Mask frame and deposition apparatus

Abstract

The present disclosure relates to a mask frame and a deposition apparatus. The mask frame comprises a support base comprising a plurality of inner side surfaces defining a first opening through the support base; a heat sink disposed on the plurality of inner side surfaces and a plurality of fixing portions disposed between the support base and the heat sink, each of the plurality of fixing portions comprising a plurality of adhesive portions attaching the support base to the heat sink and a plurality of second openings defined through the fixing portion adjacent to the plurality of adhesive portions.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0141198, filed on October 28, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0003] The inventive concept relates to a mask frame and a deposition apparatus including the mask frame. More particularly, the inventive concept relates to a mask frame including a heat dissipation plate and a deposition apparatus including the mask frame. BACKGROUND

[0004] A mask is used to manufacture a display device. The mask can include an opening defined through the mask, and a component of the display device is manufactured on a substrate through the opening. For example, when the display device includes a light emitting element, an organic material required to manufacture a light emitting layer of the light emitting element is deposited on the substrate through the opening of the mask. The mask can be disposed on a mask frame. Also, an organic material used to manufacture a color filter is deposited on the substrate through the opening of the mask.

[0005] When a deposition process is repeated, the mask frame can be deformed due to heat. When the mask frame is deformed, the organic material can not be deposited in a precise manner, which can result in errors in the manufacturing of the display device, such as a decrease in pixel position accuracy. SUMMARY

[0006] The inventive concept provides a mask frame that reduces or prevents deformation due to heat.

[0007] The inventive concept provides a deposition apparatus including a mask frame that reduces or prevents deformation due to heat.

[0008] According to an embodiment of the inventive concept, a mask frame includes a support base including a plurality of inner side surfaces defining a first opening through the support base, a heat dissipation plate disposed on the plurality of inner side surfaces, and a plurality of fixing portions disposed between the support base and the heat dissipation plate, each of the plurality of fixing portions including a plurality of adhesive portions attaching the support base to the heat dissipation plate and a plurality of second openings defined through the fixing portion adjacent to the plurality of adhesive portions.

[0009] In an embodiment, the plurality of fixing portions are disposed directly between the support base and the heat dissipation plate.

[0010] In an embodiment, the support base includes a plurality of first overlapping portions overlapping the fixing portions, and a plurality of first non-overlapping portions not overlapping the fixing portions. The heat spreader includes a plurality of second overlapping portions overlapping the fixing portions, and a plurality of second non-overlapping portions not overlapping the fixing portions.

[0011] In an embodiment, in a cross-section, a first lateral side edge of the first overlapping portion and a first lateral side edge of the second overlapping portion are substantially parallel to each other.

[0012] In an embodiment, the heat spreader and the support base are spaced apart from each other, with the fixing portions interposed between the heat spreader and the support base.

[0013] In an embodiment, the support base includes a first upper surface and a first lower surface spaced apart from the first upper surface in a first direction, the heat spreader includes a second upper surface and a second lower surface spaced apart from the second upper surface in the first direction, and a first height of the support base in a direction substantially perpendicular to the first upper surface and the first lower surface is the same as a second height of the heat spreader in a direction substantially perpendicular to the second upper surface and the second lower surface.

[0014] In an embodiment, the heat spreader includes a first surface adjacent to the support base and a second surface spaced apart from the first surface in a first direction and mirror-polished.

[0015] In an embodiment, the heat spreader includes a plurality of sub-heat spreaders; and each of the sub-heat spreaders is disposed on the inner side surface.

[0016] In an embodiment, the heat spreader has an emissivity equal to or less than about 0.25.

[0017] In an embodiment, the heat spreader includes at least one of silver (Ag), aluminum (Al), copper (Cu), chromium (Cr), and tin (Sn).

[0018] In an embodiment, each of the fixing portions has a thickness equal to or greater than about 0.05 mm and equal to or less than about 10 mm in a direction substantially perpendicular to the inner side surface of the support base and a side surface of the heat spreader facing the inner side surface of the support base.

[0019] In an embodiment, the support base includes an upper surface and a lower surface spaced apart from the upper surface in a first direction; and each of the plurality of inner side surfaces is inclined with respect to the upper surface and the lower surface.

[0020] In an embodiment, the support base includes invar steel.

[0021] In an embodiment, the plurality of fixing portions are provided in a number of three or more, and in a cross-section, the three or more fixing portions are spaced apart from each other.

[0022] In an embodiment, the support base and the fixing portions include a same metallic material as each other.

[0023] According to an embodiment of the inventive concept, a deposition apparatus includes a vacuum chamber, a deposition source disposed in the vacuum chamber, a mask frame disposed above the deposition source, and a mask disposed on the mask frame. The mask frame includes a support base including a plurality of inner side surfaces. The plurality of inner side surfaces define a first opening through the support base. A heat sink is disposed on the plurality of inner side surfaces. A plurality of fixing portions is disposed between the support base and the heat sink. Each of the plurality of fixing portions includes a plurality of adhesive portions attaching the support base to the heat sink and a plurality of second openings defined through the fixing portion adjacent to the plurality of adhesive portions.

[0024] In an embodiment, the heat sink includes at least one of Ag, Al, Cu, Cr, and Sn, and the heat sink has an emissivity equal to or less than about 0.25.

[0025] In an embodiment, the deposition apparatus further includes a magnet disposed on the mask.

[0026] According to an embodiment of the inventive concept, a mask frame includes a support base including a first opening defined through the support base, a heat sink disposed on the support base, and a plurality of fixing portions disposed directly between the support base and the heat sink, the heat sink and the support base being spaced apart from each other by the plurality of fixing portions to reduce heat transfer from the heat sink to the support base.

[0027] In an embodiment, the mask frame includes the heat sink disposed on the support base, and thus, the deformation caused by the heat is reduced.

[0028] In an embodiment, the deposition apparatus includes the mask frame in which the heat sink is disposed on the support base, and thus, deposition accuracy is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] The above and other aspects of the inventive concept will become apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is an exploded perspective view illustrating a mask assembly according to an embodiment of the inventive concept;

[0031] Figure 2 is a cross-sectional view taken along the line I-I’ of the mask frame according to an embodiment of the inventive concept; Figure 1

[0032] Figure 3 is an exploded perspective view illustrating a portion of a mask frame according to an embodiment of the inventive concept;

[0033] Figure 4 is an exploded perspective view illustrating a portion of a mask frame according to an embodiment of the inventive concept;

[0034] Figure 5 is a perspective view illustrating a portion of a mask frame according to an embodiment of the inventive concept;

[0035] Figure 6 is a cross-sectional view of a deposition apparatus according to an embodiment of the inventive concept;

[0036] Figure 7 is a magnified cross-sectional view of a region AA’ of the deposition apparatus according to an embodiment of the inventive concept; Figure 6

[0037] Figure 8 is a cross-sectional view illustrating a portion of a pixel of a color filter including a deposition apparatus according to an embodiment of the inventive concept; Figure 6

[0038] Figure 9A is an image illustrating a result of a thermal analysis with respect to a mask frame according to a comparative example; and

[0039] Figure 9B is an image illustrating a result of a thermal analysis with respect to a mask frame according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0040] The inventive concept can be variously modified and implemented in many different forms, and thus specific embodiments will be illustrated in the accompanying drawings and described in detail in the following detailed description. However, the inventive concept is not limited to the specific disclosed embodiments and the inventive concept includes all modifications, equivalents, or alternatives.

