Electrical apparatus

Abstract

An electrical device includes a semiconductor element (30), conductors (110, 120), and a covering resin (20). The conductors are connected to the semiconductor element. At least one of the conductors extends in a first direction. The covering resin covers the semiconductor element and a portion of each of the conductors. The conductors respectively include covered portions (116, 125) and exposed portions (117, 126). Each of the covered portions is covered by the covering resin. Each of the exposed portions is exposed from the covering resin. The conductors are aligned in a second direction. Two of the exposed portions closest to each other are spaced apart in each of the second direction and a third direction. The third direction is perpendicular to the first direction and the second direction. A shortest spacing distance between the two closest covered portions is shorter than a shortest spacing distance between the two closest exposed portions.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an electrical device. BACKGROUND

[0002] JP 2018-137315 A describes an electrical device including terminal members and sealing resin for sealing each of the terminal members. SUMMARY

[0003] In the structure described in JP 2018-137315, a portion of each of the terminal members is exposed from the sealing resin, and a shortest interval distance between the portions of the terminal members sealed by the sealing resin is the same as a shortest interval distance between the portions of the terminal members exposed from the sealing resin. Therefore, the physical size of the sealing resin tends to be larger, and can cause the physical size of the electrical device to increase.

[0004] An object of the present disclosure is to provide an electrical device whose physical size is suppressed.

[0005] According to one aspect of the present disclosure, an electrical device includes semiconductor elements, conductors, and a covering resin. The conductors are connected to the semiconductor elements, respectively. At least one of the conductors extends in a first direction. The covering resin covers the semiconductor elements and a portion of each of the conductors. The conductors each include a covered portion and an exposed portion. Each of the covered portions is covered by the covering resin. Each of the exposed portions is exposed from the covering resin. The conductors are aligned in a second direction different from the first direction. Two of the exposed portions closest to each other are spaced apart in each of a second direction and a third direction. The third direction is perpendicular to the first direction and the second direction. A shortest interval distance between two of the covered portions closest to each other is smaller than a shortest interval distance between two of the exposed portions closest to each other.

[0006] According to the above structure, the physical size of the covering resin can be easily suppressed. Therefore, the electrical device can be downsized. BRIEF DESCRIPTION OF DRAWINGS

[0007] The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0008] Figure 1 is a circuit diagram showing a drive system;

[0009] Figure 2 is a plan view showing an electrical device;

[0010] Figure 3 is Figure 2 is a plan view of the electrical device with the coating resin removed from

[0011] Figure 4 is a plan view of the electrical device with the coating resin removed fromFigure 2 A cross-sectional view taken from line IV-IV;

[0012] Figure 5 It is along Figure 2 A cross-sectional view of line VV;

[0013] Figure 6 It is along Figure 2 A cross-sectional view taken from line VI-VI;

[0014] Figure 7 It is along Figure 2 A cross-sectional view taken from line VII-VII;

[0015] Figure 8 It is along Figure 2 A cross-sectional view taken from line VIII-VIII;

[0016] Figure 9 It is along Figure 8 A cross-sectional view taken from line IX-IX;

[0017] Figure 10 This is a cross-sectional view showing the modifications to the roughened portion;

[0018] Figure 11 This is a top view showing the modifications to the signal terminals;

[0019] Figure 12 This is a top view showing the modifications to the signal terminals;

[0020] Figure 13 This is a modified cross-sectional view used to illustrate the upper and lower exposed portions; and

[0021] Figure 14 This is a cross-sectional view used to illustrate the modifications to the first upper connecting portion and the first lower connecting portion. Detailed Implementation

[0022] The embodiments for carrying out this disclosure will now be described with reference to the accompanying drawings. In each embodiment, components corresponding to the elements described in the previous embodiments are indicated by the same reference numerals, and redundant explanations may be omitted. When only a portion of the configuration is described in each form, the other forms described above may be applied to the remaining portions of the configuration.

[0023] Not only can components whose combination is explicitly described in the embodiments be combined, but components whose combination is not explicitly described in the various embodiments can also be combined if no particular obstacle arises in combining the components of the various embodiments.

[0024] (First Embodiment)

[0025] The following is for reference Figure 1A schematic configuration of a vehicle drive system 1 will be described.

[0026] (Vehicle drive system)

[0027] As shown in Figure 1 , the vehicle drive system 1 is equipped with a direct current power source 2, a motor generator 3, and a power converter 4.

[0028] The direct current power source 2 is a direct current voltage source including a secondary battery which is chargeable / dischargable. The secondary battery is, for example, a lithium ion battery or a nickel hydrogen battery. The motor generator 3 is a three-phase alternating current type rotary electric machine. The motor generator 3 functions as a vehicle drive power source, i.e., a motor. The motor generator 3 also functions as a generator during regeneration. The power converter device 4 performs electric power conversion between the direct current power source 2 and the motor generator 3.

