Grinding device, method for adjusting grinding pressure, and sheet loading and unloading mechanism

Abstract

The application discloses a grinding device, a method for adjusting grinding pressure and a plate loading and unloading mechanism, relates to the technical field of semiconductors, and is used for eliminating the influence of hard particles on the back surface of a wafer on a photoetch process, thereby improving the quality of semiconductor devices. The grinding device comprises a rotating part and a grinding part arranged on one side of the rotating part; the rotating part is used for fixing the relative position of the wafer and the grinding part and for driving the wafer to rotate; the grinding part has a grinding area for grinding the back surface of the wafer; and the shortest vertical distance from the rotating shaft of the rotating part to the edge of the grinding area is smaller than the radius of the wafer. The grinding device is applied to a polishing device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and particularly relates to a grinding device, a method for adjusting grinding pressure and a wafer loading and unloading mechanism. BACKGROUND

[0002] In the process of manufacturing semiconductor devices, a film layer is generally formed on a wafer by deposition or the like. Then, based on the film layer, a circuit structure or an isolation structure is formed on the wafer to realize the manufacturing of semiconductor devices.

[0003] However, in the above deposition process, not only the corresponding film layer is formed on the front surface of the wafer, but also a plurality of hard particles with uneven distribution and different specifications are generated on the edge portion of the back surface of the wafer. The existence of these hard particles will cause the mask and the wafer to be unable to be accurately aligned in the subsequent photolithography process, so that the consistency of the photoresist pattern on the wafer and the pattern on the mask is poor, thereby reducing the accuracy of the photolithography process, and finally resulting in poor quality of the semiconductor devices. SUMMARY

[0004] The present application aims to provide a grinding device, a method for adjusting grinding pressure and a wafer loading and unloading mechanism, which are used to eliminate the influence of the hard particles on the back surface of the wafer on the photolithography process, thereby improving the quality of the semiconductor devices.

[0005] In order to achieve the above-mentioned purpose, the present application provides a grinding device, which comprises a rotating member and a grinding member arranged on one side of the rotating member, wherein,

[0006] The rotating member is used to fix the relative position of the wafer and the grinding member, and to drive the wafer to rotate.

[0007] The grinding member has a grinding area for grinding the back surface of the wafer, and the shortest vertical distance from the rotating shaft of the rotating member to the edge of the grinding area is less than the radius of the wafer.

[0008] Compared with the prior art, in the grinding device provided by the present application, the grinding member arranged on one side of the rotating member has a grinding area for grinding the back surface of the wafer, and the shortest vertical distance from the edge of the grinding area to the rotating shaft of the rotating member is less than the radius of the wafer. In this case, the edge of the wafer placed on the rotating member can extend into the grinding area of the grinding member, so that the back surface of the part of the wafer located in the grinding area can be ground by the grinding member. At the same time, the rotating member can drive the wafer placed on the rotating member to rotate, and the rotating member can also fix the position of the wafer and the grinding member during the rotation, so that the edges of all regions of the wafer can extend into the grinding area of the grinding member, thereby removing the hard particles on the back surface of the wafer, eliminating the influence of these hard particles on the subsequent photolithography process, improving the accuracy of the photolithography process, and improving the quality of the semiconductor devices.

[0009] The application further provides a method for adjusting the grinding pressure of the grinding device.

[0010] obtaining the pushing force provided by the elastic member to the grinding part;

[0011] if the pushing force is less than the target grinding pressure, controlling the adjusting member to push the elastic member in the direction close to the grinding part; if the pushing force is greater than the target grinding pressure, controlling the adjusting member to pull the elastic member in the direction away from the grinding part; and if the pushing force is equal to the target grinding pressure, controlling the adjusting member to keep the deformation amount of the elastic member.

