Silicon wafer chuck (single pin)
CN309970194SActive Publication Date: 2026-05-08WUXI SONGYU TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- WUXI SONGYU TECH CO LTD
- Filing Date
- 2025-08-26
- Publication Date
- 2026-05-08
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Figure 000007_ABST
Abstract
1. Name of the designed product: Silicon wafer chuck (single insertion). 2. Use of the designed product: Used for sucking and inserting single wafer in ALD automation. 3. Design points of the designed product: In shape. 4. Picture or photo showing the design points: Fig. 1.
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