Microphones and electronic equipment

Abstract

The present invention provides a microphone and an electronic device. The microphone includes a circuit board, a housing, and a housing formed between the circuit board and the housing. A MEMS acoustic and electrical chip and an ASIC chip connected to the circuit board are arranged in the housing. A groove is formed on the circuit board, and the groove part is recessed inward to form a card slot connected to the groove. A plug-in position matching the groove is formed on the side of the housing facing the circuit board, and a card portion connected to the card slot is connected to the plug-in position. A groove matching the plug-in position of the housing is formed on the circuit board; at the same time, a card portion is arranged on the plug-in position, and the groove is recessed inward to form a card slot. The microphone securely mounts the housing on the circuit board through the cooperation of the housing and the circuit board. Compared with the solder connection in the prior art, the microphone has the advantages of high installation efficiency, low production cost, and the ability to ensure product yield.

Description

Technical Field

[0001] The present invention relates to the field of microphones, and in particular to a microphone and an electronic device. Background Art

[0002] With the progress of society and the development of technology, in recent years, the size of electronic products such as mobile phones and laptops has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which also requires the size of the electronic parts that match them to be continuously reduced, and the performance and consistency to be continuously improved. In this context, the microphone product field, as one of the important parts of the above-mentioned portable electronic products, has also launched many new products, among which MEMS microphones are the representative products.

[0003] A conventional MEMS microphone includes a packaging structure formed by a circuit board and a shell. When the shell and the circuit board are installed, the existing packaging method is to weld the shell and the circuit board through solder paste or other flux. This method has the following two main defects: First, solder paste flux and supporting welding machinery and equipment are required, which increases the production cost and has low welding efficiency; second, solder beads may splash during the solder paste packaging process, resulting in loss of microphone performance and causing product defects.

[0004] In view of this, it is necessary to provide a new type of microphone and electronic device to solve or at least alleviate the above technical defects. Summary of the invention

[0005] The main purpose of the present invention is to provide a microphone and an electronic device, aiming to solve the technical problems in the prior art that the microphone is made by welding, which has high cost, low welding efficiency and easily causes product defects.

[0006] To achieve the above-mentioned purpose, according to one aspect of the present invention, the present invention provides a microphone, including a circuit board, a shell, and a accommodating cavity formed between the circuit board and the shell, wherein a MEMS acoustic-electric chip and an ASIC chip connected to the circuit board are arranged in the accommodating cavity, a groove is formed on the circuit board, the groove portion is recessed inward to form a snap-in groove connected to the groove, a plug-in position matching the groove is formed on the side of the shell facing the circuit board, and a snap-in portion that is snap-in to the snap-in groove is connected to the plug-in position.

[0007] In one embodiment, the groove includes a bottom surface and side surfaces arranged opposite to the bottom surface, and the engaging groove is formed by the bottom surface being partially recessed inwardly.

[0008] In one embodiment, the snap-fit ​​groove includes a first groove and a second groove that are interconnected, an end of the first groove away from the second groove passes through the bottom surface, and the second groove is arranged at an angle to the first groove; the snap-fit ​​portion includes a connecting section and a snap-fit ​​section that are interconnected, an end of the connecting section away from the snap-fit ​​section is connected to the plug-in position, the connecting section cooperates with the first groove, and the second groove is snap-fitted with the snap-fit ​​section.

[0009] In one embodiment, the first groove is arranged vertically, and the second groove is arranged horizontally.

[0010] In one embodiment, the second slot extends from the first slot toward an outer side of the circuit board.

[0011] In one embodiment, the outer surface of the locking section includes a locking surface, a transition surface and an inclined surface connected in sequence, the locking surface and the inclined surface are both connected to the connecting section, the locking surface is a plane, the locking surface is used to abut against the top surface of the second groove, the transition surface is an arc surface, and the inclined surface is inclined downward from the transition surface toward the connecting section.

