Loading Module for CVD Reactor

Abstract

The invention relates to a device for processing one or more substrates (19), the device having one or more processing modules (3, 3', 3"), each of which has a processing chamber (20) for accommodating a base (10), the device also having a gripping element (9) for gripping a transport module (2) having a base (10), the device also having a storage module (21) with a plurality of coolable storage positions (5), the device also having a loading and unloading lock chamber (4), through which the base (10) can be transferred from the outside to a handling space (22) of the transport module (2), and the device also having a loading module (1), in which the base (10) having one or more substrates (19) can be loaded and unloaded. In order to arrange the multiple modules of the device in a space-saving manner, it is proposed that the loading module (1), the loading and unloading lock chamber (4) and the storage module (21) are arranged vertically one on top of the other.

Description

Technical Field

[0001] The present invention relates to a device for processing one or more substrates or other objects, the device having one or more processing modules, each of the processing modules having a processing chamber for receiving a susceptor, the device further having a gripping element for gripping an object, such as a transfer module having a susceptor, the device further having a storage module having a plurality of coolable or heatable storage positions, in particular susceptor storage positions, the device further having a load lock chamber through which the object, such as a susceptor, can be transferred from the outside into the handling space of the transfer module, and the device further having a loading module in which an object, such as a susceptor, can be loaded with one or more substrates in the loading module.

[0002] The present invention also relates to a device composed of a storage module, a load lock chamber and a loading module, the storage module having a plurality of coolable storage positions, through which an object, such as a susceptor, can be transferred from the outside into the handling space of a transfer module, and in the loading module an object, such as a susceptor, can be loaded or unloaded with one or more substrates in the loading module.

[0003] The present invention also relates to a method for loading and unloading the processing chamber of a CVD (chemical vapor deposition) reactor of such a device. Background Art

[0004] Document EP 1 124 252A1 describes a device for processing substrates, which has a plurality of processing chambers, a load lock chamber and a storage module. Substrates can be transferred between the processing chambers, the load lock chamber and the storage module by a gripping element arranged in the transfer module. A plurality of storage modules and load lock chambers are arranged vertically one above the other.

[0005] Document US 6192601 B1 describes a device having a plurality of CVD reactors, which are arranged around a handling space and each have an opening facing in the direction of the handling space. A gripping element is arranged in the handling space, and through the gripping element, substrates can be transferred into the processing chambers of the CVD reactors. An intermediate memory is provided, in which coated substrates can be temporarily stored.

[0006] Document DE 102013101777 A1 describes a device for loading and unloading a CVD device. A susceptor supporting a substrate can be transferred into and out of the processing chamber of a CVD reactor by a gripping element.

[0007] Document WO 2011 / 138315 A1 describes a warehouse for storing a plurality of susceptors, which can be transferred into the processing chamber of a CVD reactor by means of gripping elements, wherein the warehouse has a plurality of susceptor storage positions arranged one above the other.

[0008] Document CN 102212877 B describes a device for processing a susceptor, which is used to transfer the susceptor from a susceptor storage position into the processing chamber of a CVD reactor.

[0009] Document CN 207418863 U describes a device for storing susceptors, which has chambers arranged one above the other, wherein a cooling element is provided for cooling the chambers or the susceptors arranged in the chambers. Summary of the Invention

[0010] The technical problem to be solved by the present invention is to improve the aforementioned device in terms of the space requirement of the device, and in particular to more simply operate the susceptor in such a device.

[0011] The above technical problem is solved by the present invention provided in the claims, wherein the dependent claims not only show advantageous improvement schemes of the present invention claimed in the claims, but also show independent solutions to the above technical problem.