[0012] Compared with the prior art, the method for adjusting the grinding pressure can accurately determine whether the grinding pressure between the grinding part and the back surface of the wafer meets the requirements of the grinding scheme according to the size relationship between the target grinding pressure and the pushing force. In the case that the pushing force is less than the target grinding pressure, the adjusting member can be controlled to push the elastic member in the direction close to the grinding part to increase the pushing force provided by the elastic member to the grinding part, so that the actual grinding pressure between the grinding part and the back surface of the wafer is finally increased to the target grinding pressure. In the case that the pushing force is greater than the target grinding pressure, the adjusting member can be controlled to pull the elastic member in the direction away from the grinding part to reduce the pushing force provided by the elastic member to the grinding part, so that the actual grinding pressure is finally reduced to the target grinding pressure. In the case that the pushing force is equal to the target grinding pressure, the adjusting member can be controlled to keep the deformation amount of the elastic member, so that the actual grinding pressure is equal to the target grinding pressure, thereby realizing the automatic control of the grinding pressure and ensuring that the grinding device can remove all the hard particles on the back surface of the wafer while preventing the occurrence of grinding accidents caused by the large actual grinding pressure.

[0013] The application further provides a wafer loading and unloading mechanism applied to a polishing device, which comprises:

[0014] a loading device, which is used for loading the wafer onto a grinding head included in the polishing device before polishing and unloading the wafer from the grinding head after polishing;

[0015] and the grinding device provided by the above technical solution, which is arranged on one side of the loading device.

[0016] Compared with the prior art, the loading and unloading mechanism provided by the application further comprises a grinding device arranged on one side of the loading device, so that the loading and unloading mechanism can load or unload the wafer on the grinding head before or after polishing, and has the function of grinding the back surface of the wafer when the wafer is in a waiting state before or after polishing. In other words, the grinding device for removing hard particles on the back surface of the wafer is part of the loading and unloading mechanism and is not an additional chemical mechanical polishing device, so that the loading and unloading mechanism provided by the application can control the process cost while eliminating the influence of hard particles on the back surface of the wafer on the subsequent photoetching process and improving the quality of semiconductor devices.

[0017] The application further provides a polishing device comprising the grinding device or the loading and unloading mechanism provided by the above technical solution.

[0018] Compared with the prior art, the polishing device provided by the application has the same beneficial effects as the grinding device or the loading and unloading mechanism provided by the above technical solution, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0020] Figure 1 A schematic view of a photoetching process for a wafer with hard particles on the back surface;

[0021] Figure 2 A schematic view of the structure of the grinding device provided by the embodiment of the application in a working state.

[0022] Reference signs:

[0023] 111 is a silicon wafer clamp, 112 is a rotating shaft, L is a rotating shaft, 12 is a grinding piece, 121 is a support part, 122 is a fixing part, 123 is a grinding part, 13 is a pressure adjusting piece, 131 is a controller, 132 is an adjusting piece, 133 is an elastic piece, 134 is a pressure sensor, 2 is a wafer, 21 is a hard particle, 3 is a photoresist, and 4 is a mask. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessary confusion of the concept of the present disclosure.

[0025] Various structural diagrams according to embodiments of the present disclosure are shown in the drawings. These diagrams are not drawn to scale in which certain details are exaggerated for clarity and others omitted. The shapes of various regions, layers, and the relative sizes and positional relationships among them shown in the drawings are merely exemplary and can deviate in actuality due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes, and relative positions can be additionally designed according to actual needs by those skilled in the art.

[0026] In the context of the present disclosure, when a layer / element is referred to as being located "on" another layer / element, the layer / element can be directly on the other layer / element, or there can be an intervening layer / element therebetween. In addition, if a layer / element is located "on" another layer / element in one orientation, it can be located "under" the other layer / element when the orientation is reversed. In order to make the technical problems to be solved, technical solutions and beneficial effects of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present disclosure and not to limit the present disclosure.

[0027] In addition, the terms "first", "second", etc. are used only for the purpose of description and should not be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited. The meaning of "several" is one or more, unless otherwise explicitly and specifically limited.

[0028] In the description of the present disclosure, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0029] In the process of manufacturing semiconductor devices, deposition and other methods are generally used to form film layers on wafers. For example: isolation material film, conductive material film, etc. Then, based on these film layers, circuit structures or isolation structures are formed on the wafer to realize the manufacturing of semiconductor devices.

