Substrate cutting method

Abstract

A substrate cutting method includes preparing a first substrate in which a plurality of first active regions spaced apart from each other and a first non-active region surrounding the first active regions are defined in a plane; forming an adhesive layer on the first substrate, wherein the adhesive layer is disposed within the first active regions; providing a second substrate in which a plurality of second active regions spaced apart from each other and a second non-active region surrounding the second active regions are defined in the plane; and cutting the second substrate using a laser beam along a cutting line of the second substrate, the cutting line corresponding to a boundary between the second active regions and the second non-active region. The adhesive layer does not overlap the cutting line of the second substrate.

Description

[0001] Cross-references to related applications

[0002] This patent application claims priority to Korean Patent Application No. 10-2020-0147843, filed on November 6, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to a substrate cutting method. More specifically, this disclosure relates to a substrate stacking structure and a substrate cutting method for stacked substrates. Background Technology

[0004] Display devices can be used in a variety of electronic devices such as smartphones, tablet computers, laptops, digital cameras, camcorders and portable information terminals, or electronic products such as slim TVs, display signs and billboards.

[0005] Recently, the demand for thinner display devices has increased. Among display devices, flexible displays, as the next generation of displays, have received particular attention because they are portable and can be applied to devices of various shapes. In particular, flexible displays based on organic light-emitting diode (OLED) technology are considered the most popular.

[0006] Manufacturing such display devices may involve cutting multiple stacked display substrates to mass-produce display devices and improve efficiency. For example, each display substrate may include multiple display devices spaced apart from each other, and the cutting process involves using a laser beam along cutting lines defined in each display substrate. However, in some conventional display substrates, the substrate may be damaged due to vibration during the cutting process. Summary of the Invention

[0007] According to the present invention, this disclosure provides a substrate stacking structure that can prevent damage to the substrate during substrate cutting and a substrate cutting method.

[0008] Embodiments of the inventive concept provide a substrate cutting method including: preparing a first substrate in which a plurality of first active areas spaced apart from each other and a first inactive area surrounding the first active areas are defined in a plane; forming an adhesive layer on the first substrate, wherein the adhesive layer is disposed within the first active areas; disposing a second substrate on the adhesive layer, in which a plurality of second active areas spaced apart from each other and a second inactive area surrounding the second active areas are defined in the plane; and cutting the second substrate using a laser beam along a second cutting line, wherein the second cutting line corresponds to a boundary between the second active areas and the second inactive area. The adhesive layer does not overlap the second cutting line of the second substrate.

[0009] In some embodiments of the inventive concept, in the plane, the first active areas respectively overlap the second active areas. In the plane, the first active areas have shapes corresponding to shapes of the second active areas.

[0010] In some embodiments of the inventive concept, the adhesive layer includes a plurality of adhesive portions respectively overlapping the first active areas, and the adhesive portions are spaced apart from each other. The adhesive layer can further include a sub-adhesive portion overlapping the first inactive area.

[0011] The adhesive portions can have the same shape and can be directly attached to the first substrate.

[0012] The substrate cutting method further includes, after the cutting of the second substrate using the laser beam along the second cutting line, cutting the first substrate along a first cutting line, wherein the first cutting line corresponds to a boundary between the first active areas and the first inactive area.

[0013] The substrate cutting method further includes, after the cutting of the second substrate using the laser beam along the second cutting line, disposing a chuck to a portion of the second substrate corresponding to the second inactive area; and removing the portion of the second substrate corresponding to the second inactive area using the chuck.

[0014] The substrate cutting method further includes, after the removing of the portion of the second substrate corresponding to the second inactive area, removing a portion of the first substrate corresponding to the first inactive area using the chuck.

[0015] The forming of the adhesive layer includes disposing a mask on the first substrate, openings respectively corresponding to the first active areas being defined through the mask; and applying a resin on the mask.

[0016] Each of the openings can be disposed within the first active area, which can be outside the first and second dicing lines.

[0017] The substrate dicing method further includes curing the resin.

