Immersion cooling infrastructure module with computing device form factor

Abstract

A removable immersion cooling infrastructure module can have the same form factor as one or more of the computing devices that are cooled by immersion cooling, enabling the immersion cooling infrastructure module to be installed and removed in the same simplified and efficient manner. Furthermore, the number of immersion cooling infrastructure modules can vary as needed, as the immersion cooling infrastructure modules and computing devices can be interchangeable within openings designed to accommodate the computing devices. The immersion cooling infrastructure module can include a filter, a pump that can circulate immersion cooling liquid through the filter, a power supply, and a controller, with the module receiving power, and optionally communications and other similar connections, from the same sources as the computing devices.

Description

Background Technology

[0001] Increasingly, computing capabilities no longer require physical co-location with the users using such capabilities. Instead, they can be supported by network computing hardware aggregated in large data centers physically distant from the users. This use of computing capabilities is often referred to as "cloud computing" and provides users with computing power typically supported by virtual machines hosted on a large amount of computing hardware, thus offering stability, redundancy, and high availability.

[0002] Modern data centers represent significant financial investments in both computing device hardware and the hardware of the related infrastructure systems that provide support for such computing devices. For example, in addition to the computing device hardware itself (which can include thousands of computing devices, storage devices, networking equipment, and other similar computing device hardware), data centers typically include climate control hardware, redundant power systems, physical security, and other similar infrastructure systems. Typically, the computing device hardware is housed in a physical structure called a "rack."

[0003] Computing devices generate heat as a byproduct of performing computer processing. In data centers, thousands of such devices can be crammed into a single space, generating potentially enormous amounts of heat that limit the amount of processing power. More specifically, in such instances, the processors of a data center's computing devices may be unable to operate at their maximum computing throughput levels beyond the data center infrastructure hardware's capacity to properly remove the heat generated. Because computing devices represent sunk costs, they can, to some extent, be used to perform greater processing power, which can then be sold to consumers, making the data center more profitable.

[0004] One approach to addressing the thermal challenges of operating high-performance computing devices, including in a data center context, could be to immerse some or all of the computing equipment in an immersion coolant that more efficiently removes heat from the processor and other similarly heat-generating components of the computing device. Immersion cooling techniques can include two-phase immersion cooling, where the immersion coolant transitions to a gaseous state at temperatures typically reached by related computing components such as central processing units and graphics processors. The phase change between liquid and gas via the immersion coolant absorbs more heat and thus allows for more efficient heat removal from the heat-generating components of the computing device. In some cases, a two-phase immersion cooling system can remove one or more orders of magnitude of heat from the heat-generating components of the computing device compared to a conventional air-cooling mechanism.

[0005] Unfortunately, the implementation of immersion cooling mechanisms can be costly. One source of increased cost can be the tank that can house the immersion cooling liquid and the computing devices cooled thereby. Such a tank can include pumps, filters, and other similar immersion cooling infrastructure, some of which can have limited reliability or limited useful life and thus can need repair or replacement, which can negatively impact the availability of the tank as a whole, damaging the computing devices cooled thereby, which can not be used for long periods of time. Because repair or replacement of such immersion cooling infrastructure can take a significant amount of time, it is common for a tank to be provided with redundant immersion cooling infrastructure to avoid the aforementioned downtime, but at the added cost of purchase and manufacturing. SUMMARY

[0006] A removable immersion cooling infrastructure module can house immersion cooling infrastructure, separating the infrastructure that can need repair or replacement from the immersion cooling tank itself, to facilitate repair or replacement of such infrastructure and avoid downtime of the immersion cooling infrastructure as a whole, and thus associated downtime of the computing devices cooled thereby. The immersion cooling infrastructure module can have the same form factor as one or more of the computing devices cooled by immersion cooling, enabling the immersion cooling infrastructure module to be installed and removed in the same simplified and efficient manner as the computing devices. Furthermore, the number of immersion cooling infrastructure modules can vary as needed, as the immersion cooling infrastructure modules and the computing devices can be interchangeable within an opening designed to house a computing device. The immersion cooling infrastructure module can include a filter to filter particulates, contaminants, and other similar unwanted materials from the immersion cooling liquid. The immersion cooling infrastructure module can also include a pump that can circulate the immersion cooling liquid through the filter. A power supply and controller can likewise be part of the immersion cooling infrastructure module, with the module receiving power, and optionally communication and other similar connections, from the same source as the computing devices. The physical size of the immersion cooling infrastructure module can be set to allow a computing device or other device to be installed alongside it within a single opening, or can include a computing device or computing device hardware within the space available on the immersion cooling infrastructure module.

[0007] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0008] Additional features and advantages will be made apparent from the following detailed description that proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0009] The following detailed description can be best understood in conjunction with the drawings, of which:

[0010] Figure 1 is a diagram of an exemplary immersion cooling system including an immersion cooling infrastructure module;

[0011] Figure 2 is a diagram of another exemplary immersion cooling system including an immersion cooling infrastructure module;

[0012] Figure 3 is a diagram of an exemplary immersion cooling infrastructure module having a computing device form factor;

[0013] Figure 4 is a diagram of an exemplary size of an exemplary immersion cooling infrastructure module having a computing device form factor;

[0014] Figure 5 is a diagram of another exemplary immersion cooling infrastructure module having a computing device form factor;

[0015] Figure 6 is a diagram of another exemplary immersion cooling system including a plurality of immersion cooling infrastructure modules;

[0016] Figure 7 is a flow diagram of an exemplary utilization of an exemplary immersion cooling infrastructure module having a computing device form factor; and

[0017] Figure 8 is a diagram of an exemplary computing device that can provide control over an exemplary acceleration rack adapter. DETAILED DESCRIPTION

[0018] The following description relates to immersion cooling infrastructure modules that can provide immersion cooling infrastructure within a computing device form factor to allow the immersion cooling infrastructure to be removable, separating the infrastructure that can need repair or replacement from the immersion cooling tank itself. The immersion cooling infrastructure modules can have the same form factor as one or more of the computing devices that are cooled by immersion cooling, enabling the immersion cooling infrastructure modules to be installed and removed in the same simplified and efficient manner as the computing devices. In addition, the number of immersion cooling infrastructure modules can vary as needed, as the immersion cooling infrastructure modules and the computing devices can be interchangeable within the openings designed to accommodate the computing devices. The immersion cooling infrastructure modules can include filters for filtering particulates, contaminants, and other similar undesirable materials from the immersion cooling liquid. The immersion cooling infrastructure modules can also include pumps that can circulate the immersion cooling liquid through the filters. Power and controllers can likewise be part of the immersion cooling infrastructure modules, with the modules receiving power, and optionally communications and other similar connections, from the same sources as the computing devices. The physical size of the immersion cooling infrastructure modules can be set to allow a computing device or other device to be installed alongside it within a single opening, or can include computing devices or computing device hardware within the space available on the immersion cooling infrastructure module.

