Resonator package structure

Abstract

A resonator package structure includes a base, a resonator crystal piece and a top cover. The resonator crystal piece includes a resonant region and an optimization region. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other. The first side is perpendicular to the third side. The first side of the optimization region is connected to a side of the resonant region. The optimization region can have at least one rounded corner connected between the second side and its corresponding third side. The height of the bottom surface of the optimization region can be higher than the height of the bottom surface of the resonant region. The height of the top surface of the optimization region can be lower than the height of the top surface of the resonant region. The length between the first side and the second side of the optimization region divided by the thickness of the resonant region equals A, 0

Description

TECHNICAL FIELD

[0001] The present invention relates to a package structure, and more particularly to a resonator package structure. BACKGROUND

[0002] Quartz elements have stable piezoelectric characteristics, and can provide accurate and wide reference frequency, time pulse control, timing function, and noise filtering function. In addition, quartz elements can also be used as vibration and pressure sensors, and important optical elements. Therefore, for electronic products, quartz elements play an important role.

[0003] Figure 1a FIG. 1 is a sectional view of a quartz resonator of the prior art, Figure 1b FIG. 2 is an exploded view of the quartz resonator of the prior art. Please refer to Figure 1a and Figure 1b The quartz resonator 1 includes a ceramic base 10, a quartz crystal sheet 11, a top cover 12, an adhesive 13, a first conductive pad 14, a second conductive pad 15, a first electrode layer 16, and a second electrode layer 17. The quartz crystal sheet 11 is placed in a groove of the ceramic base 10 through the adhesive 13 and the first conductive pad 14, the first electrode layer 16 and the second electrode layer 17 are respectively arranged on the top surface and the bottom surface of the quartz crystal sheet 11, the ceramic base 10 has a conductive through hole 100, the first conductive pad 14 is electrically connected to the second conductive pad 15 through the conductive through hole 100, and the top cover 12 shields the quartz crystal sheet 11, the adhesive 13, the first conductive pad 14, the first electrode layer 16, and the second electrode layer 17. Since the quartz crystal sheet 11 is a complete rectangular crystal sheet, the vibration of the main vibration part is easily transmitted to the outside, resulting in unstable vibration frequency of the quartz resonator 1.

[0004] Therefore, the present invention is proposed to solve the above problems. SUMMARY

[0005] The present invention provides a resonator package structure, which reduces the resonance impedance to optimize the vibration characteristics.

[0006] In an embodiment of the present application, a resonator package structure is provided. The resonator package structure includes a base, a resonator crystal piece, and a top cover. The resonator crystal piece includes a resonator region, at least one optimization region, a frame region, and two connection regions. The resonator region is in a rectangular shape. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other, the first side is perpendicular to the third side, and the first side of the optimization region is connected to a side of the resonator region. The optimization region has at least one fillet connecting between the second side and its corresponding third side. A height of a bottom surface of the optimization region is higher than a height of a bottom surface of the resonator region, a height of a top surface of the optimization region is lower than a height of a top surface of the resonator region, a length between the first side and the second side of the optimization region divided by a thickness of the resonator region is equal to A, and 0 < A < 5. The frame region is disposed on the base, wherein the frame region surrounds the resonator region and the optimization region. The connection regions are connected between the frame region and the optimization region and are away from the fillet. The top cover is disposed on the frame region to shield the optimization region, the connection regions, and the resonator region.

[0007] In an embodiment of the present application, the resonator package structure further includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the bottom surface of the connection regions, the optimization region, and the resonator region, and the first electrode layer is electrically connected to the resonator region. The second electrode layer is disposed on the top surface of the connection regions, the optimization region, and the resonator region, and the second electrode layer is electrically connected to the resonator region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions, respectively.

[0008] In an embodiment of the present application, a resonator package structure is provided. The resonator package structure includes a base, a resonator crystal piece, and a top cover. The resonator crystal piece includes a resonator region, at least one optimization region, a frame region, and two connection regions. The resonator region is in a rectangular shape. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other, the first side is perpendicular to the third side, and the first side of the optimization region is connected to a side of the resonator region. A height of a bottom surface of the optimization region is higher than a height of a bottom surface of the resonator region, a height of a top surface of the optimization region is lower than a height of a top surface of the resonator region, and a length between the first side and the second side of the optimization region divided by a thickness of the resonator region is equal to A, and 0 < A < 5. The frame region is disposed on the base, wherein the frame region surrounds the resonator region and the optimization region. The connection regions are connected between the frame region and the optimization region. The top cover is disposed on the frame region to shield the optimization region, the connection regions, and the resonator region.

[0009] In an embodiment of the present application, the resonator package structure further includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the bottom surface of the connection regions, the optimization region, and the resonator region, and the first electrode layer is electrically connected to the resonator region. The second electrode layer is disposed on the top surface of the connection regions, the optimization region, and the resonator region, and the second electrode layer is electrically connected to the resonator region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions, respectively.