[0018] Embodiments of the inventive concept provide a method of dicing a plurality of substrates stacked on each other with adhesive layers interposed therebetween. The method includes disposing a laser module above a first substrate, defining a first active area and a first inactive area surrounding the first active area in the first substrate, and cutting the first substrate along a first dicing line using the laser module, wherein the first dicing line corresponds to a boundary between the first active area and the first inactive area. The first substrate is disposed at an uppermost position among the substrates. The adhesive layer is disposed between two substrates adjacent to each other among the substrates, and can be within the first active area and can be outside the first dicing line.

[0019] The method further includes, after the cutting the first substrate along the first dicing line, cutting a second substrate along a second dicing line, wherein the second substrate is adjacent to the first substrate in a thickness direction with the adhesive layer interposed therebetween. The second dicing line corresponds to a boundary between a second active area defined in the second substrate and a second inactive area surrounding the second active area.

[0020] The first dicing line overlaps the second dicing line.

[0021] In the plane, the first active area surrounds the adhesive layer.

[0022] Embodiments of the inventive concept provide a substrate stack structure including a first substrate defining a plurality of active areas spaced apart from each other and an inactive area surrounding the active areas in the first substrate, a plurality of adhesive portions disposed on the first substrate and respectively overlapping the active areas, and a second substrate disposed on the adhesive portions. The adhesive portions are disposed within the active areas.

[0023] The adhesive portions have the same shape and are attached to the first substrate.

[0024] The forming the adhesive portions includes coating a resin on the first substrate using a mask, a plurality of openings corresponding to the active areas passing through the mask, and curing the resin coated on the first substrate.

[0025] The method further includes aligning the first substrate and the second substrate after forming the adhesive portion.

[0026] According to the above, the adhesive layer is disposed between the substrates stacked on each other. Since the two substrates adjacent to each other are spaced apart from each other by the adhesive layer, when the substrates are cut using a laser beam, friction between the two substrates is prevented.

[0027] Accordingly, process efficiency and process reliability when cutting a plurality of substrates stacked on each other are improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] The present disclosure will become more fully understood from the detailed description given herein below, and by referring to the accompanying drawings of which:

[0029] Figure 1 is a perspective view illustrating a substrate cutting apparatus according to an embodiment of the present disclosure;

[0030] Figure 2 is a plan view illustrating a first substrate according to an embodiment of the present disclosure;

[0031] Figure 3A is a cross-sectional view illustrating a substrate cutting apparatus according to an embodiment of the present disclosure;

[0032] Figure 3B is a cross-sectional view illustrating a substrate cutting apparatus according to an embodiment of the present disclosure;

[0033] Figures 4A-4C is a perspective view illustrating a substrate cutting method according to an embodiment of the present disclosure;

[0034] Figures 5A-5C is a perspective view illustrating a method of stacking a plurality of substrates according to an embodiment of the present disclosure; and

[0035] Figures 6A-6D is a view illustrating a method of stacking a plurality of substrates according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] In the present disclosure, it will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it can be directly on the other element or layer, directly connected to or directly coupled to the other element or layer, or one or more intervening elements or layers can be present.

[0037] Throughout the specification, like numbers refer to like elements throughout. In the drawings, the thickness, proportions and dimensions of components can be exaggerated for effective description of technical content.

[0038] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0039] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these

[0040] For ease of description, spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for describing the

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0042] It will be understood that the terms "comprises", "has", "includes", or "contains", or their variants, are intended to denote presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0043] Hereinafter, the present disclosure will be explained in detail with reference to the accompanying drawings.

[0044] Figure 1 is a perspective view showing a substrate cutting apparatus according to an embodiment of the present disclosure.

[0045] Referring to Figure 1 , the substrate cutting apparatus can include a stage SG supporting a plurality of substrates ST, an adhesive layer AY, a laser module LR configured to cut the substrates ST, and a controller CT which can control the laser module LR.

[0046] The stage SG can have a quadrangular shape and can support the substrates ST. The stage SG can include a material having a sufficient strength to support the substrates ST.

