Projection exposure equipment for semiconductor lithography

Abstract

The invention relates to a projection exposure apparatus (1) for semiconductor lithography having a projection optical unit (9), comprising a sensor frame (30), a carrier frame (40), a module (50), the module (50) having an optical element (52) and an actuator (53) for positioning and / or orienting the optical element (52), wherein the module (50) is arranged on the carrier frame (40) and the sensor frame (30) is embodied as a reference for positioning the optical element (52), and wherein the module (50) comprises a base structure (60). According to the invention, the base structure (60) is embodied such that it comprises an interface (62, 70) for separating the module (50) from the projection optical unit (9). The invention also comprises a method for replacing a module (50) of a projection optical unit (9) of a projection exposure apparatus (1) for semiconductor lithography, wherein the module (50) comprises an optical element (52). According to the invention, a reference (55) for positioning and / or orienting an optical element (52) remains in the projection exposure apparatus (1) during the exchange of a module (50).

Description

[0001] This application claims the benefit of German patent application DE 10 2019 214242.7, filed on September 18, 2019, the contents of which are incorporated herein by reference in their entirety.

[0002] The invention relates to a projection exposure device for semiconductor lithography.

[0003] Such systems are used, in particular, to produce extremely small structures in semiconductor components or other microstructured components. Their operating principle is based on the production of very small structures, down to the nanometer range, by essentially miniaturizing the structures on a mask (using a so-called reticle) onto the element to be structured, which is coated with a photosensitive material. The minimum size of the structures produced is directly dependent on the wavelength of the light used. Recently, light sources with emission wavelengths in the nanometer range, for example, between 5 nm and 120 nm, and particularly in the 13.5 nm region, have become increasingly used. This wavelength range is also known as the EUV range. These highly complex projection exposure systems, particularly those for the EUV range, include, among other things, illumination and projection optics units, which are implemented as mechatronic systems and therefore have highly complex actuators, sensors, and cooling and decoupling systems. Projection optics units typically have 6 to 10 mirrors, most of which are adjustable within up to 6 degrees of freedom. Consequently, these systems include up to 60 actuators and more than 100 sensors. In addition to high-accuracy sensors for mirror positioning, numerous sensors are used for temperature measurement, system startup, acceleration measurement, and further monitoring of physical properties. Due to the large number of systems and subsystems, it is practically impossible to guarantee the functionality and imaging quality of the entire system throughout its entire lifecycle. Therefore, it must be assumed that, for example, the position control of the mirrors will fail during their service life due to actuator failure. Due to controllability requirements and practical space constraints, redundant configuration of the system is only possible to a limited extent. A further requirement for highly complex projection exposure systems is the ability to improve the underlying functionality and components, such as one or more deformable optical elements for further development of the projection optics unit. This allows, firstly, to improve the quality and imaging properties of the projection exposure system and, secondly, to respond to influences that remain unknown at the time of development. Prior art projection exposure systems already include the option to replace predefined components, which are typically selected in an early stage of the optical design so that optimal availability can be taken into account during the development of the projection exposure system. In this case, it is preferred to replace the first and last optical elements in the beam path, and only a few elements within the beam path. The proportion of replaceable optical elements in prior art systems is in the range of <= 20%. All other optical elements are no longer changeable during the service life of the system, and this occurs without replacing the projection optics unit, some other system, or the entire system.

[0004] Due to the complex process development and expensive commissioning of projection exposure equipment, where the differences between different projection exposure equipment within the specification range (the so-called fingerprint) and the imaging properties that are significantly influenced by the projection optical unit in particular are also taken into account, the simple solution for retrofitting, i.e. replacing the entire system (such as the projection optical unit), is not acceptable.

[0005] It is an object of the present invention to provide an apparatus which solves the above-mentioned disadvantages of the prior art.It is a further object of the present invention to specify a method for replacing projection lenses and components in a projection exposure apparatus.

[0006] This object is achieved by a device and a method having the features of the independent claims. The dependent claims relate to advantageous further developments and variants of the invention.

