Pushing assembly and chip testing device

Abstract

The application discloses a pressing assembly and a chip testing device. The chip testing device comprises the pressing assembly. The pressing assembly is fixedly arranged on a cover body. The cover body is used for covering one side of a chip tray set. The chip tray set is used for carrying a plurality of chips. When the cover body covers one side of the chip tray set, the pressing part of each pressing assembly will press the surface of each chip. Each elastic part connected with the pressing part will be in a pressed state. When the cover body covers one side of the chip tray set, a closed space will be formed between the cover body and the chip tray set. The vacuumizing device of the chip testing device can perform air extraction on the closed space, so that the closed space is in a negative pressure state.

Description

Technical Field

[0001] This invention relates to a pressure-resistant component and a chip testing device, and more particularly to a pressure-resistant component and a chip testing device suitable for high-frequency testing of chips. Background Technology

[0002] Existing common IC chip testing equipment, especially testing equipment used for high-frequency testing of IC chips, may experience issues during the IC chip installation process. Due to various factors, some IC chips may not be correctly electrically connected to the relevant probes of the testing equipment. As a result, IC chips that are not installed correctly cannot be tested properly.

[0003] Because existing IC chip testing equipment generally does not check whether the IC chips have been correctly installed after they are installed in the testing equipment, relevant personnel often have to wait until the entire batch of IC chips has been tested before they discover that some IC chips have not been tested correctly because they were not installed correctly. Summary of the Invention

[0004] This invention discloses a pressure-resistant component and a chip testing device, mainly used to improve existing IC chip testing equipment, which is prone to problems such as IC chips not being properly installed in the testing equipment, resulting in the IC chip not being tested correctly.

[0005] One embodiment of the present invention discloses a pressing component, which is fixedly disposed on a cover. A groove is recessed on one side of the cover, and the pressing component is located in the groove. The cover is used to cover one side of a chip tray assembly, and the pressing component is used to press against a chip carried by one of the chip holders of the chip tray assembly. The chip tray assembly includes a tray and multiple chip holders. The tray includes multiple tray perforations, each tray perforation penetrating the tray. A chip holder is disposed in each tray perforation. Each chip holder includes at least one fixing perforation and at least one chip receiving groove. The fixing perforation penetrates the chip holder, and each chip receiving groove is used to support a chip. A chip is disposed in a chip cavity, a portion of which is exposed outside a chip retainer. The pressing assembly includes: a base for being fixedly disposed on a cover; a pressing member including a contact portion having a contact surface, a portion of which can extend into one of the fixing holes, and the contact surface for pressing against a surface of the chip disposed in one of the chip cavities; at least one elastic member, the two ends of which are respectively fixed to the base and the pressing member; when the pressing member presses against the surface of the chip, the elastic member will elastically deform, and when the pressing member no longer presses against the surface of the chip, the elastic restoring force generated by the pressure on the elastic member will cause the pressing member to return to the state of not pressing against the chip.

[0006] Preferably, the pressing member further includes an abutting portion; when the cover is placed on one side of the tray and the abutting portion abuts against a top surface of the tray, a portion of the contact portion extends into one of the chip slots, and the contact surface can press against the surface of the chip disposed in the chip slot.

[0007] Preferably, the pressing component includes at least two elastic elements, each of which is a compression spring. The pressing element has at least two first grooves on its abutting portion, and the base has at least two second grooves. Each first groove faces a second groove, and the two ends of each elastic element are respectively engaged with the first groove and the second groove.

[0008] Preferably, the pressing member has two through holes, each through hole of the pressing member communicating with each of the first grooves. The pressing assembly also includes at least two guide members and at least two fixing components. The two fixing components are fixedly disposed in the two first grooves. Each fixing component has a through hole. One end of each guide member is fixed to the base, and the other end of each guide member passes through the through hole of each fixing component. When the pressing member moves relative to the base, each fixing component can move relative to each guide member, and the two guide members and the two fixing components can jointly restrict the direction of movement of the pressing member relative to the base.

[0009] Preferably, the pressing member further includes a backing portion, and the pressing assembly further includes at least one fixing structure and at least one limiting member. The fixing structure is fixed to the base, and the limiting member is detachably fixed to the fixing structure. A portion of the limiting member is used to abut against the backing portion of the pressing member, and the limiting member and the fixing structure can jointly limit the range of motion of the pressing member relative to the base.

[0010] Preferably, the limiting member includes a receiving notch for receiving a portion of the contact portion.

[0011] Preferably, the pressing component further includes a heat-conducting element, a limiting element is disposed on the base, the heat-conducting element is connected to the pressing element and the base, and the heat-conducting element is located between the pressing element and the base, the heat-conducting element is used to assist the heat energy transfer between the pressing element and the base.

[0012] One embodiment of the present invention discloses a chip testing device for testing multiple chips carried by a chip tray kit. The chip tray kit includes a tray and multiple chip holders. The tray includes multiple tray perforations, each perforation penetrating the tray. Each chip holder is disposed on the tray and located within a tray perforation. Each chip holder includes at least one fixing perforation and at least one chip receiving slot. The fixing perforation penetrates the chip holder, and each chip receiving slot holds one chip. A portion of the chip disposed in the chip receiving slot is exposed outside the chip holder. The chip testing device includes: a cover with a recessed groove on one side, the cover being used to cover one side of the tray; and multiple pressing components disposed on the cover, each pressing component located within the groove of the cover, the multiple pressing components being used to press against the chip tray. The chip tray assembly includes multiple chip holders supporting multiple chips. Each pressing component comprises: a base for fixing to a cover; a pressing member including a contact portion having a contact surface, a portion of which extends into one of the fixing holes, and the contact surface for pressing against a surface of a chip disposed in one of the chip slots; at least one elastic member with its two ends fixed to the base and the pressing member respectively; when the pressing member presses against the surface of the chip, the elastic member will elastically deform, and when the pressing member no longer presses against the surface of the chip, the elastic restoring force generated by the pressure on the elastic member will cause the pressing member to return to the state of not pressing against the chip; and a testing machine for connecting to the chip tray assembly, the testing machine for electrically connecting to the multiple chips supported by the chip tray assembly, and the testing machine for testing the multiple chips disposed in the multiple chip slots.

[0013] Preferably, the chip testing equipment further includes a temperature regulating device connected to multiple pressing components, the temperature regulating device being used to bring the temperature of each pressing component to a predetermined temperature.

[0014] Preferably, when the cover is placed on one side of the tray, the cover, the tray, multiple chip holders and multiple chips together form a closed space; the chip testing equipment also includes a vacuum device, which is used to extract air from the closed space so that the closed space is in a negative pressure state.

[0015] Preferably, the cover includes a body and a conductive structure. A temperature regulating device is connected to the conductive structure. The temperature regulating device is used to raise or lower the temperature of the conductive structure. Each base is detachably fixed to the conductive structure. The conductive structure can transfer heat energy to multiple pressing members through multiple bases and multiple elastic members, so that the temperature of each pressing member reaches a predetermined temperature.