[0047] Each of the substrates ST can be substantially parallel to a plane defined by the first direction DR1 and the second direction DR2. For example, the first direction DR1 and the second direction DR2 can span a horizontal plane. The third direction DR3 can be defined as a direction or a vertical direction orthogonal to the plane of the substrates ST. The third direction DR3 can also be referred to as a thickness direction. In the following description, the expression "when viewed in a plan view" or "in a plan" can refer to a view in the third direction DR3; for example, a top-down view. Hereinafter, a front surface (or an upper surface) and a rear surface (or a lower surface) of each layer or each unit are distinguished from each other by the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative to each other, and thus the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to other directions, for example, opposite directions.

[0048] According to an embodiment of the disclosure, the substrates ST can be stacked with each other. Each of the substrates ST can include a plurality of active areas AA and a non-active area NAA adjacent to the active areas AA. The substrates ST can be aligned with each other in the third (e.g., vertical) direction DR3. In particular, the active areas AA of two substrates adjacent to each other among the substrates ST can substantially overlap each other and can correspond to each other in the third direction DR3.

[0049] The active areas AA of each of the substrates ST can be applied to an actual display device, and the non-active area NAA can be a remaining area resulting from a cutting process. When viewed in a plan view, the active areas AA can be spaced apart from each other and can be surrounded by the non-active area NAA. The active areas AA defined in each of the substrates ST can respectively correspond to a plurality of windows including glass.

[0050] However, the disclosure is not necessarily limited thereto, and the active areas AA defined in each of the substrates ST can represent a display module, or a single bulk substrate included in the display module. The display module can include at least one of a display panel displaying an image and an input sensing unit sensing an external input.

[0051] In the following description, a boundary line between the active areas AA and the non-active area NAA will be described as a cutting line CL. For example, when a laser beam output from a laser module LR described later is irradiated onto the cutting line CL, the active areas AA of each of the substrates ST can be separated from each other.

[0052] Hereinafter, the substrate ST will be described as including a first substrate ST1, a second substrate ST2, a third substrate ST3, a fourth substrate ST4, a fifth substrate ST5, and a sixth substrate ST6 stacked on each other. The second substrate ST2, the third substrate ST3, the fourth substrate ST4, the fifth substrate ST5, and the sixth substrate ST6 can be sequentially stacked on the first substrate ST1. The first substrate ST1 can be disposed directly on the stage SG. That is, the first substrate ST1 can be a substrate disposed at a lowermost position among the substrates ST, and the sixth substrate ST6 can be a substrate disposed at an uppermost position among the substrates ST.

[0053] The laser module LR can include a laser beam generator that emits a laser beam and an optical system disposed on a path of the laser beam. The laser beam generator can include a solid laser such as a ruby laser, a glass laser, a yttrium aluminum garnet (YAG) laser, or a yttrium lithium fluoride (YLF) laser, etc., a gas laser such as an excimer laser or a helium-neon (He-Ne) laser, etc., or a pulse laser.

[0054] The optical system can be disposed on a path following the laser beam. The optical system can include a homogenizer for homogenizing a shape of the laser beam or a condenser lens for focusing the laser beam. In addition, the optical system can include at least one mirror disposed on the path of the laser beam to change an angle of the laser beam. The mirror can include a Galvano mirror or a reflecting mirror, an angle of which is changed according to a change in input voltage.

[0055] The controller CT can control a position of the laser module LR or an intensity and a size of the laser beam. The controller CT can move the position of the laser module LR so that the laser beam is irradiated onto the substrate ST along the cutting line CL of the substrate ST. The laser module LR can be moved in the first direction DR1 and the second direction DR2.

[0056] According to an embodiment of the disclosure, an adhesive layer AY can be disposed between the substrates ST. Two substrates adjacent to each other among the substrates ST can be spaced apart from each other in the third direction DR3 by the adhesive layer AY. The substrates ST can be stacked with the adhesive layer AY interposed therebetween.

