A grabbing device for silicon wafer production

Abstract

This invention discloses a gripping device for silicon wafer production, comprising: a connecting plate; several supports spaced apart from each other on the connecting plate; and several clamping mechanisms, including a first driving device, two supporting members, several finger grippers, and several auxiliary support devices. The finger grippers are provided with slots, and the finger grippers are respectively disposed on both sides of the two supporting members, with the slots on the finger grippers on both sides of each supporting member perpendicular to each other. The first driving device is inclinedly disposed on the supports to drive the two supporting members to move away from or towards each other. This invention uses a method simulating human fingers to fix the four corners of the silicon wafer to achieve the purpose of clamping, while simultaneously performing a correction action on the silicon wafer. Furthermore, it minimizes wear on the silicon wafer during contact, reducing the defect rate. The positioning requirements for silicon wafer placement are far lower than those of suction cup methods, thus reducing the difficulty of positioning and the dimensional accuracy requirements of the wafer placement trays and other mechanisms.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer manufacturing technology, and in particular to a gripping device for silicon wafer manufacturing. Background Technology

[0002] In photovoltaic applications, the most common method for gripping and transferring silicon wafers is using suction cups. However, this method can easily contaminate and leave marks on the silicon wafers, which can affect subsequent processing and negatively impact the finished product. In addition, it lacks the function of fixing the silicon wafers after they are placed on the carrier plate. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned technical problems and provide a gripping device for silicon wafer production.

[0004] The technical solution of the present invention: A gripping device for silicon wafer production, comprising:

[0005] First connecting plate;

[0006] Several brackets are arranged at intervals on the first connecting plate;

[0007] A plurality of clamping mechanisms are provided, one of which is mounted on a bracket. Each clamping mechanism includes a first driving device, two supporting members, a plurality of finger clamps, and a plurality of auxiliary support devices. Each finger clamp has a slot. The plurality of finger clamps are respectively mounted on both sides of the two supporting members, and the slots on the finger clamps on both sides of each supporting member are perpendicular to each other. The first driving device is inclinedly mounted on the bracket to drive the two supporting members to move away from or towards each other. The auxiliary support devices are used to guide and support the movement of the supporting members.

[0008] Preferably, the support member is provided with a first clearance groove and a second clearance groove.

[0009] Preferably, the auxiliary support device is inclinedly mounted on the bracket. The auxiliary support device includes a guide rail, two movable blocks, and a second connecting plate. The guide rail is mounted on the second connecting plate, and the movable blocks are slidably mounted on the guide rail.

[0010] Preferably, the device further includes several fixing devices and several lifting devices. The fixing devices are used to fix the silicon wafers onto the carrier plate, and the lifting devices are used to drive the fixing devices to be fixed on the carrier plate or away from the carrier plate.

[0011] Preferably, the fixing device includes a pin made of metal and a serrated block, the serrated block being disposed on the pin.

[0012] Preferably, the lifting device includes several second driving devices, several connecting parts, several sleeve rods, and several electromagnets. The second driving devices are used to drive the connecting parts to move up and down. The sleeve rods are disposed on the connecting parts, and the electromagnets are disposed inside the sleeve rods.

[0013] Preferably, the pin consists of an upper positioning pin and a lower positioning pin, which are detachably connected.

[0014] Preferably, the connector is provided with a plurality of wire clamps.

[0015] The beneficial effects of this invention are: This invention uses a method that simulates human fingers to fix the four corners of the silicon wafer to achieve the purpose of clamping, while simultaneously performing a correction action on the silicon wafer. When in contact with the silicon wafer, it minimizes wear on the silicon wafer, prevents contamination of the silicon wafer during gripping, and reduces the defect rate; multiple wafers can be gripped at one time, which can greatly improve production efficiency; the positioning requirements for placing silicon wafers are far lower than those of suction cups, thus reducing the difficulty of positioning and the dimensional accuracy requirements of the matching silicon wafer placement tray and other mechanisms. Attached Figure Description

[0016] Figure 1 This is a three-dimensional view of the silicon wafer grasping method of the present invention;

[0017] Figure 2 and Figure 3 This is a perspective view showing the connection of the bracket, clamping mechanism, fixing device, and lifting device in a preferred embodiment of the present invention;

[0018] Figure 4 This is a perspective view of the connection between the bracket and the clamping mechanism in a preferred embodiment of the present invention;

[0019] Figure 5 yes Figure 4 A magnified view of a portion of the image;

[0020] Figure 6 This is a bottom view of the connection between the bracket and the clamping mechanism in a preferred embodiment of the present invention;

[0021] Figure 7 This is a perspective view of the connection between the sleeve rod, electromagnet, pin, and serrated pressure block in a preferred embodiment of the present invention;

[0022] Figure 8 This is a cross-sectional view of the pin in a preferred embodiment of the present invention;

[0023] Figure 9 This is a cross-sectional view of the sleeve rod in a preferred embodiment of the present invention;

[0024] Figure 10 This is a perspective view of the wire clamp in a preferred embodiment of the present invention.