[0007] According to the present invention, a projection exposure apparatus for semiconductor lithography with a projection optics unit comprises a sensor frame, a carrier frame, a module with optical elements, and actuators for positioning and / or orienting the optical elements. The module is arranged on the carrier frame, and the sensor frame is implemented as a reference for positioning and / or orienting the optical elements. The module comprises a base structure implemented according to the present invention, such that it includes an interface for separating the module from the projection optics unit. The modular design of the projection optics unit has the advantage that individual modules can be replaced on-site, i.e., where they have been installed by the end customer. In this case, the so-called fingerprint, i.e., the imaging characteristics inherent to each projection exposure apparatus, can be preserved to the greatest extent possible. This is particularly important during the manufacture of electronic components, where, in addition to the imaging quality of the projection optics unit itself, the exposure process, particularly the photosensitive coating process, also has a significant impact on the quality of the structure. Therefore, the inherent characteristics of each individual projection exposure apparatus are taken into account in these processes. Furthermore, the individual modules, due to their smaller geometry, can be more easily transported and, with respect to replacement of the projection optics unit, the complexity of replacement is simplified.

[0008] Furthermore, the infrastructure can include electrical and / or optical and / or fluidic lines. A module can be separated from all these lines independently of the other modules, ie only one module can be removed from the projection optics unit without the other modules losing their position in the process.

[0009] Furthermore, the infrastructure of a plurality of modules can be connected in parallel to one another. The infrastructure line is thus implemented in a continuous manner and comprises a branch for each module, so that a plurality or all modules can be supplied in parallel by the infrastructure line.

[0010] Alternatively, the infrastructure of multiple modules can be connected in series. In this case, the infrastructure wiring can at least partially include the wiring of the modules, so that the infrastructure wiring extends from one module to another and connects them in series. If a module is removed, the interfaces of the infrastructure between the modules are released and the module is removed. The modules, in particular the sensors of the modules, remaining in the projection exposure apparatus are not mechanically altered when a module is removed. Therefore, after the removed module has been reinstalled, it can be put back into operation without having to reconfigure and / or calibrate the modules and / or sensors.

[0011] In a variant of the invention, at least one module can include a module-carrying frame. In this case, the module-carrying frame can be embodied so that it can determine the rigidity of the module and can serve as a central mechanical component of the module.

[0012] Furthermore, the actuator can be arranged on the module carrier frame. When the module is disassembled, the actuator is removed along with the module carrier frame. Therefore, the actuator can be replaced on the disassembled module, which advantageously simplifies actuator replacement due to better accessibility.

[0013] In particular, the actuator can be replaced without disassembling the module carrier frame. This has the advantage that in the event of a defective actuator, the outlay for replacement can be reduced to a minimum, since all other components, in particular the sensors, are not mechanically moved. Consequently, commissioning the module after actuator replacement is also significantly simplified.

[0014] In another embodiment of the invention, at least one module may include a sensor. The sensor may be constructed in a bipartite manner and include a sensor element and a sensor reference, wherein the sensor element may be connected to the module.

[0015] Additionally, the reference of the sensor can be arranged on the sensor frame.

[0016] In particular, the reference of the sensor can be embodied such that it does not change due to the removal of the module. This has the advantage that after replacing the module, the commissioning of the module and the entire projection exposure apparatus is advantageously simplified and downtimes of the projection exposure apparatus can be reduced to a minimum.

[0017] In this case, the sensor can be implemented, in particular, as an interferometer or an encoder. It is also conceivable to implement one part of the sensor arranged in the module as an interferometer and another part as an encoder. In this case, the choice of sensor type depends primarily on the arrangement of the module relative to the sensor frame and the often limited installation space. Furthermore, any other sensor type suitable for the task is also conceivable.

[0018] In case the sensor is implemented as an interferometer, it may comprise a sensor reference and a sensor element, which are arranged at a distance from each other in the range of 10 cm to 200 cm.

[0019] Furthermore, the module carrier frame may comprise mechanical interfaces for positioning and orienting on the carrier frame.The carrier frame may be embodied as a central component of the projection exposure apparatus, to which all modules may be mechanically connected.

[0020] In particular, the module carrier frame can be designed so that when the module carrier frame is connected to the carrier frame, the rigidity of the carrier frame is increased. As a result, the carrier frame and the module carrier frame can be designed with low rigidity and can therefore be advantageously easy to implement. The connection between the module carrier frame and the carrier frame can be achieved, for example, by screw connection.