[0057] The adhesive layer AY can include a first adhesive layer AY1, a second adhesive layer AY2, a third adhesive layer AY3, a fourth adhesive layer AY4, and a fifth adhesive layer AY5. The first adhesive layer AY1 can be disposed between the first substrate ST1 and the second substrate ST2. The first substrate ST1 and the second substrate ST2 can be spaced apart from each other in the third direction DR3 with the first adhesive layer AY1 interposed therebetween.

[0058] Similarly, a second adhesive layer AY2 can be provided between the second substrate ST2 and a third substrate ST3. The second substrate ST2 and the third substrate ST3 can be spaced apart from each other in a third direction DR3, with the second adhesive layer AY2 interposed between the second substrate ST2 and the third substrate ST3.

[0059] The third adhesive layer AY3, the fourth adhesive layer AY4, and the fifth adhesive layer AY5 can also have a structure similar to that of the first adhesive layer AY1 and the second adhesive layer AY2 described above. For example, the third adhesive layer AY3 can be provided between the third substrate ST3 and a fourth substrate ST4, where the fourth substrate ST4 is spaced apart from the third substrate ST3 in the third direction DR3. The fourth adhesive layer AY4 can be provided between the fourth substrate ST4 and a fifth substrate ST5, where the fifth substrate ST5 is spaced apart from the fourth substrate ST4 in the third direction DR3. The fifth adhesive layer AY5 can be provided between the fifth substrate ST5 and a sixth substrate ST6, where the sixth substrate ST6 is spaced apart from the fifth substrate ST5 in the third direction DR3.

[0060] In the case where the adhesive layer AY is omitted, the two substrates of the stack can be in contact with each other. In this case, when the laser beam is irradiated onto the cutting line, vibrations can occur in the substrates stacked on each other. Due to the vibrations, friction can occur between the substrates, and thus, the substrates can be damaged.

[0061] According to the present disclosure, the adhesive layer AY can be provided between two substrates adjacent to each other among the stacked substrates ST. For example, when the laser beam is irradiated onto the cutting line CL of the sixth substrate ST6, vibrations can occur in the sixth substrate ST6. Since the sixth substrate ST6 and the fifth substrate ST5 are spaced apart from each other by the fifth adhesive layer AY5, friction between the sixth substrate ST6 and the fifth substrate ST5 caused by the vibrations can be prevented. Furthermore, since the sixth substrate ST6 and the fifth substrate ST5 are held by the fifth adhesive layer AY5, movement of the sixth substrate ST6 and the fifth substrate ST5 can be prevented when the cutting operation is performed by irradiating the laser beam.

[0062] As described above, when the stacked substrates ST are cut along the cutting line CL, since the friction between the substrates is prevented by the adhesive layer AY, damage to the substrates can be prevented.

[0063] Furthermore, according to an embodiment of the present disclosure, the adhesive layer AY can not overlap the cutting line CL. This is because the intensity of the laser beam can be attenuated as the laser beam passes through the adhesive layer. That is, when the laser beam is irradiated onto the cutting line of the substrate after passing through the adhesive layer, the substrate can not be cut.

[0064] However, since the adhesive layer AY does not overlap the cutting line CL, the intensity of the laser beam irradiated onto the substrate ST can be maintained.

[0065] Figure 2 is a plan view showing a first substrate ST1 according to an embodiment of the present disclosure. Figure 3A is a cross-sectional view showing a substrate cutting apparatus according to an embodiment of the present disclosure. Figure 3B is a cross-sectional view showing a substrate cutting apparatus according to an embodiment of the present disclosure.

[0066] Figure 2 is a plan view of the first substrate ST1. The first substrate ST1 can include first, second, third, fourth, fifth, and sixth active areas AA11, AA12, AA13, AA14, AA15, and AA16 spaced apart from each other when viewed in the plan view. A non-active area NAA can surround the first through sixth active areas AA11 through AA16.

