A burn-in board including strip sockets with integrated heating for high volume burn-in of semiconductor devices

Abstract

An aging board for use in aging testing semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including a series of semiconductor devices and a socket cover including at least one heating block. The socket cover is movable between (a) an open position allowing installation of the device strip on the socket base and (b) a closed position in which the socket cover, including the heating block, is closed down on the installed device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during an aging test process. The aging board can also include heating control circuitry to control the heating block during the aging test process.

Description

[0001] Related patent applications

[0002] This application claims priority to jointly owned U.S. Provisional Patent Application No. 62 / 977,779, filed February 18, 2020, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This disclosure relates to the burn-in of semiconductor devices, and more specifically, to burn-in boards including strip sockets having integrated heating for high-volume burn-in of semiconductor devices. Background Technology

[0004] In the semiconductor manufacturing and testing field, "aging" is a common process used to detect faults in a group of semiconductor devices. The aging process typically involves electrically testing devices under elevated or extreme voltages and temperatures. Aging is usually performed on devices or device components during production to detect early failures caused by defects in the manufacturing process.

[0005] In a typical aging system, individual semiconductor devices are loaded into “sockets” mounted on an aging board and then subjected to specified aging test conditions. Figure 1 An exemplary conventional aging board 100 is shown, which includes a series of discrete sockets 102 mounted on a printed circuit board (PCB) 104. Individual (unitized) semiconductor devices, referred to as devices under test or “DUTs”, can be manually loaded into each socket 102 on the board 100, and the board 100 can be inserted into the hot chamber (oven) of an aging tester, where the semiconductor devices are subjected to elevated or extreme voltages and temperatures, and over time undergo various electrical tests to identify defective devices. Figure 2 An exemplary aging test machine 200 is shown, which includes two hot chambers 202, each hot chamber including a plurality of slots 204 configured to receive a corresponding aging plate, for example Figure 1 The aging board 100 shown.

[0006] Conventional aging systems and techniques for testing individual devices are expensive and time-consuming. For example, hundreds or thousands of individual devices need to be manually loaded into discrete sockets, and often require significant resources for aging large volumes of devices (i.e., testing a large number of devices).

[0007] There is a need for a high-volume device aging solution that reduces the resources (time and / or cost) required for aging tests. Summary of the Invention

[0008] The embodiments described herein provide a aging board for aging tests of semiconductor devices, the aging board including a strip receptacle mounted to a printed circuit board (PCB). The strip receptacle includes a receptacle base and a receptacle cover. The receptacle base is configured to receive a device strip comprising a series of semiconductor devices. The receptacle cover is movably connected to the receptacle base and includes at least one heating block. The receptacle cover is movable between (a) an open position and (b) a closed position, the open position allowing the device strip to be mounted on the receptacle base, and the closed position, in which the receptacle cover including the heating block is closed downwards on the mounted device strip. The strip receptacle includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during the aging test process. The aging board may also include heating control circuitry to control the heating block during the aging test process.

[0009] In one aspect, a burn-in board for device aging testing includes a PCB and a strip socket mounted to the PCB. The strip socket may include: a socket base configured to receive a strip of devices including a series of devices mounted on a substrate of the strip; a socket cover; and at least one heating block associated with the socket cover, wherein the socket cover is movable between (a) an open position and (b) a closed position, the open position allowing the strip of devices to be mounted on the socket base, and the closed position, the mounted strip of devices being arranged between the socket cover and the socket base. The socket base may also include a series of conductive contacts, each conductive contact configured to contact a corresponding device among the series of devices on the mounted strip of devices. The burn-in board may include heating control circuitry and burn-in test circuitry, the heating control circuitry being configured to control at least one heating block to provide heating to the strip of devices, and the burn-in test circuitry being connected to the conductive contacts for supplying input test signals to the respective devices on the strip of devices and receiving output test signals from the respective devices.

[0010] In one embodiment, the at least one heating block is integrated into or mounted to the socket cover.

[0011] In one embodiment, in the closed position of the receptacle cover, the mounted device strip is physically compressed between the receptacle cover and the receptacle base to allow conductive contacts to contact the individual devices on the device strip. In one embodiment, the receptacle base includes a contactor plate and conductive contacts configured to support the device strip, the conductive contacts being configured to protrude through holes in the contactor plate.

[0012] In one embodiment, the strip socket is configured to receive a device strip comprising multiple device panels, each device panel including multiple devices. The strip socket includes multiple segments, each segment corresponding to a corresponding device panel on the device strip, and the strip socket includes multiple heating blocks, each heating block being arranged for heating a corresponding device panel on the device strip. In one embodiment, the multiple heating blocks are independently controllable to provide independent temperature control of the multiple device panels on the device strip.

[0013] In one embodiment, the burn-in board includes: a multiplexer connected to a plurality of conductive contacts in a series of conductive contacts configured to contact corresponding plurality of devices in a series of devices; and a multiplexer control circuit configured to control the multiplexer to selectively receive signals from each of the plurality of devices via corresponding conductive contacts of the plurality of conductive contacts.

[0014] In one embodiment, the aging board includes: (a) a performance signal multiplexer connected to a first subset of conductive contacts in a series of conductive contacts; (b) a power signal multiplexer connected to a second subset of conductive contacts in a series of conductive contacts; and (c) a multi-signal multiplexer control circuit configured to control the performance signal multiplexer and the power signal multiplexer to selectively monitor device performance signals and power signals from individual devices in a series of devices.

[0015] On the other hand, a strip socket is provided for aging tests on a series of devices disposed on a device strip. The strip socket may include: a socket base configured to receive a device strip including a series of devices mounted on a device strip substrate; a socket cover; and a series of conductive contacts, each conductive contact configured to contact a corresponding device in the series. The socket cover is movable between (a) an open position and (b) a closed position, the open position allowing the device strip to be mounted on the socket base, and the closed position, in which the mounted device strip is arranged between the socket cover and the socket base.

[0016] In one embodiment, the at least one heating block is integrated into or mounted to the socket cover.

[0017] In one embodiment, in the closed position of the receptacle cover, the mounted device strip is physically compressed between the receptacle cover and the receptacle base to allow conductive contacts to contact the individual devices on the device strip. In one embodiment, the receptacle base includes a contactor plate and conductive contacts configured to support the device strip, the conductive contacts being configured to protrude through holes in the contactor plate.

[0018] In one embodiment, the strip socket is configured to receive a device strip including multiple device panels, each device panel including multiple devices, the strip socket including multiple segments, each segment corresponding to a corresponding device panel on the device strip, and the strip socket including multiple heating blocks, each heating block being arranged for heating a corresponding device panel on the device strip.

