An OLED display module and an electronic device

Abstract

The present disclosure provides an OLED display module and an electronic device, the display module comprising: a sensor layer; a control layer; a panel layer located between the sensor layer and the control layer; a chip-on-chip film, wherein a first end of the chip-on-chip film is connected to the panel layer, a second end of the chip-on-chip film is connected to the control layer, and a first bend is provided between the first and second ends of the chip-on-chip film; and an electromagnetic shielding layer, wherein a first end of the electromagnetic shielding layer is connected to the sensor layer, a second end of the electromagnetic shielding layer covers the second end of the chip-on-chip film, a second bend is provided between the first and second ends of the electromagnetic shielding layer, and the second bend covers the first bend. The present disclosure adds an electromagnetic shielding layer to the OLED display module structure, thereby covering the chip-on-chip film without affecting the original hierarchical structure of the OLED display module, thereby preventing the chip-on-chip from being interfered with by external electromagnetic signals and ensuring the normal display effect of the OLED display module.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to an OLED display module and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) display devices have the characteristics of high contrast, high brightness, bright colors and flexibility, and are widely used in many fields.

[0003] However, using an OLED screen in a complex electromagnetic environment will cause interference to its signal. For example, when the screen's driver IC is driving the screen display, external interference signals flow into the IC end through the exposed chip-on-film (COF), increasing the noise output by the IC end and causing display failures such as jitter, black screen, and screen distortion on the OLED screen, affecting the normal use of the OLED screen. Summary of the Invention

[0004] The purpose of the embodiments of the present disclosure is to provide an OLED display module and an electronic device to solve the problem in the prior art that OLED screens are prone to display failures when used in complex electromagnetic environments.

[0005] The embodiments of the present disclosure adopt the following technical solution: an OLED display module, comprising: a sensor layer; a control layer; a panel layer located between the sensor layer and the control layer; a chip-on-chip film, wherein the first end of the chip-on-chip film is connected to the panel layer, the second end of the chip-on-chip film is connected to the control layer, and a first bending portion is provided between the first end and the second end of the chip-on-chip film; an electromagnetic shielding layer, wherein the first end of the electromagnetic shielding layer is connected to the sensor layer, the second end of the electromagnetic shielding layer covers the second end of the chip-on-chip film, and a second bending portion is provided between the first end and the second end of the electromagnetic shielding layer, and the second bending portion covers the first bending portion.

[0006] In some embodiments, there is a first overlapping area between the first end of the electromagnetic shielding layer and the sensor layer. When the chip-on-chip film and the electromagnetic shielding layer are not bent, the size of the electromagnetic shielding layer in the first direction is larger than the size of the chip-on-chip film in the first direction, and the size of the electromagnetic shielding layer in the second direction is larger than the size of the chip-on-chip film in the second direction; wherein the first direction is a direction perpendicular to the long side of the first overlapping area, and the second direction is a direction perpendicular to the first direction.

[0007] In some embodiments, the electromagnetic shielding layer includes at least a first edge and a second edge in the first direction, the spacing between the first edge of the electromagnetic shielding layer and the third edge of the chip-on-film is between 4 and 5 mm, and the spacing between the second edge of the electromagnetic shielding layer and the fourth edge of the chip-on-film is between 4 and 5 mm; wherein, the third edge is the edge of the chip-on-film that is closest to the first edge in the first direction, and the fourth edge is the edge of the chip-on-film that is closest to the second edge in the first direction.

[0008] In some embodiments, the method further includes: a flexible circuit board, wherein the flexible circuit board is used to connect the sensor layer and the control layer, and the flexible circuit board at least includes an electromagnetic shielding film, and the electromagnetic shielding film is reused as the electromagnetic shielding layer.

[0009] In some embodiments, the first end of the electromagnetic shielding layer is divided into at least one binding area and at least one virtual area; the binding area is connected to the input area of the sensor layer through a conductive glue, wherein the input area is located in the first overlapping area, and the virtual area is fixedly connected to other areas in the first overlapping area except the input area.

[0010] In some embodiments, the electromagnetic shielding layer is an electromagnetic shielding tape, and the display module also includes a protective layer arranged on the side of the sensor layer away from the panel layer; the first end of the electromagnetic shielding tape is located between the protective layer and the sensor layer, and the first end of the electromagnetic shielding tape is adhered to the surface of the protective layer or the surface of the sensor layer.

