Infrared Image Sensors and Infrared Camera Modules

Abstract

The present application relates to an infrared image sensor and an infrared camera module, wherein the infrared image sensor includes a first integrated circuit (IC), a radian thermometer arranged on or above a surface of the first IC and configured to detect infrared rays passing through a lens module, a through hole electrically connecting the first IC and the radian thermometer, and a reflective layer arranged between the first IC and the radian thermometer, wherein the first IC includes at least one of a readout (RO) element and an image signal processing (ISP) element and at least one of an autofocus (AF) control element and an optical image stabilization (OIS) control element, the readout (RO) element is configured to perform analog processing for the radian thermometer to generate infrared sensing information, the image signal processing (ISP) element is configured to perform digital processing based on the radian thermometer to generate infrared image information, and the autofocus (AF) control element and the optical image stabilization (OIS) control element are configured to adjust the positional relationship between the lens module and the radian thermometer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0139603 filed in the Korean Intellectual Property Office on October 26, 2020, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field

[0003] The present disclosure relates to an infrared image sensor and an infrared camera module. Background Art

[0004] Infrared imaging devices that use infrared rays emitted by an object to make it visible even in a non-luminous environment are currently widely used in defense, medical, and industrial fields. In the past, infrared imaging systems were mainly developed for defense. However, in recent years, the market has been rapidly expanding, focusing on civilian fields such as vehicle visual aids and security cameras. In recent years, research and development for mobile devices and wearable devices is being conducted. Therefore, the demand for portable infrared cameras with relatively small size and using relatively low power is increasing.

[0005] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0006] The purpose of providing this summary is to introduce a selection of inventive concepts in a concise form, and these inventive concepts will be further described in the following detailed description. This summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to help determine the scope of the claimed subject matter.

[0007] In a general aspect, an infrared image sensor includes a first integrated circuit (IC), a bolometer disposed on or above a surface of the first IC and configured to detect infrared rays passing through a lens module, a through hole electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a readout (RO) element and an image signal processing (ISP) element and at least one of an autofocus (AF) control element and an optical image stabilization (OIS) control element, wherein the readout (RO) element is configured to perform analog processing for the bolometer to generate infrared sensing information, the image signal processing element is configured to perform digital processing based on the bolometer to generate infrared image information, and the autofocus (AF) control element and the optical image stabilization (OIS) control element are configured to adjust a positional relationship between the lens module and the bolometer.

[0008] The infrared image sensor may also include a second IC, which is arranged on another surface of the first IC opposite to one surface of the first IC, wherein the second IC includes at least a portion of the ISP element and can be configured to output infrared image information to the outside of the second IC, and wherein the first IC can be configured to output a value corresponding to the distance that the lens module is to move to the outside of the first IC.

[0009] The first IC may include an RO element and an ISP element, and the ISP element may be configured to convert and digitally process infrared sensing information into a digital value.

[0010] The first IC may include an ISP element, may be configured to output infrared image information to the outside of the first IC, and may be configured to output a value corresponding to a distance that the lens module is to move to the outside of the first IC.

[0011] The ISP element may be configured to extract at least one of position information and acceleration information of the lens module based on at least one of the infrared sensing information and the infrared image information, and wherein at least one of the AF control element and the OIS control element may be configured to generate a value corresponding to a distance that the lens module is to move based on at least one of the position information and the acceleration information.

[0012] At least one of the AF control element and the OIS control element may be configured to receive a detection result from at least one of the position sensor and the acceleration sensor, and output a value corresponding to a distance that the lens module is to move based on the detection result from at least one of the position sensor and the acceleration sensor to the outside of the first IC.

[0013] The first IC may include an AF control element and an OIS control element.

[0014] The infrared camera module may include an infrared image sensor, a lens module arranged to transmit infrared rays directed to the infrared image sensor, and a driver configured to drive the lens module based on a value corresponding to a distance the lens module is to move, based on at least one of an auto focus (AF) control element of the infrared image sensor and an optical image stabilization (OIS) control element of the infrared image sensor to control at least one of a position or an acceleration of the lens module.

[0015] In another general aspect, an infrared image sensor includes a first integrated circuit (IC) and a second IC stacked on each other, a bolometer arranged on or above a surface of one of the first IC and the second IC and configured to detect infrared rays passing through a lens module, a through hole electrically connecting one of the first IC and the second IC to the bolometer, and a reflective layer arranged between the bolometer and one of the first IC and the second IC, wherein the first IC includes at least one of a readout (RO) element and an image signal processing (ISP) element, the readout (RO) element being configured to perform analog processing on the bolometer to generate infrared sensing information, the image signal processing (ISP) element being configured to perform digital processing based on the bolometer to generate infrared image information, and wherein the second IC includes at least one of an autofocus (AF) control element and an optical image stabilization (OIS) control element, the autofocus (AF) control element and the optical image stabilization (OIS) control element being configured to adjust a positional relationship between the lens module and the bolometer.

[0016] The second IC may include at least a portion of the ISP element, the first IC may be configured to transmit the processing result of the remaining portion of the ISP element or the processing result of the RO element to the second IC, and the second IC may be configured to output the infrared image information to the outside of the second IC, and may be configured to output a value corresponding to the distance that the lens module is to move to the outside of the second IC.

[0017] The first IC may include an RO element and an ISP element, the ISP element may be configured to convert and digitally process infrared sensing information into a digital value, the first IC may be configured to output infrared image information to the outside of the first IC, and the second IC may be configured to output a value corresponding to a distance that the lens module is to move to the outside of the second IC.

[0018] The infrared image sensor may further include a third IC stacked on one of the first IC and the second IC or stacked between the first IC and the second IC, wherein the third IC may include at least a portion of the ISP element and may be configured to output the infrared image information to the outside of the third IC.

[0019] The first IC may include an ISP element, which may be configured to extract at least one of position information and acceleration information of the lens module based on at least one of infrared sensing information and infrared image information, and at least one of the AF control element and the OIS control element may be configured to output a value corresponding to a distance that the lens module is to move based on at least one of the position information and the acceleration information to the outside of the second IC.

[0020] At least one of the AF control element and the OIS control element may be configured to receive a detection result from at least one of the position sensor and the acceleration sensor, and may be configured to output a value corresponding to a distance that the lens module is to move based on the detection result from at least one of the position sensor and the acceleration sensor to the outside of the second IC.

[0021] The second IC may include an AF control element and an OIS control element.

[0022] The first IC and the second IC may be electrically connected to each other through a conductive pad or a through silicon via (TSV) disposed therebetween.