[0067] The first cutting line CL1 can correspond to a boundary between the first active area AA11 and the non-active area NAA. The second cutting line CL2 can correspond to a boundary between the second active area AA12 and the non-active area NAA. The third cutting line CL3 can correspond to a boundary between the third active area AA13 and the non-active area NAA. The fourth cutting line CL4 can correspond to a boundary between the fourth active area AA14 and the non-active area NAA. The fifth cutting line CL5 can correspond to a boundary between the fifth active area AA15 and the non-active area NAA. The sixth cutting line CL6 can correspond to a boundary between the sixth active area AA16 and the non-active area NAA.

[0068] The second through sixth substrates ST2 through ST6 can include active areas having substantially the same structure as that of the first substrate ST1.

[0069] The first adhesive layer AY1 disposed above the first substrate ST1 can include first, second, third, fourth, fifth, and sixth adhesive portions AY11, AY12, AY13, AY14, AY15, and AY16 overlapping central portions of the first through sixth active areas AA11 through AA16, respectively. For example, the first through sixth adhesive portions AY11, AY12, AY13, AY14, AY15, and AY16 can not overlap the first through sixth cutting lines CL1 through CL6.

[0070] For example, as Figure 2As shown in FIG. 1A, the first active area AA11 can surround the first adhesive portion AY11 when viewed in a plan view. Similarly, the second active area AA12 to the sixth active area AA16 can surround the second adhesive portion AY12 to the sixth adhesive portion AY16, respectively, when viewed in a plan view.

[0071] Referring to Figure 3A , each of the first adhesive layer AY1 to the fifth adhesive layer AY5 can overlap at least a central portion of the active area AA and can not overlap the non-active area NAA. In particular, each of the first adhesive layer AY1 to the fifth adhesive layer AY5 can not overlap a cutting region CA corresponding to the cutting line CL shown in FIG. 1A. As a result, when a laser beam is irradiated onto the cutting region CA, the laser beam can not pass through the adhesive layer AY. Figure 1

[0072] Referring to Figure 3B , the adhesive layer AYa can overlap the non-active area NAA when compared to the adhesive layer AY shown in FIG. 1A. However, the adhesive layer AYa can still not overlap the cutting region CA. As described above, the adhesive layer AYa can be disposed not to overlap the cutting region CA so that the laser beam does not pass through the adhesive layer AYa. Figure 3A

[0073] The adhesive layer AYa can include a first adhesive layer AY1a, a second adhesive layer AY2a, a third adhesive layer AY3a, a fourth adhesive layer AY4a, and a fifth adhesive layer AY5a, and each of the first adhesive layer AY1a to the fifth adhesive layer AY5a can be disposed between two respective substrates among the first substrate ST1 to the sixth substrate ST6. For example, the first adhesive layer AY1a can be disposed between the first substrate ST1 and the second substrate ST2, the second adhesive layer AY2a can be disposed between the second substrate ST2 and the third substrate ST3, and so on. Figure 3B Each of the first adhesive layer AY1a to the fifth adhesive layer AY5a shown in FIG. 1B can include a first adhesive portion P1 and a second adhesive portion P2 spaced apart from each other, the cutting region CA being interposed between the first adhesive portion P1 and the second adhesive portion P2. The first adhesive portion P1 can overlap the active area AA and can correspond to the adhesive portion shown in FIG. 1A. The second adhesive portion P2 can overlap the non-active area NAA. In the following description, the second adhesive portion P2 can be referred to as a sub-adhesive portion. Figure 2

[0074] Figures 4A-4C is a perspective view illustrating a substrate cutting method according to an embodiment of the disclosure.

[0075] In Figure 4A , it is shown​​​Figure 1 The first substrate ST1 and the second substrate ST2 among the stacked substrates ST illustrated in FIG. 1A are described with reference to FIGS. 2A and 2B. Figure 4A 、 Figure 4B The method of cutting the two stacked substrates ST1 and ST2 is described with reference to FIGS. 3A and 3B. Figure 4C The method of cutting the two stacked substrates ST1 and ST2 is described with reference to FIGS. 3A and 3B.

[0076] The laser beam can be irradiated onto each of the first to sixth cutting lines CL1 to CL6 defined in the second substrate ST2 by the laser module LR. The first adhesive layer AY1 can not overlap the first to sixth cutting lines CL1 to CL6 and can be disposed between the first substrate ST1 and the second substrate ST2.

