A method for identifying defects in electronic components

Abstract

The present invention provides a method for identifying defects of electronic components, a detection device, and a storage medium, including a detection process for electrode foil defects and a detection process for core package defects. The detection process for electrode foil defects includes: S101 extracting information of the target to be measured in the picture and determining the specific position of the target to be measured in the picture; S102 obtaining the electrode foil information of the target to be measured and comparing it with the preset value of the electrode foil to determine whether the electrode foil information conforms to the preset value of the electrode foil. If it does not conform, it is a defective electronic component. The detection process for core package defects includes: S201 determining the position of the core package in the picture; S202 obtaining the core package information and comparing it with the preset value of the core package to determine whether the core package information conforms to the preset value of the core package. If it does not conform, it is a defective electronic component. The present invention sets up a detection process for electrode foil defects and a detection process for core package defects, which can effectively identify the electrode foil and core package of electronic components, reduce the need for manual labor, and improve the detection efficiency before the electronic components leave the factory.

Description

Technical Field

[0001] The present invention belongs to the field of intelligent recognition, and particularly relates to a method for identifying defects of electronic components, a detection device, and a storage medium. Background Art

[0002] With the development of the electronics industry, the demand for electronic components has been increasing year by year. Before traditional electronic components leave the factory, it is necessary for workers to visually identify the appearance of the electronic components to determine whether they meet the factory quality standards. This has led to a large demand for labor and limited production capacity. Although intelligent recognition devices are currently used in some electronic production lines to replace manual identification, most of them are for identifying larger electronic products such as circuit boards. Since electronic components are small in size, it is difficult to identify them, and there is a lack of a suitable method to identify defects in electronic components. Summary of the Invention

[0003] The present invention provides a method for identifying defects of electronic components, specifically for identifying defects of capacitors, so as to achieve the effect of intelligent identification of defects of electronic components.

[0004] The present invention provides a method for identifying defects of electronic components, including a process for detecting defects of the electrode foil and a process for detecting defects of the core package. The process for detecting defects of the electrode foil includes:

[0005] S101 Extract the information of the target to be measured in the picture and determine the specific position of the target to be measured in the picture;

[0006] S102 Obtain the electrode foil information of the target to be measured and compare it with the preset value of the electrode foil to determine whether the electrode foil information meets the preset value of the electrode foil. If not, it is a defective electronic component;

[0007] The electrode foil information includes at least one of the following: the area of the nail head, the angle of the nail head, the number of nail holes, the area of the nail holes, the displacement of the nail holes, the area of the petals, the area of the cracks in the electrode foil, the degree of deviation of the nail holes, and the distance between the nail head and the nail holes;

[0008] The process for detecting defects of the core package includes:

[0009] S201 Determine the position of the core package in the picture;

[0010] S202 Obtain the core package information and compare it with the preset value of the core package to determine whether the core package information meets the preset value of the core package. If not, it is a defective electronic component;

[0011] The core package information includes at least one of the following: the height of the core package, the width of the core package, the pitch of the core package pins, and the uneven height of the core package pins.

[0012] Furthermore, the target to be measured is provided with an identification structure, and the identification structure can be selected from one of aluminum foil and identification images;

[0013] The step S101 extracts the information of the target to be measured in the picture and determines the specific position of the target to be measured in the picture, including:

[0014] S1011 loops through the color values, extracts the contours corresponding to the color values in the picture, calculates the four-corner coordinates of the calculated contours, and determines whether they meet the coordinate requirements of the identification structure. If not, this step is repeated; if so, it is exported.

[0015] Furthermore, the step S101 extracts the information of the target to be measured in the picture, and determining the specific position of the target to be measured in the picture further includes:

[0016] S1012 calculates the height of the contour based on the exported four-corner coordinates and compares it with the height of the identification structure. If they match, it is determined that this contour is the image contour of the identification structure; if not, step S1011 is repeated.

