Electronic components and their manufacturing methods

Abstract

This disclosure provides an electronic component and a method for manufacturing the same. The electronic component includes: a body comprising a plurality of dielectric layers and a plurality of internal electrodes, wherein the dielectric layers are disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the internal electrodes. At least one of the plurality of internal electrodes comprises nickel and an alloy metal, wherein the alloy metal comprises tin and aluminum. The at least one of the plurality of internal electrodes includes an internal electrode core and an internal electrode cover. The internal electrode core includes a first surface and a second surface opposite to each other, and the internal electrode cover is disposed on the first surface and the second surface of the internal electrode core. The internal electrode cover includes a first alloy region comprising an alloy of nickel and aluminum.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0153127, filed on November 16, 2020, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to an electronic component and a method for manufacturing the same. Background Technology

[0003] In electronic components, a multilayer ceramic capacitor (MLCC) can be a type of chip capacitor that is mounted on a printed circuit board in various electronic products, such as imaging devices including liquid crystal displays (LCDs), computers, smartphones, and mobile phones, and is charged or discharged.

[0004] Multilayer capacitors are used as components in a wide variety of electronic devices due to their small size, high capacitance, and ease of installation. Recently, the miniaturization of electronic device components has increased the demand for smaller, higher-capacitance multilayer capacitors.

[0005] A multilayer capacitor may include multiple dielectric layers and multiple internal electrodes, with the dielectric layers situated between the multiple internal electrodes. Summary of the Invention

[0006] According to one aspect of this disclosure, tin (Sn) can be used as an additive to improve the characteristics of the internal electrode. Adding tin to the internal electrode can improve reliability (e.g., the connectivity and high-temperature load life of the internal electrode). However, tin may diffuse from the internal electrode into the dielectric layer, and the tin diffused into the dielectric layer may react with oxygen included in the dielectric layer, which may result in reduced capacitance.

[0007] One aspect of this disclosure is to provide an electronic component with improved reliability.

[0008] Another aspect of this disclosure is to provide a method for manufacturing electronic components with improved reliability.

[0009] According to one aspect of this disclosure, an electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes, wherein the dielectric layers are disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the internal electrodes. At least one of the plurality of internal electrodes comprises nickel and an alloy metal, wherein the alloy metal comprises tin and aluminum. The at least one of the plurality of internal electrodes includes an internal electrode core and an internal electrode cover, the internal electrode core including a first surface and a second surface opposite to each other, and the internal electrode cover being disposed on the first surface and the second surface of the internal electrode core. The internal electrode cover includes a first alloy region comprising an alloy of nickel and aluminum.

[0010] According to another aspect of this disclosure, an electronic component includes: a body comprising a plurality of dielectric layers and a plurality of internal electrodes, wherein the dielectric layers are disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the internal electrodes. At least one of the plurality of internal electrodes comprises nickel and an alloy metal, wherein the alloy metal comprises tin and aluminum. The at least one of the plurality of internal electrodes includes an internal electrode core and an internal electrode cover. The internal electrode core includes a first surface and a second surface opposite to each other, and the internal electrode cover is disposed on the first surface and the second surface of the internal electrode core. The internal electrode cover includes a first alloy region and a second alloy region, wherein the first alloy region comprises an alloy of nickel and aluminum, and the second alloy region comprises an alloy of nickel and tin. The area of ​​the first alloy region covering the first surface of the internal electrode core is greater than the area of ​​the second alloy region covering the first surface of the internal electrode core.

[0011] According to another aspect of this disclosure, a method of manufacturing an electronic component includes: forming an unsintered body comprising a plurality of unsintered dielectric layers and a plurality of unsintered internal electrodes, the unsintered internal electrodes being formed by coating the unsintered dielectric layers with a conductive paste comprising nickel and an alloy metal; and forming a sintered body and sintered internal electrodes by sintering the unsintered body. The internal electrodes include an internal electrode core and an internal electrode cap, the internal electrode core including a first surface and a second surface opposite to each other, the internal electrode cap being disposed on the first surface and the second surface of the internal electrode core. The alloy metal includes aluminum and tin. The internal electrode core is a sintered electrode formed of nickel. The internal electrode cap includes a first alloy region comprising an alloy of nickel and aluminum. Attached Figure Description

[0012] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0013] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following combined with the accompanying drawings and detailed embodiments, in which:

[0014] Figure 1 This is a perspective view illustrating an electronic component according to an exemplary embodiment of the present disclosure;

[0015] Figure 2 It is shown Figure 1 An exploded 3D view of the electronic components in the image;

[0016] Figure 3 It is shown Figure 1An exploded perspective view of the main body of the electronic components;

[0017] Figure 4 It is along Figure 1 A cross-sectional view taken from line IV-IV in the diagram;

[0018] Figure 5 It is shown Figure 4 An enlarged cross-sectional view of region Q1 in the image;

[0019] Figure 6 It is shown Figure 4 Enlarged cross-sectional view of region Q2 in the image;

[0020] Figure 7 This is a cross-sectional view showing an electronic component according to another example embodiment;

[0021] Figure 8 This is a cross-sectional view showing an electronic component according to another example embodiment;

[0022] Figure 9 This is a flowchart illustrating a method for manufacturing an electronic component according to an example embodiment; and

[0023] Figure 10 It is shown Figure 9 A diagram illustrating process S320. Detailed Implementation

[0024] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0025] However, this disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art. Thus, for clarity of description, the shape and size of the elements in the drawings may be exaggerated, and in the drawings, elements indicated by the same reference numerals are the same elements.

