Hot pressing head and hot pressing device

By designing a thermal pressing head with a leveling component and a heating component, the problem of uneven thermal pressing in existing semiconductor packaging is solved, uniform force and efficient mounting of the heat dissipation cover are achieved, and the yield rate is improved.

CN114551319BActive Publication Date: 2025-09-19TANGREN MFG (JIASHAN) CO LTD
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Patent Information

Application Number
CN202210249815.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-03-14
Publication Date
2025-09-19
Estimated Expiration
2042-03-14

AI Technical Summary

Technical Problem

In the existing semiconductor packaging process, the manual hot pressing fixation method is inefficient, costly, and has uneven pressure, resulting in unqualified glue thickness and precision, and low yield.

Method used

The hot pressing head designed with leveling components and heating components ensures uniform force on the heat dissipation cover by adjusting the angle of the leveling plate and setting the heat insulation board, and drives the hot pressing head to move for hot pressing through the driving component.

Benefits of technology

The yield rate of heat dissipation cover mounted on the substrate is improved, the pressure uniformity and accuracy are ensured, the labor cost is reduced and the production efficiency is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a hot pressing head and hot pressing device, wherein the hot pressing head comprises: a connecting plate, an adjustment plate, a heat insulation plate, a heating assembly, a pressing plate, and a leveling assembly; the adjustment plate is located below the connecting plate and is connected to the connecting plate via the leveling assembly; the heat insulation plate is located below the adjustment plate and is connected to the adjustment plate; the heating assembly is located below the heat insulation plate and is connected to the heat insulation plate; the pressing plate is located below the heating assembly and is connected to the heating assembly; the leveling assembly is used to adjust the angle of the adjustment plate relative to the horizontal plane; and the heating assembly is used to heat the pressing plate. The present invention can improve the yield rate of heat dissipation covers mounted on substrates.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a thermal pressing head and a thermal pressing device. Background Art

[0002] In the existing semiconductor packaging process, chip capping typically involves attaching multiple heat sink covers to a substrate using capping equipment. Then, manually adding a mass block to the heat sink covers and placing the entire assembly in an oven or reflow furnace for glue curing. This manual hot-pressing method is not only inefficient and costly, but also suffers from uneven pressure due to the inability to maintain verticality when pressing the mass blocks together. This often results in post-assembly glue thickness and precision issues, glue overflow, and a very low product yield. Summary of the Invention

[0003] To solve the above problems, the hot pressing head and hot pressing device provided by the present invention, by providing a leveling component, can ensure that the heat dissipation cover is subjected to uniform force when the hot pressing head is hot pressing the heat dissipation cover, thereby improving the yield rate of the heat dissipation cover mounted on the substrate.

[0004] In a first aspect, the present invention provides a thermal compression head, comprising: a connecting plate, a leveling plate, a heat insulating plate, a heating assembly, a pressing plate, and a leveling assembly;

[0005] The leveling plate is located below the connecting plate and is connected to the connecting plate via the leveling assembly. The heat insulating plate is located below the leveling plate and is connected to the leveling plate. The heating assembly is located below the heat insulating plate and is connected to the heat insulating plate. The pressing plate is located below the heating assembly and is connected to the heating assembly.

[0006] The leveling assembly is used to adjust the angle of the leveling plate relative to the horizontal plane;

[0007] The heating component is used to heat the pressing plate.

[0008] Optionally, the heating assembly includes: a heat conducting plate and a heating plate;

[0009] The heating plate is located inside the heat conducting plate, and is used to heat the heat conducting plate. The heat conducting plate is used to conduct heat to the pressing plate.

[0010] Optionally, a storage groove is provided on the upper surface of the heat conducting plate;

[0011] The heating plate is located in the storage tank, and a pressing component is also provided in the storage tank;

[0012] The pressing assembly is used to press down the heating plate so that the lower surface of the heating plate contacts the heat conducting plate.

[0013] Optionally, the pressing assembly includes: a heat insulating sheet and an elastic member;

[0014] The elastic member is located above the heat insulation sheet, one end of the elastic member contacts the heat insulation sheet, and the other end of the elastic member contacts the heat insulation board;

[0015] The elastic member is used to press the heat insulation sheet downward;

[0016] One end of the storage tank passes through a side wall of the heat conducting plate.