[0021] Furthermore, the module carrier frame can be connected to the carrier frame in an overdetermined manner (with excessive or redundant connections). Due to the overdetermined mounting of the module carrier frame, for example, the tightening force can be increased and thus the overall stiffness of the module screwed to the carrier frame can be increased. For example, the force-locking connection generated by friction can also be designed for higher operating and / or transport loads, such as vibrations. Deformations that may be caused by the overdetermined mounting are decoupled by the actuator and are not transmitted to the optical element.

[0022] In one embodiment of the present invention, the sensor frame can be arranged in a volume defined by the carrier frame. This has the advantage that the sensor frame can be compact and thus have a low moment of inertia, thereby advantageously minimizing vibrations caused by external excitations.

[0023] In particular, the sensor frame can comprise a plurality of sub-frames. A multi-part construction of the sensor frame has the advantages that, firstly, production and assembly can be simplified and, secondly, transportation of the individual components can be simplified.

[0024] In this case, the sub-frames can be referenced to each other via the sensors. The referencing of the sub-frames to each other has the effect that the positions of the individual frames relative to each other (which positions vary due to movement of the frames relative to each other) are always known, so that the sensor frame can be used as a common reference for all modules.

[0025] In a variant of the invention, each optical element of the projection optical unit can be arranged in a dedicated module. This has the advantage that, regardless of malfunctioning or damaged optical elements or modules, the projection exposure apparatus can be ready for operation again with minimal downtime.

[0026] Furthermore, the projection exposure apparatus can be embodied such that the module can be exchanged while the projection optics unit is installed in the projection exposure apparatus. Exchanging the module while the projection optics unit is still installed in the projection exposure apparatus reduces the outlay for the exchange and thus reduces the downtime of the projection exposure apparatus, which in turn advantageously reduces the manufacturing costs of the electronic components.

[0027] In a method according to the invention for replacing a module of a projection optics unit of a projection exposure apparatus for semiconductor lithography, wherein the module comprises an optical element, according to the invention, a reference for positioning and / or orienting the optical element remains in the projection exposure apparatus during module replacement. This advantageously minimizes the costs for replacing optical elements, such as mirrors, actuators, or any other components of the module.

[0028] Furthermore, a module can be replaced without changing any other modules. Therefore, the references of other modules can remain unchanged, which advantageously reduces the commissioning time after the replacement.

[0029] Furthermore, modules can be calibrated after replacement, making module calibration less complex than calibrating the entire projection optics unit.

[0030] The projection exposure apparatus can in particular be ready for operation again after the replacement and calibration of a module. Consequently, no further module or group of modules of the projection exposure apparatus needs to be put into operation.

[0031] In one variant of the invention, the module can be replaced without changing the sensor frame. As a result, partial calibration of the module can optionally be eliminated and the commissioning time can be advantageously further reduced.

[0032] Furthermore, the mounting elements in the reticle and / or wafer modules can be moved into a parking position to exchange modules. For transferring a reticle and / or wafer, the mounting elements can be moved into a so-called parking position in the reticle and / or wafer modules. This simplifies access to the modules arranged below the reticle and / or wafer and / or above the reticle and / or wafer, respectively. Consequently, modules can be exchanged without additional effort, regardless of the arrangement of the optical elements relative to the reticle or wafer modules and the given installation space requirements.

[0033] Furthermore, the reticle module or wafer module can be disassembled to replace the module.

[0034] Furthermore, the projection optics unit can be removed from the projection exposure apparatus in order to replace a module. This situation arises whenever the module in which the projection optics unit is mounted is not accessible.

[0035] In one embodiment of the invention, the replacement of a module can have no effect on the process for exposing wafers optimized for a projection exposure apparatus. During the manufacture of electronic components, in addition to the imaging quality of the projection optical unit, the exposure process, in particular the behavior of the photosensitive coating during exposure and during subsequent processing, also influences the quality of the structure. Therefore, these processes are optimized for each imaging-specific property. Due to the removal of the projection optical unit and the reinstallation of the same optical elements, the imaging may have changed significantly, making it necessary to optimize the process again. By replacing only one module while maintaining the arrangement of all other modules, the changes in the individual imaging properties can be kept small enough that the existing processes can continue to be used without adaptation.

[0036] In one variant of the invention, more than 80%, in particular more than 90%, in particular 100% of the optical elements of the projection optical unit are replaced without modifying any other modules.