[0019] As used in this application, the term "infrastructure module" refers to a physical structure of devices that provide resources used by a computing device, that are physically distinct and separate from the infrastructure module, and / or that improve the operating environment of the computing device, likewise, that are physically distinct and separate from the computing device. As specifically defined above, the resources and / or environmental improvements provided by an "infrastructure module" are provided to and primarily used by a computing device that is physically distinct and separate from the infrastructure module. Thus, as specifically defined above, the term "infrastructure module" does not include computing devices whose hardware only affects the resources and environment of a host computing device housing or otherwise contains such hardware, and whose impact beyond such a host computing device is only ancillary.

[0020] Reference Figure 1 An example system 100 is shown to provide context for the following description. The example system 100 includes a tank, such as example tank 110, that can hold an immersion cooling liquid, such as example immersion cooling liquid 120. The example system 100 can also include one or more computing devices, such as example computing devices 131 and 133, that can be at least partially, if not completely, immersed in the immersion cooling liquid 120 within the tank 110. As Figure 1As shown, heat from a computing device (such as exemplary computing device 131) can be absorbed by the immersion coolant 120, thereby removing heat generated by various components of exemplary computing device 131, such as the central processing unit, graphics processing unit, and other similar thermally charged computing hardware. If the exemplary immersion coolant 120 is a two-phase immersion coolant, absorbing heat from the thermally charged computing hardware of computing device 131 can enable the exemplary immersion coolant 120 to perform a liquid-to-gas transition (e.g., Figure 1 The phase change (shown in the bubbles) occurs. Such a phase change can absorb more heat and allows a two-phase immersion coolant to conduct heat away from the computing device more efficiently than a single-phase immersion coolant that does not change phase. According to one aspect, one or more radiators, such as the exemplary radiator 160 or other similar cooling devices, can be mounted near the top of the housing 110. As the immersion coolant evaporates due to the heat of the computing device, it can be cooled on the radiator (such as the exemplary radiator 160) and undergo a phase change back to liquid and precipitate back into the tank 110, as shown in the bubbles. Figure 1 The droplets shown are illustrated. The heat absorbed by a radiator such as the exemplary radiator 160 can then be further removed by conventional cooling mechanisms, such as ventilation, airflow, air conditioning, and other similar cooling mechanisms.

[0021] Such as Figure 1 The use of the illustrated immersion cooling device can leverage immersion cooling infrastructure to maintain optimal performance of the immersion cooling device. Such immersion cooling infrastructure may include a filter that filters the immersion coolant 120 to remove particulates, contaminants, and other similar undesirable elements, thereby preventing such undesirable elements from negatively impacting the performance of computing devices such as exemplary computing devices 131 and 133, the heat transfer capacity of immersion coolants such as the exemplary immersion coolant 120, or combinations thereof. The immersion cooling infrastructure may also include a pump or other similar liquid movement mechanism that can force liquid (such as the exemplary immersion coolant 120) through the aforementioned filter. Additional immersion cooling infrastructure may include power and control mechanisms for such pumps and filters, including sensing and monitoring devices.

[0022] Filters may require periodic and / or as-needed replacement. Additionally, pumps may also require periodic and / or as-needed servicing. According to one aspect, to facilitate the removal and replacement of immersion cooling infrastructure, such immersion cooling infrastructure can be encapsulated in immersion cooling infrastructure modules, which can have the same form factor as computing devices and can be installed in the same manner as those computing devices. For example, Figure 1The example system 100 shown shows an immersion cooling infrastructure module in the form of an example immersion cooling infrastructure module 300 that is installed within the same type of opening as the example computing devices 131 and 133.

[0023] More specifically, computing devices such as those in a data center are typically installed within a rack or other similar frame or support system that can house, support, and accommodate multiple computing devices such as the example computing devices 131 and 133. Air-cooled server racks can conform to various standards such as the EIA-310 standard, the IEC 60297 standard, and other similar standards. As will be appreciated by those skilled in the art, such standards typically define a rack frame that is 19 or 23 inches wide and has mounting holes to accommodate devices that are approximately 1.75 inches high in multiples. Computing devices designed to be installed in such racks are typically referenced based on the height of such devices as multiples of a "rack unit," often abbreviated to the letter "U." Thus, for example, a computing device can be referred to as a "1U," "2U," and so on. Further, the racks themselves are typically referenced based on the total height of the computing devices that can be installed in such racks, such as a "42U" or "48U" rack.

[0024] In immersion cooling installations, different standards can be established, but the principle remains the same in that a predefined measurement can define both the relevant size and shape of the opening into which a computing device is inserted, the computing device itself, and any associated accessories or connection mechanisms such as screws, clips, connectors, plugs, and other similar connection mechanisms. In Figure 1 Within the example system 100 shown, the example tank 110 shows a plurality of openings such as the example openings 141, 142, and 143 into which computing devices can be installed. For example, the example opening 141 is shown to include brackets, guides, or other similar structures in the form of structures 151 and 152 that can define the opening 141 and enable it to receive a computing device of an appropriate size. The example opening 141 can also include a connection 153 that can facilitate the provision of power to the computing device. The example connection 153 can also include network connections, peripheral connections, and other similar connections. As will be appreciated by those skilled in the art, the connections 153 can be wired or wireless, or a combination thereof. Figure 1 As shown, a computing device such as the example computing device 132 can be inserted into an opening such as the example opening 142 and, from there, can be installed within the tank 110 and made operable such as by providing power, network, and other similar capabilities via the connections facilitated by the opening 142. The openings such as the example openings 141, 142, and 143 can be built into the tank 110 or can be part of a removable upper structure that can be separated or at least separable from the tank 110.