[0041] In the present disclosure, it will be understood that when an element or layer is referred to as being “on” another element or layer, “connected to” or “coupled to” another element or layer, it can be directly on the other element or layer, connected or coupled to the other element or layer, or intervening elements or layers can be present. When an element or layer is referred to as being “directly on” another element or layer, “directly connected to” or “directly coupled to” another element or layer, there can be no intervening elements or layers present. ​​​

[0042] Like numerals refer to like elements throughout. In the drawings, the thickness of components, proportions of sizes, and the like can be exaggerated for effectual description of the inventive concept.

[0043] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. For example, these terms can be merely used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the inventive concept. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0045] For ease of description, spatially relative terms such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for describing the relationship of one element or feature to another element (s) or feature (s) as shown in the drawings.

[0046] Unless otherwise defined, all terms used in disclosing elements, components, regions, layers and / or sections herein, such as technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this inventive concept belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0047] It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0048] Hereinafter, a mask frame and a deposition apparatus including the mask frame according to an embodiment of the inventive concept will be explained in detail with reference to the accompanying drawings.

[0049] Figure 1 is an exploded perspective view illustrating a mask assembly MAS according to an embodiment of the inventive concept. Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 is a cross-sectional view taken along line I-I' ofFigure 2 FIG. 1 is a perspective view showing a mask assembly according to an embodiment of the present inventive concept. Figure 1 FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1. Figure 1 FIG. 3 is a perspective view showing a portion of a mask frame according to an embodiment of the present inventive concept. Figure 3 FIG. 4 is a perspective view showing a portion of a mask frame according to an embodiment of the present inventive concept. Figure 4 FIG. 5 is an exploded perspective view showing a portion of a mask frame according to an embodiment of the present inventive concept. Figure 5 FIG. 6 is a perspective view showing a portion of a mask frame according to an embodiment of the present inventive concept.

[0050] FIG. 7 is a perspective view showing a portion of a mask frame according to an embodiment of the present inventive concept. Figure 1 Referring to FIG. 7, the mask assembly MAS can include a mask frame MF and a plurality of mask sticks MST disposed on the mask frame MF. The mask frame MF can include a support base SU, a heat spreader RH, and a plurality of fixed portions FP disposed between the support base SU and the heat spreader RH. The support base SU can include a first opening SU-OP passing through the support base SU defined by a plurality of inner side surfaces, such as a first inner side surface SU-F1 and a second inner side surface SU-F2. The heat spreader RH can be disposed on the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU.

[0051] The mask sticks MST can be disposed on the mask frame MF. A portion of the mask sticks MST extending longitudinally in a direction substantially parallel to the first direction axis DR1 (hereinafter, a "first direction") can be disposed to overlap the mask frame MF. The mask sticks MST can be supported by the mask frame MF. In the present disclosure, the mask sticks MST and the mask MST (refer to Figure 6 ) are assigned the same reference numerals, and the mask sticks MST are described as a representative example of the mask MST (refer to Figure 6 ). When a display device is manufactured, the mask MST can be used for a deposition process. However, embodiments of the present inventive concept are not limited thereto, and the shape, size, and form of the mask MST can vary.

[0052] In a plane defined by the first direction axis DR1 and the second direction axis DR2, the mask sticks MST can have a rectangular shape. As Figure 1As shown in the embodiment of FIG. 1, the second direction axis DR2 can intersect the first direction axis DR1, and the first direction axis DR1 and the second direction axis DR2 can each extend in parallel to a surface of the support substrate SU. The relatively shorter sides of the mask sticks MST having a rectangular shape in a plane can extend longitudinally in a direction substantially parallel to the second direction axis DR2 (hereinafter, a "second direction"), and the relatively longer sides of the mask sticks MST having a rectangular shape in a plane can extend in the first direction substantially parallel to the first direction axis DR1. The mask sticks MST can be arranged on the second direction axis DR2 to be spaced apart from each other. For example, the spacing between the mask sticks MST adjacent to each other among the mask sticks MST can be constant in the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto, and the arrangement, size, and shape of the mask sticks MST can vary.

[0053] Each of the mask sticks MST can include a plurality of third openings MST-OP defined through the mask stick MST. As shown in the embodiment of FIG. 1, the third openings MST-OP can be arranged in the first direction in one mask stick MST. In embodiments, the spacing between the third openings MST-OP adjacent to each other among the third openings MST-OP can be constant along the first direction. However, embodiments of the inventive concept are not limited thereto. Figure 1

[0054] The support substrate SU can be disposed under the mask sticks MST. For example, the support substrate SU can be disposed under the mask sticks MST in a direction substantially parallel to a third direction axis DR3 (hereinafter, a "third direction"), the third direction being perpendicular to the first direction and the second direction, and the third direction can be a thickness direction of the mask frame MF. The support substrate SU can include a metal material. For example, in embodiments, the support substrate SU can include invar. Invar can be an alloy of iron and nickel. However, embodiments of the inventive concept are not limited thereto.

[0055] As shown in the embodiment of FIG. 1, the second direction axis DR2 can intersect the first direction axis DR1, and the first direction axis DR1 and the second direction axis DR2 can each extend in parallel to a surface of the support substrate SU. The relatively shorter sides of the mask sticks MST having a rectangular shape in a plane can extend longitudinally in a direction substantially parallel to the second direction axis DR2 (hereinafter, a "second direction"), and the relatively longer sides of the mask sticks MST having a rectangular shape in a plane can extend in the first direction substantially parallel to the first direction axis DR1. The mask sticks MST can be arranged on the second direction axis DR2 to be spaced apart from each other. For example, the spacing between the mask sticks MST adjacent to each other among the mask sticks MST can be constant in the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto, and the arrangement, size, and shape of the mask sticks MST can vary. Figure 1 ​As shown in the embodiments, the support base SU may have a quadrilateral annular shape. The support base SU may include a first opening SU-OP extending through the support base SU, defined by a first inner surface SU-F1 and a second inner surface SU-F2. The first opening SU-OP may have a quadrilateral shape, and the first inner surface SU-F1 and the second inner surface SU-F2 of the support base SU may have shapes corresponding to the four sides of the quadrilateral shape. For example, the first opening SU-OP of the support base SU may have a rectangular shape. The first inner surface SU-F1 and the second inner surface SU-F2 may have shapes corresponding to the two relatively shorter sides and the two relatively longer sides forming the rectangular shape, respectively. For example, in an embodiment, the first inner surface SU-F1 may extend longitudinally in a first direction substantially parallel to the first direction axis DR1, and the second inner surface SU-F2 may extend longitudinally in a second direction substantially parallel to the second direction axis DR2. In an embodiment, when viewed in a plane defined by the first direction axis DR1 and the second direction axis DR2, the sum of the areas of the mask rods MST may be greater than the area of ​​the first opening SU-OP. When viewed in a plane defined by the first directional axis DR1 and the second directional axis DR2, the area of ​​the quadrilateral shape defined by the mask rod MST can be greater than the area of ​​the first opening SU-OP.