[0012] In one embodiment, the number of the second grooves is two, and the two second grooves are respectively arranged on two opposite sides of the first groove; the number of the clamping sections is two, and the two clamping sections are respectively arranged on two opposite sides of the connecting section, and the two clamping sections are arranged in a one-to-one correspondence with the two second grooves.

[0013] In one embodiment, the first groove has a top end communicating with the bottom surface and a bottom end away from the top end, and the second groove is connected to the bottom end.

[0014] In one embodiment, the first groove has a top end connected to the bottom surface and a bottom end away from the top end, and a connection position between the second groove and the first groove is spaced apart from the bottom end.

[0015] In one embodiment, the groove includes a bottom surface and side surfaces that are arranged opposite to each other on both sides of the bottom surface, and the engaging groove is formed by the side surfaces being recessed inwardly.

[0016] In one embodiment, the thickness of the inserting position is smaller than the width of the groove.

[0017] In one embodiment, the groove is a square groove, and the square groove is arranged at a position close to the edge of the circuit board. At least one snap-in groove is arranged on one side of each square groove, and the snap-in parts are consistent in number with the snap-in grooves and are arranged in one-to-one correspondence.

[0018] In one embodiment, the microphone further includes a sound hole, and the sound hole is disposed on the housing or the circuit board.

[0019] According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises the microphone described above.

[0020] In the above scheme, the microphone includes a circuit board, a shell, and a accommodating cavity formed between the circuit board and the shell. A MEMS acoustic and electrical chip and an ASIC chip connected to the circuit board are arranged in the accommodating cavity. A groove is formed on the circuit board, and the groove part is recessed inward to form a snap-in groove connected to the groove. A plug-in position matching the groove is formed on the side of the shell facing the circuit board, and a snap-in portion that snaps in with the snap-in groove is connected to the plug-in position. A groove matching with the plug-in position of the shell is formed on the circuit board; at the same time, a snap-in portion is arranged on the plug-in position, and the groove is recessed inward to form a snap-in groove. When the shell and the circuit board need to be connected, it is only necessary to align the plug-in position with the groove. After the plug-in position is inserted into place, the snap-in portion will snap-in with the snap-in groove at the same time, thereby fixing the shell to the circuit board. It should be noted that the snap-in groove mentioned here is formed by the inward recess of the groove, and the snap-in groove is also formed in the circuit board. The invention securely mounts the shell on the circuit board by cooperating between two parts of the shell and the circuit board (i.e., the plug-in position and the groove, and the snap-in groove and the snap-in part). Compared with the solder connection in the prior art, the invention has the advantages of high installation efficiency, low production cost and the ability to ensure product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 It is a structural schematic diagram of a microphone according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the housing of an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of a circuit board according to an embodiment of the present invention;

[0025] Figure 4 It is a structural schematic diagram of a clamping portion according to an embodiment of the present invention;

[0026] Figure 5 for Figure 4 A magnified view at point A;

[0027] Figure 6 A schematic diagram of the structure of the groove and the clamping groove according to an embodiment of the present invention;

[0028] Figure 7 Another structural schematic diagram of the clamping slot according to an embodiment of the present invention;

[0029] Figure 8 FIG. 4 is another schematic diagram of the three-dimensional structure of the microphone according to the embodiment of the present invention.

[0030] Description of Figure Numbers:

[0031] 1. Circuit board; 2. Shell; 3. Sound hole; 4. Groove; 5. Snap-in slot; 51. First slot; 511. End; 52. Second slot; 6. Insertion position; 7. Snap-in portion; 71. Connecting section; 72. Snap-in section; 721. Snap-in surface; 722. Transition surface; 733. Inclined surface; 8. MEMS acoustic and electrical chip; 9. ASIC chip.