[0016] Preferably, at least one flow channel is formed within the conductive structure, and the temperature regulating device can provide a fluid to the flow channel to raise or lower the temperature of the conductive structure.

[0017] Preferably, the temperature regulating device includes a temperature controller and a heating coil. The temperature controller is electrically connected to the heating coil, and the heating coil is disposed in the conductive structure. The temperature controller can activate the heating coil to raise the temperature of the conductive structure.

[0018] Preferably, the temperature regulating device includes a temperature controller and a cooling chip. The temperature controller is electrically connected to the cooling chip, which is disposed in the conductive structure. The temperature controller can activate the cooling chip to lower the temperature of the conductive structure.

[0019] Preferably, each pressing component further includes a heat-conducting element, which is connected to the pressing component and the base. The heat-conducting element is located between the pressing component and the base and is used to assist in the mutual transfer of heat between the pressing component and the base.

[0020] Preferably, the chip testing equipment further includes a plurality of auxiliary inserts, which are fixed to one side of the tray. Each auxiliary insert includes a body and at least one protrusion. The protrusion is formed by protruding outward from one side of the body and is used to be disposed in a fixing hole. The auxiliary insert has an insertion hole that passes through the body and the protrusion. The diameter of the insertion hole is larger than the outer diameter of the contact portion, and a portion of the contact portion can pass through the insertion hole and protrude from one side of the auxiliary insert. The insertion hole is smaller than the diameter of the chip cavity.

[0021] Preferably, when the cover is placed on one side of the tray, the cover, the tray, multiple chip fixing components, multiple auxiliary inserts, and multiple chips together form a closed space; the chip testing equipment also includes a vacuum device, which is used to extract air from the closed space so that the closed space is in a negative pressure state.

[0022] Preferably, the chip testing equipment also includes a chip tray kit.

[0023] Preferably, each chip fixing member has a plurality of first receiving grooves on its sidewall, and each tray through hole has a plurality of second receiving grooves on its sidewall. A plurality of elastic members are provided between each chip fixing member and the sidewall forming the tray through hole. The two ends of each elastic member located between each chip fixing member and the sidewall forming the tray through hole are correspondingly engaged in one of the first receiving grooves and one of the second receiving grooves.

[0024] Preferably, each pressing member further includes a pressing part; when the cover is placed on one side of the tray and each pressing part abuts against a top surface of the tray, a portion of each contact part extends into one of the chip slots, and each contact surface can press against the surface of the chip disposed in the chip slot.

[0025] Preferably, each pressing component includes at least two elastic elements, each elastic element is a compression spring, each pressing component has at least two first grooves at its abutting portion, each base has at least two second grooves, each first groove faces a second groove, and the two ends of each elastic element are respectively engaged with the first groove and the second groove.

[0026] Preferably, each pressing member has two through holes, and each through hole of each pressing member is interconnected with each first groove; each pressing component also includes at least two guide members and at least two fixing components, the two fixing components are fixedly disposed in the two first grooves, each fixing component has a through hole, one end of each guide member is fixed to the base, and the other end of each guide member passes through the through hole of each fixing component; when each pressing member moves relative to the base, each fixing component can move relative to each guide member, and the two guide members and the two fixing components can jointly restrict the movement direction of the pressing member relative to the base.

[0027] Preferably, each pressing member further includes a backing portion, and each pressing component further includes at least one fixing structure and at least one limiting member. The fixing structure is fixed to the base, and the limiting member is detachably fixed to the fixing structure. A portion of the limiting member is used to abut against the backing portion of the pressing member, and the limiting member and the fixing structure can jointly limit the range of motion of the pressing member relative to the base.

[0028] Preferably, each limiting member includes a receiving notch for receiving a portion of the contact portion.

[0029] Preferably, each pressing component further includes a heat-conducting element, which is connected to the pressing component and the base. The heat-conducting element is located between the pressing component and the base and is used to assist in the mutual transfer of heat between the pressing component and the base.

[0030] In summary, the pressing component of the present invention and the chip testing equipment of the present invention are mainly used to press the chip disposed in the chip cavity. When relevant personnel want to test the chip, they can press the surface of the chip by pressing the pressing component. In this way, the chip can be tightly electrically connected to the testing machine, thereby ensuring that the chip can be tested correctly. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the chip testing equipment of the present invention.

[0032] Figure 2 for Figure 1 A magnified view of a portion of the image.

[0033] Figure 3 and Figure 4 This is a partially enlarged schematic diagram of the chip tray kit of the present invention from different perspectives.

[0034] Figure 5 and Figure 6 This is a partially exploded schematic diagram from different perspectives of the chip tray kit of the present invention.

[0035] Figure 7 This is a partial exploded cross-sectional view of the chip tray kit of the present invention.

[0036] Figure 8 This is a partial cross-sectional view of the chip tray kit of the present invention, which is provided with chips.

[0037] Figure 9 This is a partially exploded view of the chip tray kit of the present invention.

[0038] Figures 10-12 This is a schematic diagram illustrating the operation of the auxiliary insert and the chip fixing member of the chip tray kit of the present invention fixing each other.

[0039] Figure 13 for Figure 1 A magnified view of a portion of the image.

[0040] Figure 14 This is a partially exploded view of the pressure-absorbing component of the present invention.

[0041] Figure 15 This is a partial cross-sectional schematic diagram of the pressure-reducing component of the present invention.

[0042] Figure 16 This is a cross-sectional schematic diagram showing the separation of the cover and the chip tray assembly of the present invention.

[0043] Figure 17 This is a cross-sectional schematic diagram of the combination of the cover and the chip tray kit of the present invention.

[0044] Figure 18 for Figure 17 A magnified view of a portion of the image.

[0045] Figure 19 This is a cross-sectional schematic diagram of different embodiments of the pressure-reducing component of the present invention. Detailed Implementation

[0046] In the following description, if a specific drawing is indicated or shown in a particular drawing, it is only to emphasize that most of the relevant content mentioned in the following description appears in that particular drawing, but does not limit the following description to refer only to that particular drawing.

[0047] Please refer to the following: Figures 1 to 8 The chip testing equipment A of the present invention is used to test multiple chips C (such as...) carried by a chip tray kit 1. Figure 8The chip C referred to can be any IC chip, memory, etc. The chip testing equipment A includes: a testing platform 2, a cover 3, multiple pressing components 4, and a temperature control device 5. The testing platform 2 and the cover 3 are used to jointly hold a chip tray assembly 1.