[0011] In some embodiments, it also includes: a flexible circuit board, which is used to connect the sensor layer and the control layer; when the flexible circuit board and the electromagnetic shielding layer are not bent, the maximum dimension of the electromagnetic shielding layer in the first direction is less than 1 / 3 of the maximum dimension of the flexible circuit board in the first direction.

[0012] In some embodiments, a through hole is provided on the electromagnetic shielding layer, and a position of the through hole corresponds to a distance between two adjacent chip-on-films.

[0013] In some embodiments, each of the through holes has the same distance from two adjacent chip-on-films to the through hole.

[0014] The embodiment of the present disclosure further provides an electronic device, which at least includes the above-mentioned OLED display module.

[0015] The beneficial effect of the embodiment of the present disclosure is that by adding an electromagnetic shielding layer to the OLED display module structure, the chip-on-chip film can be covered without affecting the original hierarchical structure of the OLED display module, thereby preventing it from being interfered with by external electromagnetic signals and ensuring the normal display effect of the OLED display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 This is a first front view of the OLED display module in the first embodiment of the present disclosure;

[0018] Figure 2 This is a first side view of the OLED display module in the first embodiment of the present disclosure;

[0019] Figure 3 This is a second front view of the OLED display module in the first embodiment of the present disclosure;

[0020] Figure 4 This is a second side view of the OLED display module in the first embodiment of the present disclosure;

[0021] Figure 5 FIG. 1 is a schematic diagram of an electronic device in a second embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] Various aspects and features of the present disclosure are described herein with reference to the accompanying drawings.

[0023] It should be understood that various modifications may be made to the embodiments disclosed herein. Therefore, the above description should not be considered as limiting, but merely as an example of an embodiment. Other modifications within the scope and spirit of the present disclosure will occur to those skilled in the art.

[0024] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the general description of the present disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure.

[0025] These and other characteristics of the present disclosure will become apparent from the following description of a preferred form of embodiment given as a non-limiting example with reference to the accompanying drawings.

[0026] It should also be understood that although the present disclosure has been described with reference to certain specific examples, those skilled in the art will be able to realize many other equivalent forms of the present disclosure that have the features of the claims and are therefore within the scope of protection defined thereby.

[0027] The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0028] Specific embodiments of the present disclosure will be described hereinafter with reference to the accompanying drawings; however, it should be understood that the claimed embodiments are merely examples of the present disclosure, which may be implemented in a variety of ways. Well-known and / or repetitive functions and structures are not described in detail to avoid obscuring the present disclosure with unnecessary or redundant detail. Therefore, the specific structural and functional details claimed herein are not intended to be limiting, but rather serve merely as a basis and representative basis for teaching those skilled in the art to variously employ the present disclosure with substantially any suitable detailed structure.

[0029] This description may use the phrases "in one embodiment," "in another embodiment," "in a further embodiment," or "in other embodiments," each of which may refer to one or more of the same or different embodiments according to the present disclosure.

[0030] Organic Light Emitting Diode (OLED) displays, with their high contrast, high brightness, vibrant colors, and flexibility, have broad applications across a wide range of fields. For example, using OLED screens as a vehicle's central control display or instrument panel can achieve superior display quality and a more optimized user experience. OLED's flexibility also allows for a wider range of form factors, allowing automotive display designs to be applied in a wider range of scenarios and enhancing the driver's experience.

[0031] However, in complex electromagnetic environments, the signals of the OLED screen will be interfered with, affecting the normal use of the OLED screen. For example, when the OLED screen is used in a vehicle, the electromagnetic signals in the vehicle environment are relatively complex. The generation of various control signals during the driving process of the vehicle will interfere with the signals of the OLED display screen, causing the display screen that displays vehicle control signals, vehicle faults, vehicle driving status, etc. to be interfered with, making it impossible for users to understand the vehicle status in a timely and accurate manner, and seriously causing safety accidents. The fundamental reason for this is that the driver IC in the screen is seriously interfered with by external electromagnetic signals when providing display signals to the screen. The external interference signal will flow into the driver IC along with the COF in the display module, increasing the noise output by the driver IC, causing the OLED screen to experience display failures such as jitter, black screen, and flowery screen, affecting the normal use of the OLED screen.

