Display device

Abstract

A display device is disclosed. In one aspect, the display device includes a substrate having a display area and a pad area, wherein the display area includes a plurality of pixels configured to display an image, and the pad area is adjacent to the display area and configured to transmit electrical signals. At least a portion of the pad area is bendable. The display device further includes an insulating layer formed over the substrate and including a bend slot in the pad area. The bend slot includes a sidewall. A plurality of peripheral wires are formed over the insulating layer, and a cutout portion is connected to the sidewall and disposed between adjacent peripheral wires.

Description

[0001] This application is a divisional application of the patent application filed on August 10, 2016, with application number 201610652721.X and entitled "Display Device". Technical Field

[0002] The technology described generally relates to a display device. Background Technology

[0003] Display devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light-emitting diode (OLED) displays, electric field effect displays, and electrophoretic displays are facing increasing market demand.

[0004] These devices include a display panel that displays images by emitting multi-color light and a window disposed on and protecting the display panel. Significant progress has been made in display devices by further including a touch panel for receiving input signals from human contact or handheld input devices (e.g., styluses).

[0005] At this point, in order to utilize the display panel for light emission, a driver chip is installed around the periphery of the display panel to drive the display panel by transmitting touch signals. To electrically connect the display panel and the driver chip, pad electrodes are formed on a portion of the display panel. These pad electrodes are formed of a conductive material to electrically connect the display panel and the driver chip.

[0006] The market demand for display devices with a large display area is increasing, and manufacturers are developing display devices that can reduce the ratio of pad area to display area and improve display performance. Summary of the Invention

[0007] One aspect of the invention relates to a display device capable of reducing the pad area of ​​the display device and preventing short circuits between wirings.

[0008] Another aspect includes a display device having: a substrate including a display area having a plurality of pixels for displaying an image and a pad area for transmitting electrical signals, wherein a portion of the pad area can be bent; an insulating layer formed on the substrate and including a bending groove in the pad area; a plurality of peripheral wirings formed above the insulating layer; and cut-off portions protruding from or recessed from the sidewalls of the bending grooves and disposed between the plurality of peripheral wirings adjacent to each other.

[0009] The bending groove is provided on the insulation layer in a direction that intersects with the length direction of the outer wiring. The cut-off portion is provided on the same layer as the insulation layer.

[0010] The cut-off portion is formed from the same material as the insulating layer. The cut-off portion is integrally formed with the insulating layer.

[0011] The width of the cut-off portion remains constant from the sidewall to the end of the cut-off portion.

[0012] The width of the cut-off portion decreases from the sidewall to the end of the cut-off portion.

[0013] The display area includes display wiring extending from the pixels to the pad area, wherein one end of the peripheral wiring contacts the display wiring through a first contact hole.

[0014] The pad area includes pad electrodes and pad wiring. The other end of the peripheral wiring contacts the pad wiring through a second contact hole, and the pad electrode contacts the pad wiring through the pad contact hole.

[0015] The display area is connected to the display wiring and includes a thin-film transistor with a gate electrode, a source electrode, and a drain electrode. The display wiring is made of the same material as the gate electrode, and the peripheral wiring is made of the same material as the source electrode and the drain electrode.

[0016] The cut-off portion has multiple protrusions at the edge of the pad area that protrudes from the sidewall to the substrate.

[0017] Cut off multiple recesses that have the edges of the pad area recessed from the sidewall into the substrate.

[0018] The height of the cut-off portion is equal to or less than the height of the insulation layer.

[0019] Another aspect is a display device comprising: a substrate including a display area and a pad area, wherein the display area includes a plurality of pixels configured to display an image, the pad area being adjacent to the display area and configured to transmit electrical signals, wherein at least a portion of the pad area is bendable; an insulating layer formed over the substrate and including a bending groove in the pad area, wherein the bending groove includes sidewalls; a plurality of peripheral wirings formed over the insulating layer; and cut-off portions connected to the sidewalls and disposed between adjacent peripheral wirings.

[0020] In the above display device, the curved groove extends in a direction that intersects with the direction of the peripheral wiring.

[0021] In the above display device, the cut-off portion is formed on the same layer as the insulating layer.

[0022] In the above display device, the cut-off portion is formed of the same material as the insulating layer.

[0023] In the above display device, the cut-off portion is integrally formed with the insulating layer.

[0024] In the above display devices, the width of the cut-off portion is basically the same from the side wall to the end area of ​​the cut-off portion.

