A contactless chip module induction antenna board fixture

Abstract

The present invention provides a contactless chip module induction antenna board fixture, the induction antenna board fixture comprises an induction antenna board, an induction coil, a pad, a through hole and a clip probe, wherein the induction coil is etched on the induction antenna board, the clip probe is connected and fixed to the pad on the induction antenna board, the clip probe is inserted and fixed to the chip module to be tested, and the electrical connection between the induction coil and the chip module to be tested is realized through the pad, the three-section structure of the clip probe has the characteristic of elastic pressure, which realizes good fixation of the chip module to be tested and provides a welding-free and lossless use environment for the chip module to be tested; at the same time, the parasitic parameters of the induction antenna board are measurable and will not change during use, which can provide a completely consistent test environment for different chip modules to be tested, ensure the precision and accuracy of the test data of the chip module to be tested, and realize good testing of the chip module to be tested; moreover, the contactless chip module induction antenna board fixture has a simple structure and low production cost, and can realize accurate testing with fast and lossless replacement.

Description

Technical Field

[0001] The invention relates to the technical field of contactless chip module testing, and in particular to an inductive antenna board jig for a contactless chip module. Background Art

[0002] Contactless chip module card, also known as radio frequency card, consists of a contactless chip module and an inductive antenna. When the radio frequency card enters the working environment of the contactless card reader, the self-inductance coil receives the electromagnetic wave energy of the card reader, and the chip circuit rectifies and stabilizes it to obtain a stable working voltage before it starts to work. The existing technical solution for the use of contactless chips is achieved through packaging and card making. The encapsulated chip is punched and cut to form a single chip module, which is welded to the induction coil attached to the ultra-thin PVC or PET by mechanical winding and ultrasonic pressing, and then laminated with multiple layers of PVC or PET at high temperature. The chip is cured and sealed in the PVC or PET body, and finally undergoes punching and other processes to form a single card body. Such as Figure 1 As shown, it is a schematic diagram of the antenna structure in the existing card packaging form, which includes a pad 200, an encapsulation body 300, an induction coil 400 and a plastic card body 500, and a chip module to be tested 100. During the processing and manufacturing, the chip module to be tested 100 needs to withstand the effects of external high temperature, pressure and other stresses, which will cause corresponding failures; and the entire process is complicated, and the production cycle is long and only suitable for batch production mode. At the same time, if it is necessary to measure other parameters of the chip module to be tested, such as capacitance, or replace the test coil during the test and use process, the card body can only be physically destroyed to separate the chip module to be tested, and the card body of the self-inductance coil cannot be used again. In addition, in the process of removing the chip module to be tested, it is necessary to perform mechanical disassembly under high temperature heating conditions, which is easy to accidentally damage the chip module to be tested. Using the existing card packaging mode, it is impossible to meet the practical needs of lossless and fast switching of samples. For this reason, a device that can provide parasitic parameter determination and lossless switching of antenna coils is required. Summary of the invention

[0003] In view of the deficiencies in the above-mentioned prior art, the object of the present invention is to provide a contactless chip module inductive antenna board fixture, including an inductive antenna board, an inductive coil, a pad, a through hole and a clip probe. The fixture provides unified parasitic parameters for the chip module to be tested, provides a completely consistent test environment for different chips, and ensures the precision and accuracy of the test data.

[0004] In order to achieve the above technical purpose, the technical solution adopted by the present invention is:

[0005] A contactless chip module induction antenna board fixture, the induction antenna board fixture comprising an induction antenna board, an induction coil, a pad, a through hole and a clip probe, wherein the clip probe is divided into a first clip probe and a second clip probe, the pad is divided into a first pad and a second pad, the first clip probe and the second clip probe are respectively connected to a first pad and a second pad fixed on the induction antenna board, and connected to the pad fixed on the induction antenna board, the induction coil is etched on the induction antenna board, one end of the induction coil is connected to the first clamp probe through the through hole, and the other end of the induction coil is directly connected to the second clamp probe.

[0006] Preferably, the clip probe is an integrally formed three-section structure, including a front end, a middle end and a terminal end, wherein the front end is a semi-arc structure, the middle end and the terminal end are straight plate structures, the front end is connected to the middle end at an angle of 30 to 45 degrees, and the middle end is connected to the terminal end at an angle of 100 to 120 degrees.

[0007] Preferably, the clip probe has a length of 10 to 15 mm and a width of 1.0 to 1.5 mm.

[0008] Preferably, the clip probe is made of a metal all-copper elastic member.

[0009] Preferably, the clip probe is inserted into and fixes the chip module to be tested, and realizes electrical connection between the induction coil and the chip module to be tested through the pad.

[0010] In the contactless chip module sensing antenna board jig of the present invention, the induction coil is etched on the sensing antenna board, the clip probe is connected and fixed to the pad on the sensing antenna board, the clip probe is inserted and fixed to the chip module to be tested, and the electrical connection between the induction coil and the chip module to be tested is realized through the pad. The beneficial effect obtained is that the three-section structure of the clip probe has the characteristic of elastic pressure, which can realize good fixation of the chip module to be tested, and provide a non-destructive use environment for the chip module to be tested without welding. At the same time, the parasitic parameters of the sensing antenna board are measurable and will not change during use. It can provide a completely consistent test environment for different chip modules to be tested, ensure the precision and accuracy of the test data of the chip module to be tested, and realize good testing of the chip module to be tested; moreover, the contactless chip module sensing antenna board jig has a simple structure and low production cost, and can realize fast and non-destructive replacement and precise testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0012] Figure 1 It is a schematic diagram of the existing card packaging antenna structure.