[0030] However, during the deposition process described above, not only is a corresponding film formed on the front side of the wafer, but also several unevenly distributed hard particles of different sizes are generated at the edges of the back side of the wafer. See also Figure 1 The presence of these hard particles 21 causes the back side of wafer 2 to be uneven. During subsequent photolithography processes on wafer 2, even if wafer 2 is placed on a flat support surface via its back side, the front side of wafer 2 will still be tilted due to the presence of the hard particles 21. Figure 1 The rectangular dashed box represents the wafer and photoresist parallel to the horizontal plane. In this case, after the photoresist 3 is covered on the front side of wafer 2, the presence of these hard particles 21 during exposure to form a photoresist pattern prevents precise alignment between the mask 4 and wafer 2. This results in poor consistency between the photoresist pattern on wafer 2 and the pattern on mask 4, thus reducing the precision of the photolithography process. Subsequently, when etching wafer 2 based on the aforementioned photoresist pattern, the poor consistency between the photoresist pattern and the preset pattern makes it impossible to guarantee the fabrication quality of the semiconductor device. Furthermore, with the miniaturization of semiconductor devices, these problems become increasingly prominent.

[0031] Furthermore, to address the aforementioned issues, those skilled in the art have specifically designed chemical mechanical polishing (CMP) equipment with the function of grinding the back side of wafers. This allows for the use of additional CMP equipment to grind the back side of the wafer before or after polishing the front side, removing hard particles and preventing their presence from affecting the precision of subsequent photolithography processes. However, this additional CMP equipment incurs extra costs, thereby increasing the manufacturing cost of semiconductor devices and reducing their market competitiveness.

[0032] To address the technical problem of hard particles on the back side of wafers affecting the precision of subsequent photolithography processes and thus degrading the quality of semiconductor devices, embodiments of the present invention provide a polishing apparatus, a method for adjusting polishing pressure, and a wafer loading and unloading mechanism. In the polishing apparatus provided by the embodiments of the present invention, a rotating component can drive the wafer to rotate, and the polishing area of ​​the polishing component can remove hard particles located on the back side of the wafer, thereby eliminating the influence of hard particles on subsequent photolithography processes and improving the quality of semiconductor devices.

[0033] This invention provides a grinding apparatus that can grind the back side of a wafer before or after polishing the front side of the wafer in a polishing device. The wafer can be any wafer with hard particles present on its back side.

[0034] See Figure 2 The grinding device includes a rotating component (not shown) and a grinding component 12.

[0035] SeeFigure 2 The rotating member is used to fix the relative position of the wafer 2 and the grinding member 12, and to drive the wafer 2 to rotate. The rotating member can be any component that can clamp the wafer 2 and drive the wafer 2 to rotate. The rotating member drives the wafer 2 to rotate around the rotating axis L by fixed-axis rotation.

[0036] For example, see Figure 2 The rotating member can include a wafer chuck 111, a rotating shaft 112, and a motor. The wafer chuck 111 can clamp the wafer 2 placed on its bearing surface by vacuum adsorption. One end of the rotating shaft 112 is in transmission connection with the driving end of the motor. The other end of the rotating shaft 112 is fixedly connected with the other surface of the wafer chuck 111 away from the bearing surface. Moreover, the central axis of the rotating shaft 112 coincides with the central axis of the wafer chuck 111. After the wafer 2 is clamped by the wafer chuck 111, the motor can drive the rotating shaft 112 and the wafer chuck 111 to rotate, thereby realizing the rotation of the wafer 2. During the above rotation process, the rotating axis L of the rotating member coincides with the central axis of the rotating shaft 112.

[0037] For example, see Figure 2 The grinding member 12 is arranged on one side of the rotating member. The grinding member 12 has a grinding area for grinding the back surface of the wafer 2, and the shortest vertical distance from the rotating axis L of the rotating member to the edge of the grinding area is less than the radius of the wafer 2.

[0038] Specifically, the grinding member can be arranged on any side of the rotating member, as long as the grinding area of the grinding member can grind the back surface of the wafer. In addition, the size of the grinding area of the grinding member and the shortest vertical distance from the rotating axis of the rotating member to the edge of the grinding area affect the range of grinding the back surface of the wafer by the grinding member, so the size of the grinding area and the shortest vertical distance from the rotating axis of the rotating member to the edge of the grinding area can be set according to the distribution of hard particles on the back surface of the wafer.