[0037] Exemplary embodiments and variants of the present invention are explained in more detail below with reference to the accompanying drawings, in which:

[0038] Figure 1 shows the basic construction of an EUV projection exposure apparatus in which the present invention can be implemented,

[0039] Figure 2 shows the basic structure of the EUV projection optical unit according to the present invention,

[0040] Figure 3a -c shows a detailed diagram of the present invention,

[0041] Figure 4a , b shows other details of the present invention,

[0042] Figure 5a , b shows other details of the present invention, and

[0043] Figure 6 A basic schematic diagram showing the tool for replacing modules.

[0044] Figure 1An example of the basic construction of a microlithography EUV projection exposure apparatus 1 in which the present invention can be used is shown. The illumination system of the projection exposure apparatus 1 has, in addition to a light source 3, an illumination optical unit 4 that illuminates an object field 5 in an object plane 6. EUV radiation 14, in the form of optically useful radiation generated by the light source 3, is collimated by a light collector integrated into the light source 3 so that the radiation passes through an intermediate focus in the region of an intermediate focal plane 15 and is incident on a field facet mirror 2. Downstream of the field facet mirror 2, the EUV radiation 14 is reflected by a pupil facet mirror 16. The field facets of the field facet mirror 2 are imaged into the object field 5 by means of the pupil facet mirror 16 and an optical assembly 17 having mirrors 18, 19, and 20.

[0045] A reticle 7 is illuminated, which is arranged in an object field 5 and held by a schematically illustrated reticle holder 8. A projection optical unit 9, which is only schematically illustrated, serves to image the object field 5 into an image field 10 in an image plane 11. The structures on the reticle 7 are imaged onto a photosensitive layer of a wafer 12, which is arranged in the region of the image field 10 in the image plane 11 and held by a wafer holder 13, also partially illustrated. The light source 3 can emit the radiation used, in particular, in a wavelength range between 5 nm and 120 nm.

[0046] The present invention can also be used in a DUV system (not shown). The DUV system is in principle configured similarly to the EUV system 1 described above, wherein mirrors and lens elements can be used as optical elements in the DUV system, and the light source of the DUV system emits the radiation used in the wavelength range of 100 nm to 300 nm.

[0047] Figure 2The basic construction of the projection optical unit 9 according to the invention is shown in a cross-sectional view. The projection optical unit 9 comprises six optical modules 50 and is connected to a reticle module 21 and a wafer module 22. The modules 50, 21, 22 are arranged around a central sensor frame 30 and are connected to a carrier frame 40. The modules 50, 21, 22 can also be connected to one another. In this case, the modules 50, 21, 22 are designed so that they can be separated from the projection optical unit 9 in the direction of the arrow without having to change any other modules 50, 21, 22. After a disassembled module 50, 21, 22 or an identical replacement module 50, 21, 22 has been reinstalled, the remaining modules 50, 21, 22 do not have to be recalibrated or reoriented, so that, if appropriate, only the replaced module 50, 21, 22 needs to be recalibrated. An arrangement of the modules 50, 21, 22 is also conceivable, wherein, for example, the first module 50, 21, 22 located farther away must be removed for an optical module 50 arranged farther away, for example, in the direction of the sensor frame 30 within the projection optical unit 9. The modules 50, 21, 22 are designed so that they can be removed and installed again without affecting the other modules 50, 21, 22 or the modules 50, 22, 11 themselves.

[0048] The optical module 50 includes at least one sensor 54, the latter comprising a sensor element 56 and a sensor reference 55. While the sensor element 56 is arranged on the optical element 52, the sensor reference 55 is arranged on the sensor frame 30 and thus determines the position and orientation of the optical element relative to the sensor frame 30 and therefore relative to all other optical modules 50, the reticle module 21, and the wafer module 22. In this case, the sensor 54 can be embodied in particular as an interferometer or an encoder.

[0049] When using an interferometric sensor 54, the sensor element 56 can include a mirror that reflects the optical radiation emitted by the sensor reference 55, which can be implemented as the sensor head of the interferometric sensor 54. In this case, the sensor reference 55 and the sensor element 56 can be arranged at a relatively large distance from each other, in particular, up to 10-200 centimeters. The use of an interferometric sensor allows for a more compact sensor frame 30, which is more advantageous in terms of oscillation excitation. Furthermore, a more compact sensor frame 30 allows for more free installation space. In particular, a more compact sensor frame 30 reduces the complexity of replacing or removing the optical module 50.

