Method of improving display backplane etch process

Abstract

The present disclosure provides a method for improving the etching process of a display backplane, comprising: before loading the display backplane by the support column, adjusting the height of the support column so that the top surface of the support column and the top surface of the electrode are in the same plane, simulating the magnetic field environment provided when etching the display backplane, energizing the support column and the electrode, adjusting the power supply parameters of the support column until the electric field and / or magnetic field intensity in the target area reaches the uniformity standard, and recording the final determined power supply parameters of the support column; loading the display backplane by the support column, adjusting the height of the support column so that the top surface of the support column and the top surface of the electrode are in the same plane, energizing the electrode to adsorb the backplane, energizing the support column according to the previously determined power supply parameters of the support column to generate an electric field and / or a magnetic field, and continuously supplying power to the support column and the electrode during the etching process of the display backplane; wherein the top surface of the electrode and the top surface of the support column are the contact surfaces in contact with the display backplane. The method provided herein can improve the etching uniformity of the display backplane.

Description

Technical Field

[0001] This article relates to, but is not limited to, the field of display technology, and in particular to a method for improving the etching process of display backplanes. Background Technology

[0002] Dry etching generally refers to plasma surface etching. In this method, the material surface is selectively etched by reacting free radicals, such as plasma, generated by the ionization of reactive gases. The etched material is converted into a gaseous phase and removed by a vacuum pump. Equipment for dry etching includes a reaction chamber, power supply, and vacuum system. The workpiece is fed into the evacuated reaction chamber. Gas is introduced and exchanges with plasma. The plasma reacts on the workpiece surface, and volatile byproducts are removed by the vacuum pump.

[0003] like Figure 1 As shown, in the dry etching process of AMOLED (Active-matrix organic light-emitting diode) display backplane, the display backplane 10 is sent into the reaction chamber as a workpiece. The support column (Pin) 30 on the worktable rises from the groove, the display backplane is placed on the support column and transferred to the designated area by the robotic arm. The display backplane descends with the support column until the top of the support column is flush with the upper surface of the electrode 20. The electrode is energized, and the display backplane is attached to the electrode by the adsorption of the electrode, and then etching is performed.

[0004] Optical inspection of the etched display backplane reveals that optical inconsistencies (muras) are easily generated in the area near the support pillars. Summary of the Invention

[0005] This disclosure provides a method for improving the etching process of a display backplane, including:

[0006] Before loading the display back panel through the support column, adjust the height of the support column so that the top surface of the support column and the top surface of the electrode are in the same plane. Power is supplied to the support column and the electrode, and the power supply parameters of the support column are adjusted until the electric field strength and / or magnetic field strength in the target area reach the uniformity standard. After the adjustment is completed, the power is turned off, and the final determined power supply parameters of the support column are recorded. The electrode surrounds the support column and the two do not contact each other.

[0007] The display backplate is loaded via a support column. The height of the support column is adjusted so that the top surface of the support column and the top surface of the electrode are in the same plane. The electrode is energized to attract the display backplate. The support column is energized according to the previously determined power supply parameters to generate an electric field and / or magnetic field. Power is continuously supplied to the support column and the electrode during the etching process of the display backplate. The top surfaces of the electrode and the support column are the contact surfaces that come into contact with the display backplate.

[0008] The method for improving the etching process of a display backplane provided in this disclosure involves adjusting the support pillars according to their height in the etching process flow before loading the display backplane using support pillars. This simulates the magnetic field environment provided during the etching of the display backplane. The support pillars and electrodes are energized, and the power supply parameters of the support pillars are adjusted until the electric field strength and / or magnetic field strength in the target test area reach a uniformity standard. After adjustment, the final determined power supply parameters of the support pillars are recorded. This adjustment is performed before the actual loading of the display backplane and can be considered a new pre-processing step. This pre-processing step provides a support pillar power supply scheme that improves the uniformity of the electric field and / or magnetic field distribution. During the actual etching process, as long as the support pillars are powered according to the power supply scheme determined in the previous pre-processing step, the differences in the electric field and / or magnetic field in the top area of ​​the support pillars during etching can be compensated, thereby improving the etching uniformity of the display backplane. Attached Figure Description

[0009] The accompanying drawings are used to provide an understanding of the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure.