[0026] A construction where an element or layer is described as being "on" another element or layer can include constructions where other elements or layers are located between them, as well as constructions where the element or layer is directly disposed on the other element or layer. A construction where an element or layer is described as being "directly on" another element or layer indicates that no other elements or layers are inserted between them.

[0027] The spatial relative terms “below,” “under,” “lower,” “above,” and “upper” are used to readily describe the relationships between elements. Spatial relative terms may include not only the orientation shown in the figures but also different orientations of the elements during use or operation. For example, when an element shown in the figures is flipped, an element described as being “below” or “under” another element may be placed “above” that other element. Thus, the example term “below” can include both the lower and upper orientations. Elements may be positioned in other ways, and the spatial relative terms may be interpreted accordingly based on their positioning.

[0028] The terms "first," "second," etc., may be used to describe various elements and / or parts, but elements and / or parts are not limited to these terms. These terms are used only to distinguish one element or part from another. Therefore, in the example embodiment, the first element or first part mentioned below may be a second element or second part.

[0029] Figure 1 This is a perspective view showing an electronic component according to an example embodiment. Figure 2 It is shown Figure 1 An exploded 3D view of the electronic components. Figure 3 It is shown Figure 1 An exploded 3D view of the main body of the electronic components. Figure 4 It is along Figure 1 The cross-sectional view taken from line IV-IV in the diagram.

[0030] Reference Figure 1 , Figure 2 and Figure 4 In the example embodiment, the electronic component 100 may include a body (or ceramic body) 110, a first external electrode 161, and a second external electrode 162.

[0031] The main body 110 may have, for example, a hexahedral shape. For example, as... Figure 2 As shown, the body 110 may include six surfaces M1, M2, F1, F2, C1, and C2. The first surface M1 and the second surface M2 may be opposite each other in a third direction T (or in the thickness direction of the body 110). When the electronic component 100 is mounted on the substrate, the first surface M1 or the second surface M2 may be a surface mounted on the substrate (mounting surface). The third surface F1 and the fourth surface F2 may be opposite each other in a second direction W (or in the width direction of the body 110). The third surface F1 and the fourth surface F2 may be connected to the first surface M1 and the second surface M2. The fifth surface C1 and the sixth surface C2 may be opposite each other in a first direction L (or in the length direction of the body 110). The fifth surface C1 and the sixth surface C2 may be connected to the first surface M1, the second surface M2, the third surface F1, and the fourth surface F2.

[0032] like Figure 3 As shown, the main body 110 may include a plurality of dielectric layers 111, a plurality of first internal electrodes 121, and a plurality of second internal electrodes 122. In other words, a plurality of dielectric layers 111 may be stacked, and a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 may be alternately disposed, with the dielectric layer 111 located between the first internal electrodes 121 and the second internal electrodes 122.

[0033] Multiple dielectric layers 111 can be in a sintered state and can be integrated, making the boundaries between adjacent layers difficult to distinguish.

[0034] The dielectric layer 111 may comprise a ceramic material having a high dielectric constant, and may include, for example, barium titanate (BaTiO3) powder or strontium titanate (SrTiO3) powder, but exemplary embodiments are not limited thereto. In other words, any material that yields sufficient electrostatic capacitance can be used. Furthermore, ceramic additives, organic solvents, plasticizers, binders (e.g., organic binders), and dispersants may be selectively added together with the ceramic powder as materials for the dielectric layer 111. Ceramic additives may include transition metal oxides or metallized carbides, rare earth elements, magnesium (Mg), or aluminum (Al), but examples of ceramic additives are not limited thereto.

[0035] Multiple first inner electrodes 121 may be stacked with multiple second inner electrodes 122 in a third direction T (or in the thickness direction of the body 110), and the stacking area may be related to the formation of the capacitance of the capacitor.

[0036] The first internal electrode 121 may include a first surface 121AS and a second surface 121BS opposite to the first surface 121AS in a third direction T. The first surface 121AS of the first internal electrode 121 may be closer to the second surface M2 of the body 110 than the second surface 121BS of the first internal electrode 121. The first surface 121AS and the second surface 121BS of the first internal electrode 121 may be opposite to the dielectric layer 111.

[0037] The second inner electrode 122 may include a first surface 122AS and a second surface 122BS opposite to the first surface 122AS in a third direction T. The first surface 122AS of the second inner electrode 122 may be closer to the second surface M2 of the body 110 than the second surface 122BS of the second inner electrode 122. The first surface 122AS and the second surface 122BS of the second inner electrode 122 may be opposite to the dielectric layer 111.