[0032] In order to solve the above problems, the first embodiment of the present disclosure provides an OLED display module. Figure 1 shows a front view of the display module, Figure 2 Then Figure 1 The side view of the display module shown in FIG. Figure 1 and Figure 2 As shown, the display module mainly includes a sensor layer 20, a panel layer 30, and a control layer (not shown in the figure) which are arranged in sequence. Among them, the sensor layer 20 may include functional layers such as the touch layer of the display; the panel layer 30 is arranged between the sensor layer 20 and the control layer, which is mainly a display panel with an OLED unit for presenting images; the control layer mainly includes a driver IC for controlling the panel layer 30, and may also include a processing unit for processing the sensor signal fed back by the sensor layer 20, etc. For example, the control layer may be a printed circuit board provided with the aforementioned driver IC and processing unit; in this embodiment, the processing unit and the driver IC are represented by the control layer, and no distinction will be made later. In addition, as Figure 1 As shown, the OLED display module generally further includes a protective layer 10 disposed on the side of the sensor layer 20 away from the panel layer 30 for protecting the hierarchical structure within the OLED module. The protective layer 10 is generally made of glass or other hard transparent materials.

[0033] In this embodiment, the panel layer 30 and the control layer are mainly connected through a chip-on-film (COF) 40, wherein the first end of the chip-on-film 40 is bonded to the panel layer 30, and the second end of the chip-on-film 40 is bonded to the control layer, and a first bend is provided between the first and second ends of the chip-on-film 40. Specifically, the chip-on-film 40 has a certain number of signal lines, which are respectively connected to the signal lines in the panel layer 30 and the control layer to realize the transmission of the control signal output by the control layer, so that the panel layer 30 displays the image. In actual use, a display module usually has multiple chip-on-films 40, each of which is used to transmit signals for controlling different panel layer areas. Figure 1 The display module shown in FIG. 4 includes four chip-on-films 40 . When the size or requirements of the display module change, the number of chip-on-films 40 may be adjusted accordingly, and this embodiment does not impose any specific limitation.

[0034] Furthermore, the display module in this embodiment further includes an electromagnetic shielding film 50. Figure 1The electromagnetic shielding film 50 includes a first end, a second end and a second bending portion, wherein the first end of the electromagnetic shielding film 50 is fixedly connected to the sensor layer, and the second end thereof covers the second end of the chip-on-chip film 40 and is also connected to the control layer. The second bending portion is located between the first end and the second end of the electromagnetic shielding film 50. When the display module is prepared, the first bending portion is covered by the second bending portion, and then the electromagnetic shielding film 50 is used to prevent external electromagnetic signals from interfering with the chip-on-chip film 40, thereby shielding the external interference signal.

[0035] Specifically, during the preparation of the display module, the first end of the chip-on-chip film 40 is first connected to the panel layer 30, the first end of the electromagnetic shielding film 50 is connected to the sensor layer, and then the second end of the chip-on-chip film 40 is connected to the control layer, the second end of the electromagnetic shielding film 50 is covered on the second end of the chip-on-chip film 40, and then the control layer is bent to the side of the panel layer 30 away from the sensor layer 20, so that the connection area between the first end and the second end of the chip-on-chip film 40 and the connection area between the second end and the second end of the electromagnetic shielding film 50 are bent at the same time to form a first bending area and a second bending area, and according to the connection position of the electromagnetic shielding film 50, the second bending portion covers the first bending portion to achieve the function of shielding the interference signal.

[0036] It should be noted that there is a first overlapping area 21 (eg, Figure 1 The first overlapping area 21 is the area where the first end of the electromagnetic shielding layer 50 is fixedly connected to the edge of the sensor layer 20, and the width of the first overlapping area 21 is the attachment width between the first end of the electromagnetic shielding layer 50 and the sensor layer 20. The length of the first overlapping area 21 is usually the same as the length of the electromagnetic shielding layer 50. Figure 1 The figure also shows the dimensions between the chip-on-film 40 and the electromagnetic shielding layer 50 when the chip-on-film 40 and the electromagnetic shielding layer 50 are not bent. Specifically, in this embodiment, the first direction is defined as the direction perpendicular to the long side of the first overlap region 21 (i.e. Figure 1 The second direction is the direction perpendicular to the first direction (i.e. Figure 1 horizontal direction), by Figure 1 It can be seen that the size of the electromagnetic shielding layer 50 in the first direction is larger than the size of the chip-on-chip film in the first direction, and the size of the electromagnetic shielding layer 50 in the second direction is also larger than the size of the chip-on-chip film in the second direction. At this time, after the chip-on-chip film 40 and the electromagnetic shielding layer 50 are bent, the second bent portion with a larger size can cover the first bent portion, thereby isolating the external interference signal.

