Crystal Plasticity Simulation Method and Device for Fretting Fatigue of Polycrystalline Alloys

Abstract

The present application discloses a crystal plasticity simulation method and device for fretting fatigue of polycrystalline alloys. The method includes: writing a crystal plasticity constitutive relationship and generating a calling calculation program; establishing a geometric model including a fretting specimen and a fretting pad and generating an stl file; determining at least one parameter of the required crystal model and generating a material model containing a crystal microstructure to obtain a self-written script; importing the stl file into the self-written script to generate a crystal model and save it as an inp file; importing the inp file into a preset Matlab script for running; further generating a crystal plasticity finite element model, and associating the crystal plasticity finite element model with the calling calculation program to complete the crystal plasticity finite element modeling. Thus, the technical problems in the related art, such as ignoring the plastic behavior of materials, insufficient consideration of the microstructure of polycrystalline materials, resulting in errors in simulation results, limited accuracy, and high costs required to improve the simulation accuracy, are solved.

Description

Technical Field

[0001] This application relates to the technical field of material property characterization, and particularly relates to a crystal plasticity simulation method and device for fretting fatigue of polycrystalline alloys. Background Art

[0002] Fretting fatigue refers to the phenomenon that when two mutually contacting components are under the action of fatigue loads, a small relative displacement occurs on the contact surface of the two components, resulting in material damage, earlier nucleation, initiation and propagation of cracks, and finally failure and fracture of the components. The working condition between the blades and disks of the fan, compressor and turbine of an aero-engine is a typical fretting fatigue condition.

[0003] In the related art, the finite element research on fretting fatigue of polycrystals mainly includes the macroscopic research method and the EBSD layer-by-layer slicing method:

[0004] The macroscopic research method applies the method of studying macroscopic simple fatigue to the research of fretting fatigue, that is, a finite element model is established through UG software according to the actual specimen geometry, and the model is imported into the ABAQUS finite element analysis software. Homogeneous isotropic properties such as elastic modulus and Poisson's ratio are assigned to the entire model, and finite element analysis is carried out through steps such as assigning given loads, contacts, and setting analysis steps.

[0005] The EBSD layer-by-layer slicing method requires slicing the material layer by layer. To ensure accuracy, the thickness of each layer of slices should be less than the grain size. The samples of each layer of slices are prepared and EBSD tests are carried out, and then the obtained slice data are spliced together to obtain the EBSD characterization data of the complete polycrystalline material, and then a crystal model is generated for finite element analysis.

[0006] However, the related art has the following defects:

[0007] 1. Most of the related art only considers the finite element simulation of material elastic anisotropy and does not consider plastic behavior. For fretting fatigue, due to the high stress concentration in the fretting contact area, the material enters plastic deformation, so the accuracy of the simulation results is limited.

[0008] 2. The related art has insufficient consideration of the microstructure of polycrystalline materials. The fretting fatigue behavior of crystalline materials, different from macroscopic fatigue, is affected by various microscopic factors such as crystal microstructure, grain boundaries, crystal orientation, and anisotropy. Applying the research method of macroscopic fatigue to fretting fatigue cannot study the microscopic influencing factors, and the internal structure of the actual crystalline material is quite different, resulting in a large error in the finite element analysis results. When studying the influence of microscopic factors such as grain boundaries and crystal orientation on the fretting fatigue behavior of polycrystalline alloys, the reliability of the results is reduced.

[0009] 3. In the EBSD layer slicing method in the related art, to ensure accuracy, the slice thickness needs to be less than the grain size, often at the μm level, while the sample size is generally at the mm level. Therefore, the number of layers is extremely large, consuming a large amount of cost.

[0010] In summary, the related art has problems such as poor accuracy of simulation results, low reliability, and high cost, and urgently needs to be improved.

[0011] Application content

[0012] This application provides a crystal plasticity simulation method and device for fretting fatigue of polycrystalline alloys to solve the technical problems in the related art, such as ignoring the plastic behavior of materials, insufficient consideration of the microstructure of polycrystalline materials, resulting in errors in simulation results, limited accuracy, and high cost required to improve simulation accuracy.

[0013] The first aspect of the embodiments of this application provides a crystal plasticity simulation method for fretting fatigue of polycrystalline alloys, including the following steps: writing a crystal plasticity constitutive relation and generating a calling calculation program; establishing a geometric model including a fretting specimen and a fretting pad according to the actual shape of the actual specimen, and generating an stl file; determining at least one parameter of the required crystal model, and generating a material model containing crystal microstructure based on the at least one parameter to obtain a self-written script; importing the stl file into the self-written script, and shearing the generated crystal model so that the crystal model is consistent with the model of the actual specimen, and saving it as an inp file; importing the inp file into a preset Matlab script for running, numbering each grain in the crystal model, and calculating the crystal orientation of each grain; generating a crystal plasticity finite element model based on the inp files corresponding to the fretting specimen and the fretting pad, and associating the crystal plasticity finite element model with the calling calculation program to complete the crystal plasticity finite element modeling.