[0050] The sensor frame 30 and the carrier frame 40 are decoupled from each other (not shown), so that the reaction force of the actuator (not shown) of the optical module 50 cannot dynamically excite the sensor frame 30. In addition, the sensor frame 30 and the carrier frame 40 are also mounted in a decoupled manner relative to the projection exposure apparatus 1 (also not shown), so that excitation from the base system or other systems of the projection exposure apparatus has no effect or only a negligibly small effect on the imaging quality of the projection exposure apparatus.

[0051] EUV radiation 14 is composed of Figure 1 The light source 3 shown in FIG emits and passes through the same Figure 1 , the illumination optical unit 4 shown in FIG2 is directed onto the reticle 7, the EUV radiation 14 being reflected at the reticle 7 and reflected by a separate module 50 via an optical element 52 embodied as a mirror 52 and imaged onto the wafer 12. The reticle 7 is arranged in a reticle holder 8 and can be moved together with the object plane 6 parallel to the latter. The wafer 12 is arranged in a wafer holder 13 and can likewise be moved parallel to the image plane 11.

[0052] Figure 3a A detailed view of the present invention is shown, in cross-section, illustrating the effects of a carrier frame 40 together with an optical module 50. The optical module 50 typically includes three actuators 53, which are implemented as bipods and can position the optical element 52 in six degrees of freedom. In the illustrated example, only one actuator 53 is shown for clarity. Actuator 53 is connected to a module carrier frame 51, which is secured to a flange 41 of the carrier frame 40 via screws 23, thereby forming a mechanical interface 42 between the module carrier frame 51 and the carrier frame. This arrangement allows the optical module 50 to be easily released from the carrier frame 40 and readily disassembled. The optical module 50 reinforces the carrier frame 40 with its screw connection, which is implemented as an overdetermined screw connection, thereby advantageously increasing the eigenmodes of the carrier frame 40. In this case, the actuators 53 are implemented or arranged in the module carrier frame 51, allowing them to be replaced even without disassembling the optical module 50 (see arrows). Optical element 52 includes sensor element 56 of sensor 54, which, in conjunction with actuator 53 and open-loop or closed-loop control (not shown), can position and orient optical element 52 with an accuracy in the range of less than one nanometer.

[0053] Figure 3b Another detail of the present invention is shown, showing an optical module 50 in cross-section. Figure 3a In addition to the actuator 53 and the sensor 54 shown in FIG, the optical module 50 also comprises end stops 58 which limit the movement of the optical element so that the actuator, for example implemented as a Lorentz actuator, and the optical element 52 itself are protected from damage. Figure 3bThe actuators and sensors are not shown in the drawing. The end stops 58 are held in mounts 57 arranged on the module-carrying frame 51 , wherein the end stops 58 are embodied such that they are easily accessible and replaceable in the event that the module 50 has been disassembled.

[0054] Figure 3c Another detail of the present invention is shown, showing the impact from the carrier frame 40 and the optical module 50 in cross-section. For clarity, Figure 3b The actuator, sensor and end stop shown in Figure 3c . The transport securing members 59 are connected to the module carrier frame 51 by screws 23, wherein the transport securing members 59 are shown in a transport position, i.e., a position for transporting the optical module 50. The transport securing members 59 press the optical element 52 into its end stop (not shown), for example, by spring force, thereby securing the optical element 52. In this case, the transport securing members 59 are also designed so that they can be replaced even without disassembling the optical module 50.

[0055] All functional elements required for the positioning and orientation of the optical element 52 - i.e. actuators, sensors, end stops and transport securing members - are arranged on the module and can therefore be replaced in a simple manner and without disassembling the module, and in part even without removing the module from the projection optical unit.

[0056] Figure 4a Another detail of the present invention shows an optical module 50 installed in a carrier frame 40 from the rear side facing away from the optical elements (not visible). The optical module 50 includes three actuators 53, each arranged at a 120° angle, three transport securing members 59, each offset by 60° relative to the actuators 53, and three interfaces 77 for a replacement device (not shown) for replacing the optical module 50. Interfaces 62 and 70 for the base structure 60 of the optical module 50 are also arranged on the rear side of the optical module 50. Interfaces 70 for fluid lines are provided in two of the four corners of the rectangular module carrier frame 51, via which the optical module 50 can be connected to compressed air or hydraulic lines. Interfaces 62 for cables, i.e., for electrical or optical lines, are arranged in direct proximity, with multiple plug connectors positioned adjacent to one another. Multiple screws 23, arranged in a row, for the screw connection 75 between the optical module 50 and the carrier frame 40 are located on both sides of the module carrier frame 51. By means of this overdetermined connection, the contact stiffness can be designed so that the module carrier frame 51 as part of the carrier frame actively increases the eigenmodes of the carrier frame 40 and prevents the module carrier frame 51 from sliding on the carrier frame 40, for example due to vibration events during transportation.

