Image processing apparatus

Abstract

Provided is an image processing device that improves heat dissipation by studying the shape and arrangement of a battery. The image processing device includes a light-receiving element, a light-emitting element, a battery, a power supply circuit electrically connected to the battery, a first substrate provided with the light-receiving element, a second substrate provided with the light-emitting element, a third substrate provided with the power supply circuit, and a housing that accommodates the first substrate, the second substrate, and the third substrate, and the closer the portion of the battery that opposes the first substrate, the second substrate, and the third substrate is to the first substrate, the second substrate, and the third substrate, the smaller the cross-sectional area.

Description

TECHNICAL FIELD

[0001] The present application relates to an image processing apparatus. BACKGROUND

[0002] In recent years, an image processing apparatus equipped with a battery and capable of being carried and operated as a single body has been widely spread. For example, Patent Literature 1 describes an image processing apparatus equipped with a calibration data setting section and an image correction section, the calibration data setting section sets, as calibration data, color chart image data at a temperature closer to a temperature at which a subject is photographed, from among temperatures from a temperature of a camera at a time of photographing a color chart before photographing the subject to a temperature of the camera at a time of photographing the color chart after photographing the subject, in accordance with a temperature of the camera at a time of photographing a subject, a temperature of the camera at a time of photographing a color chart before and after photographing the subject, and color chart image data obtained by photographing the color chart before and after photographing the subject; and the image correction section corrects image data of the subject obtained by photographing the subject using the calibration data set in the calibration data setting section. According to the image processing apparatus described in Patent Literature 1, even in a case where a photographing condition or the like is changed in photographing, image data of the subject can be corrected with high precision.

[0003] Patent Literature 1: Japanese Patent Application Publication No. 2010-81057

[0004] However, in an image processing apparatus equipped with a battery and capable of being carried and operated as a single body, in order to facilitate arrangement of various constituent elements in a small housing, heat dissipation is reduced in accordance with a shape or arrangement of the battery, and a cooling time must be set when temperature rise occurs in association with continuous operation, and there is still room for improvement in terms of technology. SUMMARY

[0005] One embodiment of an image processing apparatus according to the present application includes:

[0006] a light-receiving element;

[0007] a light-emitting element;

[0008] a battery;

[0009] a power supply circuit electrically connected to the battery;

[0010] a first substrate on which the light-receiving element is provided;

[0011] a second substrate on which the light-emitting element is provided;

[0012] a third substrate on which the power supply circuit is provided; and

[0013] a housing that accommodates the first substrate, the second substrate, and the third substrate,

[0014] The closer the portion of the battery opposite the first substrate, the second substrate, and the third substrate is to the first substrate, the second substrate, and the third substrate, the smaller the cross-sectional area. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a perspective view of an image processing apparatus of the present embodiment.

[0016] Figure 2 is a diagram showing an example of information displayed in a display module.

[0017] Figure 3 is a block diagram showing a functional configuration of an image processing apparatus.

[0018] Figure 4 is a diagram showing the inside of a housing of an image processing apparatus as viewed from the positive direction of an X axis.

[0019] Figure 5 is a diagram showing the inside of a housing of an image processing apparatus as viewed from the positive direction of a Y axis.

[0020] Figure 6 is a diagram showing the inside of a housing of an image processing apparatus as viewed from the positive direction of a Z axis.

[0021] Figure 7 is a diagram showing a first substrate as viewed from the positive direction of a Z axis.

[0022] Figure 8 is a cross-sectional view of the first substrate taken along the A-A line of Figure 7

[0023] Figure 9 is a diagram showing a sub substrate as viewed from the positive direction of a Z axis.

[0024] Figure 10 is a diagram showing a spacer substrate as viewed from the positive direction of a Z axis.

[0025] Figure 11 is a diagram showing a main substrate as viewed from the positive direction of a Z axis.

[0026] Figure 12 is a diagram showing a second substrate as viewed from the positive direction of a Z axis.

[0027] Figure 13 is a diagram showing a third substrate as viewed from the positive direction of a Z axis.

[0028] Figure 14 is a diagram showing a fourth substrate as viewed from the positive direction of a Z axis.

[0029] Figure 15 is a diagram showing a part of constituent elements of an image processing apparatus as viewed from the positive direction of a Z axis.

[0030] REFERENCE SIGNS​

[0031] 1…image processing apparatus; 10…light emitting element; 11…light emitting element drive circuit; 20…wavelength variable filter; 21…light receiving element; 22…photoelectric conversion circuit; 23…amplification circuit; 24…C / V conversion circuit; 25…amplification circuit; 26…voltage step-up conversion circuit; 30…first processor; 31…wireless communication module; 32…operation section; 33…light emitting module; 34…buzzer; 40…second processor; 41…power supply circuit; 42…switching circuit; 43…charging circuit; 50…display module; 51…cable; 60…connector; 70…battery; 71, 72…connector; 81, 82, 83, 84, 85, 86, 87…connector; 91, 92…flexible flat cable; 93…cable; 100…housing; 101…first substrate; 101a, 101b, 101c, 101d…edge of first substrate; 101F, 101R…face of first substrate; 102…second substrate; 102a, 102b, 102c, 102d…edge of second substrate; 102F, 102R…face of second substrate; 103…third substrate; 103a, 103b, 103c, 103d…edge of third substrate; 103F, 103R…face of third substrate; 104…fourth substrate; 104a, 104b, 104c, 104d…edge of fourth substrate; 104F, 104R…face of fourth substrate; 111…main substrate; 111a, 111b, 111c, 111d…edge of main substrate; 111F, 111R…face of main substrate; 112…spacer substrate; 113…sub substrate; 113F, 113R…face of sub substrate; 120…opening; 121, 122, 123, 124, 125…threaded hole; 133, 132…screw; 140…opening. DETAILED DESCRIPTION

[0032] Hereinafter, a preferred embodiment of the present application will be described in detail using the drawings. The drawings used herein are diagrams for facilitating the description. Furthermore, the embodiment described below is not an improper limitation of the content of the present application recited in the claims. In addition, not all of the configurations described below are essential components of the present application.

[0033] Hereinafter, in the present embodiment, as an example of the image processing apparatus to which the present application is applied, a color measurement device will be described as an example.

[0034] 1. Outline of image processing apparatus

[0035] Figure 1 is a perspective view of the image processing apparatus 1 of the present embodiment. As shown in the figure, the image processing apparatus 1 of the present embodiment includes a housing 100, a first substrate 101, a second substrate 102, a third substrate 103, a fourth substrate 104, a main substrate 111, a spacer substrate 112, and a sub substrate 113. Figure 1As illustrated, the image processing apparatus 1 of the present embodiment performs colorimetry processing of measuring the color of the image IMG as image processing. Specifically, when the user moves the image processing apparatus 1 above the image IMG formed on the medium M and presses the operation section 32 disposed on the upper surface of the image processing apparatus 1, the image processing apparatus 1 emits light from a portion of the bottom surface opposite the image IMG and measures the color of the image IMG according to the wavelength of the light reflected by the image IMG. That is, the operation section 32 functions as a measurement start button. For example, the medium M is paper or cloth or the like, and the image IMG is a monochrome image. As illustrated, Figure 1 As illustrated, a color chart including a plurality of images of different colors can also be formed on the medium M, and the user moves the image processing apparatus 1 above each image and presses the operation section 32, whereby the color of each image is measured by the image processing apparatus 1. In addition, the image processing apparatus 1 can measure the color of the medium M.