[0077] With reference to FIGS. 4A and 4B, the substrate cutting apparatus according to the present disclosure can further include suction pads DMP1, DMP2, DMP3, and DMP4. Figure 4B After the cutting process is performed along the first to sixth cutting lines CL1 to CL6 using the laser module LR (with reference to FIG. 1A), the suction pads DMP1 to DMP4 can be suctioned to the second substrate ST2. For example, the four suction pads DMP1 to DMP4 can be disposed at four corners of the second substrate ST2, respectively. Figure 4A The suction pads DMP1 to DMP4 can move in the third direction DR3, and thus, after the cutting process is performed, a portion of the second substrate ST2 corresponding to the non-active area NAA (with reference to FIG. 1A) can be removed.

[0078] Figure 2 With reference to FIGS. 5A and 5B, since the portion of the second substrate ST2 corresponding to the non-active area NAA (with reference to FIG. 1A) is removed, first to sixth active portions SP1 to SP6 corresponding to the first to sixth active areas AA11 to AA16 illustrated in FIG. 1B, respectively, can be formed.

[0079] With reference to FIGS. 5A and 5B, since the portion of the second substrate ST2 corresponding to the non-active area NAA (with reference to FIG. 1A) is removed, first to sixth active portions SP1 to SP6 corresponding to the first to sixth active areas AA11 to AA16 illustrated in FIG. 1B, respectively, can be formed. Figure 4C Figure 2 With reference to FIGS. 5A and 5B, since the portion of the second substrate ST2 corresponding to the non-active area NAA (with reference to FIG. 1A) is removed, first to sixth active portions SP1 to SP6 corresponding to the first to sixth active areas AA11 to AA16 illustrated in FIG. 1B, respectively, can be formed. Figure 2 With reference to FIGS. 6A and 6B, the laser module LR (with reference to FIG. 1A) can apply a laser beam to the cutting lines of the first substrate ST1 again, and thus, a portion of the first substrate ST1 corresponding to the non-active area NAA (with reference to FIG. 1A) can be removed. As a result, an active portion of the first substrate ST1 can be formed.

[0080] Figure 4A With reference to FIGS. 6A and 6B, the laser module LR (with reference to FIG. 1A) can apply a laser beam to the cutting lines of the first substrate ST1 again, and thus, a portion of the first substrate ST1 corresponding to the non-active area NAA (with reference to FIG. 1A) can be removed. As a result, an active portion of the first substrate ST1 can be formed. Figure 2 With reference to FIGS. 6A and 6B, the laser module LR (with reference to FIG. 1A) can apply a laser beam to the cutting lines of the first substrate ST1 again, and thus, a portion of the first substrate ST1 corresponding to the non-active area NAA (with reference to FIG. 1A) can be removed. As a result, an active portion of the first substrate ST1 can be formed.​​​

[0081] Figures 5A-5C is a perspective view illustrating a method of stacking a plurality of substrates according to an embodiment of the disclosure.

[0082] Referring to Figure 5A A first substrate ST1 can be prepared. The first substrate ST1 can include a plurality of first active areas AA-1 and first non-active areas NAA-1 surrounding the first active areas AA-1. A boundary between the first active areas AA-1 and the first non-active areas NAA-1 can be defined as a first cutting line CL-1.

[0083] Referring to Figure 5B A first adhesive layer AY-1 can be disposed on the first substrate ST1 to overlap at least a central portion of the first active areas AA-1. For example, the first adhesive layer AY-1 can include adhesive portions PS overlapping the first active areas AA-1, respectively, and each of the adhesive portions PS can be provided in an adhesive resin having a single shape. The adhesive portions PS can not overlap the first cutting line CL-1 and can be disposed on the first active areas AA-1, respectively.

[0084] Referring to Figure 5C A second substrate ST2 can be disposed on the first adhesive layer AY-1. The second substrate ST2 can include a plurality of second active areas AA-2 and second non-active areas NAA-2 surrounding the second active areas AA-2. A boundary between the second active areas AA-2 and the second non-active areas NAA-2 can be defined as a second cutting line CL-2.