[0048] like Figure 1 and Figure 2 As shown, the test equipment 2 can be connected to the chip tray kit 1, and the test equipment 2 is used to connect with the multiple chips C (such as...) carried by the chip tray kit 1. Figure 8 As shown, the test equipment 2 is electrically connected to multiple chips C and tests them. The test content performed on each chip C by the test equipment 2 can be designed according to the actual type and requirements of the chip C, and is not limited here. In practical applications, the test equipment 2 may include a machine body 21, a control module 22, and multiple probe holders 23. The control module 22 is set in the machine body 21. Each probe holder 23 contains multiple probes (not shown in the figure), and the multiple probes of each probe holder 23 are used to electrically connect with the chip C to be tested. The control module 22 can execute relevant test programs to test multiple chips C to be tested (such as...) through multiple probe holders 23. Figure 8 (As shown) relevant tests are performed. In practical applications, the machine body 21 may have a structure or mechanism for fixing it to the chip tray kit 1 (not shown), and the machine body 21 or each probe holder 23 may have a structure or mechanism for assisting in limiting the chip C (not shown), without limitation. The control module 22 may include, for example, a circuit board, a microprocessor, control circuitry, etc.

[0049] like Figure 1 , Figures 3 to 8 As shown, the chip tray kit 1 may include a tray 11 and 24 chip holders 12. The tray 11 includes 24 tray perforations 111, each perforation passing through the tray 11. The number of tray perforations 111, the shape of the perforations 111, and their arrangement are not limited to those shown in the figure. The number of chip holders 12 corresponds to the number of tray perforations 111. Each chip holder 12 is detachably fixed to the tray 11, and each chip holder 12 is correspondingly fixed in one of the tray perforations 111.

[0050] In practical applications, the chip tray kit 1 may also include multiple auxiliary fasteners 13. Some of the auxiliary fasteners 13 are detachably fixed to one side of the tray 11 (e.g., with at least one screw), while others are detachably fixed to the other side of the tray 11. In the accompanying drawings of this embodiment, each chip fastener 12 may be fixed to the tray 11 by 10 auxiliary fasteners 13. The tray 11 has 4 and 6 auxiliary fasteners 13 on opposite sides, respectively. With these 10 auxiliary fasteners 13, the chip fastener 12 is fixed in the tray perforation 111. The shape of the auxiliary fasteners 13 and the number of auxiliary fasteners 13 used to fix a single chip fastener 12 to the tray 11 are not limited to those shown in the figures.

[0051] like Figures 5 to 8 As shown, each chip holder 12 includes 16 fixing holes 121, 16 chip receiving slots 122, and multiple limiting structures 123. The number of fixing holes 121, chip receiving slots 122, and limiting structures 123 included in each chip holder 12 is not limited to those shown in the figure. Each fixing hole 121 is disposed through the chip holder 12, and the chip receiving slots 122 are connected to the fixing holes 121. Each chip receiving slot 122 is used to hold a chip C to be tested. Multiple electrical connection parts (not shown, such as various pins) of the chip C disposed in the chip receiving slot 122 are exposed outside the chip holder 12, and the multiple electrical connection parts can be connected to multiple probe holders 23 of the test equipment 2, thereby allowing the test equipment 2 (such as...) to connect to the test equipment 2. Figure 1 (As shown) can then be electrically connected to chip C.

[0052] The sidewalls forming the chip reservoir 122 extend in the direction of the chip reservoir 122 to form various limiting structures 123. The limiting structures 123 located in the same chip reservoir 122 are used to jointly limit the range of motion of the chip C located in the chip reservoir 122, so as to limit the chip C disposed in the chip reservoir 122 from leaving the chip reservoir 122. In this embodiment, it is taken that the chip C disposed in the chip reservoir 122 is limited by four limiting structures 123, but the number, formation position, shape, etc. of the limiting structures 123 are not limited to those shown in the figure. Of course, the limiting structures 123 cannot prevent the electrical connection part of the chip C disposed in the chip reservoir 122 from connecting with the probe holder 23 of the test machine 2.

[0053] like Figure 7As shown, in practical applications, the chip holder 12 may also include a guide structure 124. The guide structure 124 may be, for example, an inclined surface that slopes towards the chip cavity 122. Through the design of the guide structure 124, during the process of placing the chip C into the chip cavity 122 via the fixing hole 121, even if the placement position of the chip C is slightly off, the chip C will still be guided by the guide structure 124 and successfully placed in the chip cavity 122.

[0054] As described above, by designing the chip holder 12 to be detachably fixed to the tray 11, the user can selectively replace the chip holder 12 with different shapes and sizes of chip slots 122 and fixing holes 121, depending on the type, shape and size of the chip C to be tested.

[0055] like Figure 5 and Figure 6 As shown, in a preferred application, the chip tray assembly 1 may further include a plurality of elastic elements 14. One end of each elastic element 14 is fixedly disposed in a first receiving groove 1121 of the sidewall 112 forming the tray perforation 111, and the other end of each elastic element 14 is correspondingly disposed in a second receiving groove 1251 of the sidewall 125 of the chip holder 12. In embodiments where the chip holder 12 is generally rectangular in shape, at least one of the aforementioned elastic elements 14 may be disposed between each sidewall 125 of the chip holder 12 and the sidewall 125 forming the tray perforation 111.

[0056] When the chip holder 12 is fixedly installed in the tray perforation 111, the multiple elastic members 14 will be in a compressed state. The elastic force generated by the compression of each elastic member 14 will push against the chip holder 12, thus ensuring that the chip holder 12 is securely installed in the tray perforation 111. Since the multiple elastic members 14 are located between the side wall 125 of the chip holder 12 and the side wall 112 forming the tray perforation 111, and the multiple auxiliary fasteners 13 are fixed to the two opposite wide sides of the tray 11, when the user removes the multiple auxiliary fasteners 13 from the tray 11, the chip holder 12 will remain installed on the tray 11 due to the pushing force of the multiple elastic members 14. This prevents the chip holder 12 from falling to the ground when the multiple auxiliary fasteners 13 are removed from the tray 11. In addition, through the setting of the multiple elastic members 14, when the chip tray assembly 1 is fixed to the testing machine 2 (e.g., ...), Figure 1 When the chip holder 12 is positioned to one side (as shown), it can move slightly relative to the tray 11. This allows the multiple chips C carried by the chip holder 12 to more easily align with the multiple probe holders 23 of the testing machine 2 (as shown). Figure 2 (As shown) are connected.

[0057] like Figure 1 , Figures 5 to 9 As shown, the chip tray kit 1 may also include 24 auxiliary inserts 15. The number of auxiliary inserts 15 corresponds to the number of chip holders 12, and the number of auxiliary inserts 15 is not limited to that shown in the figure. Each auxiliary insert 15 is detachably disposed on one side of each chip holder 12.

[0058] Each auxiliary insert 15 includes a body 151 and multiple protrusions 152. The protrusions 152 are formed by protruding outward from one side of the body 151. The number of protrusions 152 corresponds to the number of fixing holes 121 in each chip holder 12. The chip holder 12 may also have multiple receiving grooves 126. Each receiving groove 126 communicates with each chip receiving groove 122. The aperture W1 of the receiving groove 126 is larger than the aperture W2 of the chip receiving groove 122. The receiving groove 126 is used to receive the protrusions 152 of the auxiliary insert 15.