[0014] Optionally, in an embodiment of this application, before associating the crystal plasticity finite element model with the calling calculation program, it further includes: assembling the fretting specimen and the fretting pad; setting fatigue load, boundary conditions, analysis steps, friction, and contact for the polycrystalline model of the fretting specimen, and setting a normal contact load for the polycrystalline model of the fretting pad, with one end of the fretting specimen fixed and a fatigue load applied at the other end.

[0015] Optionally, in an embodiment of this application, the contact property between the fretting specimen and the fretting pad is a hard contact, and a preset friction coefficient is assigned.

[0016] Optionally, in an embodiment of the present application, the crystal plasticity finite element model has the same shape as the actual specimen and includes crystal information, where the crystal information includes one or more of the crystal orientation, grain boundary, grain size, and grain morphology of each grain.

[0017] Optionally, in an embodiment of the present application, the crystal plasticity constitutive relation includes a crystallographic description of plastic behavior.

[0018] An embodiment of the second aspect of the present application provides a crystal plasticity simulation device for fretting fatigue of polycrystalline alloys, including: a program generation module for writing a crystal plasticity constitutive relation and generating a calling calculation program; a first modeling module for establishing a geometric model including a fretting specimen and a fretting pad according to the actual shape of the actual specimen and generating an stl file; a model generation module for determining at least one parameter of the required crystal model and generating a material model containing a crystal microstructure based on the at least one parameter to obtain a self-written script; a shearing module for importing the stl file into the self-written script and shearing the generated crystal model so that the crystal model is consistent with the model of the actual specimen and saving it as an inp file; a calculation module for importing the inp file into a preset Matlab script for running, numbering each grain in the crystal model, and calculating the crystal orientation of each grain; a second modeling module for generating a crystal plasticity finite element model based on the inp files corresponding to the fretting specimen and the fretting pad, and associating the crystal plasticity finite element model with the calling calculation program to complete crystal plasticity finite element modeling.

[0019] Optionally, in an embodiment of the present application, the second modeling module is further configured to: assemble the fretting specimen and the fretting pad; set fatigue load, boundary conditions, analysis steps, friction, and contact for the polycrystalline model of the fretting specimen, and set a normal contact load for the polycrystalline model of the fretting pad, with one end of the fretting specimen fixed and a fatigue load applied to the other end.

[0020] Optionally, in an embodiment of the present application, the contact property between the fretting specimen and the fretting pad is a hard contact, and a preset friction coefficient is assigned.

[0021] Optionally, in an embodiment of the present application, the crystal plasticity finite element model has the same shape as the actual specimen and includes crystal information, where the crystal information includes one or more of the crystal orientation, grain boundary, grain size, and grain morphology of each grain.

[0022] Optionally, in an embodiment of the present application, the crystal plasticity constitutive relation includes a crystallographic description of plastic behavior.

[0023] A third aspect embodiment of the present application provides an electronic device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor executes the program to implement the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys as described in the above embodiments.

[0024] A fourth aspect embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored, and the program is executed by a processor to be used to implement the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys as described in the above embodiments.

[0025] Embodiments of the present application can write corresponding calculation programs based on the crystal plasticity constitutive model, establish a crystal plasticity finite element model, and then complete the crystal plasticity finite element modeling by associating the crystal plasticity finite element model with the calculation program, which can better simulate the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, increase the accuracy and reliability of the simulation results, have a wide range of applications, and low costs. Thus, the technical problems in the related art, such as ignoring the plastic behavior of materials, insufficient consideration of the microstructure of polycrystalline materials, resulting in errors in the simulation results, limited accuracy, and high costs required to improve the simulation accuracy, are solved.

[0026] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the drawings, where:

[0028] Figure 1 is a flowchart of a crystal plasticity simulation method for fretting fatigue of polycrystalline alloys according to an embodiment of the present application;

[0029] Figure 2 is a stress nephogram of crystal plasticity simulation of fretting fatigue of polycrystalline alloys according to an embodiment of the present application;

[0030] Figure 3 is a cumulative plastic strain nephogram of crystal plasticity simulation of fretting fatigue of polycrystalline alloys according to an embodiment of the present application;

[0031] Figure 4 is an assembly drawing of a fretting pad and a fretting specimen for a crystal plasticity simulation method for fretting fatigue of polycrystalline alloys according to an embodiment of the present application;

[0032] Figure 5Crystallographic information diagram of the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys according to an embodiment of the present application;

[0033] Figure 6 Flowchart of the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys according to an embodiment of the present application;

[0034] Figure 7 Structural schematic diagram of a crystal plasticity simulation device for fretting fatigue of polycrystalline alloys provided according to an embodiment of the present application;

[0035] Figure 8 Structural schematic diagram of an electronic device provided according to an embodiment of the present application. Detailed implementation manners

[0036] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, but should not be construed as limiting the present application.

