Radiation source assembly and drying apparatus

Abstract

A radiation source assembly (300) and a drying device (100) are provided, wherein a light-emitting element (304) includes pins (308), a reflector cup (302) houses a portion of the light-emitting element (304), the pins (308) extend beyond the base (310) of the reflector cup (302), a circuit board (306) is soldered to the pins (308), and the circuit board (306) is electrically connected to the light-emitting element (304); a shock-absorbing structure (318) connects the base (310) of the reflector cup (302) and the circuit board (306), and the shock-absorbing structure (318) is configured to reduce vibrations at the connection between the circuit board (306) and the pins (308) in the radial and axial directions.

Description

Technical Field

[0001] This application relates to the field of drying technology, and in particular to a radiation source assembly and drying equipment. Background Technology

[0002] Currently, hair dryers capable of emitting infrared radiation to dry hair already exist, and these hair dryers have a radiation source for emitting infrared radiation. The radiation source includes a light source to generate infrared radiation. The operation of the light source is controlled by a control board electrically connected to the light source. The connection method between multiple light sources (such as series and parallel connection) can also be implemented by the control board, which requires connecting the light source and the control board together. However, in related technologies, the light source and the control board are generally connected together by connectors and wire harnesses. This method occupies a large structural space, making it difficult to miniaturize and compact the product. Summary of the Invention

[0003] Embodiments of this application provide a radiation source assembly and a drying device.

[0004] An embodiment of this application provides a radiation source assembly, comprising:

[0005] Light-emitting components, including pins;

[0006] A reflector cup houses part of the light-emitting element, with the pins extending beyond the reflector cup base.

[0007] A circuit board, wherein the circuit board is soldered to the pins and electrically connected to the light-emitting element;

[0008] A shock-absorbing structure connects the reflector base and the circuit board, the shock-absorbing structure being configured to mitigate vibrations at the connection between the circuit board and the pins in the radial and axial directions.

[0009] A drying apparatus according to an embodiment of this application includes:

[0010] A housing, wherein an air duct is provided inside the housing;

[0011] An electric motor, located within the housing, is used to generate airflow in the air duct;

[0012] The aforementioned radiation source assembly is housed within the housing and is used to generate infrared radiation and direct the infrared radiation to the outside of the housing;

[0013] The power supply is electrically connected to the motor and the radiation source assembly.

[0014] In the aforementioned radiation source components and drying equipment, the circuit board is soldered to the pins, which reduces the use of connectors and wire harnesses, thereby reducing space occupation and facilitating product miniaturization and compactness. Furthermore, the vibration damping structure can reduce radial and axial vibrations at the circuit board and pin connections, preventing damage to the light-emitting components themselves, the connections, and the circuit board.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0017] Figure 1 This is a three-dimensional schematic diagram of the radiation source assembly according to an embodiment of this application;

[0018] Figure 2 This is an exploded view of the radiation source assembly according to an embodiment of this application;

[0019] Figure 3 This is a cross-sectional schematic diagram of the radiation source assembly according to an embodiment of this application;

[0020] Figure 4 yes Figure 3 An enlarged schematic diagram of part A in the diagram;

[0021] Figure 5 This is an enlarged cross-sectional schematic diagram of the radiation source assembly according to an embodiment of this application;

[0022] Figure 6 This is another cross-sectional schematic diagram of the radiation source assembly according to an embodiment of this application;

[0023] Figure 7 yes Figure 6 An enlarged schematic diagram of part B in the diagram;

[0024] Figure 8 This is a schematic diagram of the drying equipment according to an embodiment of this application;

[0025] Figures 9-11 This is a schematic diagram showing the relationship between the air duct and the radiation source of the drying equipment according to an embodiment of this application. Detailed Implementation

[0026] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] This disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described herein. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0031] Please refer to Figures 1 to 4 This application provides a radiation source assembly 300, including a reflector 302, a light-emitting element 304, and a circuit board 306. The light-emitting element 304 includes pins 308, and the reflector 302 houses a portion of the light-emitting element 304, with the pins 308 extending out of the reflector base 310. The circuit board 306 is mounted on the reflector base 310, soldered to the pins 308, and electrically connected to the light-emitting element 304.

[0032] In the aforementioned radiation source component 300, the circuit board 306 is soldered to the pins 308, which can reduce the use of connectors and wire harnesses, thereby reducing space occupation and facilitating product miniaturization and compactness.

[0033] Specifically, the light-emitting element 304 and the reflector 302 can constitute a radiation source 30. The light-emitting element 304 can be partially located inside the reflector 302. The radiation source 30 is used to generate infrared radiation and guide the infrared radiation to the outside of the drying equipment. The light-emitting element 304 can emit infrared radiation outward. A portion of the infrared radiation emitted by the light-emitting element 304 is emitted directly to the outside of the drying equipment, and a portion of the infrared radiation is reflected by the reflector 302 and emitted to the outside of the drying equipment.

[0034] The radiation source 30 is configured such that radiation from the radiation source 30 forms a light spot on a target object at a certain distance outside the opening side of the radiation source 30. Thus, the infrared radiation intensity of the light spot is high, enabling effective drying of the object. It is understood that the radiation source 30 can be a single radiation source or multiple radiation sources (two or more).

[0035] Specifically, by adjusting the opening direction of the radiation sources 30, multiple radiation sources 30 can form a light spot at a certain distance from the outside of the drying equipment 100. The light spot can be a circular light spot, and the diameter of the circular light spot can be 10 cm. In one example, the certain distance can be 10 cm.

[0036] The infrared radiation emitted by the light-emitting element 304 may include far-infrared radiation, near-infrared radiation, etc. In one example, the infrared radiation emitted by the light-emitting element 304 can cover the infrared spectrum above 0.7 μm. In another example, the wavelength of the infrared radiation emitted by the light-emitting element 304 is in the range of 0.7 μm to 20 μm. In yet another example, the radiation emitted by the light-emitting element 304 can approximately cover the visible spectrum from 0.4 μm to 0.7 μm and the infrared spectrum above 0.7 μm.