[0029] (Power converter device)

[0030] Next, the circuit configuration of the power converter device 4 will be described with reference to Figure 1 . The power converter device 4 includes a smoothing capacitor 5 and an inverter 6.

[0031] The smoothing capacitor 5 mainly smooths a direct current voltage (DC voltage) supplied from the direct current power source 2. One electrode included in the smoothing capacitor 5 is connected to a positive electrode of the direct current power source 2 and the inverter 6 through a P bus 7. The other electrode included in the smoothing capacitor 5 is connected to a negative electrode of the direct current power source 2 and the inverter 6 through an N bus 8. The direct current power source 2, the smoothing capacitor 5, and the inverter 6 are connected in parallel between the P bus 7 and the N bus 8.

[0032] The inverter 6 corresponds to a direct current-alternating current converter circuit. The inverter 6 converts a direct current into an alternating current by switching control of a control circuit (not shown). The inverter 6 outputs the converted alternating current to the motor generator 3. Thus, the motor generator 3 is driven.

[0033] During vehicle regenerative braking, the inverter 6 converts, according to switching control of the control circuit, three-phase alternating current generated by the motor generator 3 receiving a rotational force from a wheel into a direct current, and outputs the direct current voltage to the P bus 7. In this way, the inverter 6 performs bidirectional power conversion between the direct current power source 2 and the motor generator 3.

[0034] The inverter 6 includes three-phase upper and lower arm circuits 9. The upper and lower arm circuits 9 are also referred to as bridge arms. The upper and lower arm circuits 9 include three-phase upper arms 9H and three-phase lower arms 9L. Each of the three-phase upper arms 9H is connected to the P bus 7. Each of the three-phase lower arms 9L is connected to the N bus 8. The inverter 6 has six arms.

[0035] The upper arm 9H and the lower arm 9L are connected in series between the P busbar 7 and the N busbar 8. The connection node between the upper arm 9H and the lower arm 9L is connected to the winding 3a of the corresponding phase of the electric generator 3.

[0036] In this embodiment, an n-channel insulated-gate bipolar transistor 11 is used as the switching element included in each arm. Hereinafter, the n-channel insulated-gate bipolar transistor 11 may also be referred to as IGBT 11. A freewheeling diode 12 is connected in anti-parallel to each IGBT 11. Hereinafter, the freewheeling diode 12 may also be referred to as FWD 12.

[0037] like Figure 1 As shown, in the upper arm 9H, the collector of IGBT 11 is connected to the P bus 7. In the lower arm 9L, the emitter of IGBT 11 is connected to the N bus 8. The emitters of IGBT 11 in the upper arm 9H and the collectors of IGBT 11 in the lower arm 9L are connected. The anode of FWD 12 is connected to the emitter of the corresponding IGBT 11, and the cathode of FWD 12 is connected to the collector of the corresponding IGBT 11.

[0038] The power converter device 4 may further include a converter as a power converter circuit. The converter is a DC-DC converter circuit used to convert a DC voltage into a DC voltage with different values. The converter is disposed between the DC power supply 2 and the smoothing capacitor 5. The converter is configured to include, for example, a reactor and the aforementioned upper and lower arm circuits 9. The power converter device 4 may further include a filter capacitor for removing power supply noise from the DC power supply 2. The filter capacitor is disposed between the DC power supply 2 and the converter.

[0039] The power converter device 4 may also have a drive circuit for switching elements, such as those in the inverter 6. The drive circuit provides a drive voltage to the gate of the corresponding IGBT 11 based on drive commands from the control circuit. The drive circuit drives the corresponding IGBT 11 by applying the drive voltage to turn it on and off. The drive circuit may also be referred to as a driver.

[0040] The power converter device 4 may include control circuitry for switching elements. The control circuitry generates drive commands based on torque request inputs from an advanced ECU (not shown) or signals detected by various sensors. ECU is an abbreviation for Electronic Control Unit.

[0041] Various sensors include, for example, current sensors, rotation angle sensors, and voltage sensors. The current sensor detects the phase current flowing through each phase winding 3a. The rotation angle sensor detects the rotation angle of the rotor of the electric generator 3. The voltage sensor detects the voltage across the smoothing capacitor 5. For example, the control circuit outputs a PWM signal as a drive command. The control circuit includes, for example, a microcomputer. PWM is an abbreviation for Pulse Width Modulation.

[0042] (Electrical equipment)

[0043] The schematic configuration of electrical equipment 15 is described below. The three mutually orthogonal directions are referred to as the x-direction, y-direction, and z-direction. The x-direction corresponds to the second direction. The y-direction corresponds to the first direction. The z-direction corresponds to the third direction.

[0044] In the attached diagram, for clarification, the following is given. Figure 2 The position of the cross-sectional line corresponds to Figure 2 The cross-sectional lines also give Figure 3 .

[0045] In the following text, for some components included in electrical device 15, an “H” indicating the upper arm 9H side will be added after the reference numeral, and an “L” indicating the lower arm 9L will be added to the reference numeral. For other components included in electrical device 15, common reference numerals are given in both the upper arm 9H and the lower arm 9L.

