A transport structure and semiconductor apparatus

Abstract

The application discloses a center ring, a conveying structure and a semiconductor device, wherein an outer ring end surface of the center ring is provided with a first sealing groove for mounting a first O-shaped sealing ring, and vacuum cavities are distributed in the center ring. The center ring is installed at a connecting port between a first pipeline and a second pipeline of the conveying structure, so that temperature change of conveyed fluid can be effectively avoided when the fluid flows through the pipeline connecting part, and the temperature of the conveyed fluid can be maintained. Further, the conveying structure is applied to the semiconductor device as a waste gas discharge pipeline of the semiconductor device, so that pipeline blockage caused by powder formed due to heat loss of high-temperature waste gas at the pipeline connecting part can be effectively inhibited.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a delivery structure and a semiconductor device. Background Technology

[0002] Semiconductor manufacturing equipment is crucial to the quality and efficiency of semiconductor products. Some semiconductor manufacturing equipment, such as film deposition equipment, generates significant amounts of process waste gas during the semiconductor manufacturing process. If this waste gas is discharged outdoors without effective treatment, it will cause air pollution. Therefore, it needs to be discharged into a specialized waste gas treatment system through exhaust pipes. During the waste gas discharge process, as the high-temperature waste gas flows through the pipes, its temperature gradually decreases. This causes powder from the waste gas to adhere to the inside of the pipes, easily clogging them and affecting their lifespan.

[0003] Currently, the common practice is to wrap the exhaust pipe with a heating jacket to maintain a certain temperature and thus suppress powder adhesion caused by the temperature difference. However, exhaust pipes are usually composed of multiple vacuum tubes connected together. Since heating jackets cannot be installed at the pipe joints, the exhaust gas is prone to heat loss at these points, leading to powder adhesion, which can clog the pipes and affect their service life. Summary of the Invention

[0004] This application provides a conveying structure and a semiconductor device that can effectively suppress heat loss at pipe connections, help maintain the smooth flow of the semiconductor device's exhaust pipe, and extend the service life of the pipe.

[0005] Firstly, this application provides the following technical solution through an embodiment of the application:

[0006] A conveying structure for a semiconductor device is provided for conveying exhaust gas; the conveying structure includes a first pipe, a second pipe, a connector, a first O-ring, and a central ring, wherein the first pipe and the second pipe are connected through the central ring, the first O-ring, and the connector.

[0007] The central ring is installed at the connection port between the first pipe and the second pipe;

[0008] The outer ring end surface of the central ring is provided with a first sealing groove, and the first O-ring is fitted inside the first sealing groove;

[0009] The central ring contains vacuum cavities to prevent heat transfer between the interior and the outside at the connection port.

[0010] The inner ring end of the central ring is formed with a first extension and a second extension on both sides. The first extension is used to cooperate with the inner wall of the first pipe, and the second extension is used to cooperate with the inner wall of the second pipe.

[0011] When the central ring is in the installed state, the first extension protrudes from the inner wall of the first pipe and extends along the length direction of the first pipe, and the second extension protrudes from the inner wall of the second pipe and extends along the length direction of the second pipe.

[0012] The distal ends of the first extension and the second extension are inclined, and the inner diameter of the distal ends of the first extension and the second extension increases in the direction away from the connection port.

[0013] Furthermore, the volume of the vacuum cavity accounts for 15% to 85% of the volume of the central ring.

[0014] Furthermore, the vacuum cavity is an annular vacuum cavity distributed along the circumferential direction of the central ring.

[0015] Furthermore, the inner ring end of the central ring is formed with a first extension and a second extension on both sides. The first extension is used to mate with the inner wall of the first pipe, and the second extension is used to mate with the inner wall of the second pipe. Both the first extension and the second extension are provided with a second sealing groove for inserting a second O-ring seal between the inner wall of the first pipe and the first extension, and between the inner wall of the second pipe and the second extension, respectively.

[0016] Furthermore, when the central ring is in the installed state, the first extension is embedded in the inner wall of the first pipe, the second extension is embedded in the inner wall of the second pipe, and the inner ring end face of the central ring is aligned with the inner walls of the first pipe and the second pipe.

[0017] Furthermore, when the central ring is in the installed state, the first extension protrudes from the inner wall of the first pipe and extends along the length direction of the first pipe, and the second extension protrudes from the inner wall of the second pipe and extends along the length direction of the second pipe.

[0018] Furthermore, the central ring is made of stainless steel, aluminum, titanium, or polytetrafluoroethylene.

[0019] Furthermore, both the first extension and the second extension are provided with a second sealing groove, and the conveying structure also includes a second O-ring seal, which is sleeved in the second sealing groove and located between the inner wall of the first pipe and the first extension, and between the inner wall of the second pipe and the second extension, respectively.