[0036] The image processing apparatus 1 can also calculate the color difference, which is the difference between the measured colorimetric values and the target colorimetric values. The image processing apparatus 1 displays the calculated measured colorimetric values and the color difference in the display module 50, which the user can visually confirm from the outside of the housing 100. In Figure 1 In the example illustrated, the display module 50 is disposed at a position where the user can visually confirm from the face of the image processing apparatus 1 on which the operation section 32 is disposed. Figure 2 is a view illustrating an example of the measured colorimetric values and the color difference displayed in the display module 50. In Figure 2 In the example illustrated, the measured colorimetric values L, a, b and the color difference ΔE displayed in the display module 50 are values in the L*a*b* color space. In addition, the measured colorimetric values and the color difference can also be values in various color spaces other than the L*a*b* color space, such as the RGB color space, the YCC color space, the CMYK color space, the L*C*h color space, and the like.

[0037] As illustrated in Figure 1 and Figure 2 The image processing apparatus 1 can also have a light emitting module 33 that the user can visually confirm from the outside of the housing 100. In Figure 1 and Figure 2 In the example illustrated, the light emitting module 33 is disposed in a manner surrounding the operation section 32. For example, the light emitting module 33 has a light guide in the shape of a tube and an LED mounted to the front end of the light guide, and the light emitted by the LED is guided by the light guide. LED is an abbreviation for Light Emitting Diode. In Figure 1 and Figure 2 In the example illustrated, the user can visually confirm the light guide of the light emitting module 33. The light emitting module 33 is a module for displaying a state, and the light emission state differs according to the operation of the operation section 32 by the user. For example, the image processing apparatus 1 can also cause the light emitting module 33 to emit light when it is recognized that the user has pressed the operation section 32.

[0038] The image processing apparatus 1 is in the shape of a cuboid that is close to a size that can be held and operated by one hand of a user, and thus is portable. In addition, the image processing apparatus 1 is built-in with the battery 70 described later, and operates by being pressed by the user by the operation section 32, and thus can operate as a single body without being instructed from another apparatus. Therefore, the convenience for the user of the image processing apparatus 1 is high.

[0039] Further, as shown in Figure 1 and Figure 2 , directions along three edges of the housing 100 of the image processing apparatus 1 that intersect each other are set as an X axis, a Y axis, and a Z axis, and thereafter, the orientation of the image processing apparatus 1 is the same as that of Figure 3 and Figure 1 and Figure 2 except for

[0040] 2. Functional Configuration of Image Processing Apparatus

[0041] Figure 3 is a block diagram showing the functional configuration of the image processing apparatus 1. As shown in Figure 3 , the image processing apparatus 1 includes a plurality of light emitting elements 10 and a light emitting element drive circuit 11. In addition, the image processing apparatus 1 includes a wavelength variable filter 20, a light receiving element 21, a photoelectric conversion circuit 22, an amplification circuit 23, a C / V conversion circuit 24, an amplification circuit 25, and a step-up conversion circuit 26. In addition, the image processing apparatus 1 includes a first processor 30, a wireless communication module 31, an operation section 32, a light emitting module 33, a buzzer 34, and a display module 50. In addition, the image processing apparatus 1 includes a second processor 40, a power supply circuit 41, a switching circuit 42, a charging circuit 43, a connector 60, and a battery 70.

[0042] The plurality of light emitting elements 10 are respectively arranged on a bottom surface portion of the image processing apparatus 1, and are lit or extinguished in accordance with a drive signal output from the light emitting element drive circuit 11. When each light emitting element 10 is lit, light is emitted from the bottom surface of the image processing apparatus 1. Each light emitting element 10 is, for example, an LED. For example, a part of the plurality of light emitting elements 10 can emit white light, and another part of the plurality of light emitting elements 10 can emit ultraviolet light.

[0043] The light emitting element drive circuit 11 outputs a plurality of drive signals that respectively drive the plurality of light emitting elements 10 in accordance with a control signal from the first processor 30.

[0044] The wavelength variable filter 20 transmits light of a prescribed range of wavelengths from light incident from the bottom surface of the image processing apparatus 1. The wavelength variable filter 20 has an electrostatic actuator not shown, and a voltage output from the amplification circuit 25 is applied to the electrostatic actuator. The capacitance value of the electrostatic actuator changes according to the applied voltage, and the wavelength of light transmitted through the wavelength variable filter 20 changes according to the capacitance value of the electrostatic actuator. Therefore, the wavelength of light transmitted through the wavelength variable filter 20 changes according to the voltage output from the amplification circuit 25. The wavelength variable filter 20 can also be a etalon element, for example.

[0045] The amplification circuit 25 outputs a voltage of several tens of V for driving the wavelength variable filter 20. The output voltage of the amplification circuit 25 changes according to a control signal from the first processor 30.

[0046] The step-up conversion circuit 26 steps up a voltage VI of several V output from the power supply circuit 41 to a voltage V4 of several tens of V, and outputs to the amplification circuit 25. The voltage V4 stepped up by the step-up conversion circuit 26 becomes the power supply voltage of the amplification circuit 25. The step-up conversion circuit 26 can also be a step-up type DC-DC converter, for example.

[0047] The C / V conversion circuit 24 converts the electric charge accumulated in the electrostatic actuator to a voltage, and outputs to the first processor 30. The first processor 30 controls the output voltage of the amplification circuit 25 according to a digital value obtained by A / D converting the output voltage of the C / V conversion circuit 24, so that the wavelength variable filter 20 transmits light of a desired wavelength. That is, the wavelength of light transmitted through the wavelength variable filter 20 is controlled by the first processor 30.

[0048] The light receiving element 21 receives light transmitted through the wavelength variable filter 20, and outputs an electric charge of a size corresponding to the amount of light. The light receiving element 21 can also be a photodiode, for example.

[0049] The photoelectric conversion circuit 22 converts the amount of light received by the light receiving element 21 to an electric signal, and outputs to the amplification circuit 23. The photoelectric conversion circuit 22 can also be a C / V conversion circuit that converts the electric charge output from the light receiving element 21 to a voltage, for example.

[0050] The amplification circuit 23 amplifies the voltage output from the photoelectric conversion circuit 22, and outputs to the first processor 30.