[0010] In one embodiment of the present application, the optimization region has two corners opposite to each other, each corner is connected between the second side and the corresponding third side, and all the corners of the optimization region include two right angles, and the two connection regions are connected to the two right angles respectively.

[0011] In one embodiment of the present application, a resonator package structure includes a base, a resonator crystal piece, and a top cover. The resonator crystal piece includes a resonator region, at least one optimization region, a frame region, and two connection regions. The resonator region is in a rectangular shape. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other, the first side is perpendicular to the third side, and the first side of the optimization region is connected to a side of the resonator region. The optimization region has at least one fillet connected between the second side and the corresponding third side. The radius of curvature of the fillet divided by the thickness of the resonator region is equal to B, and 0 < B < 4. The frame region is disposed on the base, wherein the frame region surrounds the resonator region and the optimization region. The connection regions are connected between the frame region and the optimization region and are away from the fillet. The top cover is disposed on the frame region to shield the optimization region, the connection regions, and the resonator region.

[0012] In one embodiment of the present application, the resonator package structure further includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the bottom surface of the connection regions, the optimization region, and the resonator region, and the first electrode layer is electrically connected to the resonator region. The second electrode layer is disposed on the top surface of the connection regions, the optimization region, and the resonator region, and the second electrode layer is electrically connected to the resonator region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions respectively.

[0013] In one embodiment of the present application, a resonator package structure includes a base, at least one adhesive, a resonator crystal piece, and a top cover. The top of the base has a recess, and the adhesive is disposed in the recess. The resonator crystal piece includes a resonator region and at least one optimization region. The resonator region is in a rectangular shape, and the optimization region is disposed on the adhesive. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other, the first side is perpendicular to the third side. The first side of the optimization region is connected to a side of the resonator region. The optimization region has at least one fillet connected between the second side and the corresponding third side. The height of the bottom surface of the optimization region is higher than the height of the bottom surface of the resonator region, the height of the top surface of the optimization region is lower than the height of the top surface of the resonator region, the length between the first side and the second side of the optimization region divided by the thickness of the resonator region is equal to A, and 0 < A < 5. The radius of curvature of the fillet divided by the thickness of the resonator region is equal to B, and 0 < B < 4. The top cover is disposed on the top of the base to shield the two adhesives and the resonator crystal piece.

[0014] In one embodiment of the present application, the resonator package structure further includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the bottom surface of the resonator region and the optimization region, and the second electrode layer is disposed on the top surface of the resonator region and the optimization region, wherein the first electrode layer and the second electrode layer are electrically connected to the adhesive.

[0015] In an embodiment of the present application, a resonator package structure includes a base, at least one adhesive, a resonator crystal piece, and a top cover. The top of the base has a recess, and the adhesive is disposed in the recess. The resonator crystal piece includes a resonator region and at least one optimization region. The resonator region is rectangular, and the optimization region is disposed on the adhesive. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other, and the first side is perpendicular to the third sides. The first side of the optimization region connects to a side of the resonator region. The bottom surface of the optimization region has a height higher than that of the resonator region, the top surface of the optimization region has a height lower than that of the resonator region, and the length between the first side and the second side of the optimization region divided by the thickness of the resonator region equals A, where 0 < A < 5. The top cover is disposed on the top of the base to shield the two adhesives and the resonator crystal piece.

[0016] In an embodiment of the present application, the resonator package structure further includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the bottom surface of the resonator region and the optimization region, and the second electrode layer is disposed on the top surface of the resonator region and the optimization region, where the first electrode layer and the second electrode layer are electrically connected to the adhesives.

[0017] In an embodiment of the present application, a resonator package structure includes a base, at least one adhesive, a resonator crystal piece, and a top cover. The top of the base has a recess, and the adhesive is disposed in the recess. The resonator crystal piece includes a resonator region and at least one optimization region. The resonator region is rectangular, and the optimization region is disposed on the adhesive. The optimization region has a first side and a second side parallel to each other and two third sides parallel to each other, and the first side is perpendicular to the third sides. The first side of the optimization region connects to a side of the resonator region. The optimization region has at least one fillet connecting between the second side and its corresponding third side. The radius of curvature of the fillet divided by the thickness of the resonator region equals B, where 0 < B < 4. The top cover is disposed on the top of the base to shield the two adhesives and the resonator crystal piece.

[0018] In an embodiment of the present application, the resonator package structure further includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the bottom surface of the resonator region and the optimization region, and the second electrode layer is disposed on the top surface of the resonator region and the optimization region, where the first electrode layer and the second electrode layer are electrically connected to the adhesives.

[0019] Based on the above, the resonator package structure meets the partial or all conditions of the width of the optimization region, the radius of curvature of the fillet, and the thickness of the resonator region to achieve better boundary effect and energy locking effect, thereby reducing the loss of vibration energy and the resonator impedance while optimizing the vibration characteristics. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1a A sectional view of the structure of a quartz resonator of the prior art.