[0059] The auxiliary insert 15 has an insertion hole 153 that penetrates the body 151 and the protrusion 152. The diameter W3 of the insertion hole 153 is larger than the contact portion 421 of the pressing member 42 (e.g., Figure 18 As shown (details to follow), the outer diameter W4, and a portion of the contact portion 421 can pass through the insertion hole 153 and protrude from one side of the auxiliary insert 15 (as shown). Figure 18 (As shown). The diameter W3 of the insertion hole 153 is smaller than the diameter W2 of the chip cavity 122. The height of the protrusion 152 can be approximately equal to the depth of the receiving groove 126, and when the protrusion 152 is located in the receiving groove 126, the body 151 of the auxiliary insert 15 abuts against the top surface 128 of the chip holder 12 (as shown). Figure 8 (As shown).

[0060] like Figure 7 and Figure 8 As shown, to facilitate the quick and accurate entry of the protrusion 152 into the fixing hole 121, the protrusion 152 may also include multiple guide ramps 1521, which facilitate easier entry of the protrusion 152 into the fixing hole 121. Figure 8 As shown, in practical applications, when the chip cavity 122 is provided with a chip C and the protrusion 152 is located in the receiving groove 126, a gap G is formed between the protrusion 152 and the surface C1 of the chip C, and the protrusion 152 will not contact the surface C1 of the chip C. When the chip holder 12 and the auxiliary insert 15 are fixedly disposed on the tray 11, the chip C disposed in the chip cavity 122 of the chip holder 12 will be simultaneously restricted by the chip holder 12 and the auxiliary insert 15, and each chip C is basically difficult to detach from the chip holder 12.

[0061] The manner in which each auxiliary insert 15 is detachably disposed on one side of each chip holder 12 is not limited. Any method that allows each auxiliary insert 15 to be detachably disposed on each chip holder 12 is within the scope of this embodiment. For example, in one embodiment, each auxiliary insert 15 and each chip holder 12 may be disposed together in the tray through-hole 111 of the tray 11, and the aforementioned plurality of auxiliary fasteners 13 may be used to limit the range of motion of each auxiliary insert 15 and each chip holder 12 relative to the tray 11. That is, each auxiliary insert 15 and each chip holder 12 are fixedly disposed in the tray through-hole 111 of the tray 11 by the plurality of auxiliary fasteners 13.

[0062] Following on, such as Figure 1 , Figure 5 , Figure 6 , Figures 9 to 12 As shown, in one preferred embodiment, the chip tray kit 1 may further include multiple quick-release components 16. At least one quick-release component 16 is disposed between each auxiliary insert 15 and each chip retainer 12. Each auxiliary insert 15 can be quickly installed on one side of the chip retainer 12 or quickly removed from one side of the chip retainer 12 via at least one quick-release component 16. For example, each chip retainer 12 may be provided with two quick-release components 16. Each quick-release component 16 may include two limiting members 161 and two elastic members 162. The chip retainer 12 may also have a groove 127. One end of each elastic member 162 is fixedly disposed on the sidewall forming the groove 127, and the other end of each elastic member 162 is fixed to one of the limiting members 161. The two limiting members 161 of each quick-release component 16 are disposed in one of the grooves 127.

[0063] Each limiting member 161 can be pushed and moved within the groove 127, correspondingly compressing the elastic member 162 it is connected to. The compressed elastic member 162 then generates an elastic restoring force. When the limiting member 161 is no longer pushed, the elastic restoring force generated by the compression of the elastic member 162 will cause the limiting member 161 to return to its unpushed position. When two limiting members 161 are disposed in the groove 127, a gap P is formed between the two limiting members 161.

[0064] Each limiting member 161 may have a slot 1611, and each slot 1611 divides the limiting member 161 into a pushing part 16A and a locking part 16B. The pushing part 16A has a guide slope 16A1 formed at the end opposite to the elastic member 162, and the locking part 16B has a locking slope 16B1 formed at the end facing the pushing part 16A.

[0065] like Figure 10 As shown, each auxiliary insert 15 may have a through hole 155, and each auxiliary insert 15 may have two engaging members 154 located at both ends of the through hole 155. Each engaging member 154 has an engaging bevel 1541 formed at one end opposite to the through hole 155. The through hole 155 of the auxiliary insert 15 provides an insert R to extend into. The insert R is used to push against the two limiting members 161 provided on the chip holder 12. In practical applications, the insert R can be fixed to a related robotic arm or other equipment used to fix the auxiliary insert 15 to the chip holder 12.

[0066] like Figures 10 to 11 As shown, the process of the auxiliary insert 15 and the insert R cooperating with each other and being fixed to the chip holder 12 can be as follows: First, the insert R passes through the through hole 155 of the auxiliary insert 15 and enters the gap P formed between the two limiting members 161. Since the outer diameter of the insert R is larger than the width of the gap P, when the insert R enters the groove 127, the insert R will push against the pushing part 16A of the two limiting members 161, and each limiting member 161 will move towards the elastic member 162 accordingly, and each elastic member 162 will be compressed and elastically deformed.

[0067] Following on, such as Figure 11 As shown, when the end of the insert R abuts against the bottom of the groove 127, each engaging member 154 will be correspondingly disposed in the slot 1611 of each limiting member 161. The engaging slope 1541 of each engaging member 154 is disposed facing each other with the engaging slope 16B1 of the engaging portion 16B of the adjacent limiting member 161, and each engaging slope 1541 does not contact the adjacent engaging slope 16B1. Next, as Figure 12 As shown, when the insert R is removed from the groove 127, the elastic restoring force generated by the pressure on the two elastic members 162 located in the groove 127 will cause the two limiting members 161 to move closer to each other. Finally, the engaging slope 16B1 of the engaging portion 16B of each limiting member 161 will abut against the engaging slope 1541 of the adjacent engaging member 154, and the auxiliary insert 15 will be engaged and fixed to the chip fixing member 12 accordingly.

[0068] like Figure 12 As shown, when the auxiliary insert 15 is fixed to the chip fixing member 12 via the engaging member 154 and the quick-release assembly 16, the relevant robotic arm or other mechanism can pass the insert R through the through hole 155 of the auxiliary insert 15 and into the gap P between the two limiting members 161, so as to push against the two limiting members 161. At this time, the two limiting members 161 will be... Figure 12 The state changes to Figure 11 In the state, Figure 11In this state, the engagement slope 16B1 of each limiting member 161 will no longer contact the engagement slope 1541 of the adjacent engagement member 154, and the relevant robotic arm and other mechanisms can hold the auxiliary insert 15 and pull the auxiliary insert 15 away from the chip fixing member 12, so that the auxiliary insert 15 and the chip fixing member 12 are separated from each other.

[0069] like Figure 3 and Figure 5 As shown, it is worth mentioning that in the embodiment where each auxiliary insert 15 is fixed to one side of the chip holder 12 by a quick-release assembly 16, each auxiliary insert 15 may be formed with a plurality of clearance holes 156, each clearance hole 156 being used to avoid the auxiliary holder 13, so that the auxiliary holder 13 does not restrict the range of motion of the auxiliary insert 15.