[0019] In one implementation, multiple heating blocks are independently controllable to provide independent temperature control of multiple device panels on the device strip.

[0020] On the other hand, a system for aging tests on devices is provided. The system includes an aging tester and an aging board. The aging board includes a printed circuit board (PCB) and a strip socket mounted to the PCB, as well as heating control circuitry. The strip socket includes: a socket base configured to receive a strip of devices including a series of devices mounted on a substrate of the strip; a socket cover; at least one heating block associated with the socket cover, wherein the socket cover is movable between (a) an open position and (b) a closed position, the open position allowing the strip of devices to be mounted on the socket base, and the closed position, the mounted strip of devices being arranged between the socket cover and the socket base; a series of conductive contacts, each conductive contact configured to contact a corresponding device in the series of devices; and a connection interface connected to the series of conductive contacts. The heating control circuitry is configured to control the at least one heating block to provide heat to the strip of devices. The aging tester is configured to supply input test signals to the respective devices on the strip of devices via the connection interface and conductive contacts of the strip socket, and to receive output test signals from the respective devices via the conductive contacts and connection interface of the strip socket.

[0021] In one embodiment, the aging test machine includes a test bench. In another embodiment, the aging test machine includes an aging oven.

[0022] In one embodiment, the at least one heating block is integrated into or mounted to the socket cover.

[0023] In one embodiment, in the closed position of the receptacle cover, the installed device strip is physically compressed between the receptacle cover and the receptacle base to allow the conductive contacts to contact the individual devices on the device strip.

[0024] In one embodiment, the device strip includes a plurality of device panels, each device panel including a plurality of devices, the strip socket including a plurality of segments, each segment corresponding to a corresponding device panel on the device strip, and at least one heating block including a plurality of heating blocks, each heating block being arranged for heating a corresponding device panel on the device strip.

[0025] In one implementation, the multiple heating blocks are independently controllable to provide independent temperature control for each of the multiple device panels on the device strip.

[0026] In one embodiment, the aging test electronics include an electrical fault detection circuit and a device performance monitoring circuit, the electrical fault detection circuit being configured to detect electrical faults associated with each individual device, and the device performance monitoring circuit being configured to measure the operational performance of each individual device. Attached Figure Description

[0027] Example aspects of this disclosure are described below with reference to the accompanying drawings, in which:

[0028] Figure 1 An exemplary prior art aging board is shown, which includes a series of discrete sockets mounted on a PCB;

[0029] Figure 2 An exemplary prior art aging test machine is shown, which includes a hot chamber configured to receive an aging plate for performing high-temperature aging tests on devices mounted in sockets on the aging plate.

[0030] Figures 3A to 3C Three exemplary device strips are shown, which can be tested using the strip socket provided according to this embodiment;

[0031] Figure 4A and Figure 4B The top and bottom sides of an exemplary aging board according to one embodiment are shown respectively;

[0032] Figures 5A to 5C An exemplary process for mounting a device strip in an exemplary flip-type strip socket is shown;

[0033] Figure 6A and Figure 6B This shows the process of mounting the device strip on the contactor plate before ( Figure 6A ) and after mounting the component strip on the contactor plate ( Figure 6B A top view of the strip socket in the open position;

[0034] Figure 7A and Figure 7B A side sectional view of a strip socket according to an exemplary embodiment is shown, which shows the socket cover closed onto a device strip mounted on a contactor plate;

[0035] Figure 8A and Figure 8B This is an exploded assembly diagram of an exemplary strip socket according to an exemplary embodiment;

[0036] Figure 9A and Figure 9B A portion of an exemplary strip socket according to an exemplary embodiment is shown, which includes a selected heating block pressed down onto a corresponding device panel of the mounted device strip;

[0037] Figure 10A and Figure 10B An exemplary system for aging tests on a strip of devices mounted in a strip socket including a heating block is shown according to one embodiment, wherein the strip socket is inserted into an aging oven and tested using the test electronics of the aging oven, but the oven is not heated;

[0038] Figure 11 An exemplary test bench according to one embodiment is shown for performing an aging test on a strip of devices arranged in a strip socket including a heating block;

[0039] Figure 12 An exemplary power system according to an exemplary embodiment is shown for mounting an exemplary device strip in a strip socket on an exemplary aging board;

[0040] Figure 13 An exemplary stimulation and monitoring system according to an exemplary embodiment is shown, which is used to provide electrical stimulation and monitoring for various devices under test (DUTs); and

[0041] Figure 14 A temperature control system according to an exemplary embodiment is shown for controlling a heating element disposed in a strip socket.

[0042] It should be understood that reference numerals for any illustrated element appearing in multiple different figures have the same meaning in all figures, and any illustrated element mentioned or discussed herein in the context of any particular figure also applies to every other figure (if any) in which the same illustrated element is shown. Detailed Implementation

[0043] The embodiments described herein provide systems and methods for high-volume aging of a single aging board. In some embodiments, the aging board includes a strip receptacle, which may be a flip-top type strip receptacle receiving a strip of devices between a receptacle base and a receptacle cover, wherein the receptacle cover may be retractable, allowing the entire series of semiconductor devices on the device strip (e.g., 1,170 semiconductor devices) to be loaded simultaneously. This significantly reduces test setup time compared to conventional systems that require loading individual (unitized) semiconductor devices into discrete receptacles. The strip receptacle provides electrical connectivity to each semiconductor device on the device strip (e.g., to each pin on each device), allowing each individual semiconductor device to be tested and analyzed independently, for example, to identify individual faulty or failed devices. For example, the aging board may provide power control and output signal monitoring for each individual semiconductor device on the device strip.

[0044] In some implementations, the strip socket includes an integrated, controllable heating block, allowing the aging process to be performed (e.g., on a test bench) without inserting the socket into a hot chamber or oven. This allows for the addition of various types of electronic devices to the aging plate that would normally not function properly or effectively at the elevated temperatures experienced in an aging oven. Such electronic devices include, for example, multiplexers and current limiters.

[0045] In some embodiments, the heating block may be mounted to or integrated into a retractable socket cover that closes and clamps downward onto the device strip (i.e., the socket base) after the device strip is inserted into the strip socket. In one embodiment, the strip socket includes multiple sections (strip socket sections), for example, to receive a device strip having a series of devices (i.e., sub-arrays) arranged in multiple panels. Each strip socket section may have a corresponding independently controllable heating block to provide independent temperature control of the device panels arranged in the respective strip socket section. In some embodiments, multiple independently controllable heating blocks may be disposed in a common socket cover spanning multiple strip socket sections, or disposed in separate socket covers, each for a corresponding individual strip socket section.

[0046] Because the strip socket includes a heating block for heating the strip of devices mounted in the strip socket, for example for performing aging tests on the devices on the strip, it may be referred to herein as a "heated strip socket".