[0010] Figure 1 This is a schematic diagram of a support column supporting a display back panel in the prior art;

[0011] Figure 2 A flowchart of a method for improving the etching process of a display backplane provided in this disclosure embodiment;

[0012] Figure 3 A schematic diagram of a target area provided in an embodiment of this disclosure;

[0013] Figure 4 A schematic diagram illustrating the adjustment of the magnetic field strength near a support column, provided as an embodiment of this disclosure;

[0014] Figure 5-a A schematic diagram of an electromagnetic induction coil connected to a DC power supply according to an embodiment of this disclosure;

[0015] Figure 5-b A schematic diagram of an electromagnetic induction coil connected to a reverse DC power supply, provided as an embodiment of this disclosure;

[0016] Figure 6 A schematic diagram illustrating the adjustment of the electric field strength near a support column, provided as an embodiment of this disclosure;

[0017] Figure 7 This is a schematic diagram illustrating the adjustment of electric and magnetic field strengths near a support column, as provided in an embodiment of this disclosure. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this disclosure clearer, embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Note that the implementation methods can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in various forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0019] In the accompanying drawings, the size of the constituent elements, the thickness of the layers, or the area are sometimes exaggerated for clarity. Therefore, one aspect of this disclosure is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0020] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0021] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0022] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0023] In this disclosure, “about” means a value that is not strictly limited and allows for process and measurement errors.

[0024] In related technologies, the support pillars are not energized throughout the etching process. Tests have revealed that, when the support pillars are not energized, the electric field (or magnetic field) intensity measured on the top surface of the support pillar with holes (the groove containing the support pillar) differs significantly from that measured on the electrode surface without holes. This difference in the electric field (or magnetic field) in certain areas affects the uniform distribution of plasma on the display backplane surface during etching, thus impacting the etching uniformity.

[0025] Figure 2 A method for improving the etching process of a display backplane is provided. For example... Figure 2 As shown, a method for improving the etching process of a display backplane may include the following steps:

[0026] S10, before loading the display backplate via the support column, adjust the height of the support column so that the top surface of the support column and the top surface of the electrode are in the same plane to simulate the magnetic field environment provided during etching of the display backplate. Power is supplied to the support column and the electrode, and the power supply parameters of the support column are adjusted until the electric field strength and / or magnetic field strength in the target area reach the uniformity standard. After adjustment, the power is turned off, and the final determined power supply parameters of the support column are recorded. The electrode surrounds the support column and the two do not contact each other.

[0027] S20, the display backplate is loaded by the support column, the height of the support column is adjusted so that the top surface of the support column and the top surface of the electrode are in the same plane, the electrode is energized to attract the display backplate, the support column is energized according to the previously determined power supply parameters to generate an electric field and / or magnetic field, and the support column and the electrode are continuously powered during the etching process of the display backplate; wherein, the top surface of the electrode and the top surface of the support column are the contact surfaces that contact the display backplate.

[0028] The method for improving the etching process of a display backplane provided in the above embodiments of this application involves adjusting the support pillars according to their height in the etching process flow before loading the display backplane. This simulates the magnetic field environment provided during the etching of the display backplane. The support pillars and electrodes are energized, and the power supply parameters of the support pillars are adjusted until the electric field strength and / or magnetic field strength in the target test area reach a uniformity standard. After adjustment, the final determined power supply parameters of the support pillars are recorded. This adjustment is performed before the actual loading of the display backplane and can be considered a new pre-processing step. This pre-processing step provides a power supply scheme for the support pillars that improves the uniformity of the electric field and / or magnetic field distribution. During the actual etching process, as long as the power supply scheme determined in the previous pre-processing step is applied to the support pillars, the differences in the electric field and / or magnetic field in the top area of ​​the support pillars during etching can be compensated, thereby improving the etching uniformity of the display backplane.

[0029] In some exemplary implementations, such as Figure 3 As shown, the target area may include the top surface area 101 of the support column and its surrounding area 102. The surrounding area may be the top surface area of ​​the electrode close to the top surface of the support column. The size and shape of the target area can be set according to actual needs, such as a rectangular area or a circular area centered on the top surface of the support column. The area of ​​the target area is a times the area of ​​the top surface area of ​​the support column, where 2≤a≤10.

[0030] like Figure 4 As shown, in some exemplary embodiments, energizing the support post and the electrode includes:

[0031] An insulating layer is provided on the outside of the column body 32 of the support column 30, and an electromagnetic induction coil 40 is wound around the outside of the insulating layer; wherein, the support column includes a column head 31 and a column body 32; the column head is made of insulating material, and the column body is made of conductive material;

[0032] A voltage is applied to the electrode 20 using a first DC power supply, and current is provided to the electromagnetic induction coil using a second DC power supply.

[0033] During the etching process, the top surface of the pillar head is the contact surface that contacts the display back panel, which is also the top surface of the support pillar.

[0034] In some exemplary embodiments, the column body may be made of a metal alloy material, and the column head may be made of a high-temperature resistant polymer material (such as PEEK material).