[0057] Figure 4b Another detail of the invention is shown, in which an optical module 50 with an optical element 52 is shown in a plan view from the front side of the optical module 50. For the sake of clarity, the actuators, sensors, end stops and transport securing members are not shown or are hidden by the optical element 52. In addition, the three mechanical interfaces 42 are arranged at an angle of 120° relative to each other, which are implemented so that the accuracy of positioning the optical module 50 on the carrying frame (not shown) can be lower than 50 μm, in particular lower than 30 μm, in particular lower than 20 μm. In this case, the stroke of the actuator (not shown) is designed so that the optical element 52 can be positioned in its desired position and desired orientation after the optical module 50 has been screwed to the carrying frame. After the module carrying frame 51 has been oriented on the carrying frame (not shown), it is connected to the carrying frame by means of screw connections 75, Figure 4b Only the through-holes 43 of the screw connections 75 are shown.

[0058] Figure 5a Another detailed view of the present invention shows the interface 70 for fluid line 69. In this case, interface 70 comprises two adapters 73, 73', which are arranged in cutouts 76, 76', respectively, on the module carrier frame 51 and carrier frame 40. Line 69 is guided through a socket 78 in the module carrier frame 51, and its ends bear against adapter 73. The latter is additionally sealed against cutout 76 by a seal 74 and secured to the module carrier frame 51 by screws 23. On the side of adapter 73 facing the corresponding adapter 73' of carrier frame 40, a tapered pipe section 71 is implemented. When the module 50 is screwed onto the carrier frame 40, this pipe section descends into the corresponding opening 72 in adapter 73' of carrier frame 40, creating a tight connection due to its tapered design. Seal 74 is arranged outside opening 72 and creates an additional seal between adapters 73'. Adapter 73' is arranged in cutout 76' of carrier frame 40 and connected to it by screws 23.

[0059] Figure 5b Another detail of the invention is shown, showing an interface 62 for a line 61 which is implemented as an electrical or optical cable 61. The socket 64 of the plug connector 79 is arranged in a socket receptacle 65'.

[0060] In the embodiment of the present invention, the slot receptacle 65' is then arranged in a cutout 76' of the carrier frame 40 and connected to the latter via screws 23. The plug 63 corresponding to the slot 64 is arranged in a plug receptacle 65, which is connected to the module carrier frame 51 in the cutout 76 via a resilient mounting element 66 embodied as a spring. In order to align the plug 63 and the slot 64 during the connection of the module carrier frame 51 and the carrier frame 40, a recess 67 is formed in the plug receptacle 65, and a pin 68 with a corresponding geometry (which is arranged on the slot receptacle 65') can enter the recess. As a result, the plug 63 and the slot 64 are pre-aligned and can be plugged together in a simple manner. The pin 68 can also establish a coding so that different sockets 65, 65' can only be plugged in at the position provided for them and in the correct orientation, thereby advantageously avoiding errors caused by incorrect plug connections 79.

[0061] Figure 6 A replacement device 80 for replacing or installing an optical module 50 of a projection exposure apparatus is shown. The replacement device 80 includes a bracket 81 having a guide 84 on which a slide 83 can move along an axis. The slide 83 can be locked by means of a locking member 85 at the upper end of the bracket 81. A stopper 86 is arranged at the lower end of the guide 84 and is designed to prevent the slide 83 and the adapter 90 fixed thereto from colliding with the optical module 50. The replacement device 80 can be attached to a commercial crane (not shown), such as those typically used in production plants, by means of a connecting rod 82. The bracket 81 is positioned on the interface 89 of the carrier frame 40 by means of a locating pin 87 arranged at the interface 89. The optical module 50 is connected to the slide 83 via an adapter 90. Both the interface 77 of the optical module 50 and the interface 93 of the floating mount 91 of the adapter 90 are designed as bayonet catches, with the two bayonet catches 77 and 93 being interconnected by a cable 92. In this case, the bayonet catch 93 connected to the floating mount 91 is embodied so that the length of the adapter 90 is adjustable. In this regard, before the optical module 50 is lowered onto the carrier frame 40, the optical module 50 can be oriented parallel to the mechanical interface 42 on the carrier frame 40 with the aid of the tilt sensor 88 arranged on the optical module 50. During the replacement process, the mechanical interface 42 is adapted by means of washers (not shown), so-called spacers, so that the optical module 50 is positioned within a tolerance range of the position and orientation of the position before the replacement.