[0025] In the above display device, the width of the cut-off portion decreases from the side wall to the end of the cut-off portion.

[0026] In the above display device, the display area includes display wiring extending from the pixel to the pad area, wherein one end of the peripheral wiring contacts the display wiring through a first contact hole.

[0027] In the above display device, the pad area includes pad electrodes and pad wiring, wherein the other end of the peripheral wiring contacts the pad wiring through a second contact hole, and the pad electrode contacts the pad wiring through a pad contact hole.

[0028] In the above display device, the display area is connected to the display wiring and includes a thin-film transistor having a gate electrode, a source electrode, and a drain electrode, wherein the display wiring is formed of the same material as the gate electrode, and the peripheral wiring is formed of the same material as the source electrode and the drain electrode.

[0029] In the above display device, the cut-off portion includes multiple protrusions that extend from the edge of the sidewall to the pad area.

[0030] In the above display device, the cut-off portion includes multiple recesses that are recessed from the sidewall to the edge of the pad area.

[0031] In the above display devices, the height of the cut-off portion is basically equal to or less than the height of the insulating layer.

[0032] Another aspect is a display device comprising: a substrate including a display area configured to display an image and a pad area adjacent to the display area and configured to transmit electrical signals to the display area, wherein a portion of the pad area is bendable; an insulating layer formed over the substrate and including a bending groove formed in the pad area, wherein the bending groove includes sidewalls; a plurality of display wirings formed in the display area; a plurality of peripheral wirings formed in the peripheral area and electrically connected to the display wirings; and a cut-off portion extending from the sidewalls into the display area or protruding from the insulating layer of the display area into the sidewalls of the peripheral area, wherein the cut-off portion is positioned between adjacent peripheral wirings.

[0033] In the above display device, the height of the bending groove is lower than the height of the remaining part of the insulating layer.

[0034] In the above display devices, the cut-off portion is basically rectangular.

[0035] In the above display device, the selected display wiring and the selected peripheral wiring are superimposed in the superposition area of ​​the display area, wherein the superposition area has a length smaller than the length of the cut-off portion.

[0036] In the above display devices, the cut-off portion is basically triangular.

[0037] In the above display devices, the sidewalls and the selected peripheral wiring are superimposed on the depth dimension of the display device.

[0038] In the above display devices, the width of the cut-off portion is smaller than the width of the peripheral wiring.

[0039] According to at least one of the disclosed embodiments, a display device is provided in which, when the display device is bent, the probability of damage to the display device due to the modulus difference of each insulating layer formed by stacking multiple layers can be reduced in a bending groove formed by removing the portion of the insulating layer corresponding to the bending area of ​​the pad area of ​​the display device.

[0040] In addition, a display device is provided that reduces the probability of short circuits between multiple peripheral wirings by cutting off a portion. Attached Figure Description

[0041] Figure 1 A top plan view of a display device according to an exemplary embodiment is shown.

[0042] Figure 2 A side view showing the bent state of the display device illustrating an exemplary embodiment is shown.

[0043] Figure 3 A display device according to a first exemplary embodiment is shown. Figure 1 A magnified view of region A in the image.

[0044] Figure 4 Show along Figure 3 A sectional view taken along line IV-IV.

[0045] Figure 5 Show Figure 3 A magnified view of region B in the image.

[0046] Figure 6 A display device according to a second exemplary embodiment is shown. Figure 3 A magnified view of region B in the image.

[0047] Figure 7 A display device according to a third exemplary embodiment is shown. Figure 3 A magnified view of region B in the image.

[0048] Figure 8 A display device according to a fourth exemplary embodiment is shown. Figure 3 A magnified view of region B in the image.

[0049] Figure 9A cross-sectional view showing a portion of pixels in the display area of ​​a display device according to an exemplary embodiment is shown. Detailed Implementation

[0050] In the following description, exemplary embodiments will be described in detail with reference to the accompanying drawings. However, in describing the present technology, descriptions of known functions or structures will be omitted so that the subject matter of the present technology remains clear.

[0051] Parts unrelated to the description of exemplary embodiments are not shown in the drawings to make the description clearer; the same reference numerals denote the same elements throughout the specification. Additionally, for better understanding and ease of description, the dimensions and thicknesses of each construction shown in the drawings are arbitrarily illustrated, but the technology is not limited thereto.