[0056] The supporting substrate SU may include a first upper surface SU-UF and a first lower surface SU-DF, wherein the first lower surface SU-DF extends upward from the first upper surface SU-UF along a third-direction axis DR3. For example... Figure 1 As shown in the embodiments, the first upper surface SU-UF and the first lower surface SU-DF can be substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. In the embodiments, the first inner surface SU-F1 and the second inner surface SU-F2 can be inclined relative to the first upper surface SU-UF and the first lower surface SU-DF. For example, the first inner surface SU-F1 and the second inner surface SU-F2 can be inclined relative to the plane defined by the first direction axis DR1 and the second direction axis DR2. In the embodiments, the first inner surface SU-F1 and the second inner surface SU-F2 and the first lower surface SU-DF can form an acute angle with respect to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, the embodiments of the inventive concept are not limited thereto, and the supporting substrate SU-a (refer to Figure 3 The first inner surface SU-F1a and the second inner surface SU-F2a (reference) Figure 3 It can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0057] The fixed part FP can be set on the supporting base SU. For example, asFigure 1 As shown in the embodiment of FIG. 1, the fixing portions FP can be disposed directly on the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU. The fixing portions FP can fix the heat spreader RH to the support base SU. For example, the fixing portions FP can fix the heat spreader RH to the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU. In an embodiment, the fixing portions FP can include the same metal material as the metal material of the support base SU. For example, the fixing portions FP can include invar.

[0058] As shown in the embodiment of FIG. 1, the fixing portions FP can be disposed directly on the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU. The fixing portions FP can fix the heat spreader RH to the support base SU. For example, the fixing portions FP can fix the heat spreader RH to the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU. In an embodiment, the fixing portions FP can include the same metal material as the metal material of the support base SU. For example, the fixing portions FP can include invar. Figure 1 As shown in the embodiment of FIG. 1, the fixing portions FP can be spaced apart from each other. For example, the fixing portions FP can be disposed on the first inner side surface SU-F1 and the second inner side surface SU-F2 and can be spaced apart from each other at regular intervals. In an embodiment, the fixing portions FP can be disposed on the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU and can be spaced apart from each other at regular intervals. Figure 1 In an embodiment, three fixing portions FP are disposed on each of the first inner side surface SU-F1 and the second inner side surface SU-F2. However, embodiments of the inventive concept are not limited thereto, and the number of the fixing portions FP can vary and the intervals of the fixing portions FP can vary. For example, in an embodiment, in the mask frame MF, the number of the fixing portions FP disposed on one inner side surface can be four or more. In an embodiment, the four or more fixing portions FP can be spaced apart from each other at regular intervals.

[0059] The fixing portions FP can be disposed directly between the support base SU and the heat spreader RH. For example, the upper surface and the lower surface of the fixing portions FP can be in direct contact with the support base SU and the heat spreader RH, respectively. In an embodiment, the portions of the fixing portions FP that are in direct contact with the support base SU and the heat spreader RH can be one of the adhesive portions AP1, AP2, …, and AP n (see Figure 5 ).

[0060] The support base SU and the heat spreader RH can be spaced apart from each other with the fixing portions FP interposed therebetween. The heat spreader RH can be disposed on the fixing portions FP. For example, the heat spreader RH can be disposed directly on the fixing portions FP. The heat spreader RH can be disposed to correspond to the first inner side surface SU-F1 and the second inner side surface SU-F2 of the support base SU. For example, the heat spreader RH can completely cover the first inner side surface SU-F1 and the second inner side surface SU-F2.

[0061] The heat spreader RH can be inclined with respect to a plane defined by the first direction axis DR1 and the second direction axis DR2. For example, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be inclined with respect to a plane defined by the first direction axis DR1 and the second direction axis DR2. As shown in the embodiment of FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be inclined with respect to a plane defined by the first direction axis DR1 and the second direction axis DR2.Figure 1 In the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto.

[0062] For example, in the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto. Figure 3 and Figure 4 In the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto. Figure 1 In the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto. Figure 3 In the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto. Figure 4 In the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto. Figure 1 Figure 3 and Figure 4 In the embodiment shown in FIG. 1, the first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. The first side surface RH-D1 and the second side surface RH-D2 of the heat spreader RH can be disposed between the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH. The second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can be spaced apart from each other in a third direction in which the third direction axis DR3 extends. In the embodiment, the second upper surface RH-UF of the heat spreader RH and the second lower surface RH-DF of the heat spreader RH can extend substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. However, embodiments of the inventive concept are not limited thereto.

[0063] ​In embodiments of the present invention, the second height RH-H2 of the heat sink RH can be substantially the same as the first height SU-H1 of the supporting base SU. The first height SU-H1 of the supporting base SU can be measured in a direction substantially perpendicular to the first upper surface SU-UF and the first lower surface SU-DF. The second height RH-H2 of the heat sink RH can be measured in a direction substantially perpendicular to the second upper surface RH-UF and the second lower surface RH-DF of the heat sink RH. The second height RH-H2 of the heat sink RH and the first height SU-H1 of the supporting base SU can be measured in a direction substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2. For example, the second height RH-H2 of the heat sink RH and the first height SU-H1 of the supporting base SU can be lengths in a third direction substantially parallel to the third direction axis DR3.

[0064] The heat sink RH may comprise a metallic material. For example, in an embodiment, the heat sink RH may comprise at least one of Ag, Al, Cu, Cr, and Sn. In an embodiment, the heat sink RH may have an emissivity less than or equal to about 0.25. In an embodiment, the emissivity of the heat sink RH may be less than the emissivity of stainless steel. In an embodiment, the stainless steel may comprise a vacuum chamber CB (reference) in which a vacuum chamber is mounted. Figure 6 ) deposition equipment EV (reference) Figure 6 In this example, the emissivity of the heat sink RH can be less than or equal to approximately 0.20. However, embodiments of the present invention are not limited thereto, and the emissivity of the heat sink RH can vary.