[0047] The embodiments described herein provide heated strip sockets configured for testing various types and configurations of device strips, including any number and type of semiconductor devices arranged on a device strip substrate in any suitable physical arrangement.

[0048] Figures 3A to 3CThree exemplary device strips 300a-300c are shown, which can be tested using heated strip sockets provided according to various embodiments. As discussed above, each device strip 300a-300c includes a series of semiconductor devices (“devices”) 302 arranged on a respective device strip substrate 304, such as on a printed circuit board (PCB) or leadframe. During aging test procedures, each device 302 may be referred to as a “device under test” or “DUT”.

[0049] For each device strip 300a-300c, a series of devices 302 may be arranged in multiple device groups or "device panels," wherein each device panel includes a subset of devices 302, arranged in one or more rows and one or more columns or any other physical arrangement of the devices. For example, exemplary device strip 300a includes 1,170 devices 302 arranged in five device panels 306a-306e, each device panel including 234 devices 302, arranged in 13 rows extending in the x-direction and 18 columns extending in the y-direction, each of the 18 columns defining a "cluster" of 13 devices 302. As another example, exemplary device strip 300b includes seven device panels 306a-306g, each device panel including eight devices 302, arranged in two rows extending in the x-direction and four columns extending in the y-direction. For example, the exemplary device strip 300c includes 14 device panels 306a-306n, each device panel including 10 devices 302, the devices being arranged in two rows extending in the x-direction and five columns extending in the y-direction.

[0050] Figure 4A and Figure 4B An exemplary aging plate 400 according to one embodiment of the present invention is shown. Specifically, Figure 4A The first side 404a (e.g., the top side) of the aging board 400 is shown, and Figure 4B A second side 404b (e.g., the bottom side) of a burn-in board 400 is shown. The exemplary burn-in board 400 includes a flip-type heated strip socket 402 (shown as a flip-type and shown in a closed position) and associated circuitry that mounts the flip-type heated strip socket to a PCB 404 for heating and testing device strips mounted in the strip socket 402.

[0051] like Figure 4AAs shown, the body 410 of the heated strip socket 402 is mounted on a first side 404a of a PCB 404. The body 410 includes a socket base 412, a socket cover 414, and a handle 416. The socket base is mounted to the first side 404a of the PCB 404, and the socket cover and handle are each pivotally connected to the socket base 412. The socket cover 414 and the socket handle 416 are configured to be manually moved between (a) an open position and (b) a closed position. The open position allows the device strip to be mounted in the strip socket 402, specifically on a contactor plate disposed in the socket base 412 (e.g., as discussed below). Figure 5A , Figure 6A and Figures 8A to 8B As shown), in the closed position, the device strip is mounted in the strip socket 402, specifically mounted on the contactor plate disposed in the socket base 412 (e.g., as discussed below). Figures 5B to 5C and Figure 7B (As shown).

[0052] In the illustrated example, the heated strip socket 402 is configured to receive... Figure 3A The exemplary device strip 300a shown is used for heating and testing the device 302 on the device strip 300a. Figure 4A The device strip 300a (indicated by dashed lines) is shown on a contactor plate (not shown) mounted below a socket cover 414, which is shown in the closed position.

[0053] At least one heating block may be formed in or mounted to the receptacle cover 414 for heating the device 302 on the device strip 300a. Therefore, the heated strip receptacle 402 may be referred to as a heated strip receptacle 402. In this embodiment, the heated strip receptacle 402 includes five strip receptacle sections 402a-402e, each strip receptacle section configured for selectively heating and testing a corresponding device panel 306a-306e on the device strip 300a. For example, each strip receptacle section 402a-402e may include a corresponding heating block 420a-420e configured to heat the corresponding device panel 306a-306e. The heating blocks 420a-420e may be formed in or mounted to the underside of the receptacle cover 414 (therefore, the heating blocks 420a-420e are located in the underside of the receptacle cover 414). Figure 4A (represented by dashed lines), as discussed below. Figure 5A and Figure 5B As shown more clearly in the diagram. Each heating block 420a-420e may have an associated radiator 426a-426e mounted on the top side of the socket cover 414, wherein each radiator 426a-426e is thermally connected to a corresponding heating block in the heating blocks 420a-420e.

[0054] like Figure 4BAs shown, the heated strip socket 402 may include a socket base 430 and an insulating strip 432 mounted on a second side 404b of a PCB 404. The socket base 430 and insulating strip 432 provide structural integrity for the aging board 400 and distribute physical stress throughout the PCB 404. In this embodiment, the socket base 430 includes a metal plate that acts as a physical reinforcement, thereby providing structural integrity for the aging board 400. The metal plate of the socket base 430 may electrically isolate conductive elements on the PCB 404, such as electrical insulating sheets or spacers (e.g., discussed below), from the space occupied by the metal plate. Figures 8A to 8B The insulating sheet 431 shown prevents electrical short circuits. The insulating strip 432 may comprise a plastic or other non-conductive strip extending substantially across the width of the PCB 404 (e.g., at least 50%, at least 75%, or at least 90% of the width of the PCB 404) to distribute physical forces on the PCB 404. In other embodiments, the heated strip socket 402 may include any other physical structure to provide structural integrity for the aging board 400.

[0055] The aging board 400 may include various circuits formed on or mounted to the PCB 404, including (a) a heating control circuit 460. Figure 4A (a) and (b) aging test circuit 470 Figure 4B The heating control circuit is used to operate heating blocks 420a-420e, and the aging test circuit is used to test device 302 on device strip 300a, for example, to selectively send test signals to device 302 and receive output signals from device 302.

[0056] like Figure 4A As shown, the heating control circuit 460 may include heating block couplers 462a-462e and thermal controllers 464a-464e mounted to the first side 404A of the PCB 404. Each thermal controller 464a-464e may be connected to a corresponding heating block coupler 462a-462e, which is connected to each heating element (e.g., a coil) in the corresponding heating blocks 420a-420e, to provide independent control of each individual heating block 420a-420e, or independent control of each heating element within each heating block 420a-420e.

[0057] The aging test circuit 470 may include any suitable circuitry for testing or facilitating testing of devices 302 on device strip 300a. For example, the aging test circuit 470 may include circuitry configured to send a test input signal (e.g., a selected voltage to a selected device pin) to a selected device 302, receive an output signal (e.g., a selected voltage on a selected device pin) from the selected device 302, and analyze the operation of each individual device 302. In an illustrated embodiment, the aging test circuit 470 includes a multiplexer system 472 and a current limiter 474, as well as other suitable circuitry mounted on a second side 404b of PCB 404.