[0046] like Figures 2-4 As shown, the electrical device 15 includes a cover resin 20, two semiconductor chips 30, two first heat sinks 40, two second heat sinks 50, two terminals 60, a connector 70, a main terminal 80, and multiple signal terminals 100. The cover resin 20 may also be referred to as a coating resin or a sealing resin.

[0047] Electrical device 15 may not include all of the above-described configuration elements. Electrical device 15 may include some of the above-described configuration elements.

[0048] Electrical device 15 is included in upper and lower arm circuits 9 for one phase described above. Each of the upper arm 9H and lower arm 9L is provided with a semiconductor chip 30, a first heat sink 40, a second heat sink 50, a terminal 60, and a signal terminal 100.

[0049] The signal terminal 100 includes a plurality of upper-level terminals 110 and a plurality of lower-level terminals 120. The upper-level terminals 110 and lower-level terminals 120 are arranged at the upper arm 9H. The upper-level terminals 110 and lower-level terminals 120 are arranged at the lower arm 9L. The upper-level terminals 110 and lower-level terminals 120 correspond to conductive parts, conductive portions, or conductors.

[0050] The connector 70 has a first connector 71, a second connector 72 and a third connector 73.

[0051] The main terminal 80 has a positive terminal 80P, a negative terminal 80N, and an output terminal 80S. The positive terminal 80P can also be called the positive terminal, and the negative terminal 80N can also be called the negative terminal.

[0052] (Sealing resin)

[0053] As shown in Figures 2-4 , the cover resin 20 seals some of the configuration elements included in the electrical device 15. Specifically, the cover resin 20 seals two semiconductor chips 30, two first heat sinks 40, two second heat sinks 50, two terminals 60, the joint portion 70, a portion of the main terminal 80, and a portion of each of the signal terminals 100.

[0054] The remaining portions of the configuration elements included in the electrical device are exposed from the cover resin 20. Specifically, the remaining portions of the main terminal 80 and the remaining portions of each of the signal terminals 100 are exposed from the cover resin 20.

[0055] The cover resin 20 is made of a material such as an epoxy resin. The cover resin 20 is formed, for example, by a transfer molding method. As shown in Figure 2 , the cover resin 20 has a substantially rectangular shape. The cover resin 20 includes a first major surface 20a aligned in the z direction, a second major surface 20b located at the rear side of the first major surface 20a, and an exposed surface 20c connecting the first major surface 20a and the second major surface 20b. A portion of the main terminal 80 and a portion of each of the signal terminals 100 are exposed from the exposed surface 20c.

[0056] (Semiconductor Chip)

[0057] The semiconductor chip 30 includes a vertical element formed on a semiconductor substrate 31 made of a material such as a wide band gap semiconductor having a wider band gap than silicon. Examples of the wide band gap semiconductor include silicon carbide, gallium nitride, gallium oxide, and diamond. The semiconductor substrate 31 has a flat shape, which is thin in the z direction. The vertical element has a vertical structure so that a main current flows in the z direction. The vertical element according to the present embodiment is an IGBT 11 and an FWD 12 included in one arm. The semiconductor chip 30 corresponds to a semiconductor element.

[0058] As shown in Figure 4 , the semiconductor substrate 31 includes a first substrate surface 31a at the first major surface 20a and a second substrate surface 31b at the second major surface 20b. A collector electrode 32C is arranged at the first substrate surface 31a. The collector electrode 32C is arranged mainly on the entire surface of the first substrate surface 31a. The collector electrode 32C also serves as a cathode electrode of the diode 12. A gate electrode (not shown) and an emitter electrode 32E are arranged at the second substrate surface 31b. The emitter electrode 32E is arranged at a portion of the second substrate surface 31b. The emitter electrode 32E also serves as an anode electrode of the diode 12.

[0059] In addition to the above-described gate electrode and the emitter electrode 32E, as Figure 3As shown, a plurality of pads 32P is arranged at the second substrate surface 31b. The pads 32P are provided at the second substrate surface 31b so as to align with the emitter electrodes 32E in the y direction. The pads 32P are electrodes for signals. The pads 32P are electrically isolated from the emitter electrodes 32E.

[0060] The pads 32P include at least pads 32P for the gate and pads 32P for the temperature sensing diode. In the present embodiment, the semiconductor chip 30 has five pads 32P. Specifically, the five pads 32P are for the gate electrode, a Kelvin emitter for detecting the potential of the emitter electrode 32E, current sensing, an anode potential of a temperature sensor (temperature sensitive diode) for detecting the temperature of the semiconductor chip 30, and a cathode potential. As Figure 3 As shown, the five pads 32P are collectively formed on the terminal side of the second substrate surface 31b in the y direction, and are formed to be spaced apart from each other in the x direction.