[0065] Objects with high emissivity can have high energy absorptivity and low energy reflectivity. Objects with low emissivity can have low energy absorptivity and high energy reflectivity. In embodiments where the heat sink RH has a relatively low emissivity of less than or equal to about 0.25, energy absorptivity can be reduced and energy reflectivity can be increased.

[0066] Figure 2 The assembly is shown Figure 1 The support base SU, the fixing part FP, and the heat sink RH correspond to the portion following line I-I'. When assembling the support base SU, the fixing part FP, and the heat sink RH, the fixing part FP can be positioned between the inner surfaces SU-F1 and SU-F2 of the support base and the first side surface RH-D1 of the heat sink. Along Figure 1 The cross-sectional view taken by line I-I' can be parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. Figure 2 It is along Figure 1 An enlarged view of the cross-section taken by line I-I'.

[0067] As described above, the heat spreader RH and the support base SU can be spaced apart from each other by the fixing portions FP. In an embodiment, each of the fixing portions FP can have a thickness T0 (refer to Figure 2 ) in a range of about 0.05 mm to about 10 mm. For example, the thickness T0 (refer to Figure 2 ) of each of the fixing portions FP can be in a range of about 0.1 mm to about 10 mm. As shown in an embodiment, Figure 2 , the thickness T0 of each of the fixing portions FP can be measured in a direction substantially perpendicular to a third surface SU-F3 of the support base SU and a third surface RH-F3 of the heat spreader RH. In an embodiment, the third surface SU-F3 of the support base SU can be one of a first inner side surface SU-F1 and a second inner side surface SU-F2 (refer to Figure 1 ) of the support base SU. The third surface RH-F3 of the heat spreader RH can be a first side surface RH-D1 (refer to Figure 1 ) of the heat spreader RH facing the support base SU.

[0068] The third surface SU-F3 of the support base SU and the third surface RH-F3 of the heat spreader RH can face each other. When the thickness of the fixing portions FP is in the above-described thickness range, the heat spreader RH can be spaced apart from the support base SU, and heat transfer from the heat spreader RH to the support base SU can be reduced or prevented. Accordingly, deformation of the support base SU due to heat can be reduced or prevented.

[0069] Figure 2 A structure in which three fixing portions FP are spaced apart from each other in a cross-section is illustrated. As shown in an embodiment, Figure 2 , among the three fixing portions FP, two fixing portions FP can be respectively disposed adjacent to a first lateral side and an opposite second lateral side of the support base SU, and a remaining one of the three fixing portions FP can be disposed spaced apart from the two fixing portions FP at regular intervals. In an embodiment, the first lateral side and the opposite second lateral side of the support base SU can extend in a first direction substantially parallel to a first direction axis DR1, and the first lateral side and the opposite second lateral side of the support base SU can be spaced apart from each other in a second direction substantially parallel to a second direction axis DR2.

[0070] As shown in an embodiment, Figure 2As shown in the embodiments of FIGS. 1A and 1B, the support substrate SU can include a plurality of first overlapping portions P1 overlapping the fixed portion FP and a plurality of first non-overlapping portions NP1 not overlapping the fixed portion FP. The first overlapping portions P1 can be alternately arranged with the first non-overlapping portions NP1. The heat spreader RH can include a plurality of second overlapping portions P2 overlapping the fixed portion FP and a plurality of second non-overlapping portions NP2 not overlapping the fixed portion FP. The second overlapping portions P2 can be alternately arranged with the second non-overlapping portions NP2. When viewed in cross-section, the lateral side edges of the first overlapping portions P1 and the lateral side edges of the second overlapping portions P2 can be substantially parallel to each other. The lateral side edges of the first overlapping portions P1 and the lateral side edges of the second overlapping portions P2 can be substantially parallel to the lines L1 and L2 shown in FIGS. 1A and 1B. For example, in FIGS. 1A and 1B, the lines L1 and L2 represent imaginary lines extending from the first lateral side edge of the first overlapping portion P1 and the opposite second lateral side edge of the first overlapping portion P1, respectively. In addition, the lines L1 and L2 can be imaginary lines extending from the first lateral side edge of the second overlapping portion P2 and the opposite second lateral side edge of the second overlapping portion P2, respectively. Figure 2 As shown in FIGS. 1A and 1B, the lines L1 and L2 represent imaginary lines extending from the first lateral side edge of the first overlapping portion P1 and the opposite second lateral side edge of the first overlapping portion P1, respectively. In addition, the lines L1 and L2 can be imaginary lines extending from the first lateral side edge of the second overlapping portion P2 and the opposite second lateral side edge of the second overlapping portion P2, respectively. Figure 2 As shown in FIGS. 1A and 1B, the lines L1 and L2 represent imaginary lines extending from the first lateral side edge of the first overlapping portion P1 and the opposite second lateral side edge of the first overlapping portion P1, respectively. In addition, the lines L1 and L2 can be imaginary lines extending from the first lateral side edge of the second overlapping portion P2 and the opposite second lateral side edge of the second overlapping portion P2, respectively.

[0071] Figure 3 Figure 4 are perspective views showing a portion of the mask frame MF according to embodiments of the inventive concept. In Figure 3 Figure 4 In FIGS. 1A and 1B, the fixed portion FP is omitted for ease of explanation, and the support substrate SU-a and the heat spreaders RH-a and RH-b are shown. Reference is made to the description of the fixed portion FP described with reference to Figure 1 Figure 2 The description of the fixed portion FP described with reference to the embodiments of FIGS. 1A and 1B can apply to the fixed portion in Figure 3 Figure 4 and will be omitted for ease of explanation.

[0072] Unlike Figure 1 , in Figure 3 Figure 4 ​​​​​In embodiments, the first inner side surface SU-F1a and the second inner side surface SU-F2a of the support substrate SU-a are shown as being substantially perpendicular to the first upper surface SU-UFa and the first lower surface SU-DFa of the support substrate SU-a. The first inner side surface SU-F1a and the second inner side surface SU-F2a of the support substrate SU-a can be non-inclined with respect to the first upper surface SU-UFa and the first lower surface SU-DFa of the support substrate SU-a. For example, the first inner side surface SU-F1a and the second inner side surface SU-F2a can be substantially perpendicular to the first upper surface SU-UFa and the first lower surface SU-DFa, and the first side surface RH-F1a and the second side surface RH-F2a of the heat spreader RH-a and the side surfaces of the heat spreader RH-b can be substantially perpendicular to the first upper surface SU-UFa and the first lower surface SU-DFa of the support substrate SU-a. In embodiments, the first inner side surface SU-F1a and the second inner side surface SU-F2a of the support substrate SU-a and the first side surface RH-F1a and the second side surface RH-F2a of the heat spreader RH-a and the side surfaces of the heat spreader RH-b can extend in a third direction substantially parallel to the third directional axis DR3.