[0085] An alignment operation can be performed on the first substrate ST1 and the second substrate ST2 before the second substrate ST2 is disposed on the first adhesive layer AY-1. Accordingly, the first cutting line CL-1 of the first substrate ST1 and the second cutting line CL-2 of the second substrate ST2 can be aligned with each other in a third direction DR3.

[0086] After the alignment operation is performed on the first substrate ST1 and the second substrate ST2, the second substrate ST2 can be in contact with the first adhesive layer AY-1. Then, as described with reference to Figures 4A-4C a cutting operation can be performed on the substrates ST1 and ST2 using a laser module LR.

[0087] Figures 6A-6D A method of stacking a plurality of substrates according to an embodiment of the disclosure is illustrated.

[0088] Referring to Figure 6A The first substrate ST1 can have a plurality of first active areas AA-1 and first non-active areas NAA-1 surrounding the first active areas AA-1, as described with reference to Figure 5AThe first substrate ST1 described is substantially the same configuration. Therefore, the description of the same components will be omitted for the present embodiment, and in the subsequent description, within the scope of omitting some description, it can be assumed that these components are at least similar to the components described here.

[0089] In the process of forming the first adhesive layer AY-1a (refer to Figure 6C ), a mask MK can be provided on the first substrate ST1. The mask MK can be provided with a plurality of openings OP defined to pass through the mask MK to respectively overlap with the first active regions AA-1. The first adhesive layer AY-1a (refer to Figure 6C ) can be formed on the first substrate ST1 via the openings OP defined to pass through the mask MK.

[0090] In particular, in a planar view, each of the openings OP according to the present embodiment can have a size smaller than that of the first active regions AA-1. Otherwise, when the size of the openings OP is larger than that of the first active regions AA-1, any one of the adhesive portions of the adhesive layer AY-1a can overlap with the first cutting line CL-1. Therefore, the openings OP according to the present disclosure can have a size smaller than that of the first active regions AA-1 when viewed in a plan view.

[0091] Referring to Figure 6B , the resin RS can be coated on the first substrate ST1 using the mask MK through which the openings OP are defined. The resin RS can be formed on the first substrate ST1 after passing through the openings OP. The resin RS formed on the first substrate ST1 can be cured. Since the openings OP at least overlap with the central portions of each of the first active regions AA-1 (refer to Figure 6A ), the resin RS can be formed on the first substrate ST1 to at least overlap with the central portions of the first active regions AA-1. The resin RS provided on the mask MK can not be formed on the first substrate ST1.

[0092] Referring to Figure 6C , the first adhesive layer AY-1a can be formed by the operations shown in Figure 6B . The first adhesive layer AY-1a can overlap with the first active regions AA-1 and can not overlap with the cutting regions CA.

[0093] Referring to Figure 6D , after performing the alignment operation on the first substrate ST1 and the second substrate ST2, the second substrate ST2 can be in contact with the first adhesive layer AY-1a. Then, the cutting operation of the substrates ST1 and ST2 can be performed using the laser module LR described with reference to Figures 4A-4C .

[0094] While embodiments of the present disclosure have been described, it is to be understood that the disclosure is not necessarily limited to those embodiments precisely set forth and that various modifications and changes can be made by those of ordinary skill in the art without departing from the spirit and scope of the disclosure as hereinafter claimed. Therefore, the disclosed subject matter should not necessarily be limited to any single embodiment described herein, but should be construed as including all embodiments falling within the scope of the appended claims.

Claims

1. A method of cutting a substrate, wherein, The substrate cutting method includes: preparing a first substrate including a plurality of first active areas spaced apart from each other and a first inactive area surrounding the first active areas; forming an adhesive layer on the first substrate, wherein the adhesive layer includes a plurality of adhesive portions, wherein each of the plurality of adhesive portions is disposed within a corresponding first active area of the plurality of first active areas and overlaps at least a central portion of the corresponding first active area without overlapping the first inactive area; disposing a second substrate on the adhesive layer, wherein the second substrate includes a plurality of second active areas spaced apart from each other and a second inactive area surrounding the plurality of second active areas; and cutting the second substrate using a laser beam along a cutting line to form a plurality of active portions of the second substrate, the cutting line corresponding to a boundary between the second active areas and the second inactive area, and the adhesive layer not overlapping a cutting region corresponding to the cutting line.