[0058] As noted above, the exemplary device strip 300a includes five device panels 306a-306e, each device panel 306a-306e including 18 device clusters, each device cluster including 13 devices 302. In the illustrated embodiment, the multiplexer system 472 on the burn-in board 400 includes at least one multiplexer for each device cluster in each device panel 306a-306e, for selectively addressing and monitoring each device in each device 302 of the respective 13 device clusters. For example, as described below... Figure 12 In more detail, the multiplexer system 472 may include (a) a monitoring signal multiplexer, (b) a power signal multiplexer, and / or (c) an additional multi-signal type multiplexer configured to selectively address and monitor the performance of individual devices 302 in the device cluster, the power signal multiplexer configured to selectively address and monitor power signals through current limiters connected to each corresponding device 302 in the device cluster to detect electrical faults (e.g., short circuits) associated with each individual device 302, and the additional multi-signal type multiplexer configured to select the signals output by the monitoring signal multiplexer and the power signal multiplexer.

[0059] The exemplary aging board 400 also includes a corresponding current limiter 474 connected to each of the 1,170 devices 302 on the device strip 300a, wherein each current limiter 474 is configured to electrically isolate the respective individual device 302 from other aging test circuits 470, for example to prevent electrical short circuits at the individual devices 302, as described below. Figure 12 For more detailed discussion. In some embodiments, each current limiter 474 may be a smart solid-state switch configured to shut off (form an open circuit) in response to a current exceeding a predetermined threshold (e.g., due to a mechanical or electrical short circuit in the corresponding device 302), thereby protecting the drivers (including power supplies) connected to the device 302. Each current limiter 474 may be configured to output a digital signal (e.g., discussed below). Figure 12The signal 1204 shown indicates an overcurrent fault (e.g., caused by a short circuit) associated with the corresponding device 302. In one embodiment, each current limiter 474 includes a MIC2090 chip (50mA current-limiting power distribution switch) supplied by Microchip Technology Inc., headquartered in Chandler, Arizona.

[0060] The aging board 400 may also include interface circuitry 440 for providing an electrical interface between the PCB circuitry (e.g., heating control circuitry 460 and aging test circuitry 470) and at least one snap-fit ​​connector 442 or other external connection device. This interface can be connected to an external control system (e.g., an interface board and a tester driver disposed in an aging tester, such as an aging test bench including aging test electronics, as embodied in "Tester Driver") for performing aging tests on the respective devices 302 on the device strip 300a. An exemplary arrangement between the aging board 400 and the tester driver disposed in the aging tester is discussed below with reference to FIG10.

[0061] As discussed below, the socket base 412 may include conductive device contacts, such as spring-supported contact pins, to provide an electrical connection between each individual device 302 on the device strip 300a and the circuitry on the aging board 400 (e.g., aging test circuitry 470). The aging test circuitry 470 may therefore include circuitry that connects each conductive device contact (configured to contact a single device 302) to a corresponding current limiter in the current limiter 474 and at least one corresponding multiplexer in the multiplexer system 472.

[0062] Figures 5A to 5C It shows the use of in Figures 4A to 4B The exemplary process of mounting the device strip 300a in the exemplary flip-type heated strip socket 402 is shown. Specifically, Figure 5A A heated strip socket 402 is shown in the open position before the device strip 300a is installed therein; Figure 5B The device strip 300a is shown installed in the strip socket 402, with the heated strip socket 402 still in the open position; and Figure 5C A heated strip socket 402 is shown in a closed position according to an exemplary embodiment, wherein a device strip 300a is mounted therein, for example, after being closed using a socket handle 416.

[0063] like Figures 5A to 5CAs shown, the socket base 412 may include a socket base body 413 and a device strip support 478. The device strip support 478 may include a contactor plate 480 supported on a contactor plate base 479. The contactor plate 480 may be configured to receive a device strip 300a mounted thereon. The socket base body 413 and the device strip support 478 may have different structures, for example, such as Figures 8A to 8B As shown, or it may be a single integrated component. The receptacle cover 414 and the receptacle handle 416 are each pivotally connected to the receptacle base body 413. The receptacle base 412 may also include a cover clip 418 configured to receive and secure a locking tab 415 formed on the distal end of the receptacle cover 414 when the receptacle cover 414 and the receptacle handle 416 are pivoted to the closed position. The cover clip 418 may be mechanically connected to the receptacle handle 416 such that they rotate and move downward as the receptacle handle 461 pivots downward, as discussed below.

[0064] The contactor plate 480 may include five contactor plate segments 480a-480e, each contactor plate segment being configured to align with a corresponding device panel 306a-306e of the device strip 300a mounted on the contactor plate 480. As discussed above, five heating blocks 420a-420e may be formed in or mounted on the underside of the socket cover 414, each heating block corresponding to a corresponding device panel 306a-306e on the device strip 300a when mounted on the contactor plate 480.

[0065] refer to Figure 5B The component strip 300a can be mounted on the component strip support 478, specifically on the contactor plate 480, for example, by manually placing the component strip 300a onto the contactor plate 480. After mounting the component strip 300a onto the contactor plate 480, the socket cover 414 can be manually pivoted downwards onto the component strip 300a, as indicated by arrow L. 枢转_向下 As shown, this aligns the locking tab 415 with the corresponding cover clip 418. The socket handle 416 can then be manually pivoted downwards, as indicated by arrow H. 枢转_向下 As shown, this causes the cover clip 418 to rotate and translate downward to lock the locking tab 415 (and therefore the socket cover 414) into the closed position, as discussed below. Figures 7A to 7B The location of the closed socket is shown in more detail below. Figure 5CAs shown, the receptacle cover 414 is locked in the closed position by locking tab 415 and receptacle handle 416. Downward translation of the cover clip 418 (caused by downward pivoting of the receptacle handle 416) forces the locking tab 415 and thus the receptacle cover 414 down, which presses the heating blocks 420a-420e downward against the mounted device strip 300a to provide or improve physical (and therefore electrical) contact between the device 302 on the device strip 300a and the underlying conductive device contacts, for example, as referenced below. Figures 7A to 7B The spring-supported contact pins under discussion.

[0066] Figure 6A and Figure 6B This illustrates the process before mounting device strip 300a on device strip support 478 (specifically on contactor plate 480 including contactor plate sections 480a-480e). Figure 6A ), and after mounting the device strip 300a onto the contactor plate 480 ( Figure 6B A top view of the heated strip socket 402 in the open position. Figure 6A As shown, the device strip support 478 includes a contactor plate 480 supported on a contactor plate base 479. The contactor plate 480 includes alignment elements 484 (e.g., upwardly extending bumps or protrusions) and a series of device contact holes 482 corresponding to a series of devices 302 on the device strip 300a.