[0021] Figure 1b A structural exploded view of a quartz vibrator of the related art.

[0022] Figure 2a A structural sectional view of a first embodiment of the resonator package structure of the present application.

[0023] Figure 2b A structural exploded view of a first embodiment of the resonator package structure of the present application.

[0024] Figure 2c A bottom view of a resonator crystal sheet and a first electrode layer thereon of a first embodiment of the resonator package structure of the present application.

[0025] Figure 2d A top view of a resonator crystal sheet and a second electrode layer thereon of a first embodiment of the resonator package structure of the present application.

[0026] Figure 2e A structural sectional view of a resonator region and an optimization region of a first embodiment of the resonator package structure of the present application.

[0027] Figure 3a A bottom view of a resonator crystal sheet and a first electrode layer thereon of a second embodiment of the resonator package structure of the present application.

[0028] Figure 3b A top view of a resonator crystal sheet and a second electrode layer thereon of a second embodiment of the resonator package structure of the present application.

[0029] Figure 4a A bottom view of a resonator crystal sheet and a first electrode layer thereon of a third embodiment of the resonator package structure of the present application.

[0030] Figure 4b A top view of a resonator crystal sheet and a second electrode layer thereon of a third embodiment of the resonator package structure of the present application.

[0031] Figure 5a A bottom view of a resonator crystal sheet and a first electrode layer thereon of a fourth embodiment of the resonator package structure of the present application.

[0032] Figure 5b A top view of a resonator crystal sheet and a second electrode layer thereon of a fourth embodiment of the resonator package structure of the present application.

[0033] Figure 6a A bottom view of a resonator crystal sheet and a first electrode layer thereon of a fifth embodiment of the resonator package structure of the present application.

[0034] Figure 6b A top view of a resonator crystal sheet and a second electrode layer thereon of a fifth embodiment of the resonator package structure of the present application.

[0035] Figure 7a Structure perspective view of a sixth embodiment of the resonator package structure of the present invention.

[0036] Figure 7b Structure exploded view of a sixth embodiment of the resonator package structure of the present invention.

[0037] Figure 7c Structure sectional view of a sixth embodiment of the resonator package structure of the present invention.

[0038] Figure 7d Top view of a resonator crystal piece of a sixth embodiment of the resonator package structure of the present invention.

[0039] Figure 7e Sectional view of a resonator crystal piece of a sixth embodiment of the resonator package structure of the present invention.

[0040] BRIEF DESCRIPTION OF DRAWINGS 1 - quartz vibrator; 10 - ceramic base; 100 - conductive via; 11 - quartz crystal piece; 12 - top cover; 13 - adhesive; 14 - first conductive pad; 15 - second conductive pad; 16 - first electrode layer; 17 - second electrode layer; 2 - resonator package structure; 20 - base; 22 - resonator crystal piece; 220 - resonator region; 221 - optimization region; 222 - frame region; 223 - connection region; 24 - top cover; 25 - first electrode layer; 26 - second electrode layer; 27 - conductive pad; 3 - resonator package structure; 30 - base; 300 - recess; 301 - conductive via; 31 - adhesive; 32 - resonator crystal piece; 320 - resonator region; 321 - optimization region; 33 - top cover; 34 - first electrode layer; 35 - second electrode layer; 36 - first conductive pad; 37 - second conductive pad; X, X' - length; R, R' - radius of curvature; Y, Y' - thickness. DETAILED DESCRIPTION

[0041] Embodiments of the present invention will be described further with reference to the following drawings. In the drawings and specification, identical reference numerals have been used to designate identical elements. In the drawings, the shapes and thicknesses can be exaggerated for the sake of clear and convenient illustration. It can be understood that elements not specifically shown or described in the specification are in forms known to those having ordinary skill in the art. Those having ordinary skill in the art can make various changes and modifications to the present invention based on the contents of the present invention.

[0042] When an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular element, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" are not necessarily referring to the same embodiment.

[0044] The application is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The application, however, both as to organization and method of operation, together with objects, features, and advantages thereof, can best be understood by reference to the following detailed description of the application when read with the accompanying drawings in which:

[0045] Furthermore, the word "coupled" and "connected" and variations thereof, as used herein, are used generically and exemplify any connection or coupling, optical, electrical or otherwise, between two or more elements. Many variations and modifications of the embodiments described herein can be made by those skilled in the art without departing from the intended scope of the application. For example, it will be apparent to those skilled in the art that the specific spatial and time relationships described herein are not required. The terms "comprise", "comprising", "include", "including", "having", "contains" or "contains" and variations thereof herein are open-ended, and mean including, but not limited to. None of the elements or limitations of the application are essential, nor are implementation or use of all functions and steps described necessary for the practice of the application. Additionally, the words "example" and "exemplary" are used herein to mean serving as an instance, example, or illustration, at the express direction thereof, and not to imply or connote that anything is preferred or necessary. Also, the use of "including", "containing", "having" or "with" and variations thereof herein, is meant to encompass the items listed thereafter, and equivalents thereof as well as additional items.