[0037] In one embodiment, the light-emitting element 304 includes at least one of a halogen lamp, ceramic, graphene, and a light-emitting diode.

[0038] Specifically, examples of ceramics may include positive temperature coefficient (PTC) heaters and cermet heaters (MCH). The ceramic light-emitting element 304 includes a metal heating element embedded within the ceramic, such as tungsten embedded within silicon nitride or silicon carbide. The light-emitting element 304 may be provided in the form of a wire (e.g., a filament). The wire may be patterned (e.g., forming a spiral filament) to increase its length and / or surface area. The light-emitting element 304 may also be provided in the form of a rod. In one example, the light-emitting element 304 may be a silicon nitride rod, silicon carbide rod, or carbon fiber rod having a predetermined diameter and length.

[0039] The light-emitting element 304 may be selected from one of halogen lamps, ceramics, graphene, and light-emitting diodes, or the light-emitting element 304 may be selected from two or more of the following: halogen lamps, ceramics, graphene, and light-emitting diodes. No specific limitation is made here.

[0040] exist Figure 2 In the illustrated embodiment, the light-emitting element 304 can be configured as a light bulb; for example, the light-emitting element 304 can be a halogen light bulb. Specifically, please refer to... Figure 3 The light-emitting element 304 includes a filament 312, a bulb 314, a clamping position 316, and a lead 308. In one example, the filament 312 may be a tungsten filament.

[0041] The bulb 314 can be made of quartz glass. Quartz glass is not silicate glass or other glass. The bulb 314 is filled with inert gas and a small amount of halogen gas. The halogen gas can circulate with the evaporated tungsten in the bulb 314, which can improve the life of the halogen lamp.

[0042] During the bulb manufacturing process, the bulb shell 314 and the lead 308 need to be heated at high temperatures to fuse them together, a process called the clamping process, forming the clamping position 316. The temperature in this part is very high during clamping, requiring the thermal expansion coefficients of the internal metal and quartz to match; otherwise, after cooling, a small gap will form between the quartz glass and the metal, causing air leakage. The clamping position 316 contains a connector, typically made of molybdenum foil, which electrically connects the lead 308 and the filament 312.

[0043] Pin 308, also known as the lamp lead, is made of conductive metal. Preferably, pin 308 uses the same metal material as the connector, such as molybdenum. This ensures that the thermal expansion coefficients of pin 308 and the connector are matched, preventing separation and guaranteeing the reliability of the radiation source assembly 300.

[0044] In one embodiment, in order to ensure the welding strength between pin 308 and circuit board 306, a welding layer is provided on the surface of pin 308, which is adapted to be connected to circuit board 306 by welding.

[0045] Specifically, circuit board 306 typically has tin for soldering. Pin 308, on the other hand, is usually made of molybdenum. Without surface treatment, pin 308 is difficult to solder to circuit board 306, or in other words, it is prone to detaching after soldering. By providing a solder layer on the surface of pin 308, it becomes suitable for soldering to circuit board 306, thereby improving the reliability of the connection between pin 308 and circuit board 306.

[0046] In one embodiment, the material of the solder layer is at least one of nickel, tin, and copper. This makes the materials readily available, inexpensive, and provides a reliable connection.

[0047] In the illustrated embodiment, a light-emitting element 304 includes two pins 308. Corresponding to the soldering positions, the circuit board 306 has two through holes, with each pin 308 passing through one through hole. Then, solder is used to solder the circuit board 306 and the pins 308, forming a soldered connection between the pins 308 and the circuit board 306. This reduces the number of connecting components between the pins 308 and the circuit board 306, reducing space occupation and facilitating product miniaturization and compactness.

[0048] The reflector 302 can be configured to adjust the direction of radiation emitted from the light-emitting element 304. For example, the reflector 302 can be configured to reduce the divergence angle of the reflected radiation beam.

[0049] The reflective surface of the reflector cup 302 may be coated with a coating material that has high reflectivity for wavelengths or wavelength ranges of radiation emitted by the light-emitting element 304. For example, the coating material may have high reflectivity for wavelengths in both the visible and infrared spectra. Materials with high reflectivity can be highly efficient in reflecting radiant energy. Examples of coating materials may include metallic and dielectric materials. Metallic materials may include, for example, silver and aluminum. Dielectric coatings may have alternating layers of dielectric material, such as magnesium fluoride. In some instances, the reflectivity of the coated reflective surface may be approximately 100%, meaning that virtually all radiation emitted by the light-emitting element 304 can be reflected toward the outside of the drying device 100. Therefore, even if the temperature of the light-emitting element 304 is high, the temperature on the reflective surface of the reflector cup 302 will not substantially increase due to the radiation emitted from the light-emitting element 304.

[0050] In one embodiment, the axial cross-section of the reflective surface of the reflector cup 302 is in the shape of a polynomial curve. This allows the reflective surface to have a focal point, facilitating the guidance of infrared radiation and reducing the divergence angle of the reflected radiation beam.

[0051] Specifically, the shape of the polynomial curve can include parabolic, elliptical, hyperbolic, and other shapes. In one example, the axial cross-section of the reflecting surface of the reflector cup 302 is parabolic.

[0052] In one embodiment, the light-emitting element 304 is disposed at the focal point of the reflective surface of the reflector cup 302. In this way, the infrared beam emitted by the light-emitting element 304 can be reflected by the reflective surface and emitted substantially parallel from the opening of the reflector cup 302, thereby improving the directionality of the infrared radiation emitted by the drying equipment 100.

[0053] Specifically, the infrared radiation beam emitted by the light-emitting element 304 at the focal point is reflected by the reflective surface of the reflector 302 and then exits from the opening of the reflector 302 in a basically parallel manner.

[0054] In other embodiments, the light-emitting element 304 may also be positioned off-center from the focal point of the parabola, so that the reflected infrared radiation beam can converge or diverge at a certain distance in front of the drying device 100. The position of the light-emitting element 304 within the reflector cup 302 is adjustable, thus allowing for changes in the convergence and / or direction of the output radiation beam. The shapes of the reflector cup 302 and the light-emitting element 304 can be optimized and varied relative to each other to output the desired heating power at a desired location within the drying device 100.