[0052] In the accompanying drawings, the thickness of layers, films, panels, regions, etc., is exaggerated for clarity. The thickness of some layers and regions is exaggerated in the drawings for ease of understanding and description. In this disclosure, the term "substantially" includes completely, almost completely, or, in some applications, and to any degree that is significant to those skilled in the art. Furthermore, "formed on, disposed on, or located above" can also mean "formed on, disposed on, or located on". The term "connection" includes electrical connections.

[0053] Figure 1 A top plan view of a display device 100 according to an exemplary embodiment is shown. Figure 2 A side view showing the bent state of the display device 100 illustrating an exemplary embodiment is shown.

[0054] The display device 100 according to an exemplary embodiment includes a substrate 110, an insulating layer 120, a plurality of peripheral wirings 124, and a cut-off portion 126.

[0055] like Figure 1 As shown, the substrate 110 of this exemplary embodiment includes a display area DA and a pad area PA that are distinguishable by their respective functions. The display area DA is a region formed in the substrate 110 and includes a plurality of pixels PX for displaying images, while the pad area PA is a region that receives electrical signals transmitted from the outside to the display area through electrical connections with the chip-on-film (COF) and the flexible printed circuit board (FPCB).

[0056] The substrate 110 according to this exemplary embodiment may be a plastic film formed of a flexible material such as polyimide or polycarbonate. Therefore, the substrate 110 of this exemplary embodiment may allow a portion of the pad region PA to... Figure 2 The bend shown in the image.

[0057] An insulating layer 120 is formed on a substrate 110 in this exemplary embodiment. The insulating layer 120 protects the substrate 110 by preventing moisture and oxygen from penetrating from the outside. The insulating layer 120 is formed by stacking organic or inorganic layers, or by alternately stacking organic and inorganic layers.

[0058] For example, the insulating layer 120 of this exemplary embodiment includes a barrier layer 120a, a buffer layer (not shown), gate insulating layers 120b and 120c, and an interlayer insulating layer 120d on a substrate 110.

[0059] The barrier layer 120a is formed by stacking multiple organic or inorganic layers, or by alternately stacking organic and inorganic layers. The barrier layer 120a is formed of a material having lower moisture permeability and oxygen permeability than the substrate 110, so that moisture and oxygen permeating through the substrate 110 do not permeate the light-emitting element 30. Regarding the light-emitting element 30, details are provided below. Figure 9 Examples are given in the section.

[0060] Similar to the barrier layer 120a, the buffer layer (not shown) is also formed by stacking multiple organic or inorganic layers. In order to form pixel circuits at the light-emitting element 30 in the display area DA and to prevent moisture and impurities from penetrating into the pixel circuits and the light-emitting element 30, the buffer layer provides a substantially flat surface.

[0061] Gate insulating layers 120b and 120c are formed on the buffer layer by organic or inorganic layers, such that the gate wiring, including the gate line (not shown), gate electrode 32, and gate pad (not shown), is insulated from the conductive material of other layers. Although not shown in the figures, the gate line of this exemplary embodiment includes a first gate line and a second gate line formed in a different layer from the first gate line, such that the first gate insulating layer 120b and the second gate insulating layer 120c are formed corresponding to the first gate line and the second gate line.

[0062] An interlayer insulating layer 120d is formed on gate insulating layers 120b and 120c and is primarily formed of an organic layer, but is not limited thereto. The interlayer insulating layer 120d is formed between the data wiring and the gate wiring, including data lines (not shown), data pads (not shown), source electrode 33 and drain electrode 34, such that the interlayer insulating layer 120d insulates the gate wiring and the data wiring from each other.

[0063] When a traditional display device is bent, the following problems may occur: damage to the display device when bent; or the large modulus difference between the layers due to the excessive thickness of the insulating layer caused by stacking multiple organic or inorganic layers, making the display device difficult to bend.

[0064] Therefore, the display device 100 of this exemplary embodiment includes a curved groove BD formed by removing a portion of the insulating layer 120 corresponding to a curved region of the display device 100. Since the curved groove BD is formed by removing a portion of the insulating layer 120, a sidewall 128 can be formed by the step of the remaining insulating layer 120.

[0065] In this case, the curved groove BD of this exemplary embodiment can be formed by removing a portion of the barrier layer 120a, buffer layer (not shown), gate insulating layers 120b and 120c, and interlayer insulating layer 120d included in the insulating layer 120, or by removing the entire insulating layer 120 to expose the substrate 110.

[0066] Figure 2 and Figure 4 The diagram shows a curved groove BD formed by removing the buffer layer, gate insulating layers 120b and 120c, and interlayer insulating layer 120d from insulating layer 120, while retaining barrier layer 120a.