[0023] Other features and aspects will become apparent from the appended claims, the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 : is a view showing a structure in which an integrated circuit (IC) of the infrared image sensor according to an embodiment of the present disclosure is provided in a singular form.

[0025] FIG. 2A to FIG. 2D is a view showing a structure in which an integrated circuit (IC) of an infrared image sensor according to an embodiment of the present disclosure is provided in plural.

[0026] Figure 3A It is shown Figure 1 Block diagram of the infrared image sensor shown in .

[0027] Figure 3B It is shown Figure 2A Block diagram of the infrared image sensor shown in .

[0028] Figure 4A and Figure 4B is a block diagram illustrating an improved structure for extracting position / acceleration information that may be used for an AF / OIS control element of an infrared image sensor according to an embodiment of the present disclosure.

[0029] Figure 5 is a side view showing an infrared image sensor and an infrared camera module according to an embodiment of the present disclosure.

[0030] Figure 6 is a combined stereogram of an infrared camera module according to an embodiment of the present disclosure.

[0031] Figure 7 is an exploded perspective view of an infrared camera module according to an embodiment of the present disclosure.

[0032] Figure 8 is an exploded perspective view of an infrared camera module according to another embodiment of the present disclosure.

[0033] In all drawings and detailed description, the same reference numerals refer to the same elements. For the purpose of clarity, illustration and convenience, the drawings may not be drawn to scale, and the relative sizes, proportions and depictions of elements in the drawings may be exaggerated. DETAILED DESCRIPTION

[0034] Hereinafter, although exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, it should be noted that examples are not limited to the above-described exemplary embodiments.

[0035] The following specific embodiments are provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the present disclosure, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, except for operations that must occur in a specific order, the order of operations described herein is merely an example and is not limited to the order set forth herein, but changes that will be apparent after understanding the present disclosure may be made. In addition, for greater clarity and brevity, descriptions of features and configurations known in the art may be omitted.

[0036] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein, which will be apparent after understanding the present disclosure.

[0037] Herein, it should be noted that use of the word “may” with respect to an embodiment or example (e.g., with respect to what an embodiment or example may include or implement) means that there is at least one embodiment or example that includes or implements such feature, and all examples and embodiments are not limited thereto.

[0038] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "coupled to" another element, the element may be directly "on," "connected to," or "coupled to" another element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly coupled to" another element, there are no other elements between the element and the other element. As used herein, a "portion" of an element may include the entire element or a portion of the entire element that is less than the entire element.

[0039] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.

[0040] Although terms such as "first", "second" and "third" may be used herein to describe various components, assemblies, regions, layers or parts, these components, assemblies, regions, layers or parts are not limited by these terms. Rather, these terms are only used to distinguish one component, component, region, layer or part from another component, component, region, layer or part. Therefore, without departing from the teachings of the examples described herein, the first component, first component, first region, first layer or first part mentioned in the examples may also be referred to as the second component, second component, second region, second layer or second part.

[0041] Spatially relative terms such as "above", "higher", "below", and "lower" may be used herein for descriptive convenience to describe the relationship of one element relative to another element as shown in the accompanying drawings. In addition to covering the orientations depicted in the accompanying drawings, these spatially relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as being "above" or "higher" relative to another element will be "below" or "lower" relative to the other element. Therefore, depending on the spatial orientation of the device, the term "above" covers both "above" and "below" orientations. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0042] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the articles "a", "an" and "the" are intended to include plural forms as well. The words "include", "comprise" and "have" illustrate the presence of stated features, numbers, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, operations, components, elements and / or combinations thereof.

[0043] Due to manufacturing techniques and / or tolerances, the shapes shown in the drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include shape variations that occur during manufacturing.

[0044] The features of the examples described herein can be combined in various ways that will be apparent after understanding the present disclosure. In addition, although the examples described herein have multiple configurations, it will be apparent after understanding the present disclosure that other configurations are possible.

[0045] One aspect of the present disclosure is to provide an infrared image sensor and an infrared camera module.

[0046] Figure 1 is a view showing a structure in which an integrated circuit (IC) of an infrared image sensor according to an embodiment of the present disclosure is provided in a singular form, and Figure 3A It is shown Figure 1 Block diagram of the infrared image sensor shown in .

[0047] refer to Figure 1 , the infrared camera module 80a according to the embodiment of the present disclosure may include the infrared image sensor 40a according to the embodiment of the present disclosure, and the infrared image sensor 40a may include the bolometer 10, the reflective layer 15, the through-hole 20, and the first IC 31a.

[0048] Infrared rays (IR) may be absorbed by bolometer 10. In this case, electrical parameters (e.g., resistance value, current, voltage, etc.) of bolometer 10 may change as infrared rays (IR) are absorbed. Therefore, infrared information of a location where bolometer 10 is provided may be detected by the electrical parameters of bolometer 10.

[0049] For example, bolometer 10 may have a structure in which a plurality of bolometer units are two-dimensionally arranged. An infrared image may be generated based on a combination of infrared information of each of the plurality of bolometer units.

[0050] For example, bolometer 10 may include vanadium oxide (VO x ) and / or amorphous silicon, and can be implemented by a silicon wafer process. Therefore, the combined structure of the bolometer 10 and the first IC 31a can be effectively implemented.

[0051] When the first IC 31 a is disposed in a path of infrared rays (IR) passing through the lens module, the bolometer 10 may detect infrared rays (IR).

[0052] Reflective layer 15 may be disposed between first IC 31a and bolometer 10 and may reflect infrared rays (IR). An upper surface of first IC 31a may be used as an arrangement space for reflective layer 15. A separation distance between reflective layer 15 and bolometer 10 may correspond to 1 / 4 of a wavelength of infrared rays (IR).

[0053] Through-via 20 may electrically connect first IC 31 a and bolometer 10 , and may serve as a transmission path of electrical parameters (eg, resistance value, current, voltage, etc.) of bolometer 10 .

[0054] For example, the number of through holes 20 can be n times the number of multiple bolometer units in the bolometer 10 (where n is a natural number), and the length of the through holes 20 in the Z-axis direction can be designed so that the separation distance between the reflective layer 15 and the bolometer 10 corresponds to 1 / 4 of the wavelength of infrared light (IR).

[0055] The first IC 31 a may include at least one of a readout (RO) element that performs analog processing for the bolometer 10 to generate infrared sensing information and an image signal processing (ISP) element that performs digital processing based on the bolometer 10 to generate infrared image information.

[0056] For example, the RO element may include at least one of a bias supply circuit that supplies a bias voltage (or current) to each of a plurality of radiant heat meter units of the radiant heat meter 10, a timing circuit that controls an exposure time period of the radiant heat meter 10, and a sensing circuit that converts thermal energy integrated during the exposure time period and outputs it as infrared sensing information (e.g., an analog voltage).