[0061] The upper-arm-side semiconductor chip 30H and the lower-arm-side semiconductor chip 30L each have the same configuration. Hereinafter, the upper-arm-side semiconductor chip 30H can be referred to as an upper semiconductor chip 30H, and the lower-arm-side semiconductor chip 30L can be referred to as a lower semiconductor chip 30L. As Figure 4 As shown, the upper semiconductor chip 30H and the lower semiconductor chip 30L are aligned and spaced apart in the x direction as Figure 4 As shown, the upper semiconductor chip 30H and the lower semiconductor chip 30L are aligned and spaced apart in the x direction as

[0062] (First Heat Sink)

[0063] As Figure 4 As shown, the first heat sink 40 is arranged to face the collector electrode 32C of the semiconductor chip 30 in the z direction. The first heat sink 40 is electrically and mechanically connected to the collector electrode 32 by solder 90. The first heat sink 40 includes a first facing surface 40a that is a surface at the semiconductor 30, and a first back surface 40b that is located on the back side of the first facing surface 40a.

[0064] The first heat sink 40 radiates the heat of the semiconductor chip 30 outward. For example, the first heat sink 40 can employ a metal plate having a material such as copper or a copper alloy. The first heat sink 40 can include a plating layer such as nickel or silver at the surface. The electrical device 15 as described above includes two first heat sinks 40. Specifically, the two first heat sinks 40 are an upper-arm-side first heat sink 40H and a lower-arm-side first heat sink 40L. Hereinafter, the upper-arm-side first heat sink 40H can be referred to as an upper first heat sink 40H, and the lower-arm-side first heat sink 40L can be referred to as a lower first heat sink 40L.

[0065] AsFigure 4 and 5 As shown, the upper first radiator 40H and the lower first radiator 40L each have a substantially rectangular shape. The upper first radiator 40H and the lower first radiator 40L are aligned in the x-direction and spaced apart from each other. The upper first radiator 40H and the lower first radiator 40L have substantially the same thickness and are arranged in substantially the same position in the z-direction.

[0066] The first surface 40a of the upper first heat sink 40H and the collector 32C of the upper semiconductor chip 30H are joined by solder 90. The first surface 40a of the lower first heat sink 40L and the collector 32C of the lower semiconductor chip 30L are joined by solder 90.

[0067] Each of the upper first heat sink 40H and the lower first heat sink 40L completely covers the corresponding semiconductor chip 30 in the z-direction planar view. For example... Figure 4 As shown, the first rear surfaces 40b of each of the upper first radiator 40H and the lower first radiator 40L are exposed from the covering resin 20. The first rear surface 40b can also be referred to as the heat radiation surface. The first rear surface 40b is substantially flush with the first main surface 20a of the covering resin 20. The first rear surfaces 40b of the upper first radiator 40H and the lower first radiator 40L are aligned in the x-direction and spaced apart from each other.

[0068] (Second radiator)

[0069] like Figure 4 As shown, the second heat sink 50 is arranged to face the terminal 60 in the z-direction. The second heat sink 50 is electrically and mechanically connected to the terminal 60 via solder 90. The second heat sink 50 includes a second facing surface 50a, which serves as a surface at the semiconductor 30, and a second rear surface 50b located behind the second facing surface 50a.

[0070] The second heat sink 50 radiates heat from the semiconductor chip 30. For example, the second heat sink 50 may be a metal plate made of a material such as copper or a copper alloy. The second heat sink 50 may include a plating layer such as nickel or silver on its surface. The electrical device 15 as described above includes two second heat sinks 50 and two terminals 60. Specifically, the two second heat sinks 50 are a second heat sink 50H on the upper arm side and a second heat sink 50L on the lower arm side. Hereinafter, the second heat sink 50H on the upper arm side may be referred to as the upper second heat sink 50H, and the second heat sink 50L on the lower arm side may be referred to as the lower second heat sink 50L. Specifically, the two terminals 60 are a terminal 60H on the upper arm side and a terminal 60L on the lower arm side. The terminal 60H on the upper arm side may also be referred to as the upper terminal 60H, and the terminal on the lower arm side may also be referred to as the lower terminal 60L. The terminals 60 are described in detail below.

[0071] As shown in Figure 4 and 5 The upper second heat sink 50H and the lower second heat sink 50L each have a substantially rectangular shape. The upper second heat sink 50H and the lower second heat sink 50L are aligned in the x direction so as to be spaced apart from each other. The upper second heat sink 50H and the lower second heat sink 50L have substantially the same thickness and are disposed at substantially the same position in the z direction. The second facing surface 50a of the upper second heat sink 50H and a surface of the upper terminal 60H at the second facing surface 50a are joined by solder 90. The second facing surface 50a of the lower second heat sink 50L and a surface of the lower terminal 60L at the second facing surface 50a are joined by solder 90.

[0072] Each of the upper second heat sink 50H and the lower second heat sink 50L completely covers the corresponding semiconductor chip 30 in a plan view in the z direction. As shown in Figure 4 The second rear surface 50b of each of the upper second heat sink 50H and the lower second heat sink 50L is exposed from the covering resin 20. The second rear surface 50b can also be referred to as a heat radiation surface. The second rear surface 50b is substantially flush with the second major surface 20a of the covering resin 20. The second rear surface 40b of the upper second heat sink 50H and the second rear surface 50b of the lower second heat sink 50L are aligned so as to be spaced apart from each other in the x direction.