[0067] like Figure 6B As shown, the device strip 300a may include a hole or slot 486 configured to receive an alignment element 484 on the contactor plate 480 to physically align the device strip 300a with respect to the contact hole 482 in the contactor plate 480 and thus with respect to the conductive device contacts below (e.g., spring-supported contact pins). Therefore, when manually mounting the device strip 300a onto the contactor plate 480, the user can align the hole or slot 486 in the device strip 300a with the alignment element 484 on the contactor plate 480 to ensure proper alignment of the device strip 300a on the contactor plate 480.

[0068] Figure 7A and Figure 7B A side sectional view of a heated strip socket 402 mounted on a PCB 404 according to an exemplary embodiment is shown, illustrating that the socket cover 414 closes onto a device strip 300a mounted on a contactor plate 480 of a socket base 412. The sectional view is taken at the center point along the width of the strip socket 402, and thus cuts through the heating block 420c on the underside of the socket cover 414.

[0069] Figure 7AThe socket cover 414 is shown, in which the heating block 420c pivots downward onto the device panel 306c mounted on the contactor plate section 480c of the device strip support 478, as shown by arrow L. 枢转_向下 As shown, this aligns the locking tab 415 on the socket cover 414 with the corresponding cover clip 418 provided in the socket base 412. The contactor plate section 480c may be supported by a spring-supported or resilient member 702 mounted on the PCB 404 and is configured to translate downward in response to a downward force from above, as discussed below. Figure 7B As shown.

[0070] The device strip support 478 also includes a series of conductive device contacts 700, such as spring-supported contact pins, which are arranged below the contactor board section 480c and mounted or engaged to corresponding metal contacts 701 formed on the PCB 404. The metal contacts 701 are connected to corresponding circuitry on the burn-in board 400, including burn-in test circuitry 470, for sending and receiving test signals to and from each individual device 302 (or each pin on each device 302) on the device strip 300a via the corresponding conductive device contacts 700 (spring-supported contact pins).

[0071] like Figure 7B As shown, the user can lower the handle 416 and press it down to the closed position, as indicated by arrow H. 枢转_向下 As shown. The socket handle 416 is mechanically connected to the cover clip 418, causing the socket handle 416 to move downward (H) 枢转_向下 This causes the cover clip 418 to rotate (as indicated by arrow C). 旋转 As shown) it shifts downwards (as indicated by arrow C). 下降 As shown), this (a) locks the locking tab 415 into the cover clip 418, and (b) pushes the socket cover 414 downward. Figure 7B As indicated by the arrow marked "Comp" (compression), the downward movement of the socket cover 414 forces the heating block 420c to descend against the device panel 306c. This pushes the device panel 306c and the contactor plate section 480c downward, thereby compressing the spring-supported or resilient member 702 supporting the contactor plate section 480c. As the device strip 300a and the contactor plate section 480c move downward, the conductive device contacts 700 (spring-supported contact pins) protrude upward through the corresponding contact holes 482 in the contactor plate section 480c and contact the devices 302 on the device strip 300a (e.g., contacting one or more selected pins of each device 302), thereby providing an electrical connection between the individual devices 302 (or individual device pins) and various aging test circuits 470 (e.g., current limiter 474, multiplexer system 472, and / or other circuits).

[0072] Figure 8Aand Figure 8B This is an exploded assembly diagram of a strip socket 402 according to an exemplary embodiment. Figure 8A A side view of the component is shown, while Figure 8B A three-dimensional view is shown. (Example) Figure 8A and Figure 8B As shown, the strip socket assembly may include a socket base 412, an insulating sheet 431, and a reinforcement 430. The socket base includes a socket base body 413 and a device strip support 478 mounted on the top side 404a of the PCB 404. The insulating sheet and reinforcement are mounted on the bottom side 404b of the PCB 404. As shown, the device strip support 478 includes conductive device contacts 700 (spring-supported contact pins) arranged below the contactor plate 480 and configured to be mounted to corresponding metal contacts 701 formed on the PCB 404.

[0073] Figure 9A and Figure 9B A portion of an assembled heated strip socket 402 in the closed position according to an exemplary embodiment is shown, specifically a portion including a selected heating block 420a pressed down onto a corresponding device panel 306a of a device strip 300a arranged on a corresponding contactor plate section 480a of a device strip support 478. Figure 9A A three-dimensional view from above is shown, and Figure 9B It shows crossing Figure 9A The side profile of line 9B-9B is shown. Figure 9A As shown, a heating block 420a can be mounted to the underside of a socket cover 414, and a heat sink 426a can be mounted on the heating block 420a and protrude above the upper side of the socket cover 414. The heat sink 426a is configured to remove heat from the heating block 420a and may include a series of fins 900.

[0074] like Figure 9B As shown in the cross-sectional view, a pair of resistance heating elements 904a and 904b extend within the main body of the heating block 420a. In this exemplary embodiment, each heating element 904a and 904b is a resistance heating coil arranged in a loop (e.g., a circular or elliptical loop) within the heating block 420a, wherein heating element 904a is concentrically positioned within heating element 904b. However, it should be understood that the heating block 420a may include any number and type of heating elements arranged in any suitable manner, for example, thereby providing a defined heat distribution for the underlying device panel 306a, such as providing uniform heating for device 302 on device panel 306a, or providing a defined non-uniform heat distribution, such as targeted heating of a defined area on device panel 306a or defining device 302. Heating elements 904a and 904b may be connected to a suitable heating control circuit 460 (see [link to relevant documentation]). Figure 4A The heating control circuit is configured to allow current to flow through heating elements 904 and 904b to generate heat within the heating block 420a.

[0075] like Figure 9B As shown, at least one temperature sensor 906 may be integrated into, fixed to, or located near the heating block 420a. For example, the heating block 420a may include one or more integrated resistance temperature detector (RTD) elements 906 connected to a suitable heating control circuit 460 (see [link to relevant documentation]). Figure 4A The suitable heating control circuit is configured to allow current to flow through the RTD element 906 and measure the resistance of the RTD element 906, thereby measuring the temperature at the interface between the heating block 420a and the underlying device panel 306a. Thermal controllers 464a-464e (see above discussion) are connected to the corresponding heating block couplers 462a-462. Figure 4A For example, based on a defined target temperature value, the current applied to the heating elements 904a and 904b in the heating block 420a can be dynamically adjusted or otherwise controlled using temperature measurements from the temperature sensor 906.