[0037] The crystal plasticity simulation method and device for fretting fatigue of polycrystalline alloys according to the embodiments of the present application will be described below with reference to the accompanying drawings. In view of the problems in the related art mentioned in the above background art that the plastic behavior of materials is ignored and the microstructure of polycrystalline materials is insufficiently considered, resulting in errors in the simulation results, limited accuracy, and high costs required to improve the simulation accuracy, the present application provides a crystal plasticity simulation method for fretting fatigue of polycrystalline alloys. In this method, a corresponding calculation program can be written based on the crystal plasticity constitutive model, and a crystal plasticity finite element model can be established. Then, by associating the crystal plasticity finite element model with the calculation program, the crystal plasticity finite element modeling can be completed, which can better simulate the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, increasing the accuracy and reliability of the simulation results, having a wide range of applications, and low costs. Thus, the technical problems in the related art that the plastic behavior of materials is ignored, the microstructure of polycrystalline materials is insufficiently considered, resulting in errors in the simulation results, limited accuracy, and high costs required to improve the simulation accuracy are solved.

[0038] Specifically, Figure 1 It is a schematic flow chart of a crystal plasticity simulation method for fretting fatigue of polycrystalline alloys provided by an embodiment of the present application.

[0039] As Figure 1 shown, the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys includes the following steps:

[0040] In step S101, write the crystal plasticity constitutive relationship to generate a call calculation program.

[0041] Specifically, in the embodiments of the present application, the crystal plasticity constitutive relation can be written as a Fortran program and embedded in the ABAQUS software for calling and calculation. By writing the crystal plasticity constitutive relation and generating a calling and calculation program, the embodiments of the present application can lay a foundation for subsequent crystal plasticity finite element modeling, which is beneficial to better simulating the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, thereby increasing the accuracy and reliability of the simulation results.

[0042] Optionally, in an embodiment of the present application, the crystal plasticity constitutive relation includes a crystallographic description of plastic behavior.

[0043] It can be understood that the main part of the crystal plasticity constitutive relation is the crystallographic description of plastic behavior. The crystallographic description of plastic behavior in the embodiments of the present application is as follows:

[0044] Plastic deformation can be represented by the strain rate on each slip system with a kinetic equation:

[0045]

[0046] Among them, represents the strain rate on the α-th slip system, which can be obtained from the plastic flow rate equation, and the calculation formula can be as follows:

[0047]

[0048] Among them, represents the relative strain rate, g (α) represents the slip resistance, n represents the rate exponent, τ (α) represents the resolved shear stress on the α-th slip system, X (α) represents the back stress.

[0049] Among them, the calculation formula of τ )α) can be as follows:

[0050]

[0051] The back stress X (α) can be obtained from the Chaboche model, and the calculation formula can be as follows:

[0052]

[0053] Among them, ζ (α) and r (α) are material-related constants;

[0054] The slip resistance g (α) is given by the slip resistance evolution equation, and the calculation formula can be as follows:

[0055]

[0056] h αβ (γ) = h(γ)pq+(1 - )δ αβ ,

[0057] where h αβ (γ) is the latent hardening modulus, q represents the latent hardening parameter, h(γ) is the self - hardening modulus, which can be calculated by the following formula: The calculation formula can be as follows:

[0058]

[0059] where h 0 is the initial hardening modulus, τ s represents the initial slip resistance, τ 0 represents the slip resistance during the saturation period, γ represents the Taylor cumulative shear strain on all slip systems, and the calculation formula can be as follows:

[0060]

[0061] In step S102, a geometric model including a fretting specimen and a fretting pad is established according to the actual shape of the actual specimen, and an stl file is generated.

[0062] In the actual execution process, the embodiment of the present application can establish a geometric model in UG according to the actual shape of the specimen. Among them, the geometric model includes two parts: a fretting specimen and a fretting pad, and is saved as an stl file. Based on this, a polycrystalline model consistent with the actual shape of the specimen can be established subsequently, which is beneficial to better simulating the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, thereby increasing the accuracy and reliability of the simulation results.

[0063] In step S103, at least one parameter of the required crystal model is determined, and a material model containing crystal microstructure is generated based on the at least one parameter to obtain a self - written script.

[0064] Those skilled in the art can understand that the crystal model parameters can be the grain size, crystal orientation, etc. of the crystal model. The embodiment of the present application can set the required crystal model parameters, and generate a material model containing crystal microstructure according to the set parameters, and then obtain a Dream3d self - written script, so that the generated polycrystalline specimen model contains crystallographic information such as grids, crystal orientations of each grain, grain sizes of each grain, morphologies of each grain, and grain boundaries.