[0039] In actual application, see Figure 2 After the wafer 2 is placed on the rotating member, the central axis of the wafer 2 can coincide with the central axis of the wafer chuck 111. In this case, when the rotating member drives the wafer 2 to rotate, the rotating axis L of the wafer 2 in the rotating state can coincide with the central axis of the wafer 2. At this time, the edges of each region of the wafer 2 can extend into the grinding area of the grinding member 12, and the area of the wafer 2 in the grinding area is equal in each time period of the grinding cycle.

[0040] From the above, the grinding member can grind the back surface of the portion of the wafer located in the grinding area. At the same time, the rotating member can rotate the wafer placed on the rotating member, and the rotating member can also fix the position of the wafer and the grinding member during rotation, so that the edges of each area of the wafer can extend into the grinding area of the grinding member, thereby removing the hard particles on the back surface of the wafer, eliminating the influence of these hard particles on the subsequent photolithography process, improving the precision of the photolithography process, and improving the quality of the semiconductor device.

[0041] In an example, referring to Figure 2 The grinding member 12 can include a support portion 121, a fixed portion 122 disposed at one end of the support portion 121, and a grinding portion 123 disposed at the other end of the support portion 121. The area between the fixed portion 122 and the grinding portion 123 is the grinding area.

[0042] Specifically, the support portion can be any component that can separate the fixed portion and the grinding portion. For example, the support portion can be a rectangular support block or an arc-shaped support block. The fixed portion can be any component that can prevent the wafer from moving away from the grinding portion during grinding. For example, the fixed portion can be a rectangular fixed plate or an arc-shaped fixed plate. The fixed portion can be fixedly connected to one end of the support portion by welding, bonding, bolts, etc. In addition, the materials of the support portion and the fixed portion can be materials with certain rigidity and hardness (for example, stainless steel).

[0043] The grinding portion can be any grinding portion with polishing function. For example, the grinding portion is a polyurethane grinding portion or a sandpaper grinding portion. The grinding portion can be fixedly connected to the other end of the support portion away from the fixed portion by bolts, bonding, etc. Among them, along the height direction of the support portion, the area of the fixed portion and the grinding portion coincides determines the size of the grinding area, so the specifications of the fixed portion and the grinding portion can be set according to the specifications of the grinding area.

[0044] In an example, referring to Figure 2 The grinding device further comprises a pressure adjusting member 13 disposed on the side of the grinding portion 123 away from the fixed portion 122. The pressure adjusting member 13 is used to adjust the grinding pressure when the grinding portion 123 grinds the back surface of the wafer 2.

[0045] Specifically, in the initial stage of the above-mentioned grinding process, the hard particles on the back surface of the wafer have a relatively large size, and the grinding part in the grinding area can be in contact with the hard particles and grind the hard particles without applying external force. As the grinding process proceeds, the size of the hard particles on the back surface of the wafer becomes smaller and smaller, and the overall thickness of the wafer becomes thinner. In order to prevent the grinding pressure between the grinding part and the wafer from gradually decreasing due to the gradual decrease in the size of the hard particles, a pressure adjusting member can be arranged on the side of the grinding part away from the fixed part. The pressure adjusting member can adjust the grinding pressure when the grinding part grinds the back surface of the wafer, so that the above-mentioned grinding pressure meets the target grinding pressure specified in the grinding scheme in the actual grinding process. In addition, the pressure adjusting member can also prevent the occurrence of grinding accidents due to the relatively large actual grinding pressure.

[0046] Specifically, in the process of grinding the back surface of the wafer, in order to prevent the grinding part from damaging the wafer due to rigid contact with the back surface of the wafer, a grinding part with a certain flexibility is generally selected. Based on this, the above-mentioned pressure adjusting member can adjust the grinding pressure when the grinding part grinds the back surface of the wafer by changing the distance between the grinding part and the back surface of the wafer.

[0047] For example, Figure 2 The above-mentioned pressure adjusting member 13 can include a controller 131, and an adjusting member 132, an elastic member 133 and a pressure sensor 134 arranged in sequence along the direction close to the grinding part 123.