[0055] Alternatively, a heat-insulating material (e.g., fiberglass, mineral wool, cellulose, polyurethane foam, or polystyrene) can be inserted between the light-emitting element 304 and the reflector 302 to insulate the light-emitting element 304 from the heat of the reflector 302. Even if the temperature of the light-emitting element 304 is high, the thermal insulation can prevent the temperature of the reflector 302 from increasing. Alternatively, a heat-insulating material can be inserted between the periphery of the optical element and the reflector 302 to insulate the optical element from the heat of the reflector 302.

[0056] In one embodiment, the radiation source 30 includes an optical element (not shown) disposed at the opening of the reflector 302 for filtering or reflecting non-infrared radiation. This ensures that only infrared radiation is directed to the object being dried. For example, the radiation actually output by the radiation source 30 may include bright visible light. When using a radiation source assembly 300, the emitted visible light could potentially burn the user's eyes. Filtering this visible light through the optical element prevents it from entering the radiation source assembly 300, thus providing a safer user experience.

[0057] Specifically, optical elements may include lenses, reflectors, prisms, gratings, beam splitters, filters, or combinations thereof that alter or redirect light. In some embodiments, the optical element may be a lens. In some embodiments, the optical element may be a Fresnel lens.

[0058] Optical elements can be made of materials with high infrared transmittance. Examples of materials used for optical elements can include oxides (e.g., silicon dioxide), metal fluorides (e.g., barium fluoride), metal sulfides or metal selenides (e.g., zinc sulfide, zinc selenide), and crystals (e.g., crystalline silicon, crystalline germanium). Furthermore, one or both sides of the optical element can be coated with a material that absorbs or reflects the visible and ultraviolet spectra, such that only wavelengths in the infrared range can pass through the optical element. The optical element can filter out (e.g., absorb) radiation that is not in the infrared spectrum. The infrared transmittance of the optical element can be at least 95%. In one example, the infrared transmittance of the optical element can be 99%.

[0059] In one example, the light-emitting element 304 can emit infrared radiation with wavelengths from 0.4 μm to 20 μm, the reflector cup 302 can reflect all the radiation toward the optical element (e.g., no radiation is absorbed at the reflective surface), and the optical element can filter out any visible spectral wavelengths between 0.4 μm and 0.7 μm from the reflected radiation, so that only the radiation in the infrared spectrum leaves the radiation source 30.

[0060] In one embodiment, the optical element is sealed at the opening of the reflector cup 302. This creates a relatively sealed internal space within the reflector cup 302.

[0061] Specifically, the internal space of the reflector 302 can be configured to have a certain degree of vacuum. In one embodiment, the reflector 302 is in a near-vacuum state; for example, the pressure inside the reflector 302 can be approximately 0.001 atm or less. Vacuum can suppress the evaporation and / or oxidation of the light-emitting element 304 and extend the lifespan of the radiation source 30. Vacuum also prevents heat convection or heat conduction between the light-emitting element 304 and the optical elements and / or the reflector 302.

[0062] In one embodiment, the reflector cup 302 is filled with a protective gas, which may be a certain amount of a non-oxidizing gas (such as an inert gas), while maintaining a certain level of vacuum to reduce the temperature rise of the gas inside the space formed by the reflector cup 302 and the inner surface of the optical element. Examples of non-oxidizing gases may include nitrogen (N2), helium (He), argon (Ar), neon (Ne), krypton (Kr), xenon (Xe), radon (Rn), and nitrogen (N2). The presence of the inert gas can further protect the material of the light-emitting element 304 from oxidation and evaporation.

[0063] In one embodiment, multiple radiation sources 30 may share a single optical element, meaning that an optical element is located at the opening of the reflector cup 302 of all radiation sources. In another embodiment, each radiation source 30 may have one optical element, meaning that an optical element is located at the opening of one reflector cup 302.

[0064] Because the filament 312 and bulb 314 of the light-emitting element 304 are relatively fragile, after the pins 308 and the circuit board 306 are soldered, the fixation between the circuit board 306 and the reflector 302 relies on the light-emitting element 304. In the event of drops, vibrations, or impacts, if relative vibration, displacement, or impact occurs between the circuit board 306 and the reflector 302, the axial impact force or radial shear force between them will directly act on the light-emitting element 304, easily causing breakage and damage. Therefore, in one embodiment of this application, the radiation source assembly 300 also includes a shock-absorbing structure to avoid the above-mentioned problems.

[0065] Specifically, please refer to Figures 2 to 5 The radiation source assembly 300 includes a vibration damping structure 318, which connects the reflector base 310 and the circuit board 306. The vibration damping structure 318 is configured to mitigate vibrations at the connection between the circuit board 306 and the pins 308 in the radial and axial directions. Thus, the vibration damping structure 318 can mitigate vibrations at the connection between the circuit board 306 and the pins 308 in the radial and axial directions, preventing damage to the light-emitting element 304 itself, the connection, and the circuit board 306.

[0066] Specifically, the circuit board 306 and the reflector base 310 can be connected using screws, clips, interference fits, etc. In the illustrated example, the reflector base 310 has a fixing part 317, and screws are used to connect the circuit board 306 and the fixing part 317, resulting in good fixation. Furthermore, after the circuit board 306 and the fixing part 317 are fixed together by screws, the screws themselves also serve to fix the circuit board 306 and the reflector 302 together, and the preload of the screws makes it difficult for them to vibrate against each other, thereby reducing the vibration transmitted to the light-emitting element 304 and indirectly protecting the light-emitting element 304. Moreover, the circuit board 306 is detachably mounted on the fixing part 317, facilitating the maintenance and replacement of the circuit board 306 and the radiation source.