[0070] Please refer to the following: Figure 1 , Figure 13 and Figure 16 The cover 3 may have a body 31 and a conductive structure 32. A recessed groove 311 is formed on one side of the body 31, and the conductive structure 32 is formed on one side of the body 31 and located within the groove 311. Multiple pressing components 4 are disposed on the cover 3, and each pressing component 4 is located within the groove 311 of the cover 3. It should be noted that, in this embodiment… Figure 16 In this example, multiple pressing components 4 protrude from one end of the cover 3, but this is not a limitation. In different embodiments, the multiple pressing components 4 may not protrude from the cover 3, and each pressing component 4 may be completely located in the receiving groove 311 of the cover 3. In other words, the sum of the thickness of the conductive structure 32 and the height of each pressing component 4 may be greater than, equal to, or less than the depth of the receiving groove 311 of the cover 3.

[0071] The cover 3 is used to cover one side of the tray 11. When the cover 3 covers one side of the tray 11, the multiple pressing components 4 provided on the cover 3 will press against the surface C1 of the chip C (e.g., chip C) provided in the chip holder 12 of the tray 11. Figure 18 (As shown in the figure). In different embodiments, when the cover 3 is placed on one side of the tray 11, the multiple pressing components 4 may not be in contact with the multiple chips C until the closed space formed by the cover 3 and the tray 11 is evacuated, at which point the multiple pressing components 4 press against the surface C1 of the multiple chips C. The size, shape, and number of pressing components 4 provided in the conductive structure 32 of the cover 3 are not limited to those shown in the figure.

[0072] In practical applications, the cover 3 and the tray 11 can each have interlocking guide structures 33 and 113. For example, each guide structure 33 of the cover 3 can have blind holes, and each guide structure 113 of the tray 11 can be a columnar structure. When the cover 3 is placed on one side of the tray 11, the columnar structure of the tray 11 will correspondingly engage with the blind holes of the cover 3. Through the design of the guide structures 33 of the cover 3 and the guide structures 113 of the tray 11, the cover 3 can be quickly and correctly placed on one side of the tray 11, thereby enabling each pressing component 4 to be quickly and correctly positioned on one side of the chip C in the chip cavity 122. The number and shape of the guide structures 33 of the cover 3 and the guide structures 113 of the tray 11 are not limited to those shown in the figure.

[0073] like Figures 13 to 18 As shown, each pressing component 4 includes: a base 41, a pressing member 42, and two elastic members 43. In this embodiment, 16 pressing components 4 share the same base 41 as an example, but this is not a limitation. In different embodiments, multiple pressing components 4 may not share the same base 41. The base 41 may be a conductive structure 32 that is detachably fixed to the cover 3. In different embodiments, the base 41 may also be integrally formed with the conductive structure 32. In embodiments where the base 41 is detachably fixed to the cover 3, relevant personnel can easily replace and repair the pressing components 4.

[0074] Each pressing member 42 includes a contact portion 421 and a abutting portion 422. The contact portion 421 has a contact surface 4211, and the outer diameter W4 of the contact portion 421 is smaller than the diameter W3 of the insertion through hole 153 (e.g., ...). Figure 8 As shown), a portion of the contact portion 421 can extend into the insertion hole 153 (as shown). Figure 18 (As shown), and the contact surface 4211 can press against the surface C1 of the chip C. The contact portion 421 is mainly used to press against the surface C1 of the chip C so that the chip C can be stably connected to the test platform 2 (such as...). Figure 1 The chip C is connected to the probe holder 23 (as shown in the figure) to prevent the chip C from coming into contact with the probe holder 23 (as shown in the figure) during the testing process of the test equipment 2. Figure 2 The probes (as shown) are separated from each other.

[0075] The abutment portion 422 is connected to the contact portion 421. The abutment portion 422 is used to limit the range of movement of the pressing member 42 relative to the auxiliary insert 15, thereby preventing the contact portion 421 from excessively pressing against the chip C. Figure 18 As shown, when the cover 3 is placed on one side of the tray 11, the abutting part 422 of each pressing member 42 will be located on one side of the auxiliary insert 15, and the contact part 421 of the pressing member 42 will be located in the insertion hole 153, and the contact surface 4211 will be located on one side of the surface C1 of the chip C.

[0076] Each elastic element 43 has its two ends fixed to the base 41 and the pressing element 42. When the contact surface 4211 of the pressing element 42 contacts the uneven surface C1 of the chip C, at least one elastic element 43 will be in a compressed state. The elastic restoring force generated by the compression of the elastic element 43 allows the contact surface 4211 to remain in close contact with the surface C1 of the chip C. The number of elastic elements 43 included in each pressing component 4 is not limited to two. In different embodiments, a single pressing component 4 may contain only one elastic element 43 or more elastic elements 43.

[0077] like Figure 14 and Figure 15 As shown, in practical applications, the elastic element 43 can be, for example, a compression spring. The pressing assembly 4 can include two compression springs (elastic elements 43), and the pressing assembly 4 can also include two guides 44 and two fixing sleeves 45. The abutting portion 422 of the pressing element 42 can have two first grooves 4221, and the base 41 has two second grooves 411. Each first groove 4221 is arranged facing a second groove 411, and the two ends of each compression spring are respectively engaged with the first groove 4221 and the second groove 411.

[0078] The abutting portion 422 of the pressing member 42 may also have two through holes 4222, each through hole 4222 communicating with each first groove 4221. Two fixing components 45 are fixedly disposed in the two through holes 4222, each fixing component 45 having a through hole 451. One end of each guide member 44 is fixed to the base 41, and the other end of each guide member 44 passes through the through hole 451 of each fixing component 45. When the pressing member 42 moves relative to the base 41, each fixing component 45 can move relative to each guide member 44, and the two guide members 44 and the two fixing components 45 can jointly restrict the movement direction of the pressing member 42 relative to the base 41. Through the design of the two guide members 44 and the fixing components 45, the movement of the pressing member 42 can be effectively restricted to an axis L (e.g., perpendicular to the surface of the base 41) that is approximately perpendicular to the surface of the base 41. Figure 18 As shown, when the pressing member 42 presses against the surface C1 of the chip C, the contact portion 421 of the pressing member 42 will be the entire contact surface 4211 in contact with the surface C1 of the chip C.

[0079] Please reconsider. Figure 14Each pressing component 4 may also include at least one fixing structure 46 and at least one limiting member 47. The limiting member 47 is detachably fixed to the fixing structure 46. A portion of the limiting member 47 abuts against the abutting portion 422 of the pressing member 42. The limiting member 47 and the fixing structure 46 together limit the range of motion of the pressing member 42 relative to the base 41. For example, the base 41 may have 24 fixing structures 46, with 4 fixing structures 46 arranged in a row on the base 41. Every 6 fixing structures 46 and 2 limiting members 47 together limit 4 pressing members 42. The 24 fixing structures 46 cooperate with 8 limiting members 47 to provide 16 pressing members 42 on the base 41. Each fixing structure 46 may have a locking hole 461, and each limiting member 47 has three through holes 471. The three screws S can cooperate with the three fixing structures 46 and the three through holes 471 of the limiting member 47 to fix a single limiting member 47 to the three fixing structures 46. The single limiting member 47 is pressed against the abutment part 422 of the four abutment members 42.