[0025] According to one aspect, immersion cooling infrastructure modules, such as exemplary immersion cooling infrastructure module 300, can be of similar size and shape as computing devices, such as exemplary computing devices 131, 132, and 133. In this way, immersion cooling infrastructure modules, such as exemplary immersion cooling infrastructure module 300, can be easily installed and removed like one or more of the computing devices. Moreover, mechanisms used to install or remove computing devices, including automated mechanisms such as robotic arms, can be used to install or remove immersion cooling infrastructure modules without modification.

[0026] Immersion cooling infrastructure modules, such as exemplary immersion cooling infrastructure module 300, can be easily removed and subsequently reinstalled, which can facilitate repair or replacement of any immersion cooling infrastructure found therein. More specifically, immersion cooling infrastructure modules, such as exemplary immersion cooling infrastructure module 300, can be removed from an operating environment, such as from inside immersion cooling fluid 120 in tank 110, and moved to a more convenient location, such as a workbench, or even an off-site location, where repair or replacement of immersion cooling infrastructure components found therein can be completed more quickly and efficiently. Once such repair or replacement is completed, the immersion cooling infrastructure module can be put back into service, whether in the same tank from which it was removed, or in a different tank, such as a next subsequent tank in need of a new immersion cooling infrastructure module.

[0027] Another advantage can be that openings, such as exemplary openings 141, 142, and 143, can be standardized, and tanks 110 need not include any special or dedicated fittings, openings, or other similar devices for immersion cooling infrastructure, such as pumps, filters, electrical power, controllers, and other similar immersion cooling infrastructure. Thus, tanks, such as exemplary tank 110, can be commodity components, the price of which can be reduced through competition, but can remain compatible with different types of immersion cooling infrastructure, so long as such immersion cooling infrastructure is packaged within an immersion cooling infrastructure module, such as detailed herein. Similarly, competition between immersion cooling infrastructure manufacturers, such as pump manufacturers, filter manufacturers, and the like, can improve the quality or reduce the price of these components, and these components can be retrofitted onto existing tanks, such as exemplary tank 110, without the need to change or modify the tank. In this way, existing hardware, including computing hardware and overall cooling infrastructure, can benefit from updates to one or more specific immersion cooling infrastructure components.

[0028] Another advantage can be that the necessary redundancy of the immersion cooling infrastructure can be achieved with fewer components, as a single spare immersion cooling infrastructure module can provide redundant immersion cooling infrastructure for multiple tanks, such as example tank 110. For example, if immersion cooling infrastructure is more difficult or impossible to remove from a tank, redundancy can only be achieved by installing multiple immersion cooling infrastructure components, such as multiple filters or multiple pumps, within each tank. Thus, as a simple example, a data center with 100 tanks can have to purchase as many as two hundred pumps, filters, or other similar immersion cooling infrastructure components, as each tank can include a primary immersion cooling infrastructure component and a secondary immersion cooling infrastructure component to provide redundancy. In contrast, immersion cooling infrastructure modules designed for computing devices, such as example immersion cooling infrastructure module 300, which open easily remove and insert, can enable a data center to keep only a few "hot spares" of such immersion cooling infrastructure modules. Thus, returning to the simple example above, a data center with 100 tanks can only need 101 immersion cooling infrastructure modules, with 100 immersion cooling infrastructure modules installed in the 100 tanks, and the remaining one immersion cooling infrastructure module kept as a spare to be inserted into any tank whose immersion cooling infrastructure module fails, malfunctions, needs repair, etc. As long as only one such immersion cooling infrastructure module fails or needs repair at any time, only one additional spare can be needed to maintain redundancy.

[0029] Another advantage can be that immersion cooling infrastructure modules can be inserted into any of a number of different locations or openings, such as example openings 141, 142, and 143, allowing immersion cooling infrastructure modules to be moved around within an environment, such as within example tank 110, based on theoretical or empirical data, or current filtering, or other similar infrastructure needs. Similarly, multiple immersion cooling infrastructure modules can be temporarily installed within a tank, such as during a period when additional filtering can be needed, such as when new computing hardware is introduced into the tank. Subsequently, once the need for additional filtering or other similar increased infrastructure needs have ended, one or more of the temporarily installed immersion cooling infrastructure modules can be removed.

[0030] As can be seen, encapsulating immersion cooling infrastructure into modules creates a number of advantages, including size, shape, and attachment and connection capabilities as computing devices. Figure 1The illustrated exemplary system 100 is intended to be strictly illustrative, as different types of systems can have different openings, be of different sizes, different orientations, and such openings can or can not include racks, guides, prongs, plugs, or other similar structures as described above Figure 1 and the like. For example, Figure 2 The exemplary system 200 illustrates an embodiment in which openings such as exemplary opening 241 are horizontal, rather than vertically oriented as illustrated in the exemplary system 100 of Figure 1 In addition, in the exemplary system 200 of Figure 2 the openings can be part of a rack or other similar structure, which can be separate or separable from the tank itself. In the exemplary system 200 of Figure 2 computing devices such as exemplary computing devices 131 and 132, and immersion cooling infrastructure modules such as exemplary immersion cooling infrastructure module 300 (which will be described in greater detail below) can be inserted and removed horizontally, rather than vertically as illustrated in the exemplary system 100 of Figure 1 More particularly, the computing devices, immersion cooling infrastructure modules can be inserted horizontally into a structure such as exemplary rack 260, such as illustrated in the exemplary system 200 of Figure 2 The structure such as exemplary rack 260 can then be immersed in a tank (such as exemplary tank 210) that includes exemplary immersion cooling liquid 120, as described in greater detail above. Such immersion can be due to the vertical insertion of rack 260 into tank 210.