[0017] Optionally, the leveling assembly comprises: a first spherical screw and a plurality of connecting screws;

[0018] The connecting screws are used to connect the connecting plate and the adjusting plate and to adjust the angle of the connecting plate relative to the horizontal plane;

[0019] The first spherical screw includes: a first spherical end and a first connecting end;

[0020] The first spherical screw is located above the adjusting plate, the first spherical screw contacts the adjusting plate through the first spherical end, and the first spherical screw is fixedly connected to the connecting plate through the first connecting end.

[0021] In a second aspect, the present invention provides a hot pressing device, comprising: a driving assembly and a plurality of hot pressing heads as described in any one of the above items;

[0022] The driving assembly is connected to a plurality of thermal compression heads, and the driving assembly is used to drive the plurality of thermal compression heads to move up and down.

[0023] Optionally, the hot pressing device further comprises: a slide, a fixing assembly and a support plate;

[0024] The slide is connected to the driving assembly, the support plate is connected to a plurality of thermal compression heads, and the slide is connected to the support plate via the fixing assembly;

[0025] The driving assembly is used to drive the slide to move up and down.

[0026] Optionally, the fixing assembly includes: at least three fixing screws and at least three fixing disc springs;

[0027] At least three fixing screws are connected to the slide seat and the support plate, and the at least three fixing screws are distributed in a triangle;

[0028] The at least three fixing screws are used to adjust the angle of the support plate relative to the horizontal plane.

[0029] Optionally, the hot pressing device further comprises: a flexible hinge, a second spherical screw, at least two piezoelectric ceramic columns and at least two fixing seats;

[0030] The flexible hinge and at least two piezoelectric ceramic pillars are distributed in a triangular shape;

[0031] The second spherical screw includes: a second spherical end and a second connecting end;

[0032] The fixing seat is fixedly connected to the sliding seat, one end of the piezoelectric ceramic column is connected to the corresponding fixing seat, the other end of the piezoelectric ceramic column is connected to the support plate, a through hole is provided on the surface of the sliding seat, and the flexible hinge is fixedly arranged above the through hole, the second spherical screw passes through the sliding seat through the through hole, the second spherical screw is connected to the support plate through the second spherical end, and the second spherical screw is fixedly connected to the flexible hinge through the second connecting end; or, the fixing seat is fixedly connected to the support plate, one end of the piezoelectric ceramic column is connected to the corresponding fixing seat, the other end of the piezoelectric ceramic column is connected to the sliding seat, a through hole is provided on the surface of the support plate, the flexible hinge is fixedly arranged below the through hole, the second spherical screw passes through the support plate through the through hole, the second spherical screw is connected to the sliding seat through the second spherical end, and the second spherical screw is fixedly connected to the flexible hinge through the second connecting end.

[0033] Optionally, the hot pressing device further comprises: a plurality of driving members;

[0034] A plurality of driving members are fixedly connected to the support plate, and each driving member is fixedly connected to at least one thermal compression head;

[0035] The driving member is used to drive the corresponding hot pressing head to move up and down.

[0036] The hot pressing head and hot pressing device provided by the embodiments of the present invention, by providing a leveling component, can adjust the angle of the leveling plate relative to the horizontal plane so that the pressure plate can evenly apply pressure to the heat dissipation cover below it, thereby improving the yield rate of the heat dissipation cover mounted on the substrate; by providing a heat insulation plate between the leveling plate and the heating component, it can prevent the leveling component from expanding due to heat and affecting the leveling accuracy, thereby further improving the yield rate of the heat dissipation cover mounted on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a structural diagram of a thermal compression head according to an embodiment of the present application;

[0038] Figure 2 、 Figure 3 and Figure 5 Each of them is a cross-sectional view of a thermal compression head according to an embodiment of the present application;

[0039] Figure 4 This is a structural diagram of a hot pressing device according to an embodiment of the present application;

[0040] Figure 6 A diagram showing the installation position of a thermal compression head on a support plate according to an embodiment of the present application;

[0041] Figure 7 and Figure 8 Each of them is a cross-sectional view of a hot pressing device according to an embodiment of the present application;

[0042] Figure 9 for Figure 7 A partial enlarged view of point A in the middle;

[0043] Figure 10 for Figure 8 A partial enlarged view of point B in the middle.