[0038] The first internal electrode 121 and the second internal electrode 122 may include nickel (Ni) (as the main component) and may include the following additives.

[0039] To improve the reliability of the inner electrodes 121 and 122, the inner electrodes 121 and 122 may include an alloy metal (as an additive) with a melting point lower than that of nickel (Ni). The alloy metal may include tin (Sn) and aluminum (Al). When the weight of nickel (Ni) included in the inner electrodes 121 and 122 is 100 parts by weight, the weight of the alloy metal included in the inner electrodes 121 and 122 may be greater than or equal to 0.1 parts by weight and less than or equal to 15 parts by weight. In other words, based on 100% by weight of nickel, the inner electrodes 121 and 122 may include an amount of alloy metal greater than or equal to 0.1% by weight and less than or equal to 15% by weight.

[0040] Furthermore, the internal electrodes 121 and 122 may also include at least one material selected from the group consisting of copper (Cu), silver (Ag), lead (Pb), platinum (Pt), rhodium (Rh), iridium (Ir), ruthenium (Ru), osmium (Os), indium (In), gallium (Ga), zinc (Zn), and bismuth (Bi), but exemplary embodiments thereof are not limited thereto. Additionally, to achieve a uniform composition at the interface of the internal electrodes 121 and 122, the internal electrodes 121 and 122 may also include at least one material selected from the group consisting of barium (Ba), magnesium (Mg), dysprosium (Dy), and titanium (Ti).

[0041] like Figure 4 As shown, a plurality of first inner electrodes 121 may be exposed on (or in contact with or extending from) a fifth surface C1 and may be electrically connected to a first outer electrode 161. A plurality of second inner electrodes 122 may be exposed on (or in contact with or extending from) a sixth surface C2 and may be electrically connected to a second outer electrode 162. When a voltage is applied to the first outer electrode 161 and the second outer electrode 162, charge may accumulate between the opposing first inner electrodes 121 and second inner electrodes 122.

[0042] The main body 110 may further include a lower cover layer 113, which is disposed below the lowest inner electrode among the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122. Furthermore, the main body 110 may also include an upper cover layer 112, which is disposed above the uppermost inner electrode among the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122. The lower cover layer 113 and the upper cover layer 112 may be sintered together with the plurality of dielectric layers 111 and may be integrally formed, making the boundaries between adjacent layers difficult to distinguish.

[0043] The lower cover layer 113 and the upper cover layer 112 can be formed by laminating a single dielectric layer or two or more dielectric layers in a third direction T (e.g., in the thickness direction of the body 110). The lower cover layer 113 and the upper cover layer 112 prevent physical / chemical stress from damaging the first inner electrode 121 and the second inner electrode 122. Furthermore, to eliminate mounting orientation, the thickness TL of the lower cover layer 113 and the thickness TH of the upper cover layer 112 can be configured to be the same, but exemplary embodiments are not limited thereto. The lower cover layer 113 or the upper cover layer 112 can have the same material and construction as the dielectric layer 111, but exemplary embodiments are not limited thereto.

[0044] The shape and size of the main body 110, the number of stacked dielectric layers 111, the number of stacked first inner electrodes 121 / the number of stacked second inner electrodes 122, the thickness TL of the lower cover layer 113 / the thickness TH of the upper cover layer 112 can be varied and are not limited to the examples shown in the figures.

[0045] Refer again Figure 1 , Figure 2 and Figure 4 The first external electrode 161 may include a first connecting portion 161a, a first mounting portion 161b, and a first side portion 161c. The first connecting portion 161a may be disposed on the fifth surface C1 of the body 110 and may be connected to a plurality of first internal electrodes 121 exposed on the fifth surface C1. The first mounting portion 161b may extend from the first connecting portion 161a to the first surface M1 and the second surface M2 of the body 110. The first side portion 161c may extend from the first connecting portion 161a to the third surface F1 and the fourth surface F2 of the body 110. In other words, the first mounting portion 161b may be parallel to the first internal electrodes 121, and the first side portion 161c may be perpendicular to the first internal electrodes 121.

[0046] The first mounting portion 161b provided on the first surface M1 of the main body 110 and the first mounting portion 161b provided on the second surface M2 of the main body 110 can be symmetrical to each other in the third direction T. For example, the length of the first mounting portion 161b provided on the first surface M1 of the main body 110 in the first direction L (or the second direction W) can be the same as the length of the first mounting portion 161b provided on the second surface M2 of the main body 110 in the first direction L (or the second direction W).

[0047] Similarly, the first side portion 161c provided on the third surface F1 of the main body 110 and the first side portion 161c provided on the fourth surface F2 of the main body 110 can be symmetrical to each other in the second direction W. In other words, the length of the first side portion 161c provided on the third surface F1 of the main body 110 in the first direction L (or the third direction T) can be the same as the length of the first side portion 161c provided on the fourth surface F2 of the main body 110 in the first direction L (or the third direction T).