[0065] The material model containing crystal microstructure generated by the embodiment of the present application contains detailed crystal information, including crystal orientation, grain boundary, grain size, etc., enabling both single - crystal and polycrystalline materials to use the crystal plasticity finite element model of the embodiment of the present application, making the simulation results more accurate and reliable, and having a wider application range.

[0066] In step S104, the stl file is imported into a self-written script, and the generated crystal model is sheared so that the crystal model is consistent with the model of the actual specimen, and it is saved as an inp file.

[0067] Specifically, in the embodiment of the present application, the stl file obtained in the above steps can be imported into the self-written Dream3d script, and the generated crystal model is sheared so that the generated crystal model is consistent with the actual specimen model, and it is saved as an inp file. By importing the stl file into the self-written script and shearing the generated crystal model in the embodiment of the present application, the generated crystal model is made consistent with the actual specimen model, which is beneficial to subsequent modeling of crystal plasticity finite element, and further realizes better simulation of the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, thereby increasing the accuracy and reliability of the simulation results.

[0068] In step S105, the inp file is imported into a preset Matlab script for running, each grain in the crystal model is numbered, and the crystal orientation of each grain is calculated.

[0069] During the actual execution process, in the embodiment of the present application, the inp file generated in the above steps can be imported into a preset Matlab script for running, and by running the Matlab script, each grain in the generated crystal model can be numbered, and the crystal orientation of each grain can be calculated. In the embodiment of the present application, each grain in the crystal model can be numbered, and the crystal orientation of each grain can be calculated, providing an information data basis for subsequent crystal plasticity finite element modeling, which is beneficial to increasing the accuracy and reliability of the simulation results and more comprehensively realizing the visualization of the simulation results.

[0070] In step S106, based on the inp files corresponding to the fretting specimen and the fretting pad, a crystal plasticity finite element model is generated, and the crystal plasticity finite element model is associated with a call calculation program for file, completing the crystal plasticity finite element modeling.

[0071] Further, in the embodiment of the present application, the inp files of the fretting specimen and the fretting pad can be respectively imported into ABAQUS to generate a crystal plasticity finite element model. Specifically, in the embodiment of the present application, the ABAQUS finite element model can be associated with the Fortran material subroutine established in step S101 for file, completing the crystal plasticity finite element modeling.

[0072] For example, as Figure 2 and Figure 3 shown, in the embodiment of the present application, the fretting fatigue crystal plasticity simulation of polycrystalline alloys can be realized through running calculations, results such as stress, strain, and accumulated plastic strain are obtained, and ABAQUS is used for visual analysis of the results.

[0073] Among them, Figure 2 is the stress nephogram obtained by running the calculation to realize the crystal plasticity simulation of fretting fatigue of polycrystalline alloys; Figure 3 is the cumulative plastic strain nephogram obtained by running the calculation to realize the crystal plasticity simulation of fretting fatigue of polycrystalline alloys.

[0074] The simulation results of the embodiments of the present application can show the dangerous positions of stress, strain, and cumulative plastic strain, providing an effective basis for the failure analysis and fault prediction of fretting fatigue, so as to study the influence of microstructures such as crystal orientation, grain boundary, and grain geometry on the fretting fatigue behavior of polycrystalline alloys. The calculation program written based on the crystal plasticity constitutive model in the embodiments of the present application is combined with the ABAQUS software to realize the crystal plasticity finite element analysis of the fretting fatigue of polycrystalline materials, and better simulate the plastic deformation and damage behavior of polycrystalline alloys in the actual fretting fatigue process.

[0075] Optionally, in an embodiment of the present application, before associating the crystal plasticity finite element model with the called calculation program, it further includes: assembling the fretting specimen and the fretting pad; setting fatigue load, boundary conditions, analysis steps, friction, and contact for the polycrystalline model of the fretting specimen, and setting the normal contact load for the polycrystalline model of the fretting pad, with one end of the fretting specimen fixed and the other end applied with the fatigue load.

[0076] As a possible implementation manner, as Figure 4 shown, the embodiments of the present application can assemble the fretting specimen and the fretting pad, and the assembly method can be as follows:

[0077] Setting conditions such as fatigue load, boundary conditions, analysis steps, friction, and contact for the polycrystalline model of the fretting specimen; setting the normal contact load for the polycrystalline model of the fretting pad. One end of the fretting specimen is fixed and the other end is applied with the fatigue load.

[0078] Among them, Figure 4 in (a) is the fretting pad, and (b) is the fretting specimen.

