Adaptive variable-pitch wafer scanning system and method

Abstract

The present invention relates to an adaptive variable-pitch wafer scanning system and method, which includes a base, a wafer scanning transmitter disposed on the base, and a wafer scanning receiver corresponding to the wafer scanning transmitter, wherein one wafer scanning transmitter and one wafer scanning receiver constitute a group of wafer scanning modules; a plurality of groups of wafer scanning modules are movably disposed on the base; and the distance between the wafer scanning modules is adjustable. During scanning, the size information of the wafer to be scanned is collected by an acquisition unit, and then the distance between the corresponding wafer scanning modules is confirmed by the size. The motor is controlled to rotate by a PLC control unit, and the distance between the wafer scanning modules is adjusted by the motor drive to achieve scanning of wafers of corresponding specifications. The adaptive variable-pitch wafer scanning system and method of the present invention can adjust the positions between sensors to meet the needs of scanning wafers of different specifications, while ensuring scanning efficiency and improving the compatibility of wafer scanning.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to an adaptive variable-pitch wafer scanning system and method. Background Art

[0002] During wafer processing, when the wafer cassette is placed on the equipment, it is necessary to obtain the distribution of the wafers in the wafer cassette. Generally, sensors are used to scan the wafers in the wafer cassette. There are generally two forms:

[0003] One form is to use a scanning sensor with a standard spacing to scan the distribution of wafers in the wafer box. For example, the invention patent with application number CN202010997692.7 discloses a wafer scanning and wafer scanning method, which uses several photoelectric emitting ends on one side and several photoelectric receiving ends on the other side. A photoelectric emitting end and a photoelectric receiving end form a group of scanning components. The photoelectric emitting end and the photoelectric receiving end in each group of scanning components are respectively placed on both sides of a wafer box to form staggered scanning.

[0004] Another form is to use a single sensor to scan the wafers one by one in one direction. Existing technologies, such as the utility model patent with application number CN202023178211.4, disclose a wafer positioning device based on an acceleration sensor. The wafer scanning sensor moves up and down along one side of the wafer box to scan the wafer.

[0005] However, both forms of scanning technology have the problem of poor compatibility. With the emergence of flexible production lines, there may be differences in the thickness of front-end and back-end wafers. Scanning sensors with standard spacing cannot meet the needs of changing wafer thickness, and the scanning efficiency is low when a single sensor moves. Summary of the Invention

[0006] In order to solve the above technical problems, the present invention provides an adaptive variable-pitch wafer scanning system and method, which can be adjusted according to the thickness change of the wafer to meet the scanning requirements of wafers and wafer boxes of different specifications.

[0007] The technical objectives of the present invention are achieved through the following technical solutions:

[0008] On the one hand, the present invention provides an adaptive variable-pitch wafer scanning system, comprising a base, a wafer scanning transmitting end arranged on the base, and a wafer scanning receiving end corresponding to the wafer scanning transmitting end, wherein a wafer scanning transmitting end and a wafer scanning receiving end constitute a group of wafer scanning modules; a plurality of groups of wafer scanning modules are movably arranged on the base; and the distance between the wafer scanning modules is adjustable.

[0009] Furthermore, the wafer scanning transmitting end includes a sensor transmitting end bracket and a sensor transmitting end, and the sensor transmitting end is installed on the sensor transmitting end bracket; the wafer scanning receiving end includes a sensor receiving end bracket and a sensor receiving end, and the sensor receiving end is installed on the sensor receiving end bracket, and the sensor transmitting end and the sensor receiving end correspond one to one; the sensor transmitting end bracket and the sensor receiving end bracket are respectively movably installed on one side of the base; the base is a lifting base.

[0010] Furthermore, screw rods for installing the sensor transmitting end bracket and the sensor receiving end bracket are respectively provided on both sides of the base, and the sensor transmitting end bracket and the sensor receiving end bracket are respectively sleeved on the outside of the screw rod; a screw rod support seat is installed at one end of the screw rod, and a power device for driving the screw rod to rotate is provided at the other end of the screw rod; springs are respectively installed between the sensor transmitting end bracket and the sensor receiving end bracket, and the springs are sleeved on the screw rod; a push block is also provided on the screw rod for pushing the sensor transmitting end bracket and the sensor receiving end bracket to move relative to the screw rod, the push block cooperates with the screw rod thread, and a limit device for limiting the rotation of the push block is also provided on the side of the push block.