[0031] Turning to Figure 3 the exemplary immersion cooling infrastructure module 300 is illustrated in greater detail. According to one aspect, an immersion cooling infrastructure module such as exemplary immersion cooling infrastructure module 300 can include a filter for filtering immersion cooling liquid, such as exemplary filter 320. Filter 320 can be any filtering structure suitable for filtering immersion cooling liquid, including for example, a paper filter, a stainless steel mesh filter, a woven filter, a fiberglass filter, and the like, and can be in any appropriate physical form, including a spiral filter, a pleated filter, a conical filter, and the like.

[0032] To facilitate the passage of immersion cooling liquid through a filter, such as exemplary filter 320, immersion cooling infrastructure module 300 can include a pump, such as exemplary pump 310. Pump 310 can be any pump suitable for filtering immersion cooling liquid. Certain types of pumps can be preferred due to the viscosity of certain types of immersion cooling liquid. For example, if the immersion cooling liquid has a low viscosity, a peristaltic pump can be more effective than a rotary pump, for example. According to one aspect, a pump such as exemplary pump 310 can be positioned deeper within the immersion cooling liquid. Thus, for example, the pump can be located within the (gravity-oriented) lower portion of the immersion cooling infrastructure module, such as in the manner shown in the exemplary immersion cooling infrastructure module 300 shown in Figure 3

[0033] By contrast, a filter such as exemplary filter 320 can be positioned within the immersion cooling infrastructure module so as to be more easily visible or more easily replaceable. In this case, if the immersion cooling infrastructure module 300 is inserted and removed vertically into the tank, a filter such as exemplary filter 320 can be located in the vertically-oriented higher or upper portion of the immersion cooling infrastructure module, such as in the manner shown in the exemplary immersion cooling infrastructure module 300 shown in Figure 3 Figure 2

[0034] A tube such as exemplary tube 330 can connect a pump such as exemplary pump 310 to a filter such as exemplary filter 320, thereby facilitating the pumping of immersion cooling liquid through filter 320 if the pump and filter are located physically distinct locations within the immersion cooling infrastructure module. According to one aspect, the filter can be integrated within the pump, such as externally attached to the pump without tube 330, or internally positioned within the pump housing. In this case, tube 330 can not be necessary. Thus, to illustrate that tube 330 is an optional component, tube 330 is shown in dashed lines in Figure 3

[0035] ​​​​Similarly, an inlet conduit such as the exemplary inlet conduit 311 can facilitate the pump's reception of immersion coolant. Thus, for example, the exemplary inlet conduit 311 may extend beyond the edge of the immersion cooling infrastructure module 300, be directed to the lower part of the tank where the immersion cooling infrastructure module is mounted, or may otherwise provide advantageously positioned access to the immersion coolant for the pump 310. However, in some instances, an inlet conduit 311 may not be necessary, or only a small portion of such an inlet conduit may be practical. For example, if the immersion coolant is highly viscous, the pump 310's "drawing" of such a liquid would be negatively affected by the extent of the extension of the inlet conduit, such as the exemplary inlet conduit 311. Therefore, to illustrate that the inlet conduit 311 is an optional component, the inlet conduit 311 in... Figure 3 It is shown in dashed lines.

[0036] Similarly, a discharge conduit such as the exemplary discharge conduit 321 can facilitate the output of filtered immersion coolant, for example, by positioning the discharge of such filtered immersion coolant outside the edge of the immersion cooling infrastructure module 300, or at another advantageous location within the tank. As with the inlet conduit, in some cases, the discharge conduit 321 may not be necessary, or only a small portion of such a conduit may be practical. Therefore, to illustrate that the discharge conduit 321 is an optional component, the discharge conduit 321 in... Figure 3 It is shown in dashed lines.

[0037] A pump, such as the exemplary pump 310, can be powered by a power source, such as the exemplary power supply 340, which can also be such as Figure 3 The components of the immersion cooling infrastructure module 300 shown are of the exemplary immersion cooling infrastructure module 300. A power source such as the exemplary power supply 340 may also provide power to a controller such as the exemplary controller 350, which may control the operation of the pump 310, other components of the immersion cooling infrastructure module 300, or other equipment outside the immersion cooling infrastructure module 300 (such as infrastructure equipment that is part of the tank or installed elsewhere inside the tank).

[0038] According to one aspect, electrical power can be provided to an immersion cooling infrastructure module, such as the example immersion cooling infrastructure module 300, in the same manner as electrical power is provided to a computing device. More specifically, the connectors of an immersion cooling infrastructure module 300, such as the example connectors 360, can be of the same type as the connectors on a computing device. One such connector can be a blind-mate connector, which can facilitate a proper connection that is invisible to the user making the connection. For example, a computing device or example immersion cooling infrastructure module 300 can be slid into an opening, such as those described earlier, and the relevant connections can be on the opposite side of the computing device as it is slid, such that the visibility of the relevant connections is blocked by the device itself. Thus, a blind-mate connector can facilitate such connections, including connections for electrical power, connections for a network, computer peripherals, or other similar connections. In some cases, the connectors 360 of an immersion cooling infrastructure module can include only a subset of the connections available at each opening. For example, each opening in a rack or tank can include a connection for electrical power, a connection for a network, and other connections, all of which can be matched by corresponding connectors on a computing device. In contrast, in such an example, an immersion cooling infrastructure module can include only connectors for interfacing with electrical power, or only connectors for interfacing with electrical power and a network. To prevent immersion cooling liquid from leaking, the connectors such as the example connectors 360 can include relevant physical constructions designed to minimize such leakage, including gaskets, seals, mating surfaces, and other similar liquid barriers.

[0039] The electrical power can be provided in the form of traditional 120V or 140V AC power. Alternatively, the electrical power can be provided as DC power. Depending on the type of pump, the power supply 340 can be a switching power supply for converting from AC power to DC power, a power inverter for converting from DC to AC, a step-up or step-down converter, or, if the power supplied matches the needs of the pumps in both kind and quantity, the example power supply 340 can simply be a distribution of that power to the pumps 310, and can be as simple as bridging the pumps 310 to the relevant wiring of the connectors 360.