[0020] Secondly, through one embodiment of this application, a semiconductor device is also provided, comprising: a semiconductor process cavity and the transport structure described in the second aspect above. The semiconductor process cavity is connected to a first pipe or a second pipe in the transport structure, wherein both the first pipe and the second pipe are vacuum tubes.

[0021] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0022] The central ring provided in this embodiment can serve as a support for an O-ring seal and can be installed at the connection of the exhaust pipe of a semiconductor device. The vacuum cavities distributed within the central ring achieve a heat insulation effect, effectively reducing heat loss of the exhaust gas transported in the exhaust pipe at the pipe connection. This inhibits the formation of powder adhering to the pipe connection when the exhaust gas cools, helping to maintain the unobstructed flow of the semiconductor device's exhaust pipe and extending its service life. Based on this, the conveying structure with the aforementioned central ring provided in this embodiment eliminates the need for additional insulation material at the pipe connection, conveniently and effectively reducing heat loss at the connection. Furthermore, applying this conveying structure to semiconductor devices effectively reduces powder adhesion formed when the exhaust gas cools, thereby extending the pipe cleaning cycle, reducing the non-periodic downtime rate of the equipment, increasing equipment operating efficiency, and saving on equipment maintenance costs. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of a first exemplary pipe connection portion of the conveying structure provided in the embodiments of this specification is shown;

[0025] Figure 2 A schematic diagram of a second exemplary pipe connection portion of the conveying structure provided in the embodiments of this specification is shown;

[0026] Figure 3A schematic diagram of a third exemplary pipe connection portion of the conveying structure provided in the embodiments of this specification is shown;

[0027] Figure 4 A schematic diagram of the connection structure of a semiconductor device provided in an embodiment of this specification is shown. Detailed Implementation

[0028] Embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0029] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0030] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element. Relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The term "multiple" includes two or more cases.

[0031] Firstly, one embodiment of this specification provides a conveying structure for conveying fluids such as gas or liquid. For example... Figure 1 As shown, the conveying structure includes a first pipe 11, a second pipe 12, a central ring 13, a first O-ring seal 14, and a connector (not shown in the figure). The first pipe 11 and the second pipe 22 are connected and communicate with each other through the central ring 13, the first O-ring seal 14, and the connector. It can be understood that... Figure 1 , Figure 2 and Figure 3 These are all cross-sectional views of the pipeline connection parts of the conveying structure along the radial direction.

[0032] The central ring 13 serves as a bracket for mounting the first O-ring 14 and is installed at the connection port between the first pipe 11 and the second pipe 12. A first sealing groove is provided on the outer ring end surface of the central ring 13 for mounting the first O-ring 14. The first O-ring 14 is used to seal the gaps at the pipe connection.

[0033] like Figure 1 As shown, vacuum cavities 131 are distributed within the central ring 13 to block heat transfer between the inside of the pipe connection and the outside, thus providing insulation. This prevents the temperature of the fluid being transported from changing as it flows through the pipe connection, helping to maintain the temperature of the fluid being transported. For example, when this conveying structure is used to transport high-temperature fluids such as 180°C gas or liquid, there is no need to add additional insulation material at the pipe connection. The heat insulation provided by the vacuum cavities within the central ring of the conveying structure effectively reduces heat loss of the high-temperature fluid as it flows through the pipe connection.

[0034] To achieve better thermal insulation, in one optional embodiment, the volume of the vacuum cavity 131 can occupy 15% to 85% of the total volume of the central ring. For example, assuming the volume of the central ring 13 is... V The volume of the vacuum cavities 131 distributed within the central ring 13 can be 15%. V 50% V Or 85% V Etc., the specifics will be determined based on actual needs.

[0035] The number of vacuum cavities 131 distributed within the central ring 13 can be one or more, and their specific shape and distribution can be set according to actual needs. As one implementation, the vacuum cavity 131 can be annular vacuum cavities distributed circumferentially along the central ring 13, penetrating the entire central ring 13 and concentrically positioned with it. This achieves 360° thermal insulation at the pipe connection, resulting in better thermal insulation performance.

[0036] In one alternative embodiment, the central ring 13 can be made of a corrosion-resistant, heat-resistant, and cold-resistant material, which helps to ensure a longer service life for the central ring. For example, the central ring 13 can be made of stainless steel, aluminum, titanium, or polytetrafluoroethylene.

[0037] In the embodiments described in this specification, the structural style of the central ring 13 can be varied, and can be customized according to actual needs.