2. The substrate cutting method according to claim 1, wherein, In a plane, the plurality of first active areas respectively overlap the plurality of second active areas.

3. The substrate cutting method according to claim 2, wherein, In the plane, the plurality of first active areas have shapes corresponding to shapes of the plurality of second active areas.

4. The substrate cutting method according to claim 2, wherein, The plurality of adhesive portions are spaced apart from each other.

5. The substrate cutting method according to claim 4, wherein, The adhesive layer further includes a sub-adhesive portion overlapping the first inactive area, wherein the sub-adhesive portion does not overlap the cutting region.

6. The substrate cutting method according to claim 4, wherein, The plurality of adhesive portions have the same shape and are directly attached to the first substrate.

7. The substrate cutting method according to claim 1, wherein, The substrate cutting method further includes cutting the first substrate along a cutting line of the first substrate, the cutting line of the first substrate corresponding to a boundary between the first active areas and the first inactive area.

8. The substrate cutting method according to claim 1, wherein, The substrate cutting method further includes: after the using the laser beam to cut the second substrate along the cutting line, disposing a chuck to a portion of the second substrate corresponding to the second inactive area; and using the chuck to remove the portion of the second substrate corresponding to the second inactive area.

9. The substrate cutting method according to claim 8, wherein, The substrate cutting method further includes, after the removing the portion of the second substrate corresponding to the second inactive area, using the chuck to remove a portion of the first substrate corresponding to the first inactive area.

10. The substrate cutting method according to claim 1, wherein, The forming the adhesive layer includes: disposing a mask on the first substrate, openings respectively corresponding to the first active areas defined through the mask; and applying a resin on the mask. The substrate cutting method further includes: preparing a first substrate including a plurality of first active areas spaced apart from each other and a first inactive area surrounding the first active areas; forming an adhesive layer on the first substrate, wherein the adhesive layer includes a plurality of adhesive portions, wherein each of the plurality of adhesive portions is disposed within a corresponding first active area of the plurality of first active areas and overlaps at least a central portion of the corresponding first active area without overlapping the first inactive area; disposing a second substrate on the adhesive layer, wherein the second substrate includes a plurality of second active areas spaced apart from each other and a second inactive area surrounding the plurality of second active areas; and cutting the second substrate using a laser beam along a cutting line to form a plurality of active portions of the second substrate, the cutting line corresponding to a boundary between the second active areas and the second inactive area, and the adhesive layer not overlapping a cutting region corresponding to the cutting line. In a plane, the plurality of first active areas respectively overlap the plurality of second active areas. In the plane, the plurality of first active areas have shapes corresponding to shapes of the plurality of second active areas. The plurality of adhesive portions are spaced apart from each other. The adhesive layer further includes a sub-adhesive portion overlapping the first inactive area, wherein the sub-adhesive portion does not overlap the cutting region. The plurality of adhesive portions have the same shape and are directly attached to the first substrate. The substrate cutting method further includes cutting the first substrate along a cutting line of the first substrate, the cutting line of the first substrate corresponding to a boundary between the first active areas and the first inactive area. The substrate cutting method further includes: after the using the laser beam to cut the second substrate along the cutting line, disposing a chuck to a portion of the second substrate corresponding to the second inactive area; and using the chuck to remove the portion of the second substrate corresponding to the second inactive area. The substrate cutting method further includes, after the removing the portion of the second substrate corresponding to the second inactive area, using the chuck to remove a portion of the first substrate corresponding to the first inactive area. The forming the adhesive layer includes: disposing a mask on the first substrate, openings respectively corresponding to the first active areas defined through the mask; and applying a resin on the mask.

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