[0057] For example, the ISP element may include an analog-to-digital conversion circuit that converts infrared sensing information (e.g., an analog voltage) into a digital value. The ISP element may include a non-uniformity correction (NUC) unit that removes noise from the digital value and improves the sensitivity uniformity of each position of the multiple bolometer units of the bolometer 10. The ISP element may include an image pipeline to generate infrared image information, wherein the image pipeline includes a temperature calculation unit that calculates the temperature of an object corresponding to infrared rays (IR). The ISP element may include a serial transmission unit for transmitting the infrared image information to an application processor. The serial transmission unit may use a serial peripheral interface (SPI) communication or a mobile industrial processor interface (MIPI) communication. Depending on the design, the ISP element may also include a one-time programmable (OTP) memory that stores calibration data and at least one of a phase-locked loop (PLL) circuit that generates multiple clocks.

[0058] In addition, the first IC 31 a may include at least one of an auto focus (AF) control element and an optical image stabilization (OIS) control element to adjust the positional relationship between the lens module and the bolometer 10 .

[0059] For example, the AF control element may include an AF control logic in which the positional relationship between the lens module and the bolometer 10 is configured to generate a value corresponding to a distance that the lens module moves in the Z-axis direction (e.g., infrared direction) to optimize the focus of at least one lens that may be included in the lens module in a state where the focus is not optimized. For example, the AF control logic may receive feedback of current position information and / or acceleration information of the lens module, and may generate a value corresponding to a distance that the lens module moves in the Z-axis direction through proportional-integral-differential (PID) control.

[0060] The OIS control element may include an OIS control logic in which the lens module and / or the bolometer 10 is configured to generate a value corresponding to a distance that the lens module moves in the X-axis direction and / or the Y-axis direction, so as to optically correct the occurrence of blur in the infrared image when the lens module moves in the X-axis direction and / or the Y-axis direction (e.g., in a direction perpendicular to the infrared ray) due to hand shaking of a person. For example, the OIS control logic may receive feedback on current position information and / or acceleration information of the lens module, and may generate a value corresponding to a distance that the lens module moves in the X-axis direction and / or the Y-axis direction through PID control.

[0061] Therefore, the infrared image sensor 40a according to the embodiment of the present disclosure can obtain clearer infrared image information. Since the first IC 31a may include an RO element and / or an ISP element, and may include an AF control element and an OIS control element, the infrared image sensor 40a according to the embodiment of the present disclosure may include an integrated circuit to obtain clear infrared image information, the size of the infrared image sensor 40a for obtaining clear infrared image information may be reduced, and the cost of the infrared image sensor 40a for obtaining clear infrared image information may be reduced.

[0062] Depending on the use (e.g., as a portable terminal, a mounted camera, etc.) or specifications (e.g., resolution, frame frequency of an image, color implementation, use of HDR, etc.) of the infrared image sensor 40a or the infrared camera module 80a, the first IC 31a may include only one of the AF control element and the OIS control element, or may include both the AF control element and the OIS control element.

[0063] The first IC 31a may output infrared image information to the outside of the first IC 31a, and may output a value corresponding to the distance moved by the lens module to the outside of the first IC 31a. For example, the first IC 31a may transmit the infrared image information to the application processor through the first pin, and may transmit the value corresponding to the distance moved by the lens module to the driver 53a through the second pin.

[0064] The driver 53a may be disposed on the substrate 55 or 55a. For example, the driver 53a may include a coil, may receive a driving current corresponding to a distance the lens module moves from the first IC 31a, and may interact with a magnetic structure that may be disposed in the lens module through a Lorentz force to drive the lens module.

[0065] The sensor 57a may be disposed on the substrate 55 or 55a and may sense position information and acceleration information of the lens module. For example, the sensor 57a may include a Hall sensor and may sense a magnetic flux formed by a magnetic structure that may be disposed in the lens module to sense the position of the lens module, and may include a gyro sensor to sense the acceleration of the lens module.

[0066] At least one of the AF control element and the OIS control element of the first IC 31a may receive the detection result from the sensor 57a, and may output a value corresponding to the distance moved by the lens module based on the detection result from the sensor 57a to the outside of the first IC 31a. The actuator 50 may include a driver 53a, a sensor 57a, and a substrate 55 or 55a.

[0067] refer to Figure 3A , Figure 1 The sensor 57a shown in the figure may include an acceleration sensor 57b and / or a position sensor 57c, and the first IC 31a may transmit the infrared image information to the outside of the first IC 31a (e.g., to an application processor and an interface), and may provide a value corresponding to the distance moved by the lens module (e.g., a driving current flowing through the coil) to the driver 53.

[0068] FIG. 2A to FIG. 2D is a view showing a structure in which an integrated circuit (IC) of an infrared image sensor according to an embodiment of the present disclosure is provided in plural form, and Figure 3B It is shown Figure 2A Block diagram of the infrared image sensor shown in .

[0069] refer to Figure 2A , the infrared camera module 80b according to the embodiment of the present disclosure may include the infrared image sensor 40b according to the embodiment of the present disclosure, and the infrared image sensor 40b may include a plurality of ICs 30b stacked on each other.

[0070] For example, the plurality of ICs 30b may be coupled to each other through conductive pads or through silicon vias (TSVs) provided between the plurality of ICs 30b without interposing a substrate such as a printed circuit therebetween.

[0071] Therefore, the size of multiple ICs 30b can be Figure 1The size of the first IC 31a shown in FIG. 1 is substantially different. For example, when the length of the plurality of ICs 30b in the Z-axis direction is greater than Figure 1 When the length of the first IC 31a in the Z-axis direction is shown in FIG, the size of the plurality of ICs 30b in the X-axis direction and / or the Y-axis direction may be smaller than Figure 1 The size of the first IC 31 a in the X-axis direction and / or the Y-axis direction is shown in FIG.

[0072] The plurality of ICs 30b may include a first IC 31b and a second IC 32b disposed on a lower surface of the first IC 31b. The first IC 31b may include a readout (RO) element, may include an AF control element and / or an OIS control element, and may output a value corresponding to a distance moved by the lens module to the outside of the first IC 31b. The second IC 32b may include Figure 1 At least a part of the ISP component of the first IC 31a shown in the figure can replace at least a part of the ISP component of the first IC 31b, and can receive infrared sensing information from the first IC 31b, and can output infrared image information to the outside of the second IC 32b.