[0011] Furthermore, the push block is arranged at one end close to the screw rod connected to the power device.

[0012] Furthermore, both ends of the spring between the sensor transmitting end brackets are connected to the sensor transmitting end brackets, and both ends of the spring between the sensor receiving end brackets are connected to the sensor receiving end brackets.

[0013] Furthermore, a bearing is provided on the screw rod support seat, and the screw rod is installed on the screw rod support seat through the bearing.

[0014] Furthermore, the power device is an electric motor.

[0015] The present invention also provides an adaptive variable-pitch wafer scanning method, which includes the following steps:

[0016] Step 1: The wafer is sent to the adaptive variable spacing wafer scanning system;

[0017] Step 2: The acquisition unit collects the wafer size signal, and the acquisition unit transmits the collected wafer size signal to the PLC control unit. The PLC control unit determines the motor rotation amount according to the wafer size signal and controls the motor rotation;

[0018] Step 3: The motor drives the screw to rotate, and the push block moves along the screw toward or away from the screw support seat to adjust the distance between the wafer modules;

[0019] Step 4: After the motor has completed its rotation, the PLC control unit outputs a signal to control the lifting base to rise to the wafer box position. After the rise is completed, all sensor transmitters transmit signals to the corresponding sensor receivers.

[0020] Step 5: The sensor receiving end receives the signal from the sensor transmitting end and transmits the received signal back to the PLC control unit. The PLC control unit integrates the signal and summarizes the wafer map data;

[0021] Step 6: The PLC control unit sends the map data to the computer, and the computer displays the map image of the wafer.

[0022] Furthermore, the acquisition unit is a scanning gun or a pressure sensor, which collects the size information of the wafer to provide a basis for adjusting the distance between the wafer modules.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. Compared with the one-way wafer-by-wafer scanning technology, the sensor of this invention no longer needs to scan wafer by wafer, and can complete wafer scanning in one go, greatly improving the scanning efficiency;

[0025] 2. Compared with the existing scanning system with standard spacing, the present invention can adjust the position between sensors to meet the needs of scanning wafers of different specifications; while ensuring scanning efficiency, it improves the compatibility of wafer scanning. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the adaptive variable-pitch wafer scanning system in the present invention.

[0027] Figure 2 It is a schematic diagram of the push block structure in an embodiment of the present invention.

[0028] In the figure, 1. sensor transmitting end; 2. sensor transmitting end bracket; 3. sensor receiving end; 4. sensor receiving end bracket; 5. transmitting end control motor; 6. receiving end control motor; 7. screw rod; 8. screw rod; 9. push block; 10. spring; 11. screw rod support seat; 12. bearing; 13. base; 14. limit plate. DETAILED DESCRIPTION

[0029] The technical solution of the present invention is further described below in conjunction with specific embodiments:

[0030] This embodiment provides an adaptive variable pitch wafer scanning system that can be adjusted according to the size of the wafer to improve the scanning compatibility, such as Figure 1As shown, the system includes a base 13, a wafer scanning transmitter mounted on the base 13, and a wafer scanning receiver corresponding to the wafer scanning transmitter. A wafer scanning transmitter and a wafer scanning receiver constitute a wafer scanning module. Several wafer scanning modules are movably mounted on the base 13. The distance between the wafer scanning modules is adjustable. This adjustment allows for scanning of wafers of varying sizes.

[0031] Specifically, the wafer scanning transmitting end includes a sensor transmitting end bracket 2 and a sensor transmitting end 1, and the sensor transmitting end 1 is installed on the sensor transmitting end bracket 2; the wafer scanning receiving end includes a sensor receiving end bracket 4 and a sensor receiving end 3, and the sensor receiving end 3 is installed on the sensor receiving end bracket 4, and the sensor transmitting end 1 and the sensor receiving end 3 correspond one to one; the sensor transmitting end bracket 2 and the sensor receiving end bracket 4 are respectively movably installed on one side of the base 13; the base 13 is a lifting base, and the wafer scanning module is sent to the wafer box scanning position through the lifting base to realize the scanning of the wafer in the wafer box. The base can be lifted and lowered by hydraulic devices, electric devices, and pneumatic devices.