[0037] In some embodiments, the electromagnetic shielding layer 50 includes at least a first side and a second side in a first direction (eg, Figure 1 The electromagnetic shielding layer 50 has two sides (left and right sides in the vertical direction), the spacing between the first side of the electromagnetic shielding layer 50 and the third side of the chip-on-film 40 is between 4 and 5 mm, and the spacing between the second side and the fourth side of the chip-on-film 40 is also between 4 and 5 mm, so as to ensure that the second bend has a good shielding effect on the first bend. The third side of the chip-on-film 40 is the side of the chip-on-film 40 closest to the first side in the first direction, and the fourth side is the side of the chip-on-film 40 closest to the second side in the first direction. For example, Figure 1 In the figure, the left side of the electromagnetic shielding layer 50 in the vertical direction is the first side, and the right side is the second side. If there are four chip-on-films 40, the third side is the left side of the leftmost chip-on-film 40 among all the chip-on-films 40, and the fourth side is the right side of the rightmost chip-on-film 40 among all the chip-on-films. If there is only one chip-on-film 40, the third and fourth sides can be determined based on their positional relationship with the first and second sides. It should be noted that the dimensions, sizes, or shapes of the various layers shown in the figure are only used to illustrate the positional relationship between the layers and do not represent the specific dimensional relationship of the actual layers.

[0038] In actual production, the electromagnetic shielding layer 50 can be made using electromagnetic shielding tape (EMI tape), or the electromagnetic shielding film in a flexible circuit board can be reused as the electromagnetic shielding layer 50. The flexible circuit board (FPC) is mainly used to connect the sensor layer 20 and the control layer to achieve signal transmission between the sensor layer 20 and the control layer. In addition, when the electromagnetic shielding film of the FPC is used as the electromagnetic shielding layer 50, the first end of the electromagnetic shielding layer 50 is the first end of the FPC, and the second end of the electromagnetic shielding layer 50 is the second end of the FPC. In addition, it is necessary to ensure that the second end of the FPC is connected to the control layer to achieve signal transmission.

[0039] In actual implementation, considering the large size of the FPC, the pressure head portion corresponding to its first end is difficult to accurately correspond to the input area of the sensor layer 20, which can easily reduce the signal transmission effect. Therefore, in some embodiments, the first end of the FPC can be divided into at least one binding area 51 and at least one virtual (dummy) area 52, wherein the FPC pressure head corresponding to the binding area 51 can be bound and connected to the input area of the sensor layer 20 to meet the signal transmission accuracy, and the input area is located in the first overlapping area 21, so as to realize signal transmission while being connected to the sensor layer 20 at the first end; although the dummy area 52 also has a pressure head, the other areas of the corresponding first overlapping area 21 except the input area are not provided with pressure heads for sensor layer 20 signal access. Therefore, it is only necessary to ensure that the dummy area 52 is tightly connected to the other areas of the first overlapping area 21 except the input area.

[0040] Figure 1 The first end of the FPC shown in FIG is divided into three areas: the central area is the binding area 51, and the areas on both sides are dummy areas 52. When connecting the FPC to the sensor layer 20, the binding area 51 should be bound first to ensure effective signal transmission, and then the dummy areas 52 can be fixed. It should be noted that the specific number of binding areas 51 and dummy areas 52 is not limited in this embodiment and can be adjusted according to the size of the screen and the configuration of the input area of the sensor layer 20. This will not be discussed in detail here.

[0041] In some embodiments, the electromagnetic shielding layer 50 can be implemented using EMI tape composed of mylar glue and conductive cloth. Figure 3 and Figure 4 Shows the front view and side view of the display module when EMI tape is used as an electromagnetic shielding layer.

