suction cup

Abstract

The present application relates to the technical field of semiconductor processing equipment, and more specifically, to a suction cup comprising a cup body, wherein the cup surfaces on opposite sides of the cup body in a first direction are respectively a first cup surface and a second cup surface, wherein the first cup surface has a plurality of first air holes formed therein, and the cup body has a plurality of air channels formed therein, each of the air channels correspondingly communicating with each of the first air holes, and the second cup surface has a plurality of second air holes formed therein, each of the air channels correspondingly communicating with each of the second air holes. The purpose of the present application is to provide a suction cup that addresses the problem that suction cups used in existing semiconductor processing equipment can only be used for materials of one size, thereby reducing processing efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a suction cup. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. They are used in integrated circuits, consumer electronics, communications systems, photovoltaic power generation, lighting, and high-power power conversion. Semiconductor processing often uses materials of varying sizes. However, due to the high precision and compact structure of semiconductor processing equipment, only one material size can be used in a single exposure scene. Otherwise, the suction cup must be replaced, significantly limiting processing efficiency. Summary of the Invention

[0003] The purpose of the present application is to provide a suction cup to address the problem that a suction cup used in existing semiconductor processing equipment can only be used for materials of one size, which reduces processing efficiency.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions:

[0005] An embodiment of the present application provides a suction cup, including a disc body, wherein the disc surfaces on opposite sides of the disc body in a first direction are respectively a first disc surface and a second disc surface, a plurality of first air holes are formed on the first disc surface, a plurality of air channels are formed in the disc body, and each of the air channels is connected to each of the first air holes in a one-to-one correspondence, and a plurality of second air holes are formed on the second disc surface, and each of the air channels is connected to each of the second air holes in a one-to-one correspondence.

[0006] Optionally, a first circular adsorption area and a first crescent-shaped adsorption area are formed on the second disk surface, and second air holes are formed on both the first circular adsorption area and the first crescent-shaped adsorption area. The first crescent-shaped adsorption area extends along the circumference of the first circular adsorption area, and the first circular adsorption area is connected to the first crescent-shaped adsorption area to form a second circular adsorption area.

[0007] The beneficial effect of this technical solution is that the first circular adsorption area and the second circular adsorption area are both used to adsorb circular materials. When the size of the circular material is small, only the first circular adsorption area can be used for adsorption; when the size of the circular material is large, the second circular adsorption area is used for adsorption. At this time, the second pores on the first circular adsorption area and the second pores on the first crescent-shaped adsorption area are both used to adsorb materials.

[0008] Optionally, a second crescent-shaped adsorption area is further formed on the second disk surface, the first circular adsorption area, the first crescent-shaped adsorption area and the second crescent-shaped adsorption area are sequentially connected to form a third circular adsorption area, and the second air hole is formed on the second crescent-shaped adsorption area.

[0009] The beneficial effect of this technical solution is that by setting a second crescent-shaped adsorption area and forming a third circular adsorption area, the second pores on the first circular adsorption area, the first crescent-shaped adsorption area and the second crescent-shaped adsorption area can all have an adsorption effect on the material, further increasing the size of the circular material that the suction cup can adsorb, and improving the applicability of the suction cup and semiconductor processing equipment.

[0010] Optionally, a square adsorption area is further formed on the second disk surface. The square adsorption area is located on a side of the second crescent-shaped adsorption area away from the first circular adsorption area, and the second air holes are formed on the square adsorption area.

[0011] The beneficial effect of this technical solution is that the suction cup provided in the embodiment of the present application can not only absorb round materials, but also absorb square materials, further increasing the applicability of the suction cup provided in the embodiment of the present application.

[0012] Optionally, there are a plurality of square adsorption areas, each of which is distributed along the circumference of the second crescent-shaped adsorption area, and each of which has a different area.