[0017] Furthermore, the step S102 obtains the pole foil information of the target to be measured and compares it with the preset value of the pole foil to determine whether the pole foil information meets the preset value of the pole foil. If not, it is a defective electronic component, specifically including:

[0018] S1021 determines the nail head of the target to be measured, calculates the contour area of the nail head, and compares it with the preset value of the contour area. If the preset value of the contour area is not satisfied, it is a defect;

[0019] S1022 determines the angle between the straight line where the two coordinate points of the nail needle are located and the horizontal line of the nail head. If the preset value of the angle is not satisfied, it is a defect;

[0020] S1023 detects the nail hole information, and the nail hole information includes at least one of the number of nail holes and the area of the nail hole;

[0021] S1024 collects the center coordinates of the nail holes, performs a difference calculation with the nail hole position information, and compares it with the preset difference. If the preset difference is not satisfied, it is a defect;

[0022] S1025 determines whether the area of each petal at the nail hole is within the allowable range. If not, it is a defect;

[0023] S1026 extracts the approximate position of the pole foil cracking, performs image processing, extracts the cracking area information, and performs a difference calculation with the original image to obtain a difference image containing cracking, and calculates the proportion of the white contour area in the cracking image, which can confirm whether there is a cracking phenomenon in the aluminum foil sheet. If there is cracking, it is a defect;

[0024] S1027 calculates the angle between the straight line formed by the centers of multiple nail holes and the horizontal line of the aluminum foil sheet, and judges whether the nail holes are offset by judging the angle. If the offset exceeds the preset offset value, it is a defect;

[0025] S1028 Calculate the difference between the distance from the nail head to the identification structure and the distance from the nail hole closest to the nail head to the identification structure, and determine whether the difference in distance meets the preset range. If it does not meet the preset range, it is a defect.

[0026] Further, the S201 for determining the position of the core package in the picture includes:

[0027] S2011 Determine the maximum contour of the background light in the core package picture;

[0028] S2012 Extract the core package shadow information under the background light and determine the core package contour;

[0029] S2013 Perform erosion, dilation processing, and correction on the picture to obtain the minimum circumscribed rectangle image of the core package.

[0030] Even further, the S201 for determining the position of the core package in the picture further includes:

[0031] S2014 According to the minimum circumscribed rectangle image of the core package, adjust the picture angle until at least one side of the minimum circumscribed rectangle image of the core package is perpendicular or parallel to the horizontal, and repeat steps S2011 - S2013 again to obtain the minimum circumscribed rectangle image of the core package.

[0032] Even further, the S202 for obtaining the core package information and comparing it with the preset value of the core package to determine whether the core package information meets the preset value of the core package. If it does not meet, the defective electronic components include:

[0033] S2021 Determine the core package contour coordinate points according to the minimum circumscribed rectangle image of the core package in S2014;

[0034] S2022 Obtain the core package height, core package width, core package lead pitch, and core package high and low leads respectively according to the core package contour coordinate points, and compare them with the preset values of the core package. If they do not meet, mark them as defective.

[0035] Further, it also includes an information statistics process, and the information statistics process includes:

[0036] Collect the anode foil information and core package information, identify the anode foil information and core package information that do not match the preset values, and export them.

[0037] The identification method of the present invention can be applied to detection equipment, especially vision detection equipment, and can be used for identifying defects of electronic components with chips and anode foils.

[0038] In the identification method of the present invention, it is formed as software and stored in a storage medium, such as a USB flash drive, hard disk, cloud disk, mobile phone, etc. The storage medium contains executable instructions for the defect identification method.

[0039] Compared with the prior art, the present invention sets up a detection process for the flaws of the electrode foil and a detection process for the flaws of the core package, which can effectively identify the electrode foil and the core package of electronic components, and achieve an intelligent identification effect by comparing with preset values, reducing the need for manual labor and improving the detection efficiency before the electronic components leave the factory. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the detection process for the flaws of the electrode foil in an embodiment of the present invention;

[0041] Figure 2 It is a schematic diagram of the detection process for the flaws of the core package in an embodiment of the present invention;

[0042] Figure 3 It is a specific flowchart of S101 in an embodiment of the present invention;

[0043] Figure 4 It is a specific flowchart of S102 in an embodiment of the present invention;