[0048] Similarly, the second external electrode 162 may include a second connecting portion 162a, a second mounting portion 162b, and a second side portion 162c. The second connecting portion 162a may be disposed on the sixth surface C2 of the body 110 and may be connected to a plurality of second internal electrodes 122 exposed on the sixth surface C2. The second mounting portion 162b may extend from the second connecting portion 162a to the first surface M1 and the second surface M2 of the body 110. The second side portion 162c may extend from the second connecting portion 162a to the third surface F1 and the fourth surface F2 of the body 110. In other words, the second mounting portion 162b may be parallel to the second internal electrode 122, and the second side portion 162c may be perpendicular to the second internal electrode 122.

[0049] The second mounting portion 162b provided on the first surface M1 of the main body 110 and the second mounting portion 162b provided on the second surface M2 of the main body 110 are symmetrical to each other in the third direction T. The second side portion 162c provided on the third surface F1 of the main body 110 and the second side portion 162c provided on the fourth surface F2 of the main body 110 are symmetrical to each other in the second direction W.

[0050] As described above, the first mounting portion 161b / second mounting portion 162b formed on the first surface M1 of the body 110 can be symmetrical with the first mounting portion 161b / second mounting portion 162b formed on the second surface M2 of the body 110, and the thickness TL of the lower cover layer 113 and the thickness TH of the upper cover layer 112 can be the same. Therefore, when the electronic component 100 is mounted on the substrate, mounting orientation can be eliminated. In other words, the first surface M1 of the body 110 can be mounted opposite the substrate, or the second surface M2 of the body 110 can be mounted opposite the substrate.

[0051] The first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c of the first external electrode 161 can be formed by the same process (or a single process), and the thicknesses of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c can be substantially the same. The thicknesses of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c refer to average thicknesses. The statement "thickness can be the same" can indicate examples where the thicknesses are exactly the same or examples where the thicknesses are slightly different due to process errors.

[0052] The first connecting portion 161a and the first side portion 161c can be integrally connected to each other. The first connecting portion 161a can be directly connected to the first side portion 161c without a medium. Similarly, the first connecting portion 161a and the first mounting portion 161b can be integrally connected to each other, and the first side portion 161c and the first mounting portion 161b can be integrally connected to each other. Optionally, at least two of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c can be integrally connected. Optionally, at least two of the first connecting portion 161a, the first mounting portion 161b, and the first side portion 161c can be in direct contact with each other.

[0053] Similarly, the thicknesses of the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c of the second external electrode 162 can be substantially the same. Furthermore, at least two of the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c can be integrally connected to each other. Optionally, at least two of the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c can be in direct contact with each other.

[0054] One end of the main body 110 may be disposed in the first internal space IS1, and the other end of the main body 110 may be disposed in the second internal space IS2.

[0055] The first external electrode 161 may define a first internal space IS1. The first internal space IS1 may be defined by a first connecting portion 161a and a first mounting portion 161b and a first side portion 161c extending from the first connecting portion 161a. The space surrounded by the first connecting portion 161a, the first mounting portion 161b and the first side portion 161c may be constructed as the first internal space IS1. Specifically, the first connecting portion 161a may have a rectangular shape, and the first mounting portion 161b / first side portion 161c may be bent vertically from the corresponding side of the first connecting portion 161a having a rectangular shape and may extend toward the second external electrode 162.

[0056] The second external electrode 162 may define a second internal space IS2. The second internal space IS2 may be defined by a second connecting portion 162a, a second mounting portion 162b extending from the second connecting portion 162a, and a second side portion 162c. The space surrounded by the second connecting portion 162a, the second mounting portion 162b, and the second side portion 162c may be constructed as the second internal space IS2. Specifically, the second connecting portion 162a may have a rectangular shape, and the second mounting portion 162b / second side portion 162c may be bent vertically from the corresponding side of the rectangular second connecting portion 162a and may extend toward the first external electrode 161.

[0057] Furthermore, the first external electrode 161 and the second external electrode 162 can be configured to be symmetrical about the central portion of the main body 110.

[0058] For example, the first mounting portion 161b of the first external electrode 161 disposed on the first surface M1 of the main body 110 and the second mounting portion 162b of the second external electrode 162 disposed on the first surface M1 of the main body 110 are symmetrical to each other in the first direction L. Furthermore, the first side portion 161c of the first external electrode 161 disposed on the third surface F1 of the main body 110 and the second side portion 162c of the second external electrode 162 disposed on the third surface F1 of the main body 110 are symmetrical to each other in the first direction L. Furthermore, the first connecting portion 161a of the first external electrode 161 disposed on the fifth surface C1 of the main body 110 and the second connecting portion 162a of the second external electrode 162 disposed on the sixth surface C2 of the main body 110 are symmetrical to each other in the first direction L.

[0059] Reference Figure 4 The first external electrode 161 may include a first electrode layer 131 and a first plating layer 151 stacked sequentially.

[0060] The first electrode layer 131 may include a conductive metal (such as at least one of copper (Cu), nickel (Ni), gold (Au), silver (Ag), platinum (Pt), and palladium (Pd) or alloys thereof), but exemplary embodiments thereof are not limited thereto. Furthermore, the first electrode layer 131 may include glass (as an auxiliary material). The conductive metal ensures the sealing performance of the blank and the electrical connection between the first electrode layer 131 and the blank, while the glass fills the empty spaces during the sintering and shrinkage of the conductive metal and also provides bonding force between the first outer electrode 161 and the body 110.