[0025] Reference numerals: First connecting plate 10, bracket 2, clamping mechanism 3, first driving device 31, support member 32, first clearance groove 321, second clearance groove 322, finger gripper 33, auxiliary support device 34, guide rail 341, moving block 342, second connecting plate 343, fixing device 4, pin 41, upper positioning pin 411, lower positioning pin 412, serrated pressure block 42, lifting device 5, second driving device 51, connector 52, wire clamp 521, sleeve rod 53, electromagnet 54, slide rail 55, slider 56, connecting rod 57. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Reference Figures 1 to 10 A gripping device for silicon wafer production, comprising:

[0028] First connecting plate 10;

[0029] Several brackets 2 are arranged at intervals on the first connecting plate 10;

[0030] Several clamping mechanisms 3 are provided, each clamping mechanism 3 is mounted on a bracket 2. Each clamping mechanism 3 includes a first driving device 31, two support members 32, several finger clamping rods 33, and several auxiliary support devices 34. Each finger clamping rod 33 is provided with a slot 331. Several finger clamping rods 33 are respectively mounted on both sides of the two support members 32, and the slots 331 on the finger clamping rods 33 on both sides of each support member 32 are perpendicular to each other. The first driving device 31 is inclinedly mounted on the bracket 2 to drive the two support members 32 to move away from or towards each other. The auxiliary support devices 34 are used to guide and support the movement of the support members 32. In this invention, the first connecting plate 10 is mounted on a robot composed of a robotic arm or modules. The gripping mechanism 3 is controlled by a PLC. The carrier plate is provided with clearance holes for the finger grippers 33. When the finger grippers 33 move with the first connecting plate 10 into the slot on the carrier plate where the silicon wafer is placed, the first driving device 31 moves and simultaneously drives the two support members 32 to move. The two support members 32 move closer to each other, and the two finger grippers 33 with two mutually perpendicular slots 331 on the support members 32 form a group, so that the four sides of the silicon wafer are respectively gripped by four fingers. Within the slot 331 on the clamping rod 33, the first connecting plate 10 moves to the right, causing the clamping mechanism 3 to grip the silicon wafer. The first driving device 31 is tilted and mounted on the support 2. When the first driving device 31 is activated, it can grip the silicon wafer in different directions using the two finger-shaped clamping rods 33 on the support member 32. When it is necessary to place the silicon wafer into the carrier plate, the clamping mechanism 3 moves the silicon wafer into the carrier plate placement slot. Simultaneously, the activation of the first driving device 31 drives the two support members 32 to move, causing them to move away from each other, thus placing the silicon wafer into the carrier plate. Specifically, the first driving device 31 is a pneumatic gripper, which is tilted at a 45-degree angle to the support 2.

[0031] As a preferred embodiment of the present invention, it may also have the following additional technical features:

[0032] In this embodiment, the support member 32 is provided with a first clearance groove 321 and a second clearance groove 322, and the finger clamp 33 is provided on the side of the first clearance groove 321 and the second clearance groove 322, so that the finger clamp 33 can fix the middle part near the silicon wafer, so that the silicon wafer will not fall off, and at the same time, the downward movement of the fixing device 4 will not interfere with the support member 32.

[0033] In this embodiment, the auxiliary support device 34 is inclinedly mounted on the bracket 2. The auxiliary support device 34 includes a guide rail 341, two moving blocks 342, and a second connecting plate 343. The guide rail 341 is mounted on the second connecting plate 343, and the moving blocks 42 are slidably mounted on the guide rail 341. The second connecting plate 343 is inclined at a 45-degree angle on the bracket 2. One end of the moving block 342 is connected to the support member 32, and the other end of the moving block 342 slides on the guide rail 341.

[0034] In this embodiment, there are also several fixing devices 4 and several lifting devices 5. The fixing devices 4 are used to fix the silicon wafers on the carrier plate, and the lifting devices 5 are used to drive the fixing devices 4 to be fixed on the carrier plate or away from the carrier plate.