[0046] It will be understood that the words "comprise", "comprising", "include", "including", "have", "having", "contain", "containing", "characterized by", "characterized" and variations thereof herein are used broadly and encompass the passing of subject matter from one manner to another. None of the elements or limitations of the application are essential, nor are implementation or use of all functions and steps described necessary to the practice of the application. Additionally, the use of "example" or "exemplary" is merely meant to be an example and is not to be used in a way that would limit the scope of the application. Moreover, the section headings and titles are for convenience only and are not to be construed as limiting the application in any way.

[0047] A resonator package structure is introduced below, which optimizes the width of the optimization region, the curvature radius of the rounded corner and the thickness of the resonant region to achieve better boundary effect and energy locking effect, thereby reducing the loss of vibration energy and the resonant impedance, and optimizing the vibration characteristics.

[0048] Figure 2a A structure cross-sectional view of a first embodiment of the resonator package structure of the present application, Figure 2b A structure exploded view of a first embodiment of the resonator package structure of the present application, Figure 2c A bottom view of a resonant crystal wafer and a first electrode layer thereon of a first embodiment of the resonator package structure of the present application, Figure 2d A top view of a resonant crystal wafer and a second electrode layer thereon of a first embodiment of the resonator package structure of the present application, Figure 2e A structure cross-sectional view of a resonant region and an optimization region of a first embodiment of the resonator package structure of the present application. Please refer to Figure 2a 、 Figure 2b 、 Figure 2c 、 Figure 2d andFigure 2e A first embodiment of the resonator package structure 2 is described as follows. The resonator package structure 2 includes a base 20, a resonator crystal piece 22, and a top cover 24. The resonator crystal piece 22 includes a resonant region 220, at least one optimized region 221, a frame region 222, and two connecting regions 223. Two optimized regions 221 are taken as an example. In some embodiments of the present application, the resonant region 220, the frame region 222, the two connecting regions 223, and the two optimized regions 221 can be integrally formed. The resonant region 220, the frame region 222, the two connecting regions 223, and the two optimized regions 221 can be quartz, but the present application is not limited thereto. The resonant region 220 is rectangular, each optimized region 221 has a first side and a second side parallel to each other and two third sides parallel to each other, and the first side is perpendicular to the third side. The resonant region 220 is located between the two optimized regions 221, and the first sides of the two optimized regions 221 are connected to the two parallel sides of the resonant region 220, respectively. The first embodiment needs to satisfy at least one of the first condition and the second condition. In the first condition, the optimized region 221 has at least one fillet. For example, each optimized region 221 has two fillets opposite to each other, and each fillet is connected between the second side and the corresponding third side. In the second condition, the height of the bottom surface of each optimized region 221 is higher than the height of the bottom surface of the resonant region 220, the height of the top surface of each optimized region 221 is lower than the height of the top surface of the resonant region 220, and the length X between the first side and the second side of each optimized region 221 divided by the thickness Y of the resonant region 220 is equal to A, 0 < A < 5. If the first condition is satisfied, the radius of curvature R of each fillet divided by the thickness Y of the resonant region 220 is equal to B, 0 < B < 4. The resonator package structure 2 achieves better boundary effect and energy locking effect according to the width of the optimized region 221, the radius of curvature R of the fillet, and the thickness Y of the resonant region 220, thereby reducing the loss of vibration energy and the resonant impedance, i.e., equivalent series resistance (ESR), and optimizing the vibration characteristics. If A is greater than 5 or B is greater than 4, the resonant impedance will increase sharply. The height difference between the optimized region 221 and the resonant region 220 can block the transmission path of the resonant acoustic wave to prevent energy from spreading out from the resonant region 220. The optimized region 221 cannot be circular or elliptical. If the optimized region 221 is circular or elliptical, the resonant spurious wave will be coupled, causing the resonant impedance to increase sharply. The frame region 222 is arranged on the base 20, wherein the frame region 222 surrounds the resonant region 220 and all the optimized regions 221. The two connecting regions 223 are connected to the second sides of the two optimized regions 221, respectively, and each connecting region 223 is connected between the frame region 222 and the second side of the optimized region 221, and is away from the fillet. The top cover 24 is arranged on the frame region 222 to shield the two optimized regions 221, the two connecting regions 223, and the resonant region 220.