[0051] The first processor 30 is a processor that performs image processing, generates a digital value indicating the amount of light received by the light-receiving element 21 by performing A / D conversion on the output voltage of the photoelectric conversion circuit 22, and stores the amount of light in correspondence with the wavelength of the light. The first processor 30 may, for example, also be an MCU or an MPU. MCU is an abbreviation for Micro Control Unit, and MPU is an abbreviation for Micro-processing unit. The first processor 30 scans the wavelength of the light transmitted through the wavelength variable filter 20, and stores the amount of light received by the light-receiving element 21 in correspondence with each wavelength. Further, the first processor 30 calculates a color measurement value from the amount of light corresponding to each wavelength. The first processor 30 calculates a color difference, which is the difference between the color measurement value and a target color value, in a case where the target color value is known in advance.

[0052] The wireless communication module 31 has a wireless communication circuit and an antenna, which are not shown. The wireless communication circuit acquires a wireless signal received from an external device via the antenna and demodulates data, and transmits to the first processor 30. In addition, the wireless communication circuit acquires data from the first processor 30 and modulates a high-frequency signal, and transmits a wireless signal to the external device via the antenna. For example, the wireless communication module 31 may also acquire the color measurement value and the color difference calculated by the first processor 30, and transmit to the external device. The wireless communication circuit may also have a temperature sensor, which is not shown, and have a function of temperature compensating the color measurement value based on a signal output from the temperature sensor. The wireless communication module 31 may, for example, also be a module that transmits and receives a wireless signal corresponding to a wireless communication standard such as Bluetooth (registered trademark), Wi-Fi, or the like.

[0053] The operation section 32 outputs an operation signal based on a user operation to the first processor 30. In the present embodiment, the operation section 32 functions as a measurement start button, and outputs an operation signal indicating that it is pressed to the first processor 30 when a user presses the operation section 32. The first processor 30 starts processing for color measurement in accordance with the operation signal from the operation section 32.

[0054] The light-emitting module 33 is a module for state display, and emits light in accordance with a control signal from the first processor 30. For example, the first processor 30 outputs a control signal for causing the light-emitting module 33 to emit light when it detects that the user has pressed the operation section 32.

[0055] The buzzer 34 notifies the user of various information by generating a prescribed sound in accordance with a control signal from the first processor 30. For example, when the user presses the operation section 32 in order to start the measurement, the light axis of the light receiving element 21 is greatly shifted or shaken, and it is possible that the color measurement cannot be performed normally. Therefore, when the user's operation of the operation section 32 is not good, the first processor 30 outputs a prescribed control signal to the buzzer 34, and the buzzer 34 emits a sound.

[0056] The display module 50 displays various information in accordance with a display signal output from the first processor 30. In the present embodiment, the light emitting module 33 includes a display panel as shown in FIG. 6 and a display driver not shown. The display panel can also be a liquid crystal panel, for example. The display driver generates a drive signal corresponding to the display signal output from the first processor 30, and outputs the drive signal to the display panel. For example, as shown in FIG. 7, the display panel displays a colorimetric value, a color difference, and the like. Figure 2 Figure 2

[0057] The battery 70 is a secondary battery such as a lithium ion battery, a lithium polymer battery, or the like, for example. A voltage VB corresponding to the charge remaining amount is output from the battery 70 by the user pressing a power button not shown.

[0058] The power supply circuit 41 generates and outputs voltages VI, V2 in accordance with the output voltage VB of the battery 70. The power supply circuit 41 can also include a step-up DC-DC converter and a step-down DC-DC converter not shown, the step-up DC-DC converter generating the voltage VI by stepping up the output voltage VB of the battery 70, and the step-down DC-DC converter generating the voltage V2 by stepping down the voltage VI. The voltage VI is supplied to the step-up conversion circuit 26, and the voltage V2 is supplied to the second processor 40 as a power supply voltage. In addition, the voltage V2 is input to the switching circuit 42.

[0059] The switching circuit 42 becomes in an on state or an off state in accordance with a control signal from the second processor 40. The switching circuit 42 outputs a voltage V3 approximately equal to the voltage V2 when in the on state. The voltage V3 is supplied to the circuits surrounded by a broken line in FIG. 5 as a power supply voltage. In addition, when the switching circuit 42 is in the off state, the voltage V3 is not supplied to the circuits. That is, the second processor 40 is a power supply control processor. Figure 3 The connector 60 is a connector that connects a cable, and can also be a USB connector, for example. USB is an abbreviation for Universal Serial Bus. The connector 60 is electrically connected to an external device such as a personal computer via a USB cable, for example. The second processor 40 can perform data communication with the external device via the connector 60.

[0060]

[0061] ​​​The charging circuit 43 uses the power supply voltage VC supplied when the connector 60 is electrically connected to an external device to charge the battery 70.

[0062] In addition, the second processor 40 communicates with the first processor 30. The second processor 40 can also be started by being supplied with voltage V2 from the power supply circuit 41 and notify the first processor 30 of this start-up status. Alternatively, the first processor 30 can notify the second processor 40 of the transition to sleep mode after colorimetric processing is complete. Upon receiving this notification, the second processor 40 de-energizes the switching circuit 42, stopping the supply of voltage V3 to the first processor 30.

[0063] 3. Structure of the image processing device

[0064] Next, use Figures 4 to 15 The internal structure of the image processing device 1 will be described in detail. Figure 4 This is a view of the interior of the housing 100 of the image processing device 1, viewed from the positive X-axis direction. Additionally,

[0065] Figure 5 This is a view of the interior of the housing 100 of the image processing device 1, viewed from the positive Y-axis direction. Additionally, Figure 6 This is a view of the interior of the housing 100 of the image processing device 1 as seen from the positive Z-axis direction.

[0066] like Figure 4 and Figure 5 As shown, the image processing apparatus 1 has a cuboid-shaped housing 100, a first substrate 101, a second substrate 102, a third substrate 103, and a fourth substrate 104. The housing 100 houses the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104. The first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104 are fixed to the housing 100 by screws or the like. The second substrate 102 is located closest to the bottom surface of the housing 100. The first substrate 101 is located between the second substrate 102 and the third substrate 103, and the third substrate 103 is located between the first substrate 101 and the fourth substrate 104. The fourth substrate 104 is located closest to the upper surface of the housing 100.

[0067] Figure 3 The wavelength-variable filter 20, light-receiving element 21, photoelectric conversion circuit 22, amplification circuit 23, C / V conversion circuit 24, amplification circuit 25, boost conversion circuit 26, and first processor 30 shown are disposed on the first substrate 101. Furthermore, Figure 3The plurality of light emitting elements 10 and the light emitting element drive circuit 11 shown are provided on the second substrate 102. In addition, Figure 3 The second processor 40, the power supply circuit 41, the switching circuit 42, the charging circuit 43, and the connector 60 shown are provided on the third substrate 103. In addition, Figure 3 The wireless communication module 31, the operation section 32, the light emitting module 33, and the buzzer 34 shown are provided on the fourth substrate 104.

[0068] As shown in Figure 4 , Figure 5 and Figure 6 , Figure 3 The display module 50 shown is positioned between the fourth substrate 104 and the upper surface of the case 100 and is visually confirmed from the upper surface of the case 100. One end of a cable 51 connected to a not-shown display driver built in the display module 50 is connected to a connector 86 provided on the fourth substrate 104.