[0044] Reference numerals

[0045] 1. Thermal press head; 21. Connecting plate; 211. First countersunk hole; 212. Third countersunk hole; 22. Leveling plate; 23. Thermal insulation plate; 24. Heating assembly; 241. Heat conducting plate; 2411. Storage tank; 242. Heating plate; 25. Pressing plate; 251. Boss; 252. Second countersunk hole; 26. Leveling assembly; 261. First ball screw; 262. Connecting screw; 263. Thermal insulation washer; 27. Pressing assembly; 271. Thermal insulation plate; 272. Elastic member; 28. Thermocouple sensor; 31. Drive assembly; 311. Servo motor; 312. Screw assembly; 32. Slide; 321. Fourth countersunk hole; 33. Fixing assembly; 331. Fixing disc spring; 34. Support plate; 341. Through hole; 35. Drive member; 4. Fine adjustment assembly; 41. Flexible hinge; 42. Second spherical screw; 43. Piezoelectric ceramic column; 44. Fixing seat; 51. Mounting plate; 52. Guide rail; 53. Reading head; 54. Grating scale; 55. First cone head screw; 56. Second cone head screw; 57. Drag chain. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0047] It should be noted that, in the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0048] In the first aspect, this embodiment provides a thermal compression head 1, see Figure 1 and Figure 2 The thermal compression head 1 includes: a connecting plate 21, a leveling plate 22, a heat insulation plate 23, a heating component 24, a pressing plate 25 and a leveling component 26.

[0049] The connecting plate 21 is clearance-fitted with the adjusting plate 22. The adjusting plate 22 is located below the connecting plate 21. The adjusting plate 22 is connected to the connecting plate 21 through the leveling assembly 26. The heat insulation plate 23 is located below the adjusting plate 22. The heat insulation plate 23 is connected to the adjusting plate 22. The heating assembly 24 is located below the heat insulation plate 23. The heating assembly 24 is connected to the heat insulation plate 23. The pressing plate 25 is located below the heating assembly 24. The pressing plate 25 is connected to the heating assembly 24. The leveling assembly 26 is used to adjust the angle of the adjusting plate 22 relative to the horizontal plane. The heating assembly 24 is used to heat the pressing plate 25.

[0050] In this embodiment, the connecting plate 21, the leveling plate 22, the heat insulating plate 23 and the pressing plate 25 all have the same horizontal cross-section size and are all rectangular; the material of the heat insulating plate 23 is a composite heat-resistant material such as polyimide or PEEK (polyetheretherketone), and the heat conductive block can be a heat-conductive metal material such as copper alloy, which is not excessively limited in this embodiment.

[0051] The heating assembly 24 includes: a heat conducting plate 241 and a heating plate 242. A storage groove 2411 is provided on the upper surface of the heat conducting plate 241. One end of the storage groove 2411 in the horizontal direction passes through a side wall of the heat conducting plate 241, so that a conducting opening connected to the storage groove 2411 is formed on the outer surface of the heat conducting plate 241. The heating plate 242 is located in the storage groove 2411, and the heating plate 242 is connected to the external heating module through the conducting opening. The heating plate 242 is used to heat the heat conducting plate 241; the heat conducting plate 241 is used to conduct heat to the pressing plate 25.

[0052] The heating module can generate heat by providing electrical energy to the heating plate 242, or by replacing the heat-conducting medium in the heating plate 242, such as hot water, so that the heating plate 242 can obtain heat and heat the heat-conducting plate 241. In this embodiment, the heating plate 242 is energized to heat the heat-conducting plate 241 as an example.

[0053] Furthermore, a pressing assembly 27 is also provided in the storage tank 2411. The pressing assembly 27 is used to press down the heating plate 242 so that the lower surface of the heating plate 242 contacts the heat conducting plate 241. The pressing assembly 27 includes: a heat insulating plate 271 and an elastic member 272. The elastic member 272 is located above the heat insulating plate 271, the bottom end of the elastic member 272 contacts the heat insulating plate 271, and the top end of the elastic member 272 contacts the heat insulating plate 23. The elastic member 272 is used to press the heat insulating plate 271 downward, that is, to apply downward pressure to the heat insulating plate 271.