[0049] To electrically connect external elements, the resonator package structure 2 can further comprise a first electrode layer 25, a second electrode layer 26 and a plurality of conductive pads 27. The first electrode layer 25 is disposed on the bottom surface of the connecting region 223, the optimization region 221 and the resonant region 220, and electrically connected to the resonant region 220. The second electrode layer 26 is disposed on the top surface of the connecting region 223, the optimization region 221 and the resonant region 220, and electrically connected to the resonant region 220. The first electrode layer 25 and the second electrode layer 26 can correspond to two connecting regions 223 respectively, or correspond to the same connecting region 223. The conductive pads 27 are disposed on the bottom surface of the base 20, and electrically connected to external elements.

[0050] Figure 3a Bottom view of the resonator wafer and the first electrode layer thereon for the second embodiment of the resonator package structure of the present application. Figure 3b Top view of the resonator wafer and the second electrode layer thereon for the second embodiment of the resonator package structure of the present application. Please refer to Figure 2b 、 Figure 3a and Figure 3bThe second embodiment of the resonator package structure of the present application is described as follows. The second embodiment differs from the first embodiment in the shape of the resonator crystal piece 22. The resonator crystal piece 22 comprises a resonator region 220, two optimization regions 221, a frame region 222 and two connection regions 223. The resonator region 220 is in a rectangular shape. Each of the optimization regions 221 has a first side and a second side parallel to each other and two third sides parallel to each other, and the first side is perpendicular to the third side. The resonator region 220 is located between the two optimization regions 221, and the first side of each of the optimization regions 221 is connected to the two sides of the resonator region 220 parallel to each other. The second embodiment satisfies at least one of the first condition and the second condition. In the first condition, each of the optimization regions 221 has two corners opposite to each other, and each of the corners is connected between the second side and the corresponding third side. The corners of the two optimization regions 221 comprise two fillets and two straight angles. In the second embodiment, the two fillets are located on a first straight line, and the two straight angles are located on a second straight line, and the first straight line is parallel to the second straight line. In other words, one of the optimization regions 221 has a fillet as a corner, and the other optimization region 221 has a straight angle as a corner. In the second condition, the height of the bottom surface of each of the optimization regions 221 is higher than the height of the bottom surface of the resonator region 220, the height of the top surface of each of the optimization regions 221 is lower than the height of the top surface of the resonator region 220, and the length X between the first side and the second side of each of the optimization regions 221 divided by the thickness Y of the resonator region 220 is equal to A, and 0 < A < 5. If the first condition is satisfied, the radius R of each of the fillets divided by the thickness Y of the resonator region 220 is equal to B, and 0 < B < 4. The resonator package structure 2 achieves better boundary effect and energy locking effect according to the width of the optimization region 221, the radius R of the fillet and the thickness Y of the resonator region 220, thereby reducing the loss of vibration energy and the resonator impedance, and optimizing the vibration characteristics. If A is greater than 5 or B is greater than 4, the resonator impedance will increase sharply. The height difference between the optimization region 221 and the resonator region 220 can block the transmission path of the resonant acoustic wave, thereby preventing the energy from escaping from the resonator region 220. The frame region 222 is arranged on the base 20, and the frame region 222 surrounds the resonator region 220 and all the optimization regions 221. The two connection regions 223 are connected to the two straight angles respectively, and each of the connection regions 223 is connected between the frame region 222 and the straight angle. Since the inner edge of the frame region 222 is in a rectangular shape, in the second embodiment, the short inner edge of the frame region 222 connected by the connection region 223 is taken as an example.

[0051] Figure 4a The bottom view of the resonator crystal piece and the first electrode layer thereon of the third embodiment of the resonator package structure of the present application. Figure 4b The top view of the resonator crystal piece and the second electrode layer thereon of the third embodiment of the resonator package structure of the present application. Please refer to Figure 2b 、 Figure 4a and Figure 4bThe third embodiment of the resonator package structure of the present application is described as follows. The third embodiment differs from the second embodiment in the position of the connecting region 223. In the third embodiment, the long inner edge of the frame region 222 connected by the connecting region 223 is taken as an example, and the remaining features have been described in the second embodiment, which will not be described here.