[0073] refer to Figure 3B , the first IC 31b can provide a value corresponding to the distance moved by the lens module (e.g., a driving current flowing through the coil) to the driver 53, and can provide infrared sensing information to the second IC 32b, and the second IC 32b can transmit the infrared image information to the outside of the second IC 32b (e.g., to an application processor and an interface).

[0074] refer to Figure 2B The infrared camera module 80c according to the embodiment of the present disclosure may include the infrared image sensor 40c according to the embodiment of the present disclosure, and the infrared image sensor 40c may include a plurality of ICs 30c stacked on each other. The plurality of ICs 30c may include a first IC 31c and a second IC 32c.

[0075] The first IC 31c may include an RO element, and may provide infrared sensing information corresponding to a processing result of the RO element or a processing result of a portion of the ISP element to the second IC 32c. The second IC 32c may include at least a portion of the ISP element, may include an AF control element and / or an OIS control element, and may output infrared image information and a value corresponding to a distance moved by the lens module to the outside of the second IC 32c.

[0076] refer to Figure 2CThe infrared camera module 80d according to the embodiment of the present disclosure may include the infrared image sensor 40d according to the embodiment of the present disclosure, and the infrared image sensor 40d may include a plurality of ICs 30d stacked on each other. The plurality of ICs 30d may include a first IC 31d and a second IC 32d.

[0077] The first IC 31d may include an RO element and / or an ISP element and may output infrared image information to the outside of the first IC 31d. The second IC 32d may include an AF control element and / or an OIS control element and may output a value corresponding to a distance moved by the lens module to the outside of the second IC 32d.

[0078] refer to Figure 2D The infrared camera module 80e according to the embodiment of the present disclosure may include the infrared image sensor 40e according to the embodiment of the present disclosure, and the infrared image sensor 40e may include a plurality of ICs 30e stacked on each other. The plurality of ICs 30e may include a first IC 31e, a second IC 32e, and a third IC 33e.

[0079] The third IC 33e may be stacked on one of the first IC 31e and the second IC 32e, or may be stacked between the first IC 31e and the second IC 32e. For example, the third IC 33e may be electrically connected to the first IC 31e and the second IC 32e through TSVs 35e or conductive pads 36e.

[0080] The first IC 31e may include an RO element and may provide infrared sensing information to the third IC 33e. The second IC 32e may include an AF control element and / or an OIS control element and may output a value corresponding to a distance moved by the lens module to the outside of the second IC 32e. The third IC 33e may include an ISP element and may output infrared image information to the outside of the third IC 33e.

[0081] Figure 4A and Figure 4B is a block diagram illustrating an improved structure for extracting position / acceleration information that may be used for an AF / OIS control element of an infrared image sensor according to an embodiment of the present disclosure.

[0082] refer to Figure 4A , the infrared camera module 80f according to the embodiment of the present disclosure may include the infrared image sensor 40f according to the embodiment of the present disclosure, and the first IC 31f may include the RO element 30-1, the ISP element 30-2, and the AF / OIS element 30-3.

[0083] For example, the first IC 31f may further include a position / acceleration detection element 30-4. The position / acceleration detection element 30-4 may extract position information and / or acceleration information of the lens module based on infrared sensing information generated by the RO element 30-1 and / or infrared image information generated by the ISP element 30-2. The position / acceleration detection element 30-4 may be a part of the ISP element 30-2.

[0084] For example, the position / acceleration detection element 30-4 can generate position information corresponding to the distance between the position of a specific pixel of the infrared image information at time (t) and the position of a specific pixel of the infrared image information at time (t+1), and can generate acceleration information based on the relationship between the position of the specific pixel at time (t), the position of the specific pixel at time (t+1), and the position of the specific pixel at time (t-1).

[0085] Therefore, the infrared camera module 80f according to an embodiment of the present disclosure may omit a position sensor and / or an acceleration sensor according to the design.

[0086] The AF / OIS element 30 - 3 may provide the driver 53 with a value corresponding to a distance moved by the lens module based on position information and / or acceleration information generated by the position / acceleration detection element 30 - 4 .

[0087] refer to Figure 4B , the infrared camera module 80g according to the embodiment of the present disclosure may include the infrared image sensor 40g according to the embodiment of the present disclosure, and the first IC 31g may include the RO element 30-1 and the ISP element 30-2, and the second IC 32g may include the AF / OIS element 30-3 and the position / acceleration detection element 30-4. The position / acceleration detection element 30-4 may be a part of the ISP element 30-2.

[0088] Figure 5 is a side view showing an infrared image sensor and an infrared camera module according to an embodiment of the present disclosure.

[0089] refer to Figure 5 , the infrared camera module 80h according to an embodiment of the present disclosure may include the infrared image sensor 40h according to an embodiment of the present disclosure.

[0090] The infrared camera module 80h may include a substrate having a first portion 55b-1, a second portion 55b-2, and a third portion 55b-3. For example, the substrate may be implemented as a flexible printed circuit board (FPCB), and the normal directions of the upper surfaces of the first portion 55b-1, the second portion 55b-2, and the third portion 55b-3 may be different directions. The substrate may be surrounded by a shielding shell 64.

[0091] The infrared image sensor 40h may be disposed in the third portion 55b-3 of the substrate, and may be electrically connected to the wiring of the substrate.

[0092] The first driver 53b-1 may be disposed on the first portion 55b-1 of the substrate, may receive a value generated based on the OIS element through the infrared image sensor 40h and the substrate, and may form a first driving force for the lens module 63 according to the received value. In this case, the bead bearings 72 and 73 may be rotated by the first driving force, and the lens module 63 may be moved in the X-axis direction and / or the Y-axis direction by the rotation of the bead bearings 72 and 73. The first driver 53b-1 may include a first coil, and may interact with the first magnet 51b-1 disposed on the lens module 63 to generate the first driving force.

[0093] The second driver 53b-2 may be provided on the second portion 55b-2 of the substrate, may receive a value generated based on the AF element through the infrared image sensor 40h and the substrate, and may form a second driving force for the lens module 63 according to the received value. In this case, the bead bearing 71 may be rotated by the second driving force, and the lens module 63 may be moved in the Z-axis direction by the rotation of the bead bearing 71. The second driver 53b-2 may include a second coil, and may interact with a second magnet 51b-2 provided on the lens module 63 to generate the second driving force.

[0094] The frame 62 may support the bead bearings 71 , 72 , and 73 to move the lens module 63 according to rotation of the bead bearings 71 , 72 , and 73 .

[0095] Figure 6 is a combined stereogram of an infrared camera module according to an embodiment of the present disclosure.