[0054] In this embodiment, a thermocouple sensor 28 is fixedly provided on the side wall of the heat conducting plate 241 for monitoring the temperature of the heat conducting plate 241. The thermocouple sensor 28 is bonded to the heat conducting plate 241 through thermal conductive silicone. The elastic member 272 is a disc spring. The material of the heat insulating sheet 271 is insulating ceramic, but is not limited thereto.

[0055] The provision of the elastic member 272 enables the heating plate 242 to be in stable contact with the heat conducting plate 241, thereby ensuring the heating efficiency of the heating plate 241. The provision of the heat insulating sheet 271 prevents the influence of heat on the elastic member 272, thereby increasing the service life of the elastic member 272. It also insulates the heating plate 242 and prevents the heating plate 242 from short-circuiting.

[0056] Combine Figure 3 The leveling assembly 26 includes a first spherical screw 261 and a plurality of connecting screws 262. The connecting screws 262 are used to connect the connecting plate 21 and the leveling plate 22 and adjust the angle of the connecting plate 21 relative to the horizontal plane. The first spherical screw 261 includes a first spherical end and a first connecting end. The first spherical screw 261 is located above the leveling plate 22. The first spherical end of the first spherical screw 261 contacts the leveling plate 22. The first spherical screw 261 is fixedly connected to the connecting plate 21 via the first connecting end.

[0057] In this embodiment, there are four connecting screws 262. A first countersunk hole 211 is symmetrically defined at each of the four corners of the connecting plate 21. A thermal insulation washer 263 is disposed within each of the first countersunk holes 211. Each connecting screw 262 passes through the corresponding first countersunk hole 211, sequentially extending from top to bottom through the connecting plate 21, the leveling plate 22, and the thermal insulation plate 23. The first spherical screw 261 is located at the geometric center of the connecting plate 21.

[0058] The head of the connecting screw 262 contacts the thermal insulation washer 263, and the bottom end of the connecting screw's rod is threadedly connected to the thermal insulation plate 23. Thus, the connecting screw 262 secures the connecting plate 21, the leveling plate 22, and the thermal insulation plate 23 together. The thermal insulation washer 263 prevents the heat conducting plate 241 from conducting heat through the connecting screw 262, thereby affecting the heating effect on the plate.

[0059] The bottom surface of the pressure plate 25 is provided with a boss 251, which is used to heat-press the heat dissipation cover. A second countersunk hole 252 is defined on the bottom surface of the pressure plate 25. Screws pass through the second countersunk hole 252 to securely connect the pressure plate 25 to the heat conducting plate 241. In this embodiment, the boss 251 is integrally formed with the pressure plate 25 to securely connect them.

[0060] The thermal press head 1 can be used not only for thermal pressing of heat sink covers but also for thermal pressing of other components to be pressed, a process not specifically limited in the present invention. By providing a leveling assembly 26, the thermal press head 1 can adjust the angle of the leveling plate 22 relative to the horizontal plane, allowing the pressing plate 25 to uniformly apply pressure to the heat sink cover beneath it, thereby improving the yield rate of heat sink cover attachment to the substrate. Furthermore, by providing a heat shield 23 between the leveling plate 22 and the heating assembly 24, the leveling assembly 26 can be prevented from thermally expanding, which would affect the leveling accuracy, further improving the yield rate of heat sink cover attachment to the substrate.

[0061] In the second aspect, this embodiment provides a hot pressing device, see Figure 4 and Figure 5 The hot pressing device includes a drive assembly 31 and multiple hot pressing heads 1 as described above. The drive assembly 31 is connected to the multiple hot pressing heads 1 and is used to drive the multiple hot pressing heads 1 to move up and down. The hot pressing device can simultaneously drive multiple hot pressing heads 1 to hot press multiple heat dissipation covers through the drive assembly 31.

[0062] In this embodiment, the drive assembly 31 includes a servo motor 311 and a lead screw assembly 312. The servo motor 311 is fixedly connected to a vertically positioned lead screw in the lead screw assembly 312. The servo motor 311 rotates via the electric lead screw to drive the multiple thermal compression heads 1 up and down. The lead screw assembly 312 is not specifically defined in this embodiment.