[0061] The first plating layer 151 may be configured as a stacked nickel (Ni) plating / tin (Sn) plating or a stacked nickel (Ni) plating / gold (Au) plating, but exemplary embodiments thereof are not limited thereto. When the electronic component 100 is mounted on the substrate, the first plating layer 151 can improve contact performance with the solder.

[0062] The second external electrode 162 may also include a second electrode layer 132 and a second plating layer 152 stacked sequentially. The second electrode layer 132 may be formed of a material and structure substantially the same as that of the first electrode layer 131, and the second plating layer 152 may be formed of a material and structure substantially the same as that of the first plating layer 151.

[0063] In the following description, reference will be made to Figures 4 to 6 The structure / shape of the first internal electrode 121 is described in detail. Although not described, the structure / shape of the second internal electrode 122 may be substantially the same as that of the first internal electrode 121.

[0064] Figure 5 It is shown Figure 4 An enlarged cross-sectional view of region Q1 in the image. Figure 6 It is shown Figure 4 Enlarged cross-sectional view of region Q2 in the image.

[0065] Reference Figures 4 to 6 The first inner electrode 121 may be disposed between the corresponding dielectric layers 111. The first inner electrode 121 may include an inner electrode core 210 and an inner electrode cover 220.

[0066] Specifically, the inner electrode core 210 may include a first surface 210AS and a second surface 210BS opposite to each other. The first surface 210AS of the inner electrode core 210 may be opposite to the second surface 210BS of the inner electrode core 210 in a third direction T. For ease of description, the first surface 210AS and the second surface 210BS of the inner electrode core 210 are shown as planes, but exemplary embodiments thereof are not limited thereto.

[0067] The inner electrode core 210 can be configured as a sintered electrode formed using nickel (Ni), serving as the main component of the first inner electrode 121. The inner electrode core 210 can be formed by sintering nickel included in a conductive paste during the sintering process used to form the body 110. Here, "sintered electrode formed using nickel" can include electrodes formed solely of nickel as well as nickel electrodes that partially include the aforementioned additives.

[0068] The inner electrode cover 220 can be disposed on the first surface 210AS and the second surface 210BS of the inner electrode core 210.

[0069] In the electronic component of the example embodiment, an inner electrode cover 220 may be disposed on the entire first surface 210AS and the entire second surface 210BS of the inner electrode core 210. In other words, the first surface 121AS and the second surface 121BS of the first inner electrode 121 may be defined by the inner electrode cover 220.

[0070] The inner electrode cover 220 may include a first alloy region 221, a second alloy region 222, and a third alloy region 223. The first alloy region 221 may include an alloy of nickel and aluminum. The second alloy region 222 may include an alloy of nickel and tin. The third alloy region 223 may include an alloy of nickel, aluminum, and tin.

[0071] The first alloy region 221 does not refer to an alloy formed using nickel and aluminum in a specific ratio. For example, when the inner electrode cover 220 includes Al3Ni and Al3Ni2, the first alloy region 221 may include both Al3Ni and Al3Ni2.

[0072] In the electronic component of the example embodiment, the area ratio of the first alloy region 221 may differ from that of the second alloy region 222. In other words, the area of ​​the first surface 210AS and the second surface 210BS of the inner electrode core 210 covered by the first alloy region 221 may differ from the area of ​​the second surface 210AS and the second surface 210BS of the inner electrode core 210 covered by the second alloy region 222.

[0073] For example, the area ratio of the first alloy region 221 can be greater than the area ratio of the second alloy region 222. In other words, the area of ​​the first alloy region 221 covering the first surface 210AS and the second surface 210BS of the inner electrode core 210 can be greater than the area of ​​the second alloy region 222 covering the first surface 210AS and the second surface 210BS of the inner electrode core 210.

[0074] "The area ratio of the first alloy region 221" can refer to the ratio of the area of ​​the first surface 121AS and the second surface 121BS of the first inner electrode 121 defined by the first alloy region 221 to the total area of ​​the first surface 121AS and the second surface 121BS of the first inner electrode 121. For example, this can be observed by... Figure 4 The area or area fraction is measured using cross-sectional views (LT cross-section) and / or TW cross-sectional views. After imaging the LT cross-sectional surface and / or TW cross-sectional surface, the area fraction can be calculated by analyzing the measurement results using image analysis software such as ImageJ (open source by the National Institute of Sanitation (NIH)) or MathWorks, MATLAB, etc., but the example embodiments are not limited thereto.

[0075] The reason why the area percentage of the first alloy region 221 is greater than that of the second alloy region 222 is that the first alloy region 221 is easier to form than the second alloy region 222. For example, when the weight percentage of aluminum (Al) included in the first inner electrode 121 is greater than the weight percentage of tin (Sn) included in the first inner electrode 121, the first alloy region 221 is easier to form than the second alloy region 222. Specifically, in the first inner electrode 121, the weight percentage of aluminum (Al) relative to 100% by weight of nickel can be greater than the weight percentage of tin (Sn).