[0067] In one implementation, please refer to Figure 2 and Figure 4 The vibration damping structure 318 includes a first damping ring 320. A circuit board 306 has a circuit board through-hole 322. The first damping ring 320 is at least partially located within the circuit board through-hole 322, and a fixing part 317 is at least partially located within the circuit board through-hole 322. The first damping ring 320 is fitted onto the fixing part 317. Thus, although the fixing part 317 is fixed to the circuit board 306, the fixing parts do not directly contact each other. The first damping ring 320 separates the end faces of the fixing part 317 and the mounting part of the circuit board 306. When one of them vibrates or experiences an impact, the force is first transmitted to the first damping ring 320, and then from the first damping ring 320 to the other. Therefore, the first damping ring 320 can be used to reduce vibration at the connection between the circuit board 306 and the pins 308 in both radial and axial directions.

[0068] Specifically, corresponding to the position of the fixing part 317, the circuit board 306 has a circuit board through hole 322, and the first shock absorber 320 can be installed at the circuit board through hole 322. The first shock absorber 320 can be made of a material that can absorb vibration, such as elastic materials like rubber or silicone.

[0069] In one embodiment, the fixing part 317 includes a first segment 324 and a second segment 326 connected to each other. The first segment 324 is connected to the reflector cup base 310, and the second segment 326 is at least partially located within a through hole in the circuit board. The outer diameter of the first segment 324 is larger than the outer diameter of the second segment 326. In the illustrated embodiment, both the first segment 324 and the second segment 326 are cylindrical. It is understood that in other embodiments, the first segment 324 and the second segment 326 may also be other regular or irregular shapes, which are not specifically limited here.

[0070] In one embodiment, the radiation source assembly 300 includes a fastener 328 that passes through the first damping ring 320 and is connected to the fixing part 317. This allows for the installation and fixing of the circuit board 306, the fixing part 317, and the first damping ring 320.

[0071] Specifically, in the illustrated embodiment, the fastener 328 is a screw, and the fixing part 317 has a screw hole. The first damping ring 320 is installed at the through hole 322 of the circuit board. The fastener 328 passes through the first damping ring 320 and is screwed into the screw hole of the fixing part 317, thus realizing the installation and fixing of the circuit board 306, the fixing part 317, and the first damping ring 320. Moreover, the installation and fixing method is simple and quick. It can be understood that in other embodiments, the fastener 328 can also be a self-tapping screw or a pin. In the pin-based embodiment, the fixing part 317 has a fastening hole, and the pin passes through the first damping ring 320 and is interference-fitted with the fastening hole of the fixing part 317, or the pin passes through the first damping ring 320 and is directly driven into the fixing part 317.

[0072] In one implementation, please refer to Figure 4 The first damping ring 320 includes a first portion 330 and a second portion 332. The first portion 330 is disposed between the head 334 of the fastener 328 and a surface of the circuit board 306, and the second portion 332 is disposed between the outer peripheral wall of the fixing part 317 and the inner peripheral wall of the circuit board through hole 322. The fastener 328 itself is fixed to the fixing part 317, and its head 334 contacts the end face of the circuit board 306 through the first portion 330. That is, the fastener 328 and the circuit board 306 are also spaced apart by the first damping ring 320, thereby avoiding the direct transmission of vibration or impact between the fixing part 317 and the circuit board 306 through the fastener 328. In this way, the two portions of the first damping ring 320 respectively achieve the reduction of vibration in the axial and radial directions.

[0073] Specifically, the first damping ring 320 also includes a third portion 336. The first portion 330 and the third portion 336 are respectively connected to the two ends of the second portion 332. The first portion 330 and the third portion 336 are annular. The radial length of the first portion 330 along the first damping ring 320 is greater than the radial length of the third portion 336 along the first damping ring 320, so that the first portion 330 can better resist the impact of external vibration on the circuit board 306 and the connection of the pins 308. The first portion 330 and the third portion 336 clamp the circuit board 306 from the top and bottom. On the one hand, the circuit board 306 can be limited, and on the other hand, the shock resistance of the circuit board 306 is improved.

[0074] In this embodiment, the fastener 328 includes a head 334 and a post 338. The head 334 is connected to one end of the post 338 and protrudes relative to the post 338. The post 338 passes through a first damping ring 320 and is connected to a fixing part 317. A first gap 340 is formed between the head 334 and a surface of the circuit board 306. A first part 330 is located in the first gap 340 to resist the impact of axial vibration. It is understood that the distance of the first gap 340 is slightly smaller than the thickness of the first part 330, so that the first part 330 can be clamped. The clamping is preferably done without affecting the damping effect.

[0075] The second portion 332 is a hollow cylinder, disposed within the circuit board through-hole 322, and located on the outer peripheral wall of the fixing portion 317, specifically between the outer peripheral wall of the second segment 326 and the inner peripheral wall of the circuit board through-hole 322. This allows for radial damping of vibration impact. It is understood that in other embodiments, the second portion 332 may also include multiple discrete sub-portions.

[0076] Furthermore, a positioning part 342 is provided at the connection between the first segment 324 and the second segment 326, and a third part 336 is provided between the positioning part 342 and the other surface of the circuit board 306. The third part 336 can buffer the vibration between the positioning part 342 and the circuit board 306, thus providing more room for movement for the pin 308 when it is subjected to impact.

[0077] Specifically, a second gap 344 is formed between the other surface of the circuit board 306 and the fixing part 317, and the third part 336 is located in the second gap 344 to provide sufficient additional movement space for the pin 308 when subjected to impact. It is understood that the distance of the second gap 344 is slightly less than the thickness of the third part 336, thus enabling clamping of the third part 336. The clamping should preferably not affect the shock absorption effect.

[0078] In one embodiment, the outer diameter of the first segment 324 is larger than the outer diameter of the second segment 326, forming a stepped structure at the connection between the first segment 324 and the second segment 326. This stepped structure constitutes the positioning part 342. The third part 336 is disposed between the end face of the stepped structure and the other surface of the circuit board 306. Thus, the stepped structure provides a larger contact area and better cushioning. Specifically, when the fixing part 317 is fixed using a fastener 328 (such as a screw), it is essentially equivalent to pulling the fixing part 317 towards the circuit board 306. A contact point, namely the stepped structure, exists between the fixing part 317 and the circuit board 306 to bear this pulling force, preventing the fixing part 317 from being pulled out of the circuit board 322. This force-bearing point, the stepped structure, is cushioned by the third part 336.