[0073] (Terminal)

[0074] The terminal 60 is interposed between the semiconductor chip 30 and the second heat sink 50 in the z direction and electrically relays the emitter electrode 32E and the second heat sink 50. The terminal 60 is located midway through the electrically and thermally conductive path between the emitter electrode 32E and the second heat sink 50. The terminal 60 is a columnar body formed of a metal material such as copper or a copper alloy. The terminal 60 can include a plating layer at a surface. The terminal 60 can be referred to as a metal block or a relay member.

[0075] As described above, the surface of the upper terminal 60H at the second facing surface 50a and the second facing surface 50a of the upper second heat sink 50H are joined by solder 90. The surface of the upper terminal 60H at the upper semiconductor chip 30H and the second substrate surface 31b of the upper semiconductor chip 30H are joined by solder 90.

[0076] As described above, the surface of the lower terminal 60L at the second facing surface 50a and the second facing surface 50a of the lower second heat sink 50L are joined by solder 90. The surface of the lower terminal 60L at the lower semiconductor chip 30L and the second substrate surface 31b of the lower semiconductor chip 30L are joined by solder 90.

[0077] (Joint portion)

[0078] The first joint portion 71 and the second joint portion 72 electrically connect the upper arm 9H and the lower arm 9L. As shown, the first joint 71 and the second joint 72 are joined by solder 90. The third joint portion 73 electrically connects the lower arm 9L and the negative terminal 80N. Figure 3

[0079] (Main terminal)

[0080] The main terminal 80 is a terminal that electrically connects the electrodes of the semiconductor chip 30. The main terminal 80 has a positive terminal 80P, a negative terminal 80N, and an output terminal 80S. The positive terminal 80P can also be referred to as a positive terminal, and the negative terminal 80N can also be referred to as a negative terminal. The positive terminal 80P and the negative terminal 80N are power supply terminals. The positive terminal 80P can also be referred to as a P terminal or a high-potential power supply terminal. The negative terminal 80N can also be referred to as an N terminal or a low-potential power supply terminal.

[0081] The output terminal 80S is connected to a connection node between the upper arm 9H and the lower arm 9L. The output terminal 80S of the electrical device 15 is electrically connected to the winding 3a of the corresponding phase of the motor generator 3. The output terminal 80S can also be referred to as an O terminal or an AC terminal.

[0082] The positive terminal 80P extends in the y direction from the end of the upper first heat sink 40H. The output terminal 80S extends in the y direction from the lower first heat sink 40L. The negative terminal 80N extends so as to be spaced apart from the upper arm 9H and the lower arm 9L in the y direction. The negative terminal 80N is joined to the third joint portion 73 by, for example, solder 90 (not shown).

[0083] The positive terminal 80P, the negative terminal 80N, and the output terminal 80S are spaced apart and shifted in order in the x direction. A part of the positive terminal 80P, the negative terminal 80N, and the output terminal 80S is sealed by the covering resin 20. The remaining part of the positive terminal 80P, the negative terminal 80N, and the output terminal 80S is exposed from the covering resin 20.

[0084] (upper terminal)

[0085] As shown, the upper terminals 110 are aligned in the x direction so as to be spaced apart from each other. The respective shapes of the upper terminals 110 are similar. Figure 5 As shown, the upper terminals 110 are electrically connected to the pads 32P of the corresponding chips 30. Specifically, the upper terminals 110 are electrically connected to the pads 32P of the corresponding chips 30 by the bonding wires 91.

[0086] Figure 3 As shown, the upper terminals 110 are electrically connected to the pads 32P of the corresponding chips 30. Specifically, the upper terminals 110 are electrically connected to the pads 32P of the corresponding chips 30 by the bonding wires 91.

[0087] As shown, the upper terminals 110 are electrically connected to the pads 32P of the corresponding chips 30. Specifically, the upper terminals 110 are electrically connected to the pads 32P of the corresponding chips 30 by the bonding wires 91. Figure 5 5 ​​​As shown, each of the plurality of terminals 110 includes a first upper connecting portion 111 and a third upper connecting portion 113 extending along the y-direction, and a second upper connecting portion 112 extending along both the y-direction and the z-direction. The second upper connecting portion 112 corresponds to the bent portion.

[0088] like Figure 3 As shown, the end of the first upper connection portion 111 is connected to the pad 32P. The first upper connection portion 111 extends in the y-direction, thereby being spaced apart from the pad 32P. The second upper connection portion 112 is connected to the end of the first upper connection portion 111 on the side of the first upper connection portion 111 that is spaced apart from the pad 32P. The second upper connection portion 112 extends in both the y and z directions, thereby being spaced apart from the first upper connection portion 111. The third upper connection portion 113 is connected to the end of the second upper connection portion on the side of the first upper connection portion 111 that is spaced apart from the first upper connection portion 111. The third upper connection portion 113 extends in the y-direction, thereby being spaced apart from the second upper connection portion 112.