[0032] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, in the present invention, the descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0036] Furthermore, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] See also Figure 1-Figure 8According to one aspect of the present invention, the present invention provides a microphone, including a circuit board 1, a shell 2 and a accommodating cavity formed between the circuit board 1 and the shell 2, wherein a MEMS acoustic and electrical chip 8 and an ASIC chip 9 respectively connected to the circuit board 1 are arranged in the accommodating cavity, a groove 4 is formed on the circuit board 1, a portion of the groove 4 is recessed inward to form a snap-in groove 5 connected to the groove 4, a plug-in position 6 matching the groove 4 is formed on the side of the shell 2 facing the circuit board 1, and a snap-in portion 7 snap-in to the snap-in groove 5 is connected to the plug-in position 6.

[0038] In the above embodiment, the housing 2 is covered on the circuit board 1, and the two cooperate to form a accommodating cavity. The circuit board 1 is connected with a MEMS acoustic and electrical chip 8 and an ASIC chip 9, and the MEMS acoustic and electrical chip 8 and the ASIC chip 9 are connected by gold wires. A groove 4 is formed on the circuit board 1 to cooperate with the plug-in position 6 of the housing 2; at the same time, a snap-in portion 7 is provided on the plug-in position 6, and the groove 4 is recessed inward to form a snap-in groove 5. When the housing 2 and the circuit board 1 need to be installed, only the plug-in position 6 needs to be aligned with the groove 4. After the plug-in position 6 is inserted into place, the snap-in portion 7 will simultaneously snap-fit ​​with the snap-in groove 5, thereby fixing the housing 2 on the circuit board 1. It should be noted that the snap-in groove 5 mentioned here is formed by the inward recess of the groove 4, and the snap-in groove 5 is also formed in the circuit board 1. This embodiment securely mounts the housing 2 on the circuit board 1 by means of the cooperation of the housing 2 and the circuit board 1 (i.e., the plug-in position 6 and the groove 4, the clamping groove 5 and the clamping portion 7). Compared with the prior art using solder connection, this embodiment has the advantages of high installation efficiency, low manufacturing cost and the ability to ensure product yield. The circuit board 1 may be a printed circuit board.

[0039] In one embodiment, the groove 4 includes a bottom surface and side surfaces arranged on both sides of the bottom surface, and the snap-in groove 5 is formed by the bottom surface being partially recessed inward. The snap-in groove 5 includes a first groove 51 and a second groove 52 that are interconnected, and the end of the first groove 51 away from the second groove 52 passes through the bottom surface, and the second groove 52 is arranged at an angle to the first groove 51; the snap-in portion 7 includes a connecting section 71 and a snap-in section 72 that are interconnected, and the end of the connecting section 71 away from the snap-in section 72 is connected to the plug-in position 6, the connecting section 71 cooperates with the first groove 51, and the second groove 52 is snap-in to the snap-in section 72. The first groove 51 and the second groove 52 are arranged at an angle, rather than being arranged in a straight line and flush, and an inflection point is arranged to play a limiting role, so that the housing 2 and the circuit board 1 are not easy to fall off after being installed.

[0040] In one embodiment, the first groove 51 is arranged vertically, and the second groove 52 is arranged horizontally. The second groove 52 extends from the first groove 51 toward the outside of the circuit board 1. The plug-in position 6 of the housing 2 falls from the vertical direction and is inserted into the groove 4 of the circuit board 1. The clamping portion 7 connected to the plug-in position 6 is vertically lowered from the first groove 51. When it falls into the second groove 52, the clamping section 72 of the clamping portion 7 is clamped into the second groove 52, and the connecting section 71 is just in the first groove 51. By vertically arranging the first groove 51 and the second groove 52, the second groove 52 and the clamping section 72 limit the position of the housing 2 in the vertical direction after the housing 2 and the circuit board 1 are installed, so that the housing 2 is not easy to fall off, and the firmness of the installation is further ensured. Specifically, the groove 4 is arranged at a position close to the edge of the circuit board 1, and the second groove 52 can extend toward the inside of the circuit board 1 or toward the outside of the circuit board 1. In order not to affect the installation of components on the circuit board 1, this embodiment adopts the method of extending the second groove 52 to the outside of the circuit board 1.