[0076] The first inner electrode 121 may include an alumina film 221c disposed between the inner electrode cover 220 and the dielectric layer 111. For example, the alumina film 221c may be formed by a reaction between aluminum and oxygen eluted during the firing of the body 110. As another example, the alumina film 221c may be formed by a reaction between aluminum and oxygen included in the first alloy region 221 and the third alloy region 223.

[0077] For example, an alumina film 221c may be disposed on the first alloy region 221 and / or the third alloy region 223, but exemplary embodiments thereof are not limited thereto. Unlike the example shown, an alumina film 221c may also be disposed on the second alloy region 222 when aluminum is washed off between the second alloy region 222 and the dielectric layer 111 during the firing of the body 110.

[0078] Since the first inner electrode 121 comprises tin (Sn) and aluminum (Al) (which may be alloy metals), an inner electrode cap 220 can be formed between the first inner electrode 121 and the dielectric layer 111. The inner electrode cap 220 prevents the nickel (Ni), which can be a major component of the first inner electrode 121, from constricting. Therefore, the connectivity of the first inner electrode 121 can be improved.

[0079] Furthermore, aluminum (Al) has a greater tendency to oxidize than nickel (Ni) and tin (Sn). In other words, aluminum is more likely to form oxides by reacting with oxygen than nickel (Ni) and tin (Sn). The aluminum included in the first inner electrode 121 prevents nickel (Ni) and tin (Sn) from reacting with oxygen. Therefore, the aluminum included in the first inner electrode 121 prevents the nickel in the inner electrode core 210 from being oxidized.

[0080] Furthermore, the aluminum included in the first inner electrode 121 prevents tin from being oxidized. Dielectric dissipation can occur in the dielectric layer 111 when tin reacts with oxygen in the dielectric layer 111 to form an oxide. The aluminum included in the first inner electrode 121 reduces the dielectric dissipation of the dielectric layer 111.

[0081] Furthermore, the alumina film 221c included in the first inner electrode 121 may have a dense structure. The alumina film 221c can prevent oxygen from penetrating into the first inner electrode 121 or can reduce oxygen levels. Additionally, the alumina film 221c can prevent moisture (H2O) from penetrating into the first inner electrode 121 or can reduce moisture levels. Therefore, the corrosion resistance of the first inner electrode 121 can be improved in high-temperature environments or high-temperature and high-humidity environments.

[0082] Unlike the example shown, for example, the inner electrode cover 220 may not include the third alloy region 223. As another example, the inner electrode cover 220 may include a first alloy region 221 and may not include the second alloy region 222 and the third alloy region 223. As yet another example, the inner electrode cover 220 may not include the second alloy region 222.

[0083] The first inner electrode 121 can contact the first outer electrode 161 (first electrode layer 131) through the fifth surface C1 of the main body 110. The first outer electrode 161 can contact the inner electrode core 210 and the inner electrode cover 220.

[0084] Figure 7 This is a cross-sectional view illustrating an electronic component according to another example embodiment. For ease of description, the main description will be based on references. Figures 1 to 6 The differences in the examples described.

[0085] Reference Figure 7 In another example embodiment of the electronic component, the first internal electrode 121 may include a tin oxide film 222c disposed between the internal electrode cover 220 and the dielectric layer 111.

[0086] As an example, the tin oxide film 222c can be formed by the reaction between tin and oxygen eluted during the firing of the body 110. As another example, the tin oxide film 222c can be formed by the reaction between tin and oxygen included in the second alloy region 222.

[0087] For example, a tin oxide film 222c may be disposed on the second alloy region 222, but its exemplary embodiments are not limited thereto. When tin is washed off between the first alloy region 221 and the dielectric layer 111 during the firing of the body 110, the tin oxide film 222c may also be disposed on the first alloy region 221.

[0088] The area ratio of the first alloy region 221 can be greater than that of the second alloy region 222. Therefore, compared with the example in which the second alloy region 222 covers the first surface 210AS and the second surface 210BS of the inner electrode core 210, the dielectric dissipation of the dielectric layer 111 caused by the formation of the tin oxide film 222c can be reduced.

[0089] Figure 8This is a cross-sectional view illustrating an electronic component according to another example embodiment. For ease of description, the main description will be based on references. Figures 1 to 6 The differences in the examples described.

[0090] Reference Figure 8 In another example embodiment of the electronic component, the inner electrode cover 220 may define 80% or more of a first surface 121AS of the first inner electrode 121. The inner electrode cover 220 may define 80% or more of a second surface 121BS of the first inner electrode 121.

[0091] An inner electrode cover 220 may be disposed on a portion of a first surface 210AS and a portion of a second surface 210BS of the inner electrode core 210. The inner electrode cover 220 may cover 80% or more of the first surface 210AS and the second surface 210BS of the inner electrode core 210.

[0092] A portion of the first surface 121AS and a portion of the second surface 121BS of the first internal electrode 121 may be defined by the internal electrode core 210.