[0035] In some exemplary embodiments, adjusting the power supply parameters of the support column until the magnetic field strength in the target area reaches a uniformity standard includes:

[0036] Multiple test points are set up within the target area, and the magnetic field strength at each test point is measured.

[0037] Adjust the magnitude and direction of the current flowing through the electromagnetic induction coil, and stop adjusting when the magnetic field strength in the target area reaches the uniformity standard.

[0038] After simulating the magnetic field environment provided during the etching of the display backplane, the strength of the magnetic field generated by the support pillars (electromagnetic induction coils on the support pillars) within the target area can be adjusted by changing the magnitude of the current flowing through the electromagnetic induction coils. Similarly, the direction of the magnetic field generated by the support pillars (electromagnetic induction coils on the support pillars) within the target area can be adjusted by changing the direction of the current flowing through the electromagnetic induction coils. The magnetic field generated by the support pillars (electromagnetic induction coils on the support pillars) can compensate for differences in magnetic field strength on the top surface of the support pillars, thereby making the magnetic field strength within the target area more uniform.

[0039] In some exemplary embodiments, the power supply parameters of the support column include the magnitude and direction of the current flowing through the electromagnetic induction coil.

[0040] like Figure 5-a and Figure 5-b As shown, in some exemplary embodiments, adjusting the magnitude and direction of the current flowing through the electromagnetic induction coil includes:

[0041] The electromagnetic induction coil 50 is connected in series with the variable resistor 60, and the electromagnetic induction coil and the variable resistor are powered by the second DC power supply 70.

[0042] The resistance value of the variable resistor is adjusted to change the magnitude of the current flowing through the electromagnetic induction coil;

[0043] The second DC power supply is connected in either the forward or reverse direction to change the direction of the current flowing through the electromagnetic induction coil.

[0044] In some exemplary embodiments, achieving a uniformity standard for the magnetic field strength within the target region includes at least one of the following:

[0045] The variance of the magnetic field strength within the target area is less than the first threshold.

[0046] The target area is divided into a first area and a second area. The absolute value of the difference between the average magnetic field strength of the first area and the average magnetic field strength of the second area is less than a second threshold. The first area is the top surface area of ​​the support column, and the second area is the area outside the top surface area of ​​the support column.

[0047] In other implementations, the uniformity of the magnetic field strength within the target area can also be measured using other methods.

[0048] like Figure 6 As shown, in some exemplary embodiments, energizing the support post and the electrode includes:

[0049] An insulating layer is provided on the outside of the column body 32 of the support column 30; wherein, the support column includes a column head 31 and a column body 32; the column head is made of conductive material, and the column body is made of conductive material;

[0050] A first voltage is applied to the electrode 20 using a first DC power supply, and a second voltage is applied to the support column using a second DC power supply.

[0051] In some exemplary embodiments, the column body may be made of a metal alloy material, and the column head may be made of the same metal alloy material as the column body, or of a different conductive material than the column body.

[0052] In some exemplary embodiments, adjusting the power supply parameters of the support column until the electric field strength in the target area reaches a uniformity standard includes:

[0053] Multiple test points are set up within the target area, and the electric field strength at each test point is measured.

[0054] Adjust the output voltage of the second DC power supply until the electric field intensity in the target area reaches the uniformity standard, then end the adjustment.

[0055] After energizing the electrodes and support columns, keeping the electric field generated by the electrodes constant, the strength of the electric field generated by the support columns within the target area can be adjusted by regulating the output voltage of the second DC power supply. The electric field generated by the support columns can compensate for the electric field differences in the top area of ​​the support columns, thereby making the electric field intensity within the target area more uniform.

[0056] In some exemplary embodiments, the power supply parameters of the support column include the output voltage of a second DC power supply.

[0057] In some exemplary embodiments, achieving a uniformity standard for the electric field intensity within the target area includes at least one of the following:

[0058] The variance of the electric field intensity within the target area is less than the first threshold.

[0059] The target area is divided into a first area and a second area. The absolute value of the difference between the average electric field strength of the first area and the average electric field strength of the second area is less than a second threshold. The first area is the top surface area of ​​the support column, and the second area is the area outside the top surface area of ​​the support column.

[0060] In other implementations, the uniformity of the electric field intensity within the target area can be measured using other methods.

[0061] like Figure 7 As shown, in some exemplary embodiments, energizing the support post and the electrode includes:

[0062] An insulating layer is provided on the outside of the column body 32 of the support column 30, and an electromagnetic induction coil 40 is wound around the outside of the insulating layer; wherein, the support column includes a column head 31 and a column body 32; the column head is made of conductive material, and the column body is made of conductive material;

[0063] A voltage is applied to the electrode 20 using a first DC power supply, a second voltage is applied to the support column using a second DC power supply, and current is provided to the electromagnetic induction coil using a third DC power supply.