[0041] In one embodiment, the outer surface of the clamping section 72 includes a clamping surface 721, a transition surface 722 and an inclined surface 733 connected in sequence, the clamping surface 721 and the inclined surface 733 are also connected to the connecting section 71 respectively, the clamping surface 721 is a plane, the clamping surface 721 is used to abut against the top surface of the second groove 52, the transition surface 722 is an arc surface, and the inclined surface 733 is inclined downward from the transition surface 722 toward the connecting section 71. The clamping section 72 and the connecting section 71 are both made of elastic materials and have a certain elasticity. The inclined surface 733 and the arc surface are provided for the convenience of the installation process, that is, when the clamping section 72 falls from the first groove 51, the inclined surface 733 and the arc surface contact the side wall of the first groove 51, which can reduce the resistance of the clamping section 72 to fall. At the same time, after the installation is completed, the clamping surface 721 set as a plane can increase the contact area between the second groove 52 and the clamping groove 5, and improve the firmness of the clamping.

[0042] In one embodiment, the number of the second slots 52 is two, and the two second slots 52 are respectively arranged on two opposite sides of the first slot 51; the number of the clamping sections 72 is also two, and the two clamping sections 72 are respectively arranged on two opposite sides of the connecting section 71, and the two clamping sections 72 are arranged corresponding to the two second slots 52. Providing two second slots 52 and two clamping sections 72 can improve the strength of the clamping, thereby improving the firmness of the entire microphone. It should be noted that the present invention does not specifically limit the number of the second slots 52 and the clamping sections 72, which can be one, two, or more, and those skilled in the art can set them according to actual needs.

[0043] Reference Figure 7 In one embodiment, the first groove 51 has a top connected to the bottom surface and an end 511 away from the top, and the connection position of the second groove 52 and the first groove 51 is separated from the end 511 by a preset distance, such as Figure 7During installation, the clamping portion 7 is pressed to the bottom of the clamping groove 5, and then the clamping portion 7 extends into the second groove 52 during a slight rebound process and is clamped with the second groove 52. This embodiment provides a certain reserved space for the installation of the clamping section 72, making the installation more convenient.

[0044] Reference Figure 6 In one embodiment, the first groove 51 has a top end connected to the bottom surface and a terminal end 511 away from the top end, and the second groove 52 is connected to the terminal end 511. The second groove 52 is arranged at the terminal end 511, and when the clamping section 72 of the clamping portion 7 moves to the bottom, the clamping section 72 is just clamped with the second groove 52, and the movable distance of the housing 2 relative to the circuit board 1 is reduced to the greatest extent, ensuring the tightness of the connection between the two.

[0045] In one embodiment, the groove 4 includes a bottom surface and side surfaces arranged on both sides of the bottom surface, and the clamping groove 5 is formed by the side surface portions being recessed inward. Of course, the clamping groove 5 can also be arranged on the side surface of the groove 4, can be arranged on one side surface, or can be arranged on both side surfaces. As for the structure of the clamping groove 5, it is similar to the above-mentioned clamping groove 5 being arranged on the bottom surface of the groove 4, and the shape of the clamping portion 7 can be designed accordingly, which will not be described one by one here.

[0046] In one embodiment, the thickness of the plugging position 6 is smaller than the width of the groove 4. In order to facilitate the insertion of the plugging position 6 into the groove 4, the thickness of the plugging position 6 is smaller than the width of the groove 4, but at the same time, in order to ensure that the two are tightly connected, the thickness of the plugging position 6 is slightly smaller than the width of the groove 4.

[0047] In one embodiment, the groove 4 is a square groove, which is arranged near the edge of the circuit board 1. At least one snap-in groove 5 is arranged on one side of each square groove, and the snap-in parts 7 are arranged in the same number as the snap-in grooves 5 and in one-to-one correspondence. The square groove can be a rectangle, and the rectangle has four sides, each side corresponds to a section of the groove 4, and there is at least one snap-in groove 5 on each side, so that the housing 2 and the circuit board 1 are connected from all sides, which increases the firmness of the connection. As for the number of snap-in grooves 5, those skilled in the art can comprehensively consider factors such as cost, efficiency and firmness. It should be noted that any shape of grooves 4 and any number of snap-in grooves 5 within the scope of the present invention should fall within the protection scope of the present invention.