[0079] It is understood that in other embodiments, other structural forms may be used to construct the positioning part 342, and it is not limited to a stepped structure. For example, an inclined plane (including a single inclined plane, or a combination of several inclined planes with different slopes) or a curved surface (including a single curved surface whose cross-section is composed of a polynomial curve, or a curved surface whose cross-section is formed by connecting several polynomial curves).

[0080] In one embodiment, the second portion 332 surrounds the outer peripheral wall of the fixing portion 317. This allows for the reduction of radial vibration impact in a 360-degree circumferential direction.

[0081] Specifically, in the illustrated embodiment, the second portion 332 surrounds the outer peripheral wall of the second segment 326 of the fixing portion 317, so that the second portion 332 exists in all 360 degrees of the outer peripheral wall of the second segment 326 in the circumferential direction, thereby reducing the impact of radial vibration in the 360 ​​degrees of the circumferential direction.

[0082] In one embodiment, the height of the second segment 326 is less than or equal to the height of the first damping ring 320. This provides sufficient axial movement space.

[0083] Specifically, the height of the second segment 326 is less than or equal to the height of the first damping ring 320, so that the bottom of the second segment 326 is a certain distance away from the bottom surface of the first part 330. This distance can provide sufficient axial movement space for the pin 308, and the size of the distance can be set according to the actual situation. No specific limitation is made here.

[0084] In summary, the advantages of the first damping ring 320 in the embodiments of this application are:

[0085] 1) It serves to limit the movement of circuit board 306;

[0086] 2) This allows for a flexible connection between the circuit board 306 and the reflector, providing room for movement in the event of an impact in both the axial and radial directions;

[0087] 3) The light-emitting element 304 is soldered onto the circuit board 306, thus a flexible connection is also achieved between the light-emitting element 304 and the reflector. Therefore, when the radiation source falls, the light-emitting element 304 and the circuit board 306 can be cushioned by the first shock-absorbing ring 320.

[0088] In one implementation, please refer to Figure 6 and Figure 7 The reflector base 310 has a base through hole 346, through which the pin 308 passes. The radius of the base through hole 346 is larger than the radius of the pin 308. This provides sufficient room for the pin 308 to move when subjected to radial vibration, preventing the pin 308 from directly colliding with the reflector base 310 and being damaged.

[0089] Specifically, the pin 308 passes through the base through hole 346, and the radius of the base through hole 346 is larger than the radius of the pin 308, so that a third gap 348 is formed between the pin 308 and the inner peripheral wall of the base through hole 346 in the circumferential direction. This third gap 348 can provide sufficient room for the pin 308 to move when subjected to radial vibration. The size of the third gap 348 can be set according to the actual situation and is not specifically limited here.

[0090] In one embodiment, the difference between the radius of the base through-hole 346 and the radius of the pin 308 is not less than the gap between the inner peripheral wall of the circuit board through-hole and the outer peripheral wall of the fixing part 317. Thus, the movable space of the pin 308 within the base through-hole 346 is not less than the movable space of the fixing part 317 within the circuit board through-hole, further protecting the pin 308 and preventing it from colliding with the inner peripheral wall of the base through-hole 346 when subjected to vibration.

[0091] Specifically, when the light-emitting element 304, reflector 302, and circuit board 306 are assembled together, the pin 308 passes through the base through hole 346. A third gap 348 exists between the pin 308 and the inner peripheral wall of the base through hole 346. A fourth gap 350 is formed between the inner peripheral wall of the circuit board through hole 322 and the outer peripheral wall of the fixing part 317. In the illustrated embodiment, the fourth gap 350 is formed between the inner peripheral wall of the circuit board through hole 300 and the outer peripheral wall of the second section 326. The third gap 348 is not smaller than the fourth gap 350, allowing the pin 308 more room to move and preventing damage to the pin 308 when subjected to vibration. The width of the fourth gap 350 can be slightly smaller than the thickness of the second part 332. In this way, the second part 332 can be clamped. The clamping should preferably not affect the shock absorption effect.

[0092] In one embodiment, the reflector base 310 has an accommodating space 352, and the clamping position 316 is accommodated in the accommodating space 352. The base through hole 346 passes through the bottom wall of the accommodating space 352. The bottom of the clamping position 316 and the bottom wall of the accommodating space 352 are spaced apart to form a fifth gap 353. The fifth gap 353 is greater than the height difference between the second section 326 and the first damping ring 320, so as to provide sufficient axial movement space and prevent the clamping position 316 from hitting the bottom wall of the accommodating space 352 when the radiation source assembly 300 is vibrated.

[0093] In one embodiment, the reflector base 310 has a base through hole 346, through which the pin 308 passes. The shock-absorbing structure 318 also includes a second shock-absorbing ring (not shown), which is connected between the reflector base 310 and the pin 308. This further improves the shock resistance of the pin 308.

[0094] Preferably, the second damping ring can also form part of the damping structure and can be made of the same material and shape as the first damping ring 320 to save costs. Of course, the second damping ring can be made of a different material and / or shape than the first damping ring 320, depending on the vibration resistance requirements of the pin 308 and / or circuit board 306; no specific limitations are made here. Preferably, the second damping ring can be made of silicone, because silicone can withstand temperatures above 200 degrees Celsius. The operating temperature of the pin 308 is below this temperature, and it has virtually no impact on the vibration damping performance of the silicone. The size of the second damping ring should be such that it meets the vibration resistance requirements of the pin 308.

[0095] It is understandable that the gaps formed between the aforementioned components can also constitute part of the shock-absorbing structure 318.

[0096] In one implementation, please refer to Figure 1 and Figure 2 The radiation source assembly 300 includes multiple reflectors 302, each reflector 302 having a light-emitting element 304, and the multiple reflectors 302 are integrally formed and connected. This facilitates the manufacturing and assembly of the radiation source assembly 300, reducing its cost.