[0067] However, this embodiment is only an example. As mentioned above, it is possible to remove only the barrier layer 120a or only the interlayer insulating layer 120d while retaining the buffer layer (not shown) and the gate insulating layers 120b and 120c.

[0068] The cut-off portion 126 is formed on the sidewall of the bending groove BD. The cut-off portion 126 protrudes from the sidewall 128 of the bending groove BD to the edge of the pad area on the substrate or is recessed from the sidewall 128 of the bending groove BD to the edge of the pad area on the substrate.

[0069] Figure 3 A portion of the pad region PA and the display region DA, including a cut-out portion 126 protruding from the sidewall 128 of the curved groove BD, are shown according to a first exemplary embodiment. Figure 4 It shows along Figure 3 A sectional view taken along line IV-IV.

[0070] The term "protrusion" can mean that the cut-off portion 126 extends toward the edge of the pad area PA of the substrate 110. For example, this means that the cut-off portion 126 extends from the sidewall 128 of the curved groove BD that is retained in the insulating layer 120 toward the blank space opened at the curved groove BD by removing the insulating layer 120.

[0071] Multiple peripheral wirings 124 are formed on the insulating layer 120 including the bending groove BD in this exemplary embodiment. The peripheral wirings 124 are electrically connected to multiple display wirings in the display area DA and multiple pad electrodes 140 in the pad area PA.

[0072] like Figure 3and Figure 4 As shown, one end of the peripheral wiring 124 is electrically connected to the display wiring 130 through a first contact hole 124a via a contact, and the other end of the peripheral wiring 124 is electrically connected to the pad wiring 136 in the pad area PA through a second contact hole 124b via a contact.

[0073] The pad wiring 136 contacts the pad contact hole 142 and is connected to the pad electrode 140. The display wiring 130 of this exemplary embodiment is formed of the same material as the gate wiring described above, and the peripheral wiring 124 of this exemplary embodiment is formed of the same material as the data wiring described above.

[0074] For example, display wiring 130 includes a first display wiring 132 and a second display wiring 134 formed on a different layer from the first display wiring 132. The first display wiring 132 is formed on a first gate line and the second display wiring 134 is formed on a second gate line formed on a different layer from the first gate line, and are formed of the same material as the first gate line and the second gate line formed on a different layer from the first gate line, respectively.

[0075] However, it is not limited to this; even if the peripheral wiring 124 is formed of the same material as the gate wiring, the scope of the described technique is not limited. After forming the display wiring 130 and the peripheral wiring 124, in order to form as targeted Figure 9 The pixels in the described display area DA can be fitted with materials used to form electrodes similar to pixel electrodes 371 or common electrodes 373.

[0076] In this case, since the material used to form the electrode is applied not only to the display area DA but also to all areas of the substrate 110, the material used to form the electrode that is not removed can be retained in the lower side of the curved groove BD where the steps are formed.

[0077] If the material used to form the electrode remains in the bending groove BD, a short circuit will occur because the remaining material used to form the electrode is located in the insulating layer 120 including the bending groove BD, causing the peripheral wiring 124 to connect, resulting in a defective product. Therefore, according to this exemplary embodiment, a plurality of cut-off portions 126 are formed to prevent the material used to form the electrode from remaining in the bending groove BD.

[0078] According to this exemplary embodiment, a plurality of cut-off portions 126 are formed between each peripheral wiring 124 such that, in contrast to the case where no cut-off portions 126 are formed, the cut-off portions 126 extend the circumferential length of the sidewall 128 of the curved groove BD.

[0079] The material used to form the electrode is not retained between the peripheral wirings 124, which reduces the probability that the material used to form the electrode can be retained on the sidewall 128 in the bending groove BD due to the extension of the circumferential length of the sidewall 128, thereby preventing short circuits between the peripheral wirings 124.

[0080] The cut-off portion 126 of this exemplary embodiment may be formed of the same material as the insulating layer 120 and may be integrally formed with the insulating layer 120.

[0081] When a portion of the insulating layer 120 is removed to form the curved groove BD, in order to form the cut-off portion 126 at the sidewall 128, the curved groove BD can be formed by using a mask corresponding to the shape of the cut-off portion 126.

[0082] Additionally, although not shown in the accompanying drawings, the cut-off portion 126 of this exemplary embodiment has a height that is the same as or lower than the height of the sidewall 128 of the bending groove BD.