[0040] Operation of the pump 310 can be controlled by a controller such as the example controller 350. The functionality and complexity of the example controller 350 can vary depending on the components controlled by the controller and the inputs processed thereby. For example, a simple controller can control operation of the pump 310 and can monitor the filter 320 to determine whether flow generated by the pump should be increased or decreased, such as based on back pressure generated by the pump and / or filter. Detection of such back pressure can be performed by various sensors that can be communicatively coupled to the controller 350. The example immersion cooling infrastructure module 300 includes various example sensors, such as the example sensor 381 that can monitor various aspects of operation of the pump 310, such as energy consumption, vibration, flow rate, temperature, and other similar aspects. The example sensor 382 can similarly monitor various aspects of the filter 320, including flow through the filter, optical permeability of the filter, chemical characteristics of the filter, or other similar aspects. Similarly, the example sensor 383 can monitor various aspects of flow through the conduit 330, including flow rate, back pressure, and other similar aspects. The example sensors 381, 382, and 383 are merely one example, and an immersion cooling infrastructure module can include more sensors, different sensors, or can not include any such sensors at all, and control of the pump 310 can be performed entirely outside of the immersion cooling infrastructure module. For example, the pump 310 can be controlled by an external controller, and control signals for the pump 310 can be provided through the connector 360.

[0041] According to one aspect, an onboard controller such as the example controller 350 can facilitate communication with processes and components outside of the immersion cooling infrastructure module 300. Such communication can be wired, through the connector 360, or can be wireless. For example, the example controller 350 can control other aspects of the immersion cooling infrastructure, such as operation of a tank lid, operation of lights or other visual devices, operation of fans or pumps outside of the immersion cooling infrastructure module, and the like. As another example, the example controller 350 can communicate with controllers of other immersion cooling infrastructure modules to coordinate pump speed, flow rate, or other operational aspects.

[0042] To facilitate physical installation and removal, an immersion cooling infrastructure module can include a handle, a grip, an alignment aid, or other similar physical structure. For example, Figure 3 The example immersion cooling infrastructure module 300 shown is shown to include an example handle 370. Such a handle 370 can be positioned opposite the connector 360 to facilitate insertion or removal of the immersion cooling infrastructure module 300 into an opening, such as the opening described above.

[0043] According to one aspect, an immersion cooling infrastructure module can be the same size and shape as a computing device. According to other aspects, an immersion cooling infrastructure module can conform to fractional width size standards to facilitate installation of additional devices, such as additional computing devices, within a single opening. As will be appreciated by those skilled in the art, in the context of standard rack-mounted computing devices, such as those conforming to the standards detailed above, there exist half- wide and one-third wide computing devices and peripherals to allow multiple computing devices within one standard opening. In a similar manner, immersion cooling computing setups can likewise utilize fractional width size standards.

[0044] Turning to Figure 4 , the exemplary immersion cooling infrastructure module 421 shown in system 401 can be a half- wide module that can enable another module, such as exemplary computing device 431, to be installed alongside the exemplary immersion cooling infrastructure module 421 and both within a single standard-sized opening, such as exemplary standard-sized opening 411. Exemplary system 402 shows an exemplary one-third wide immersion cooling infrastructure module 422 with a larger computing device, i.e., exemplary computing device 432, installed alongside within a single standard-sized opening, such as exemplary standard-sized opening 412. While shown as computing devices, additional devices, such as exemplary device 431 and exemplary device 432, can be additional immersion cooling infrastructure modules.

[0045] According to another aspect, a computing device or its peripherals can be installed or pre-manufactured within an immersion cooling infrastructure module to provide more efficient use of the space within the immersion cooling tank. For example, turning to Figure 5 , exemplary immersion cooling infrastructure module 510 is shown to include the pump 310, filter 320, piping 330, power supply 340, and controller 350 detailed above. In addition, exemplary immersion cooling infrastructure module 510 is shown to include a computing device, such as exemplary computing device 520, within the space available in the immersion cooling infrastructure module 510. More specifically, as the immersion cooling infrastructure module 510 can conform to a standard size and shape, the aforementioned components can not require all of the available space within such a standard size and shape. Thus, to more efficiently utilize the space within the immersion cooling setup, a computing device, such as exemplary computing device 520, can be installed within the immersion cooling infrastructure module 510 with the relevant connections passing through the immersion cooling infrastructure module’s connectors. Exemplary computing device 520 can include some or all of the components detailed above with respect to Figure 8 Exemplary computing device 800, shown in FIG. 8. Alternatively or additionally, computing peripherals, such as hard drives, RAM, and other similar peripherals, can be installed within the immersion cooling infrastructure module 510. Figure 5the location of the computing device 520 shown.

[0046] As previously mentioned, the ease with which immersion cooling infrastructure modules can be added or removed enables the functionality provided by such immersion cooling infrastructure modules to be sized as needed. For example, when a new computing device is installed into a tank, such a new computing device can generate a greater amount of particulate. Accordingly, multiple immersion cooling infrastructure modules can be temporarily installed to increase filtration capacity. For example, Figure 6 The example system 600 shown illustrates an example tank 610 that includes two immersion cooling infrastructure modules, such as example immersion cooling infrastructure module 621 and immersion cooling infrastructure module 622. Such immersion cooling infrastructure modules can generate an immersion cooling fluid flow, such as shown generally by the dashed lines in Figure 6 The example tank 610 is also shown to include computing devices cooled by the immersion cooling fluid, such as example computing device 611, computing device 612, computing device 613, computing device 614, computing device 615, computing device 616, and computing device 617.

[0047] According to one aspect, communication between controllers on immersion cooling infrastructure modules 621 and 622, such as example inter-module communication 630, can facilitate coordination of the operation of various immersion cooling infrastructure components, such as the pumps of immersion cooling infrastructure modules 621 and 622. For example, if immersion cooling infrastructure module 622 is added after immersion cooling infrastructure module 621 is already present within tank 610, a discovery protocol can facilitate determination by immersion cooling infrastructure module 621, for example, that a second immersion cooling infrastructure module has been added. Accordingly, the controller of immersion cooling infrastructure module 621 can adjust pump speed, such as by reducing flow rate through the pump, to accommodate that a second immersion cooling infrastructure module has been added to tank 610. In a similar manner, the controller of example immersion cooling infrastructure module 622 can identify immersion cooling infrastructure module 621 and can acquire information therefrom to coordinate, for example, flow rate, pump speed, or pump direction, to synchronize the operation of the pumps of both immersion cooling infrastructure modules. For example, depending on the measurements and orientation, inter-module communication 630 can cause immersion cooling infrastructure module 621 to operate its pump in an opposite direction from immersion cooling infrastructure module 622 to facilitate a circulating flow. As another example, inter-module communication 630 can cause immersion cooling infrastructure module 621 to operate its pump in the same direction as immersion cooling infrastructure module 622 to facilitate a flow similar to Figure 6 the flow shown.