[0097] Specifically, when manufacturing the reflector cups 302, multiple reflector cups 302 can be formed in one piece using an integral molding process, and then the corresponding light-emitting element 304 can be installed on each reflector cup 302. This facilitates the manufacturing and assembly of the radiation source assembly 300 and reduces the cost of the radiation source assembly 300. Moreover, the integral molding connection can also improve the structural strength of the entire radiation source assembly 300, thereby improving the seismic resistance of the entire radiation source assembly 300. It can be understood that in other embodiments, multiple reflector cups 302 can also be connected separately, that is, each reflector cup 302 can be manufactured separately, and then multiple reflector cups 302 are assembled together.

[0098] In one embodiment, the circuit board 306 is fan-shaped, ring-shaped, or circular, and is electrically connected to the pins 308 of multiple light-emitting elements 304. Thus, one circuit board 306 can connect multiple light-emitting elements 304, and the circuit board 306 is easily mounted to the reflector base 310. Furthermore, the circuit board 307 is fixed to the reflector base 310 by multiple fasteners 328, forming a multi-point fixation. When the circuit board 307 or the reflector base 310 is subjected to vibration, impact, or other effects, the force can be dispersed and buffered through this multi-point fixation, thereby reducing the impact of vibration.

[0099] Specifically, in Figure 1 In the embodiment shown, the circuit board 306 is fan-shaped, which on the one hand achieves a compact structure, and on the other hand, the circuit board 306 can adapt to the shape of the inner wall of the housing and the outer wall of the air duct.

[0100] To adapt to different operating modes of the drying equipment, it is necessary to control the brightness of the light-emitting element 304. Simultaneously, a certain electrical connection method (such as series-parallel connection) is required between multiple light-emitting elements 304. This necessitates connecting the light-emitting elements 304 and the circuit board 306 together. The circuit board 306 can be a printed circuit board (PCB). The reflector cup base 310 and the circuit board 306 can be fixed with at least three screws, ensuring a good fixing effect. The circuit board 306 can serve as a control board, controlling the luminous efficiency, brightness, and duration of the light-emitting element 304.

[0101] In other embodiments, the circuit board 306 can be circular, annular, or non-circular, or other shapes. The circuit board 306 can be a single piece of board or it can be composed of separate individual pieces spliced ​​together. Alternatively, a light-emitting element 304 can be mounted on a single circuit board 306, with each circuit board 306 electrically connected. Or, the circuit boards 306 can be arranged separately as needed and electrically connected to each other.

[0102] Circuit board 306 can be electrically connected to a power source. In one embodiment, the power source may be a battery located within the housing handle of the drying device; in another embodiment, the power source may also be located within the housing itself. In yet another embodiment, the power source may be an AC power source.

[0103] like Figure 1 As shown, in one embodiment, the circuit board 306 is provided with a connector 354 for connecting to an external component. This facilitates the connection of external components to the circuit board 306, enabling control and / or power supply to the radiation source assembly 300.

[0104] Specifically, external components can be conveniently connected to connector 354 on circuit board 306 via another connector that matches connector 354, enabling electrical and / or structural connection between the external components and radiation source assembly 300. The external components can be a controller, processor, or control board of the drying equipment, a power supply to the radiation source assembly 300, or a combination of a controller and power supply, a control board and power supply, or a processor and power supply, etc.

[0105] This application provides a drying device. The drying device utilizes an infrared (IR) radiation source as a heat energy source to remove water and moisture from objects (e.g., hair, fabrics). The infrared radiation source emits infrared energy with a preset wavelength range and power density to heat the object. The heat carried by the infrared energy is directly transferred to the object via radiative heat transfer, resulting in improved heat transfer efficiency compared to conventional convective heat transfer (e.g., virtually no heat is absorbed by the surrounding air via radiative heat transfer, whereas in conventional heat conduction, a large portion of the heat is absorbed and carried away by the surrounding air). The infrared radiation source can be used in conjunction with a motor, and the airflow generated by the motor further accelerates the evaporation of water from the object.

[0106] Another advantage of using infrared radiation as a heat energy source is that infrared heat can penetrate the hair shaft down to the cuticle, thus drying the hair faster and leaving it soft and supple. Infrared energy is also believed to be beneficial to scalp health and stimulate hair growth by increasing blood flow to the scalp. The use of infrared radiation sources also allows for more compact and lightweight drying devices. The improved heat transfer and energy efficiency of infrared radiation sources can also extend the runtime of wireless drying devices powered by embedded batteries.

[0107] Specifically, please refer to Figure 8 A drying apparatus 100 according to an embodiment of this application includes:

[0108] Housing 10, with an air duct 40 inside;

[0109] Motor 20, located in housing 10, is used to generate airflow in air duct 40;

[0110] The radiation source assembly 300 of any of the above embodiments is housed in the housing 10 and is used to generate infrared radiation and direct the infrared radiation to the outside of the housing 10.

[0111] Power supply 70, electrically connected to motor 20 and radiation source assembly 300.

[0112] In the aforementioned drying equipment 100, the circuit board 306 is soldered to the pins 308, which reduces the use of connectors and wire harnesses, thereby reducing space occupation and facilitating product miniaturization and compactness. Moreover, the shock-absorbing structure 318 can reduce the vibration at the connection between the circuit board 306 and the pins 308 in the radial and axial directions, preventing damage to the light-emitting element 304 itself, the connection, and the circuit board 306.

[0113] The drying equipment 100 includes, but is not limited to, hair dryers, body dryers, hand dryers, tumble dryers, and bathroom heaters. In the illustrated embodiment, the drying equipment 100 is a hair dryer.

[0114] The housing 10 can accommodate various electrical, mechanical and electromechanical components, such as motor 20, radiation source assembly 300, control board (not shown) and power adapter (not shown), etc.