[0052] Figure 5a The bottom view of the resonator wafer and the first electrode layer thereon of the fourth embodiment of the resonator package structure of the present application. Figure 5b The top view of the resonator wafer and the second electrode layer thereon of the fourth embodiment of the resonator package structure of the present application. Please refer to Figure 2b Figure 5a and Figure 5b ​The fourth embodiment of the resonator package structure of the present application is described as follows. The fourth embodiment differs from the first embodiment in the shape of the resonator crystal piece 22. The resonator crystal piece 22 comprises a resonator region 220, two optimization regions 221, a frame region 222 and two connecting regions 223. The resonator region 220 is in the shape of a rectangle. Each of the optimization regions 221 has a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third side. The resonator region 220 is located between the two optimization regions 221, and the first side of each of the optimization regions 221 is connected to a side of the resonator region 220 parallel to it. Each of the optimization regions 221 has two corners opposite to each other, and each of the corners is connected between the second side and the corresponding third side. The corners of the two optimization regions 221 comprise two straight corners and two rounded corners. The fourth embodiment satisfies at least one of the first condition and the second condition. In the first condition, the corners of the two optimization regions 221 further comprise two rounded corners and two straight corners. In the fourth embodiment, the two rounded corners are located on a first straight line, and the two straight corners are located on a second straight line, the first straight line and the second straight line being staggered. In other words, one of the optimization regions 221 has corners comprising rounded corners and straight corners, and the other optimization region 221 also has corners comprising rounded corners and straight corners. In the second condition, the height of the bottom surface of each of the optimization regions 221 is higher than the height of the bottom surface of the resonator region 220, the height of the top surface of each of the optimization regions 221 is lower than the height of the top surface of the resonator region 220, and the length X between the first side and the second side of each of the optimization regions 221 divided by the thickness Y of the resonator region 220 is equal to A, 0 < A < 5. If the first condition is satisfied, the radius R of each of the rounded corners divided by the thickness Y of the resonator region 220 is equal to B, 0 < B < 4. The resonator package structure 2 achieves better boundary effect and energy locking effect according to the width of the optimization region 221, the radius R of the rounded corner and the thickness Y of the resonator region 220, thereby reducing the loss of vibration energy and the resonator impedance, and optimizing the vibration characteristics. If A is greater than 5 or B is greater than 4, the resonator impedance will increase sharply. The height difference between the optimization region 221 and the resonator region 220 can block the transmission path of the resonant acoustic wave, thereby preventing the energy from escaping from the resonator region 220. The frame region 222 is arranged on the base 20, and the frame region 222 surrounds the resonator region 220 and all the optimization regions 221. The two connecting regions 223 are connected to the two straight corners respectively, and each of the connecting regions 223 is connected between the frame region 222 and the straight corner. Since the inner edge of the frame region 222 is in the shape of a rectangle, in the fourth embodiment, the short inner edge of the frame region 222 connected by the connecting region 223 is taken as an example.

[0053] Figure 6a The bottom view of the resonator crystal piece and the first electrode layer thereon of the fifth embodiment of the resonator package structure of the present application. Figure 6b The top view of the resonator crystal piece and the second electrode layer thereon of the fifth embodiment of the resonator package structure of the present application. Please refer to Figure 2b 、 Figure 6a andFigure 6b The fifth embodiment of the resonator package structure of the present application is described as follows. The fifth embodiment differs from the fourth embodiment in the position of the connecting region 223. In the fifth embodiment, the long inner edge of the frame region 222 connected by the connecting region 223 is taken as an example, and the remaining features have been described in the fourth embodiment and will not be described again here.

[0054] Figure 7a The structure perspective view of the sixth embodiment of the resonator package structure of the present application is shown in FIG. 6. Figure 7b The structure exploded view of the sixth embodiment of the resonator package structure of the present application is shown in FIG. 7. Figure 7c The structure cross-sectional view of the sixth embodiment of the resonator package structure of the present application is shown in FIG. 8. Figure 7d The top view of the resonator crystal piece of the sixth embodiment of the resonator package structure of the present application is shown in FIG. 9. Figure 7e The cross-sectional view of the resonator crystal piece of the sixth embodiment of the resonator package structure of the present application is shown in FIG. 10. Please refer to Figure 7a Figure 7b Figure 7c Figure 7d Figure 7e ​​​​The sixth embodiment of the resonator package structure 3 is described as follows. The resonator package structure 3 includes a base 30, at least one adhesive 31, a resonator crystal piece 32, and a top cover 33. Two adhesives 31 are taken as an example. The top of the base 30 has a groove 300, and the two adhesives 31 are arranged in the groove 300. The resonator crystal piece 32 includes a resonant region 320 and at least one optimization region 321. Two optimization regions 321 are taken as an example. In some embodiments of the present application, the resonant region 320 and the two optimization regions 321 can be integrally formed. The resonant region 320 and the optimization region 321 can be quartz, but the present application is not limited thereto. The resonant region 320 is in the shape of a rectangle, and the two optimization regions 321 are arranged on the two adhesives 31, respectively. Each optimization region 321 has a first side and a second side parallel to each other and two third sides parallel to each other, and the first side is perpendicular to the third side. The resonant region 320 is located between the two optimization regions 321, and the first side of each optimization region 321 is connected to the two sides of the resonant region 320, respectively. The sixth embodiment satisfies at least one of the first condition and the second condition. In the first condition, the optimization region 321 has at least one fillet. For example, each optimization region 321 has two fillets opposite to each other, and each fillet is connected between the second side and the corresponding third side. In the second condition, the height of the bottom surface of each optimization region 321 is higher than the height of the bottom surface of the resonant region 320, the height of the top surface of each optimization region 321 is lower than the height of the top surface of the resonant region 320, and the length X' between the first side and the second side of each optimization region 321 divided by the thickness Y' of the resonant region 320 is equal to A, 0 < A < 5. If the first condition is satisfied, the radius of curvature R' of each fillet divided by the thickness Y' of the resonant region 320 is equal to B, 0 < B < 4. The top cover 33 is arranged on the top of the base 30 to shield the two adhesives 31 and the resonator crystal piece 32. The resonator package structure 3 achieves better boundary effect and energy locking effect according to the width of the optimization region 321, the radius of curvature R' of the fillet, and the thickness Y' of the resonant region 320, thereby reducing the loss of vibration energy and the resonant impedance, and optimizing the vibration characteristics. If A is greater than 5 or B is greater than 4, the resonant impedance will increase sharply. The height difference between the optimization region 321 and the resonant region 320 can block the transmission path of the resonant acoustic wave to prevent energy from spreading out from the resonant region 320. The optimization region 321 cannot be in the shape of a circle or an ellipse. If the optimization region 321 is in the shape of a circle or an ellipse, the resonant spurious wave will be coupled, causing the resonant impedance to increase sharply.