[0073] As shown in embodiments of the present inventive concept, Figure 3 As shown in embodiments of the present inventive concept, the heat spreader RH-a can include a plurality of sub-heat spreaders, such as a first sub-heat spreader RH-S1, a second sub-heat spreader RH-S2, a third sub-heat spreader RH-S3, and a fourth sub-heat spreader RH-S4. The first sub-heat spreader RH-S1, the second sub-heat spreader RH-S2, the third sub-heat spreader RH-S3, and the fourth sub-heat spreader RH-S4 can be disposed on the first inner side surface SU-F1a and the second inner side surface SU-F2a of the support substrate SU-a, respectively. One sub-heat spreader can be disposed on one inner side surface. In embodiments, each of the sub-heat spreaders can be spaced apart from each other. However, embodiments of the present inventive concept are not limited thereto.

[0074] For example, as shown in embodiments of the present inventive concept, Figure 4 As shown in embodiments of the present inventive concept, the heat spreader RH-b can have an overall shape corresponding to the first inner side surface SU-F1a and the second inner side surface SU-F2a of the support substrate SU-a. Figure 4 The heat spreader RH-b having side surfaces extending in a third direction substantially parallel to the third directional axis DR3 is shown. For example, Figure 4 The heat spreader RH-b shown in embodiments of the present inventive concept can not include an inclined surface. In embodiments in which the first inner side surface SU-F1a and the second inner side surface SU-F2a of the support substrate SU-a are substantially perpendicular to the first upper surface SU-UFa and the first lower surface SU-DFa of the support substrate SU-a, the heat spreader RH-b can not include an inclined surface.

[0075] Figure 5 is a perspective view showing a fixing portion FP according to an embodiment of the inventive concept. The fixing portion FP can include adhesive portions AP1, AP2, …, and AP n In an embodiment, the adhesive portions AP1, AP2, …, and AP n may be portions welded by a laser beam. The support substrate SU and the heat spreader RH can be attached to the fixing portion FP through a laser welding process. However, embodiments of the inventive concept are not limited thereto, and a method of attaching the support substrate SU and the heat spreader RH to the fixing portion FP can vary.

[0076] Further, the fixing portion FP can be provided with a plurality of second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP n and OP m-1 defined through the fixing portion FP and positioned adjacent to the adhesive portions AP1, AP2, …, and AP m In an embodiment, the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP m-1 and OP m may be spaced apart from each other at regular intervals. For example, among the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP m-1 and OP m , the intervals between the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP m-1 and OP m adjacent to each other in one direction can be constant. However, embodiments of the inventive concept are not limited thereto. For example, among the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP m-1 and OP m , the intervals between the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP m-1 and OP m adjacent to each other in one direction can not be constant.

[0077] Further, as Figure 5 shown in m-1 , the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP m and OP m-1 may have a circular shape in a plane. For example, among the second openings OP2-1, OP2-2, OP2-3, OP2-4, …, OP mmay have an elongated oval shape. However, embodiments of the inventive concept are not limited thereto. For example, the second openings OP2-1, OP2-2, OP2-3, OP2-4,..., OP m-1 and OP m may vary and should not be limited to a circular shape. The positions of the second openings OP2-1, OP2-2, OP2-3, OP2-4,..., OP m-1 and OP m should not be limited to the positions shown in the embodiments of Figure 5 , and the arrangement of the second openings OP2-1, OP2-2, OP2-3, OP2-4,..., OP m-1 and OP m may vary.

[0078] The second openings OP2-1, OP2-2, OP2-3, OP2-4,..., OP m-1 , OP m may prevent the accumulation of foreign matter. After a deposition process in a deposition apparatus EV (refer to Figure 6 ) according to an embodiment, which will be described later, a cleaning process can be performed, and a material used in the cleaning process can pass through the second openings OP2-1, OP2-2, OP2-3, OP2-4,..., OP m-1 , OP m . Thus, the accumulation of foreign matter between the support substrate SU and the heat spreader RH can be prevented.

[0079] The fixing portion FP can prevent the support substrate SU from directly contacting the heat spreader RH. For example, the support substrate SU can be spaced apart from the heat spreader RH by the fixing portion FP. Since the support substrate SU is spaced apart from the heat spreader RH, heat absorbed by the heat spreader RH can be prevented from being transferred to the support substrate SU.

[0080] As shown in the embodiments of Figure 1 , the mask frame MF can be a structure for fixing the mask stick MST. The mask stick MST can be used in a deposition process, and a material can be deposited through a third opening MST-OP of the mask stick MST. In an embodiment, a base substrate BS (refer to Figure 6 ) on which a deposition process is performed can be disposed above the mask stick MST.

[0081] In a comparative embodiment in which the mask frame does not include a heat dissipation plate, a support base absorbs heat. In the support base that absorbs heat, deformation such as thermal expansion occurs. When the support base is deformed, the deformed support base changes a position of a mask bar disposed above the support base, and pixel position accuracy (PPA) is reduced. In an embodiment, the mask frame MF can include heat dissipation plates RH, RH-a, and RH-b disposed on the support bases SU and SU-a, and a fixing portion FP disposed between the support bases SU and SU-a and the heat dissipation plates RH, RH-a, and RH-b. Accordingly, it is possible to reduce or prevent the support bases SU and SU-a from being deformed due to heat transferred to the support bases SU and SU-a, and it is possible to improve pixel position accuracy of the mask frame MF.

[0082] Hereinafter, a deposition apparatus EV according to an embodiment of the inventive concept will be described with reference to the accompanying drawings. Figures 6 to 8 A deposition apparatus EV according to an embodiment of the inventive concept will be described in detail. In the description of the deposition apparatus EV, repetitive description of elements of the mask frame MF described above will be omitted for convenience of explanation, and the description will focus on different features. Figures 1 to 5 A deposition apparatus EV according to an embodiment of the inventive concept will be described in detail. In the description of the deposition apparatus EV, repetitive description of elements of the mask frame MF described above will be omitted for convenience of explanation, and the description will focus on different features.

[0083] Figure 6 is a cross-sectional view illustrating a deposition apparatus EV according to an embodiment of the inventive concept. Figure 7 is an enlarged cross-sectional view illustrating a region AA' of Figure 6 . Figure 8 is a cross-sectional view illustrating a portion of a pixel PX including a color filter formed by the deposition apparatus EV illustrated in Figure 6 .