[0096] refer to Figure 6 , the infrared camera module 100 may include a housing unit 110 and a lens barrel 120, and the housing unit 110 may include a housing 111 and a shielding shell 112. The infrared camera module 100 may include at least one of an automatic focus control function and a hand shake correction function. For example, in order for the infrared camera module 100 to perform the automatic focus control function and the hand shake correction function, the lens barrel 120 may be moved inside the housing unit 110 in the optical axis direction and in a direction perpendicular to the optical axis, respectively.

[0097] Figure 7 is an exploded perspective view of an infrared camera module according to an embodiment of the present disclosure.

[0098] refer to Figure 7, an infrared camera module 200 according to an embodiment of the present disclosure may include a shielding case 210 , a lens module 220 , a housing 230 , a stopper 240 , an actuator 250 , and a bead bearing unit 270 .

[0099] The lens module 220 may include a lens barrel 221 and a lens holder 223 accommodating the lens barrel 221 therein.

[0100] The lens barrel 221 may have a hollow cylindrical shape to accommodate a plurality of lenses for photographing an object therein, and the plurality of lenses may be arranged in the lens barrel 221 in the optical axis direction 1. According to the design of the lens module 220, the plurality of lenses may be stacked multiple times as needed, and may respectively have the same or different optical properties, such as refractive index.

[0101] The lens barrel 221 may be coupled to the lens holder 223. For example, the lens barrel 221 may be inserted into a hollow portion provided in the lens holder 223, and the lens barrel 221 and the lens holder 223 may be coupled by a threaded connection method or by an adhesive. The lens module 220 may be accommodated in the housing 230 and may be moved in the optical axis direction 1 for automatic focusing control.

[0102] The actuator 250 may drive the lens module 220 in the optical axis direction 1. In order to move the lens module 220 in the optical axis direction 1, the actuator 250 may include a magnet 251 mounted on one side of the lens holder 223 and a driving coil 253 disposed opposite to the magnet 251. The driving coil 253 may be mounted on a substrate 255, and the substrate 255 may be mounted on the housing 230 such that the driving coil 253 is opposite to the magnet 251.

[0103] The actuator 250 may apply a driving signal to the driving coil 253. The actuator 250 may have an H-bridge circuit capable of driving in two directions, and may apply a driving signal to the driving coil 253 by a voice coil motor method.

[0104] The actuator 250 may apply a driving signal to the driving coil 253 to move the lens module 220 in the optical axis direction 1. Specifically, the actuator 250 may apply a driving signal to the driving coil 253 to provide a driving force to the magnet 251, and the lens module 220 may move in the optical axis direction 1 by the driving force of the magnet 251. When the driving signal is applied to the driving coil 253, a magnetic flux may be generated in the driving coil 253, and the magnetic flux of the driving coil 253 may interact with the magnetic field of the magnet 251 to generate a driving force for moving the lens module 220 in the optical axis direction 1 according to Fleming's left-hand rule.

[0105] The magnet 251 may include a first magnet and a second magnet. The first magnet and the second magnet may be formed by polarizing the magnet 251, and thus the lens module 220 may be easily moved. The magnet 251 may be used for the actuator 250 to detect the position of the lens module 220.

[0106] The actuator 250 may include a sensing coil 257 that is opposite to the magnet 251 and mounted on the substrate 255. The sensing coil 257 may be disposed outside the driving coil 253 and may be configured as follows: Figure 7 As shown in , the sensing coil 257 may be provided as at least one coil.

[0107] The inductance of the sensing coil 257 may vary according to the position of the magnet 251. Specifically, when the magnet 251 moves in one direction, the magnetic field strength of the magnet 251 affecting the inductance of the sensing coil 257 may be changed, and thus, the inductance of the sensing coil 257 may be changed.

[0108] The actuator 250 may determine the displacement of the lens module 220 according to the change in inductance of the sensing coil 257. For example, the actuator 250 may further include at least one capacitor, and the at least one capacitor and the sensing coil 257 may form a predetermined oscillation circuit. For example, at least one capacitor may be provided to correspond to the number of the sensing coils 257, and one capacitor and a corresponding one sensing coil 257 may be configured to have the same form as a predetermined LC oscillator. In addition to the above, at least one capacitor and the sensing coil 257 may be configured to have the same form as a Colpitts oscillator known in the art.

[0109] The actuator 250 can determine the displacement of the lens module 220 according to the frequency change of the oscillation signal generated by the oscillation circuit. Specifically, when the inductance of the sensing coil 257 forming the oscillation circuit changes, the frequency of the oscillation signal generated by the oscillation circuit can be changed, and thus the displacement of the lens module 220 can be detected based on the frequency change.

[0110] As a guide device for guiding the movement of the lens module 220 when the lens module 220 moves in the housing 230 in the optical axis direction 1, a bead bearing unit 270 may be provided. The bead bearing unit 270 may include one or more bead bearings. When a plurality of bead bearings are provided, the plurality of bead bearings may be disposed in the optical axis direction 1. The bead bearing unit 270 may contact the outer surface of the lens holder 223 and the inner surface of the housing 230 to guide the movement of the lens module 220 in the optical axis direction 1. For example, the bead bearing unit 270 may be disposed between the lens holder 223 and the housing 230, and may guide the movement of the lens module 220 by a rolling motion in the optical axis direction 1.

[0111] The stopper 240 may be mounted on the housing 230 to limit the moving distance of the lens module 220. For example, the stopper 240 may be mounted on the upper portion of the housing 230, and when power is not applied to the driving coil 253, the stopper 240 and the lens module 220 may be arranged to be spaced apart in the optical axis direction 1. Therefore, when power is applied to the driving coil 253 to move the lens module 220 in the optical axis direction 1, the moving distance of the lens module 220 may be limited by the stopper 240, so that the lens module 220 may move within the range of the gap with the stopper 240. Since the stopper 240 and the lens module 220 may collide with each other, the stopper 240 may be formed of a material having elasticity to mitigate the impact of the collision.

[0112] The shield case 210 may be coupled to the housing 230 to surround an outer surface of the housing 230 , and may serve to shield electromagnetic waves generated during driving of the infrared camera module 200 .

[0113] When the infrared camera module 200 is driven, electromagnetic waves may be generated. When such electromagnetic waves are emitted externally, the electromagnetic waves may affect other electronic components to cause communication failure or malfunction. In order to prevent this, the shielding shell 210 may be formed of a metal material and may be grounded to a ground pad of a substrate mounted on the lower portion of the housing 230 to shield the electromagnetic waves. When the shielding shell 210 is set as a plastic injection material, a conductive paint may be applied to the inner surface of the shielding shell 210 to shield the electromagnetic waves. Conductive epoxy resin may be used as a conductive paint, but the present disclosure is not limited thereto. Various materials having conductivity may be used as conductive paints, and a method of attaching a conductive film or a conductive tape to the inner surface of the shielding shell 210 may also be used.