[0048] Once the need for additional immersion cooling infrastructure modules decreases, one of the immersion cooling infrastructure modules 621 or 622 can be removed. In a similar manner, the remaining one of the immersion cooling infrastructure modules can detect such removal and can control its pump accordingly, such as by increasing the flow rate or operation of the pump. Further, communication external to the immersion cooling infrastructure modules, such as with a centralized control device, can provide feedback regarding optimal placement within the tank 610. For example, through sensor measurements, optimal placement of a single immersion cooling infrastructure module can replace the exemplary computing device 614, while multiple immersion cooling infrastructure modules can be placed in a similar manner as shown. Figure 6

[0049] Turning to Figure 7 wherein the exemplary flowchart 700 illustrates an exemplary series of steps that can be performed with immersion cooling infrastructure modules that can have a computing device form factor and thus can be interchangeable with such computing devices within openings provided for such computing devices. The exemplary flowchart 700 can begin at step 710, where a computing device is cooled by being immersed in an immersion cooling liquid. At step 720, it can be determined whether additional immersion cooling infrastructure modules are appropriate, desired, or needed. If at step 720, additional immersion cooling infrastructure modules should be added, then processing can proceed to step 730, and the computing device can be removed from the opening in which the computing device is installed, such as the previously illustrated and detailed opening. At step 740, an immersion cooling infrastructure module can be inserted into the same opening from which the computing device was removed.

[0050] In a similar manner, at step 750, it can be determined whether fewer immersion cooling infrastructure modules can be needed, such as to end a temporary increase in the number of immersion cooling infrastructure modules. At step 760, an immersion cooling infrastructure module can be removed, and at step 770, the computing device can be inserted into the same opening from which the immersion cooling infrastructure module was removed. As can be seen, immersion cooling infrastructure modules having a computing device form factor can facilitate interchangeability of computing devices with immersion cooling infrastructure.

[0051] Turning to Figure 8 ​FIG. 8 shows an example computing device 800. The example computing device 800 can include, but is not limited to, one or more central processing units (CPUs) 820, a system memory 830, and a system bus 821 that couples the various system components including the system memory to the processing unit 820. The system bus 821 can be any of various types of bus structures including a memory bus or memory controller, a peripheral bus, and a local bus using any of a variety of bus architectures. The computing device 800 can optionally include graphics hardware, including but not limited to a graphics hardware interface 860 and a display device 861, which can include a display device capable of receiving touch-based user input, such as a touch-sensitive or multi-touch-capable display device. The display device 861 can also include a virtual reality display device, which can be a virtual reality headset, a mixed reality headset, an augmented reality headset, and other similar virtual reality display devices. As will be appreciated by those skilled in the art, such virtual reality display devices include two physically separate displays, such as LCD displays, OLED displays, or other similar displays, where each physically separate display generates an image that is presented to each of the two eyes of a user, or they include a single display device or other similar visual hardware associated with a lens that divides the display area of such single display device into multiple areas, such that again, each of the two eyes of a user receives a slightly different generated image. The user’s brain then interprets the differences between such generated images, resulting in what appears to the user to be a fully three-dimensional environment.

[0052] Returning to Figure 8 , depending on the specific physical implementation, one or more of the CPU 820, the system memory 830, and other components of the computing device 800 can be physically co-located, such as on a single chip. In such cases, some or all of the system bus 821 can be nothing more than a silicon pathway within the single chip structure, and its illustration in Figure 8 is merely symbolic and convenient for purposes of illustration.

[0053] The computing device 800 also typically includes computer-readable media, which can also include removable / non-removable, volatile / nonvolatile computer storage media. By way of example only, computer-readable media includes a computer storage medium and communication media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by the computing device 800. Computer storage media, however, does not include communication media. Communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media. By way of example, and not limitation, communication media includes wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared and other wireless media. Combinations of the any of the above should also be included within the scope of computer-readable media.

[0054] The system memory 830 includes computer storage media in the form of volatile and / or nonvolatile memory such as read only memory (ROM) 831 and random access memory (RAM) 832. A basic input / output system 833 (BIOS), containing the basic routines that help to transfer content between elements within the computing device 800, such as during start-up, is typically stored in ROM 831. RAM 832 typically contains data and / or program modules that are immediately accessible to and / or presently being operated on by processing unit 820. By way of example, and not limitation, Figure 8 illustrates operating system 834, other program modules 835, and program data 836. Figure 8 The operating system 834, other program modules 835, and program data 836 are given different numbers here to illustrate that, at a minimum, they are different copies.

[0055] The computing device 800 can also include other removable / non-removable volatile / nonvolatile computer storage media. By way of example only, Figure 8 Hard disk drive 841, which reads from or writes to non-removable, nonvolatile media, is shown. Other removable / non-removable volatile / nonvolatile computer storage media that can be used with the exemplary computing device include, but are not limited to, magnetic tape cassettes, flash memory cards, digital versatile disks, digital video tape, solid state RAM, solid state ROM, and other computer storage media as defined and described above. Hard disk drive 841 is typically connected to the system bus 821 through a non-removable memory interface, such as interface 840.

[0056] The above discussed and described computer-readable media, and the above discussed and described computer program products, are typically stored on a computer-readable medium, which can comprise computer-readable storage media and / or computer-readable communication media.Figure 8 The drives and their associated computer storage media, discussed above and illustrated in FIG. 8, provide storage of computer-readable instructions, data structures, program modules and other data for the computing devices 800. In Figure 8 In the description above, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present subject matter. It will be apparent, however, to one skilled in the art that the present subject matter can be practiced without some or all of these specific details. In other instances, well known structures and functions have not been described in detail in order to avoid obscuring the present subject matter.