[0012] First and essentially it is proposed that the loading chamber be arranged vertically above the loading and unloading lock chamber and the storage module. Together with the loading and unloading lock chamber and the storage module, it forms an integral assembly that can be separated from the transfer module. Furthermore, it is proposed that the loading module, the loading and unloading lock chamber, and the storage module be arranged vertically stacked on top of each other. The effect of this design solution is that these three components, namely the loading module, the loading and unloading lock chamber, and the storage module, require the same vertical area. The vertical area required by these modules is equal to the largest base area among the three modules. In a preferred design solution, the loading module is arranged at the top. The loading module can be designed as a glove box. The loading module has a support element on which an object can be placed. The object is especially a base. The base especially forms a disk-shaped graphite plate, and the base can have storage positions for one or more substrates on its upper side. One or more substrates can have a disk shape. The storage position can be a recess in the upper side of the base. The lower side of the base can be configured for optimizing heat transfer. However, the base can also have a planar profile different from circular, for example, polygonal. The base can also have a sector shape, such that multiple bases complement to form a circle. In this base design solution, multiple bases can be used in the processing chamber simultaneously. The loading and unloading lock chamber can be arranged immediately below the loading module. However, it can also be stipulated that the storage module be arranged immediately below the loading module. However, the storage module can also be arranged below the loading and unloading lock chamber. Furthermore, it can be stipulated that the storage module has multiple base storage positions. It can also be stipulated that the loading and unloading lock chamber be arranged between two base storage positions. The loading and unloading lock chamber has an opening pointing towards the outside of the device, and the opening can be closed by a gate. The base can be transferred from the outside through the opening into a system preferably having an ultra-pure gas environment. For this purpose, the space of the loading and unloading lock chamber can be flushed with ultra-pure gas and, if necessary, can also be evacuated. The ultra-pure gas can be heated if necessary so that it has a temperature higher than room temperature. The loading and unloading lock chamber has an opening towards the handling space, which can also be closed by a gate. The two gates cannot be opened simultaneously, whereby the loading and unloading lock chamber fulfills its lock chamber function. Each of the one or more base storage positions has a chamber that opens towards the handling space. The opening does not require a gate, but can be closed by an air curtain. However, it can also be stipulated that the opening can be closed by means of a gate. The storage module has a temperature control device, such as a cooling device, which has, for example, coolant channels or coolant pipelines, and the cooled coolant flows through the coolant channels or coolant pipelines. The temperature control device is arranged such that the heat of the base arranged on the base storage position can be removed through the temperature control device. However, heat can also be input to the base through the temperature control device designed as a heat source. In particular, it is stipulated that the storage module has multiple base storage positions, and each base storage position has a cooling element through which heat can be removed from the substrate in the chamber of the base storage position.The transfer module with a handling space is preferably arranged at the central position of the device. The planar contour of the transfer module can be a polygonal planar contour. One or more processing modules are adjacent to one or more polygonal edges of the planar contour of the transfer module. The processing modules are respectively constituted by CVD reactors. However, the processing module can also be a storage module or a cleaning module or a drying module, in which objects, such as a pedestal or a top cover of a processing chamber, can be cleaned or dried. On other polygonal edges of the planar contour of the transfer module, a device composed of a loading module, a load lock chamber, and a storage module is adjacent. The device forms a unit in space, and the unit can be separated from the transfer module for maintenance purposes. A gripping element is arranged in the handling space of the transfer module. The gripping element is a device composed of a gripping head, one or more arms, and a central shaft. The gripping head is designed such that the gripping head can grip the pedestal, and the arms can swing relative to each other, and one of the arms is rotatably fixed on the central shaft. The gripping element can have one or more gripping heads. It can relate to a teaching tool. The pedestal, the top plate, or other objects used in manufacturing semiconductor layers and especially in CVD reactors can be transferred by the gripper. The gripping element can also have sensors. In particular, it is stipulated that the device composed of the gripping head and the arms can be displaced vertically along the central shaft. The central shaft can be a rotating shaft. However, the central shaft can also be a bearing device, on which a horizontally displaceable slide rail is provided, and one of the arms is supported on the slide rail. A plurality of separately driven slide rails arranged one above the other can be provided. The central shaft can also be designed as a telescopic member. The gripping head can be arranged on a plurality of arms connected to each other by hinges. However, instead of arms connected to each other by hinges, the gripping element can also have telescopic arms or a linearly slidable head. The gripping head can especially move in a plane or in space in the form of a stage. The gripping arm especially has nested arm elements, so that the arm can be linearly extended or shortened. By the vertical displacement of the gripping element, the gripping head can extend into the openings of the load lock chambers, the openings of the loading module, and the storage positions, such as the pedestal storage positions, arranged one above the other vertically, so as to transfer the pedestal through these openings. The gripping element can be controlled by an electronic control device. For this purpose, an electrical servo drive is especially provided, and through the servo drive, the gripping head can be displaced vertically and horizontally. Each of the one or more CVD reactors has an opening that can be closed by a gate, and through these openings, the substrate can be transferred into the processing chamber of the CVD reactor by means of the gripping element. The aforementioned gate can also be manipulated by an especially electrical servo drive to close and open the opening. Instead of an electrical servo drive, a pneumatic or hydraulic drive can also be used.