[0079] The embodiments of the present application are beneficial to complete the crystal plasticity finite element modeling by assembling the fretting specimen and the fretting pad, improve the accuracy and reliability of the simulation results, and can better simulate the plastic deformation and damage behavior of polycrystalline alloys in the actual fretting fatigue process.

[0080] Optionally, in an embodiment of the present application, the contact property between the fretting specimen and the fretting pad is hard contact, and a preset friction coefficient is given.

[0081] It can be understood that the contact property between the fretting specimen and the fretting pad can be hard contact. In order to make the assembly of the fretting specimen and the fretting pad more suitable for the establishment of the crystal plasticity finite element model, the embodiments of the present application can endow the fretting specimen and the fretting pad with appropriate friction coefficients.

[0082] It should be noted that the friction coefficient can be set accordingly by those skilled in the art according to the actual material properties, and no specific limitation is made here.

[0083] Optionally, in an embodiment of the present application, the crystal plasticity finite element model has the same shape as the actual specimen and includes crystal information, where the crystal information includes one or more of the crystal orientation, grain boundary, grain size, and grain morphology of each grain.

[0084] As a possible implementation manner, as Figure 5 shown, the crystal plasticity finite element model of the embodiment of the present application has the same shape as the actual polycrystalline specimen and includes crystallographic information such as the crystal orientation, grain boundary, grain size, and grain morphology of each grain.

[0085] The crystal plasticity finite element model of the embodiment of the present application has the same shape as the actual specimen and includes crystal information, so that both single-crystal and polycrystalline materials can use the crystal plasticity finite element model of the embodiment of the present application, making the simulation results more accurate and reliable and the applicable range wider.

[0086] In summary, the fretting fatigue polycrystalline specimen model established in the embodiments of the present application contains detailed crystal information, including crystal orientation, grain boundary, grain size, etc. Both single-crystal and polycrystalline materials can be used, making the finite element results calculated in the embodiments of the present application more accurate and reliable and the applicable range wider. Especially in the aspect of studying the influence of microscopic factors on fretting fatigue behavior and predicting fatigue life, the change of any microscopic factor such as crystal orientation, secondary orientation, grain size, grain boundary, etc. can be controlled, which is of great significance to the finite element study of fretting fatigue.

[0087] At the same time, the calculation program written based on the crystal plasticity constitutive model in the embodiments of the present application is combined with the ABAQUS software to realize the crystal plasticity finite element analysis of the fretting fatigue of polycrystalline materials, and can better simulate the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process.

[0088] Next, in combination with Figures 2 to 6 , a specific example is used to elaborate in detail on the crystal plasticity simulation method for the fretting fatigue of polycrystalline alloys in the embodiments of the present application.

[0089] As Figure 6 shown, the embodiments of the present application include the following steps:

[0090] Step S601: Write a crystal plasticity Fortran program. Specifically, in the embodiments of the present application, the crystal plasticity constitutive relation can be written as a Fortran program and embedded in the ABAQUS software for calling and calculation. By writing the crystal plasticity constitutive relation and generating a calling and calculation program, the embodiments of the present application can lay a foundation for subsequent crystal plasticity finite element modeling, which is beneficial to better simulating the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, thereby increasing the accuracy and reliability of the simulation results.

[0091] It can be understood that the main part of the crystal plasticity constitutive relation is the crystallographic description of the plastic behavior. The crystallographic description of the plastic behavior in the embodiments of the present application is as follows:

[0092] The plastic deformation can be expressed by the strain rate on each slip system with a kinetic equation:

[0093]

[0094] Among them, represents the strain rate on the α-th slip system, which can be obtained from the plastic flow rate equation, and the calculation formula can be as follows:

[0095]

[0096] Among them, represents the relative strain rate, g (α) represents the slip resistance, n represents the rate exponent, τ (α) represents the resolved shear stress on the α-th slip system, X (α) represents the back stress.

[0097] Among them, the calculation formula of τ (α9 can be as follows:

[0098]

[0099] (back stress) 9α) can be obtained from the Chaboche model, and the calculation formula can be as follows:

[0100]

[0101] Among them, ζ 9α) and r 9α) are material-related constants;

[0102] The slip resistance g (α) is given by the slip resistance evolution equation, and the calculation formula can be as follows:

[0103]

[0104] h αβ(γ) = h(γ)[q + (1 - q)δ αβ ,

[0105] where h αβ (γ) is the potential hardening modulus, q represents the potential hardening parameter, h(γ) is the self-hardening modulus, which can be calculated by the following formula:

[0106]

[0107] where h 0 is the initial hardening modulus, τ s represents the initial slip resistance, τ 0 represents the slip resistance during the saturation period, γ represents the Taylor cumulative shear strain on all slip systems, and the calculation formula can be as follows:

[0108]

[0109] Step S602: Generate a polycrystalline model in Dream3D. First, in the embodiments of the present application, a geometric model can be established in UG according to the actual shape of the specimen. The geometric model includes two parts: the fretting specimen and the fretting pad, and the geometric model established in UG is saved as an stl file. Based on this, a polycrystalline model consistent with the actual specimen shape can be established subsequently.