[0042] It should be noted that, for the display module, in order to realize the signal transmission between the sensor layer 20 and the control layer, an FPC ( Figure 3 (not shown) When the FPC is not required as an electromagnetic shielding layer, the size of the FPC can be directly set according to the size of the input area of the sensor layer to ensure stable signal transmission. In this case, due to the installation of the FPC, the EMI tape needs to be connected between the protective layer 10 and the sensor layer 20. It can be attached to the surface of the protective layer 10 or the surface of the sensor layer 20 according to actual conditions. It should be noted that when attaching the EMI tape to the surface of the sensor 20, the FPC should first be ensured to be bonded to the input area of the sensor layer 20. The first end of the EMI tape can be attached to the top of the FPC to further secure the FPC.

[0043] It should be noted that if Figure 4 As shown in FIG, after the display module is prepared, the bent portion of the FPC will cover the bent portion of the COF, and the electromagnetic shielding layer 50 needs to wrap the FPC and COF after being bent, and ensure that it fully covers the COF. Therefore, when the FPC and the electromagnetic shielding layer 50 are not bent, the electromagnetic shielding layer 50 in the first direction (i.e. Figure 1 The maximum dimension in the vertical direction needs to be less than 1 / 3 of the maximum dimension of the FPC in the same direction to avoid the EMI tape being too long after bending, which will affect the combination effect of the OLED display module and other components in the device.

[0044] Further, if Figure 4As shown, the protective layer 10 and the sensor layer 20 are fixedly connected by the optical adhesive OCA layer 11 to meet the reliability of the OLED display module. In order to avoid the electromagnetic shielding layer 50 and the protective layer 10 or the sensor layer 20 from having too small a bonding width, the OCA layer 11 can be retracted to ensure that the gap between the edge of the OCA layer 11 and the edge of the protective layer 10 or the sensor layer 20 meets the bonding of the electromagnetic shielding layer 50. Specifically, the OCA layer 11 is close to the fifth side (i.e., Figure 4 The lower side of the OCA layer 11) and the sixth side of the sensor layer 20 close to the EMI tape (i.e. Figure 4 The vertical distance between the lower edge of the sensor layer 20 is within a preset range, which can be set according to actual conditions, usually 2 to 6 mm, and it is necessary to ensure that the OCA layer 11 is in the state of being retracted toward the center of the OLED display module, that is, for Figure 3 For the display module shown, the orthographic projection of the sensor layer 20 can completely cover the orthographic projection of the OCA layer 11 , and the orthographic projection area of the OCA layer 11 is smaller than the orthographic projection area of the sensor layer 20 .

[0045] It should be understood that compared to the method of using EMI tape as the electromagnetic shielding layer 50, the method of using the electromagnetic shielding film of FPC as the electromagnetic shielding layer 50 will not add additional layers in the display module, nor will it affect the thickness of the display module, but the FPC production cost will increase. In actual use, it can be selected according to needs.

[0046] In some embodiments, especially for large-size OLED display modules, the electromagnetic shielding layer 50 with a long length may wrinkle when being fixed or bent, causing uneven stress distribution within the electromagnetic shielding layer 50 and causing it to fall off. In particular, when an electromagnetic shielding film of an FPC is used as the electromagnetic shielding layer 50, it may also cause the binding accuracy between the binding area and the input area to decrease, affecting the signal transmission effect. Therefore, in some embodiments, at least one through hole 53 can be provided on the electromagnetic shielding layer 50 to reduce the problem of uneven stress distribution within the electromagnetic shielding layer 50 and avoid wrinkles when bending. However, it is necessary to ensure that the position of the through hole 53 is located in the gap between any two adjacent COFs to avoid leakage of COF at the through hole position after the through hole 53 is opened, thereby affecting the shielding effect. Generally, the through hole 53 can be limited to be located in the middle of two adjacent COFs, that is, the distance between the through hole 53 and its two adjacent COFs is the same, to avoid the through hole 53 being closer to one of the COFs and causing a reduction in the electromagnetic shielding effect. During actual production, the number and specific positions of the through holes 53 can be adjusted according to factors such as the size of the OLED display module, the number of COFs, and the COF spacing, and this embodiment does not impose any specific restrictions.

[0047] It should be noted that when using the electromagnetic shielding film of the FPC as the electromagnetic shielding layer 50 and setting a through hole 53, it is necessary to ensure that the FPC has no wiring at the position where the through hole 53 is set to prevent the wiring passing through the binding area from being interrupted due to the through hole setting, thereby losing the signal transmission function.