[0083] For example, when removing the insulating layer 120 to form the bending groove BD, the cut-off portion 126 is formed by removing the insulating layer 120 having the same height as or lower than the height of the bending groove BD.

[0084] As an example, if the interlayer insulating layer 120d, gate insulating layers 120b and 120c, and buffer layer in insulating layer 120 are removed to form the bent groove BD, not only can all of the interlayer insulating layer 120d, gate insulating layers 120b and 120c, and buffer layer be removed to form the bent groove BD, but only the interlayer insulating layer 120d or only the interlayer insulating layer 120d and gate insulating layers 120b and 120c can be removed.

[0085] Figures 5 to 8 Various exemplary embodiments of the cut-off portion 126 according to the first exemplary embodiment to the fourth exemplary embodiment are shown.

[0086] Figure 5 Show Figure 3 Enlarged view of region B and its outer perimeter. Figures 6 to 8 Showing the ability to correspond to Figure 5 Other exemplary embodiments of deformation at the location.

[0087] like Figure 5 As shown, the cut-off portion 126 is formed according to the first exemplary embodiment because the insulating layer 120 protrudes from the sidewall 128 of the curved groove BD toward the pad electrode 140.

[0088] This is in relation to Figure 3 and Figure 4The description is the same. At the same time, Figure 6 The cut-off portion 126 according to the second exemplary embodiment is shown.

[0089] According to the second exemplary embodiment, the cut-off portion 126 is formed because the insulating layer 120 is recessed from the sidewall 128 of the curved groove BD toward the pad electrode 140.

[0090] like Figure 5 and Figure 6 As shown, the width of the cut-off portion 126 according to the first exemplary embodiment and the second exemplary embodiment remains unchanged from the sidewall 128 to the end of the cut-off portion 126.

[0091] Figure 7 The cut-off portion 126 according to the third exemplary embodiment is shown. Similar to the first exemplary embodiment, Figure 7 The cut-off portion 126 is shown as a result of the insulating layer 120 protruding from the sidewall 128 of the curved groove BD toward the pad electrode 140.

[0092] However, according to the third exemplary embodiment, unlike the first exemplary embodiment, Figure 7 The width of the cut-off portion 126 is shown to decrease from the sidewall 128 of the curved groove BD to the end of the cut-off portion 126.

[0093] Figure 8 The cut-off portion 126 according to the fourth exemplary embodiment is shown. Similar to the second exemplary embodiment, Figure 8 The cut-off portion 126 shown is also formed as part of the insulating layer 120 recessed from the sidewall 128 of the curved groove BD toward the display area DA, and similar to the third exemplary embodiment, the width of the cut-off portion 126 decreases from the sidewall 128 of the curved groove BD to the end of the cut-off portion 126.

[0094] Furthermore, although not shown in the accompanying drawings, not only can the surface and edges of the cut-off portion 126 be rounded, but also the case where the lengths or heights of multiple cut-off portions 126 differ from each other will be included within the exemplary scope of the described technology.

[0095] at the same time, Figure 9 A pixel PX in the display area DA of a display device 100 according to an exemplary embodiment is shown.

[0096] exist Figure 9 In the pixel PX, an insulating layer 120, including a blocking layer 120a, a buffer layer, gate insulating layers 120b and 120c, and an interlayer insulating layer 120d, is formed on the substrate 110, and a light-emitting element 30 is formed on the insulating layer 120.

[0097] At this time, a semiconductor layer 31 including a channel region 311, a source region 312 and a drain region 313 is formed on the buffer layer, and gate insulating layers 120b and 120c cover the semiconductor layer 31. The gate electrode 32 is formed on the gate insulating layers 120b and 120c corresponding to the channel region 311.

[0098] Interlayer insulating layer 120d covers gate electrode 32, and contact holes are formed in interlayer insulating layer 120d so that source electrode 33 and drain electrode 34 are connected to source region 312 and drain region 313 of semiconductor layer 31, respectively.

[0099] Then, to planarize the surface, a planarization layer 35 is formed on the interlayer insulating layer 120d on which the active electrode 33 and the drain electrode 34 are formed. Another contact hole is formed in the planarization layer 35 so that the pixel electrode 371 and the drain electrode 34 can contact each other. The source electrode 33, the semiconductor layer 31, the gate electrode 32, and the drain electrode 34 can be thin-film transistors (TFFs).