[0035] In this embodiment, the fixing device 4 includes a pin 41 and a serrated block 42 made of metal. The serrated block 42 is disposed on the pin 41. The carrier plate is also provided with a pin hole, and a magnet is disposed in the pin hole. The pin 41 is a stainless steel pin. When it is necessary to place the silicon wafer into the carrier plate, the lifting device 5 moves with the first connecting plate 10, the clamping mechanism 3 places the silicon wafer onto the carrier plate, the second driving device 51 drives the connecting piece 52 to move to the right, so that the pin 41 is inserted into the pin hole of the carrier plate, the electromagnet 54 is de-energized, and the sleeve rod... As the first connecting plate 10 moves to the left, the magnet attracts the pin 41, and the serrated pressure block 42 makes slight contact with the silicon wafer on its side, preventing the silicon wafer from falling off the carrier plate during vertical coating. The serrated pressure block 42 also reduces the area of ​​the silicon wafer being pressed, thereby increasing the overall coating area of ​​the silicon wafer. When it is necessary to remove the silicon wafer, the sleeve rod 53 moves to the right with the first connecting plate 10, the electromagnet 54 is energized to attract the pin 41, the pin 41 is pulled out from the pin hole, and the clamping mechanism 3 clamps the silicon wafer and moves to the left with the first connecting plate 10 to remove the silicon wafer.

[0036] In this embodiment, the lifting device 5 includes several second driving devices 51, several connecting parts 52, several sleeve rods 53, and several electromagnets 54. The second driving devices 51 are used to drive the connecting parts 52 to move up and down. The sleeve rods 53 are disposed on the connecting parts 52, and the electromagnets 54 are disposed inside the sleeve rods 53. Specifically, the second driving device 51 is a cylinder, and there are two of them; the bracket 2, clamping mechanism 3, and lifting device 5 are three in number. The lifting device 5 also includes several slide rails 55, several sliders 56, and connecting rods 57. The number of connecting parts 52 and connecting rods 57 in the lifting device 5 is determined according to the actual number of silicon wafers placed on the carrier. The left and right lifting devices 5 have two connecting parts 52 and zero connecting rods 57. The second driving device 51 is set on the bracket 2. The second driving device 51 drives the connecting parts 52 to move, and then drives the sleeve rod 53 to move. The middle lifting device 5 has three connecting parts 52 and one connecting rod 57. The connecting rod 57 connects the three connecting parts 52. The second driving device 51 drives the connecting rod 57 to move, and then drives the connecting parts 52 to move. The sliders 56 are set on the bracket 2, and the slide rails 55 are set on the connecting parts 52.

[0037] In this embodiment, the pin 41 is composed of an upper positioning pin 411 and a lower positioning pin 412. The upper positioning pin 411 and the lower positioning pin 412 are detachably connected by bolts. Both the upper positioning pin 411 and the lower positioning pin 412 are provided with annular grooves, and the serrated pressure block 42 is sleeved in the annular grooves.

[0038] In this embodiment, the connector 52 is provided with a plurality of wire clamps 521 to centrally fix the wires of the plurality of electromagnets 54. The wire clamps 521 are U-shaped and have through holes on both sides.

[0039] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A gripping device for silicon wafer production, characterized in that, include: First connecting plate (10); Several brackets (2) are arranged at intervals on the first connecting plate (10); Several clamping mechanisms (3) are provided, one of which is mounted on a bracket (2). The clamping mechanism (3) includes a first driving device (31), two support members (32), several finger clamps (33), and several auxiliary support devices (34). The finger clamps (33) are provided with slots (331). Several finger clamps (33) are respectively mounted on both sides of the two support members (32), and the slots (331) on the finger clamps (33) on both sides of each support member (32) are perpendicular to each other. The first driving device (31) is inclinedly mounted on the bracket (2) to drive the two support members (32) to move away from or closer to each other. The auxiliary support devices (34) are used to guide and support the movement of the support members (32). The device comprises several fixing devices (4) and several lifting devices (5). The fixing devices (4) are used to fix the silicon wafers on the carrier plate. The lifting devices (5) are used to drive the fixing devices (4) to be fixed on the carrier plate or away from the carrier plate. The fixing devices (4) include pins (41) and serrated blocks (42) made of metal. The serrated blocks (42) are disposed on the pins (41). The lifting devices (5) include several second driving devices (51), several connecting parts (52), several sleeves (53) and several electromagnets (54). The second driving devices (51) are used to drive the connecting parts (52) to move up and down. The sleeves (53) are disposed on the connecting parts (52). The electromagnets (54) are disposed inside the sleeves (53).

2. The gripping device for silicon wafer production according to claim 1, characterized in that: The support member (32) is provided with a first clearance groove (321) and a second clearance groove (322).

3. The gripping device for silicon wafer production according to claim 1, characterized in that: The auxiliary support device (34) is inclinedly mounted on the bracket (2). The auxiliary support device (34) includes a guide rail (341), two moving blocks (342) and a second connecting plate (343). The guide rail (341) is mounted on the second connecting plate (343), and the moving blocks (342) are slidably mounted on the guide rail (341).

4. The gripping device for silicon wafer production according to claim 1, characterized in that: The pin (41) consists of an upper positioning pin (411) and a lower positioning pin (412), which are detachably connected.

5. The gripping device for silicon wafer production according to claim 1, characterized in that: The connector (52) is provided with a plurality of wire clamps (521).

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