Laser radar and its heat dissipation device

Abstract

The present invention discloses a laser radar and a heat dissipation device thereof. The laser radar heat dissipation device includes a support plate and a plurality of heat sinks. The support plate has a first surface and a second surface facing each other. The first surface is used to connect to the laser radar's transmitter circuit board, and the second surface is provided with the plurality of heat sinks, which are spaced apart on the support plate. The support plate of the present invention can conduct heat from the transmitter circuit board, and the heat sinks can increase the contact area between the support plate and the air. The heat on the heat sinks is evenly distributed, thereby enhancing the heat conduction effect between the support plate and the air.

Description

Technical Field

[0001] The present invention relates to the field of radar, and in particular to a laser radar and a heat dissipation device thereof. Background Art

[0002] By transmitting detection signals to objects and the echo signals reflected back from them, LiDAR can calculate physical information about the objects, such as distance, direction, altitude, speed, and attitude. This physical information forms point data with three-dimensional spatial information. Processing large amounts of point data can generate three-dimensional point cloud data, enabling target object recognition, parameter measurement, and motion tracking. The more detection signal beams a LiDAR emits, the richer the information it can obtain about the detected objects.

[0003] As LiDAR performance requirements have increased in recent years, the number of laser emission lines has increased. However, due to radar size limitations, the laser arrays on the transmitter side have become denser, resulting in increased power consumption and, in turn, increased heat generation. Therefore, it is necessary to provide an effective heat sink to effectively dissipate the heat generated by the transmitter side, thereby reducing the operating temperature of the LiDAR and improving its performance and service life. Summary of the Invention

[0004] The present invention provides a laser radar and a heat dissipation device thereof to solve the problem that heat from the laser radar transmitting end cannot be effectively conducted away.

[0005] In order to solve the above problems, according to one aspect of the present invention, a laser radar heat dissipation device is provided, which includes a support plate and a plurality of heat sinks. The support plate has a first surface and a second surface relative to each other. The first surface is used to connect the transmitting end circuit board of the laser radar, and the second surface is provided with the plurality of heat sinks. The plurality of heat sinks are arranged at intervals on the support plate.

[0006] In one embodiment, the plurality of heat dissipating elements are integrally formed with the support plate, or the plurality of heat dissipating elements are separately formed and removably mounted on the second surface of the support plate.

[0007] In one embodiment, the plurality of heat dissipating elements are evenly distributed on the second surface of the support plate along a height direction of the support plate.

[0008] In one embodiment, the plurality of heat dissipating elements are in the shape of thin sheets and are parallel to each other.

[0009] In one embodiment, the plurality of heat dissipating elements have arc-shaped peripheries.

[0010] In one embodiment, the width of the heat sink at the connection point with the support plate is the same as that of the support plate, and after protruding a certain distance away from the support plate, the width of the heat sink gradually decreases to form an arc-shaped periphery.

[0011] In one embodiment, at least one of the plurality of heat dissipating elements forms a continuous W-shape or a wave-shape on the support plate.

[0012] In one embodiment, the plurality of heat dissipating elements are arranged in a plurality of rows on the support plate, and a plurality of heat dissipating elements are arranged in each row at intervals.

[0013] In one embodiment, the laser radar heat dissipation device also includes a connecting plate integrally formed with the multiple heat sinks, the multiple heat sinks are connected by the connecting plate and arranged in multiple rows on the connecting plate, and multiple heat sinks are arranged in each row at intervals, and the connecting plate is separately formed from the support plate and connected to the second surface of the support plate.

[0014] In one embodiment, the plurality of heat dissipating elements in each row are arranged at an angle A to the horizontal direction, wherein the angle A formed by each heat dissipating element in the same row and in different rows to the horizontal direction is equal.

[0015] In one embodiment, the odd-numbered heat sinks in each row are arranged at the same first angle A1 to the horizontal direction, and the even-numbered heat sinks in each row are arranged at the same second angle A2 to the horizontal direction, so that two adjacent heat sinks in the same row are staggered.

[0016] In one embodiment, the heat dissipation element includes a cylinder, one end of the cylinder is connected to the second surface of the support plate, and the other end of the cylinder protrudes in a direction perpendicular to the second surface of the support plate.