[0032] A screw rod 7 for mounting the sensor transmitting end bracket 2 is provided on one side of the upper end of the base 13, and a screw rod 8 for mounting the sensor receiving end bracket 4 is provided on the other side of the base 13. The sensor transmitting end bracket 2 is sleeved on the outside of the screw rod 7, and the sensor receiving end bracket 4 is sleeved on the outside of the screw rod 8; a screw rod support seat 11 is installed at one end of the screw rod 7 and the screw rod 8, and the screw rod 7 and the screw rod 8 are respectively mounted on the screw rod support seat 11 through bearings, and a power device for driving the screw rod to rotate is provided at the other end of the screw rod, and the power device is The motor, specifically, one end of the screw rod 7 is connected to the transmitting end control motor 5, and one end of the screw rod 8 is connected to the receiving end control motor 6; a spring 10 is respectively installed between the sensor transmitting end bracket 2 and the sensor receiving end bracket 4, and the spring 10 is sleeved on the screw rod 7 and the screw rod 8; the screw rod 7 and the screw rod 8 are also respectively provided with a push block 9 for pushing the sensor transmitting end bracket and the sensor receiving end bracket to move relative to the screw rod, and the push block 9 is threadedly matched with the screw rod 7 and the screw rod 8, and the side of the push block 9 is also provided with a limit device for limiting the rotation of the push block 9.

[0033] The push block 9 is a square block, and a threaded hole is provided in the middle to match the screw rods 7 and 8. The limiting device is a limiting plate 14 provided at the bottom of the push block. Figure 2 As shown, the limit plate 14 is parallel to the bottom surface of the push block 9. During the rotation of the screw rods 7 and 8, the limit plate 14 can prevent the push block 9 from rotating, ensuring that the push block 9

[0034] It moves relative to screw rod 7 and screw rod 8 under the rotation of the screw rod.

[0035] The push block 9 is installed close to one end of the screw rod connected to the power device. When the push block 9 moves toward the screw rod support seat 11, it pushes the sensor transmitting end bracket 2 and the sensor receiving end bracket 4 closest to the push block 9. The corresponding sensor transmitting end bracket 2 pushes the adjacent sensor transmitting end bracket 2 through the spring, and the sensor receiving end bracket 4 pushes the adjacent sensor receiving end bracket 4 through the spring. In this process, the spring 10 is compressed equally.

[0036] When the push block 9 moves toward one end of the power device, the distance between the sensor transmitting end brackets 2 and the distance between the sensor receiving end brackets 4 increase under the action of the spring 10, thereby realizing scanning of larger wafers.

[0037] Before the spring 10 is compressed, the two ends of the spring 10 on one screw rod are in contact with the sensor receiving end bracket 2, and the two ends of the spring 10 on the other screw rod are in contact with the sensor transmitting end bracket 4; as another solution, the two ends of the spring 10 between the sensor transmitting end brackets 2 are respectively connected to the sensor transmitting end bracket 2, and the two ends of the spring 10 between the sensor receiving end brackets 4 are respectively connected to the sensor receiving end bracket 4.

[0038] This embodiment also provides an adaptive variable-pitch wafer scanning method, which includes the following steps:

[0039] Step 1: The wafer is sent to an adaptive variable-pitch wafer scanning system, which also includes an acquisition unit and a PLC control unit.

[0040] Step 2: The wafer size signal is collected by the collection unit, and the collection unit transmits the collected wafer size signal to the PLC control unit. The PLC control unit determines the motor rotation amount according to the wafer size signal and controls the motor rotation. The collection unit can be a scanner or a pressure sensor. The scanner scans the barcode or QR code on the corresponding wafer box to identify the specifications of the wafers in the wafer box. The pressure sensor can also be used to identify the weight of the wafers in the wafer box, and the corresponding wafer specifications can be identified according to the weight of the wafers in the wafer box.

[0041] Step 3: The motor drives the screw to rotate, and the push block moves along the screw toward or away from the screw support seat to adjust the distance between the wafer modules. Currently, in the wafer box (wafer boat), the slot gap of 6"×25 is 4.76mm, the slot gap of 8"×25 is 6.35mm, and the slot gap of 12"×25 is 10mm. The thickness of the wafers installed in the slots is different. Taking these three wafer boxes as an example, when the acquisition unit acquires the corresponding wafer box specifications (wafer specifications), the acquired wafer size signal is transmitted to the PLC control unit. The C control unit matches the received wafer size signal with the stored wafer size information. When the largest wafer is detected (12"×25 slot), the motor rotation amount is 0, and there is no need to adjust the distance between the wafer scanning modules. When the middle-sized wafer is detected (8"×25 slot), the motor rotates until the distance between the wafer scanning modules is equal to 6.35mm. When the smallest wafer is detected (6"×25 slot), the motor rotates until the distance between the wafer scanning modules is equal to 4.76mm.