[0057] The computing device 800 can operate in a networked environment using logical connections to one or more remote computers. The computing device 800 is illustrated as being connected to the general network connection 851 (to the network 880) through a network interface or adapter 850, which is connected to the system bus 821, and also illustrated as being connected to the storage device 823. In a networked environment, program modules depicted relative to the computing device 800, or portions or peripheral devices thereof, can be stored in the memory of one or more other computing devices that are communicatively coupled to the computing device 800 by the general network connection 851. It will be appreciated that the network connections shown are exemplary and other means of establishing a communications link between computing devices can be used.

[0058] As a first example, the above description includes a system comprising: a tank; an immersion cooling liquid in the tank; a rack comprising a plurality of adjacent openings having the same size and shape, at least a portion of the rack being submersible in the immersion cooling liquid; a computing device mounted in a first opening of the plurality of openings, the computing device being at least partially submersible in the immersion cooling liquid when mounted in the first opening; and an immersion cooling infrastructure module mounted into a second opening of the plurality of openings adjacent to the computing device, the immersion cooling infrastructure module comprising: an immersion cooling liquid pump; and an immersion cooling liquid filter; wherein the immersion cooling liquid pump and the immersion cooling liquid filter are arranged within the immersion cooling infrastructure module such that the immersion cooling liquid pump is able to pump the immersion cooling liquid through the immersion cooling liquid filter.

[0059] A second example is the system according to the first example, wherein the immersion cooling infrastructure module further comprises a connector on the first side, the connector connecting the immersion cooling infrastructure module to electrical power.

[0060] A third example is the system according to the second example, wherein the immersion cooling infrastructure module further comprises a handle on a second side opposite the first side.

[0061] A fourth example is the system according to the second example, wherein the connector is a self-aligning blind mate connector.

[0062] A fifth example is the system of the second example, wherein each opening of the plurality of adjacent openings individually includes a rack connector that provides power to equipment installed within the plurality of adjacent openings, and wherein the connector of the immersion cooling infrastructure module also mates with any of the rack connectors.

[0063] A sixth example is the system of the second example, wherein the connector also connects the immersion cooling infrastructure module to a computer network.

[0064] A seventh example is the system of the first example, wherein the rack is oriented such that the immersion cooling infrastructure module is inserted vertically downward into the first opening.

[0065] An eighth example is the system of the first example, wherein the immersion cooling liquid pump is located near a bottom edge of the immersion cooling infrastructure module when the immersion cooling infrastructure module is in the operational orientation within the tank.

[0066] A ninth example is the system of the eighth example, wherein the immersion cooling liquid filter is located near a top edge of the immersion cooling infrastructure module when the immersion cooling infrastructure module is in the operational orientation within the tank.

[0067] A tenth example is the system of the first example, wherein the immersion cooling liquid filter is integrated into the immersion cooling liquid pump.

[0068] An eleventh example is the system of the first example, wherein the immersion cooling infrastructure module further includes a conduit between the immersion cooling liquid pump and the immersion cooling liquid filter, the immersion cooling liquid pump pumping immersion cooling liquid through the conduit before pumping the immersion cooling liquid through the immersion cooling liquid filter.

[0069] A twelfth example is the system of the first example, wherein the immersion cooling infrastructure module further includes an immersion cooling infrastructure controller circuit, wherein operation of the immersion cooling liquid pump is controlled by the immersion cooling infrastructure controller circuit.

[0070] A thirteenth example is the system of the twelfth example, wherein the immersion cooling infrastructure module further includes a sensor that provides sensor data to the immersion cooling infrastructure controller circuit, the sensor data being associated with back pressure experienced by the immersion cooling liquid pump, the immersion cooling infrastructure controller circuit controlling operation of the immersion cooling liquid pump based at least in part on the provided sensor data.

[0071] A fourteenth example is the system of the twelfth example, further comprising: a second immersion cooling infrastructure module installed into a third opening of the plurality of openings, the second immersion cooling infrastructure module comprising: a second immersion cooling liquid pump; a second immersion cooling liquid filter; and a second immersion cooling infrastructure controller circuit; wherein the immersion cooling infrastructure controller circuit controls the immersion cooling liquid pump based at least in part on communications received from the second immersion cooling infrastructure module.

[0072] A fifteenth example is the system of the first example, wherein the immersion cooling infrastructure module has a width that is a predetermined fraction of a width of a second opening of the plurality of openings.

[0073] A sixteenth example is the system of the fifteenth example, further comprising a second computing device installed alongside the immersion cooling infrastructure module in a second opening of the plurality of openings.

[0074] A seventeenth example is the system of the first example, wherein the immersion cooling infrastructure module further comprises: a second computing device that supplements a processing capability of the computing device.

[0075] An eighteenth example is an immersion cooling infrastructure module comprising: an immersion cooling liquid pump; and an immersion cooling liquid filter; wherein the immersion cooling infrastructure module is installable into a first opening in a rack, the rack comprising a plurality of adjacent openings having a same size and shape, a second opening of the rack having a computing device installed therein; wherein the rack is at least partially immerseable in an immersion cooling liquid, the immersion cooling liquid pump and the immersion cooling liquid filter being arranged within the immersion cooling infrastructure module such that the immersion cooling liquid pump is capable of pumping the immersion cooling liquid through the immersion cooling liquid filter.

[0076] A nineteenth example is a method of installing a filter, comprising: removing a computing device from a first opening in a tank at least partially filled with an immersion cooling liquid, the computing device being at least partially immersed in the immersion cooling liquid, the tank further comprising a second opening having other computing devices installed therein; installing an immersion cooling infrastructure module comprising an immersion cooling liquid pump and an immersion cooling liquid filter in the first opening, both the immersion cooling liquid pump and the immersion cooling liquid filter being arranged within the immersion cooling infrastructure module such that the immersion cooling liquid pump is capable of pumping the immersion cooling liquid through the immersion cooling liquid filter after being installed.

[0077] A twentieth example is the method of the nineteenth example, further comprising: removing the immersion cooling infrastructure module; and installing a second computing device in the first opening; wherein the tank comprises a second immersion cooling infrastructure module installed in the second opening.