[0110] Among them, as a possible implementation method, as Figure 4 shown, in the embodiments of the present application, the fretting specimen and the fretting pad can be assembled: set fatigue load, boundary conditions, analysis steps, friction, contact and other conditions for the polycrystalline model of the fretting specimen; set the normal contact load for the polycrystalline model of the fretting pad. One end of the fretting specimen is fixed and a fatigue load is applied at the other end.

[0111] Among them, Figure 4 (a) is the fretting pad, and (b) is the fretting specimen.

[0112] It can be understood that the contact property between the fretting specimen and the fretting pad can be hard contact, and in order to make the assembly of the fretting specimen and the fretting pad more suitable for the establishment of the crystal plasticity finite element model, the embodiments of the present application can endow the fretting specimen and the fretting pad with appropriate friction coefficients.

[0113] It should be noted that the friction coefficient can be set by those skilled in the art according to the actual material properties, and no specific limitation is made here.

[0114] Secondly, in the self-written script of Dream3d, embodiments of the present application can set parameters such as the grain size and crystal orientation of the required crystal model, and generate a material model containing crystal microstructure according to the set parameters, so that the generated polycrystalline specimen model contains crystallographic information such as grids, crystal orientations of each grain, sizes of each grain, morphologies of each grain, and grain boundaries.

[0115] Finally, embodiments of the present application can import the stl file into the self-written script of Dream3d, shear the generated material model, so that the generated crystal model is consistent with the actual specimen model, and save it as an inp file.

[0116] Step S603: Number each grain in Matlab. Embodiments of the present application can import the generated inp file into a self-written Matlab script for running, and by running the Matlab script, number each grain in the generated crystal model and calculate the crystal orientation of each grain.

[0117] Step S604: Import the model into ABAQUS and call the Fortran program for calculation. Embodiments of the present application can respectively import the inp files of the fretting specimen and the fretting pad into ABAQUS, and then a crystal plasticity finite element model can be generated. As Figure 5 shown, the crystal plasticity finite element model of embodiments of the present application has the same shape as the actual polycrystalline specimen and contains crystallographic information such as the crystal orientations, grain boundaries, sizes of each grain, and morphologies of each grain of each grain.

[0118] Furthermore, embodiments of the present application can respectively import the inp files of the fretting specimen and the fretting pad into ABAQUS to generate a crystal plasticity finite element model. Specifically, embodiments of the present application can associate the ABAQUS finite element model with the Fortran material subroutine established in step S101 to complete the crystal plasticity finite element modeling.

[0119] For example, as Figure 2 and Figure 3 shown, embodiments of the present application can realize the crystal plasticity simulation of fretting fatigue of polycrystalline alloys through running calculations, obtain results such as stress, strain, and accumulated plastic strain, and use ABAQUS for visual analysis of the results.

[0120] Among them, Figure 2 is the stress nephogram obtained by running calculations to realize the crystal plasticity simulation of fretting fatigue of polycrystalline alloys; Figure 3 is the accumulated plastic strain nephogram obtained by running calculations to realize the crystal plasticity simulation of fretting fatigue of polycrystalline alloys.

[0121] The simulation results of the embodiments of the present application can display the stress, strain, and dangerous positions of cumulative plastic strain, providing an effective basis for the failure analysis and fault prediction of fretting fatigue, thereby studying the effects of microstructures such as crystal orientation, grain boundary, and grain geometry on the fretting fatigue behavior of polycrystalline alloys. The calculation program written based on the crystal plasticity constitutive model in the embodiments of the present application is combined with the ABAQUS software to achieve crystal plasticity finite element analysis of the fretting fatigue of polycrystalline materials, and better simulate the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process.

[0122] According to the crystal plasticity simulation method for the fretting fatigue of polycrystalline alloys proposed in the embodiments of the present application, a corresponding calculation program can be written based on the crystal plasticity constitutive model, and a crystal plasticity finite element model can be established. Then, by associating the crystal plasticity finite element model with the calculation program, the crystal plasticity finite element modeling can be completed, which can better simulate the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, increasing the accuracy and reliability of the simulation results, having a wide application range, and lower cost. Thus, the technical problems in the related art, such as ignoring the plastic behavior of materials, insufficient consideration of the microstructures of polycrystalline materials, resulting in errors in the simulation results, limited accuracy, and high cost required to improve the simulation accuracy, are solved.

[0123] Next, a crystal plasticity simulation device for the fretting fatigue of polycrystalline alloys proposed in the embodiments of the present application is described with reference to the accompanying drawings.