[0084] As illustrated in the embodiment of Figure 6 , the deposition apparatus EV can include a vacuum chamber CB, a deposition source VS, a mask frame MF, and a mask MST, and the deposition source VS, the mask frame MF, and the mask MST can be disposed in the vacuum chamber CB. The mask frame MF can be disposed above the deposition source VS. The mask MST can be disposed above the mask frame MF. In an embodiment, the mask bar MST (see Figure 1 ) described above can be the same as the mask MST.

[0085] The mask frame MF can include a support base SU, a heat dissipation plate RH, and a fixing portion FP. The support base SU can include a first opening SU-OP (see Figure 1 ) passing through the support base SU defined by a first inner side surface SU-F1 and a second inner side surface SU-F2 (see Figure 1 ). The heat dissipation plate RH can be disposed on the first inner side surface SU-F1 and the second inner side surface SU-F2 (see Figure 1The fixing part FP can be directly set on the first inner surface SU-F1 and the second inner surface SU-F2 of the supporting base SU (refer to...). Figure 1 The fixing part FP can be set on the first inner surface SU-F1 and the second inner surface SU-F2 of the heat sink RH and the supporting base SU (refer to...). Figure 1 Between. Each of the fixed parts FP may include adhesive parts AP1, AP2, ... and AP. n (refer to Figure 5 This is used to attach the support base SU to the heat sink RH. Additionally, the fixing portion FP may include portions defined adjacent to the adhesive portions AP1, AP2, ... and AP... n The second opening OP2-1, OP2-2, OP2-3, OP2-4, ..., OP m-1 and OP m (refer to Figure 5 ).

[0086] refer to Figure 6 In one embodiment, the deposition apparatus EV may include a first ST1, a second ST2, a first component MB1, and a second component MB2. The first ST1, the second ST2, the first component MB1, and the second component MB2 may be disposed within a vacuum chamber CB. The vacuum chamber CB may be maintained in a vacuum state.

[0087] The mask frame MF can be set on the first ST1. For example, as Figure 6 As shown in the embodiment, the support base SU can be directly mounted on the first ST1. The upper surface of the first ST1 can directly contact the lower surface of the support base SU. The first ST1 can be supported by a first component MB1. The first component MB1 can be disposed below the first ST1.

[0088] The substrate BS can be directly disposed on the lower surface of the second ST2. The second ST2 can be a component on which the substrate BS is disposed. The substrate BS can be fixed to the second ST2. The second component MB2 can be disposed on the second ST2. For example, in an embodiment, the second component MB2 can be a magnet. The second component MB2 can fix the second ST2.

[0089] The deposition apparatus EV can be used to deposit deposition material VD onto a substrate BS. The substrate BS can be positioned above the mask MST. For example... Figure 6As shown in embodiments of the inventive concept, the base substrate BS can have a single layer structure. However, embodiments of the inventive concept are not limited thereto. For example, the base substrate BS can have a multi-layer structure of a plurality of layers. In embodiments, an organic material (i.e., a deposition material VD) can be deposited on the base substrate BS. As described above, the deposition material VD can be deposited on the first surface of the base substrate BS after passing through the third openings MST-OP of the mask MST. The first surface of the base substrate BS can not be in contact with the second stage ST2. For example, as shown in embodiments of the inventive concept, the first surface can be a bottom surface of the base substrate BS, and an upper surface of the base substrate BS can directly contact the second stage ST2. Figure 6 As shown in embodiments of the inventive concept, the first surface can be a bottom surface of the base substrate BS, and an upper surface of the base substrate BS can directly contact the second stage ST2.

[0090] The deposition source VS can include a deposition material VD. In embodiments, the deposition material VD can be heated in the deposition source VS and can be ejected upward. The deposition material VD can be ejected toward the base substrate BS. Thermal radiation energy EA (see FIG. 2) can be generated in the deposition source VS. Since the vacuum chamber CB is in a vacuum state, there is no convective heat transfer, and the thermal radiation energy EA generated by the deposition source VS can be absorbed or reflected by the mask frame MF after moving upward. Figure 7 ) Since the vacuum chamber CB is in a vacuum state, there is no convective heat transfer, and the thermal radiation energy EA generated by the deposition source VS can be absorbed or reflected by the mask frame MF after moving upward.

[0091] Referring to embodiments of the inventive concept, the heat sink RH can include a first surface and an opposite second surface, such as a first side surface RH-D1 and a second side surface RH-D2. Figure 7

[0092] The second side surface RH-D2 of the heat sink RH and the first side surface RH-D1 of the heat sink RH can be spaced apart from each other in one direction. The first side surface RH-D1 of the heat sink RH can be disposed adjacent to the support substrate SU. For example, the first side surface RH-D1 of the heat sink RH can be in direct contact with the fixed portion FP. The second side surface RH-D2 of the heat sink RH can be exposed to the deposition source VS. The second side surface RH-D2 of the heat sink RH exposed to the deposition source VS can be exposed to the thermal radiation energy EA. In embodiments, the second side surface RH-D2 of the heat sink RH exposed to the deposition source VS can be mirror-polished. When compared to a heat sink that is not mirror-polished, the reflectivity of energy can increase in the mirror-polished heat sink RH. Since the energy reflectivity increases in the second side surface RH-D2 of the heat sink RH, the energy absorption rate can decrease.

[0093] A mask frame including a support substrate in which a heat sink is not disposed can be deformed due to thermal radiation energy. When the support substrate is deformed due to the thermal radiation energy, the pixel position accuracy of a mask disposed on the support substrate can decrease. When the pixel position accuracy of the mask decreases, the deposition accuracy can decrease in a deposition process.

[0094] ​The mask frame MF (refer to Figure 1 ) can include a heat sink RH disposed on the support base SU. Since the heat sink RH is disposed on the support base SU, direct exposure of the support base SU to thermal radiation energy can be reduced. In an embodiment, the heat sink RH can include at least one of Ag, Al, Cu, Cr, and Sn, and an emissivity of the heat sink RH can be less than or equal to about 0.25. Accordingly, heat transferred from the heat sink RH to the support base SU can be reduced. In the vacuum chamber CB, the heat sink RH having a lower emissivity than that of a material such as stainless steel can have a relatively low absorption rate of thermal radiation energy and a relatively high reflectivity of thermal radiation energy.

[0095] Further, in an embodiment in which a second side surface RH-D2 of the heat sink RH exposed to the deposition source VS is mirror-polished, the absorption rate of thermal radiation energy can be reduced. Since the absorption rate of thermal radiation energy in the heat sink RH is reduced, heat transferred from the heat sink RH to the support base SU can be reduced. Accordingly, deformation caused by heat in the mask frame MF can be reduced or prevented, and deposition accuracy in the deposition apparatus EV including the mask frame MF can be improved.

[0096] Meanwhile, a plurality of metal bars can be disposed under the mask MST. Further, each of the metal bars can be provided with a plurality of openings defined through the metal bar.