[0013] By means of the method according to the present invention, a method for loading and unloading the processing chamber of a CVD reactor can be carried out, or additionally a processing process, such as a substrate processing process, can be implemented in one or more CVD reactors, such that the susceptor taken out of the processing chamber is cooled before taking out the substrate or heated before or after processing. One or more substrates can be loaded onto the susceptor in the loading module. This can be achieved manually or automatically. In the first case, the loading chamber can be designed as a glove box. In the second case, a loading automation device can be provided in the loading chamber. The susceptor loaded with at least one substrate is thus transferred from the opening of the loading module into the handling space by means of a gripping element. The susceptor taken out of the loading module can be temporarily stored at the susceptor storage position or directly transferred into the processing chamber of the CVD reactor, where one or more substrates received by the susceptor are processed. If the susceptor is first temporarily stored at the susceptor storage position, the susceptor is subsequently transferred into the processing chamber by means of a gripping element, where one or more substrates are processed. At this time, one or more coatings can be deposited on one or more substrates. This preferably relates to an MOCVD (metalorganic chemical vapor deposition) process, in which III-V main group coatings are deposited on the substrate by means of raw materials of the III and V main groups. It preferably relates to GaN layers or other layers having Ga, Al, In, such as P, N or As layers. The processing implemented in the processing module can also relate to a cleaning process, a storage process or a quenching process. It can also relate to a "fingerprinting process", in which certain data from the reaction chamber are collected for the digitization of the physical device state. The processing process is preferably carried out at a first elevated temperature of especially more than 500 °C, more than 700 °C or more than 1000 °C. After the processing process, cooling of the susceptor can be carried out in the processing chamber. It is especially provided that the susceptor is only cooled to a second elevated temperature, which is preferably more than 500 °C. At the second elevated temperature, the susceptor is taken out of the processing chamber by means of a gripping element. For this purpose, an inert gas atmosphere, such as H 2 or N 2 atmosphere exists in the handling space and the space adjacent to the handling space. The susceptor taken out of the CVD reactor at the second elevated temperature is first transferred to the susceptor storage position, where the susceptor is discharged of heat by means of a cooling element for such a long time until the susceptor reaches a cooling temperature of, for example, not exceeding 100 °C. This cooled susceptor can subsequently be transferred into the storage module by means of a gripping element, where the coated substrates can be taken off the susceptor. The same processing steps can be implemented respectively in the processing chambers of a plurality of CVD reactors. However, it is also provided that different processing steps are implemented in a plurality of CVD reactors. It can be provided that the susceptors loaded with one or more substrates are only transferred into the processing chambers respectively. Subsequently, the substrates of a plurality of susceptors are subjected to the same or different processing processes to a certain extent in parallel in different CVD reactors.

[0014] With the device and method according to the present invention, not only can the susceptor be transferred, but also other components, such as the top plate or cover plate of the intake mechanism, can be transferred. Thus, the foregoing embodiments are applicable not only to the susceptor in this sense, but also to other components of the MOCVD reactor or to multiple susceptors that are sequentially or simultaneously transferred into the processing chamber, where the substrates supported by the susceptor are heat-treated. In particular, it is provided to transfer the transfer ring, the substrate holder, the wall components of the processing chamber or similar components. Instead of the CVD reactor, other types of reactors for cleaning objects can also be provided. For this purpose, a cleaning gas can be supplied into the processing chamber, and the cleaning gas can exert a corrosive effect. The components processed by the device according to the present invention can be not only the susceptor, the top plate or other components of the CVD reactor, but also components that do not directly belong to the CVD reactor, such as teaching tools or portable sensors for collecting data during a defined time period and maintenance operations.