[0044] Figure 5 It is a specific flowchart of S201 in an embodiment of the present invention;

[0045] Figure 6 It is a schematic diagram of the nail head structure in an embodiment of the present invention;

[0046] Figure 7 It is a schematic diagram of taking a photo of the core package in an embodiment of the present invention

[0047] Figure 8 It is a schematic diagram of the corrosion of the core package in an embodiment of the present invention

[0048] Figure 9 It is a schematic diagram of the correction of the core package in an embodiment of the present invention

[0049] Figure 10 It is a schematic diagram of the misidentification of the anode foil in an embodiment of the present invention;

[0050] Figure 11 It is a schematic diagram of the crack of the electrode foil in an embodiment of the present invention

[0051] Figure 12 It is a schematic diagram of the misidentification of the cathode foil in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0052] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0053] The embodiment of the present invention discloses a method for identifying flaws in electronic components, including a detection process for the flaws of the electrode foil and a detection process for the flaws of the core package. The detection process for the flaws of the electrode foil is as follows Figure 1As shown in the figure, it includes:

[0054] S101 Extract the information of the target to be measured in the picture and determine the specific position of the target to be measured in the picture;

[0055] Among them, in the embodiment of the present invention, taking a capacitor as an example, the picture is taken by a vision device;

[0056] S102 Obtain the electrode foil information of the target to be measured, compare it with the preset value of the electrode foil, and determine whether the electrode foil information meets the preset value of the electrode foil. If it does not meet, it is a defective electronic component;

[0057] Among them, the preset value of the electrode foil can be set manually according to the specific size of the electronic component, or can be set by collecting relevant data specification information of the electronic component;

[0058] The electrode foil information at least includes one of the nail head area, nail head angle, number of nail holes, nail hole area, nail hole displacement, petal area, electrode foil crack area, nail hole deviation degree, and nail head to nail hole spacing information;

[0059] Among them, the nail head is the structure where the electrode foil is connected to the capacitor body, such as Figure 10 , Figure 11 As shown, in the embodiment of the present invention, the number of nail holes is 4, the standard is a straight line, and it is parallel to the nail head structure.

[0060] The core package defect detection process is as shown in Figure 2 and includes:

[0061] S201 Determine the position of the core package in the picture;

[0062] Among them, as shown in Figure 7 , the core package picture is taken under a backlight;

[0063] S202 Obtain the core package information, compare it with the preset value of the core package, and determine whether the core package information meets the preset value of the core package. If it does not meet, it is a defective electronic component;

[0064] The core package information at least includes at least one of the core package height, core package width, core package lead pitch, and core package high and low leads.

[0065] In the embodiment of the present invention, the electrode foil defect detection process and the core package defect detection process are set up, which can effectively identify the electrode foil and core package of the electronic component, and through comparison with the preset value, achieve the effect of intelligent identification, reduce the need for manual work, and improve the detection efficiency of the electronic component before leaving the factory.

[0066] Optionally, the target to be measured is provided with an identification structure, and the identification structure can be one of aluminum foil and identification image;

[0067] Step S101 extracts the information of the target to be measured in the picture and determines the specific position of the target to be measured in the picture, such as Figure 3 shown, including:

[0068] S1011 loops through the color values, extracts the contours corresponding to the color values in the picture, calculates the four-corner coordinates of the contour, and determines whether they meet the coordinate requirements of the identification structure. If not, repeat this step; if so, export.

[0069] Among them, the identification structure is the polar foil (aluminum foil), which is arranged on the core package of the capacitor; in the actual process of the embodiment of the present invention, the color range of the polar foil is determined through the HSV color table, within Scalar(0,0,46)-Scalar(180,43,220). By looping through the color values, the contour is determined; by extracting the four-corner coordinate positions of the contour, taking the embodiment of the present invention as an example, the embodiment of the present invention can use a positioning device and adjust the industrial camera to make the polar foil of the capacitor appear rectangular in the camera. If the coordinates of the four corners in the picture meet the rectangle, it is the polar foil structure and is determined as the target contour. If not, repeat looping through the color values.