[0069] As shown in Figure 4 and Figure 5 , both ends of a flexible flat cable 91 are connected to a connector 81 provided on the first substrate 101 and a connector 87 provided on the fourth substrate 104, respectively. Signals input and output between the first processor 30 provided on the first substrate 101 and the wireless communication module 31, the operation section 32, the light emitting module 33, and the buzzer 34 provided on the fourth substrate 104 are transmitted in the flexible flat cable 91.

[0070] In addition, a signal for display output from the first processor 30 provided on the first substrate 101 is transmitted in the flexible flat cable 91 and reaches the fourth substrate 104, and further transmitted in the cable 51 and reaches the display module 50. Thus, the fourth substrate 104 functions as a relay substrate that relays the signal for display to the display module 50.

[0071] Both ends of a flexible flat cable 92 are connected to a connector 84 provided on the first substrate 101 and a connector 85 provided on the third substrate 103, respectively. The first processor 30 provided on the first substrate 101 and the second processor 40 provided on the third substrate 103 perform data communication via the flexible flat cable 92. In addition, a voltage V3 based on a voltage V2 generated by the power supply circuit 41 provided on the third substrate 103 is transmitted in the flexible flat cable 92 and reaches the first substrate 101, and further transmitted in the flexible flat cable 91 and reaches the fourth substrate 104. That is, the wiring path from the third substrate 103 to the first substrate 101 is shorter than the wiring path from the third substrate 103 to the fourth substrate 104. Thus, the amount of decrease in the voltage V3 supplied from the power supply circuit 41 to the first substrate 101 is small, and a stable voltage is supplied to the light receiving element 21 disposed on the first substrate 101.

[0072] The both ends of the cable 93 are connected to the connector 82 provided on the first substrate 101 and the connector 83 provided on the second substrate 102, respectively. The control signal output from the first processor 30 provided on the first substrate 101 is transmitted in the cable 93 and reaches the second substrate 102, and is input to the light emitting element drive circuit 11 provided on the second substrate 102.

[0073] As Figure 4 and Figure 5 illustrated, Figure 3 The battery 70 illustrated in is located between the first substrate 101, the second substrate 102, and the third substrate 103 and the fourth substrate 104. More specifically, the battery 70 is provided between the third substrate 103 and the fourth substrate 104. In addition, the third substrate 103 is provided between the battery 70 and the first substrate 101. Also, the battery 70 overlaps the third substrate 103 in the Z-axis direction orthogonal to the face 101F of the first substrate 101. Therefore, in a plan view observed from the positive direction of the Z-axis, the first substrate 101, the second substrate 102, the third substrate 103, the fourth substrate 104, and the battery 70 overlap, and the arrangement space of the first substrate 101, the second substrate 102, and the third substrate 103 is separated from the arrangement space of the fourth substrate 104 by the battery 70.

[0074] Figure 4 In addition, as Figure 5 illustrated, in a plan view observed from the positive direction of the Y-axis, the portion of the battery 70 facing the fourth substrate 104 has a semicircular shape, and the portion of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 has a trapezoidal shape with the upper base longer than the lower base. Therefore, the closer the portion of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 is to the first substrate 101, the second substrate 102, and the third substrate 103, the smaller the cross-sectional area is. Therefore, a gap is generated in the X-axis direction between the battery 70 and the third substrate 103, and the connectors 71, 72 are provided on the third substrate 103 using the gap. The connectors 71, 72 are connected to the battery 70 by wiring not shown. Figure 3 The power supply circuit 41 and the charging circuit 43 illustrated in

[0075] Figure 7 is a plan view of the first substrate 101 observed from the positive direction of the Z-axis, Figure 8 is a cross-sectional view of the first substrate 101 taken along the A-A line of Figure 7 As Figure 7As shown, in a top view taken from the positive direction of the Z-axis, the first substrate 101 has a rectangular shape having a side 101a, a side 101b longer than the side 101a, a side 101c opposite to the side 101a, and a side 101d opposite to the side 101b.

[0076] like Figure 7 and Figure 8 As shown, the first substrate 101 has a surface 101F facing the positive Z-axis direction and a surface 101R facing the negative Z-axis direction. Furthermore, the first substrate 101 is disposed between the third substrate 103 and the second substrate 102 in the Z-axis direction. A light-receiving element 21 is disposed on surface 101R of the first substrate 101.

[0077] like Figure 7 As shown, the first substrate 101 is constructed by fixing the main substrate 111 and the sub-substrate 113 onto the spacer substrate 112 using screws 131 and 132.

[0078] Figure 9 This is a view of the sub-substrate 113 viewed from the positive Z-axis direction. Additionally, Figure 10 This is a view of the spacer substrate 112 as seen from the positive Z-axis direction. Additionally, Figure 11 This is a view of the main substrate 111 viewed from the positive Z-axis direction. Furthermore, in... Figure 9 , Figure 10 as well as Figure 11 In the diagram, solid lines represent constituent elements disposed on the surface of each substrate facing the positive Z-axis, and dashed lines represent constituent elements disposed on the surface of each substrate facing the negative Z-axis.

[0079] like Figure 7 , Figure 9 , Figure 10 as well as Figure 11 As shown, screws 131 are inserted into threaded holes 121 on the main substrate 111, threaded holes 123 on the spacer substrate 112, and threaded holes 124 on the sub-substrate 113; and screws 132 are inserted into threaded holes 122 on the main substrate 111 and threaded holes 125 on the sub-substrate 113.

[0080] like Figure 9 As shown, the sub-substrate 113 has a surface 113F facing the positive Z-axis and a surface 113R facing the negative Z-axis. Surfaces 101F and 101R of the first substrate 101 are surfaces 113F and 113R of the sub-substrate 113, respectively. Figure 8 and Figure 9 As shown, a light-receiving element 21 and an amplifier circuit 23 are disposed on the surface 113R of the sub-substrate 113.

[0081] like Figure 7 and Figure 11As shown, the outer shape of the first substrate 101 coincides with the outer shape of the main substrate 111 in plan view from the positive direction of the Z-axis, and the side 101a, the side 101b, the side 101c, and the side 101d of the first substrate 101 are the side 111a, the side 111b, the side 111c, and the side 111d of the main substrate 111, respectively.

[0082] As shown, the main substrate 111 has a surface 111F facing the positive direction of the Z-axis and a surface 111R facing the negative direction of the Z-axis. The photoelectric conversion circuit 22, the amplification circuit 25, and the step-up conversion circuit 26, the first processor 30, and the connector 84 are provided on the surface 111F of the main substrate 111. In addition, the wavelength variable filter 20, the C / V conversion circuit 24, the connector 81, and the connector 82 are provided on the surface 111R of the main substrate 111. As shown, the main substrate 111 has a rectangular opening portion 120, and the wavelength variable filter 20 overlaps the opening portion 120 in plan view from the positive direction of the Z-axis. Figure 11 Figure 8 Figure 11 As shown, the main substrate 111 has a rectangular opening portion 120, and the wavelength variable filter 20 overlaps the opening portion 120 in plan view from the positive direction of the Z-axis.