[0015] In the foregoing embodiments, the openings for storing bits, in particular susceptor storage bits, are open. However, these openings can also be closed by gates. Furthermore, it can be provided that these openings are provided with an air curtain such that the air flow is designed to flow transversely to the transfer direction of the object. The chamber of the storage bit is then isolated from the handling space by the air curtain. Description of the Drawings

[0016] The embodiments of the present invention will be described below in conjunction with the drawings. In the drawings:

[0017] Figure 1 In a cross-sectional view of the device for processing substrates, the loading module 1, the transfer module 2 and the processing module 3 are shown, and

[0018] Figure 2 In a longitudinal cross-sectional view of such a device for processing substrates, the loading module 1, the transfer module 2 and a total of three processing modules 3, 3', 3" are shown. Detailed Description of the Invention

[0019] Figure 2 A plan view showing an embodiment of the present invention is presented. The transfer module 2 has a rectangular plan view. The transfer module is adjacent to the loading module 1 through a rectangular edge and adjacent to the processing module 3, which is a CVD reactor, through another rectangular edge. Optionally, another rectangular edge of the loading module 1 can be adjacent to Figure 2 the other processing modules 3', 3" shown in dashed lines. These processing modules 3', 3" can also be CVD reactors. In addition to such CVD reactors, there can also be other modules connected to the prime device for processing or storing susceptors, cover plates or similar components, so that objects can be cleaned, dried or stored.

[0020] Figure 1Schematically shown is a loading module 1 connected to the handling space 22 of a transfer module 2, the loading module being arranged above a loading and unloading lock chamber 4, wherein the loading and unloading lock chamber 4 is arranged above a storage module 21. The loading module 1 has a support element 8 on which a disk-shaped base 10 can be placed, and the base is made of, for example, graphite or coated graphite. A substrate 19 can be placed on the base 10. For this purpose, storage recesses (not shown) for respectively receiving the substrate 19 are provided on the upper side of the base 10.

[0021] The loading chamber 18 of the loading module 1 can be designed as a glove box so that the substrate 19 can be manually placed in the storage recess. An opening 11' is provided herein, and the opening 11' can be closed by a gate 11. The gripping head of a gripping element 9 can extend into the loading chamber 18 through the opening 11' to obtain the base 10 arranged therein.

[0022] The loading and unloading lock chamber 4 has an outwardly open opening 13' that can be closed by a gate 13 and an opening 12' directed towards the handling space 22, and the opening 12' can be closed by a gate 12. The base 10 can be placed from the outside into the handling space 22 or brought from the handling space 22 to the outside by means of the loading and unloading lock chamber 4. The loading and unloading lock chamber 4 can be flushed with an inert gas by means of a flushing gas device (not shown).

[0023] Below the loading module 1 and also below the loading and unloading lock chamber 4 in the present embodiment, there are respectively provided devices consisting of a plurality of storage positions 5 for the base. The devices relate to a storage module 21 having a plurality of base storage positions 5, and these base storage positions are designed identically to each other in the present embodiment. Each base storage position 5 has a chamber 7 that is open towards the handling space 22, and the support element 8 is located in the chamber 7. The base 10 can be placed on the support element, and the support element has a temperature control element 6 to control the temperature of the chamber 7 or the base 10 arranged in the chamber 7. The temperature control element can be a cooling element to cool the base. However, the temperature control element can also be a heating element to heat the base 10, especially to dehumidify the base.

[0024] The susceptor is taken out from the susceptor storage position 5 or the loading chamber 18, and the susceptor is transferred through the opening 14' by the gripping element 9 into the interior of the processing modules 3, 3', 3", and the opening 14' can be closed by the shutter 14. In the processing module, the susceptor 10 is placed on the support element 17, and the support element 17 can be rotated about a vertical axis so that the susceptor 10 can be rotated when processing the substrate. The processing chamber 20 is located above the susceptor 10, and the chamber is bounded upward by the processing chamber top cover 16. The processing chamber top cover 16 can be a cover plate of the gas inlet mechanism 15 designed as a showerhead and not shown in the drawing. The cover plate can also be gripped by the gripping element for replacing the cover plate. The cover plate can be temporarily stored at the storage position 5 and transported outwards through the loading and unloading lock chamber 4.