[0013] Figure 2 It is a schematic diagram of the structure of a contactless chip module sensing antenna board fixture specifically implemented in the present invention.

[0014] Figure 3 It is a schematic diagram of the structure of a clip probe specifically implemented in the present invention. DETAILED DESCRIPTION

[0015] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0016] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0017] See also Figure 2 The present invention discloses a specific implementation of a contactless chip module sensing antenna board fixture, including a pad 300, an induction coil 400, an induction antenna board 500, a clip probe 600 and a through hole 700, as well as a chip module to be tested 100 and an encapsulation body 200, wherein the clip probe 600 is divided into a first clip probe 610 and a second clip probe 620, the pad is divided into a first pad 310 and a second pad 320, the first clip probe 610 and the second clip probe 620 are respectively connected to the first pad 310 and the second pad 320 fixed on the sensing antenna board 500, the induction coil 400 is etched on the sensing antenna board 500, one end of the induction coil 400 is wired and connected to the first clamp probe 610 through the through hole 700, and the other end of the induction coil 400 is directly connected to the second clamp probe 620.

[0018] In the main structural design of the induction antenna board 500 for implementing the above-mentioned induction coil 400, a back wiring design of a through hole 700 is adopted for one end of the overlapping tail line of the induction coil 400 to avoid short-circuiting and crossing of the induction coil 400, and specific silk-screen information is designed in the blank area of ​​the induction coil 400 as a unique identification mark when the induction antenna board 500 is used, so as to distinguish different induction antenna boards.

[0019] See also Figure 2 The clip probe 600 is inserted into and fixed to the chip module 100 to be tested, and the induction coil 400 is electrically connected to the chip module 100 to be tested through the pad 300 .

[0020] See also Figure 3The present invention discloses a schematic diagram of a clip probe structure of a specific implementation. The clip probe 600 is an integrated three-section structure, including a front end 6001, a middle end 6002 and a terminal end 6003, wherein the front end 6001 is a semi-arc structure, the middle end 6002 and the terminal end 6003 are straight plate structures, the front end 6001 is connected to the middle end 6002 at an angle of 30 to 45 degrees, and the middle end 6002 is connected to the terminal end 6003 at an angle of 100 to 120 degrees.

[0021] See also Figure 3 The length of the clip probe 600 is 10-15 mm, and the width is 1.0-1.5 mm. The three-section structure of the clip probe 600 has the characteristics of elastic pressure, which can achieve good fixation of the chip to be tested and provide a non-destructive use environment for the chip to be tested without welding.

[0022] See also Figure 3 The clip probe 600 is composed of a metal all-copper spring.

[0023] In the present invention, after welding the clip probe on the sensing antenna board, simulation software such as Cadence can be used to perform software simulation on the sensing antenna board to obtain parasitic parameters, and further combined with a vector network analyzer, the final parasitic parameters of the sensing antenna board can be obtained, and the influence of the non-contact chip module sensing antenna board fixture can be quantified, thereby providing a completely consistent test environment for different chip modules to be tested, ensuring the precision and accuracy of the test data of the chip modules to be tested, and achieving good testing of the chip modules to be tested; in the present invention, the required sensing antenna board is selected according to the capacitance value of the chip module to be tested, and the chip module to be tested can be tested after being slid and inserted in the direction of the pad of the clip probe; after the test is completed, the chip module to be tested can be slid out in the opposite direction of the pad of the clip probe.

[0024] The contactless chip module sensing antenna board fixture of the present invention has a simple structure and low production cost, and can realize rapid and non-destructive replacement and accurate testing.

[0025] The three parameters of the size, wire diameter and shape of the induction coil of the present invention can be combined to design different induction coils.

[0026] The shape of the contactless chip module sensing antenna board jig of the present invention can be customized according to actual needs, for example, it can be made into a rectangular, square, circular, or other shapes.

[0027] The shape, contact point and bending degree of the clip probe of the present invention can be customized according to actual needs.

[0028] The above is only a preferred embodiment of the present invention. Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Any technician familiar with the art can make many possible changes and modifications to the technical solution of the present invention by using the above disclosed methods and technical contents without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A non-contact chip module sensing antenna board fixture, characterized in that: The induction antenna board fixture includes an induction antenna board, an induction coil, a solder pad, a through hole, a clip probe, a chip module to be tested and an encapsulation body, wherein the clip probe is divided into a first clip probe and a second clip probe, the solder pad is divided into a first solder pad and a second solder pad, the first clip probe and the second clip probe are respectively connected to the first solder pad and the second solder pad fixed on the induction antenna board, the induction coil is etched on the induction antenna board, one end of the induction coil is connected to the first clip probe through the through hole wiring, and the other end of the induction coil is directly connected to the second clip probe, and the clip probe is an integrated three-section structure, including a front end, a middle end and a terminal end, wherein the front end is a semi-arc structure, the middle end and the terminal end are straight plate structures, the front end is connected to the middle end at an angle of 30 to 45 degrees, and the middle end is connected to the terminal end at an angle of 100 to 120 degrees.

2. The contactless chip module sensing antenna board fixture according to claim 1, characterized in that: The length of the clip probe is 10-15 mm, and the width is 1.0-1.5 mm.

3. The contactless chip module sensing antenna board fixture according to claim 1, characterized in that: The clip probe is composed of a metal all-copper elastic member.

4. The contactless chip module sensing antenna board fixture according to claim 1, characterized in that: The clip probe is inserted into and fixes the chip module to be tested, and realizes electrical connection between the induction coil and the chip module to be tested through the pad.

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