[0017] In one embodiment, one end of the cylinder is connected to the second surface of the connecting plate, and the other end of the cylinder protrudes in a direction perpendicular to the second surface of the connecting plate.

[0018] In one embodiment, the lengths of the multiple heat dissipating elements in the same row extending from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate are different, wherein the heat dissipating elements closer to the middle extend longer from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate, and the heat dissipating elements closer to the two ends extend shorter from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate, thereby forming an arc-shaped profile as a whole.

[0019] In one embodiment, at least one connecting member is provided between at least two adjacent first and second heat sinks of the plurality of heat sinks, one end of the connecting member is connected to the first heat sink, and the other end of the connecting member is connected to the second heat sink.

[0020] In one embodiment, an even number of connecting members are provided between at least two adjacent first and second heat dissipating members of the plurality of heat dissipating members, and the even number of connecting members are symmetrically arranged about the center of the first and second heat dissipating members along the width direction.

[0021] In one embodiment, an odd number of connecting members are provided between at least two adjacent first heat dissipation members and second heat dissipation members of the multiple heat dissipation members, a central connecting member is provided at the center of the first heat dissipation member and the second heat dissipation member along the width direction, and the other connecting members are symmetrically arranged on both sides of the central connecting member.

[0022] In one embodiment, the connecting member is made of a low thermal resistance material.

[0023] In one embodiment, the connecting member is made of copper, aluminum or aluminum alloy.

[0024] In one embodiment, the connecting pillar and the heat sink are made of the same material.

[0025] In one embodiment, the connecting member and the heat dissipating member are integrally formed.

[0026] According to another aspect of the present invention, a laser radar is provided, comprising a light shield, a laser, a lens barrel, a transmitting end circuit board, and the above-mentioned heat dissipation device.

[0027] The interior of the mask forms a cavity, and the laser, lens barrel, emission end circuit board and heat dissipation device are arranged in the cavity, wherein,

[0028] The transmitting end circuit board has a first surface and a second surface relative to each other, the first surface of the transmitting end circuit board is connected to the laser, the second surface of the transmitting end circuit board is connected to the first surface of the support plate, and the lens barrel cooperates with the laser and is connected to the outside through the light cover.

[0029] In one embodiment, the FR4 layer of the transmitter circuit board is compressed.

[0030] In one embodiment, the laser radar also includes a base, a top cover and a rotating bracket, the rotating bracket is rotatably mounted on the base, the top cover is arranged above the light shield, the lens barrel, the transmitting end circuit board, the laser and the heat dissipation device are fixedly mounted on the rotating bracket, the base, the light shield and the top cover cooperate to encapsulate the rotating bracket, the lens barrel, the transmitting end circuit board, the laser and the heat dissipation device.

[0031] In one embodiment, the laser radar further includes a wireless power supply module and a base circuit board, and the wireless power supply module is connected to the base circuit board and installed in the base.

[0032] The second surface of the transmitter circuit board of the present invention is bonded to the first surface of the support plate. The support plate acts as a heat sink to conduct heat from the transmitter circuit board. It also serves as a reinforcement structure for the transmitter circuit board, supporting the transmitter circuit board and the laser assembly on its first surface. A heat sink is provided on the second surface of the support plate. This heat sink increases the contact area between the support plate and the air, enhancing heat conduction between the support plate and the air. Furthermore, by compressing the FR4 layer of the transmitter circuit board, the thermal conductivity coefficient can be increased, reducing its own thermal resistance.

[0033] The heat conduction path of the laser assembly in the present invention is: laser - transmitting end circuit board - support plate - heat sink - air, which reduces the heat conduction path of the laser assembly and reduces the thermal resistance of the heat sink assembly itself, greatly improving the heat conduction efficiency.

[0034] In summary, the present invention has the following beneficial technical effects:

[0035] First, the laser radar heat dissipation device of the present invention is directly connected to the transmitter circuit board via a support plate. The support plate acts as a heat sink to conduct heat from the transmitter circuit board and also as a reinforcement structure for the transmitter circuit board, supporting the transmitter circuit board and the laser assembly on its first surface. A heat sink is provided on the second surface of the support plate, increasing the contact area between the support plate and the air and enhancing heat conduction between the support plate and the air.