[0114] Figure 8 is an exploded perspective view of an infrared camera module according to another embodiment of the present disclosure.

[0115] refer to Figure 8 , an infrared camera module 300 according to another embodiment of the present disclosure may include a housing unit 310 , an actuator unit 320 , and a lens module 330 .

[0116] The housing unit 310 may include a housing 311 and a shielding shell 312. The housing 311 may be formed of a material that can be easily molded. For example, the housing 311 may be formed of a plastic material. One or more actuator units 320 may be mounted on the housing 311. For example, a portion of the first actuator 321 may be mounted on a first side surface of the housing 311, and a portion of the second actuator 322 may be mounted on the second side surface to the fourth side surface of the housing 311. The housing 311 may be configured to accommodate the lens module 330 therein. For example, a space in which the lens module 330 is fully or partially accommodated may be formed inside the housing 311.

[0117] The housing 311 may have six open surfaces. For example, a hole for mounting an infrared image sensor may be formed on the lower surface of the housing 311, and a hole for mounting a lens module 330 may be formed on the upper surface of the housing 311. In addition, a hole into which the first driving coil 321a of the first actuator 321 is inserted may be formed on the first side surface of the housing 311, and a hole into which the second driving coil 322a of the second actuator 322 is inserted may be formed on the second to fourth side surfaces of the housing 311.

[0118] The shield shell 312 may be configured to cover a portion of the housing 311. For example, the shield shell 312 may be configured to cover the upper surface and four side surfaces of the housing 311. In addition, differently from this, the shield shell 312 may be configured to cover only the four side surfaces of the housing 311, or the shield shell 312 may be configured to partially cover the upper surface and four side surfaces of the housing 311.

[0119] The actuator unit 320 may include a plurality of actuators. For example, the actuator unit 320 may include a first actuator 321 configured to move the lens module 330 in the Z-axis direction and a second actuator 322 configured to move the lens module 330 in the X-axis direction and the Y-axis direction.

[0120] The first actuator 321 may be mounted on the housing 311 and the first frame 331 of the lens module 330. For example, a portion of the first actuator 321 may be mounted on a first side surface of the housing 311, and the remaining portion of the first actuator 321 may be mounted on a first side surface of the first frame 331. The first actuator 321 may be mounted in the optical axis direction (in the Figure 8 The lens module 330 is moved in the Z-axis direction of the housing 311. For example, the first actuator 321 may include a first driving coil 321a, a first magnet 321b, a first substrate 321c, and at least one first sensing coil 321d. The first driving coil 321a and the at least one first sensing coil 321d may be formed on the first substrate 321c. The first substrate 321c may be mounted on a first side surface of the housing 311, and the first magnet 321b may be mounted on a first side surface of the first frame 331 opposite to the first substrate 321c.

[0121] The first actuator 321 may apply a driving signal to the first driving coil 321a. The first actuator 321 may have an H-bridge circuit capable of driving in two directions, and may apply a driving signal to the first driving coil 321a by a voice coil motor method. When the driving signal is applied to the first driving coil 321a, a magnetic flux may be generated in the first driving coil 321a. The magnetic flux of the first driving coil 321a may interact with the magnetic field of the first magnet 321b to generate a driving force that enables the first frame 331 and the lens barrel 334 to move relative to the housing 311. Figure 7 Similar to the actuator 250 of FIG. 3 , the first actuator 321 may determine the displacement of the lens barrel 334 and the first frame 331 according to the inductance change of at least one first sensing coil 321 d. As shown, the first magnet 321 b may be disposed on one surface 331 c of the first frame 331, and differently from this, the first magnet 321 b may be disposed on one of the edges 331 d of the first frame 331.

[0122] The second actuator 322 may be mounted on the housing 311 and the third frame 333 of the lens module 330. For example, a portion of the second actuator 322 may be mounted on the second to fourth side surfaces of the housing 311, and the remaining portion of the second actuator 322 may be mounted on the second to fourth side surfaces of the third frame 333. Alternatively, the second actuator 322 may be mounted on the second edge to the fourth edge where the first to fourth side surfaces of the housing 311 and the third frame 333 contact each other. In the above description, it has been described that the second actuator 322 may be formed on the second to fourth sides or the second to fourth edges, but the actuators formed on the corresponding side surfaces or the corresponding edges may independently provide a driving force to the lens module 330. Therefore, according to an embodiment, the second actuator 322 may be formed on a portion of the second to fourth side surfaces. Hereinafter, for the sake of convenience of explanation, it may be assumed that the actuator formed on the second side surface may be the second actuator 322. However, the following description may be applied to actuators formed on other side surfaces or other edges.

[0123] The second actuator 322 may move the lens barrel 334 in a direction perpendicular to the optical axis. For example, the second actuator 322 may include a second drive coil 322a, a second magnet 322b, a second substrate 322c, and at least one second sensing coil 322d. The second drive coil 322a and the at least one second sensing coil 322d may be formed on the second substrate 322c. The second substrate 322c may be generally formed to have a "C" shape and may be installed to surround the second side surface to the fourth side surface of the housing 311. The second magnet 322b may be installed on the second side surface to the fourth side surface of the third frame 333 to be opposite to the second substrate 322c.

[0124] The second actuator 322 can change the magnitude and direction of the magnetic force generated between the second driving coil 322a and the second magnet 322b to enable the second frame 332 or the third frame 333 to move relatively. The lens barrel 334 can move in the same direction as the second frame 332 or the third frame 333 by the movement of the second frame 332 or the third frame 333.

[0125] and Figure 7 Similar to the actuator 250 , the second actuator 322 may detect the position of the second frame 332 or the position of the third frame 333 according to a change in inductance of the at least one second sensing coil 322 d.

[0126] The lens module 330 may be mounted on the housing unit 310. For example, the lens module 330 may be accommodated in a storage space formed by the housing 311 and the shield case 312 to be movable in at least three axis directions.

[0127] The lens module 330 may include a plurality of frames. For example, the lens module 330 may include a first frame 331, a second frame 332, and a third frame 333. The first frame 331 may be movable relative to the housing 311. For example, the first frame 331 may be moved in the optical axis direction (Z-axis direction) of the housing 311 by the first actuator 321 described above. A plurality of guide grooves 331a and 331b may be formed in the first frame 331. For example, a first guide groove 331a extending in the optical axis direction (Z-axis direction) may be formed on a first side surface of the first frame 331, for example, the first guide groove 331a may be formed on two edges of the first side surface of the first frame 331, respectively. For example, a second guide groove 331b extending in the first horizontal direction (Y-axis direction) may be formed on four edges of the inner bottom surface of the first frame 331, respectively. The first frame 331 may be manufactured in a form having at least three side surfaces opened therein. For example, the second to fourth side surfaces of the first frame 331 may be opened so that the second magnet 322 b on the third frame 333 and the second driving coil 322 a on the housing 311 are opposite to each other.