[0064] In some exemplary embodiments, the column body may be made of a metal alloy material, and the column head may be made of the same metal alloy material as the column body, or of a different conductive material than the column body.

[0065] In some exemplary embodiments, adjusting the power supply parameters of the support column until the electric and magnetic field strengths within the target area reach a uniformity standard includes:

[0066] Multiple test points are set up within the target area, and the magnetic field strength and electric field strength of each test point are measured.

[0067] Adjust the output voltage of the second DC power supply, and adjust the magnitude and direction of the current flowing through the electromagnetic induction coil. The adjustment ends when the electric field strength and magnetic field strength in the target area reach the uniformity standard.

[0068] After energizing the electrodes and support pillars, keeping the electric field generated by the electrodes constant, the strength of the electric field generated by the support pillars within the target area can be adjusted by regulating the output voltage of the second DC power supply. The electric field generated by the support pillars can compensate for the electric field differences in the top area of ​​the support pillars, thus making the electric field strength more uniform within the target area. After simulating the magnetic field environment provided during etching the display backplane, the strength of the magnetic field generated by the support pillars (electromagnetic induction coils on the support pillars) within the target area can be adjusted by regulating the magnitude of the current flowing through the electromagnetic induction coils. The direction of the magnetic field generated by the support pillars (electromagnetic induction coils on the support pillars) within the target area can be adjusted by regulating the direction of the current flowing through the electromagnetic induction coils. The magnetic field generated by the support pillars (electromagnetic induction coils on the support pillars) can compensate for the magnetic field strength differences in the top area of ​​the support pillars, thus making the magnetic field strength more uniform within the target area.

[0069] In some exemplary embodiments, the power supply parameters of the support column include: the magnitude and direction of the current flowing through the electromagnetic induction coil, and the output voltage of the second DC power supply.

[0070] In some exemplary embodiments, adjusting the magnitude and direction of the current flowing through the electromagnetic induction coil includes:

[0071] The electromagnetic induction coil is connected in series with a variable resistor, and the electromagnetic induction coil and the variable resistor are powered by a third DC power supply.

[0072] The resistance value of the variable resistor is adjusted to change the magnitude of the current flowing through the electromagnetic induction coil;

[0073] The third DC power supply can be connected in either the forward or reverse direction to change the direction of the current flowing through the electromagnetic induction coil.

[0074] In some exemplary embodiments, achieving a uniformity standard for the magnetic field strength within the target region includes at least one of the following:

[0075] The variance of the magnetic field strength within the target area is less than the first threshold.

[0076] The target area is divided into a first area and a second area. The absolute value of the difference between the average magnetic field strength of the first area and the average magnetic field strength of the second area is less than a second threshold. The first area is the top surface area of ​​the support column, and the second area is the area outside the top surface area of ​​the support column.

[0077] In some exemplary embodiments, achieving a uniformity standard for the electric field intensity within the target area includes at least one of the following:

[0078] The variance of the electric field intensity within the target area is less than the first threshold.

[0079] The target area is divided into a first area and a second area. The absolute value of the difference between the average electric field strength of the first area and the average electric field strength of the second area is less than a second threshold. The first area is the top surface area of ​​the support column, and the second area is the area outside the top surface area of ​​the support column.

[0080] In other implementations, the uniformity of electric and magnetic field strengths within the target area can also be measured using other methods.

[0081] In some exemplary embodiments, the display backplane is an AMOLED (Active-matrix organic light-emitting diode) display backplane.

[0082] In some exemplary embodiments, the etching is dry etching.

[0083] In some exemplary embodiments, before simulating the magnetic field environment provided during etching the display backplane, the method further includes heating the electrodes at the electrode temperature during etching the display backplane.

[0084] While the embodiments disclosed herein are as described above, the content is merely for the purpose of facilitating understanding of this disclosure and is not intended to limit this disclosure. Any person skilled in the art to which this disclosure pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this disclosure shall still be determined by the scope defined in the appended claims.

