A heat dissipation mechanism for a solid state relay

Abstract

This utility model discloses a heat dissipation mechanism for a solid-state relay, including a housing for mounting the relay body, a top cover fixedly connected to the inner wall of the housing, an air inlet and an air outlet on both sides of the housing, an air inlet pipe fixedly connected to one side of the housing corresponding to the air inlet, a filter screen fixedly connected to the inner wall of the air inlet pipe, a support shaft fixedly connected to one side of the housing, a rotating arm rotatably connected to one end of the support shaft, and bristles fixedly connected to the side of the rotating arm near the filter screen. When the bristles rotate to below the air inlet pipe, a movable column contacts a fixed column, and the fixed column presses against the movable column, causing the movable column to move towards the side closer to the filter screen. This compresses a spring and drives a sliding rod to move, which in turn moves a movable plate away from the rotating arm, cleaning the bristles. This allows the heat dissipation mechanism for the solid-state relay to effectively clean the bristles, preventing dust adhering to the bristles from affecting the subsequent cleaning of the filter screen.

Description

Technical Field

[0001] This application relates to the field of solid-state relay technology, and in particular to a heat dissipation mechanism for solid-state relays. Background Technology

[0002] Solid-state relays are contactless switches composed of microelectronic circuits, discrete electronic components, and power electronic devices. Isolation devices achieve isolation between the control terminal and the load terminal. Solid-state relays use a small control signal at their input to directly drive a high-current load. Because they generate considerable heat during operation, they typically require a cooling system for heat dissipation.

[0003] A search revealed that Chinese Patent CN218447730U discloses a heat dissipation mechanism for solid-state relays. This mechanism uses a mounting bracket, a brush, a bearing, and a heat sink. When the fan rotates, the heat sink rotates on the inner wall of the bearing via a drive shaft. This allows the brush to sweep away dust accumulated in the heat sink's ventilation holes. However, dust tends to accumulate inside the brush during operation, and this dust can easily re-adhere to the heat sink during subsequent brush cycles, affecting the cleaning effect. Therefore, a heat dissipation mechanism for solid-state relays is proposed to solve this problem. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation mechanism for solid-state relays to solve the problems mentioned in the background art.

[0005] The embodiments of this application adopt the following technical solutions:

[0006] A heat dissipation mechanism for a solid-state relay includes a housing for mounting the relay body. A top cover is fixedly connected to the inner wall of the housing. An air inlet and an air outlet are respectively opened on both sides of the housing. An air inlet pipe is fixedly connected to one side of the housing at a position corresponding to the air inlet. A filter screen is fixedly connected to the inner wall of the air inlet pipe. A support shaft is fixedly connected to one side of the housing. A rotating arm is rotatably connected to one end of the support shaft. Brush bristles are fixedly connected to the side of the rotating arm near the filter screen. A movable plate is provided on the side of the rotating arm near the filter screen. A through hole adapted to the brush bristles is opened on the side of the movable plate. A sliding hole is opened on the side of the rotating arm, and a sliding rod is slidably connected to the inner wall of the sliding hole. One end of the sliding rod is fixedly connected to the movable plate. The sliding rod can drive the movable plate to move towards the side near the filter screen to clean the brush bristles.

[0007] Preferably, a support arm is fixedly connected to one side of the housing, a motor is fixedly connected to one side of the support arm, the output end of the motor passes through the support arm and is fixedly connected to a rotating shaft, and one end of the rotating shaft is fixedly connected to the rotating arm.

[0008] Preferably, a fixed column is fixedly connected to the side of the support arm near the outer shell, and a movable column is fixedly connected to the end of the slide rod away from the moving plate. Both the fixed column and the movable column are semi-cylindrical, and the fixed column pushes the movable column to move after contacting the movable column.

[0009] Preferably, a spring is fitted onto the surface of the slide rod, one end of the spring is fixedly connected to the rotating arm, and the other end of the spring is fixedly connected to the movable column.

[0010] Preferably, a dust removal ring is fixedly connected to one side of the outer shell. The dust removal ring is sleeved on the outside of the air inlet pipe. The bottom of the dust removal ring has a downward inclined guide wall, and a dust removal port is opened at the bottom of the guide wall.

[0011] Preferably, a fan is fixedly connected to the inner wall of the air inlet duct.

[0012] Preferably, the bottom of the housing has a through-hole for exposing the pins of the relay body.