[0048] For example, Figure 2 The driving end of the above-mentioned adjusting member 132 is fixedly connected with one end of the elastic member 133. The adjusting member 132 is used to adjust the deformation amount of the elastic member 133 in the direction close to or away from the grinding part 123 under the control of the controller 131. Specifically, the adjusting member 132 can push the elastic member 133 in the direction close to the grinding part 123, so that the grinding part 123 is close to the back surface of the wafer 2 by receiving the pushing force of the elastic member 133, thereby increasing the grinding pressure when the grinding part 123 grinds the back surface of the wafer 2. On the contrary, the adjusting member 132 can also reduce the pushing force of the elastic member 133 indirectly provided to the grinding part 123 by pulling the elastic member 133 in the direction away from the grinding part 123, so as to reduce the grinding pressure. The adjusting member 132 can be any component capable of providing a pushing force or a pulling force in the direction close to or away from the grinding part 123. For example: a pneumatic cylinder or a hydraulic cylinder. The elastic member 133 can be any component capable of producing elastic deformation under the action of the pushing force or the pulling force of the adjusting member 132. For example: a spring. When the adjusting member 132 is a pneumatic cylinder and the elastic member 133 is a spring, one end of the spring can be fixedly connected to the piston rod of the pneumatic cylinder by welding or the like.

[0049] For example, Figure 2One end of the pressure sensor 134 is fixedly connected to the other end of the elastic member 133. The other end of the pressure sensor 134 is in abutment with the grinding part 123. The pressure sensor 134 is used to measure the pushing force provided by the elastic member 133 to the grinding part 123 and send the measurement result to the controller 131.

[0050] Referring to Figure 2 The input end of the controller 131 is connected to the pressure sensor 134. The output end of the controller 131 is connected to the adjusting member 132. The controller 131 is used to control the operation of the adjusting member 132 according to the measurement result.

[0051] Specifically, the controller can be any device with a control function such as a mobile phone or a computer, to realize the adjustment strategy of the grinding pressure. The connection between the controller, the pressure sensor and the adjusting member can be a communication connection or an electrical connection.

[0052] In actual application, the pressure sensor is located between the elastic member and the grinding part. When the grinding member grinds the back surface of the wafer, the pressure sensor can measure the pushing force indirectly provided by the elastic member to the grinding part in real time and output the measurement result to the controller in the form of an electrical signal. When the pushing force is less than the target grinding pressure required by the grinding scheme, the controller can control the adjusting member to push the elastic member in the direction close to the grinding part according to the measurement result, so as to increase the pushing force provided by the elastic member to the grinding part, and finally increase the actual grinding pressure between the grinding part and the back surface of the wafer to the target grinding pressure. When the pushing force is greater than the target grinding pressure, the controller can control the adjusting member to pull the elastic member in the direction away from the grinding part according to the measurement result, so as to reduce the pushing force provided by the elastic member to the grinding part, and finally reduce the actual grinding pressure to the target grinding pressure. When the pushing force is equal to the target grinding pressure, the controller can control the adjusting member to keep the deformation amount of the elastic member according to the measurement result, so that the actual grinding pressure is equal to the target grinding pressure, thereby realizing the automatic control of the grinding pressure.

[0053] The embodiment of the present application also provides a method for adjusting the grinding pressure by using the grinding device provided by the above-mentioned embodiment. When the grinding device comprises a pressure adjusting member, and the pressure adjusting member comprises a controller and an adjusting member, an elastic member and a pressure sensor arranged in sequence in the direction close to the grinding part, the method comprises the following steps:

[0054] The controller obtains the pushing force provided by the elastic member to the grinding part.

[0055] For example, in the process of grinding the back surface of the wafer by the grinding member, the pushing force provided by the elastic member to the grinding part can be measured in real time by the pressure sensor described above, and the pressure sensor can send the measurement result of the measured pushing force to the controller.

[0056] The controller controls the adjusting member to adjust the deformation of the elastic member in a direction approaching or moving away from the grinding part according to the relationship between the target grinding pressure and the pushing force.

[0057] In actual application, the target grinding pressure is set in advance before the back surface of the wafer is ground by the adjusting member, and the target grinding pressure is a basis for judging whether the pushing force provided by the elastic member to the grinding part meets the requirements of the grinding scheme.