[0128] The second frame 332 may be mounted on the first frame 331. For example, the second frame 332 may be mounted in the inner space of the first frame 331. The second frame 332 may move in the first horizontal direction (Y-axis direction) relative to the first frame 331. For example, the second frame 332 may move in the first horizontal direction (Y-axis direction) along the second guide groove 331b of the first frame 331. A plurality of guide grooves 332a may be formed in the second frame 332. For example, four third guide grooves 332a extending in the second horizontal direction (X-axis direction) may be formed on the edge of the second frame 332.

[0129] The third frame 333 may be mounted on the second frame 332. For example, the third frame 333 may be mounted on the upper surface of the second frame 332. The third frame 333 may be configured to move in a second horizontal direction (X-axis direction) relative to the second frame 332. For example, the third frame 333 may move in a second horizontal direction (X-axis direction) along the third guide groove 332a of the second frame 332. A plurality of second magnets 322b may be mounted on the third frame 333. For example, at least two second magnets 322b may be mounted on the second side surface to the fourth side surface of the third frame 333, respectively, and for example, three second magnets 322b may be mounted on the second side surface to the fourth side surface of the third frame 333, respectively.

[0130] The third frame 333 may be integrally formed with the second frame 332. In this case, the third frame 333 may be omitted, and the second frame 332 may be movable in the first horizontal direction (Y-axis direction) and the second horizontal direction (X-axis direction).

[0131] The lens module 330 may include a lens barrel 334. For example, the lens module 330 may include a lens barrel 334 including one or more lenses. The lens barrel 334 may be mounted on the third frame 333. For example, the lens barrel 334 may be inserted into the third frame 333 to move integrally with the third frame 333. The lens barrel 334 may move in the optical axis direction (Z axis direction) and in the horizontal direction (X axis direction and Y axis direction). For example, the lens barrel 334 may move in the optical axis direction (Z axis direction) by the first actuator 321, and may move in the horizontal direction (X axis direction and Y axis direction) by the second actuator 322.

[0132] The bead bearing unit 340 may guide the movement of the lens module 330. For example, the bead bearing unit 340 may be configured to smoothly move the lens module 330 in the optical axis direction and in the horizontal direction. The bead bearing unit 340 may include a first bead bearing 341, a second bead bearing 342, and a third bead bearing 343. For example, the first bead bearing 341 may be disposed in a first guide groove 331a of the first frame 331 to smoothly move the first frame 331 in the optical axis direction. As another example, the second bead bearing 342 may be disposed in a second guide groove 331b of the first frame 331 to smoothly move the second frame 332 in the first horizontal direction. As another example, the third bead bearing 343 may be disposed in a third guide groove 332a of the second frame 332 to smoothly move the third frame 333 in the second horizontal direction.

[0133] The first ball bearing 341 may have at least three balls disposed in the first guide groove 331a, or when there is more than one first guide groove 331a, the first ball bearing 341 may have at least three balls disposed in each of the first guide grooves 331a. In addition, each of the second ball bearing 342 and the third ball bearing 343 may have four balls, and the four balls of each ball bearing may be disposed in the second guide groove 331b and the third guide groove 332a, respectively.

[0134] A lubricating material for reducing friction and noise may be filled in all parts in which the ball bearing unit 340 is provided. For example, a viscous fluid may be injected into each of the guide grooves 331a, 331b, and 332a. Grease having excellent viscosity and lubrication properties may be used as the viscous fluid.

[0135] According to one or more embodiments of the present disclosure, an infrared image sensor and an infrared camera module may obtain clear infrared sensing information and / or infrared image information, and may reduce their size and / or implementation cost.

[0136] Infrared camera module, infrared image sensor, bolometer, first IC, second IC, third IC, driver, interface, RO element, ISP element, AF element, OIS element, AF control element, OIS control element, AF / OIS element, AF / OIS control element, control element, acceleration detection element, position detection element, position / acceleration detection element, position sensor, acceleration sensor, infrared image sensor, object detector, moving object detection device, processor, memory, depth sensor, color sensor, and references herein Figures 1 to 8Other equipment, devices, units, modules and components described are implemented or represent hardware components by hardware components. Where appropriate, examples of hardware components that can be used to perform the operations described in this application include controllers, sensors, generators, drivers, memories, comparators, arithmetic logic units, adders, subtractors, multipliers, dividers, integrators, circuits, and any other electronic components configured to perform the operations described in this application. In other examples, one or more hardware components performing the operations described in this application are implemented by computing hardware, for example, by one or more processors or computers. A processor or computer may be implemented by one or more processing elements (such as, logic gate arrays, controllers and arithmetic logic units), digital signal processors, microcomputers, programmable logic controllers, field programmable gate arrays, programmable logic arrays, microprocessors, or combinations of any other devices or devices configured to respond and execute instructions in a limited manner to achieve desired results. In one example, a processor or computer includes one or more memories storing instructions or software executed by a processor or computer, or is connected to one or more memories storing instructions or software executed by a processor or computer. The hardware components implemented by a processor or a computer can execute instructions or software, such as an operating system (OS) and one or more software applications running on the OS to perform the operations described in this application. The hardware components can also access, manipulate, process, create and store data in response to executing instructions or software. For simplicity, the singular term "processor" or "computer" can be used to describe the examples described in this application, but in other examples, multiple processors or computers can be used, or the processor or computer can include multiple processing elements or multiple types of processing elements or multiple processing elements and multiple types of processing elements. For example, a single hardware component or two or more hardware components can be implemented by a single processor or two or more processors or a processor and a controller. One or more hardware components can be implemented by one or more processors or a processor and a controller, and one or more other hardware components can be implemented by one or more other processors or another processor and another controller. One or more processors or a processor and a controller can implement a single hardware component or two or more hardware components. The hardware components may have any one or more of different processing configurations, examples of which include a single processor, independent processors, parallel processors, single instruction single data (SISD) multiprocessing, single instruction multiple data (SIMD) multiprocessing, multiple instruction single data (MISD) multiprocessing, and multiple instruction multiple data (MIMD) multiprocessing.