[0055] In order to electrically connect the external elements, the two adhesives 31 can be electrically conductive glue, and the resonator package structure 3 can further include a first electrode layer 34, a second electrode layer 35, two first conductive pads 36 and a plurality of second conductive pads 37. The first electrode layer 34 is arranged on the bottom surface of the resonance region 320 and the optimization region 321, and the second electrode layer 35 is arranged on the top surface of the resonance region 320 and the optimization region 321. The first electrode layer 34 and the second electrode layer 35 correspond to the two optimization regions 321 respectively, and are electrically connected to the two adhesives 31 respectively. The first conductive pads 36 are arranged in the groove 300, and the two adhesives 31 are arranged on the base 30 through the two first conductive pads 36 respectively. The bottom of the base 30 has two conductive through holes 301 penetrating through itself, and the two conductive through holes 301 are electrically connected to the two first conductive pads 36 respectively. All the second conductive pads 37 are arranged on the bottom surface of the base 30, and all the second conductive pads 37 are electrically connected to the two conductive through holes 301 and the external elements.

[0056] According to the above-mentioned embodiments, the resonator package structure achieves better boundary effect and energy locking effect according to the width of the optimization region, the curvature radius of the round corner and the thickness of the resonance region, thereby reducing the loss of vibration energy and the resonance impedance, and optimizing the vibration characteristics.

[0057] The above only describes a preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any equivalent changes and modifications made according to the shape, structure, features and spirit of the present application are included in the scope of the present application.

Claims

1. A resonator package structure, characterized by, Comprising: a base; a resonator wafer, comprising: a resonator region, in a rectangular shape; at least one optimization region, the at least one optimization region having a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third sides, the first side of the at least one optimization region connecting a side of the resonator region, wherein the at least one optimization region has at least one rounded corner connecting between the second side and its corresponding third side, a height of a bottom surface of the at least one optimization region is higher than a height of a bottom surface of the resonator region, a height of a top surface of the at least one optimization region is lower than a height of a top surface of the resonator region, a length between the first side and the second side of the at least one optimization region divided by a thickness of the resonator region equals A, 0 a frame region, disposed on the base, wherein the frame region surrounds the resonator region and the at least one optimization region; and two connection regions, connected between the frame region and the at least one optimization region, and apart from the at least one rounded corner; and a cover, disposed on the frame region, to shield the at least one optimization region, the two connection regions, and the resonator region.

2. The resonator package structure of claim 1, wherein, Further comprising: a first electrode layer, disposed on a bottom surface of the connection regions, the at least one optimization region, and the resonator region, the first electrode layer electrically connected to the resonator region; and a second electrode layer, disposed on a top surface of the connection regions, the at least one optimization region, and the resonator region, the second electrode layer electrically connected to the resonator region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions respectively. Comprising:

3. A resonator package structure, characterized by, a base; a resonator wafer, comprising: a resonator region, in a rectangular shape; at least one optimization region, the at least one optimization region having a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third sides, the first side of the at least one optimization region connecting a side of the resonator region, wherein a height of a bottom surface of the at least one optimization region is higher than a height of a bottom surface of the resonator region, a height of a top surface of the at least one optimization region is lower than a height of a top surface of the resonator region, a length between the first side and the second side of the at least one optimization region divided by a thickness of the resonator region equals A, 0 a frame region, disposed on the base, wherein the frame region surrounds the resonator region and the at least one optimization region; and two connection regions, connected between the frame region and the at least one optimization region; and a cover, disposed on the frame region, to shield the at least one optimization region, the two connection regions, and the resonator region. Further comprising:

4. The resonator package structure of claim 3, wherein, a first electrode layer, disposed on a bottom surface of the connection regions, the at least one optimization region, and the resonator region, the first electrode layer electrically connected to the resonator region; and a second electrode layer, disposed on a top surface of the connection regions, the at least one optimization region, and the resonator region, the second electrode layer electrically connected to the resonator region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions respectively. ​ a second electrode layer disposed on top surfaces of the at least one optimization region and the resonant region, the second electrode layer electrically connected to the resonant region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions respectively.