[0063] The hot pressing device also includes: a mounting plate 51, a guide rail 52, a reading head 53, a grating scale 54, a slide 32, a fixed assembly 33, a support plate 34, a drag chain 57, multiple drive members 35, and a fine adjustment assembly 4. The fine adjustment assembly 4 is used to adjust the angle of the support plate 34 relative to the horizontal plane. The drag chain 57 is fixedly connected to the mounting plate 51 and is used to drive the mounting plate 51 to move. The guide rail 52 and reading head 53 are both fixedly connected to the mounting plate 51. The slide 32 is connected to the guide rail 52 in a vertical sliding direction. The grating scale is fixedly connected to the side plate of the slide 32, and one end of the reading head 53 faces the grating scale 54.

[0064] Combine Figure 4 、 Figure 7 and Figure 9 In this embodiment, the fine adjustment assembly 4 includes: a flexible hinge 41, a second spherical screw 42, at least two piezoelectric ceramic columns 43, and at least two fixed seats 44. The slide 32 is connected to the lead screw; the support plate 34 is connected to the multiple thermal compression heads 1, and the slide 32 is connected to the support plate 34 via the fixed assembly 33. The drive assembly 31 is used to drive the support plate 34 to move up and down via the slide 32, thereby driving the multiple thermal compression heads 1 to move up and down. Multiple drive members 35 are located directly below the support plate 34 and are fixedly connected to the support plate 34. Each drive member 35 is fixedly connected to a thermal compression head 1, and the drive members 35 are used to drive the corresponding thermal compression head 1 to move up and down.

[0065] Combine Figure 5 and Figure 6 , wherein a plurality of thermal compression heads 1 are arranged in a rectangular array below the support plate 34. In this embodiment, the number of thermal compression heads 1 and driving members 35 is 8, and the 8 thermal compression heads 1 are arranged in a 2x4 rectangular array below the support plate 34; the driving member 35 is a cylinder, the outer shell of the cylinder is fixedly connected to the support plate 34, the piston of the cylinder moves in the vertical direction, and a push seat is fixedly provided at one end of the piston extending out of the outer shell. A third countersunk hole 212 is provided on the bottom surface of the connecting plate 21, and the third countersunk hole 212 passes through the upper surface of the connecting plate 21. The connecting plate 21 is fixedly connected to the push seat by screws passing through the third countersunk hole 212 from bottom to top.

[0066] The drive member 35 can be provided to independently drive the corresponding thermal pressing head 1 to perform thermal pressing on the heat sink. The specific combination and arrangement of the thermal pressing head 1 can be selected according to the requirements of different substrate products, and the present invention does not make any specific restrictions.

[0067] Combine Figure 4 、 Figure 9 and Figure 10, the fixing assembly 33 includes: at least three fixing screws and at least three fixing disc springs 331. In this embodiment, the number of fixing screws is three, and the number of fixing disc springs 331 is three. The three fixing screws are all connected to the slide 32 and the support plate 34, and the three fixing screws are distributed in a triangular shape. The three fixing screws are all used to adjust the angle of the support plate 34 relative to the horizontal plane. Among them, the fixing screws fix the slide 32 and the support plate 34 from bottom to top, and can also fix the slide 32 and the support plate 34 from top to bottom. In this embodiment, the slide 32 and the support plate 34 are fixedly connected by fixing screws from top to bottom.

[0068] Specifically, three fourth countersunk holes 321 are defined on the upper surface of the slide 32. Fixed disc springs 331 are located within the fourth countersunk holes 321. A fixing screw passes through the fourth countersunk holes 321 and penetrates the bottom plate of the slide 32. It is then threadedly engaged with the support plate 34, with the head of the fixing screw pressing downward against the fixed disc spring 331. The provision of the fixed disc springs 331 facilitates rotating the fixing screws to achieve stable relative movement between the support plate 34 and the slide 32 under the action of the fixing disc springs 331, thereby adjusting the relative distance between the support plate 34 and the slide 32 and maintaining relative stability between the support plate 34 and the slide 32.

[0069] Furthermore, the flexible hinge 41 and at least two piezoelectric ceramic pillars 43 are arranged in a triangular pattern. In this embodiment, there are two piezoelectric ceramic pillars 43, one at the left and one at the bottom of the slide 32. The flexible hinge 41 is located on the side of the two piezoelectric ceramic pillars 43 facing the drive assembly 31. As a result, the two piezoelectric ceramic pillars 43 and the flexible hinge 41 are not in the same straight line.