[0062] Reference Signs List

[0063] 1 Projection exposure equipment

[0064] 2-field facet mirrors

[0065] 3 Light Source

[0066] 4 Illumination optical unit

[0067] 5 Material Field

[0068] 6 Object Plane

[0069] 7 Reticle Master

[0070] 8 Reticle holder

[0071] 9 Projection optical unit

[0072] 10 Image Field

[0073] 11 Image plane

[0074] 12 chips

[0075] 13 Wafer holder

[0076] 14 EUV radiation

[0077] 15 Intermediate field focal plane

[0078] 16-Pupil Faceted Mirror

[0079] 17 Assembly

[0080] 18 Reflector

[0081] 19 Reflector

[0082] 20 reflectors

[0083] 21 Mask Master Module

[0084] 22 chip module

[0085] 23 screws

[0086] 30 sensor frame

[0087] 40 Carrying Frame

[0088] 41 flange

[0089] 42 Mechanical Interface

[0090] 43 through holes

[0091] 50 optical modules

[0092] 51 module carrying frame

[0093] 52 optical components

[0094] 53 Actuator

[0095] 54 sensors

[0096] 55 Sensor Reference

[0097] 56 sensor elements

[0098] 57 Mounting parts

[0099] 58 End stop

[0100] 59 Transport fixed components

[0101] 60 Infrastructure

[0102] 61 Cable

[0103] 62 cable interface

[0104] 63 plug

[0105] 64 slots

[0106] 65, 65' socket

[0107] 66 elastic mounting parts

[0108] 67 Recess

[0109] 68 pins

[0110] Route 69

[0111] 70 Line Interface

[0112] 71 pipe section

[0113] 72 Opening

[0114] 73, 73′ adapter

[0115] 74 seals

[0116] 75 Screw connection of the carrying frame

[0117] 76, 76′ adapter cutout

[0118] 77 Interface for replacing the device

[0119] 78 line socket

[0120] 79 plug connector

[0121] 80 Replacement device

[0122] 81 bracket

[0123] 82 crane connecting rod

[0124] 83 Slide

[0125] 84 guides

[0126] 85 Slider locking member

[0127] 86 lower stopper

[0128] 87 Locating pin for bracket on carrying frame

[0129] 88 Tilt sensor

[0130] 89 Replacement device - Carrying frame interface

[0131] 90 Adapter

[0132] 91 Adapter mounting

[0133] 92 cables

[0134] 93 Interface for adapter mounting

Claims

1. A projection exposure apparatus (1) for semiconductor lithography having a projection optical unit (9), comprising: - sensor frame (30), - a carrying frame (40), a module (50) having an optical element (52) and an actuator (53) for positioning and / or orienting the optical element (52), wherein the module (50) is arranged on the carrier frame (40) and the sensor frame (30) is embodied as a reference for the positioning and / or orientation of the optical element (52), and wherein the module (50) comprises a base structure (60), It is characterized by: The basic structure (60) is embodied such that it comprises interfaces (62, 70) for separating the modules (50) from the projection optical unit (9), wherein at least one module (50) comprises a module carrier frame (51), and wherein the module carrier frame (51) is connected to the carrier frame (40) in an overdetermined manner.

2. The projection exposure apparatus (1) according to claim 1, It is characterized by: The basic structure (60) includes electrical and / or optical circuits (61), and / or fluid circuits (69).

3. The projection exposure apparatus (1) according to claim 1 or 2, It is characterized by: The base structures (60) of the plurality of modules (50) are connected in parallel to each other.

4. The projection exposure apparatus (1) according to claim 1 , It is characterized by: The base structures (60) of the plurality of modules (50) are connected in series with each other.

5. The projection exposure apparatus (1) according to claim 1 , It is characterized by: The actuator (53) is arranged on the module carrying frame (51).