[0076] As discussed above, aging tests on device strips can be performed by providing an aging board with a strip socket including heating blocks for heating devices on the strip (e.g., an aging board 400 with a heated strip socket 402 having integrated heating blocks 420a-420e as discussed herein), without the need for external heating of the device strips, such as using an aging oven. Therefore, the aging board disclosed herein can be used for aging tests on devices on a test bench (without an oven), or for electrical testing using an aging oven without heating the oven. Various types of electronic devices that would not function properly or effectively at elevated temperatures (e.g., as typically experienced in a thermal aging chamber or oven) can be mounted on the aging board by avoiding the need to expose the aging board to high temperatures (e.g., in a conventional aging oven). Such electronic devices include, for example, multiplexers and current limiters, such as the various multiplexers and current limiters disposed on the exemplary aging board 400 disclosed herein.

[0077] Figure 10A and Figure 10B An exemplary aging oven system 1000 according to one embodiment is shown for aging tests on a strip of devices mounted in a strip socket having an integrated heating block as disclosed herein, without heating the hot chamber of the aging oven system 1000 while testing electronic devices using the aging oven system. Figure 10AAs shown, the aging oven system 1000 may be an aging oven machine 1002 (e.g., an Art aging oven provided by ELES SpA in Todi, Italy), which includes test electronics 1020 and at least one hot chamber (oven) 1004 and at least one aging plate 1008, each hot chamber including a plurality of aging plate slots 1006 (e.g., 18 slots), each aging plate being received in a corresponding aging plate slot 1006. For example, Figure 10A Two aging plates 1008 are shown inserted into two corresponding aging plate slots 1006.

[0078] Each burn-in board 1008 may include a device strip 1010 mounted in a heated strip socket 1010. Burn-in boards 1008 in different slots 1006 may include heated strip sockets 1010 of different types or sizes, configured to support and test device strips 1010 of different types or sizes, including different types of semiconductor devices (e.g., chips or dies). For example, one or more burn-in boards 1008 may include heated strip sockets 1010 similar to the exemplary heated strip socket 402 discussed above, for example, for testing... Figures 3A to 3C The exemplary device strips 300a-300c shown are any of the device strips and / or any other type of device strip including any one or more types of semiconductor devices. Therefore, in some specific embodiments, multiple different types of semiconductor devices or device strips can be tested simultaneously in an aging oven 1002, which are mounted in a heated strip socket 1010 located on different aging plates 1008 inserted into multiple plate slots 1006.

[0079] like Figure 10B As shown, each aging plate 1008 can be connected to a test electronics device 1020, such as a tester driver disposed in the aging oven 1002. Figure 10B The exemplary aging board 1008 shown corresponds to the aging board 400 discussed above, and therefore includes a test strip 300a, a heating control circuit 460, and an aging test circuit 470. The test strip is mounted in a heated strip socket 402, which includes heating blocks 420a-420e. The heating control circuit and the aging test circuit are connected to a snap-fit ​​connector 442 via an interface circuit 440. Figure 10BIn the exemplary system 1000 shown, the aging board 1008 is connected to the test electronics 1020 via an interface board 1030. The interface board may include physical and electrical interfaces configured to receive snap-fit ​​connectors 442 disposed on or otherwise connected to the aging board 1080, thereby providing an electrical connection between the test electronics 1020 and the aging board circuitry (e.g., the heating control circuitry 460 and aging test circuitry 470 discussed above) via suitable snap-fit ​​connectors 442 and interface circuitry 440.

[0080] To perform aging tests on the devices on device strip 300a, test electronics 1020 can (a) signal heating control circuit 460 to control heating blocks 420a-420e to heat device strip 1010 (or selected device panel or other parts thereof), for example, to a defined temperature; and (b) signal aging test circuit 470 to perform various electrical tests on the individual devices 302 on device strip 300a. Test electronics 1020 may include an electrical fault detection circuit and a device performance monitoring circuit, the electrical fault detection circuit being configured to detect electrical faults associated with each individual device 302 (e.g., based on a fault detection signal output by current limiter 474, as discussed below), and the device performance monitoring circuit being configured to measure the operational performance of each individual device (e.g., based on a performance monitoring output signal 1312 output by each device 302, as discussed below). The test electronics 1020 can be configured to generate output data indicating the operational performance and / or fault status of each device 302, which can be displayed on the display screen 1040 of the aging oven system 1000 (see [link]). Figure 10A And / or can be accessed or downloaded via another computer, for example, via a wired or wireless connection to the aging oven system 1000.

[0081] Because the device strip 300a mounted in the heated strip socket 402 is heated by integrated heating blocks 420a-420e, the test electronics 1020 can perform aging tests without heating the hot chamber 1004, which offers various advantages. For example, as noted above, such a test configuration and procedure allows for the addition of various electronic devices (e.g., various heating control circuits 460 and aging test circuits 470) to the aging board 404 that may not withstand the typical temperatures experienced in the hot chamber 1004. Furthermore, by providing multiple aging boards 1008 with heated strip sockets arranged in the aging oven 1002, multiple device strips can be simultaneously exposed to different temperatures or temperature distributions during aging tests, for example, to effectively determine device performance or failures under different temperatures or temperature distributions.

[0082] As discussed above, in addition to testing in an aging oven, or alternatively, the aging plates according to this disclosure can be tested on a test bench or other non-oven-based testing equipment. For example, Figure 11 An exemplary test bench 1100 according to one embodiment is shown for performing aging tests on a device strip 300a arranged in an exemplary heated strip socket 402 disposed on the exemplary aging board 404 discussed above. The test bench 1100 may include test electronics 1104, such as a tester driver, for performing aging tests on the individual devices on the device strip 300a. To perform aging tests on the devices on the device strip 300a, the test electronics 1104 may (a) signal a heating control circuit 460 to control heating blocks 420a-420e to heat the device strip 1010 (or selected device panels or other portions thereof), for example, to a defined temperature; and (b) signal an aging test circuit 470 to perform various electrical tests on the individual devices on the device strip 300a, for example, as discussed above.

[0083] Figures 12 to 14 An exemplary system is shown for aging tests on individual DUTs 302 on a device strip 300a using a tester driver 1010 and circuitry on an aging board 400, the circuitry including an aging test circuitry 470 and a heating control circuitry 460.

[0084] Figure 12 An exemplary power system 1200 according to an exemplary embodiment is shown, which is arranged to provide power to an exemplary device strip 300a in a heated strip socket 402 mounted on an exemplary aging board 400. Various components and functions of the power system 1200 may be embodied by any suitable electronics (e.g., aging test circuitry 470) and / or tester driver 1010 on the aging board 400. As shown, the illustrated power system 1200 includes (a) five fault detection drivers 1202a-1202e and (b) a digital signal analysis driver 1206, each fault detection driver including a power supply providing power to the DTUs in the corresponding device panels 306a-306e for detecting electrical faults (e.g., short circuits) at each individual DUT 302 in the corresponding device panels 306a-306e, and the digital signal analysis driver providing both power to the device panels 306a-306e and digital stimulus signaling for monitoring the performance of the individual DUTs 302 in the device panels 306a-306e. In one exemplary embodiment, each fault detection driver 1202a-1202e can provide a supply voltage of +5.5V. DD The current is 10A (approximately 40mA is provided by each individual DUT), and the total power is 60W.