[0036] Second, the heat conduction path of the laser component of the laser radar of the present invention is: laser - transmitting end circuit board - support plate - heat sink - air, which reduces the heat conduction path of the laser component and reduces the thermal resistance of the heat sink component itself, greatly improving the heat conduction efficiency. At the same time, the support plate itself also serves as a reinforcement structure for the transmitting end circuit board, ensuring the flatness of the thin circuit board.

[0037] Third, the laser radar heat dissipation device of the present invention uses heat dissipation parts to increase the contact area between the support plate and the air, and adopts W-shaped, wavy, short-tooth, staggered-tooth, and needle-rib deformations to further increase the contact area. At the same time, the use of deformation embodiments can increase air disturbance between the fins, generate air convection, and further enhance heat conduction between the fins and the air.

[0038] Fourth, the laser radar heat dissipation device of the present invention adds a connecting piece between two adjacent heat dissipation elements to improve the stress of the heat dissipation elements, while ensuring heat conduction between the heat dissipation elements, so that the heat of each heat dissipation element is evenly distributed. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a three-dimensional schematic diagram of a laser radar according to an embodiment of the present invention.

[0040] Figure 2 It is a three-dimensional schematic diagram of a laser radar heat dissipation device according to an embodiment of the present invention.

[0041] Figure 3 It is a three-dimensional exploded view of a heat dissipation device according to an embodiment of the present invention.

[0042] Figure 4 It is a schematic diagram of the three-dimensional structure of a heat sink according to an embodiment of the present invention.

[0043] Figure 5 It is a schematic diagram of the three-dimensional structure of a heat sink according to an embodiment of the present invention.

[0044] Figure 6 It is a schematic diagram of the three-dimensional structure of a heat sink according to an embodiment of the present invention.

[0045] Figure 7 It is a schematic diagram of the three-dimensional structure of a heat sink according to an embodiment of the present invention.

[0046] Figure 8 It is a schematic diagram of the three-dimensional structure of a heat sink according to an embodiment of the present invention.

[0047] Figure 9 3D is a schematic three-dimensional diagram of a heat sink according to an embodiment of the present invention.

[0048] Figure 10 FIG. 4 is a side view of a heat sink according to an embodiment of the present invention. DETAILED DESCRIPTION

[0049] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the present invention can be more clearly understood. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0050] In the following description, for the purpose of illustrating the various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the relevant art will recognize that the embodiments may be practiced without one or more of these specific details. In other cases, well-known devices, structures, and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0051] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0052] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but words such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and should not be understood as restrictive terms.

[0053] The present invention relates to a laser radar and a heat dissipation device thereof. The heat dissipation device comprises a support plate and a plurality of heat dissipation elements. The support plate has a first surface and a second surface relative to each other. The first surface is used to connect to the transmitter circuit board of the laser radar. The second surface is provided with a plurality of heat dissipation elements. The plurality of heat dissipation elements are arranged at intervals on the support plate. The laser radar comprises a light shield, a laser, a lens barrel, a transmitter circuit board, and a heat dissipation device. The interior of the light shield forms a chamber. The laser, the lens barrel, the transmitter circuit board, and the heat dissipation device are arranged in the chamber. The transmitter circuit board has a first surface and a second surface relative to each other. The first surface of the transmitter circuit board is connected to the laser, and the second surface of the transmitter circuit board is connected to the first surface of the support plate. The lens barrel cooperates with the laser and is connected to the external optical path through the light shield.

[0054] The heat conduction path of the laser component of the laser radar of the present invention is: laser-transmitter circuit board-heat sink-air. Therefore, the heat dissipation device of the present invention can reduce the heat conduction path of the laser component, and at the same time can also reduce the thermal resistance of the heat sink component itself, greatly improving the heat conduction efficiency.

[0055] It should be noted that, in some embodiments, the heat sink may be referred to as a fin or a connector. The following describes various embodiments of the present invention in detail with reference to the accompanying drawings.