[0093] A portion of the inner electrode core 210 may be opposite the dielectric layer 111, and the nickel of the inner electrode core 210 may be prevented from being oxidized by the first alloy region 221 and the aluminum oxide film 221c.

[0094] Figure 9 This is a flowchart illustrating a method for manufacturing an electronic component according to an example embodiment. Figure 10 It is shown Figure 9 A diagram illustrating process S320.

[0095] Reference Figure 9 This can form an unsintered body (process S310).

[0096] Specifically, multiple ceramic green sheets can be prepared, and conductive paste can be applied to each ceramic green sheet using printing methods such as screen printing or gravure printing.

[0097] Conductive paste may include nickel (Ni), tin (Sn), and aluminum (Al). Conductive paste may be formed using conductive powders.

[0098] For example, a powder mixture containing nickel powder, tin powder, and aluminum powder can be used as a conductive powder. As another example, a powder mixture containing nickel powder coated with one of tin and aluminum, combined with a powder formed from the other of tin and aluminum, can be used as a conductive powder. As yet another example, nickel powder coated with tin and aluminum can be used as a conductive powder.

[0099] Then, multiple ceramic green sheets can be stacked, and multiple ceramic green sheets can be pressed in the stacking direction, so that the stacked ceramic green sheets and the conductive paste for the internal electrode can be pressed together.

[0100] Subsequently, the compressed laminate can be cut for each region corresponding to the body of a single multilayer capacitor, thereby creating an unsintered body. The complete unsintered body may include multiple unsintered dielectric layers and unsintered internal electrodes formed on the unsintered dielectric layers using a conductive paste comprising nickel, tin, and aluminum.

[0101] The unsintered body can be heat-treated to burn off the binder, and the body can be fired in a reducing atmosphere to obtain a sintered body 110 (process S320).

[0102] Reference Figure 10 In (a), the alloy metal may include metals with a melting point lower than that of nickel (Ni). The alloy metal may include aluminum (Al) and tin (Sn).

[0103] Alloy metals can form interfaces with nickel (Ni). Tin can be oxidized in air, and aluminum can prevent the oxidation of tin. Due to the oxidizing properties of aluminum, the wettability of tin on a nickel surface can be increased.

[0104] Reference Figure 10 In (b), tin and aluminum may have melting points lower than those of nickel. Therefore, when firing is performed, the alloy metal comprising tin and aluminum can be melted and wetted onto the nickel. Thus, an alloy coating comprising aluminum and tin can be formed around the nickel (Ni).

[0105] Reference Figure 10 In section (c), as firing proceeds, the nickel (Ni) pieces with alloy coatings formed on them can adhere to each other. The nickel (Ni) can be bonded together through the alloy coatings.

[0106] Reference Figure 10 In step (d), as firing proceeds, the alloy coating surrounding the nickel (Ni) can temporarily liquefy. After liquefaction, tin and aluminum can diffuse into the nickel (Ni) while the temperature is maintained.

[0107] When tin and aluminum diffuse into nickel (Ni), the average composition of tin and aluminum may decrease. As the average composition of tin and aluminum decreases, alloy coatings and solidification of nickel (Ni) can be performed.

[0108] Furthermore, nickel (Ni) can agglomerate with each other and can form a nickel-fired electrode (Ni plate). When nickel (Ni) agglomerates, tin and aluminum can be leached from the nickel-fired electrode (Ni plate). Additionally, tin and / or aluminum can form alloys with nickel, allowing an alloy layer to be formed on the nickel-fired electrode (Ni plate), the alloy layer comprising an alloy of nickel and aluminum and / or an alloy of nickel and tin. The alloy layer can correspond to... Figure 5 (or Figure 7 or Figure 8 The inner electrode cover 220 in the ) and the nickel-fired electrode (Ni plate) can correspond to Figure 5 (or Figure 7 or Figure 8 The inner electrode core 210 in ).

[0109] Return to reference Figure 9 External electrodes can be formed on both end surfaces of the body 110 (process S330). The external electrodes may include a copper paste electrode layer, for example, comprising glass, and a nickel / tin plating layer on the electrode layer.

[0110] According to the foregoing example embodiments, in the internal electrode of an electronic component, the nickel (Ni) sintered electrode may include an internal electrode core and an internal electrode cover disposed on the surface of the internal electrode core. The internal electrode cover may include an alloy region of nickel (Ni) and tin (Sn) and an alloy region of nickel (Ni) and aluminum (Al). The aluminum included in the internal electrode prevents nickel and tin from reacting with oxygen (O). The aluminum included in the internal electrode can react with oxygen and form an alumina film, thereby preventing oxygen from penetrating into the internal electrode. Furthermore, since the alumina film formed by the oxidation reaction of aluminum has a dense structure, the corrosion resistance of the internal electrode in high-temperature environments or high-temperature and high-humidity environments can be improved.