[0115] The housing 10 may include a body 102 and a handle 104, each of which may house at least a portion of electrical, mechanical, and electromechanical components. In some embodiments, the body 102 and handle 104 may be integrally connected. In some embodiments, the body 102 and handle 104 may be separate components. For example, the handle 104 may be detachable from the body 102. In one example, the detachable handle 104 may house a power source (such as one or more batteries) for powering the drying device 100. The housing 10 may be made of an electrically insulating material. Examples of electrically insulating materials may include polyvinyl chloride (PVC), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polyester, polyolefins, polystyrene, polyurethane, thermoplastics, silicone, glass, glass fiber, resin, rubber, ceramics, nylon, and wood.

[0116] The housing 10 may also be made of a metal material coated with an electrically insulating material, or a combination of an electrically insulating material and a metal material with or without an electrically insulating material. For example, the electrically insulating material may form the inner layer of the housing 10, while the metal material may form the outer layer of the housing 10.

[0117] The housing 10 may have one or more air ducts 40 internally, which may be fixed within the housing 10 to ensure stable airflow generated by the motor 20 and prevent unwanted airflow disturbances. The airflow generated by the motor 20 may be guided or regulated through the air ducts and directed toward the user's hair. For example, the air duct 40 may be shaped to at least regulate the velocity, throughput, divergence angle, or eddy intensity of the airflow leaving the drying device 100. The air duct 40 may include an airflow inlet 402 and an airflow outlet 404. In one example, the airflow inlet 402 and the airflow outlet 404 may be positioned at opposite ends of the drying device 100 along the longitudinal direction of the drying device 100 (such as the length direction of the body 102). The airflow inlet 402 and the airflow outlet 404 may each be a vent that allows for effective airflow throughput. Ambient air may be drawn into the air duct 40 through the airflow inlet 402 to generate airflow, and the generated airflow may exit the air duct 40 through the airflow outlet 404. The motor 20 can be located in the air duct 40 of the main body 102 or in the air duct 40 of the handle 104, and there is no specific limitation. The air inlet 402 can also be located in the handle 104, or the handle 104 and the main body 102.

[0118] The cross-sectional shape of the airflow outlet 404 can be any shape, preferably circular, elliptical, rectangular, square, or various variations of circles and quadrilaterals, such as quadrilaterals with rounded corners. No specific limitation is made here.

[0119] In one example, the main body 102 has an air duct 40, which is basically cylindrical. It is understood that in other embodiments, the air duct 40 may also be in other shapes, such as funnel shape, Y shape, and various regular or irregular shapes, which are not specifically limited here.

[0120] In one embodiment, since the housing 10 houses a radiation source assembly 300 for generating infrared radiation, no additional heating device is required in the housing 10. This allows for adjustment of the radiation power of the radiation source assembly to achieve the desired drying effect. Furthermore, the absence of an additional heating device enables miniaturization of the drying device 100, improving its portability. The lack of an additional heating device also results in lower energy consumption for the drying device 100, thus increasing its operating time. In some embodiments, the heating device includes a heating wire (such as a resistance wire).

[0121] In one embodiment, the motor 20 is located within the housing 10 and is used to generate airflow in the duct 40. In one example, the motor 20 may be disposed within the duct 40 of the body 102 and near the airflow inlet 402. The motor 20 may include a drive unit 202 and an impeller 204. The impeller 204 may include multiple blades. When the impeller 204 is driven by the drive unit 202, the rotation of the impeller 204 can draw ambient air into the duct 40 through the airflow inlet 402 to generate airflow, propel the generated airflow through the duct 40, and discharge the airflow from the airflow outlet 404. The drive unit 202 may be supported by a bracket or housed in a protective cover. The motor 20 may include a brushless motor 20, the rotational speed of which can be adjusted under the control of a controller (not shown).

[0122] In one embodiment, the radiation source assembly 300 is surrounded by the air duct 40, thus enabling a configuration of the drying equipment 100, such as... Figure 9 As shown.

[0123] Specifically, the radiation source component 300 can be placed in the air duct 40, and the airflow in the air duct 40 can properly dissipate heat from the radiation source component 300.

[0124] The number of radiation sources 30, which are composed of light-emitting element 304 and reflector cup 302, can be single, two or more. The shape of the radiation source 30 along the plane perpendicular to the axial direction of the air duct 40 is circular or approximately circular, or it can be annular or other shapes, without specific limitation here.

[0125] The planar shapes of the multiple radiation sources 30 arranged in the air duct 40 can be the same or different. For example, any combination of circular radiation sources 30, annular radiation sources 30, and fan-shaped radiation sources 30 can be distributed in the air duct 40.

[0126] In one implementation, please refer to Figure 9 The drying equipment 100 also includes an isolator 50 disposed within the air duct 40. Thus, the isolator 50 can be used to shield a portion of the radiation source 30, preventing that portion from being blown by the airflow within the air duct 40. In one example, the shielded portion of the radiation source 30 may be at least one of the outer wall of the reflector 302 and the base of the reflector 302. The outer wall of the isolator 50 may be configured as an air guide, for example, a streamlined shape, to reduce wind noise and resistance. Furthermore, a heat sink (not shown) is provided on the outer wall of the isolator 50. This accelerates heat dissipation efficiency. Specifically, the heat sink may include one or any combination of heat dissipation fins, a heat dissipation duct, a heat pipe, and a heat sink plate.

[0127] In one embodiment, the radiation source assembly 300 is located between the air duct 40 and the housing 10. This allows for another configuration of the drying equipment 100, such as... Figure 10 and Figure 11 As shown.

[0128] In one embodiment, all radiation sources 30 are located outside the air duct 40. The number of radiation sources 30 may be multiple, and the fact that all radiation sources 30 are located outside the air duct 40 reduces airflow resistance generated by the air duct 40 during operation, which helps to reduce wind noise and wind resistance.

[0129] Specifically, since there is no radiation source 30 in the air duct 40, it has minimal impact on wind speed and air volume, and does not generate additional wind noise. Wind speed and air volume have a significant impact on the drying speed. In particular, when the drying device 100 is used for drying hair, the low noise level improves the user experience because the drying device 100 is close to the ear during the drying process.