[0070] The embodiment of the present invention can perform intelligent recognition on the image by looping through the color values, extracting the contour, and calculating the coordinates, determine the polar foil structure, and further determine the specific position of the target to be measured in the picture from the perspective of visual recognition, achieving the effect of intelligent correction.

[0071] Particularly, the step that S101 extracts the information of the target to be measured in the picture and determines the specific position of the target to be measured in the picture further includes:

[0072] S1012 calculates the height of the contour according to the exported four-corner coordinates and compares it with the height of the identification structure. If they match, determine that this contour is the image contour of the identification structure; if not, repeat step S1011.

[0073] Among them, as Figure 10 , Figure 12 shown, there is still a low probability of misidentification in the process of S1011 (that is, meeting the conditions of S1011, but at this time the recognized height is significantly inconsistent with the actual height of the polar foil). The embodiment of the present invention adopts S1012 to pre-determine the height that the polar foil should have in the picture (this height refers to the vertical distance between the upper edge and the lower edge of the polar foil) as a preset value, and matches the four-corner coordinates exported by S1011. If it meets the height of the polar foil, this contour is the image contour of the polar foil; if not, it means that this contour does not meet the image contour of the polar foil and needs to re-perform the contour extraction process through S1011.

[0074] The embodiment of the present invention can perform intelligent screening on the polar foil by adopting S1012, avoid the occurrence of small-probability error situations, and effectively improve the recognition accuracy of the polar foil.

[0075] Specifically, S102 obtains the pole foil information of the target to be measured, compares it with the preset value of the pole foil, and determines whether the pole foil information meets the preset value of the pole foil. If not, it is a defective electronic component, such as Figure 4 as shown, specifically including:

[0076] S1021 determines the nail head of the target to be measured, calculates the contour area of the nail head, and compares it with the preset value of the contour area. If the preset value of the contour area is not satisfied, it is a defect;

[0077] Among them, S1021 is blank material detection to determine the nail head of the target, specifically including: S1021 determines the nail head contour. The white part of the nail head is relatively obvious. Set the color range Scalar(0,0,221), Scalar(180,30,255), draw the contour, and according to the nail head structure, as Figure 6 shown, the nail head structure is divided into a first part, a second part, and a third part from bottom to top. The first part is set as the straight line direction of the nail needle, and the third part is used as the area of the positive pole foil nail head (in the negative pole foil, due to the darker color of the third part, an error is generated, so the second part is used as the nail head area); S1022 calculates the contour area, compares it with the standard area, and judges whether it meets the factory requirements. If it is significantly smaller than the standard area, it is blank material.

[0078] S1022 determines the included angle between the straight line where the two coordinate points of the nail needle are located and the horizontal line of the nail head. If the preset value of the included angle is not satisfied, it is a defect;

[0079] Among them, using the nail needle coordinate points obtained in the S1021 process, calculate the included angle between the straight line of the two nail needle points and the horizontal horizontal line. If the preset value of the included angle is not satisfied, the deviation angle of the nail needle is too large, which is a defect.

[0080] S1023 detects the nail hole information, and the nail hole information includes at least one of the nail hole number and the nail hole area;

[0081] Among them, in the embodiment of the present invention, the nail hole information includes the nail hole number and the nail hole area. The specific process is as follows: S10231 loops the color value, extracts the contour corresponding to the color value in the picture, calculates the contour width information, and judges whether it meets the nail hole width requirement. If not, repeat this step; if it meets, export; S10232 matches the number of exported contours with the actual nail hole number of the capacitor. If they are the same, perform S10233. If they are different, repeat S10231; S10231 calculates the position information of each contour. If they are on the same straight line, determine each contour as a nail hole. If they are not on the same straight line, repeat S10231.

[0082] S1024 collects the center coordinates of the nail holes, performs a difference calculation with the nail hole position information, and compares it with the preset difference. If the preset difference is not satisfied, it is a defect;

[0083] Among them, through S1023, the positions of the nail holes are determined, the central coordinates of the nail holes are calculated, the central coordinates of each nail hole are compared, and the deviation between each nail hole is marked. If it meets the requirements of the preset value, it is qualified; if not, it is a defective product.