[0038] In an optional embodiment, the inner ring end of the central ring 13 has a first extension 132 and a second extension 133 formed on both sides. In this case, the radial cross-sectional shape of the central ring 13 is similar to two symmetrically arranged T-shapes, such as... Figure 1 and Figure 2As shown. The first extension 132 mates with the inner wall of the first pipe 11, and the second extension 133 mates with the inner wall of the second pipe 12. It can be understood that the inner ring end of the central ring 13 is the end opposite to the outer ring end, closer to the inner side of the pipe.

[0039] At this time, the above-mentioned conveying structure also includes a second O-ring seal 15, and the first extension 132 and the second extension 133 of the central ring 13 are respectively provided with second sealing grooves. The second O-ring seal 15 is respectively fitted onto the second sealing grooves of the first extension 132 and the second extension 133. The second O-ring seal 15 is inserted between the inner wall of the first pipe 11 and the first extension 132, and between the inner wall of the second pipe and the second extension 133. On the basis of sealing the pipe connection gap by the first O-ring seal 14, the O-ring seal 15 further seals the gap between the inner wall of the first pipe 11 and the first extension 132, and between the inner wall of the second pipe 12 and the second extension 133, achieving double sealing. This can more effectively prevent the fluid being conveyed in the conveying structure from leaking at the pipe connection and affecting the external environment, which is beneficial to ensuring the safety of the conveying structure.

[0040] Specifically, the specific cooperation between the first extension 132 and the inner wall of the first pipe 11, and between the second extension 133 and the interior of the second pipe 12, can be customized according to actual needs.

[0041] In one implementation, such as Figure 1 As shown, the central ring 13 is an embedded central ring. When the central ring 13 is in the installation state, the first extension 132 is embedded in the inner wall of the first pipe 11, and the second extension 133 is embedded in the inner wall of the second pipe 12. Furthermore, in order to avoid the first extension 132 and the second extension 133 affecting the pipeline transmission efficiency, the inner ring end face of the central ring 13 is aligned with the inner wall of the first pipe 11 and the inner wall of the second pipe 12. That is, the inner ring diameter of the central ring 13 is consistent with the inner diameter of the first pipe 11 and the second pipe 12, so that the inner wall of the first pipe 11, the inner ring end face of the central ring 13, and the inner wall of the second pipe 12 transition smoothly, so that the pipeline transmission efficiency remains unchanged.

[0042] In another implementation, such as Figure 2As shown, the central ring is a protruding type. When the central ring is in the installed state, the first extension 132 protrudes from the inner wall of the first pipe 11 and extends along the length of the first pipe 11, and the second extension 133 protrudes from the inner wall of the second pipe 12 and extends along the length of the second pipe 12. At this time, the inner diameter of the central ring 13 is smaller than the inner diameters of the first pipe 11 and the second pipe 12. Compared with the above-mentioned embedded central ring, the protruding central ring is relatively easier to manufacture, but because it protrudes from the inner wall of the pipe, it may have a certain impact on the pipe transmission efficiency. Furthermore, in order to minimize the impact of the first extension 132 and the second extension 133 on the pipe transmission efficiency, the distal ends of the first extension 132 and the second extension 133 can be designed as inclined, with the inner diameter increasing as it moves away from the pipe connection port. This can effectively reduce the degree of obstruction of the protruding first extension 132 and the second extension 133 on the fluid in the pipe, thereby reducing the impact on the pipe transmission efficiency. It is understood that the distal ends of the first extension 132 and the second extension 133 refer to the ends of the first extension 132 and the second extension 133 that are far from the pipe connection port, respectively.

[0043] Of course, in other embodiments of this specification, the central ring 13 can also be a linear vacuum ring, such as... Figure 3 As shown, its radial cross-sectional shape resembles two symmetrically arranged hollow rectangles. In this case, the inner diameter of the central ring 13 is consistent with the inner diameters of the first pipe 11 and the second pipe 12. This structure is relatively simple to manufacture and does not affect the pipe transmission efficiency.

[0044] In addition to the central ring and O-ring, the above-mentioned conveying structure also requires a connector to connect the first and second pipes. In this embodiment, the connector can be an existing pipe connection device such as a pipe clamp or clamp, which will not be described in detail here.

[0045] The conveying structure provided in the embodiments of this specification can be applied to semiconductor equipment, for example, to the exhaust system of semiconductor equipment, to discharge process waste gas formed in the semiconductor process cavity to the waste gas treatment system for treatment. In this case, both the first and second pipes are vacuum tubes. The vacuum cavities distributed within the central ring provide insulation, effectively reducing heat loss at pipe connections due to the high temperature of the waste gas. This prevents the waste gas from cooling and forming powder that adheres to the pipe connections, causing blockages and corrosion of the O-rings, thus affecting the pipe's service life. Therefore, it helps maintain the unobstructed flow of the semiconductor equipment's exhaust pipes and extends their service life. Simultaneously, it also prevents some substances in the waste gas from condensing and condensing upon cooling. Furthermore, by designing the first and second extensions of the central ring, a second O-ring is installed in addition to the first O-ring, achieving double sealing and effectively preventing waste gas leakage and environmental pollution.