[0080] In practical applications, the limiting member 47 may also include a receiving notch 472 for receiving a portion of the contact portion 421. In the accompanying drawings of this embodiment, therefore, a single limiting member 47 simultaneously abuts against the abutting portions 422 of four limiting members 47. Thus, the limiting member 47 may have four corresponding receiving notches 472, and the four receiving notches 472 are portions of the contact portions 421 corresponding to the four limiting members 47. The design of the receiving notch 472 helps to limit the movement direction of the pressing member 42 relative to the base 41, so that the pressing member 42 is approximately along an axis L perpendicular to the base 41 (e.g., ...). Figure 18 Move in the direction shown.

[0081] In embodiments where each pressing component 4 has a guide 44, the limiting member 47 has at least one clearance hole 473, each clearance hole 473 providing a passage for the guide 44 to pass through. That is, when the pressing member 42 moves toward the base 41, a portion of the guide 44 will pass through the clearance hole 473. The shape of the clearance hole 473 is not limited to that shown in the figures.

[0082] Please refer to the following: Figure 1 , Figure 13 , Figures 16 to 18 The temperature regulating device 5 can be connected to multiple pressing components 4 via the cover 3. The temperature regulating device 5 is used to bring the temperature of each pressing component 42 to a predetermined temperature. With the temperature regulating device 5 in place, when the chip C, which is mounted on the chip holder 12, is connected to the test machine 2 and tested by the test machine 2, the pressing component 42, having reached the predetermined temperature, will press against the chip C (e.g., ...). Figure 8Surface C1 (as shown) Figure 8 As shown), this allows chip C to be tested at a predetermined temperature. In a preferred embodiment, the pressure member 42 may be made of a metal material with high thermal conductivity.

[0083] In existing common chip testing operations, multiple chips are tested in a large freezer or oven. Since the temperature in different areas of a freezer or oven is rarely completely uniform, multiple chips cannot be tested at the same temperature, leading to unreliable test results. In contrast, the chip testing equipment A of this invention, during the testing of chip C on the testing machine 2, has the contact surfaces 4211 of each pressing member 42, which have reached a predetermined temperature, pressed against the surface C1 of each chip C. In this way, multiple chips C are tested at approximately the same temperature.

[0084] In practical applications, the temperature regulating device 5 can be used to bring the temperature of each pressing component 42 to a predetermined temperature in any way as needed, without limitation. For example, the temperature regulating device 5 can be connected to the conductive structure 32 of the cover 3, and each base 41 can be fixed to the conductive structure 32. The temperature regulating device 5 can raise or lower the temperature of the conductive structure 32, and the conductive structure 32 can transfer heat energy to the multiple pressing components 42 through multiple bases 41 and multiple elastic members 43, so that the temperature of each pressing component 42 reaches the predetermined temperature. The conductive structure 32 referred to here is a structure made of a material with a high thermal conductivity. In the embodiment where the body 31 of the cover 3 and the conductive structure 32 are integrally formed, the temperature regulating device 5 transfers heat energy to the multiple pressing components 4 through the cover 3. In the embodiment where the conductive structure 32 and the body 31 of the cover 3 are not integrally formed, the temperature regulating device 5 can be directly connected to the conductive structure 32.

[0085] In one embodiment, the conductive structure 32 may include at least one flow channel (not shown), and the temperature regulating device 5 can provide a fluid to the flow channel to raise or lower the temperature of the conductive structure 32. The fluid may be, for example, various high-temperature or low-temperature fluids. In one embodiment, the temperature regulating device 5 may include a temperature controller (not shown) and a heating coil (not shown), the temperature controller being electrically connected to the heating coil, the heating coil being disposed in the conductive structure 32, and the temperature controller being able to actuate the heating coil to raise the temperature of the conductive structure 32. In embodiments where the temperature regulating device 5 includes a temperature controller, the temperature regulating device 5 may also include a cooling chip (not shown), the temperature controller being electrically connected to the cooling chip, the cooling chip being disposed in the conductive structure 32, and the temperature controller being able to actuate the cooling chip to lower the temperature of the conductive structure 32. In practical applications, the conductive structure 32 may also simultaneously include a cooling chip and a heating coil; this is not a limitation.

[0086] like Figure 14 As shown, to facilitate the temperature of the pressing member 42 reaching the predetermined temperature, each pressing component 4 may also include a heat-conducting member 48. The heat-conducting member 48 is located between the pressing member 42 and the base 41, and is connected to both the pressing member 42 and the base 41. The heat-conducting member 48 assists in the heat transfer between the pressing member 42 and the base 41. For example, the heat-conducting member 48 may include two elastic arms 481, with one end of each arm connected to the other. When the pressing member 42 moves towards the base 41, the two elastic arms 481 are elastically deformed by the pressure from the pressing member 42. When the pressing member 42 moves away from the base 41, the elastic restoring force generated by the pressure on the elastic arms 481 will restore them to their unpressurized state. Thus, whether the pressing member 42 is stationary or moving relative to the base 41, the heat between the pressing member 42 and the conductive structure 32 can be effectively transferred through the heat-conducting member 48. It is worth mentioning that the aforementioned guide 44 and fixing kit 45 can also be made of materials with high thermal conductivity, and the guide 44 and fixing kit 45 can also be used to conduct heat between the pressing member 42, the base 41 and the conductive structure 32.

[0087] Please refer to the following: Figure 1 , Figures 16 to 19 In practical applications, chip testing equipment A may also include a vacuum pumping device 6, a moving device 7, and a processing device 8. The processing device 8 is electrically connected to the testing machine 2, the vacuum pumping device 6, and the moving device 7, and the processing device 8 can control the operation of the testing machine 2, the vacuum pumping device 6, and the moving device 7. The processing device 8 may be, for example, various computers or servers.

[0088] The moving device 7 is connected to the cover 3, and the moving device 7 can drive the cover 3 to move closer to or away from the tray 11. The moving device 7 referred to here is mainly used to make the cover 3 and the tray 11 move closer to or away from each other. Therefore, in different embodiments, the moving device 7 can also be connected to the tray 11, and the moving device 7 drives the tray 11 to move closer to or away from the cover 3.

[0089] When the moving device 7 moves the cover 3 toward the tray 11 and places the cover 3 on one side of the tray 11, with the side of the tray 11 opposite the cover 3 fixed to the testing machine 2, the contact surfaces 4211 of each pressing member 42 will abut against the surface C1 of the chip C. One side of the chip C is connected to the probe holder 23 of the testing machine 2, and the cover 3, chip fixing member 12, tray 11, and multiple chips C will together form a closed space SP. At this time, the processing device 8 will control the vacuum device 6 to operate, causing the vacuum device 6 to extract the air from the closed space SP, thereby making the closed space SP a negative pressure state.