[0085] As discussed above, each device panel 306a-306e includes 234 DUTs arranged in 18 columns or "clusters," with each column or cluster containing 13 DUTs (in this discussion, "DUT" refers to device 302 on device strip 300a). Figure 12 As shown, each cluster is associated with 13 current limiters 474, each connected to a separate device under test (DUT). For each device panel 302a-302e, each corresponding current limiter 474 detects the voltage and / or current at its corresponding DUT and outputs a fault detection signal 1204 indicating the presence (or absence) of an electrical fault, such as a short circuit, at the corresponding DUT. The fault detection signals 1204 from the 234 current limiters 474 associated with each device panel in the respective device panels 302a-302e can be multiplexed and monitored to detect electrical faults (e.g., short circuits) at individual DUTs, as discussed below.

[0086] Figure 13 An example stimulation and monitoring system 1300 according to an exemplary embodiment is shown for providing electrical stimulation and monitoring to 13 DUTs in a selected device cluster in a selected device panel 302a. Various components and functions of the stimulation and monitoring system 1300 may be embodied by any suitable electronics (e.g., aging test circuitry 470) and / or tester driver 1010 on the aging plate 400.

[0087] System 1300 includes an input test signal 1302, an output test signal 1304, and a multiplexer system 1306. The input test signal is applied to 13 DUTs in a selected device cluster, and the output test signal is generated by the input test signal 1302. The multiplexer system is used to selectively receive the output test signal 1304 from the 13 DUTs. As shown, two types of input test signals are applied to each of the 13 DUTs in the selected device cluster: (1) a performance monitoring input signal 1310 is applied to a selected pin on each DUT to trigger a defined performance monitoring output signal 1312 from each DUT, and (2) an input power signal 1320 (V) is applied to each DUT. DD This is applied to each DUT, where the current limiter 474 connected to each corresponding DUT can detect the presence of an overcurrent fault and output the above-mentioned combination. Figure 12 The fault detection signal 1204 is discussed.

[0088] The performance monitoring input signal 1310 can be applied to any number of pins of any type on each DUT. For example, the performance monitoring input signal 1310 may include a pin-specific signal applied to each of a plurality of pins on each respective DUT, each pin-specific signal being configured to generate a corresponding pin-specific output signal 1312. Each pin-specific output signal 1312 output by each DUT may be transmitted via a separate line between the DUT and the performance signal multiplexer 1330, as discussed below. For example, the performance monitoring input signal 1310 for each DUT may include a first pin-specific signal applied to a reset pin to trigger a first defined output signal 1312, and the three additional pin-specific signals applied to three additional pins on the DUT and configured to generate three additional output signals 1312, wherein the four output signals 1312 generated by the DUT are output via four lines connected to the performance signal multiplexer 1330.

[0089] The output performance monitoring output signal 1312 from each DUT and the fault detection signal 1204 from the current limiter 474 are transmitted to the multiplexer system 1306 to selectively monitor each individual DUT. The multiplexer system 1306 includes the performance signal multiplexer 1330, the power signal multiplexer 1332, and the multi-signal multiplexer 1336 discussed above. The multiplexer system 1306, including multiplexers 1330, 1332, and 1336, can be mounted on the burn-in board 400. For example, the multiplexer system 1306 can be connected to... Figure 4B This corresponds to the multiplexer system 472 shown.

[0090] As discussed above, the performance signal multiplexer 1330 receives performance monitoring output signals 1312 from each of the 13 DUTs via multiple lines connected between each DUT and the performance signal multiplexer 1330, corresponding to multiple pin-specific output signals output by each DUT. The performance signal multiplexer 1330 may be a 16-channel multiplexer configured to manage the output signals from the 13 DUTs.

[0091] The power signal multiplexer 1332 receives a fault detection signal 1204 from each of the 13 DUTs. The power signal multiplexer 1332 can be a 16-channel multiplexer configured to manage the 13 fault detection signals 1204.

[0092] The performance signal multiplexer 1330 and the power signal multiplexer 1332 can be controlled by the multiplexer control circuit 1340 to select two types of output signals for the selected DUT, namely the performance monitoring output signal 1312 and the fault detection signal 1204. The selected signal for the selected DUT, represented as signals 1312' and 1204', is passed to the multi-signal type multiplexer 1336.

[0093] The multi-signal multiplexer control circuitry 1342, connected to the multi-signal multiplexer 1336, can select between two types of output signals for the selected DUT (performance monitoring output signal 1312' and fault detection signal 1204') and pass one of the selected signals 1312' or 1204' to appropriate signal analysis circuitry, for example, to (a) identify electrical faults (e.g., short circuits) associated with the selected DUT (based on signal 1204') and (b) analyze the performance of the selected DUT (based on signal 1312'). Furthermore, the system 1300 may include circuitry configured to analyze the performance of each multiplexer 1330, 1332, and 1336 by monitoring the selected signals 1350, 1352, and 1356 passed by multiplexers 1330, 1332, and 1336, thereby providing a verification check for the selected DUT signal 1312' or 1204'.

[0094] Figure 13 A temperature control system 1300 according to an exemplary embodiment is shown for controlling heating blocks 420a-420e. Various components and functions of the temperature control system 1300 may be embodied by any suitable electronics (e.g., heating control circuitry 460) and / or tester driver 1010 on the aging board 400. The temperature control system 1300 may be configured to provide independent control over each heating block 420a-420e, and in some embodiments, to provide independent control over individual heating elements (e.g., heating coils) 904 within each heating block 420a-420e, which offers various advantages. For example, by providing independent control over the heating blocks 420a-420e and / or the heating elements 904, different temperatures can be applied to different device panels 302a-302e and / or different groups of DUTs within individual device panels 302a-302e, thereby generating a DUT performance versus temperature curve during a single aging test, which can be used to determine one or more specific temperatures at which the DUT begins to fail. For example, independent control of heating blocks 420a-420e and / or heating element 904 provides the ability to perform aging tests on only selected portions of the device strip.

[0095] like Figure 14As shown, the temperature control system 1400 may include: heating blocks 420a-420e, each heating block including a temperature sensor 906 and two heating coils 904; thermal controllers 464a-464e connected to heating block couplers 462a-462e, each heating block coupler configured to control a corresponding heating block 420a-420e; and a heating system power supply 1402. The heating system power supply 1402 may be configured to supply power to the heating coils 904 in each heating block 420a-420e. Each thermal controller 464a-464e may be configured to control the power applied to each heating coil 904 in its corresponding heating block 420a-420e via the corresponding heating block coupler 462a-462e based on temperature measurements from the corresponding temperature sensor 906 and one or more defined setpoint or threshold temperatures controlled by the corresponding thermal controller 464a-464e.