[0013] The beneficial effect of this technical solution is that: that is, if there are four square adsorption areas, the four square adsorption areas have four types of areas, so that the suction cup provided in the embodiment of the present application can adsorb square materials of various sizes, further improving the applicability of the suction cup provided in the embodiment of the present application.

[0014] Optionally, a positioning square groove is formed between the square adsorption area, the second crescent-shaped adsorption area, and the square adsorption area.

[0015] Optionally, a first square avoidance groove is formed on the disk body, the first square avoidance groove is formed at an edge of the disk body, and the first square avoidance groove is located on a side of the disk body away from the second crescent-shaped adsorption area.

[0016] Optionally, a second avoidance groove is formed on the disc body, the second avoidance groove is formed at an edge of the disc body, and the second avoidance groove is located on a side of the square adsorption area away from the second crescent-shaped adsorption area.

[0017] The beneficial effect of this technical solution is that the suction cup provided in the embodiment of the present application is not easily collided with structures such as a robotic arm.

[0018] Optionally, a plurality of supporting protrusions are arranged in both the third circular adsorption area and the square adsorption area, and any three adjacent supporting protrusions are arranged in an equilateral triangle.

[0019] The beneficial effect of this technical solution is that: in this way, stable support of the supporting protrusions can be obtained at all positions of the third circular adsorption area and the square adsorption area.

[0020] Optionally, a sealing layer is laid in both the third circular adsorption area and the square adsorption area, and each of the supporting protrusions is arranged on the sealing layer.

[0021] The technical solution provided by this application can achieve the following beneficial effects:

[0022] The suction cup provided in the embodiment of the present application, when in use, connects each first air hole to a vacuum pump through a connecting tube, places the material on the second disk surface, and the suction action of the vacuum pump acts on the material through each first air hole, each air channel and each second air hole in turn, so that the material is adsorbed at the second air hole. When the area of ​​the material is small, the material can be adsorbed by only one second air hole. When the area of ​​the material is large, the material can be adsorbed by two or more second air holes, thereby allowing the same suction cup to be used to adsorb materials of different sizes. When using semiconductor processing equipment to process different materials, there is no need to use multiple suction cups of different specifications, nor is there any need to replace the suction cup when changing materials, thereby improving the work efficiency of semiconductor processing.

[0023] The additional technical features and advantages of this application will be more clearly explained in the following description, or can be understood through the specific practice of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the specific embodiments of this application, the following briefly introduces the drawings required for describing the specific embodiments. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0025] Figure 1 A schematic diagram of a three-dimensional structure at one angle of an embodiment of a suction cup provided in an embodiment of the present application;

[0026] Figure 2 A schematic diagram of the three-dimensional structure of an embodiment of the suction cup provided in an embodiment of the present application from another angle;

[0027] Figure 3 A schematic side view of a suction cup according to an embodiment of the present application;

[0028] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure at AA in the middle.

[0029] Reference numerals:

[0030] 1-disc body; 11-first air hole;

[0031] 12- Positioning square groove; 13- Bolt stepped hole;

[0032] 14-sealing layer; 15-supporting bumps;

[0033] 16- inlay hole; 17- airway;

[0034] 18-limit pin hole; 19-first avoidance square groove;

[0035] 111-first circular adsorption area; 112-first crescent-shaped adsorption area;

[0036] 113-second crescent-shaped adsorption area; 114-square adsorption area;

[0037] 2-Location bearing; 3-Sealing plate;

[0038] 31- Second air hole; 20- Second avoidance groove. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solution of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0040] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0042] like Figures 1 to 4As shown, one aspect of an embodiment of the present application provides a suction cup, including a disc body 1, and the disc surfaces on opposite sides of the disc body 1 in a first direction are respectively a first disc surface and a second disc surface, a plurality of first air holes 11 are formed on the first disc surface, a plurality of air channels 17 are formed in the disc body 1, and each of the air channels 17 is connected to each of the first air holes 11 in a one-to-one manner, and a plurality of second air holes 31 are formed on the second disc surface, and each of the air channels 17 is connected to each of the second air holes 31 in a one-to-one manner.