[0025] The processing gas can be introduced into the processing chamber 20 through the gas inlet mechanism 15 shown as a central gas inlet element in the drawing. With the heating device arranged below the susceptor 10, the susceptor 10 or the substrate 19 supported by the susceptor is heated to a processing temperature above 500°C. After the processing is completed, the substrate 10 is first cooled to a temperature that may be above 500°C. However, this temperature is lower than the processing temperature. The processing temperature can be lower than 600°C. However, the temperature to which the susceptor is cooled can also be in the range of 400°C to 600°C. The shutter 14 is opened when the temperature rises. The susceptor 10 is taken out from the processing chamber 20 by the gripping element 9 and transferred to one of the susceptor storage positions 5, where the heat is discharged from the susceptor storage position by means of the cooling element 6 until the susceptor 10 reaches the cooling temperature, which can be less than 100°C, at which temperature the substrate 19 can be removed from the susceptor in the loading chamber 18. However, this cooling temperature can also be less than 70°C or less than 50°C.

[0026] The loading chamber 18 can have a plurality of additional openings not shown, in particular lock chamber openings, through which the substrate can be taken outwards from the loading chamber 18 preferably flushed with an inert gas. Through these openings, the unprocessed substrate can also be placed into the loading chamber 18.

[0027] In particular, it is stipulated that Figure 1 the assembly shown on the left in

[0028] By means of the device according to the invention, a plurality of susceptors 10 can be successively processed in one or more processing modules 3, 3', 3", each of which is loaded with a plurality of substrates. For this purpose, the susceptors can be successively loaded with substrates and then directly placed in the processing chambers 20 of the CVD reactors 3, 3', 3" respectively, or first temporarily stored on the susceptor storage positions 5. For this purpose, it can be particularly provided that the number of susceptor storage positions 5 is at least equal to the number of processing modules 3, 3', 3" connected to the transfer module 2.

[0029] In an embodiment not shown, the susceptor 10 has a central recess or a sole storage position for storing large-sized substrates. The substrates can have a diameter of 300 mm or more and extend over the entire plane of the susceptor 10.

[0030] The above embodiments are used to illustrate the invention as a whole included in the application, which at least independently extends the prior art through the following combinations of features, wherein two, multiple or all combinations of features can also be combined with each other, namely:

[0031] A device, characterized in that the loading module 1, the loading and unloading lock chamber 4 and the storage module 21 are arranged vertically one above the other.

[0032] A device, characterized in that the gripping element 9 can move in a horizontal plane and vertically, and / or the gripping element is a device composed of a plurality of arms 23, 23' articulated to each other, and one of these arms 23' is rotatably fixed on an axis 24 in a horizontal plane and can be displaced vertically along the axis 24.

[0033] A device, characterized in that the storage position 5 is equipped with a temperature control element, such as a cooling element or a heating element, whereby the object 10 arranged on the storage position 5 can be cooled or heated.

[0034] A device, characterized in that the storage position 5 has a chamber 7, which is open towards the handling space 22 or can be separated from the handling space 22 by means of an air curtain.

[0035] A device, characterized in that the transfer module 2 has a polygonal contour, and a loading module 1, a storage module 21 connected to the loading module and a loading and unloading lock chamber 4 are arranged on one edge of the polygon, and processing modules 3, 3', 3" are arranged on at least one other edge of the polygon, wherein the processing modules 3, 3', 3" are also devices for storing, cleaning or temperature control of objects and / or are in the form of components of a CVD reactor.

[0036] A device, characterized in that the loading module 1, the loading and unloading lock chamber 4, and the storage module 21 are arranged vertically stacked on top of each other.