[0058] For example, the target grinding pressure can be obtained by the operator according to the grinding experience summarized from the previous grinding of the back surface of the wafer. The target grinding pressure can be pre-stored in the memory included in the controller. Of course, the target grinding pressure can also be provided to the controller in a temporary loading manner.

[0059] Specifically, the control mode of the controller on the adjusting member includes the following three cases:

[0060] The first case: if the pushing force is less than the target grinding pressure, the controller controls the adjusting member to push the elastic member in a direction approaching the grinding part.

[0061] In actual application, when the adjusting member is a pneumatic cylinder, in the case that the pushing force is less than the target pressure, the controller can control the opening degree of the pneumatic speed regulating valve between the air source and the pneumatic cylinder to be increased, so that the piston rod of the pneumatic cylinder can push the elastic member in a direction approaching the grinding part.

[0062] The second case: if the pushing force is greater than the target grinding pressure, the controller controls the adjusting member to pull the elastic member in a direction moving away from the grinding part.

[0063] The third case: if the pushing force is equal to the target grinding pressure, the controller controls the adjusting member to keep the deformation of the elastic member.

[0064] Specifically, when the pushing force is greater than or equal to the target grinding pressure, how to control the adjusting member to adjust the deformation of the elastic member by the controller can be referred to the foregoing, which will not be described here.

[0065] From the above, it can be seen that the method for adjusting the grinding pressure provided by the embodiment of the present application can accurately judge whether the grinding pressure between the grinding part and the back surface of the wafer meets the requirements of the grinding scheme according to the relationship between the target grinding pressure and the pushing force. Moreover, the adjusting member can be controlled to adjust the deformation of the elastic member in a direction approaching or moving away from the grinding part according to the relationship between the pushing force and the actual grinding pressure, so that the actual grinding pressure is equal to the target grinding pressure, thereby realizing the automatic control of the grinding pressure and ensuring that the wafer back surface can be completely removed while preventing the occurrence of grinding accidents caused by the large actual grinding pressure.

[0066] The embodiment of the present application also provides a wafer loading and unloading mechanism, which is applied to a polishing device and comprises a loading device and the grinding device provided by the above embodiment.

[0067] The loading device is used for loading a wafer onto a grinding head included in the polishing device before polishing and unloading the wafer from the grinding head after polishing.

[0068] For example, the loading device can comprise a circular pedestal, a splash-proof baffle, a wafer presence sensor and a cleaning nozzle. The bottom of the circular pedestal is provided with at least three leveling adjusting rods. Before the wafer is carried by the loading device, the angles of the leveling adjusting rods can be adjusted so that the carrying surface of the circular pedestal is parallel to the horizontal plane. A circular groove is formed in the circular pedestal, and the cleaning nozzle is arranged at the bottom of the groove. The carrying surface of the circular pedestal is provided with a conical pin for supporting the wafer and a positioning pin for limiting the position of the wafer on the carrying surface. In addition, the carrying surface of the circular pedestal is also provided with a wafer presence sensor for detecting whether the wafer is normally placed on the carrying surface. After the wafer is normally placed on the carrying surface, the cleaning nozzle can spray cleaning liquid such as ionized water to clean the wafer and the grinding head. After cleaning, the wafer can be lifted to be loaded onto the grinding head. During the cleaning process, the splash-proof baffle arranged on the outer periphery of the circular pedestal can prevent the cleaning liquid from being sprayed outside the carrying surface, avoiding affecting other workstations. After the polishing device finishes polishing the front surface of the wafer, the grinding head clamps the wafer to move above the carrying surface of the circular pedestal, and the circular pedestal can unload the wafer from the grinding head.

[0069] The grinding device is arranged on one side of the loading device. Specifically, the grinding device can be arranged on any side of the loading device as long as the two do not interfere with each other in the vertical direction. In addition, the specific circumstances of the grinding device can be referred to the foregoing, which will not be described here.