[0083] In addition, in the present embodiment, the first substrate 101 is constituted by three substrates, the main substrate 111, the spacer substrate 112, and the sub substrate 113, but can be constituted by one or two substrates.

[0084] Figure 12 is a view of the second substrate 102 as viewed from the positive direction of the Z-axis. In addition, in Figure 12 , a solid line indicates a constituent element provided on a surface 102F of the second substrate 102 facing the positive direction of the Z-axis, and a dashed line indicates a constituent element provided on a surface 102R of the second substrate 102 facing the negative direction of the Z-axis.

[0085] As shown, the outer shape of the first substrate 101 coincides with the outer shape of the main substrate 111 in plan view from the positive direction of the Z-axis, and the side 101a, the side 101b, the side 101c, and the side 101d of the first substrate 101 are the side 111a, the side 111b, the side 111c, and the side 111d of the main substrate 111, respectively. Figure 12 The surface 102F of the second substrate 102 is opposed to the surface 101R of the first substrate 101.

[0086] The surface 102R of the second substrate 102 is opposed to the inner wall surface of the case 100.

[0087] Figure 13 ​​is a view of the third substrate 103 as viewed from the positive direction of the Z axis. Furthermore, in Figure 13 the solid line indicates a component provided on the surface 103F of the third substrate 103 facing the positive direction of the Z axis, and the broken line indicates a component provided on the surface 103R of the third substrate 103 facing the negative direction of the Z axis.

[0088] As shown in Figure 13 , in a plan view as viewed from the positive direction of the Z axis, the third substrate 103 has a rectangular shape having a side 103a, a side 103b longer than the side 103a, a side 103c opposite to the side 103a, and a side 103d opposite to the side 103b. The second processor 40, the power supply circuit 41, the switching circuit 42, the charging circuit 43, the connector 60, the connector 71, and the connector 72 are provided on the surface 103F of the third substrate 103. The surface 103F of the third substrate 103 faces the battery 70.

[0089] The connector 85 is provided on the surface 103R of the third substrate 103. The surface 103R of the third substrate 103 faces the surface 101F of the first substrate 101.

[0090] Figure 14 is a view of the fourth substrate 104 as viewed from the positive direction of the Z axis. Furthermore, in Figure 14 the solid line indicates a component provided on the surface 104F of the fourth substrate 104 facing the positive direction of the Z axis, and the broken line indicates a component provided on the surface 104R of the fourth substrate 104 facing the negative direction of the Z axis.

[0091] As shown in Figure 14 , in a plan view as viewed from the positive direction of the Z axis, the fourth substrate 104 has a rectangular shape having a side 104a, a side 104b longer than the side 104a, a side 104c opposite to the side 104a, and a side 104d opposite to the side 104b.

[0092] The operation section 32, the light emitting module 33, the buzzer 34, and the connector 86 are provided on the surface 104F of the fourth substrate 104. The operation section 32 is provided on the surface 104F of the fourth substrate 104 at a position overlapping with a virtual line VL having the same distance from the side 104b and the side 104d. That is, the operation section 32 is arranged at a central portion in the short side direction of the fourth substrate 104. The operation section 32 is, for example, a button which is physically displaced by being pressed by a user. Alternatively, the operation section 32 can be a static capacitance type button.

[0093] The surface 104F of the fourth substrate 104 faces the inner wall surface of the housing 100 and the display module 50.

[0094] A wireless communication module 31 and a connector 87 are disposed on surface 104R of the fourth substrate 104. The wireless communication module 31 is disposed in the end region of surface 104R of the fourth substrate 104. This end region is the region closest to edge 104a when the entire area of ​​surface 104R of the fourth substrate 104 is divided into three regions of equal area by two line segments parallel to edge 104a. Surface 104R of the fourth substrate 104 faces the battery 70.

[0095] Figure 15 This is a diagram showing multiple light-emitting elements 10, wavelength-variable filter 20, light-receiving element 21, opening 140, first processor 30, wireless communication module 31, operation unit 32, power supply circuit 41, display module 50, and fourth substrate 104 viewed from the positive direction of the Z-axis.

[0096] like Figure 15 As shown, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength-variable filter 20, and the light-receiving element 21 overlap, and a plurality of light-emitting elements 10 are arranged to surround the opening 140. That is, the opening 140 and the wavelength-variable filter 20 overlap on the optical axis of the light-receiving element 21, and the plurality of light-emitting elements 10 are arranged to surround the optical axis of the light-receiving element 21. Therefore, light emitted from the plurality of light-emitting elements 10 is reflected by the image IMG, and the reflected light enters the wavelength-variable filter 20 through the opening 140. Then, light of a predetermined wavelength that has passed through the wavelength-variable filter 20 enters the light-receiving element 21. In this way, by arranging the components of the optical system in an overlapping manner in the Z-axis direction, the space required for the optical system is reduced, and the housing 100 can be miniaturized.

[0097] In addition, such as Figure 15 As shown, the operation unit 32 and the region A1, which is configured with a plurality of light-emitting elements 10, are positioned overlapping each other on the optical axis of the light-receiving element 21. Therefore, when the user operates the operation unit 32, a force is applied directly to the optical axis of the light-receiving element 21, thus the optical axis of the light-receiving element 21 is less prone to wobbling or shifting relative to the image IMG. Furthermore, in this embodiment, the plurality of light-emitting elements 10 are disposed on the surface 102R of the second substrate 102 in a manner that surrounds the opening 140; therefore, region A1 is the region containing the smallest circle of each configuration area of ​​the plurality of light-emitting elements 10.

[0098] In addition, such as Figure 15 As shown, in the Z-axis direction orthogonal to the plane 104R of the fourth substrate 104 where the wireless communication module 31 is located, the display module 50 and the wireless communication module 31 do not overlap. Therefore, the possibility of the display module 50 causing a decrease in the receiving sensitivity of the wireless communication module 31 is reduced.

[0099] In addition, such as Figure 15As shown, in the Z-axis direction, the first processor 30 and the light-receiving element 21 do not overlap with the power supply circuit 41. Therefore, the possibility that the heat emitted by the power supply circuit 41 causes a change in the characteristics of the light-receiving element 21 is reduced, and the heat dissipation of the power supply circuit 41, the first processor 30, and the light-receiving element 21, which are each heat sources, is improved.

[0100] 4. Effects

[0101] The image processing apparatus 1 of the present embodiment has been researched in various ways in terms of the arrangement of each constituent element in order to solve at least one of various problems that arise because it is provided with the battery 70 and can be carried and operated as a single body.