[0078] As can be seen from the foregoing description, an immersion cooling infrastructure module having a computing device form factor has been presented. In view of the many possible variations of the subject matter described herein, we claim as our invention all such embodiments as can come within the scope of the following claims and equivalents thereto.

Claims

1. A system comprising: Can; Immersion coolant, in the tank; A rack comprising a plurality of adjacent openings of the same size and shape, at least a portion of the rack being immersable in the immersion coolant; A computing device is mounted in a first opening among a plurality of openings, the computing device being at least partially immersed in the immersion coolant when mounted in the first opening, wherein the plurality of openings have the same shape factor as the computing device. as well as An immersion cooling infrastructure module is installed into a second opening of the plurality of openings adjacent to the computing device, the immersion cooling infrastructure module comprising: Submersible coolant pump; and Immersion coolant filter; The immersion coolant pump and the immersion coolant filter are arranged within the immersion cooling infrastructure module, such that the immersion coolant pump can pump the immersion coolant through the immersion coolant filter. The system includes a controller configured to determine an increase in the flow rate generated by the immersion coolant pump by monitoring the immersion coolant pump and the immersion coolant filter; and The controller is further configured to monitor the immersion coolant filter by monitoring the flow rate through the immersion coolant filter, the optical permeability of the immersion coolant filter, and the chemical characteristics of the immersion coolant filter.

2. The system of claim 1, wherein the immersion cooling infrastructure module further includes a connector on a first side that connects the immersion cooling infrastructure module to an electrical power source.

3. The system of claim 2, wherein the immersion cooling infrastructure module further includes a handle on a second side opposite to the first side.

4. The system of claim 2, wherein the connector is a self-aligning blind-mating connector.

5. The system of claim 2, wherein each of the plurality of adjacent openings individually includes a rack connector for providing power to devices mounted within the plurality of adjacent openings, and wherein the connector of the immersion cooling infrastructure module also mates with any rack connector of the rack connector.

6. The system of claim 2, wherein the connector also connects the immersion cooling infrastructure module to a computer network.

7. The system of claim 1, wherein the rack is oriented such that the immersion cooling infrastructure module is inserted vertically downward into the first opening.

8. The system of claim 1, wherein when the immersion cooling infrastructure module is in the operating orientation within the tank, the immersion coolant pump is located near the bottom edge of the immersion cooling infrastructure module.

9. The system of claim 1, wherein when the immersion cooling infrastructure module is in the operating orientation within the tank, the immersion coolant filter is located near the top edge of the immersion cooling infrastructure module.

10. The system of claim 1, wherein the immersion coolant filter is integrated into the immersion coolant pump.

11. The system of claim 1, wherein the immersion cooling infrastructure module further comprises: The pipe between the immersion coolant pump and the immersion coolant filter, wherein the immersion coolant pump pumps the immersion coolant through the pipe before pumping the immersion coolant through the immersion coolant filter.

12. The system of claim 1, wherein the immersion cooling infrastructure module further comprises: An immersion cooling infrastructure controller circuit, wherein the operation of the immersion coolant pump is controlled by the immersion cooling infrastructure controller circuit.

13. The system of claim 12, wherein the immersion cooling infrastructure module further comprises: A sensor provides sensor data to the immersion cooling infrastructure controller circuit, the sensor data being associated with the back pressure experienced by the immersion coolant pump, and the immersion cooling infrastructure controller circuit controls the operation of the immersion coolant pump based at least in part on the provided sensor data.

14. The system of claim 12, further comprising: A second immersion cooling infrastructure module is installed in a third opening among the plurality of openings, the second immersion cooling infrastructure module comprising: Second immersion coolant pump; A second immersion coolant filter; and Second immersion cooling infrastructure controller circuit; The immersion cooling infrastructure controller circuit controls the immersion coolant pump based at least in part on communications received from the second immersion cooling infrastructure module.

15. The system of claim 1, wherein the width of the immersion cooling infrastructure module is a predetermined fraction of the width of the second opening among the plurality of openings.

16. The system of claim 15, further comprising a second computing device mounted next to the immersion cooling infrastructure module in the second opening of the plurality of openings.

17. The system of claim 1, wherein the immersion cooling infrastructure module further comprises a second computing device that supplements the processing power of the computing device.

18. An immersion cooling infrastructure module, comprising: Submersible coolant pump; as well as Immersion coolant filter; The immersion cooling infrastructure module can be installed into a first opening in a rack, the rack including a plurality of adjacent openings of the same size and shape, a computing device being installed in a second opening of the rack, and wherein the first opening and the second opening have the same shape factor as the computing device. and The rack is at least partially immersable in an immersion coolant, and the immersion coolant pump and the immersion coolant filter are arranged within the immersion cooling infrastructure module such that the immersion coolant pump can pump the immersion coolant through the immersion coolant filter. The immersion cooling infrastructure module includes a controller configured to determine an increase in the flow rate generated by the immersion coolant pump by monitoring the immersion coolant pump and the immersion coolant filter; and The controller is further configured to monitor the immersion coolant filter by monitoring the flow rate through the immersion coolant filter, the optical permeability of the immersion coolant filter, and the chemical characteristics of the immersion coolant filter.

19. A method for installing a filter, comprising: The computing device is removed from a first opening in a rack at least partially filled with an immersion coolant, the computing device being at least partially immersed in the immersion coolant, the rack also including other openings in which other computing devices are mounted, wherein the first opening and the other openings have the same shape factor as the computing device. as well as An immersion cooling infrastructure module, including an immersion coolant pump and an immersion coolant filter, is installed in the first opening. Both the immersion coolant pump and the immersion coolant filter are arranged within the immersion cooling infrastructure module such that the immersion coolant pump, after installation, can pump the immersion coolant through the immersion coolant filter. The method further includes: determining an increase in the flow rate generated by the immersion coolant pump by monitoring the immersion coolant pump and the immersion coolant filter; and The method further includes monitoring the immersion coolant filter by monitoring the flow rate through the immersion coolant filter, the optical permeability of the immersion coolant filter, and the chemical characteristics of the immersion coolant filter.

20. The method of claim 19, further comprising: Remove the immersion cooling infrastructure module; as well as Install a second computing device in the first opening; The tank includes a second immersion cooling infrastructure module installed in a second opening.

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