[0090] It is worth mentioning that the chip testing device A may also include at least one detector (not shown in the figure). The detector is electrically connected to the processing device 8. The detector is used to detect whether the cover 3 is placed on one side of the tray 11. When the processing device 8 determines that the cover 3 has been placed on one side of the tray 11 based on the detection result of the detector, the processing device 8 will control the vacuum device 6 to operate.

[0091] By using the vacuum pump 6 to extract the gas from the enclosed space SP and making the enclosed space SP a negative pressure state, the design can effectively prevent the temperature inside the enclosed space SP from being affected by the environment outside the enclosed space SP, thereby effectively controlling the humidity of the enclosed space SP, and thus significantly reducing the problem of condensation on the surface C1 of the low-temperature chip C.

[0092] Please refer to the following: Figure 8 and Figure 18Since the aperture W3 of the insertion hole 153 of each auxiliary insert 15 is smaller than the aperture W2 of the chip cavity 122, when the enclosed space SP changes from a negative pressure state to a normal pressure state and the moving device 7 moves away from the tray 11, if the chip C sticks to the pressing member 42, as the contact portion 421 moves away from the auxiliary insert 15 along the insertion hole 153, the chip C will be pushed away from the contact portion 421 by the end of the protrusion 152 of the auxiliary insert 15 near the chip cavity 122. In other words, by providing auxiliary inserts 15 on the tray 11 and designing the aperture W3 of the insertion hole 153 to be smaller than the aperture W2 of the chip cavity 122, it can be ensured that the chip C does not stick to the contact portion 421 when the cover 3 and the multiple pressing components 4 move away from the tray 11.

[0093] The chip testing equipment A of the present invention, when manufactured and sold, may include a testing machine 2, a cover 3, multiple pressing components 4, a temperature regulating device 5, and a processing device 8, but is not limited thereto. In different embodiments, the chip testing equipment A of the present invention may also include at least one of a chip tray kit 1, a vacuuming device 6, and a moving device 7. Furthermore, the chip tray kit 1 of the present invention may also be manufactured and sold separately.

[0094] Please see Figure 19 The diagram shows cross-sectional views of different embodiments of the pressing component of the present invention. The biggest difference between the pressing component of this embodiment and the previous embodiments is that the heat-conducting element 48 can be a cylindrical structure. One end of the heat-conducting element 48 is fixed in a groove 423 of the pressing component 42, and one end of the heat-conducting element 48 is movably disposed in a receiving groove 412 of the base 41. The other end of the heat-conducting element 48 is fixed to the pressing component 42. When the pressing component 42 moves relative to the base 41, the heat-conducting element 48 moves in the receiving groove 412 of the base 41, and the heat-conducting element 48 is in constant contact with the side wall forming the receiving groove 412. The temperature regulating device 5 transfers heat energy to the pressing component 42 through the base 41 and the heat-conducting element 48, which is a cylindrical structure.

[0095] In summary, the pressing component of the present invention can be applied in chip testing equipment. The pressing component presses against the surface of the chip being tested, thereby ensuring a stable connection between the chip and the relevant electrical connector during testing. The pressing component can also be connected to a temperature regulating device, allowing the temperature of the pressing component to reach a predetermined temperature. This ensures the chip is tested at the predetermined temperature. The chip testing equipment of the present invention, through the design of the pressing component and temperature regulating device, allows the chip to be stably connected to the testing equipment by the pressing component during testing. Furthermore, the pressing component reaching the predetermined temperature ensures the chip is tested at the predetermined temperature. The chip testing equipment of the present invention can also include a vacuum device, which prevents the chip and the pressing component reaching the predetermined temperature from being easily affected by the external environment.

[0096] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention.

Claims

1. A pressure-absorbing component, characterized in that, The pressing component is fixedly disposed on a cover. One side of the cover has a recessed groove. The pressing component is located within the groove. The cover is used to cover one side of a chip tray assembly, and the pressing component is used to press against a chip held by one of the chip holders of the chip tray assembly. The chip tray assembly includes a tray and multiple chip holders. The tray includes multiple tray perforations, each perforation penetrating the tray. Each perforation contains a chip holder. Each chip holder includes at least one fixing perforation and at least one chip receiving groove. The fixing perforation penetrates the chip holder. Each chip receiving groove holds one chip, and a portion of the chip in the chip receiving groove is exposed outside the chip holder. The pressing component includes: A base for fixing the cover body; A pressing member includes a contact portion having a contact surface, a portion of the contact portion being able to extend into one of the fixing through holes, and the contact surface being used to press against a surface of a chip disposed in one of the chip receptacles. At least one elastic element has its two ends fixed to the base and the pressing element, respectively; when the pressing element presses against the surface of the chip, the elastic element will elastically deform, and when the pressing element no longer presses against the surface of the chip, the elastic restoring force generated by the pressure on the elastic element will cause the pressing element to return to the state of not pressing against the chip; The pressing member further includes a backing portion, and the pressing assembly further includes at least one fixing structure and at least one limiting member. The fixing structure is fixed to the base, and the limiting member is detachably fixed to the fixing structure. A portion of the limiting member is used to abut against the backing portion of the pressing member, and the limiting member and the fixing structure can jointly limit the range of motion of the pressing member relative to the base.

2. The pressing component according to claim 1, characterized in that, The pressing member further includes a pressing portion; when the cover is placed on one side of the tray and the pressing portion abuts against a top surface of the tray, a portion of the contact portion extends into one of the chip slots, and the contact surface can press against the surface of the chip disposed in the chip slot.

3. The pressure-absorbing component according to claim 2, characterized in that, The pressing assembly includes at least two elastic elements, each of which is a compression spring. The abutting portion of the pressing element has at least two first grooves, and the base has at least two second grooves. Each first groove faces one of the second grooves, and the two ends of each elastic element are respectively engaged with the first groove and the second groove.

4. The pressing component according to claim 3, characterized in that, The pressing member has two through holes, each of which communicates with each of the first grooves. The pressing assembly also includes at least two guide members and at least two fixing components. The two fixing components are fixedly disposed in the two first grooves. Each fixing component has a through hole. One end of each guide member is fixed to the base, and the other end of each guide member passes through the through hole of each fixing component. When the pressing member moves relative to the base, each fixing component can move relative to each guide member, and the two guide members and the two fixing components can jointly restrict the direction of movement of the pressing member relative to the base.

5. The pressing component according to claim 1, characterized in that, The limiting member includes a receiving notch for receiving a portion of the contact portion.

6. The pressing component according to claim 1, characterized in that, The pressure-bearing assembly further includes a heat-conducting element connected to the pressure-bearing element and connected to the base. The heat-conducting element is located between the pressure-bearing element and the base, and is used to assist in the mutual transfer of heat between the pressure-bearing element and the base.