[0070] When the hot pressing device is installed on the equipment and needs to be leveled with the workpiece table, first, the servo motor 311 drives the hot pressing head 1 on one of the four corners, which has been leveled, to move downward until it presses against a contact signal tooling or proximity switch sensor on the workpiece table, and at the same time, the reading head 53 on the hot pressing device accurately measures the height; then, the above steps are repeated to execute the hot pressing heads 1 on the other three corners in turn, thereby obtaining four height data; after that, the control system in the hot pressing device obtains the tilt trend of the support plate 34 through an algorithm, and provides corresponding signals to the first piezoelectric ceramic and the second piezoelectric ceramic, so that the first piezoelectric ceramic column 43 and the second piezoelectric ceramic column 43 are extended or shortened by a corresponding distance, thereby achieving the angle of the support plate 34 relative to the horizontal plane, and since the piezoelectric ceramic column 43 can achieve nanometer-level precision, the support plate 34 can be accurately leveled.

[0071] In an optional embodiment, the thermal compression head 1 may be mounted on the support plate 34 first, and then the thermal compression head 1 and the support plate 34 may be leveled.

[0072] The second spherical screw 42 includes a second spherical end and a second connecting end. A through-hole 341 is formed on the surface of the slide 32. The fine adjustment assembly 4, in conjunction with the fixing assembly 33, enables precise and stable adjustment of the support plate 34. The fine adjustment assembly 4 can be installed above the support plate 34 to adjust its levelness, or it can be installed below the support plate 34 and pass through the support plate 34 to adjust its levelness.

[0073] Specifically, when the fine-tuning component 4 is installed above the support plate 34, the fixing seat 44 is fixedly connected to the base plate, the top of the piezoelectric ceramic column 43 is connected to the corresponding fixing seat 44, and the bottom end of the piezoelectric ceramic column 43 passes through the base plate and is connected to the support plate 34; the flexible hinge 41 is fixedly arranged above the through hole 341 and fixedly connected to the base plate, the bottom end of the flexible hinge 41 is inserted into the through hole 341, the second spherical screw 42 passes through the slide 32 through the through hole 341, the second spherical screw 42 is connected to the support plate 34 through the second spherical end, and the second spherical screw 42 is threadedly connected to the flexible hinge 41 through the second connecting end.

[0074] When the fine-tuning assembly 4 is installed below the support plate 34, the fixing seat 44 is fixedly connected to the support plate 34, the bottom end of the piezoelectric ceramic column 43 is connected to the corresponding fixing seat 44, and the top end of the piezoelectric ceramic column 43 passes through the support plate 34 and is connected to the bottom plate; the flexible hinge 41 is arranged below the through hole 341 and is fixedly connected to the support plate 34, the top end of the flexible hinge 41 is inserted into the through hole 341, the second spherical screw 42 passes through the support plate 34 through the through hole 341, the second spherical screw 42 is connected to the slide seat 32 through the second spherical end, and the second spherical screw 42 is threadedly connected to the flexible hinge 41 through the second connecting end.

[0075] This embodiment takes the case where the fine-tuning component 4 is installed above the support plate 34 as an example. Among them, a first cone head screw 55 is connected to the position of the support plate 34 facing the through hole 341, and the top of the first cone head screw 55 is in conflict with the second spherical end. In this way, the horizontality of the support plate 34 can be accurately adjusted through the curved surface of the second spherical end. A second cone head screw 56 is fixedly provided at the position of the support plate 34 facing the piezoelectric ceramic column 43, and the piezoelectric ceramic column 43 is in conflict with the head of the second cone head screw 56. By providing the flexible hinge 41 and the second spherical screw 42, not only is it convenient to adjust the horizontality of the support plate 34, but it also saves the number of piezoelectric ceramic columns 43, further reducing the manufacturing cost of the hot pressing device. By providing the first cone head screw 55, damage to the support plate 34 can be avoided, thereby extending the service life of the support plate 34.

[0076] The hot pressing device has a simple structure and low manufacturing cost, and can accurately adjust the horizontality of the hot pressing head 1.