[0102] One of the problems is to reduce the possibility that adverse situations arise due to heat generated in the narrow space inside the small housing 100. In the image processing apparatus 1 of the present embodiment, the light-receiving element 21, the first processor 30, which operate during image processing and can be heat sources, are arranged on the first substrate 101. In addition, the plurality of light-emitting elements 10, the light-emitting element drive circuit 11, which operate during image processing and can be heat sources, are arranged on the second substrate 102. In addition, the power supply circuit 41, the second processor 40, which operate during image processing and can be heat sources, are arranged on the third substrate 103. In this way, in the image processing apparatus 1 of the present embodiment, because each constituent element that can be a heat source is dispersedly arranged on the first substrate 101, the second substrate 102, and the third substrate 103, the heat influence of each other is reduced, and the operation is stabilized.

[0103] Further, because the power supply circuit 41 does not overlap with the light-receiving element 21 in the Z-axis direction, the possibility that the heat emitted by the power supply circuit 41 causes a change in the characteristics of the light-receiving element 21 is reduced, and the heat dissipation of the power supply circuit 41 and the light-receiving element 21 is each improved. Therefore, according to the image processing apparatus 1, the possibility that the accuracy of image processing performed in accordance with the amount of light received by the light-receiving element 21 is reduced, and the operation can be performed for a long time while ensuring a certain quality.

[0104] In addition, according to the image processing apparatus 1, the first processor 30, which can be a heat source, does not overlap with the power supply circuit 41 in the Z-axis direction, and therefore the heat dissipation of the first processor 30 and the power supply circuit 41 is each improved.

[0105] Further, in the image processing apparatus 1, the wireless communication module 31 is provided on the fourth substrate 104 different from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light-receiving element 21, the plurality of light-emitting elements 10, and the power supply circuit 41 that can be heat sources are respectively provided. Therefore, according to the image processing apparatus 1, the wireless communication module 31, which requires stable operation, is less likely to cause a malfunction due to the influence of heat.

[0106] Further, in the image processing apparatus 1, the battery 70 between the first substrate 101, the second substrate 102, and the third substrate 103 and the fourth substrate 104 functions as a thermal barrier, and heat generation of the first substrate 101, the second substrate 102, and the third substrate 103 is less likely to be transmitted to the fourth substrate 104. Therefore, according to the image processing apparatus 1, the wireless communication module 31 provided on the fourth substrate 104 is less likely to be affected by the temperature of the first substrate 101, the second substrate 102, and the third substrate 103 that sharply rises along with image processing, and stable communication quality can be ensured.

[0107] Further, as shown in FIG. 1, in the image processing apparatus 1, the battery 70 is provided on the fourth substrate 104 different from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light-receiving element 21, the plurality of light-emitting elements 10, and the power supply circuit 41 that can be heat sources are respectively provided. Therefore, according to the image processing apparatus 1, the wireless communication module 31 is less likely to be affected by the temperature of the first substrate 101, the second substrate 102, and the third substrate 103 that sharply rises along with image processing, and stable communication quality can be ensured. Figure 5 Further, as shown in FIG. 1, in the image processing apparatus 1, the battery 70 is provided on the fourth substrate 104 different from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light-receiving element 21, the plurality of light-emitting elements 10, and the power supply circuit 41 that can be heat sources are respectively provided. Therefore, according to the image processing apparatus 1, the wireless communication module 31 is less likely to be affected by the temperature of the first substrate 101, the second substrate 102, and the third substrate 103 that sharply rises along with image processing, and stable communication quality can be ensured.

[0108] Further, the wireless communication module 31 and the light emitting module 33, which act only for a short period of time when necessary and thus generate a small amount of heat, the operation section 32 and the buzzer 34, which generate almost no heat, are arranged on the fourth substrate 104 as necessary. Thus, the fourth substrate 104 generates heat for relaying a signal for display to the display module 50 during image processing, but at least one of the first substrate 101, the second substrate 102, and the third substrate 103 generates a larger amount of heat than the fourth substrate 104. In fact, the first substrate 101, the second substrate 102, and the third substrate 103 generate a larger amount of heat than the fourth substrate 104 as long as no special situation in which wireless communication or the like is frequently performed occurs. In this way, in the image processing device 1, the components that generate a relatively large amount of heat are arranged on the first substrate 101, the second substrate 102, and the third substrate 103, which have high heat dissipation properties, and the components that generate a relatively small amount of heat are arranged on the fourth substrate 104, which is less likely to be affected by heat. Thus, according to the image processing device 1, it is possible to improve heat dissipation properties while securing the capacity of the battery 70, and thus it is possible to perform work for a long time continuously while ensuring a certain quality.

[0109] Further, according to the image processing device 1, since the first processor 30, which can be a heat source, is arranged on the first substrate 101, which has high heat dissipation properties, it is possible to perform work for a long time continuously while ensuring a certain quality.

[0110] Further, according to the image processing device 1, since the second processor 40, which can be a heat source, is arranged on the third substrate 103, which has high heat dissipation properties, it is possible to perform work for a long time continuously while ensuring a certain quality.

[0111] It is also a subject to achieve good noise resistance and responsiveness. In the image processing device 1 of the present embodiment, since the first processor 30, which performs image processing, is arranged on the first substrate 101 on which the light receiving element 21 is arranged, a signal output from the light receiving element 21 is transmitted to the first processor 30 without passing through the second substrate 102, the third substrate 103, and the fourth substrate 104. Thus, according to the image processing device 1, it is possible to achieve good noise resistance and responsiveness.

[0112] Further, in the image processing device 1, the second processor 40, which performs power control, is arranged on the third substrate 103 on which the power supply circuit 41 is arranged, and thus a signal output from the second processor 40 is transmitted to the power supply circuit 41 without passing through other substrates. Thus, according to the image processing device 1, it is possible to achieve good noise resistance and responsiveness.

[0113] Further, according to the image processing device 1, the wireless communication module 31 is arranged in the fourth substrate 104 at an end region in the long side direction at a small distance from the inner wall surface of the housing 100, and thus is less likely to be affected by noise and it is possible to improve communication sensitivity.

[0114] Further, according to the image processing apparatus 1, the light-receiving element 21, the plurality of light-emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation section 32 are respectively provided on different substrates, and thus, mutual interference of heat, vibration, signals, and the like is reduced, and the operation can be stabilized. Thus, according to the image processing apparatus 1, the possibility of a decrease in the accuracy of image processing due to mutual interference of heat, vibration, signals, and the like between the plurality of constituent elements is reduced, and the operation can be performed continuously for a long time while ensuring a certain quality.

[0115] Further, in the image processing apparatus 1, the wiring path from the third substrate 103 to the first substrate 101 is short, and thus, the amount of decrease in the voltage V3 supplied from the power supply circuit 41 provided on the third substrate 103 to the first substrate 101 is small. Thus, according to the image processing apparatus 1, a stable voltage can be supplied to the light-receiving element 21 provided on the first substrate 101, and thus, the possibility of a decrease in the accuracy of image processing is reduced.

[0116] Further, according to the image processing apparatus 1, the wiring path between the light-receiving element 21 and the photoelectric conversion circuit 22 is shortened, and the influence of noise on a small signal is reduced, and thus, the possibility of a decrease in the accuracy of image processing is reduced.