[0013] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects:

[0014] In this invention, the output end of the motor drives the rotating shaft to rotate, which in turn drives the rotating arm to rotate, thereby driving the bristles to clean the filter screen. As the rotating arm rotates, when the bristles rotate to the bottom of the air inlet pipe, the movable column contacts the fixed column. The fixed column presses against the movable column, causing the movable column to move closer to the filter screen, which in turn compresses the spring and drives the slide rod to move. The slide rod drives the moving plate to move away from the rotating arm, cleaning the bristles. Thus, the heat dissipation mechanism of the solid-state relay has the effect of cleaning the bristles, preventing dust adhering inside the bristles from affecting the subsequent cleaning effect on the filter screen. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 Here is a three-dimensional structural schematic diagram of this utility model;

[0017] Figure 2 See: A cross-sectional view of the outer shell of this utility model;

[0018] Figure 3 Here is a cross-sectional view of the dust removal ring of this utility model;

[0019] Figure 4 Here is a three-dimensional structural diagram of the rotating arm and brush bristles of this utility model;

[0020] Figure 5 This utility model is: Figure 4 Enlarged structural diagram at point A;

[0021] Figure 6 See: A cross-sectional view of the air inlet pipe and filter screen of this utility model.

[0022] In the diagram: 1. Relay body; 2. Housing; 3. Top cover; 4. Air inlet; 5. Air outlet; 6. Air inlet pipe; 7. Filter screen; 8. Support shaft; 9. Rotating arm; 10. Brush bristles; 11. Moving plate; 12. Slide rod; 13. Support arm; 14. Motor; 15. Rotating shaft; 16. Fixed column; 17. Moving column; 18. Spring; 19. Dust removal ring; 20. Guide wall; 21. Dust removal port; 22. Fan; 23. Pin. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0025] Please see Figure 1-6 This utility model provides a technical solution for a heat dissipation mechanism for solid-state relays:

[0026] A heat dissipation mechanism for a solid-state relay includes a housing 2 for mounting the relay body 1. A top cover 3 is fixedly connected to the inner wall of the housing 2. An air inlet 4 and an air outlet 5 are respectively opened on both sides of the housing 2. An air inlet pipe 6 is fixedly connected to one side of the housing 2 at a position corresponding to the air inlet 4. A filter screen 7 is fixedly connected to the inner wall of the air inlet pipe 6. A support shaft 8 is fixedly connected to one side of the housing 2. A rotating arm 9 is rotatably connected to one end of the support shaft 8. A brush bristle 10 is fixedly connected to the side of the rotating arm 9 near the filter screen 7. A movable plate 11 is provided on the side of the rotating arm 9 near the filter screen 7. A through hole adapted to the brush bristle 10 is opened on the side of the movable plate 11. A sliding hole is opened on the side of the rotating arm 9, and a sliding rod 12 is slidably connected to the inner wall of the sliding hole. One end of the sliding rod 12 is fixedly connected to the movable plate 11. The sliding rod 12 can drive the movable plate 11 to move towards the side near the filter screen 7 to clean the brush bristle 10.

[0027] Specifically, the relay body 1 is ventilated and cooled by setting air inlet 4 and air outlet 5. Dust is prevented from entering the interior of the housing 2 by setting filter screen 7. The brush 10 is rotated by rotating arm 9 to clean the filter screen 7 and prevent it from clogging. The sliding rod 12 drives the moving plate 11 to move away from the rotating arm 9 to clean the brush 10. Thus, the heat dissipation mechanism of the solid-state relay has the effect of cleaning the brush 10 and avoids dust adhering inside the brush 10 from affecting the subsequent cleaning effect of the filter screen 7.

[0028] A support arm 13 is fixedly connected to one side of the outer casing 2, and a motor 14 is fixedly connected to one side of the support arm 13. The output end of the motor 14 passes through the support arm 13 and is fixedly connected to a rotating shaft 15. One end of the rotating shaft 15 is fixedly connected to the rotating arm 9. The output end of the motor 14 drives the rotating shaft 15 to rotate, thereby driving the rotating arm 9 to rotate.

[0029] A fixed column 16 is fixedly connected to the side of the support arm 13 near the outer shell 2, and a movable column 17 is fixedly connected to the end of the slide rod 12 away from the moving plate 11. Both the fixed column 16 and the movable column 17 are semi-cylindrical. After the fixed column 16 contacts the movable column 17, it pushes the movable column 17 to move. By setting the support arm 13 to install the motor 14 and the fixed column 16, after the fixed column 16 contacts the movable column 17, the fixed column 16 presses against the movable column 17, causing the movable column 17 to move towards the side closer to the filter screen 7, thereby compressing the spring 18 and driving the slide rod 12 to move.

[0030] A spring 18 is fitted on the surface of the slide rod 12. One end of the spring 18 is fixedly connected to the rotating arm 9, and the other end of the spring 18 is fixedly connected to the movable column 17. By setting the spring 18, after the fixed column 16 is separated from the movable column 17, the spring 18 resets and drives the movable column 17 to reset, thereby driving the slide rod 12 to move, and then driving the movable plate 11 to reset.