[0077] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A hot pressing device, characterized in that: include: Drive assembly and thermal head; The driving assembly is connected to the plurality of thermal pressing heads, and the driving assembly is used to drive the plurality of thermal pressing heads to move up and down; The hot pressing head comprises: a connecting plate, an adjusting plate, a heat insulating plate, a heating component, a pressing plate and a leveling component; The leveling plate is located below the connecting plate and is connected to the connecting plate via the leveling assembly. The heat insulating plate is located below the leveling plate and is connected to the leveling plate. The heating assembly is located below the heat insulating plate and is connected to the heat insulating plate. The pressing plate is located below the heating assembly and is connected to the heating assembly. The leveling assembly is used to adjust the angle of the leveling plate relative to the horizontal plane; The heating component is used to heat the pressing plate; The hot pressing device further comprises: a slide, a fixing assembly and a support plate; The slide is connected to the driving assembly, the support plate is connected to a plurality of thermal compression heads, and the slide is connected to the support plate via the fixing assembly; The driving assembly is used to drive the slide to move up and down; The hot pressing device further comprises: a flexible hinge, a second spherical screw, at least two piezoelectric ceramic columns and at least two fixing seats; The flexible hinge and at least two piezoelectric ceramic pillars are distributed in a triangular shape; The second spherical screw includes: a second spherical end and a second connecting end; The fixing seat is fixedly connected to the sliding seat, one end of the piezoelectric ceramic column is connected to the corresponding fixing seat, the other end of the piezoelectric ceramic column is connected to the support plate, a through hole is provided on the surface of the sliding seat, the flexible hinge is fixedly arranged above the through hole, the second spherical screw passes through the sliding seat through the through hole, the second spherical screw is connected to the support plate through the second spherical end, and the second spherical screw is threadedly connected to the flexible hinge through the second connecting end; or, the fixing seat is fixedly connected to the support plate, one end of the piezoelectric ceramic column is connected to the corresponding fixing seat, the other end of the piezoelectric ceramic column is connected to the sliding seat, a through hole is provided on the surface of the support plate, the flexible hinge is fixedly arranged below the through hole, the second spherical screw passes through the support plate through the through hole, the second spherical screw is connected to the sliding seat through the second spherical end, and the second spherical screw is threadedly connected to the flexible hinge through the second connecting end.

2. The hot pressing device according to claim 1, characterized in that The heating assembly includes: a heat conducting plate and a heating plate; The heating plate is located inside the heat conducting plate, and is used to heat the heat conducting plate. The heat conducting plate is used to conduct heat to the pressing plate.

3. The hot pressing device according to claim 2, characterized in that A storage groove is provided on the upper surface of the heat conducting plate; The heating plate is located in the storage tank, and a pressing component is also provided in the storage tank; The pressing assembly is used to press down the heating plate so that the lower surface of the heating plate contacts the heat conducting plate.

4. The hot pressing device according to claim 3, characterized in that The pressing assembly includes: a heat insulation sheet and an elastic member; The elastic member is located above the heat insulation sheet, one end of the elastic member contacts the heat insulation sheet, and the other end of the elastic member contacts the heat insulation board; The elastic member is used to press the heat insulation sheet downward; One end of the storage tank passes through a side wall of the heat conducting plate.

5. The hot pressing device according to claim 4, characterized in that The leveling assembly includes: a first spherical screw and a plurality of connecting screws; The connecting screws are used to connect the connecting plate and the adjusting plate and to adjust the angle of the connecting plate relative to the horizontal plane; The first spherical screw includes: a first spherical end and a first connecting end; The first spherical screw is located above the adjusting plate, the first spherical screw contacts the adjusting plate through the first spherical end, and the first spherical screw is fixedly connected to the connecting plate through the first connecting end.

6. The hot pressing device according to claim 1, characterized in that The fixing assembly includes: at least three fixing screws and at least three fixing disc springs; At least three fixing screws are connected to the slide seat and the support plate, and the at least three fixing screws are distributed in a triangle; The at least three fixing screws are used to adjust the angle of the support plate relative to the horizontal plane.

7. The hot pressing device according to claim 1, characterized in that The hot pressing device further comprises: a plurality of driving members; A plurality of driving members are fixedly connected to the support plate, and each driving member is fixedly connected to at least one thermal compression head; The driving member is used to drive the corresponding hot pressing head to move up and down.

Citation Information

Patent Citations

  • Hot pressing head and hot pressing device

    CN217062044U