[0096] Although this disclosure describes the disclosed embodiments in detail, it should be understood that various changes, substitutions and modifications can be made to these embodiments without departing from the spirit and scope of the invention.

Claims

1. An aging board for device aging testing, the aging board comprising: a printed circuit board (PCB); a strip socket mounted to the PCB, the strip socket comprising: a socket base configured to receive a device strip, the device strip comprising a series of devices mounted on a device strip substrate; a socket cover; at least one heating block associated with the socket cover; wherein the socket cover is movable between an open position allowing mounting of the device strip on the socket base and a closed position in which a mounted device strip is disposed between the socket cover and the socket base; and a series of conductive contacts, each conductive contact configured to contact a respective device of the series of devices, a heating control circuit configured to control the at least one heating block to provide heat to the device strip; and an aging test circuit connected to the conductive contacts for delivering input test signals to individual devices of the series of devices on the device strip and delivering output test signals from the individual devices.

2. The aging board of claim 1, wherein the at least one heating block is integrated in or mounted to the socket cover.

3. The aging board of any of claims 1-2, wherein: the socket base comprises a contactor plate configured to support the device strip, the contactor plate comprising a series of device contact holes; and in the closed position of the socket cover, the conductive contacts protrude through the series of device contact holes in the contactor plate and contact individual devices on the device strip.

4. The aging board of any of claims 1-2, wherein: the device strip comprises a plurality of device panels, each device panel comprising a plurality of devices; the strip socket comprises a plurality of sections, each section corresponding to a respective device panel on the device strip; and the at least one heating block comprises a plurality of heating blocks, each heating block arranged to heat a respective device panel on the device strip.

5. The aging board of claim 4, wherein the plurality of heating blocks are independently controllable to provide independent temperature control of each of the plurality of device panels on the device strip.

6. The aging board of any of claims 1-2, further comprising: a multiplexer connected to a plurality of conductive contacts of the series of conductive contacts, the plurality of conductive contacts configured to contact a corresponding plurality of devices of the series of devices; a multiplexer control circuit configured to control the multiplexer to selectively receive signals from each of the plurality of devices via a respective conductive contact of the plurality of conductive contacts.

7. The aging board of any of claims 1-2, comprising a multiplexer system comprising: a performance signal multiplexer connected to a first subset of conductive contacts in the series of conductive contacts; a power signal multiplexer connected to a second subset of conductive contacts in the series of conductive contacts; and a multi-signal multiplexer control circuit configured to control the performance signal multiplexer and the power signal multiplexer to selectively monitor device performance signals and power signals from individual devices in the series of devices.

8. A strip socket for use in burn-in testing of a series of devices disposed on a device strip, wherein the strip socket comprises: a socket base configured to receive the device strip comprising the series of devices, the socket base comprising a contactor plate configured to support the device strip, the contactor plate comprising a series of contact holes; a series of conductive contacts; a socket cover; at least one heating block associated with the socket cover; wherein the socket cover is movable between an open position allowing installation of the device strip on the socket base and a closed position in which an installed device strip is disposed between the socket cover and the socket base; and wherein in the closed position of the socket cover, respective conductive contacts in the series of conductive contacts protrude through respective contact holes in the series of device contact holes in the contactor plate to contact respective devices in the series of devices on the device strip.

9. The strip socket of claim 8, wherein the at least one heating block is integrated in or mounted to the socket cover.

10. The strip socket of any one of claims 8 to 9, wherein in the closed position of the socket cover, the installed device strip is physically compressed between the socket cover and the socket base to bring the conductive contacts into contact with respective devices in the series of devices on the device strip.

11. The strip socket of any one of claims 8 to 9, wherein: the device strip comprises a plurality of device panels, each device panel comprising a plurality of devices; the strip socket comprises a plurality of zones, each zone corresponding to a respective device panel on the device strip; and the at least one heating block comprises a plurality of heating blocks, each heating block arranged to heat a respective device panel on the device strip.

12. The strip socket of claim 11, wherein the plurality of heating blocks are independently controllable to provide independent temperature control of each of the plurality of device panels on the device strip.

13. A burn-in board comprising any one of the strip sockets of claims 8 to 9.

14. A system for burn-in testing of devices, comprising: a burn-in tester; and a burn-in board comprising: a printed circuit board (PCB); a strip socket mounted to the PCB, the strip socket comprising: ​ ​ a socket base configured to receive a device strip, the device strip comprising a series of devices mounted on a device strip substrate; a socket cover; at least one heating block associated with the socket cover; wherein the socket cover is movable between an open position that allows mounting of the device strip on the socket base and a closed position in which a mounted device strip is disposed between the socket cover and the socket base; a series of conductive contacts, each conductive contact configured to contact a respective device in the series of devices; and a connection interface connected to the series of conductive contacts; a heating control circuit configured to control the at least one heating block to provide heat to the device strip; and wherein the burn-in tester is configured to: supply input test signals to individual devices on the device strip via the connection interface and the conductive contacts of the strip socket; and receive output test signals from the individual devices via the conductive contacts and the connection interface of the strip socket.

15. The system of claim 14, wherein the burn-in tester comprises a test bench.

16. The system of any one of claims 14-15, wherein the burn-in tester comprises a burn-in oven machine.

17. The system of any one of claims 14-15, wherein the at least one heating block is integrated in or mounted to the socket cover.

18. The system of any one of claims 14-15, wherein in the closed position of the socket cover, a mounted device strip is physically compressed between the socket cover and the socket base to bring the conductive contacts into contact with the individual devices on the device strip.

19. The system of any one of claims 14-15, wherein: the device strip comprises a plurality of device panels, each device panel comprising a plurality of devices; the strip socket comprises a plurality of segments, each segment corresponding to a respective device panel on the device strip; and the at least one heating block comprises a plurality of heating blocks, each heating block arranged to heat a respective device panel on the device strip; wherein the plurality of heating blocks are independently controllable to provide independent temperature control of each of the plurality of device panels on the device strip.

20. The system of any one of claims 14-15, wherein burn-in test electronics comprise: electrical fault detection circuitry configured to detect electrical faults associated with each individual device; and device performance monitoring circuitry configured to measure operational performance of each individual device.

21. The system of any one of claims 14-15, wherein the burn-in board comprises a burn-in board according to any one of claims 1-2.

22. The system of any one of claims 14-15, wherein the burn-in board comprises a burn-in board according to claim 13.

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