[0031] A dust removal ring 19 is fixedly connected to one side of the outer casing 2. The dust removal ring 19 is sleeved on the outside of the air inlet pipe 6. The bottom of the dust removal ring 19 has a downward inclined guide wall 20. A dust removal port 21 is opened at the bottom of the guide wall 20. By setting the dust removal ring 19 to block the dust, the dust is prevented from escaping. By setting the guide wall 20 to guide the dust, it is discharged from the dust removal port 21.

[0032] A fan 22 is fixedly connected to the inner wall of the air inlet duct 6. By setting the fan 22, the air circulation speed is increased and the heat dissipation effect is improved.

[0033] The bottom of the housing 2 has a through-hole for exposing the pins 23 of the relay body 1.

[0034] Working principle: During the use of the heat dissipation mechanism for this solid-state relay, the fan 22 is started, allowing outside air to pass through the filter screen 7 and enter the housing 2 through the air inlet pipe 6 and air inlet, and then be discharged from the air outlet, increasing the air circulation speed inside the housing 2 and dissipating heat from the relay body 1. The motor 14 is started, and the output end of the motor 14 drives the rotating shaft 15 to rotate. The rotating shaft 15 drives the rotating arm 9 to rotate, and the rotating arm 9 drives the bristles 10 to clean the filter screen 7. As the rotating arm 9 rotates, when the bristles 10 rotate to below the air inlet pipe 6, the movable column 17 contacts the fixed column 16. The fixed column 16 presses against the movable column 17, causing the movable column 17 to move closer to the filter screen 7, thereby compressing the spring 18 and driving the slide rod 12 to move. The slide rod 12 drives the movable plate 11 to move away from the rotating arm 9, cleaning the bristles 10. Thus, the heat dissipation mechanism for the solid-state relay has the effect of cleaning the bristles 10, preventing dust adhering inside the bristles 10 from affecting the subsequent cleaning effect of the filter screen 7.

[0035] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application.

Claims

1. A heat dissipation mechanism for a solid state relay, comprising a housing (2) for mounting a relay body (1), a top cover (3) is fixedly connected to the inner wall of the housing (2), characterized in that: The outer casing (2) has an air inlet (4) and an air outlet (5) on its two sides respectively. An air inlet pipe (6) is fixedly connected to one side of the outer casing (2) at a position corresponding to the air inlet (4). A filter screen (7) is fixedly connected to the inner wall of the air inlet pipe (6). A support shaft (8) is fixedly connected to one side of the outer casing (2). A rotating arm (9) is rotatably connected to one end of the support shaft (8). Brush bristles (10) are fixedly connected to the side of the rotating arm (9) near the filter screen (7). The rotating arm (9) has a movable plate (11) on the side near the filter screen (7). The movable plate (11) has a through hole on its side that matches the bristles (10). The rotating arm (9) has a sliding hole on its side, and a sliding rod (12) is slidably connected to the inner wall of the sliding hole. One end of the sliding rod (12) is fixedly connected to the movable plate (11). The sliding rod (12) can drive the movable plate (11) to move towards the side near the filter screen (7) to clean the bristles (10).

2. The heat dissipation mechanism for a solid state relay according to claim 1, characterized by: A support arm (13) is fixedly connected to one side of the outer shell (2), and a motor (14) is fixedly connected to one side of the support arm (13). The output end of the motor (14) passes through the support arm (13) and is fixedly connected to a rotating shaft (15). One end of the rotating shaft (15) is fixedly connected to the rotating arm (9).

3. The heat dissipating mechanism for a solid state relay according to claim 2, wherein: The support arm (13) is fixedly connected to a fixed column (16) on the side near the outer shell (2), and the slide rod (12) is fixedly connected to a movable column (17) at the end away from the moving plate (11). Both the fixed column (16) and the movable column (17) are semi-cylindrical. After the fixed column (16) contacts the movable column (17), it pushes the movable column (17) to move.

4. The heat dissipation mechanism for a solid-state relay according to claim 3, characterized in that: A spring (18) is fitted on the surface of the slide rod (12). One end of the spring (18) is fixedly connected to the rotating arm (9), and the other end of the spring (18) is fixedly connected to the movable column (17).

5. The heat dissipating mechanism for a solid state relay according to claim 1, wherein: A dust removal ring (19) is fixedly connected to one side of the outer shell (2). The dust removal ring (19) is sleeved on the outside of the air inlet pipe (6). The bottom of the dust removal ring (19) has a downward inclined guide wall (20). A dust removal port (21) is opened at the bottom of the guide wall (20).

6. The heat dissipating mechanism for a solid state relay according to claim 1, wherein: A fan (22) is fixedly connected to the inner wall of the air inlet pipe (6).

7. The heat dissipating mechanism for a solid state relay according to claim 1, wherein: The bottom of the housing (2) has a through-hole for exposing the pins (23) of the relay body (1).

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