[0089] The third upper connecting portion 113 includes an upper base portion 114 and an upper front end portion 115. Each of the third connecting portion 113 and the upper front end portion 115 extends in the y direction. The upper base portion 114 is connected to the end of the second upper connecting portion 112 on a side spaced apart from the first upper connecting portion 111. The upper front end portion 115 is connected to the end of the upper base portion 114 on a side spaced apart from the second upper connecting portion 112.

[0090] like Figure 5 As shown, the widths of the first upper connecting portion 111, the second upper connecting portion 112, and the upper base portion 114 are similar in the x-direction. The width of the upper front end portion 115 in the x-direction is narrower than the widths of the first upper connecting portion 111, the second upper connecting portion 112, and the upper base portion 114.

[0091] like Figure 3 As shown, a portion of the upper terminal 110 is coated or covered by the covering resin 20. The remaining portion of the upper terminal 110 is exposed from the covering resin 20. Specifically, a portion of the first upper connecting portion 111, the second upper connecting portion 112, and the upper base portion 114 is covered or coated by the covering resin 20. The remaining portion of the upper front end portion 115 and the upper base portion 114 is exposed from the covering resin 20.

[0092] In the following text, the upper terminal 110 coated or covered by the covering resin 20 is referred to as the upper covered portion 116. The upper terminal 110 exposed from the covering resin 20 is referred to as the upper exposed portion 117. Furthermore, the remaining portion of the upper base 114 exposed from the covering resin 20 included in the upper exposed portion 117 is referred to as the upper exposed base 114a. The upper covered portion 116 corresponds to the covered portion. The upper exposed portion 117 corresponds to the exposed portion.

[0093] exist Figure 5In the middle, the boundary line BL1 between the upper covering part 116 and the upper exposed part 117 is represented by a dashed line. Figure 3 In the middle, the boundary line BL2 between the second upper connecting part 112 and the third upper connecting part 113 and the boundary line BL3 between the upper exposed base 114a and the upper front end part 115 are respectively represented by dashed lines.

[0094] (Lower terminal)

[0095] like Figure 6 As shown, a plurality of lower terminals 120 are aligned in the x-direction and spaced apart from each other. The lower terminals 120 are all similar in shape.

[0096] like Figure 3 As shown, the lower terminal 120 is electrically connected to the pad 32P of the corresponding chip 30. Specifically, the lower terminal 120 is electrically connected to the pad 32P of the corresponding chip 30 via a bonding wire 91.

[0097] like Figure 3 and 6 As shown, each lower terminal 120 includes a first lower connecting portion 121 and a second lower connecting portion 122 extending along the y direction.

[0098] The end of the first lower connection portion 121 is connected to the pad 32P. The first lower connection portion 121 extends in the y-direction, thereby being spaced apart from the pad 32P. The second lower connection portion 122 is connected to the end of the first lower connection portion 121 on the side of the first lower connection portion 121 that is spaced apart from the pad 32P. The second lower connection portion 122 extends in the y-direction, thereby being spaced apart from the first lower connection portion 121.

[0099] The second lower connecting portion 122 includes a lower base 123 and a lower front end portion 124. Each of the lower base 123 and the lower front end portion 124 extends in the y-direction. The lower base 123 is connected to the end of the first lower connecting portion 121 on a side spaced apart from the connecting node connected to the bonding line 91. The lower front end portion 124 is connected to the end of the lower base 123 on a side spaced apart from the first lower connecting portion 121.

[0100] like Figure 6 As shown, the widths of the first lower connecting portion 121 and the lower base portion 123 are similar in the x-direction. The width of the lower front portion 124 in the x-direction is narrower than the widths of the first lower connecting portion 121 and the lower base portion 123 in the x-direction.

[0101] like Figure 3As shown, a portion of the lower terminal 120 is coated or covered by the covering resin 20. The remaining portion of the lower terminal 120 is exposed from the covering resin 20. Specifically, a portion of the first lower connecting portion 121 and the lower base portion 123 is coated or covered by the covering resin 20. The remaining portion of the lower front portion 124 and the lower base portion 123 is exposed from the covering resin 20.

[0102] In the following text, the lower terminal 120 coated or covered by the covering resin 20 is referred to as the lower covering portion 125. The lower terminal 120 exposed from the covering resin 20 is referred to as the lower exposed portion 126. Furthermore, the remaining portion of the lower base 123 exposed from the covering resin 20 included in the lower exposed portion 126 is referred to as the lower exposed base 123a. The lower covering portion 125 corresponds to the covering portion. The lower exposed portion 126 corresponds to the exposed portion.