[0084] S1025 measures whether the area of each petal at the nail hole is within the allowable range. If not, it is a defect.

[0085] Among them, in Embodiment 1 of the present invention, there are 4 petal-shaped structures around one nail hole. By detecting the number of holes and obtaining the center point positions of each hole, four rectangles are divided from the center to the surrounding to obtain the approximate positions of the petals. Fix the w and h of the petal rectangle, which are set to 18 here, and the positions of the upper left, upper right, lower left, and lower right rectangles can be directly calculated.

[0086] Specifically, S1025 includes: S10251 loops through the color values, extracts the color values corresponding to the petal contours around the nail hole in the picture, calculates the contour area information, and judges whether it meets the petal area requirements. If not, this step is repeated; if it meets, it is exported; S10252 matches the number of exported contours with the actual number of petals of the capacitor. If they are the same, S10253 is performed; if not, S10251 is repeated.

[0087] If the method of S1023 is directly adopted, after obtaining the approximate rectangular frame where the petals are located, the contours of the petals need to be extracted. Since the color of the petals is relatively white, through color extraction, according to the hsv color table, the range of the white area can be seen as cv::Scalar(0,0,221), cv::Scalar(180,30,255). During on-site testing, since there are white markings beside the petals of the capacitor, image recognition will recognize the white beside the petals, resulting in a large error in the calculation of the petal area. More specifically, in Embodiment 1 of the present invention, S10251 performs grayscale processing on the picture, and through median filtering, binary processing is performed on the high-threshold information and low-threshold information respectively, and the contour value is obtained by subtraction, which can effectively remove the influence of the white beside the petals.

[0088] S1026 As Figure 11 shown, extract the approximate position of the crack on the electrode foil, perform image processing, extract the crack area information, and perform a difference calculation with the original picture to obtain a difference image containing the crack. Calculate the proportion of the white contour area in the crack image to confirm whether there is a crack in the aluminum foil sheet. If there is a crack, it is a defect.

[0089] Among them, in embodiment S1026 of the present invention, the picture is grayscale processed, and through median filtering, binarization processing is respectively performed on the high-threshold information and the low-threshold information, and the value at the cracked position of the electrode foil is obtained by subtraction. Then, a difference calculation is performed with the original picture to obtain a difference image containing cracks (white contours), and the proportion of the area of the white contour in the cracked image is calculated to confirm whether there is a cracking phenomenon in the aluminum foil sheet.

[0090] S1027 Calculate the angle between the straight line formed by the centers of multiple nail holes and the horizontal line of the aluminum foil sheet, and judge whether the nail holes are offset by judging the angle. If the offset exceeds the preset offset value, it is a defect.

[0091] Among them, through the nail hole center positions obtained above, in embodiment of the present invention, the 4 nail holes are divided into two groups, and the angles between the straight lines formed by the two groups and the horizontal line of the aluminum foil sheet are respectively determined and averaged to obtain the final result.

[0092] S1028 Calculate the difference between the distance from the nail head to the marking structure and the distance from the nail hole closest to the nail head to the marking structure, and judge whether the difference in distance meets the preset range. If it does not meet the preset range, it is a defect.

[0093] Among them, S1028 is also called H value detection. Through the nail hole center position and the rectangular position of the nail head, the distance from the nail head to the aluminum foil sheet and the distance from the nail hole closest to the nail head to the aluminum foil sheet are respectively calculated, and it is judged whether the interval distance between the nail head and the nail hole is reasonable. If it does not meet the preset range, it means that the distance between the nail hole and the nail head is too large, and there are production quality defects.

[0094] It should be noted that the above steps S1021 - S1028 are only for description and marking, and do not limit that the embodiments of the present application can only adopt the above order. The specific recognition method can be adjusted by the user according to actual needs, or the user can select one or more steps according to needs.