[0097] Figure 8 is a cross-sectional view showing a portion of a pixel PX of a color filter CF formed by a deposition apparatus EV according to an embodiment of the present inventive concept. Figure 6 As shown in the embodiment of FIG. 1, the pixel PX can include a light emitting element OLED, a transistor TR connected to the light emitting element OLED, and a color filter CF disposed on the light emitting element OLED. Figure 8 As shown in the embodiment of FIG. 1, the pixel PX can include a light emitting element OLED, a transistor TR connected to the light emitting element OLED, and a color filter CF disposed on the light emitting element OLED.

[0098] The light emitting element OLED can include a first electrode E1, a second electrode E2, and a light emitting layer OEL disposed between the first electrode E1 and the second electrode E2 (e.g., in a thickness direction of the substrate layer SUB). The light emitting element OLED can be an organic light emitting element. In an embodiment, the light emitting layer OEL can be an organic light emitting layer.

[0099] In an embodiment, the first electrode E1 can be an anode electrode, and the second electrode E2 can be a cathode electrode. The first electrode E1 can be a pixel electrode, and the second electrode E2 can be a common electrode.

[0100] The pixel PX can include a pixel region PA and a non-pixel region NPA adjacent to the pixel region PA. The light-emitting element OLED can be provided in the pixel region PA, and the transistor TR can be provided in the non-pixel region NPA.

[0101] The transistor TR and the light-emitting element OLED can be provided over a substrate layer SUB. A buffer layer BFL can be provided over the substrate layer SUB. In an embodiment, the buffer layer BFL can include an inorganic material.

[0102] A semiconductor layer SM of the transistor TR can be provided over the buffer layer BFL. In an embodiment, the semiconductor layer SM can include an inorganic semiconductor including amorphous silicon or polycrystalline silicon, or an organic semiconductor. Further, the semiconductor layer SM can include an oxide semiconductor. The semiconductor layer SM can include a source region, a drain region, and a channel region defined between the source region and the drain region.

[0103] A first insulating layer INS1 can be provided over the buffer layer BFL to cover the semiconductor layer SM. In an embodiment, the first insulating layer INS1 can include an inorganic material. A gate electrode GE of the transistor TR can be provided over the first insulating layer INS1 to overlap with the semiconductor layer SM. The gate electrode GE can be provided to overlap with the channel region of the semiconductor layer SM.

[0104] A second insulating layer INS2 can be provided over the first insulating layer INS1 to cover the gate electrode GE. The second insulating layer INS2 can include an organic material and / or an inorganic material.

[0105] A source SE and a drain DE of the transistor TR can be provided over the second insulating layer INS2 to be spaced apart from each other. As Figure 8 In an embodiment as shown, the source SE can be connected to the source region of the semiconductor layer SM via a first contact hole CH1 defined through the first insulating layer INS1 and the second insulating layer INS2. The drain DE can be connected to the drain region of the semiconductor layer SM via a second contact hole CH2 defined through the first insulating layer INS1 and the second insulating layer INS2.

[0106] A third insulating layer INS3 can be provided over the second insulating layer INS2 to cover the source SE and the drain DE of the transistor TR. In an embodiment, the third insulating layer INS3 can include an organic material.

[0107] A first electrode E1 can be provided over the third insulating layer INS3. The first electrode E1 can be connected to the drain DE of the transistor TR via a third contact hole CH3 defined through the third insulating layer INS3.

[0108] A pixel definition layer PDL can be disposed on the first electrode E1 and the third insulating layer INS3 to expose a predetermined portion of the first electrode E1. For example, as shown in an embodiment of Figure 8 The pixel definition layer PDL can be disposed on a lateral edge of the first electrode E1 and can expose a central portion of the first electrode E1, as shown in an embodiment of

[0109] The light emitting layer OEL can be disposed on the first electrode E1 in the opening PX_OP. In an embodiment, the light emitting layer OEL can generate light having a red, green, or blue color. Further, the light emitting layer OEL can generate white light by combining organic materials that respectively generate red, green, and blue colors. However, embodiments of the inventive concept are not limited thereto, and the color of light generated by the light emitting layer OEL can vary. The light emitting layer OEL can include an organic light emitting material. However, embodiments of the inventive concept are not limited thereto or by it. For example, the light emitting layer can include quantum dots or quantum rods.

[0110] The second electrode E2 can be disposed on the pixel definition layer PDL and the light emitting layer OEL. The thin film encapsulation layer TFE can be disposed on the second electrode E2. Holes and electrons injected into the light emitting layer OEL can recombine to generate excitons, and the light emitting element OLED can emit light by excitons returning from an excited state to a ground state. The light emitting element OLED can emit red, green, and blue light in accordance with a flow of current, and thus can display an image.

[0111] As shown in an embodiment of Figure 8 The touch sensing unit TSP can be disposed on the thin film encapsulation layer TFE, as shown in an embodiment of The touch sensing unit TSP can sense an external input such as a touch of a user, can convert the external input into a predetermined input signal, and can apply the input signal to a display panel including the pixels PX. The touch sensing unit TSP can include a plurality of touch sensor portions to sense the external input. In an embodiment, the touch sensor portions can sense the external input by a capacitive method.

[0112] The color filter CF and the black matrix BM can be disposed on the touch sensing unit TSP. The color filter CF can overlap the pixel area PA, and the black matrix BM can overlap the non-pixel area NPA.

[0113] In an embodiment, the color filter CF can have one of a red, green, and blue color. The color filter CF can convert light incident to the color filter CF into light having one of a red, green, and blue color. In an embodiment, the color filter CF can be formed by a deposition apparatus EV. Figure 6 The base substrate BS shown in an embodiment of Figure 8The base substrate BS shown in the embodiment of the present inventive concept can include the base layer SUB, components stacked between the base layer SUB and the touch sensing unit TSP, and the touch sensing unit TSP. However, the configuration of the base substrate BS can vary and should not be limited to or by this. Figure 6 The base substrate BS shown in the embodiment of the present inventive concept can include the base layer SUB, components stacked between the base layer SUB and the touch sensing unit TSP, and the touch sensing unit TSP. However, the configuration of the base substrate BS can vary and should not be limited to or by this.

[0114] The fourth insulating layer INS4 can be disposed on the color filter CF and the black matrix BM. In an embodiment, a protective layer can be disposed on the fourth insulating layer INS4.

[0115] As Figure 6 As shown in the embodiment of the present inventive concept, the deposition apparatus EV can include a vacuum chamber CB, a deposition source VS, a mask frame MF, and a mask MST, and the deposition source VS, the mask frame MF, and the mask MST can be disposed in the vacuum chamber CB. The mask frame MF can include a support substrate SU, a heat sink RH, and a fixed portion FP disposed between the support substrate SU and the heat sink RH. Since the heat sink RH is disposed on the support substrate SU, absorption of thermal radiation energy EA generated from the deposition source VS by the support substrate SU can be reduced. Further, since the support substrate SU and the heat sink RH are spaced apart from each other with the fixed portion FP interposed therebetween, heat transferred from the heat sink RH to the support substrate SU can be reduced. Accordingly, deposition accuracy of the deposition apparatus EV can be improved.