[0117] Further, according to the image processing apparatus 1, the wireless communication module 31 does not overlap the display module 50 in the direction orthogonal to the fourth substrate 104, and thus, the possibility of a decrease in reception sensitivity due to the display module 50 is reduced.

[0118] Improving the operability and convenience for the user is also one of the problems. In the image processing apparatus 1 of the present embodiment, the first substrate 101 is provided between the third substrate 103 and the second substrate 102 in the Z-axis direction, the third substrate 103 is provided between the battery 70 and the first substrate 101, the battery 70 is located between the third substrate 103 and the fourth substrate 104, and the battery 70 overlaps the third substrate 103. Thus, according to the image processing apparatus 1, the second substrate 102, the first substrate 101, the third substrate 103, the battery 70, and the fourth substrate 104 are sequentially overlapped and arranged, and thus, the width of the housing 100 in the X-axis direction and the Y-axis direction can be made smaller than the height in the Z-axis direction. Thus, the user can easily recognize the position of the light-receiving element 21, and the operability of the image processing apparatus 1 is improved.

[0119] Further, according to the image processing apparatus 1, in the Z-axis direction, the opening portion 140 of the second substrate 102, the wavelength variable filter 20, and the light-receiving element 21 overlap, and the plurality of light-emitting elements 10 are arranged so as to surround the opening portion 140, and thus, the space required for the arrangement of the optical system is reduced, and thus, the housing 100 can be downsized.

[0120] Further, in the image processing apparatus 1, the operation section 32, the buzzer 34, and the light emitting module 33 which generate little heat hardly affect the communication quality, and thus, by disposing the operation section 32, the buzzer 34, and the light emitting module 33 on the fourth substrate 104 on which the wireless communication module 31 is disposed, the area of the fourth substrate 104 is effectively utilized. Further, the display module 50 which generates less heat than the first substrate 101, the second substrate 102, and the third substrate 103 has less influence on the communication quality, and thus, the fourth substrate 104 on which the wireless communication module 31 is disposed is also effectively used as a relay substrate which relays a signal for display to the display module 50. Therefore, according to the image processing apparatus 1, the housing 100 can be downsized, and the operability of the user can be improved.

[0121] Further, in the image processing apparatus 1, the operation section 32 disposed on the fourth substrate 104, the area Al of the second substrate 102 on which the plurality of light emitting elements 10 are disposed, and the light receiving element 21 overlap on the optical axis of the light receiving element 21, and thus, when the user operates the operation section 32, a force is directly applied to the optical axis of the light receiving element 21. Therefore, according to the image processing apparatus 1, when the user operates the operation section 32, the optical axis of the light receiving element 21 is less likely to shake or shift with respect to the image IMG of the processing target, and the probability of obtaining normal data can be improved.

[0122] For example, when the operation section 32 is a physically displaced button, the operation section 32 is physically displaced by the user's operation, and thus, it can be reliably recognized that the user has operated, and on the other hand, although a large force is applied by the user's operation, the optical axis of the light receiving element 21 is less likely to shake or shift.

[0123] Further, for example, when the operation section 32 is an electrostatic capacitance type button, the operation is detected by the user touching the operation section 32, and thus, the force applied by the user's operation is small, and the optical axis of the light receiving element 21 is less likely to shake or shift.

[0124] Further, according to the image processing apparatus 1, since the operation section 32 is disposed at the central portion in the short side direction of the fourth substrate 104, the user easily operates, and the operability is improved. Further, since the operability is improved, when the user operates the operation section 32, the optical axis of the light receiving element 21 is less likely to shake or shift with respect to the image IMG of the processing target.

[0125] Further, according to the image processing apparatus 1, the user can recognize that the operation section 32 has been operated according to the light emission state of the light emitting module 33 even if a large force required or more is not applied, and thus, the amount of shaking or shifting of the optical axis of the light receiving element 21 is reduced, and the probability of obtaining normal data can be improved.

[0126] Further, according to the image processing apparatus 1, the user can recognize that the operation failure has occurred through the buzzer sound, and quickly re-perform the operation of the operation section 32, so that the convenience of the user is improved.

[0127] Further, according to the image processing apparatus 1, the user can recognize that the operation failure has occurred through the buzzer sound, and quickly re-perform the operation of the operation section 32, so that the convenience of the user is improved.

[0128] Improvement of maintainability is also one of the problems. In the image processing apparatus 1 of the present embodiment, the light-receiving element 21, the plurality of light-emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation section 32 are respectively provided on different substrates. Therefore, according to the image processing apparatus 1 of the present embodiment, when a failure occurs in any one of the light-receiving element 21, the plurality of light-emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation section 32, only one substrate needs to be replaced, and the other three substrates do not need to be replaced, so that the maintainability is good.

[0129] Further, according to the image processing apparatus 1, since the light-emitting element driving circuit 11 and the plurality of light-emitting elements 10 are provided on the second substrate 102, when a failure occurs in at least one of them, the second substrate 102 can be replaced with a substrate in which another light-emitting element driving circuit and another light-emitting element are combined and the characteristics are checked, so that the maintainability is good.

[0130] Further, according to the image processing apparatus 1, since the light-receiving element 21 and the photoelectric conversion circuit 22 are provided on the sub-substrate 113 of the first substrate 101, when a failure occurs in at least one of them, the sub-substrate 113 of the first substrate 101 can be replaced with a substrate in which another light-receiving element and another photoelectric conversion circuit are combined and the characteristics are checked, so that the maintainability is good.

[0131] As described above, according to the image processing apparatus 1 of the present embodiment, at least one of various problems that are easily caused since the battery 70 is provided and the image processing apparatus 1 can be carried or act as a single body can be solved.

[0132] The present application is not limited to the present embodiment, and various modifications can be made within the scope of the gist of the present application.

[0133] For example, as the image processing apparatus to which the present application is applied, a color measurement apparatus is exemplified in the above-described embodiment, but the present application can be applied to various image processing apparatuses having a function of processing an image, in addition to the color measurement apparatus. As an example of the image processing apparatus to which the present application can be applied, for example, a mobile terminal such as a smartphone, a portable printer, a portable scanner, a portable display apparatus, a digital camera, and the like can be exemplified.

[0134] The above describes the present embodiment or the modified example, but the present application is not limited to these present embodiment or the modified example, and can be implemented in various ways without departing from the gist thereof. For example, each of the above-described embodiments and the modified examples can be appropriately combined.

[0135] The present application includes configurations substantially the same as those described in the embodiments, such as configurations having the same functions, methods, and results, or configurations having the same objects and effects. In addition, the present application includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. In addition, the present application includes configurations that can achieve the same effects as the configurations described in the embodiments or configurations that can achieve the same objects. In addition, the present application includes configurations in which publicly known technologies are added to the configurations described in the embodiments.

[0136] The following can be derived from the above-described embodiments and the modified examples.