[0130] In one embodiment, the radiation source 30 can be positioned circumferentially around the airflow outlet 404 of the air duct 40. In this way, on the one hand, as the airflow exits from the airflow outlet 404, some of the heat from the radiation source 30 is carried away by the wind, raising the wind temperature by a few degrees (1-5 degrees). While this is insufficient to decisively affect the object being dried (such as hair), it improves the perceived temperature of the airflow, preventing a feeling of being blown by cold air and enhancing the user experience. On the other hand, this ensures that the infrared radiation emitted by the radiation source 30 is largely unobstructed by the air duct 40, which is beneficial for improving drying efficiency.

[0131] In one embodiment, the radiation source 30 is arranged around the airflow outlet 404 of the duct 40, such as... Figure 10 As shown.

[0132] In one embodiment, the radiation source 30 is arranged on one side of the airflow outlet 404 of the air duct 40, such as... Figure 11 As shown. In Figure 11 In the illustrated embodiment, the radiation source 30 is arranged on the lower half of the airflow outlet 404 of the air duct 40. It is understood that in other embodiments, the radiation source 30 may be arranged on one of the upper half, left half, right half, upper left half, lower left half, upper right half, or lower right half of the airflow outlet 404 of the air duct 40, and no specific limitation is made here.

[0133] In one embodiment, the cross-sectional shape of the radiation source 30 along the axis perpendicular to the air duct 40 can be annular, fan-shaped, or circular.

[0134] In one embodiment, any combination of circular radiation sources 30, annular radiation sources 30, and fan-shaped radiation sources 30 can be dispersed on one side of the airflow outlet 404 of the air duct 40, or arranged around the airflow outlet 404 of the air duct 40, etc., without specific limitations.

[0135] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0136] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A radiation source assembly, characterized in that, include: Light-emitting components, including pins; A reflector cup houses a portion of the light-emitting element. The axial cross-section of the reflective surface of the reflector cup is parabolic. The light-emitting element is located at the focal point of the reflective surface of the reflector cup. The pin extends out of the reflector cup base. The reflector cup base has a base through hole. The pin passes through the base through hole. The radius of the base through hole is larger than the radius of the pin so that there is a third gap between the pin and the inner peripheral wall of the base through hole. A circuit board, wherein the circuit board is soldered to the pins and electrically connected to the light-emitting element; A shock-absorbing structure connecting the reflector base and the circuit board is configured to mitigate vibrations at the connection between the circuit board and the pins in the radial and axial directions. The reflector cup base is provided with a fixing part, the circuit board has a circuit board through hole, the shock absorption structure includes a first shock absorption ring located at least partially inside the circuit board through hole, the fixing part is located at least partially inside the circuit board through hole, a fourth gap is formed between the inner peripheral wall of the circuit board through hole and the outer peripheral wall of the fixing part, the first shock absorption ring is sleeved on the fixing part, the first shock absorption ring is formed of elastic material, the first shock absorption ring separates the end face of the fixing part and the circuit board mounting part from each other, and the third gap is not less than the fourth gap.

2. The radiation source assembly according to claim 1, characterized in that, The surface of the pin is provided with a solder layer, which is adapted to be soldered to the circuit board.

3. The radiation source assembly according to claim 2, characterized in that, The material of the weld layer is at least one of nickel, tin, and copper.

4. The radiation source assembly according to claim 1, characterized in that, The radiation source assembly includes a fastener that passes through the first shock-absorbing ring and is connected to the fixing part.

5. The radiation source assembly according to claim 4, characterized in that, The fastener includes a post and a head. The head is connected to one end of the post and protrudes relative to the post. The post passes through the first damping ring and is connected to the fixing part. The first damping ring includes a first portion and a second portion. The first portion is disposed between the head and a surface of the circuit board. The second part is disposed between the outer peripheral wall of the fixing part and the inner peripheral wall of the circuit board through hole.

6. The radiation source assembly according to claim 5, characterized in that, The second part surrounds the outer peripheral wall of the fixing part.

7. The radiation source assembly according to claim 1, characterized in that, The fixing part includes a first section and a second section connected to each other. The first section is connected to the reflector cup base, and the second section is partially located in the through hole of the circuit board. A positioning part is provided at the connection between the first section and the second section. The first shock-absorbing ring includes a third part, which is disposed between the positioning part and another surface of the circuit board.

8. The radiation source assembly according to claim 7, characterized in that, The outer diameter of the first segment is larger than that of the second segment, and a stepped structure is formed at the connection between the first segment and the second segment. The stepped structure constitutes the positioning part; the third part is disposed between the end face of the stepped structure and the other surface of the circuit board.

9. The radiation source assembly according to claim 7, characterized in that, The height of the second segment is less than or equal to the height of the first damping ring.

10. The radiation source assembly according to claim 1, characterized in that, The first shock absorber ring is made of rubber or silicone.

11. The radiation source assembly according to claim 1, characterized in that, The reflector base has a base through hole, and the pin passes through the base through hole. The shock absorption structure also includes a second shock absorption ring, which is connected between the reflector base and the pin.

12. The radiation source assembly according to claim 1, characterized in that, The radiation source assembly includes multiple reflectors, each of which is provided with a light-emitting element, and the multiple reflectors are integrally formed and connected.

13. The radiation source assembly according to claim 12, characterized in that, The circuit board is fan-shaped, ring-shaped, or circular.

14. The radiation source assembly according to claim 1, characterized in that, The circuit board is provided with a connector for connecting to external components.

15. A drying apparatus, characterized in that, include: A housing, wherein an air duct is provided inside the housing; An electric motor, located within the housing, is used to generate airflow in the air duct; The radiation source assembly according to any one of claims 1-14 is housed in the housing and used to generate infrared radiation and direct the infrared radiation to the outside of the housing; The power supply is electrically connected to the motor and the radiation source assembly.

16. The drying apparatus according to claim 15, characterized in that, The radiation source assembly is surrounded by the air duct, or the radiation source assembly is located between the air duct and the housing.

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