[0111] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. An electronic component, comprising: The main body includes multiple dielectric layers and multiple internal electrodes, with the dielectric layers located between the multiple internal electrodes; as well as An outer electrode is disposed on the main body and connected to the inner electrode. At least one of the plurality of internal electrodes comprises nickel and an alloy metal, wherein the alloy metal comprises tin and aluminum. Wherein, at least one of the plurality of inner electrodes includes an inner electrode core and an inner electrode cover, the inner electrode core includes a first surface and a second surface opposite to each other, and the inner electrode cover is disposed on the first surface and the second surface of the inner electrode core, and The inner electrode cover includes a first alloy region, which comprises an alloy of nickel and aluminum.

2. The electronic assembly of claim 1, wherein, The inner electrode cover also includes a second alloy region comprising an alloy of nickel and tin.

3. The electronic assembly of claim 2, wherein, The area ratio of the first alloy region is different from that of the second alloy region.

4. The electronic assembly of claim 2, wherein, The internal electrode also includes a tin oxide film disposed between the second alloy region and the dielectric layer.

5. The electronic assembly of claim 1, wherein, The inner electrode includes an aluminum oxide film disposed between the inner electrode cover and the dielectric layer.

6. The electronic assembly of claim 5, wherein, The alumina film is disposed on the first alloy region.

7. The electronic assembly of claim 1, wherein, The inner electrode cover also includes a third alloy region comprising an alloy of nickel, aluminum, and tin.

8. The electronic component according to claim 1, in, At least one of the plurality of internal electrodes includes a surface opposite to one of the plurality of dielectric layers, and The inner electrode cap defines 80% or more of one surface of at least one of the plurality of inner electrodes.

9. The electronic component according to claim 1, wherein, The inner electrode core is a sintered electrode containing nickel.

10. The electronic component according to claim 1, wherein, In at least one of the plurality of internal electrodes, the alloy metal comprises, based on 100% by weight of nickel, an amount greater than or equal to 0.1% by weight and less than or equal to 15% by weight.

11. The electronic component according to claim 1, wherein, The weight percentage of aluminum included in the inner electrode is greater than the weight percentage of tin included in the inner electrode.

12. The electronic component according to claim 1, wherein, At least one of the plurality of internal electrodes comprises one or more of copper, silver, lead, platinum, rhodium, iridium, ruthenium, osmium, indium, gallium, zinc, and bismuth.

13. An electronic component, comprising: The main body includes multiple dielectric layers and multiple internal electrodes, with the dielectric layers located between the multiple internal electrodes; as well as An outer electrode is disposed on the main body and connected to the inner electrode. At least one of the plurality of internal electrodes comprises nickel and an alloy metal, wherein the alloy metal comprises tin and aluminum. Wherein, at least one of the plurality of inner electrodes includes an inner electrode core and an inner electrode cover, the inner electrode core includes a first surface and a second surface opposite to each other, and the inner electrode cover is disposed on the first surface and the second surface of the inner electrode core. The inner electrode cover includes a first alloy region and a second alloy region. The first alloy region comprises an alloy of nickel and aluminum, and the second alloy region comprises an alloy of nickel and tin. Wherein, the area of ​​the first surface of the first alloy region covering the inner electrode core is greater than the area of ​​the first surface of the second alloy region covering the inner electrode core.

14. The electronic component according to claim 13, in, At least one of the plurality of internal electrodes includes a surface opposite to one of the plurality of dielectric layers, and The inner electrode cap defines 80% or more of one surface of at least one of the plurality of inner electrodes.

15. The electronic component according to claim 13, wherein, At least one of the plurality of internal electrodes includes an aluminum oxide film disposed between the first alloy region and one of the plurality of dielectric layers.

16. The electronic component according to claim 15, wherein, The at least one of the plurality of internal electrodes further includes a tin oxide film disposed between the second alloy region and the one of the plurality of dielectric layers.

17. The electronic component according to claim 13, in, In at least one of the plurality of internal electrodes, based on 100% by weight of nickel, the alloy metal comprises an amount greater than or equal to 0.1% by weight and less than or equal to 15% by weight, and The weight percentage of aluminum included in at least one of the plurality of internal electrodes is greater than the weight percentage of tin included in at least one of the plurality of internal electrodes.

18. A method for manufacturing an electronic component, the method comprising: An unsintered body is formed, the unsintered body comprising a plurality of unsintered dielectric layers and a plurality of unsintered internal electrodes, the unsintered internal electrodes being formed by coating the unsintered dielectric layers with a conductive paste comprising nickel and an alloy metal; and The sintered body and the sintered internal electrode are formed by sintering the unsintered body. The inner electrode includes an inner electrode core and an inner electrode cover. The inner electrode core includes a first surface and a second surface that are opposite to each other. The inner electrode cover is disposed on the first surface and the second surface of the inner electrode core. The alloy metals include aluminum and tin. The inner electrode core is a sintered electrode made of nickel, and The inner electrode cover includes a first alloy region, which comprises an alloy of nickel and aluminum.

19. The method according to claim 18, wherein, The conductive paste comprises, based on 100% by weight of nickel, an amount of the alloy metal greater than or equal to 0.1% by weight and less than or equal to 15% by weight.

20. The method according to claim 18, wherein, The inner electrode cover also includes a second alloy region comprising an alloy of nickel and tin.

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