[0100] A pixel defining layer 36 is formed on the planarization layer 35, with an open area corresponding to the light-emitting region of the pixel. A pixel electrode 371, an organic emitting layer 372, and a common electrode 373 are sequentially stacked in the open area of ​​the pixel defining layer 36, thereby completing the organic light-emitting element 37.

[0101] A thin film encapsulation layer 38 is formed on the organic light-emitting element 37 to prevent moisture and oxygen from penetrating into the substrate 110 on which the organic light-emitting element 37 is formed.

[0102] Figure 9 An OLED display including an organic light-emitting element 37 is shown according to an exemplary embodiment. However, the described technology is not limited thereto, and it can be applied to various display devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), field-effect displays (FEDs), and electrophoretic displays.

[0103] According to an exemplary embodiment, display wiring 130 extends from pixel PX in display area DA to pad area PA. Display wiring 130 is a gate line formed of the same material as gate electrode 32 in the same layer, or a data line formed of the same material as source electrode 33 and drain electrode 34 in the same layer.

[0104] Furthermore, as described above, the gate lines can be first gate lines and second gate lines formed on different layers from each other. Therefore, the first display wiring 132 and the second display wiring 134 correspond not only to the first gate line and the second gate line, but also to the gate line and the data line.

[0105] Meanwhile, the pad wiring 136 formed in the pad region PA of this exemplary embodiment is also formed of the same material as the display wiring 130, and the pad electrode 140 is formed of the same material as the peripheral wiring 124.

[0106] Additionally, material used to form pixel electrodes is formed on pad electrodes 140 to form pixel electrodes 371 of the display area DA. As described above, the display device 100 includes cut-off portions 126 corresponding to the first to fourth exemplary embodiments.

[0107] According to this exemplary embodiment, when the display device is bent, the probability of damage to the display device due to the modulus difference of each insulating layer formed by stacking multiple layers can be reduced in the bending groove formed by removing the portion of the insulating layer corresponding to the bending area of ​​the pad area of ​​the display device.

[0108] In addition, by forming the cut-off portion 126, the probability of short circuits between the peripheral wirings 124 passing through the pad area PA can be reduced.

[0109] While the invention has been described in conjunction with exemplary embodiments now considered practical, it will be understood that the invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the claims.

[0110] Therefore, examples of alterations and modifications should not be understood in isolation from the technical spirit or viewpoint of the described technology, and it should be understood that the modified exemplary embodiments will be included in the claims of the described technology.

Claims

1. A display device, the display device comprising: The display area comprises multiple pixels on a base. A pad region, on the substrate and adjacent to the display area, the pad region including a curved region; An insulating layer is disposed on the substrate, the insulating layer including a bending groove corresponding to the bending region and a plurality of recesses adjacent to the bending groove, wherein a portion of the insulating layer is removed in the bending groove and the plurality of recesses; and Multiple peripheral wirings are disposed on the insulating layer and extend through the curved groove. The recess extends from the sidewall of the curved groove toward the display area. The recess is provided between adjacent peripheral wirings, and The recesses and the peripheral wiring are alternately arranged.

2. The display device according to claim 1, wherein, The insulating layer includes gap regions, which are portions of the insulating layer removed from the pad regions. The gap region extends in a direction that intersects with the direction of the extension of the peripheral wiring.

3. The display device according to claim 1, wherein, The display area includes display wiring extending from the pixel to the pad area, wherein the end region of the peripheral wiring contacts the display wiring through a first contact hole.

4. The display device according to claim 1, wherein, The pad area includes a pad electrode and a pad wiring, wherein the other end of the peripheral wiring contacts the pad wiring through a second contact hole, and wherein the pad electrode contacts the pad wiring through a pad contact hole.

5. The display device according to claim 1, wherein, The display area includes display wiring extending from the pixel to the pad area, and includes a thin-film transistor connected to the display wiring, the thin-film transistor including a gate electrode, a source electrode and a drain electrode, wherein the display wiring is formed of the same material as the gate electrode, and wherein the peripheral wiring is formed of the same material as the source electrode and the drain electrode.

6. The display device according to claim 1, wherein, The height of the recess is substantially equal to or less than the height of the insulating layer.

7. The display device according to claim 1, wherein, The substrate is flexible.

8. The display device according to claim 2, wherein, The height of the gap region is less than the height of the remaining portion of the insulating layer.

9. The display device according to claim 1, wherein, The recess is roughly rectangular.

10. The display device according to claim 1, wherein, The width of the recess is smaller than the width of the peripheral wiring.

Images