[0043] In the embodiment of the present application, the number of first air holes 11, the number of air channels 17 and the number of second air holes 31 are all at least two; a sealing sheet 3 is provided in the air channel 17, so that when the material is adsorbed, a closed space is formed between the material and the air channel 17; the second air hole 31 is preferably a threaded hole.

[0044] When the suction cup provided in the embodiment of the present application is used, each first air hole 11 is connected to a vacuum pump through a connecting pipe, and the material is placed on the second disk surface. The suction action of the vacuum pump acts on the material through each first air hole 11, each air channel 17 and each second air hole 31 in turn, so that the material is adsorbed at the second air hole 31. When the area of ​​the material is small, the material can be adsorbed by only one second air hole 31. When the area of ​​the material is large, the material can be adsorbed by two or more second air holes 31, so that the same suction cup can be used to adsorb materials of different sizes. When using semiconductor processing equipment to process different materials, there is no need to use multiple suction cups of different specifications, nor is there any need to replace the suction cup when changing materials, thereby improving the work efficiency of semiconductor processing.

[0045] Optionally, a first circular adsorption area 111 and a first crescent-shaped adsorption area 112 are formed on the second disk surface. Second air holes 31 are formed on both the first circular adsorption area 111 and the first crescent-shaped adsorption area 112. The first crescent-shaped adsorption area 112 extends along the circumference of the first circular adsorption area 111. The first circular adsorption area 111 and the first crescent-shaped adsorption area 112 are connected to form a second circular adsorption area. Both the first circular adsorption area 111 and the second circular adsorption area are used to adsorb circular materials. When the size of the circular material is small, only the first circular adsorption area 111 can be used for adsorption. When the size of the circular material is large, the second circular adsorption area is used for adsorption. In this case, the second air holes 31 on the first circular adsorption area 111 and the second air holes 31 on the first crescent-shaped adsorption area 112 are both used to adsorb the material.

[0046] Optionally, a second crescent-shaped suction area 113 is further formed on the second disk surface. The first circular suction area 111, the first crescent-shaped suction area 112, and the second crescent-shaped suction area 113 are sequentially connected to form a third circular suction area. The second air holes 31 are formed in the second crescent-shaped suction area 113. By providing the second crescent-shaped suction area 113 and forming the third circular suction area, each of the second air holes 31 in the first circular suction area 111, the first crescent-shaped suction area 112, and the second crescent-shaped suction area 113 can absorb materials, further increasing the size of circular materials that the suction cup can absorb and improving the applicability of the suction cup and semiconductor processing equipment.

[0047] Optionally, a square adsorption area 114 is further formed on the second disk surface. The square adsorption area 114 is located on a side of the second crescent-shaped adsorption area 113 facing away from the first circular adsorption area 111. The second air holes 31 are formed in the square adsorption area 114. In this way, the suction cup provided in this embodiment of the present application can not only adsorb round materials, but also square materials, further increasing the applicability of the suction cup provided in this embodiment of the present application.

[0048] Optionally, there are multiple square adsorption areas 114, each of which is distributed along the circumference of the second crescent-shaped adsorption area 113, and each of which has a different area. In other words, if there are four square adsorption areas 114, the four square adsorption areas 114 have four different areas. This allows the suction cup provided in this embodiment of the application to adsorb square materials of various sizes, further improving the applicability of the suction cup provided in this embodiment of the application.

[0049] Optionally, a positioning square groove 12 is formed between the square adsorption area 114 , the second crescent-shaped adsorption area 113 , and the square adsorption area 114 .

[0050] Optionally, a first square avoidance groove 19 is formed on the disc body 1 . The first square avoidance groove 19 is formed at an edge of the disc body 1 . The first square avoidance groove 19 is located on a side of the disc body 1 away from the second crescent-shaped adsorption area 113 .