[0070] Compared with the prior art, the wafer loading and unloading mechanism provided by the embodiment of the present application further comprises the grinding device arranged on one side of the loading device, so that the wafer loading and unloading mechanism can not only load or unload the wafer on the grinding head before polishing or after polishing, but also has the function of grinding the back surface of the wafer when the wafer is in a waiting state before polishing and / or after polishing. In other words, the grinding device for removing hard particles on the back surface of the wafer is part of the wafer loading and unloading mechanism and is not an additional chemical mechanical polishing device purchased, so that the wafer loading and unloading mechanism provided by the embodiment of the present application can control the process cost while eliminating the influence of hard particles on the back surface of the wafer on the subsequent photolithography process and improving the quality of semiconductor devices.

[0071] The embodiment of the present application also provides a polishing device, which comprises the grinding device or the sheet loading and unloading mechanism provided by the above-mentioned embodiment.

[0072] Compared with the prior art, the polishing device provided by the embodiment of the present application has the same beneficial effects as the grinding device or the sheet loading and unloading mechanism provided by the above-mentioned embodiment, which will not be repeated here.

[0073] The above describes the embodiments of the present application. However, these embodiments are merely for illustrative purposes, and are not intended to limit the scope of the present application. The scope of the present application is defined by the appended claims and their equivalents. Without departing from the scope of the present application, those skilled in the art can make various substitutions and modifications, which should all fall within the scope of the present application.

Claims

1. A grinding apparatus, characterized in that, The grinding device includes: a rotating component and a grinding component disposed on one side of the rotating component; wherein, The rotating component is used to fix the relative position of the wafer and the grinding component, and to drive the wafer to rotate; the rotation axis of the wafer when it is rotating coincides with the central axis of the wafer; The grinding element has a grinding area for grinding the back side of the wafer, and the shortest vertical distance from the rotation axis of the rotating element to the edge of the grinding area is less than the radius of the wafer; the grinding element includes a support portion, a fixing portion disposed at one end of the support portion, and a grinding portion disposed at the other end of the support portion, the area between the fixing portion and the grinding portion being the grinding area; the grinding device further includes a pressure adjusting element disposed on the side of the grinding portion away from the fixing portion, the pressure adjusting element being used to adjust the grinding pressure when the grinding portion grinds the back side of the wafer; The pressure regulating component includes a controller, and an adjusting component, an elastic component, and a pressure sensor arranged sequentially along the direction close to the grinding part; the driving end of the adjusting component is fixedly connected to one end of the elastic component; one end of the pressure sensor is fixedly connected to the other end of the elastic component, and the other end of the pressure sensor abuts against the grinding part; wherein... The adjusting member is used to adjust the deformation of the elastic member in a direction closer to or further away from the grinding part under the control of the controller; The pressure sensor is used to measure the thrust provided by the elastic element to the grinding part and to send the measurement result to the controller. The input terminal of the controller is connected to the pressure sensor, and the output terminal of the controller is connected to the adjusting component. The controller is used to control the operation of the adjusting component based on the measurement result.

2. The grinding apparatus according to claim 1, characterized in that, The grinding part is a polyurethane grinding part or a sandpaper grinding part.

3. The grinding apparatus according to claim 1, characterized in that, The adjusting element is a cylinder; and / or, the elastic element is a spring.

4. A method for adjusting grinding pressure using the grinding apparatus according to claim 1 or 3, characterized in that, include: Obtain the thrust provided by the elastic element to the grinding part; If the thrust is less than the target grinding pressure, the adjusting member is controlled to push the elastic member in the direction closer to the grinding part; if the thrust is greater than the target grinding pressure, the adjusting member is controlled to pull the elastic member in the direction away from the grinding part; if the thrust is equal to the target grinding pressure, the adjusting member is controlled to maintain the deformation of the elastic member.

5. A wafer loading and unloading mechanism, characterized in that, The loading and unloading mechanism, used in polishing equipment, includes: A loading device for loading a wafer onto a grinding head included in the polishing equipment before polishing, and for removing the wafer from the grinding head after polishing; And the grinding apparatus as described in any one of claims 1 to 3, wherein the grinding apparatus is disposed on one side of the loading device.

6. A polishing device, characterized in that, It includes the grinding apparatus as described in any one of claims 1 to 3, or the loading and unloading mechanism as described in claim 5.

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