[0048] In one embodiment, the microphone further includes a sound hole 3, which is disposed on the housing 2 or the circuit board 1. The present invention can be applied to a microphone in which the sound hole 3 is disposed on the housing 2 (top sound intake), such as Figure 8 As shown, it can also be arranged in a microphone where the sound hole 3 is located on the circuit board (the sound enters from the bottom) as shown in FIG. Figure 1-Figure 3 shown.

[0049] According to another aspect of the present invention, the present invention further provides an electronic device, which includes the above-mentioned microphone. Since the electronic device includes all technical solutions of all embodiments of all the above-mentioned microphones, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0050] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A microphone, characterized in that: The invention comprises a circuit board, a shell and a receiving cavity formed between the circuit board and the shell, wherein a MEMS acoustic and electric chip and an ASIC chip connected to the circuit board are arranged in the receiving cavity, a groove is formed on the circuit board, the groove part is inwardly recessed to form a card connection groove connected to the groove, a plug-in position matching with the groove is formed on the side of the shell facing the circuit board, and a card connection portion connected to the card connection groove is connected to the plug-in position; The groove includes a bottom surface and side surfaces relatively arranged on both sides of the bottom surface, the snap-in groove is formed by the bottom surface being partially recessed inwardly, the snap-in groove includes a first groove and a second groove that are connected to each other, the end of the first groove away from the second groove passes through the bottom surface, the first groove is vertically arranged, and the second groove is horizontally arranged; the snap-in portion includes a connecting section and a snap-in section that are connected to each other, the end of the connecting section away from the snap-in section is connected to the plug-in position, the connecting section cooperates with the first groove, and the second groove is snap-in to the snap-in section.

2. The microphone according to claim 1, characterized in that The second slot extends from the first slot toward the outer side of the circuit board.

3. The microphone according to claim 1, characterized in that The outer surface of the snap-fit ​​section includes a snap-fit ​​surface, a transition surface and an inclined surface connected in sequence, the snap-fit ​​surface and the inclined surface are both connected to the connecting section, the snap-fit ​​surface is a plane, the snap-fit ​​surface is used to abut against the top surface of the second groove, the transition surface is an arc surface, and the inclined surface is inclined downward from the transition surface toward the connecting section.

4. The microphone according to claim 1, characterized in that There are two second grooves, which are respectively arranged on two opposite sides of the first groove; there are two clamping sections, which are respectively arranged on two opposite sides of the connecting section, and the two clamping sections are arranged in one-to-one correspondence with the two second grooves.

5. The microphone according to claim 1, characterized in that The first groove has a top end communicating with the bottom surface and a bottom end away from the top end, and the second groove is connected to the bottom end.

6. The microphone according to claim 1, characterized in that The first groove has a top end connected to the bottom surface and a bottom end away from the top end, and a connection position between the second groove and the first groove is spaced apart from the bottom end.

7. The microphone according to claim 1, characterized in that The groove comprises a bottom surface and side surfaces which are arranged opposite to each other on both sides of the bottom surface, and the clamping groove is formed by the side surfaces being recessed inwardly.

8. The microphone according to any one of claims 1 to 7, characterized in that: The thickness of the inserting position is smaller than the width of the groove.

9. The microphone according to any one of claims 1 to 7, characterized in that: The groove is a square groove, which is arranged at a position close to the edge of the circuit board. At least one clamping groove is arranged on one side of each square groove, and the number of the clamping parts is consistent with that of the clamping grooves and they are arranged in a one-to-one correspondence.

10. The microphone according to any one of claims 1 to 7, characterized in that: The microphone further comprises a sound hole, and the sound hole is arranged on the housing or the circuit board.

11. An electronic device, characterized in that: The electronic device comprises the microphone according to any one of claims 1-10.

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