[0124] Figure 7 It is a block diagram of the crystal plasticity simulation device for the fretting fatigue of polycrystalline alloys in the embodiments of the present application.

[0125] As Figure 7 shown, the crystal plasticity simulation device 10 for the fretting fatigue of polycrystalline alloys includes: a program generation module 100, a first modeling module 200, a model generation module 300, a shear module 400, a calculation module 500, and a second modeling module 600.

[0126] Specifically, the program generation module 100 is used to write the crystal plasticity constitutive relationship and generate a call calculation program.

[0127] The first modeling module 200 is used to establish a geometric model including a fretting specimen and a fretting pad according to the actual shape of the actual specimen, and generate an stl file.

[0128] The model generation module 300 is used to determine at least one parameter of the required crystal model, and generate a material model containing crystal microstructures based on the at least one parameter to obtain a self-written script.

[0129] The shearing module 400 is used to import the stl file into a self-written script, shear the generated crystal model so that the crystal model is consistent with the model of the actual specimen, and save it as an inp file.

[0130] The calculation module 500 is used to import the inp file into a preset Matlab script for running, number each grain in the crystal model, and calculate the crystal orientation of each grain.

[0131] The second modeling module 600 is used to generate a crystal plasticity finite element model based on the inp files corresponding to the fretting specimen and the fretting pad, and associate the crystal plasticity finite element model with the called calculation program to complete the crystal plasticity finite element modeling.

[0132] Optionally, in an embodiment of the present application, the second modeling module 500 is further used to assemble the fretting specimen and the fretting pad; set fatigue load, boundary conditions, analysis steps, friction and contact for the polycrystalline model of the fretting specimen, and set a normal contact load for the polycrystalline model of the fretting pad, with one end of the fretting specimen fixed and a fatigue load applied to the other end.

[0133] Optionally, in an embodiment of the present application, the contact property between the fretting specimen and the fretting pad is hard contact, and a preset friction coefficient is given.

[0134] Optionally, in an embodiment of the present application, the crystal plasticity finite element model has the same shape as the actual specimen and includes crystal information, where the crystal information includes one or more of the crystal orientation, grain boundary, grain size, and grain morphology of each grain.

[0135] Optionally, in an embodiment of the present application, the crystal plasticity constitutive relation includes a crystallographic description of the plastic behavior.

[0136] It should be noted that the foregoing explanation of the embodiment of the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys also applies to the crystal plasticity simulation device for fretting fatigue of polycrystalline alloys in this embodiment, and will not be elaborated here.

[0137] According to the crystal plasticity simulation device for fretting fatigue of polycrystalline alloys proposed in the embodiments of the present application, a corresponding calculation program can be written based on the crystal plasticity constitutive model, and a crystal plasticity finite element model can be established. Furthermore, by associating the crystal plasticity finite element model with the calculation program, the crystal plasticity finite element modeling can be completed, which can better simulate the plastic deformation and damage behavior of polycrystalline alloys during the actual fretting fatigue process, increase the accuracy and reliability of the simulation results, have a wide range of applications, and lower costs. Thus, the technical problems in the related art, such as ignoring the plastic behavior of materials, insufficient consideration of the microstructure of polycrystalline materials, resulting in errors in the simulation results, limited accuracy, and high costs required to improve the simulation accuracy, are solved.

[0138] Figure 8 This is a schematic structural diagram of the electronic device provided by the embodiment of the present application. The electronic device may include:

[0139] A memory 801, a processor 802, and a computer program stored on the memory 801 and executable on the processor 802.

[0140] When the processor 802 executes the program, it implements the crystal plasticity simulation method for polycrystalline alloy fretting fatigue provided in the above embodiment.

[0141] Furthermore, the electronic device further includes:

[0142] A communication interface 803 for communication between the memory 801 and the processor 802.

[0143] The memory 801 is used to store a computer program executable on the processor 802.

[0144] The memory 801 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0145] If the memory 801, the processor 802, and the communication interface 803 are implemented independently, the communication interface 803, the memory 801, and the processor 802 can be interconnected through a bus and communicate with each other. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of simplicity of representation, Figure 8 only a thick line is used to represent it in the figure, but it does not mean that there is only one bus or one type of bus.

[0146] Optionally, in a specific implementation, if the memory 801, the processor 802, and the communication interface 803 are integrated on a chip, the memory 801, the processor 802, and the communication interface 803 can communicate with each other through an internal interface.

[0147] The processor 802 may be a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0148] This embodiment also provides a computer-readable storage medium, on which a computer program is stored. When the program is executed by a processor, it implements the crystal plasticity simulation method for polycrystalline alloy fretting fatigue as described above.

