and the frequency f2 of the second current is in the range of 100 Hz ≤ f2 ≤ 200 Hz. In other words, the high-pass filter circuit of the circuit board 200 filters the current frequency from 20 Hz to 200 Hz to 100 Hz to 200 Hz.

[0104] In another embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a low-pass filter circuit. Specifically, the cut-off frequency of the low-pass filter circuit is f0, and the frequency f1 of the first current is: fa≤f1≤fb, wherein fa<fb, fa≤f0≤fb, then the frequency f2 of the second current is: fa≤f2≤f0. For example, in one embodiment, the cut-off frequency f0 of the low-pass filter circuit is f0=150Hz, the range of the frequency f1 of the first current is: 20Hz≤f1≤200Hz, and the range of the frequency f2 of the second current is: 20Hz≤f2≤150Hz. In other words, the low-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz~200Hz to 20Hz~150Hz. In another embodiment, the cut-off frequency f0 of the low-pass filter circuit is 120 Hz, the frequency f1 of the first current is in the range of 20 Hz ≤ f1 ≤ 200 Hz, and the frequency f2 of the second current is in the range of 20 Hz ≤ f2 ≤ 120 Hz. In other words, the low-pass filter circuit of the circuit board 200 filters the current frequency from 20 to 200 Hz to 20 to 120 Hz.

[0105] In another embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a bandpass filter circuit. Specifically, the high-pass cutoff frequency of the bandpass filter circuit is f01, the low-pass cutoff frequency of the bandpass filter circuit is f02, and the frequency f1 of the first current is: fa≤f1≤fb, wherein fa<fb, fa≤f01≤f02≤fb, then, the frequency f2 of the second current is: f01≤f2≤f02. For example, in one embodiment, the high-pass cutoff frequency f01 of the bandpass filter circuit is 50Hz, the low-pass cutoff frequency f02 of the bandpass filter circuit is 150Hz, the range of the frequency f1 of the first current is: 20Hz≤f1≤200Hz, the range of the frequency f2 of the second current is: 50Hz≤f2≤150Hz, in other words, the bandpass filter circuit of the circuit board 200 filters the current frequency from 20Hz~200Hz to 50Hz~150Hz.

[0106] It should be noted that this embodiment only illustrates some applications of the display device 1 and does not limit the application scope of the display device 1 .

[0107] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. A capacitor component, characterized in that: The capacitor assembly comprises: A capacitor, the capacitor comprising a dielectric portion, a first electrode and a second electrode, the first electrode wrapping one end of the dielectric portion, the second electrode wrapping the other end of the dielectric portion, and the second electrode being arranged opposite to the first electrode, the second electrode, the first electrode and the dielectric portion jointly forming a first accommodation space, a second accommodation space and a third accommodation space being arranged inside the first electrode, the second accommodation space and the first accommodation space being both located on the same side of the dielectric portion, the third accommodation space and the second accommodation space being arranged on opposite sides of the dielectric portion, and the third accommodation space being away from the second electrode relative to the second accommodation space; A first vibration damping member, the first vibration damping member is disposed in the first accommodating space, and the first vibration damping member is fixedly connected to the dielectric part; a second vibration damper, the second vibration damper being disposed in the second accommodating space and abutting against the dielectric portion and the first electrode; and A third vibration damping member is disposed in the third accommodating space and abuts against the dielectric portion and the first electrode.

2. The capacitor assembly according to claim 1, wherein: A fourth accommodation space is provided inside the first electrode, and the fourth accommodation space is provided on a side of the dielectric portion away from the second electrode. The capacitor assembly further includes: A fourth vibration damping member is disposed in the fourth accommodating space and abuts against the dielectric portion and the first electrode.

3. The capacitor assembly according to claim 1, wherein: A fifth accommodating space is provided inside the second electrode, and the fifth accommodating space is provided on a side of the dielectric portion facing the first vibration damping member, and the capacitor assembly further includes: A fifth vibration damper is disposed in the fifth accommodating space and abuts against the dielectric portion and the second electrode.

4. The capacitor assembly according to claim 3, characterized in that: A sixth accommodation space is provided inside the second electrode, the sixth accommodation space is provided on a side of the dielectric portion away from the first vibration damping member, and the sixth accommodation space is farther away from the first electrode than the fifth accommodation space, and the capacitor assembly further includes: The sixth vibration damper is disposed in the sixth accommodating space and abuts against the dielectric portion and the second electrode.

5. The capacitor assembly according to any one of claims 1 to 4, characterized in that: A seventh accommodating space is provided inside the second electrode, and the seventh accommodating space is provided on a side of the dielectric portion away from the first electrode. The capacitor assembly further includes: A seventh vibration damper is disposed in the seventh accommodating space and abuts against the dielectric portion and the second electrode.

6. The capacitor assembly according to claim 1, wherein: There is a gap between the first vibration reducing member and the first electrode, and there is a gap between the first vibration reducing member and the second electrode.

7. A circuit board assembly, characterized in that: The circuit board assembly comprises: Circuit boards; and The capacitor assembly according to any one of claims 1 to 6, wherein the capacitor assembly is electrically connected to the circuit board.

8. A display device, characterized in that: The display device comprises: display panel; and The circuit board assembly as claimed in claim 7, wherein the circuit board assembly is electrically connected to the display panel.

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