[0095] Through the adoption of steps S1021 - S1028 in the embodiment of the present invention, the nail head area, nail head angle, nail hole number, nail hole area, nail hole displacement, petal area, electrode foil crack area, nail hole offset degree, and the distance information between the nail head and the nail hole can be effectively recognized, and then it can be judged whether the quality of the structure at the capacitor electrode foil meets the factory requirements, realizing multi-angle intelligent recognition of the capacitor.

[0096] Optionally, as Figure 5 shown, the determination of the position of the core package in the picture in S201 includes:

[0097] S2011 As Figure 7 shown, determine the maximum contour of the background light in the core package picture;

[0098] S2012 Extract the core package shadow information under the background light to determine the core package contour;

[0099] S2013 As Figure 8 shown, perform erosion, dilation processing and correction on the picture to obtain the minimum circumscribed rectangle image of the core package.

[0100] Specifically, the S201 for determining the position of the core package in the picture further includes:

[0101] S2014 As Figure 9 shown, according to the minimum circumscribed rectangle image of the core package, adjust the picture angle until at least one side of the minimum circumscribed rectangle image of the core package is perpendicular or parallel to the horizontal, and repeat steps S2011 - S2013 again to obtain the minimum circumscribed rectangle image of the core package.

[0102] Specifically, the S202 for obtaining the core package information and comparing it with the preset value of the core package to determine whether the core package information meets the preset value of the core package. If not, the defective electronic components include:

[0103] S2021 Determine the core package contour coordinate points according to the minimum circumscribed rectangle image of the core package in S2014;

[0104] S2022 Obtain the core package height, core package width, core package lead pitch, and core package high and low leads respectively according to the core package contour coordinate points, and compare them with the preset values of the core package. If not, mark them as defective.

[0105] Through the correction of the image in the embodiment of the present invention, the core package area can be effectively identified, and it can be effectively judged whether the core package meets the product requirements through the core package appearance, so as to achieve the effect of intelligent identification.

[0106] Optionally, it further includes an information statistics process, and the information statistics process includes:

[0107] Collect the pole foil information and core package information, mark the pole foil information and core package information that do not match the preset values, and export them.

[0108] Among them, the information statistics process statistically counts the data identified by nail head detection, nail hole detection, cracking detection, petal detection, hole displacement detection, nail hole deviation, H value detection, and nail head deviation detection, and exports the data to the user in a highlighted or marked manner to achieve the effect of prompting defects.

[0109] On the other hand, the present invention also discloses a detection device, and the detection device applies the above-mentioned electronic component defect identification method.

[0110] On the other hand, the present invention also discloses a storage medium, and the storage medium contains executable instructions, and the executable instructions are used to execute the above-mentioned electronic component defect identification method.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that after reading the specification of this application, they can still modify the specific implementation manners of the present invention or make equivalent substitutions, but these modifications or changes do not depart from the scope of protection of the pending claims of this invention application.

Claims

1. A method for identifying defects in electronic components, characterized in that, it includes a process for detecting defects in the electrode foil and a process for detecting defects in the core package. The process for detecting defects in the electrode foil includes: S101 Extract the information of the target to be measured in the picture and determine the specific position of the target to be measured in the picture; S102 Obtain the electrode foil information of the target to be measured, compare it with the preset value of the electrode foil, and determine whether the electrode foil information meets the preset value of the electrode foil. If it does not meet, it is a defective electronic component; The electrode foil information includes at least one of the nail head area, nail head angle, number of nail holes, nail hole area, nail hole displacement, petal area, electrode foil crack area, nail hole deviation degree, and distance between the nail head and the nail hole; The process for detecting defects in the core package includes: S201 Determine the position of the core package in the picture; S202 Obtain the core package information, compare it with the preset value of the core package, and determine whether the core package information meets the preset value of the core package. If it does not meet, it is a defective electronic component; The core package information includes at least one of the core package height, core package width, core package pin pitch, and core package high-low pins; The target to be measured is provided with an identification structure, and the identification structure can be selected from one of aluminum foil and identification image; The S101 for extracting the information of the target to be measured in the picture and determining the specific position of the target to be measured in the picture includes: S1011 Loop the color value, extract the contour corresponding to the color value in the picture, calculate the four corner coordinates of the contour, and determine whether it meets the coordinate requirements of the identification structure. If it does not meet, repeat this step; if it meets, export.