[0103] exist Figure 6 In the middle, the boundary line BL4 between the lower covering portion 125 and the lower exposed portion 126 is represented by a dashed line. Figure 7 In the middle, the boundary line BL5 between the first lower connecting part 121 and the second lower connecting part 122, and the boundary line BL6 between the lower exposed base part 123a and the lower front end part 124 are respectively represented by dashed lines.

[0104] (First upper connecting part and first lower connecting part)

[0105] like Figure 7 As shown, the first upper connecting portions 111 are aligned and spaced apart from each other in the x-direction. The first lower connecting portions 121 are aligned and spaced apart from each other in the x-direction. Regarding the arrangement of the first upper connecting portions 111 and the first lower connecting portions 121, the first upper connecting portions 111 and the first lower connecting portions 121 are alternately aligned and spaced apart in the x-direction. Figure 2 In the middle, the simplified diagram shows the route along... Figure 8 The cross section of line VII-VII is shown.

[0106] (Upper exposed base and lower exposed base)

[0107] like Figure 8 As shown, each upper exposed base 114a is closer to the second main surface 20b than each lower exposed base 123a. In other words, each lower exposed base 123a is closer to the first main surface 20a than each upper exposed base 114a. Each lower exposed base 123a is arranged in the x-direction between adjacent upper exposed bases 114a.

[0108] With regard to the arrangement of the upper exposed base 114a and the lower exposed base 123a, the upper exposed base 114a and the lower exposed base 123a are alternately aligned apart from each other in the x direction and the z direction. The upper exposed base 114a and the lower exposed base 123a are zigzagged and alternately arranged from the first main surface 20a and the second main surface 20b. In Figure 2 In Figure 7 In

[0109] (Spacing distance between upper and lower terminals)

[0110] As described above, the first upper connecting portion 111 and the first lower connecting portion 121 are alternately aligned apart from each other in the x direction. The upper exposed base 114a and the lower exposed base 123a are alternately aligned apart from each other in the x direction and the z direction.

[0111] Figure 8 The first spacing distance "a" between the first upper connecting portion 111 and the first lower connecting portion 121 closest to each other shown is smaller than the second spacing distance "b" between the upper exposed base 114a and the lower exposed base 123a closest to each other shown in Figure 8

[0112] The first spacing distance "a" between the first upper connecting portion 111 and the first lower connecting portion 121 closest to each other corresponds to the shortest spacing distance between the upper cover portion 116 and the lower cover portion 125 closest to each other. The second spacing distance "b" between the upper exposed base 114a and the lower exposed base 123a closest to each other corresponds to the shortest spacing distance between the upper exposed portion 117 and the lower exposed portion 126 closest to each other.

[0113] Although not shown, the first spacing distance "a" is smaller than the spacing distance between the upper front end portion 115 and the lower front end portion 124 closest to each other.

[0114] The cover resin 20 has higher insulating properties than air. Even if the first spacing distance "a" is smaller than the second spacing distance "b", it is easy to maintain insulation between the first upper connecting portion 111 and the first lower connecting portion 121 closest to each other. The upper terminal 110 and the lower terminal 120 can be aligned so that the first spacing distance "a" is shorter than the second spacing distance "b". It is no longer necessary to make the first spacing distance "a" and the second spacing distance "b" equal so that the first spacing distance "a" matches the second spacing distance "b".

[0115] (Groove)

[0116] As Figure 8 and 9 ​As shown, a recessed groove 21 along the z-direction is formed at the exposed surface 20c of the covering resin 20, wherein each of the upper exposed base 114a and the lower exposed base 123a is exposed at the aforementioned exposed surface. Figure 9 As shown, a recess 21 is formed at the exposed surface 20c, thereby being located between adjacent terminals. Figure 8 In the middle, the simplified diagram shows the route along... Figure 8 The cross-section of the IX-IX line is shown. The groove 21 corresponds to the rough portion, uneven portion, or groove.

[0117] like Figure 9 As shown, the groove 21 is formed between the upper exposed base 114a and the lower exposed base 123a that are closest to each other. Furthermore, the groove 21 is formed between the two upper exposed bases 114a that are closest to each other. Furthermore, the groove 21 is formed between the two lower exposed bases 123a that are closest to each other.

[0118] like Figure 10 As shown, the recess 21 includes a first wall surface 21a, a second wall surface 21b, and a third wall surface 21c. The first wall surface 21a and the second wall surface 21b are aligned and spaced apart from each other in a direction that aligns two adjacent terminals. The third wall surface 21c is located on a side spaced apart from the exposed surface 20c. The third wall surface 21c connects the first wall surface 21a and the second wall surface 21b.

[0119] Therefore, the creepage distance along the exposed surface 20c between two adjacent terminals increases. Specifically, the creepage distance along the exposed surface 20c between the two closest upper exposed bases 114a and lower exposed bases 123a increases. The creepage distance along the exposed surface 20c between the two closest upper exposed bases 114a increases. The creepage distance along the exposed surface 20c between the two closest lower exposed bases 123a increases.