6. The projection exposure apparatus (1) according to claim 1 , It is characterized by: The actuator (53) can be replaced without disassembling the module carrying frame (51).

7. The projection exposure apparatus (1) according to claim 1 , It is characterized by: At least one module (50) includes a sensor (54).

8. The projection exposure apparatus (1) according to claim 7, It is characterized by: A reference of the sensor (54) is arranged on the sensor frame (30).

9. The projection exposure apparatus (1) according to claim 8, It is characterized by: The reference of the sensor (54) is implemented so that it is not modified by disassembly of the module (50).

10. The projection exposure apparatus (1) according to any one of claims 7 to 9, It is characterized by: The sensor (54) is implemented as an interferometer.

11. The projection exposure apparatus (1) according to claim 10, It is characterized by: The sensor (54) comprises a sensor reference (55) and a sensor element (56), the sensor reference (55) and the sensor element (56) being arranged at a distance from each other in the range of 10 cm to 200 cm.

12. The projection exposure apparatus (1) according to claim 1, It is characterized by: The module carrier frame (51) includes a mechanical interface (42) for positioning and orientation on the carrier frame (40).

13. The projection exposure apparatus (1) according to claim 1 , It is characterized by: The module carrying frame (51) is implemented so that when the module carrying frame (51) is connected to the carrying frame (40), the rigidity of the carrying frame (40) is increased.

14. The projection exposure apparatus (1) according to any one of the preceding claims, It is characterized by: The sensor frame (30) is arranged within a volume defined by the carrier frame (40).

15. The projection exposure apparatus (1) according to any one of the preceding claims, It is characterized by: The sensor frame (30) includes a plurality of sub-frames.

16. Projection exposure apparatus (1) according to claim 15, It is characterized by: The subframes are referenced to each other through sensors.

17. The projection exposure apparatus (1) according to any one of the preceding claims, It is characterized by: The individual optical elements (52) of the projection optical unit (9) are arranged in a dedicated module (50).

18. The projection exposure apparatus (1) according to any one of the preceding claims, It is characterized by: The projection exposure tool (1) is embodied such that the module (50) can be replaced while the projection optics unit (9) is installed in the projection exposure tool (1).

19. A method for replacing a module (50) of a projection optical unit (9) of a projection exposure apparatus (1) for semiconductor lithography, wherein: The projection optical unit (9) comprises a sensor frame (30) and a carrying frame (40); The module (50) is arranged on the carrying frame (40); The module (50) includes an optical element (52) and a module carrying frame (51); The module carrying frame (51) is connected to the carrying frame (40) in an overdetermined manner; The sensor frame (30) is a reference (55) for positioning and / or orienting the optical element (52); as well as During the replacement of the module (50), the sensor frame (30) remains in the projection exposure apparatus (1).

20. The method according to claim 19, It is characterized by: The module (50) can be replaced without changing any other modules (50).

21. The method according to claim 19 or 20, It is characterized by: The module (50) is calibrated after the replacement.

22. The method according to claim 21, It is characterized by: After the module (50) has been replaced and calibrated, the projection exposure apparatus (1) is ready for operation again.

23. The method according to any one of claims 19 to 22, It is characterized by: The module (50) can be replaced without changing the sensor frame (30).

24. The method according to any one of claims 19 to 23, It is characterized by: The mountings (8, 13) in the reticle module (21) and / or wafer module (22) are moved to a parking position to replace the module (50).

25. The method according to claim 24, It is characterized by: The reticle module (21) or wafer module (22) is disassembled to replace the module (50).

26. The method according to any one of claims 19 to 25, It is characterized by: The projection optical unit (9) has to be removed from the projection exposure apparatus (1) in order to replace the module (50).

27. The method according to any one of claims 19 to 26, It is characterized by: The replacement of the module (50) has no influence on the process for exposing a wafer optimized for the projection exposure apparatus (1).

28. The method according to any one of claims 19 to 27, It is characterized by: More than 80% of the optical elements (52) of the projection optical unit (9) can be replaced without changing any other modules (50).

29. The method according to any one of claims 19 to 27, It is characterized by: More than 90% of the optical elements (52) of the projection optical unit (9) can be replaced without changing any other modules (50).

30. The method according to any one of claims 19 to 27, It is characterized by: 100% of the optical elements (52) of the projection optical unit (9) can be replaced without modifying any other modules (50).

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