Claims

1. A method for improving the etching process of a display backplane, comprising: Before loading the display backplate via the support pillar, adjust the height of the support pillar so that the top surface of the support pillar and the top surface of the electrode are in the same plane to simulate the magnetic field environment provided during etching the display backplate. Power is supplied to the support pillar and the electrode, and the power supply parameters of the support pillar are adjusted until the electric field strength and / or magnetic field strength in the target area reach the uniformity standard. After adjustment, the power is turned off, and the final determined power supply parameters of the support pillar are recorded. The electrode surrounds the support pillar and the two do not contact each other. The display backplate is loaded via a support column. The height of the support column is adjusted so that the top surface of the support column and the top surface of the electrode are in the same plane. The electrode is energized to attract the display backplate. The support column is energized according to the previously determined power supply parameters to generate an electric field and / or magnetic field. Power is continuously supplied to the support column and the electrode during the etching process of the display backplate. The top surfaces of the electrode and the support column are the contact surfaces that come into contact with the display backplate.

2. The method as described in claim 1, characterized in that: The step of energizing the support column and the electrode includes: An insulating layer is provided on the outside of the support column body, and an electromagnetic induction coil is wound around the outside of the insulating layer; wherein, the support column includes a column head and a column body; the column head is made of insulating material, and the column body is made of conductive material; A voltage is applied to the electrode using a first DC power supply, and current is provided to the electromagnetic induction coil using a second DC power supply.

3. The method as described in claim 2, characterized in that: Adjusting the power supply parameters of the support column until the magnetic field strength in the target area reaches the uniformity standard includes: Multiple test points are set up within the target area, and the magnetic field strength at each test point is measured. Adjust the magnitude and direction of the current flowing through the electromagnetic induction coil, and stop adjusting when the magnetic field strength in the target area reaches the uniformity standard.

4. The method as described in claim 3, characterized in that: The adjustment of the magnitude and direction of the current flowing through the electromagnetic induction coil includes: The electromagnetic induction coil is connected in series with a variable resistor, and the electromagnetic induction coil and the variable resistor are powered by a second DC power supply. The resistance value of the variable resistor is adjusted to change the magnitude of the current flowing through the electromagnetic induction coil; The second DC power supply is connected in either the forward or reverse direction to change the direction of the current flowing through the electromagnetic induction coil.

5. The method as described in claim 1, characterized in that: The step of energizing the support column and the electrode includes: An insulating layer is provided on the outside of the support column body; wherein, the support column includes a column head and a column body; the column head is made of conductive material, and the column body is made of conductive material; A first voltage is applied to the electrode using a first DC power supply, and a second voltage is applied to the support column using a second DC power supply.

6. The method as described in claim 5, characterized in that: Adjusting the power supply parameters of the support column until the electric field strength in the target area reaches the uniformity standard includes: Multiple test points are set up within the target area, and the electric field strength at each test point is measured. Adjust the output voltage of the second DC power supply until the electric field intensity in the target area reaches the uniformity standard, then end the adjustment.

7. The method as described in claim 1, characterized in that: The step of energizing the support column and the electrode includes: An insulating layer is provided on the outside of the support column body, and an electromagnetic induction coil is wound around the outside of the insulating layer; wherein, the support column includes a column head and a column body; the column head is made of conductive material, and the column body is made of conductive material; A first DC power supply is used to apply a voltage to the electrode, a second DC power supply is used to apply a second voltage to the support column, and a third DC power supply is used to provide current to the electromagnetic induction coil.

8. The method as described in claim 7, characterized in that: Adjusting the power supply parameters of the support column until the electric and magnetic field strengths within the target area reach the uniformity standard includes: Multiple test points are set up within the target area, and the magnetic field strength and electric field strength of each test point are measured. Adjust the output voltage of the second DC power supply, and adjust the magnitude and direction of the current flowing through the electromagnetic induction coil. The adjustment ends when the electric field strength and magnetic field strength in the target area reach the uniformity standard.

9. The method according to any one of claims 1-8, characterized in that: The target area includes the top surface area of ​​the support column and its surrounding area, wherein the surrounding area is the top surface area of ​​the electrode close to the top surface of the support column.

10. The method as described in claim 9, characterized in that: The magnetic field strength in the target area reaching the uniformity standard includes at least one of the following: The variance of the magnetic field strength within the target area is less than the first threshold. The target area is divided into a first area and a second area. The absolute value of the difference between the average magnetic field strength of the first area and the average magnetic field strength of the second area is less than a second threshold. The first area is the top surface area of ​​the support column, and the second area is the area outside the top surface area of ​​the support column. The electric field intensity within the target area must meet the uniformity standard, including at least one of the following: The variance of the electric field intensity within the target area is less than the first threshold. The target area is divided into a first area and a second area. The absolute value of the difference between the average electric field strength of the first area and the average electric field strength of the second area is less than a second threshold. The first area is the top surface area of ​​the support column, and the second area is the area outside the top surface area of ​​the support column.

11. The method as described in claim 1, characterized in that: The etching includes: dry etching.

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