[0137] Although specific exemplary embodiments have been shown and described above, it will be apparent after understanding the present disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein should be interpreted in a descriptive sense only, and not for limiting purposes. The description of the features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order, and / or if the components in the described system, architecture, device or circuit are replaced or supplemented in a different manner and / or with other components or their equivalents. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the appended claims and their equivalents, and all variations within the scope of the appended claims and their equivalents should be understood to be included in the present disclosure.

Claims

1. An infrared image sensor, comprising: First integrated circuit; a bolometer disposed on or above a surface of the first integrated circuit and configured to detect infrared light passing through the lens module; a through hole electrically connecting the first integrated circuit and the bolometer; as well as a reflective layer disposed between the first integrated circuit and the bolometer, Wherein, the first integrated circuit comprises: at least one of a readout element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal processing element configured to perform digital processing based on the bolometer to generate infrared image information; and At least one of an autofocus control element and an optical image stabilization control element, wherein the autofocus control element and the optical image stabilization control element are configured to adjust a positional relationship between the lens module and the bolometer.

2. The infrared image sensor according to claim 1, further comprising a second integrated circuit, the second integrated circuit being arranged on another surface of the first integrated circuit opposite to the one surface of the first integrated circuit, in, The second integrated circuit includes at least a portion of the image signal processing element and is configured to output the infrared image information to the outside of the second integrated circuit, and The first integrated circuit is configured to output a value corresponding to a distance that the lens module is to move to the outside of the first integrated circuit.

3. The infrared image sensor according to claim 1, wherein: The first integrated circuit includes the readout element and the image signal processing element, and The image signal processing element is configured to convert and digitally process the infrared sensing information into digital values.

4. The infrared image sensor according to claim 1, wherein: The first integrated circuit includes the image signal processing element, the first integrated circuit is configured to output the infrared image information to the outside of the first integrated circuit, and the first integrated circuit is configured to output a value corresponding to a distance that the lens module is to move to the outside of the first integrated circuit.

5. The infrared image sensor according to claim 4, wherein: The image signal processing element is configured to extract at least one of position information and acceleration information of the lens module based on at least one of the infrared sensing information and the infrared image information, and Wherein, at least one of the automatic focusing control element and the optical image stabilization control element is configured to generate a value corresponding to a distance that the lens module is to move based on at least one of the position information and the acceleration information.

6. The infrared image sensor according to claim 1, wherein: At least one of the autofocus control element and the optical image stabilization control element is configured to receive a detection result from at least one of a position sensor and an acceleration sensor, and output a value corresponding to a distance that the lens module is to move based on the detection result from at least one of the position sensor and the acceleration sensor to the outside of the first integrated circuit.

7. The infrared image sensor according to claim 1, wherein: The first integrated circuit includes the auto focus control element and the optical image stabilization control element.

8. An infrared camera module, comprising: The infrared image sensor according to claim 1; a lens module arranged to transmit infrared rays directed toward the infrared image sensor; a sensor configured to detect at least one of a position or an acceleration of the lens module and configured to provide a detection result to the infrared image sensor; as well as A driver is configured to drive the lens module based on a value corresponding to a distance that the lens module is to move, based on at least one of an autofocus control element of the infrared image sensor and an optical image stabilization control element of the infrared image sensor, so as to control at least one of a position or an acceleration of the lens module.

9. An infrared image sensor, comprising: A first integrated circuit and a second integrated circuit, stacked on each other; a bolometer disposed on or above a surface of one of the first integrated circuit and the second integrated circuit and configured to detect infrared rays passing through the lens module; a through-hole electrically connecting one of the first integrated circuit and the second integrated circuit to the bolometer; as well as a reflective layer disposed between the bolometer and one of the first integrated circuit and the second integrated circuit, wherein the first integrated circuit includes at least one of a readout element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal processing element configured to perform digital processing based on the bolometer to generate infrared image information, and The second integrated circuit includes at least one of an automatic focusing control element and an optical image stabilization control element, and the automatic focusing control element and the optical image stabilization control element are configured to adjust the positional relationship between the lens module and the radiation heat meter.

10. The infrared image sensor according to claim 9, wherein: The second integrated circuit includes at least a portion of the image signal processing element, wherein the first integrated circuit is configured to transmit the processing result of the remaining part of the image signal processing element or the processing result of the readout element to the second integrated circuit, and The second integrated circuit is configured to output the infrared image information to the outside of the second integrated circuit, and is configured to output a value corresponding to a distance that the lens module is to move to the outside of the second integrated circuit.

11. The infrared image sensor according to claim 9, wherein: The first integrated circuit includes the readout element and the image signal processing element, The image signal processing element is configured to convert and digitally process the infrared sensing information into digital values. Wherein, the first integrated circuit is configured to output the infrared image information to the outside of the first integrated circuit, and The second integrated circuit is configured to output a value corresponding to a distance that the lens module is to move to the outside of the second integrated circuit.

12. The infrared image sensor according to claim 9, further comprising a third integrated circuit, wherein the third integrated circuit is stacked on one of the first integrated circuit and the second integrated circuit or between the first integrated circuit and the second integrated circuit. in, The third integrated circuit includes at least a portion of the image signal processing element and is configured to output the infrared image information to the outside of the third integrated circuit.

13. The infrared image sensor according to claim 9, wherein: The first integrated circuit includes the image signal processing element, wherein the image signal processing element is configured to extract at least one of position information and acceleration information of the lens module based on at least one of the infrared sensing information and the infrared image information, and At least one of the autofocus control element and the optical image stabilization control element is configured to output a value corresponding to a distance that the lens module is to move based on at least one of the position information and the acceleration information to the outside of the second integrated circuit.

14. The infrared image sensor according to claim 9, wherein: At least one of the autofocus control element and the optical image stabilization control element is configured to receive a detection result from at least one of a position sensor and an acceleration sensor, and is configured to output a value corresponding to a distance that the lens module is to move based on the detection result from at least one of the position sensor and the acceleration sensor to the outside of the second integrated circuit.

15. The infrared image sensor according to claim 9, wherein: The second integrated circuit includes the automatic focus control element and the optical image stabilization control element.

16. The infrared image sensor according to claim 9, wherein: The first integrated circuit and the second integrated circuit are electrically connected to each other through a conductive pad or a through silicon via disposed therebetween.

17. An infrared camera module, comprising: The infrared image sensor according to claim 9; a lens module arranged to transmit infrared rays directed toward the infrared image sensor; a sensor configured to detect at least one of a position or an acceleration of the lens module and configured to provide a detection result to the infrared image sensor; as well as A driver is configured to drive the lens module based on a value corresponding to a distance that the lens module is to move, based on at least one of an autofocus control element of the infrared image sensor and an optical image stabilization control element of the infrared image sensor, so as to control at least one of a position or an acceleration of the lens module.

Images