[0051] Optionally, a second avoidance groove 20 is formed on the disk body 1. The second avoidance groove 20 is formed at the edge of the disk body 1 and is located on the side of the square adsorption area 114 away from the second crescent-shaped adsorption area 113. In this way, the suction cup provided in the embodiment of the present application is not likely to collide with structures such as a robotic arm. Inlay holes 16 are provided on both sides of the first avoidance square groove 19 on the disk body 1, and the positioning bearing 2 is bonded to the inlay holes 16 to realize the positioning function of manually loading materials in the circular area. A limit pin hole 18 is also formed on the disk body 1 to which a limit pin can be assembled.

[0052] Optionally, multiple support bumps 15 are arranged in both the third circular adsorption area and the square adsorption area 114, with any three adjacent support bumps 15 arranged in an equilateral triangle. In this way, stable support from the support bumps 15 can be obtained at all positions in the third circular adsorption area and the square adsorption area 114.

[0053] Optionally, a sealing layer 14 is laid in both the third circular adsorption area and the square adsorption area 114 , and each of the supporting protrusions 15 is arranged on the sealing layer 14 .

[0054] The disc body 1 is provided with six bolt stepped holes 13 for connection with external mechanisms, and can be fixed on the rotating mechanism and rotated around the center to meet the Rz rotation stroke requirement.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. Suction cup, characterized in that, The invention comprises a disk body, wherein disk surfaces on opposite sides of the disk body in a first direction are respectively a first disk surface and a second disk surface, a plurality of first air holes are formed on the first disk surface, a plurality of air channels are formed in the disk body, each of the air channels is connected to each of the first air holes in a one-to-one correspondence, and a plurality of second air holes are formed on the second disk surface, each of the air channels is connected to each of the second air holes in a one-to-one correspondence; A first circular adsorption area and a first crescent-shaped adsorption area are formed on the second disk surface, second air holes are formed on both the first circular adsorption area and the first crescent-shaped adsorption area, the first crescent-shaped adsorption area extends along the circumference of the first circular adsorption area, and the first circular adsorption area and the first crescent-shaped adsorption area are connected to form a second circular adsorption area; A second crescent-shaped adsorption area is further formed on the second disk surface, the first circular adsorption area, the first crescent-shaped adsorption area and the second crescent-shaped adsorption area are sequentially connected to form a third circular adsorption area, and the second air hole is formed on the second crescent-shaped adsorption area; A square adsorption area is further formed on the second disk surface, the square adsorption area is located on a side of the second crescent-shaped adsorption area away from the first circular adsorption area, and the second air hole is formed on the square adsorption area; There are multiple square adsorption areas, each of which is distributed along the circumference of the second crescent-shaped adsorption area, and each of the square adsorption areas has a different area; A positioning square groove is formed between the square adsorption area, the second crescent-shaped adsorption area and the square adsorption area; A first square avoidance groove is formed on the disc body, the first square avoidance groove is formed at the edge of the disc body, and the first square avoidance groove is located on a side of the disc body away from the second crescent-shaped adsorption area; On both sides of the first avoidance square groove on the disc body, there are inlay holes, and two positioning bearings are bonded to the two inlay holes in a one-to-one correspondence, so as to realize the positioning function of manually loading materials in the circular area; the positioning square groove partially overlaps with the second crescent-shaped adsorption area; A second avoidance groove is formed on the disc body, the second avoidance groove is formed at the edge of the disc body, and the second avoidance groove is located on a side of the square adsorption area away from the second crescent-shaped adsorption area.

2. The suction cup according to claim 1, wherein A plurality of supporting convex points are arranged in both the third circular adsorption area and the square adsorption area, and any three adjacent supporting convex points are arranged in an equilateral triangle.

3. The suction cup according to claim 2, characterized in that A sealing layer is laid in both the third circular adsorption area and the square adsorption area, and each of the supporting protrusions is arranged on the sealing layer.

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