[0046] It should be noted that the central ring and the conveying structure including the central ring provided in the embodiments of this specification can be applied not only to semiconductor devices, but also to other scenarios that require heat preservation for air intake or exhaust, liquid intake or drainage, and where the conveying pipeline needs to be connected by multiple pipelines. For example, it can also be applied to the exhaust system of an automobile engine.

[0047] Secondly, such as Figure 4 As shown, this specification also provides a semiconductor device 20, including a semiconductor process cavity 210 and a transport structure 220. The transport structure 220 is the transport structure provided in any of the embodiments of the first aspect described above, where both the first and second pipes in the transport structure are vacuum tubes. The semiconductor process cavity is connected to the first or second pipe in the transport structure to transport gases or liquids required during semiconductor manufacturing. For example, as... Figure 4 As shown, the process waste gas in the semiconductor process chamber 210 is transported to the waste gas treatment system 30.

[0048] It should be noted that the semiconductor equipment provided in the embodiments of this specification can be a film deposition equipment such as a chemical vapor deposition equipment, a physical vapor deposition equipment, or an epitaxial furnace equipment, or other semiconductor equipment that requires the transport of gases or liquids that need to be maintained at a certain temperature through a vacuum tube; no limitation is made here. Of course, semiconductor equipment includes, but is not limited to, other types of equipment. Figure 4 In addition to the semiconductor process cavity and transport structure shown, other components are also included, which can be referred to in the structure of existing specific semiconductor equipment, and will not be described in detail here.

[0049] Because the central ring installed at the pipe connection point in the conveying structure has a vacuum cavity, it can provide heat insulation at the pipe connection point, effectively maintaining the temperature of the conveyed gas or liquid. For example, when the above-mentioned conveying structure is used to discharge process waste gas from a semiconductor process chamber, it can effectively reduce the heat loss of the high-temperature waste gas at the pipe connection point, prevent the waste gas from forming powder that adheres to the pipe connection point when it cools down, extend the pipe cleaning cycle, reduce the non-periodic downtime rate of the equipment, increase the equipment operating efficiency by 30%, and save on equipment dimension costs.

[0050] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0051] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A delivery structure, characterized by, For use in semiconductor equipment, the conveying structure is used to convey exhaust gas; the conveying structure includes a first pipe, a second pipe, a connector, a first O-ring seal, and a central ring, wherein the first pipe and the second pipe are connected through the central ring, the first O-ring seal, and the connector; The central ring is installed at the connection port between the first pipe and the second pipe; The outer ring end surface of the central ring is provided with a first sealing groove, and the first O-ring is fitted inside the first sealing groove; The central ring contains vacuum cavities to prevent heat transfer between the interior and the outside at the connection port. The inner ring end of the central ring is formed with a first extension and a second extension on both sides. The first extension is used to cooperate with the inner wall of the first pipe, and the second extension is used to cooperate with the inner wall of the second pipe. When the central ring is in the installed state, the first extension protrudes from the inner wall of the first pipe and extends along the length direction of the first pipe, and the second extension protrudes from the inner wall of the second pipe and extends along the length direction of the second pipe. The distal ends of the first extension and the second extension are inclined, and the inner diameter of the distal ends of the first extension and the second extension increases in the direction away from the connection port.

2. The delivery construct of claim 1, wherein, The volume of the vacuum cavity accounts for 15% to 85% of the volume of the central ring.

3. The delivery construct of claim 1, wherein, The vacuum cavity is an annular vacuum cavity distributed along the central ring.

4. The delivery construct of claim 1, wherein, Both the first extension and the second extension are provided with a second sealing groove, which is used to insert a second O-ring seal between the inner wall of the first pipe and the first extension, and between the inner wall of the second pipe and the second extension, respectively.

5. The delivery construct of claim 1, wherein, The central ring is made of stainless steel, aluminum, titanium, or polytetrafluoroethylene.

6. The delivery construct of claim 1, wherein, Both the first extension and the second extension are provided with a second sealing groove. The conveying structure also includes a second O-ring seal, which is fitted inside the second sealing groove and is located between the inner wall of the first pipe and the first extension, and between the inner wall of the second pipe and the second extension, respectively.

7. A semiconductor device, characterized by comprising: include: The semiconductor process cavity and the transport structure according to any one of claims 1 to 6 The semiconductor process cavity is connected to the first or second conduit in the transport structure. Both the first pipe and the second pipe are vacuum tubes.

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