[0056] Figure 1 is a three-dimensional schematic diagram of a laser radar 100 according to an embodiment of the present invention. Figure 2: is a three-dimensional schematic diagram of a laser radar heat dissipation device according to an embodiment of the present invention. Figure 1-2 The laser radar of the present invention includes a light shield 10, a laser 20, a lens barrel 30, a transmitting end circuit board 40, and a heat dissipation device 50. A chamber 11 is formed inside the light shield 10. The heat dissipation device 50 includes a support plate 51 and a plurality of heat sinks 52. The support plate 51 has a first surface 511 and a second surface 512 that are opposite to each other. The transmitting end circuit board 41 has a first surface 41 and a second surface 42 that are opposite to each other. The first surface 511 of the support plate 51 is connected to the first surface 41 of the transmitting end circuit board 40. The second surface 512 of the support plate 51 is provided with a plurality of heat sinks 52. The plurality of heat sinks 52 are arranged at intervals on the second surface 512 of the support plate 51. The first surface 41 of the transmitting end circuit board 40 is connected to the laser 20. The lens barrel 30 cooperates with the laser 20 and is connected to the external optical path through the light shield 10. The optical path connection here means that the light emitted by the laser 20 can be transmitted to the outside through the light shield 10 after being transmitted from the lens barrel 30.

[0057] In one embodiment, the laser 20 is bonded to the first surface 41 of the transmitter circuit board 40. The transmitter circuit board 40 compresses the FR4 layer to increase its thermal conductivity and reduce its own thermal resistance. The second surface 42 of the transmitter circuit board 40 is bonded to the first surface 511 of the support plate 51. The support plate 51 acts as a heat sink to conduct heat from the transmitter circuit board and as a reinforcement structure for the transmitter circuit board, supporting the transmitter circuit board and the laser assembly on the first surface 41 of the transmitter circuit board.

[0058] The support plate 51 of the present invention is provided with a heat sink 52 on its second surface 512. This heat sink 52 increases the contact area between the support plate 51 and the air, enhancing heat conduction between the support plate 51 and the air. The heat sink 52 can be integrally formed with the support plate 51, simplifying assembly processes, or it can be installed as a separate component in conjunction with the support plate for easy removal and replacement.

[0059] Continue to refer to Figure 1 The top cover 60 has a shape that matches the top of the mask 10. For example, the mask 10 and the top cover 60 are both cylindrical, and the cylindrical inner diameter of the top cover 60 matches the cylindrical outer diameter of the mask 10, so that it is fitted on the top of the mask 10.

[0060] refer to Figure 1 In the direction shown, the support plate 51 of the heat dissipation device 50 is vertically placed in the chamber 11 of the mask 10, the heat dissipation element 52 is located on the left side of the support plate 51, and the transmitter circuit board 40 and the lens barrel 30 are located on the right side of the support plate 51. The support plate 51 separates the transmitter circuit board 40 and the heat dissipation element 52. In one embodiment, continue to refer to Figure 1The laser radar 100 also includes a rotating bracket 70 and a base 80. The base 80 cooperates with the light cover 10. The rotating bracket 70 is placed in the base 70. The heat dissipation device 50, the transmitting end circuit board 40 and the lens barrel 30 are arranged on the rotating bracket 70 and can rotate with the rotating bracket 70.

[0061] In order to further increase the contact area between the support plate and the air and enhance the heat conduction effect between the support plate and the air, an embodiment of the present invention provides Figure 2 The heat sink shown below. Figure 2 The heat dissipation device 50 of this embodiment is described. Figure 2 In the embodiment shown, the support plate 51 and the plurality of heat sinks 52 of the heat dissipation device 50 are integrally formed. Figure 1-2 , multiple heat dissipation elements 52 extend outward from the second surface 512 of the support plate 51 in a direction perpendicular to the second surface 512 and are arranged at intervals. Preferably, the multiple heat dissipation elements 52 are evenly arranged on the second surface 512 along the height direction of the support plate 51, that is, the distance between each two adjacent heat dissipation elements 52 is equal.

[0062] In one embodiment, to fit within the cylindrical cavity of the photomask 10, the outer periphery of each heat sink is arc-shaped, thereby maximizing the utilization of the internal space of the photomask 10. Preferably, the width of the heat sinks 52 at their connection to the support plate 51 is the same as that of the support plate 51. After protruding a certain distance d1 away from the support plate 51, the width of the heat sinks 52 gradually decreases, forming an arc-shaped outer periphery 521. In one embodiment, the heat sinks 52 are shaped like thin sheets and are parallel to each other.