[0042] Step 4: After the motor has completed its rotation, the PLC control unit outputs a signal to control the lifting base to rise to the wafer box position. After the rise is completed, all sensor transmitters transmit photoelectric signals to the corresponding sensor receivers.

[0043] Step 5: The sensor receiving end receives the photoelectric signal from the sensor transmitting end and transmits the received photoelectric signal back to the PLC control unit. The PLC control unit integrates the signal and summarizes the wafer map data.

[0044] Step 6: The PLC control unit sends the map data to the HMI computer, and the HMI computer displays the map image of the wafer.

[0045] This embodiment is only a further explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. Adaptive variable pitch wafer scanning system, characterized in that, The device comprises a base, a wafer scanning transmitting end arranged on the base, and a wafer scanning receiving end corresponding to the wafer scanning transmitting end. One wafer scanning transmitting end and one wafer scanning receiving end constitute a set of wafer scanning modules. Several sets of wafer scanning modules are movably arranged on the base. The distance between the wafer scanning modules is adjustable. The wafer scanning transmitting end includes a sensor transmitting end bracket and a sensor transmitting end, and the sensor transmitting end is mounted on the sensor transmitting end bracket; the wafer scanning receiving end includes a sensor receiving end bracket and a sensor receiving end, and the sensor receiving end is mounted on the sensor receiving end bracket, and the sensor transmitting end and the sensor receiving end correspond to each other one by one; the sensor transmitting end bracket and the sensor receiving end bracket are respectively movably mounted on one side of the base; the base is a lifting base; Screws for installing the sensor transmitting end bracket and the sensor receiving end bracket are respectively provided on both sides of the base, and the sensor transmitting end bracket and the sensor receiving end bracket are respectively sleeved on the outside of the screw; a screw support seat is installed at one end of the screw, and a power device for driving the screw to rotate is provided at the other end of the screw; springs are respectively installed between the sensor transmitting end bracket and the sensor receiving end bracket, and the springs are sleeved on the screw; the screw is also provided with a push block for pushing the sensor transmitting end bracket and the sensor receiving end bracket to move relative to the screw, the push block is engaged with the screw thread, and the side of the push block is also provided with a limit device for limiting the rotation of the push block, and the push block is arranged at one end close to the screw connecting the power device.

2. The adaptive variable pitch wafer scanning system according to claim 1, characterized in that: The two ends of the spring between the sensor transmitting end brackets are respectively connected to the sensor transmitting end brackets, and the two ends of the spring between the sensor receiving end brackets are respectively connected to the sensor receiving end brackets.

3. The adaptive variable pitch wafer scanning system according to claim 1, characterized in that: The screw rod support seat is provided with a bearing, and the screw rod is installed on the screw rod support seat through the bearing.

4. The adaptive variable-pitch wafer scanning system according to any one of claims 1 to 3, characterized in that: The power device is an electric motor.

5. Adaptive variable pitch wafer scanning method, characterized in that, The method comprises the following steps: Step 1: The wafer is sent to an adaptive variable pitch wafer scanning system, wherein the adaptive variable pitch wafer scanning system is as described in claim 4; Step 2: The acquisition unit collects the wafer size signal, and the acquisition unit transmits the collected wafer size signal to the PLC control unit. The PLC control unit determines the motor rotation amount according to the wafer size signal and controls the motor rotation; Step 3: The motor drives the screw to rotate, and the push block moves along the screw toward or away from the screw support seat to adjust the distance between the wafer modules; Step 4: After the motor has completed its rotation, the PLC control unit outputs a signal to control the lifting base to rise to the wafer box position. After the rise is completed, all sensor transmitters transmit signals to the corresponding sensor receivers. Step 5: The sensor receiving end receives the signal from the sensor transmitting end and transmits the received signal back to the PLC control unit. The PLC control unit integrates the signal and summarizes the wafer map data; Step 6: The PLC control unit sends the map data to the computer, and the computer displays the map image of the wafer.

6. The adaptive variable-pitch wafer scanning method according to claim 5, characterized in that: The acquisition unit is a scanning gun or a pressure sensor.

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