[0048] This embodiment adds an electromagnetic shielding layer to the OLED display module structure to cover the flip chip film without affecting the original hierarchical structure of the OLED display module, thereby preventing it from being interfered with by external electromagnetic signals and ensuring the normal display effect of the OLED display module.

[0049] The second embodiment of the present disclosure provides an electronic device, the schematic diagram of which is as follows Figure 5 As shown, the electronic device includes the OLED display module provided by the first embodiment of the present disclosure, which provides strong electromagnetic signal shielding capabilities. This makes it suitable for environments with complex electromagnetic signals, particularly complex in-vehicle environments, ensuring accurate display effects and avoiding display failures. Furthermore, the electronic device may also include other components or elements to implement certain essential functions or other functions required by the user. For example, the electronic device may also include a power module, an audio module, and a communication module.

[0050] The above describes in detail multiple embodiments of the present disclosure, but the present disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications to the embodiments based on the concepts of the present disclosure, and these variations and modifications should all fall within the scope of protection claimed by the present disclosure.

Claims

1. An OLED display module, characterized in that: include: sensor layer; Control layer; a panel layer located between the sensor layer and the control layer; A chip-on-film (CFO), wherein a first end of the CFO is connected to the panel layer, a second end of the CFO is connected to the control layer, and a first bending portion is defined between the first end and the second end of the CFO; an electromagnetic shielding layer, wherein a first end of the electromagnetic shielding layer is connected to the sensor layer, a second end of the electromagnetic shielding layer covers the second end of the chip-on-film, a second bending portion is defined between the first end and the second end of the electromagnetic shielding layer, and the second bending portion covers the first bending portion; There is a first overlapping area between the first end of the electromagnetic shielding layer and the sensor layer; The first end of the electromagnetic shielding layer is divided into at least one binding area and at least one virtual area; The binding area is connected to the input area of the sensor layer through conductive glue, wherein the input area is located in the first overlapping area, and the virtual area is fixedly connected to other areas of the first overlapping area except the input area.

2. The OLED display module according to claim 1, wherein: When the chip-on-film and the electromagnetic shielding layer are not bent, the size of the electromagnetic shielding layer in the first direction is larger than the size of the chip-on-film in the first direction, and the size of the electromagnetic shielding layer in the second direction is larger than the size of the chip-on-film in the second direction; wherein, The first direction is a direction perpendicular to the long side of the first overlapping area, and the second direction is a direction perpendicular to the first direction.

3. The OLED display module according to claim 2, wherein: The electromagnetic shielding layer includes at least a first side and a second side in the first direction, a distance between the first side of the electromagnetic shielding layer and the third side of the chip-on-film is between 4 and 5 mm, and a distance between the second side of the electromagnetic shielding layer and the fourth side of the chip-on-film is between 4 and 5 mm; The third side is the side of the COF that is closest to the first side in the first direction, and the fourth side is the side of the COF that is closest to the second side in the first direction.

4. The OLED display module according to claim 2, wherein: Also includes: A flexible circuit board is used to connect the sensor layer and the control layer. The flexible circuit board at least includes an electromagnetic shielding film, and the electromagnetic shielding film is reused as the electromagnetic shielding layer.

5. The OLED display module according to claim 2, wherein: The electromagnetic shielding layer is an electromagnetic shielding tape, and the display module further comprises a protective layer arranged on a side of the sensor layer away from the panel layer; The first end of the electromagnetic shielding tape is located between the protective layer and the sensor layer, and the first end of the electromagnetic shielding tape is attached to the surface of the protective layer or the surface of the sensor layer.

6. The OLED display module according to claim 5, characterized in that: Also includes: a flexible circuit board, wherein the flexible circuit board is used to connect the sensor layer and the control layer; When the flexible circuit board and the electromagnetic shielding layer are not bent, the maximum dimension of the electromagnetic shielding layer in the first direction is less than 1 / 3 of the maximum dimension of the flexible circuit board in the first direction.

7. The OLED display module according to any one of claims 1 to 6, wherein: The electromagnetic shielding layer is provided with a through hole, and the position of the through hole corresponds to the interval between two adjacent chip-on-films.

8. The OLED display module according to claim 7, wherein: The distance between each through hole and two adjacent chip-on-films is the same.

9. An electronic device, characterized in that: At least comprising the OLED display module according to any one of claims 1 to 8.

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