[0037] A method, characterized in that an object 10, for example a susceptor 10, is prepared in the loading module 1, and one or more substrates 19 can be loaded in the loading module. The object is transferred from the opening 11' of the loading module 1 into the transfer space 22 by means of a gripping element 9 and through the opening 14' of the CVD reactor 3 into the processing chamber 20. A processing step of heating the susceptor 10 to a first elevated temperature of at least 500 °C, in particular, is carried out in the processing chamber 20. After carrying out this processing step, the susceptor 10 is taken out of the processing chamber 20 through the opening 14' by means of the gripping element 9 at a second elevated temperature of at least 500 °C and placed on the storage position 5, where the object 10 is cooled by means of a cooling element 6. The object 10 is taken from the storage position 5 by means of the gripping element 9 after the cooling temperature is below 100 °C, in particular, and transferred into the loading module 1.

[0038] A method, characterized in that the object 10 taken from the loading module 1 by means of the gripping element 9 is temporarily stored on the storage position 5 before being transferred into the processing chamber 20 of the CVD reactors 3, 3', 3".

[0039] A method, characterized in that the same or different processing processes are respectively carried out in a plurality of CVD reactors 3, 3', 3", for example, a heat treatment is carried out or a coating, in particular the same layer or layer sequence, in particular the same layer sequence, is deposited on the surface of one or more substrates 19. Different objects 10 are successively transferred directly from the storage module 21 or from the loading module 1 into the respective processing chambers 20 by means of the gripping element 9, and before or after the processing process, the different objects are transferred into the chamber 7 of the storage position 5 for cooling or heating respectively.

[0040] All the disclosed features (by themselves and in combination with each other) have inventive significance or inventive value. In the disclosure document of the present application, the disclosure content of the affiliated priority text (prior application document) is also fully included. For this reason, the features in the priority text are also incorporated into the claims of the present application. The features of the dependent claims are improvement designs that have independent inventive significance or value for the prior art even without the technical features of the corresponding claims. In particular, divisional applications can be filed based on these dependent claims. The invention provided in each claim may additionally have one or more technical features provided in the foregoing description, in particular with reference numerals and / or in the list of reference numerals. The present invention also relates to some design forms in which individual technical features mentioned in the foregoing specification cannot be implemented. In particular, it can be recognized that these are unnecessary for each application purpose or can be replaced by other technically equally achievable devices.

[0041] List of Reference Numerals

[0042] 1 Loading Module

[0043] 2 Transfer Module

[0044] 3 Processing Module

[0045] 3’ Processing Module

[0046] 3” Processing Module

[0047] 4 Loading and Unloading Lock Chamber

[0048] 5 Storage Location

[0049] 6 Temperature Regulation Element, Cooling Element, Heating Element

[0050] 7 Chamber

[0051] 8 Support Element

[0052] 9 Gripping Element

[0053] 10 Base

[0054] 11 Gate

[0055] 11’ Opening

[0056] 12 Gate

[0057] 12’ Opening

[0058] 13 Gate

[0059] 13’ Opening

[0060] 14 Gate

[0061] 14’ Opening

[0062] 15 Intake mechanism

[0063] 16 Top cover of the processing chamber

[0064] 17 Support element

[0065] 18 Loading chamber

[0066] 19 Substrate

[0067] 20 Processing chamber

[0068] 21 Storage module

[0069] 22 Handling space

[0070] 23 Arm

[0071] 23’ Arm

[0072] 24 Axis

Claims

1. An apparatus for processing one or more substrates (19) placed on a base (10), the apparatus having a storage module (21), the storage module having a plurality of coolable or heatable storage positions (5) for respectively storing at least one base (10), the apparatus further having one or more processing modules (3, 3', 3") for processing one or more substrates (19), the processing modules respectively having a processing chamber (20) for receiving the base (10) stored in the storage module (21), the apparatus further having a loading and unloading lock chamber (4) through which the base (10) can be transferred from the outside into the handling space (22) of the transfer module (2), and the apparatus further having a loading module (1), the loading module having a loading cavity (18) in which the base (10) having one or more substrates (19) can be loaded and unloaded, the apparatus further having a gripping element (9) arranged in the handling space (22) of the transfer module (2), the gripping element being designed to transfer one of the plurality of bases (10) between the storage module (21), the processing chamber (20), the loading cavity (18) or the loading and unloading lock chamber (4), characterized in that, the loading cavity (18) is arranged vertically above the loading and unloading lock chamber (4) and the storage module (21) and together with the loading and unloading lock chamber (4) and the storage module (21) forms an integral assembly that can be separated from the transfer module (2).