[0116] Figure 9A And Figure 9B The images of FIGS. 10 and 11 are displayed in gray scale, but it should be understood that, Figure 9A Temperature changes in the mask frame of the comparative example including the support substrate but not the fixed portion and the heat sink due to heat transfer are shown in color. Figure 9B Temperature changes in the mask frame of the embodiment of the present inventive concept including the support substrate, the fixed portion, and the heat sink due to heat transfer are shown in color. Although Figure 9A And Figure 9B The images of FIGS. 10 and 11 are displayed in gray scale, but it should be understood that, Figure 9A And Figure 9B The actual images of FIGS. 10 and 11 are in color, and thus the terms "color", "blue", and "red", etc. are used herein and hereafter.

[0117] In Figure 9A And Figure 9BIn the drawing, the Y-axis indicates a relative temperature, and the temperature increases from the lower side to the upper side. The first region A1, which is positioned at the lower side of the Y-axis and displayed in a color close to blue, indicates a lower temperature than the second region A2, which is positioned at the upper side of the Y-axis and displayed in a color close to red.

[0118] Figure 9A The mask frame of the comparative example displays a color close to the upper side of the Y-axis. Figure 9B The mask frame of the comparative example displays a color close to the lower side of the Y-axis. When compared with the mask frame of the comparative example, Figure 9A Figure 9B The mask frame of the embodiment of the inventive concept shown in FIG. 11 exhibits a relatively low temperature overall. In addition, as shown in FIG. 12, the color difference in the left side of the mask frame of the comparative example is large, and thus it can be concluded that the temperature difference in the mask frame of the comparative example is relatively large. However, as shown in FIG. 13, the overall color difference in the mask frame of the embodiment of the inventive concept is small, and thus it can be concluded that the temperature difference in the mask frame of the embodiment of the inventive concept is not large. Figure 9A Figure 9B

[0119] Accordingly, in the mask frame including the heat dissipation plate disposed on the support base and the fixing portion disposed between the heat dissipation plate and the support base, the absorption rate of thermal radiation energy can be reduced, and deformation of the mask frame due to heat can be reduced or prevented.

[0120] The mask frame can include a support base including an inner side surface, a heat dissipation plate disposed on the inner side surface of the support base, and a fixing portion disposed between the support base and the heat dissipation plate. The heat dissipation plate can cover the inner side surface of the support base and can reduce or prevent deformation of the support base caused by thermal radiation energy generated in a deposition process. Since deformation of the support base due to heat is reduced or prevented, deposition accuracy of a deposition process using the mask frame can be improved.

[0121] The deposition apparatus can include a vacuum chamber and a mask frame disposed in the vacuum chamber. A deposition source and a mask can be disposed in the vacuum chamber, and the mask can be disposed above the mask frame. The mask frame can include a support base, a heat dissipation plate disposed on the support base, and a fixing portion disposed between the support base and the heat dissipation plate. Since the heat dissipation plate is disposed on the support base, absorption of thermal radiation energy generated from the deposition source by the support base can be reduced. Accordingly, deformation of the support base due to heat can be reduced or prevented, and deposition accuracy of the deposition apparatus including the mask frame can be improved.

[0122] ​​​While embodiments of the inventive concept have been described, it is to be understood that the inventive concept is not limited to those embodiments. Instead, numerous modifications, alterations and changes to the described embodiments are possible and within the scope and spirit of the inventive concept, as will become apparent to those of ordinary skill in the art. Accordingly, the description is to be regarded as illustrative in nature and not restrictive.

[0123] Accordingly, the disclosed subject matter is not to be limited by any single embodiment described herein.

Claims

1. A mask frame, wherein the mask frame comprises: a support base including a plurality of inner side surfaces defining a first opening through the support base; a heat dissipation plate disposed on the plurality of inner side surfaces; and a plurality of fixing portions disposed between the support base and the heat dissipation plate, each of the plurality of fixing portions including a plurality of adhesive portions attaching the support base to the heat dissipation plate and a plurality of second openings defined through the fixing portion adjacent to the plurality of adhesive portions. The plurality of fixing portions are disposed directly between the support base and the heat dissipation plate.

2. The mask frame of claim 1, wherein, 3. The mask frame of claim 1, wherein: the support base includes: a plurality of first overlapping portions overlapping with the fixing portions; and a plurality of first non-overlapping portions not overlapping with the fixing portions, and the heat dissipation plate includes: a plurality of second overlapping portions overlapping with the fixing portions; and a plurality of second non-overlapping portions not overlapping with the fixing portions. The heat dissipation plate and the support base are spaced apart from each other with the fixing portions interposed therebetween.

4. The mask frame of claim 1, wherein, 5. The mask frame of claim 1, wherein: the support base includes a first upper surface and a first lower surface spaced apart from the first upper surface in a first direction, the heat dissipation plate includes a second upper surface and a second lower surface spaced apart from the second upper surface in the first direction, and a first height of the support base in a direction perpendicular to the first upper surface and the first lower surface is the same as a second height of the heat dissipation plate in a direction perpendicular to the second upper surface and the second lower surface.

6. The mask frame of claim 1, wherein: the heat dissipation plate includes a first surface adjacent to the support base and a second surface spaced apart from the first surface in a first direction; and the second surface is mirror polished.

7. The mask frame of claim 1, wherein: the heat dissipation plate includes a plurality of sub-heat dissipation plates; and each of the sub-heat dissipation plates is disposed on the inner side surface. The heat dissipation plate includes at least one of silver, aluminum, copper, chromium, and tin.

8. The mask frame of claim 1, wherein, 9. The mask frame of claim 1, wherein: the support base includes an upper surface and a lower surface spaced apart from the upper surface in a first direction; and each of the plurality of inner side surfaces is inclined with respect to the upper surface and the lower surface. The support base includes invar.

10. The mask frame of claim 1, wherein, 11. The mask frame of claim 1, wherein: the plurality of fixing portions includes three or more fixing portions; and in a cross-section, the three or more fixing portions are spaced apart from each other. The support base and the fixing portions include a same metallic material as each other.

12. The mask frame of claim 1, wherein, 13. A deposition apparatus, wherein the deposition apparatus comprises: a vacuum chamber; a deposition source disposed in the vacuum chamber; a mask frame disposed above the deposition source; and a mask disposed on the mask frame, the mask frame being the mask frame according to any one of claims 1 to 12. ​ ​

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