7. A chip testing device, characterized in that, The chip testing equipment is used to test multiple chips carried by a chip tray kit. The chip tray kit includes a tray and multiple chip holders. The tray includes multiple tray through-holes, each of which passes through the tray. Each chip holder is disposed on the tray and located in each of the tray through-holes. Each chip holder includes at least one fixing through-hole and at least one chip receiving slot. The fixing through-hole passes through the chip holder. Each chip receiving slot is used to hold one chip, and a portion of the chip disposed in the chip receiving slot is exposed outside the chip holder. The chip testing equipment includes: A cover body, one side of which is recessed to form a receiving groove, the cover body being used to cover one side of the tray; A plurality of pressing components are disposed on the cover body, and each pressing component is located in the receiving groove of the cover body. The plurality of pressing components are used to press against a plurality of chips carried by a plurality of chip holders of the chip tray kit. Each pressing component includes: A base for fixing the cover body; A pressing member includes a contact portion having a contact surface, a portion of the contact portion being able to extend into one of the fixing through holes, and the contact surface being used to press against a surface of a chip disposed in one of the chip receptacles. At least one elastic element has its two ends fixed to the base and the pressing element, respectively; when the pressing element presses against the surface of the chip, the elastic element will elastically deform, and when the pressing element no longer presses against the surface of the chip, the elastic restoring force generated by the pressure on the elastic element will cause the pressing element to return to the state of not pressing against the chip; A test machine is used to connect to the chip tray kit, the test machine is used to electrically connect to a plurality of chips carried by the chip tray kit, and the test machine is used to test a plurality of chips disposed in a plurality of chip slots; Each of the pressing members further includes a backing portion, and each of the pressing components further includes at least one fixing structure and at least one limiting member. The fixing structure is fixed to the base, and the limiting member is detachably fixed to the fixing structure. A portion of the limiting member is used to abut against the backing portion of the pressing member, and the limiting member and the fixing structure can jointly limit the range of motion of the pressing member relative to the base.

8. The chip testing equipment according to claim 7, characterized in that, The chip testing equipment also includes a temperature regulating device connected to multiple of the pressing components, the temperature regulating device being used to bring the temperature of each of the pressing components to a predetermined temperature.

9. The chip testing equipment according to claim 7, characterized in that, When the cover is placed on one side of the tray, the cover, the tray, the multiple chip holders, and the multiple chips together form a closed space; the chip testing equipment also includes a vacuum device, which is used to extract the air in the closed space so that the closed space is in a negative pressure state.

10. The chip testing equipment according to claim 8, characterized in that, The cover includes a body and a conductive structure. The temperature regulating device is connected to the conductive structure and is used to raise or lower the temperature of the conductive structure. Each of the bases is detachably fixed to the conductive structure. The conductive structure can transfer heat energy to the multiple pressing members through the multiple bases and multiple elastic members, so that the temperature of each pressing member reaches the predetermined temperature.

11. The chip testing equipment according to claim 10, characterized in that, The conductive structure has at least one flow channel, and the temperature regulating device can provide a fluid to the flow channel to raise or lower the temperature of the conductive structure.

12. The chip testing equipment according to claim 10, characterized in that, The temperature regulating device includes a temperature controller and a heating coil. The temperature controller is electrically connected to the heating coil. The heating coil is disposed in the conductive structure. The temperature controller can activate the heating coil to raise the temperature of the conductive structure.

13. The chip testing equipment according to claim 10, characterized in that, The temperature regulating device includes a temperature controller and a cooling chip. The temperature controller is electrically connected to the cooling chip, and the cooling chip is disposed in the conductive structure. The temperature controller enables the cooling chip to operate, thereby lowering the temperature of the conductive structure.

14. The chip testing equipment according to claim 10, characterized in that, Each of the pressure-absorbing components further includes a heat-conducting element connected to the pressure-absorbing component and connected to the base. The heat-conducting element is located between the pressure-absorbing component and the base and is used to assist in the mutual transfer of heat between the pressure-absorbing component and the base.

15. The chip testing equipment according to claim 7, characterized in that, The chip testing equipment also includes multiple auxiliary inserts, which are fixed to one side of the tray. Each auxiliary insert includes a body and at least one protrusion. The protrusion protrudes outward from one side of the body and is disposed in the fixing through hole. The auxiliary insert has an insertion through hole that penetrates the body and the protrusion. The diameter of the insertion through hole is larger than the outer diameter of the contact portion, and a portion of the contact portion can pass through the insertion through hole and protrude from one side of the auxiliary insert. The insertion through hole is smaller than the diameter of the chip cavity.

16. The chip testing equipment according to claim 15, characterized in that, When the cover is placed on one side of the tray, the cover, the tray, the plurality of chip fixing components, the plurality of auxiliary inserts, and the plurality of chips together form a closed space; the chip testing equipment also includes a vacuum device, which is used to extract air from the closed space to make the closed space a negative pressure state.

17. The chip testing equipment according to claim 7, characterized in that, The chip testing equipment also includes the chip tray kit.

18. The chip testing equipment according to claim 17, characterized in that, Each of the chip fixing members has a plurality of first receiving grooves on its sidewall, and each of the tray through holes has a plurality of second receiving grooves on its sidewall. A plurality of elastic members are provided between each of the chip fixing members and the sidewall forming the tray through hole. The two ends of each of the elastic members located between each of the chip fixing members and the sidewall forming the tray through hole are respectively engaged in one of the first receiving grooves and one of the second receiving grooves.

19. The chip testing equipment according to claim 7, characterized in that, Each of the abutting members further includes an abutting portion; when the cover is placed on one side of the tray and each of the abutting portions abuts against a top surface of the tray, a portion of each of the contact portions extends into one of the chip slots, and each of the contact surfaces can press against the surface of the chip disposed in the chip slot.

20. The chip testing equipment according to claim 19, characterized in that, Each of the pressing components includes at least two elastic elements, each elastic element being a compression spring. The abutting portion of each pressing component has at least two first grooves, and each base has at least two second grooves. Each first groove faces one of the second grooves, and the two ends of each elastic element are respectively engaged with the first groove and the second groove.

21. The chip testing equipment according to claim 20, characterized in that, Each of the pressing members has two through holes, and each through hole of each of the pressing members communicates with each of the first grooves; each pressing assembly also includes at least two guide members and at least two fixing components, the two fixing components are fixedly disposed in the two first grooves, each fixing component has a through hole, one end of each guide member is fixed to the base, and the other end of each guide member passes through the through hole of each fixing component; when each of the pressing members moves relative to the base, each fixing component can move relative to each guide member, and the two guide members and the two fixing components can jointly restrict the movement direction of the pressing member relative to the base.

22. The chip testing equipment according to claim 7, characterized in that, Each of the limiting members includes a receiving notch for receiving a portion of the contact portion.

23. The chip testing equipment according to claim 7, characterized in that, Each of the pressure-absorbing components further includes a heat-conducting element connected to the pressure-absorbing component and connected to the base. The heat-conducting element is located between the pressure-absorbing component and the base and is used to assist in the mutual transfer of heat between the pressure-absorbing component and the base.

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