2. The apparatus according to claim 1, characterized in that, the gripping element (9) is movable in a horizontal plane and vertically.

3. The apparatus according to claim 1, characterized in that, the gripping element (9) is a device composed of a plurality of arms (23, 23') articulated to each other, one of these arms (23') being rotatably fixed in a horizontal plane on an axis (24) and being displaceable vertically along the axis (24).

4. The apparatus according to claim 1, characterized in that, the storage position (5) is equipped with a temperature control element by means of which the object arranged on the storage position (5) can be cooled or heated.

5. The apparatus according to claim 4, characterized in that, the temperature control element is a cooling element or a heating element.

6. The apparatus according to claim 1, characterized in that, the storage position (5) has a chamber (7) that is open towards the handling space (22) or can be separated from the handling space (22) by means of an air curtain.

7. The apparatus according to claim 1, characterized in that, the transfer module (2) has a polygonal profile, and a loading module (1), a storage module (21) connected to the loading module, and a loading and unloading lock chamber (4) are arranged on one edge of the polygon, and processing modules (3, 3', 3") are arranged on at least one other edge of the polygon.

8. The apparatus according to claim 1, characterized in that, The processing module (3, 3', 3") is a device for storing, cleaning or temperature-adjusting an object and / or a component of a CVD reactor.

9. A device applied to the equipment according to any one of the preceding claims 1 to 8, the device comprising a storage module (21), a loading and unloading lock chamber (4) and a loading module (1), the storage module having a plurality of storage positions (5) that can be cooled or heated, an object can be transferred from the outside into the handling space (22) of the transfer module (2) through the loading and unloading lock chamber, and an object can be prepared in the loading module and / or one or more substrates (19) can be loaded or unloaded for the susceptor (10). Characterized in that The loading module (1), the loading and unloading lock chamber (4) and the storage module (21) are arranged vertically one above the other.

10. A method for loading and unloading the processing chamber (20) of a CVD reactor of the equipment according to any one of the preceding claims 1 to 8. Characterized in that An object can be prepared in the loading module (1) and / or one or more substrates (19) can be loaded for the susceptor (10), and is transferred into the handling space (22) through the opening (11') of the loading module (1) by means of a gripping element (9) and is transferred into the processing chamber (20) through the opening (14') of the CVD reactor, and a processing step of heating the susceptor (10) to a first elevated temperature is carried out in the processing chamber (20). After carrying out this processing step, at a second elevated temperature, the susceptor (10) is taken out of the processing chamber (20) through the opening (14') of the CVD reactor by means of the gripping element (9) and placed on the storage position (5), where the object is cooled by means of a cooling element (6). Wherein, after the object is below the cooling temperature, it is taken away from the storage position (5) by means of the gripping element (9) and transferred into the loading module (1).

11. The method according to claim 10. Characterized in that The first elevated temperature is at least 500 °C.

12. The method according to claim 10. Characterized in that The second elevated temperature is at least 500 °C.

13. The method according to claim 10. Characterized in that The cooling temperature is at most 100 °C.

14. The method according to claim 10. Characterized in that The object taken away from the loading module (1) by the gripping element (9) is temporarily stored on the storage position (5) before being transferred into the processing chamber (20) of the CVD reactor.

15. The method according to claim 10. Characterized in that The same or different processing processes are respectively carried out in a plurality of CVD reactors, wherein a heat treatment is carried out or a coating is deposited on the surface of one or more substrates (19). Among them, different objects are successively transferred into the respective processing chambers (20) directly from the storage module (21) or from the loading module (1) by means of the gripping element (9), and before or after the processing process, different objects are respectively transferred into the chambers (7) of the storage positions (5) for cooling or heating.

16. The method according to claim 15, characterized in that, a layer sequence or an identical layer sequence or identical layers are deposited on the substrate (19).

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