5. The resonator package structure of claim 3, wherein, The at least one optimization region has two corners opposite to each other, each of the corners being connected between the second side and the corresponding third side, the corners of the at least one optimization region including two right angles, and the two connection regions being connected to the two right angles respectively.

6. A resonator package structure, characterized by, It further comprises: a base; a resonant crystal wafer comprising: a resonant region in a rectangular shape; at least one optimization region having a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third side, the first side of the at least one optimization region being connected to a side of the resonant region, wherein the at least one optimization region has at least one rounded corner connected between the second side and the corresponding third side, a radius of curvature of the at least one rounded corner divided by a thickness of the resonant region being equal to B, 0 < B < 4; a bezel region disposed on the base, wherein the bezel region surrounds the resonant region and the at least one optimization region; and two connection regions connected between the bezel region and the at least one optimization region and away from the at least one rounded corner; and a top cover disposed on the bezel region to shield the at least one optimization region, the two connection regions, and the resonant region. It further comprises:

7. The resonator package structure of claim 6, wherein, a first electrode layer disposed on bottom surfaces of the at least one optimization region and the resonant region, the first electrode layer electrically connected to the resonant region; and a second electrode layer disposed on top surfaces of the at least one optimization region and the resonant region, the second electrode layer electrically connected to the resonant region, wherein the first electrode layer and the second electrode layer correspond to the two connection regions respectively. It further comprises:

8. A resonator package structure, characterized by, a base having a recess on a top portion of the base; at least one adhesive disposed in the recess; a resonant crystal wafer comprising: a resonant region in a rectangular shape; and at least one optimization region disposed on the at least one adhesive, the at least one optimization region having a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third side, the first side of the at least one optimization region being connected to a side of the resonant region, wherein the at least one optimization region has at least one rounded corner connected between the second side and the corresponding third side, a height of a bottom surface of the at least one optimization region being higher than a height of a bottom surface of the resonant region, a height of a top surface of the at least one optimization region being lower than a height of a top surface of the resonant region, a length between the first side and the second side of the at least one optimization region divided by a thickness of the resonant region being equal to A, 0 < A < 5, and a radius of curvature of the at least one rounded corner divided by the thickness of the resonant region being equal to B, 0 < B < 4; and a top cover disposed on the top portion of the base to shield the at least one adhesive and the resonant crystal wafer. It further comprises:

9. The resonator package structure of claim 8, wherein, ​ a first electrode layer disposed on a bottom surface of the resonance region and the at least one optimization region; and a second electrode layer disposed on a top surface of the resonance region and the at least one optimization region, wherein the first electrode layer and the second electrode layer are electrically connected to the at least one adhesive.

10. A resonator package structure, characterized by, Further comprising: a base having a recess on a top portion thereof; at least one adhesive disposed in the recess; a resonator crystal including: a resonance region in a rectangular shape; and at least one optimization region disposed on the at least one adhesive, the at least one optimization region having a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third sides, the first side of the at least one optimization region being connected to a side of the resonance region, wherein a height of a bottom surface of the at least one optimization region is higher than a height of a bottom surface of the resonance region, a height of a top surface of the at least one optimization region is lower than a height of a top surface of the resonance region, and a length between the first side and the second side of the at least one optimization region divided by a thickness of the resonance region is equal to A, 0 < A < 5; and a top cover disposed on a top portion of the base to shield the at least one adhesive and the resonator crystal.

11. The resonator package structure of claim 10, wherein, Further comprising: a first electrode layer disposed on a bottom surface of the resonance region and the at least one optimization region; and a second electrode layer disposed on a top surface of the resonance region and the at least one optimization region, wherein the first electrode layer and the second electrode layer are electrically connected to the at least one adhesive.

12. A resonator package structure, characterized by, Further comprising: a base having a recess on a top portion thereof; at least one adhesive disposed in the recess; a resonator crystal including: a resonance region in a rectangular shape; and at least one optimization region disposed on the at least one adhesive, the at least one optimization region having a first side and a second side parallel to each other and two third sides parallel to each other, the first side being perpendicular to the third sides, the first side of the at least one optimization region being connected to a side of the resonance region, wherein the at least one optimization region has at least one rounded corner connected between the second side and a corresponding one of the third sides, and a radius of curvature of the at least one rounded corner divided by a thickness of the resonance region is equal to B, 0 < B < 4; and a top cover disposed on a top portion of the base to shield the at least one adhesive and the resonator crystal.

13. The resonator package structure of claim 12, wherein, Further comprising: a first electrode layer disposed on a bottom surface of the resonance region and the at least one optimization region; and a second electrode layer disposed on a top surface of the resonance region and the at least one optimization region, wherein the first electrode layer and the second electrode layer are electrically connected to the at least one adhesive.

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