2. The method for identifying defects in electronic components according to claim 1, characterized in that, The S101 for extracting the information of the target to be measured in the picture and determining the specific position of the target to be measured in the picture further includes: S1012 According to the derived four corner coordinates, calculate the contour height and compare it with the height of the identification structure. If it meets, determine that the contour is the image contour of the identification structure; if it does not meet, repeat step S1011.

3. The method for identifying defects in electronic components according to claim 1, characterized in that, The S102 for obtaining the electrode foil information of the target to be measured, comparing it with the preset value of the electrode foil, and determining whether the electrode foil information meets the preset value of the electrode foil. If it does not meet, it is a defective electronic component specifically includes: S1021 Determine the nail head of the target to be measured and calculate the contour area of the nail head, compare it with the preset value of the contour area. If it does not meet the preset value of the contour area, it is a defect; S1022 Determine the angle between the straight line where the two coordinate points of the nail needle are located and the horizontal line of the nail head. If it does not meet the preset value of the angle, it is a defect; S1023 Detect the nail hole information, and the nail hole information includes at least one of the number of nail holes and the nail hole area; S1024 Collect the center coordinates of the nail hole, perform a difference calculation with the nail hole position information, and compare it with the preset difference. If it does not meet the preset difference, it is a defect; S1025 Determine whether the area of each petal at the nail hole is within the allowable range. If it does not meet, it is a defect; S1026 Extract the approximate position of the crack on the electrode foil, perform image processing, extract the crack area information, calculate the difference with the original image to obtain a difference image containing the crack, and calculate the proportion of the white contour area in the crack image to confirm whether there is a crack in the aluminum foil sheet. If there is a crack, it is a defect. S1027 Calculate the angle between the straight line formed by the centers of multiple nail holes and the horizontal line of the aluminum foil sheet, and judge whether the nail holes are offset by judging the angle. If the offset exceeds the preset offset value, it is a defect. S1028 Calculate the difference between the distance from the nail head to the marking structure and the distance from the nail hole closest to the nail head to the marking structure, and judge whether the difference in distance meets the preset range. If it does not meet the preset range, it is a defect.

4. The method for identifying defects of an electronic component according to claim 1, wherein, the step S201 of determining the position of the core package in the picture includes: S2011 Determine the maximum contour of the background light in the core package picture; S2012 Extract the shadow information of the core package under the background light to determine the core package contour; S2013 Perform corrosion, dilation processing, and correction on the picture to obtain the minimum circumscribed rectangle image of the core package.

5. The method for identifying defects of an electronic component according to claim 4, wherein, the step S201 of determining the position of the core package in the picture further includes: S2014 According to the minimum circumscribed rectangle image of the core package, adjust the picture angle until at least one side of the minimum circumscribed rectangle image of the core package is perpendicular or parallel to the horizontal, and repeat steps S2011 - S2013 again to obtain the minimum circumscribed rectangle image of the core package.

6. The method for identifying defects of an electronic component according to claim 5, wherein, the step S202 of obtaining the core package information and comparing it with the preset value of the core package to determine whether the core package information meets the preset value of the core package. If it does not meet, the defective electronic component includes: S2021 Determine the coordinate points of the core package contour according to the minimum circumscribed rectangle image of the core package in S2014; S2022 Obtain the core package height, core package width, core package lead pitch, and core package high and low leads respectively according to the core package contour coordinate points, and compare them with the preset values of the core package. If they do not meet, mark them as defective.

7. The method for identifying defects of an electronic component according to claim 1, wherein, it further includes an information statistics process, and the information statistics process includes: Collect the electrode foil information and the core package information, mark the electrode foil information and the core package information that do not match the preset values, and export them.

8. A detection device, wherein, the detection device applies the method for identifying defects of an electronic component according to any one of claims 1 - 7.

9. A storage medium, wherein, the storage medium contains executable instructions, and the executable instructions are used to execute the method for identifying defects of an electronic component according to any one of claims 1 - 7.

Images