[0149] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, without conflict, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0150] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "N" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0151] Any process or method description shown in the flowchart or described in other ways herein may be understood to represent a module, segment, or portion of code including one or more executable instructions for implementing a customized logic function or process. The scope of the preferred embodiments of the present application includes additional implementations, where the functions may be executed in a substantially simultaneous manner or in an order opposite to that shown or discussed, according to the functions involved, which should be understood by those skilled in the art to which the embodiments of the present application belong.

[0152] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a definable sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or in conjunction with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection portion (electronic device) having one or N wirings, a portable computer disk cartridge (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other suitable processing as necessary, and then storing it in a computer memory.

[0153] It should be understood that various parts of the present application can be implemented by hardware, software, firmware, or a combination thereof. In the above-described embodiments, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits having suitable combinational logic gate circuits, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0154] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the method of implementing the above embodiments can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0155] In addition, each functional unit in various embodiments of the present application may be integrated into a processing module, may exist physically alone for each unit, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. When the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0156] The above-mentioned storage medium may be a read-only memory, a magnetic disk, an optical disc, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A crystal plasticity simulation method for fretting fatigue of polycrystalline alloys, characterized in that, it includes the following steps: Write the crystal plasticity constitutive relationship and generate a calling calculation program; Establish a geometric model including a fretting specimen and a fretting pad according to the actual shape of the actual specimen, and generate an stl file; Determine at least one parameter of the required crystal model, and generate a material model containing crystal microstructure based on the at least one parameter to obtain a self-written script; Import the stl file into the self-written script, and shear the generated crystal model so that the crystal model is consistent with the model of the actual specimen, and save it as an inp file; Import the inp file into a preset Matlab script for running, number each grain in the crystal model, and calculate the crystal orientation of each grain; Generate a crystal plasticity finite element model based on the inp files corresponding to the fretting specimen and the fretting pad, and associate the crystal plasticity finite element model with the calling calculation program to complete the crystal plasticity finite element modeling.

2. The method according to claim 1, characterized in that, before associating the crystal plasticity finite element model with the calling calculation program, it further includes: Assemble the fretting specimen and the fretting pad; Set fatigue load, boundary conditions, analysis steps, friction and contact for the polycrystalline model of the fretting specimen, and set a normal contact load for the polycrystalline model of the fretting pad. One end of the fretting specimen is fixed, and a fatigue load is applied to the other end of the fretting specimen.

3. The method according to claim 1, characterized in that, the contact property between the fretting specimen and the fretting pad is a hard contact, and a preset friction coefficient is given.

4. The method according to claim 1, characterized in that, the crystal plasticity finite element model has the same shape as the actual specimen and contains crystal information, where the crystal information includes one or more of the crystal orientation, grain boundary, grain size and grain morphology of each grain.

5. The method according to any one of claims 1-4, characterized in that, the crystal plasticity constitutive relationship includes a crystallographic description of plastic behavior.

6. A crystal plasticity simulation device for fretting fatigue of polycrystalline alloys, characterized in that, it includes: A program generation module for writing the crystal plasticity constitutive relationship and generating a calling calculation program; A first modeling module for establishing a geometric model including a fretting specimen and a fretting pad according to the actual shape of the actual specimen, and generating an stl file; A model generation module for determining at least one parameter of the required crystal model, and generating a material model containing crystal microstructure based on the at least one parameter to obtain a self-written script; A shearing module for importing the stl file into the self-written script, and shearing the generated crystal model so that the crystal model is consistent with the model of the actual specimen, and saving it as an inp file; A calculation module for importing the inp file into a preset Matlab script for running, numbering each grain in the crystal model, and calculating the crystal orientation of each grain; A second modeling module, configured to generate a crystal plasticity finite element model based on the inp file corresponding to the fretting specimen and the fretting pad, and associate the crystal plasticity finite element model with the called calculation program to complete crystal plasticity finite element modeling.

7. The apparatus according to claim 6, wherein, the second modeling module is further configured to: assemble the fretting specimen and the fretting pad; set fatigue load, boundary conditions, analysis steps, friction and contact for the polycrystalline model of the fretting specimen, and set a normal contact load for the polycrystalline model of the fretting pad, with one end of the fretting specimen fixed and a fatigue load applied to the other end of the fretting specimen.

8. The apparatus according to claim 6, wherein, the crystal plasticity finite element model has the same shape as the actual specimen and includes crystal information, where the crystal information includes one or more of the crystal orientation, grain boundary, grain size, and grain morphology of each grain.

9. An electronic device, wherein, it includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor executes the program to implement the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys according to any one of claims 1-5.

10. A computer-readable storage medium, on which a computer program is stored, wherein, the program is executed by a processor to be used to implement the crystal plasticity simulation method for fretting fatigue of polycrystalline alloys according to any one of claims 1-5.

Images