[0137] One embodiment of an image processing apparatus has:

[0138] a light-receiving element;

[0139] a light-emitting element;

[0140] a battery;

[0141] a power supply circuit electrically connected to the battery;

[0142] a first substrate provided with the light-receiving element;

[0143] a second substrate provided with the light-emitting element;

[0144] a third substrate provided with the power supply circuit; and

[0145] a housing that accommodates the first substrate, the second substrate, and the third substrate,

[0146] the closer the portion of the battery that opposes the first substrate, the second substrate, and the third substrate is to the first substrate, the second substrate, and the third substrate, the smaller the cross-sectional area.

[0147] In the image processing apparatus, the cross-sectional area of the portion of the battery that opposes the first substrate, the second substrate, and the third substrate is small, and thus, compared to a case in which a battery having a cuboid shape is arranged, the gap between the battery and the first substrate, the second substrate, and the third substrate is large. Therefore, according to the image processing apparatus, heat from the first substrate, the second substrate, and the third substrate each of which is provided with a light-receiving element, a light-emitting element, and a power supply circuit that can be a heat source is easily diffused, and heat dissipation is improved.

[0148] In one embodiment of the image processing apparatus, it can be that:

[0149] The image processing apparatus has a fourth substrate,

[0150] The battery is located between the first substrate, the second substrate, the third substrate, and the fourth substrate.

[0151] According to the image processing apparatus, the battery located between the first substrate, the second substrate, the third substrate, and the fourth substrate functions as a thermal barrier, and heat generation of the first substrate, the second substrate, and the third substrate is difficult to be transmitted to the fourth substrate.

[0152] In one embodiment of the image processing apparatus, it can also be that:

[0153] The amount of heat generation of at least one of the first substrate, the second substrate, and the third substrate is greater than the amount of heat generation of the fourth substrate.

[0154] In the image processing apparatus, the components having relatively large amounts of heat generation are arranged on the first substrate, the second substrate, and the third substrate having high heat dissipation, and the components having relatively small amounts of heat generation are arranged on the fourth substrate which is less likely to be affected by heat. Therefore, according to the image processing apparatus, it is possible to improve heat dissipation while ensuring the capacity of the battery, and thus it is possible to continuously operate for a long time while ensuring a certain quality.

[0155] In one embodiment of the image processing apparatus, it can also be that:

[0156] The image processing apparatus has a wireless communication module.

[0157] The wireless communication module is provided on the fourth substrate.

[0158] In the image processing apparatus, the wireless communication module is provided on the fourth substrate, and heat from the first substrate, the second substrate, and the third substrate each of which is provided with a light receiving element, a light emitting element, and a power supply circuit which are likely to be heat sources is less likely to be transmitted to the fourth substrate. Therefore, according to the image processing apparatus, the wireless communication module provided on the fourth substrate is less likely to be affected by a temperature rise of the first substrate, the second substrate, and the third substrate accompanying image processing, and the possibility of causing a malfunction is reduced, and thus it is possible to ensure stable communication quality.

[0159] In one embodiment of the image processing apparatus, it can also be that:

[0160] The image processing apparatus has an operation section,

[0161] The operation section is provided on the fourth substrate.

[0162] In the image processing apparatus, by disposing the operation section which hardly generates heat in the fourth substrate in which a constituent element which can cause a bad situation due to heat is disposed, the area of the fourth substrate is effectively utilized. Therefore, according to the image processing apparatus, it is possible to realize the miniaturization of the housing, and it is possible to improve the operability of the user.

[0163] In one embodiment of the image processing apparatus, it can be that:

[0164] The image processing apparatus has a buzzer,

[0165] The buzzer is disposed on the fourth substrate.

[0166] In the image processing apparatus, by disposing the buzzer which hardly generates heat in the fourth substrate in which a constituent element which can cause a bad situation due to heat is disposed, the area of the fourth substrate is effectively utilized. Therefore, according to the image processing apparatus, it is possible to realize the miniaturization of the housing, and it is possible to improve the operability of the user.

[0167] In one embodiment of the image processing apparatus, it can be that:

[0168] The image processing apparatus has a first processor,

[0169] The first processor is disposed on the first substrate.

[0170] According to the image processing apparatus, since the first processor which can be a heat source is disposed on the first substrate which has a good heat dissipation property, it is possible to continuously operate for a long time while ensuring a certain quality. In addition, in the image processing apparatus, since the first processor is disposed on the first substrate in which the light receiving element is disposed, a signal output from the light receiving element is transmitted to the first processor without passing through other substrates. Therefore, according to the image processing apparatus, it is possible to realize good noise resistance and responsiveness.

[0171] In one embodiment of the image processing apparatus, it can be that:

[0172] The image processing apparatus has a second processor,

[0173] The second processor is disposed on the third substrate.

[0174] According to the image processing apparatus, since the second processor which can be a heat source is disposed on the third substrate which has a good heat dissipation property, it is possible to continuously operate for a long time while ensuring a certain quality. In addition, in the image processing apparatus, the second processor is disposed on the third substrate in which the power supply circuit is disposed, and thus a signal output from the second processor is transmitted to the power supply circuit without passing through other substrates. Therefore, according to the image processing apparatus, it is possible to realize good noise resistance and responsiveness.

Claims

1. An image processing apparatus characterized by comprising: having: a light-receiving element; a light-emitting element; a battery; a power supply circuit electrically connected to the battery; a first substrate provided with the light-receiving element; a second substrate provided with the light-emitting element; a third substrate provided with the power supply circuit; and a housing in a rectangular parallelepiped shape that houses the first substrate, the second substrate, and the third substrate, the first substrate, the second substrate, and the third substrate are arranged in parallel, a surface of the housing opposite to the second substrate is set as a first surface, a long side direction of the first surface is set as a first direction, and a short side direction of the first surface is set as a second direction, the battery has a first edge in the first direction and a second edge in the second direction, and the first edge is longer than the second edge, a portion of the battery opposite to the first substrate, the second substrate, and the third substrate is closer to the first substrate, the second substrate, and the third substrate, and a cross-sectional area is smaller, and a cross-sectional shape of the cross-sectional area is a quadrilateral.

2. The image processing apparatus according to claim 1, wherein the image processing apparatus has a fourth substrate, the battery is located between the first substrate, the second substrate, and the third substrate and the fourth substrate.

3. The image processing apparatus according to claim 2, wherein a heat generation amount of at least one of the first substrate, the second substrate, and the third substrate is larger than a heat generation amount of the fourth substrate during a period in which wireless communication is not performed and an image processing operation is performed.

4. The image processing apparatus according to claim 2 or 3, wherein the image processing apparatus has a wireless communication module, the wireless communication module is provided to the fourth substrate.

5. The image processing apparatus according to claim 2, wherein the image processing apparatus has an operation unit, the operation unit is provided to the fourth substrate.

6. The image processing apparatus according to claim 2, wherein the image processing apparatus has a buzzer, the buzzer is provided to the fourth substrate.

7. The image processing apparatus according to claim 1, wherein the image processing apparatus has a first processor, the first processor is provided to the first substrate.

8. The image processing apparatus according to claim 1, wherein the image processing apparatus has a second processor, the second processor is provided to the third substrate. ​

Images