[0120] (Operation and beneficial effects)

[0121] As described above, the first upper connecting portion 111 and the first lower connecting portion 121, which are coated or covered by the covering resin 20, are alternately aligned and spaced apart from each other in the x-direction. The upper exposed base portion 114a and the lower exposed base portion 123a exposed from the covering resin 20 are alternately aligned and spaced apart from each other in the x-direction.

[0122] As described above, the first spacing distance "a" between the first upper connecting portion 111 and the first lower connecting portion 121, which are closest to each other, is smaller than the second spacing distance "b" between the upper exposed base portion 114a and the lower exposed base portion 123a, which are closest to each other. Therefore, it is easy to suppress the increase in the physical size of the covering resin 20 in the x-direction. As a result, the electrical device 15 can be miniaturized.

[0123] As described above, the second upper connecting portion 112 extending in each of the y direction and the z direction is covered or coated with the covering resin 20. The covering resin 20 has higher insulating properties than air. Thus, it is easy to suppress discharge at the second upper connecting portion 112. Further, it is easy to suppress damage to the second upper connecting portion 112, for example, due to external force.

[0124] As described above, the recessed portion 21 is formed at the exposed surface 20c between the adjacent terminals. Thus, the creepage distance along the exposed surface 20c between the two adjacent terminals becomes longer. Thus, the insulating properties between the two adjacent terminals tend to be enhanced.

[0125] (First Modification)

[0126] In the embodiment described above, the recessed portion 21 is formed at the exposed surface 20c between the adjacent terminals. However, the recess 21 can not be formed at the exposed surface 20c. As Figure 11 indicated, a protruding portion 22 can be formed protruding from the exposed surface 20c. In this case, the protruding portion 22 includes a first protruding surface 22a, a second protruding surface 22b, and a third protruding surface 22c. The first protruding surface 22a and the second protruding surface 22b are aligned apart from each other in a direction in which the two adjacent terminals align. The third protruding surface 22c is located at a side spaced apart from the exposed surface 20c. The third protruding surface 22c connects the first protruding surface 22a and the second protruding surface 22b. Thus, the creepage distance along the exposed surface 20c between the two adjacent terminals becomes longer. The insulating properties between the two adjacent terminals tend to be enhanced. The protruding portion 22 corresponds to a rough portion, an uneven portion, or a protrusion.

[0127] (Second Modification)

[0128] The above-described embodiment describes that the respective shapes of the upper terminals 110 and the lower terminals 120 are similar. However, as Figure 12 indicated, the respective lengths of the upper terminals 110 can be different. The respective lengths of the lower terminals 120 can be different. The respective lengths of all the terminals including the upper terminals 110 and the lower terminals 120 can be different.

[0129] As Figure 13 indicated, the length of the lower terminal 120 in the y direction can be shorter than the length of the upper terminal 110 in the y direction. Although not indicated, the length of the upper terminal 110 in the y direction can be shorter than the length of the lower terminal 120 in the y direction.

[0130] (Third Modification)

[0131] The above embodiment describes the upper exposed base 114a and the lower exposed base 123a arranged in a zigzag pattern at the first main surface 20a and the second main surface 20b. However, if the first interval distance "a" is shorter than the second interval distance "b", the upper exposed base 114a and the lower exposed base 123a may not be aligned in a zigzag pattern. For example, as Figure 14 As shown, the upper exposed base 114a and the lower exposed base 123a can be aligned in three levels in the z direction.

[0132] (Fourth revision)

[0133] As described above, the first upper connecting portion 111 and the first lower connecting portion 121 are alternately aligned and spaced apart from each other in the x-direction. However, when the first interval distance "a" is less than the second interval distance "b", such as ​ As shown, the first upper connecting portion 111 and the first lower connecting portion 121 can be aligned in the x and z directions. Even in this case, it is easy to suppress the increase in the physical size of the covering resin 20. This allows for the miniaturization of the electrical device 15.

Claims

1. An electrical device, comprising: Semiconductor components; A plurality of conductors, each configured to be connected to the semiconductor element, at least one of the plurality of conductors extending in a first direction; and A covering resin configured to cover a portion of the semiconductor element and each of the plurality of conductors. The plurality of conductors each include a covered portion and an exposed portion. Each of the aforementioned covering portions is covered by the covering resin. Each of the exposed portions is exposed from the covering resin. The conductor is aligned in a second direction different from the first direction. Among them, the two closest exposed portions are spaced apart in each of the second and third directions. Wherein, the third direction is perpendicular to the first direction and the second direction, and Wherein, the shortest interval between the two closest members in the covered portion is less than the shortest interval between the two closest members in the exposed portion. At least one of the covered portions includes a curved portion that bends upwards from the third party, the curved portion separating the exposed portions of the conductor, and The exposed portion of the conductor extends in a straight line in the first direction.

2. The electrical equipment according to claim 1, in, The covering resin has an exposed surface, and the exposed portion is exposed from the covering resin at the exposed surface. The exposed surface of the covering resin has an uneven portion disposed between two adjacent exposed portions.

Images