[0063] In order to facilitate the replacement of the heat sink, one embodiment of the present invention provides Figure 3 The heat sink shown below refers to Figure 3 The heat sink 50A of this embodiment will be described. Figure 3 In the illustrated embodiment, the multiple heat sinks 52 and support plate 51 in the heat dissipation device 50A are independent components. For example, the multiple heat sinks 52 are connected via a connecting plate 53, which is connected to the support plate 51. For example, the multiple heat sinks 52 may integrally extend outward from a first surface 531 of the connecting plate 53 in a direction perpendicular to the first surface 531, and the second surface 532 of the connecting plate 53 may be connected to the second surface 512 of the support plate 51. It should be noted that in other embodiments, the multiple heat sinks 52 may also be directly connected to the second surface 512 of the support plate 51.

[0064] Continue to refer to Figure 3 The transmitting end circuit board 40 is arranged close to the first surface 511 of the support plate 51 , and the laser 20 is arranged between the transmitting end circuit board 40 and the lens barrel 30 . Figure 3The shapes and structures of the plurality of heat sinks 52 shown are similar to those of Figure 2 The heat sink 52 shown is the same and will not be described in detail here.

[0065] Refer to the following Figure 4-8 Describe these different heat sinks. Figure 4-8 The embodiment shown is Figure 2-3 The difference between the embodiment shown is the shape and structure of the heat sink, and the rest of the parts are the same as Figure 2 or Figure 3 The heat sink shown is identical, that is, Figure 4-8 The support plate and the plurality of heat sinks in the heat dissipation device shown can be as follows Figure 2 As shown in the integrated molding, it can also be Figure 3 Shown are separate components. Figure 4-8 The heat dissipation device in Figure 2 and Figure 3 The different parts shown are described below, and the remaining identical parts are not described in detail.

[0066] In order to further increase the contact area between the heat sink and the air, and the heat sink generates disturbances in the air during the rotation process to form air convection to enhance the heat exchange effect between the fins and the air, an embodiment of the present invention provides Figure 4 The heat sink shown, wherein Figure 4 The heat sink shown is in a W-shape. Figure 4 As shown, each of the multiple heat sinks 54 forms a continuous W-shape on the second surface of the support plate or the connecting plate. That is, each heat sink is continuously distributed laterally on the second surface of the support plate or the connecting plate and protrudes upward and downward to form a W-shape. It should be noted that in order to match the inner wall of the cylindrical chamber inside the mask 10, the length of the multiple heat sinks 54 in the same row extending from the second surface of the support plate or the connecting plate to the second surface of the support plate or the connecting plate gradually decreases from the middle to the ends. That is, the heat sinks closer to the middle extend longer from the second surface of the support plate or the connecting plate to the second surface of the support plate or the connecting plate, and the heat sinks closer to the ends extend shorter from the second surface of the support plate or the connecting plate to the second surface of the support plate or the connecting plate, thereby forming an overall arc-shaped profile to maximize the utilization of the internal space of the mask. In one embodiment, the multiple heat sinks 54 have the same shape and structure.

[0067] In order to further increase the contact area between the heat sink and the air, and the heat sink causes the air to be disturbed during the rotation process to form air convection to enhance the heat exchange effect between the fins and the air, an embodiment of the present invention further provides Figure 5 The heat sink shown, Figure 5 The heat dissipation element shown is wavy in shape. Specifically, Figure 5 As shown, each heat sink 55 forms a wave shape on the second surface of the support plate or the connecting plate, that is, each heat sink is continuously distributed laterally on the second surface of the support plate or the connecting plate and protrudes upward and downward to form a wave shape. Figure 5 The heat sink 55 shown is Figure 4 The difference of the heat sink 54 shown is that Figure 4 The heat sink 54 in the embodiment of the present invention protrudes upward and downward to form a sharp corner to form a W shape, and Figure 5 The heat sink 55 in the embodiment of the present invention protrudes upward and downward to form rounded corners, thereby forming a wavy shape. Figure 4 Similar to the multiple heat sinks 54 in FIG. 1 , to fit within the inner wall of the cylindrical chamber within the photomask 10 , the length of the multiple heat sinks 55 in the same row extending from the second surface of the support plate or connecting plate to the second surface away from the support plate or connecting plate gradually decreases from the middle to the ends. In other words, the heat sinks closer to the middle extend longer from the second surface of the support plate or connecting plate to the second surface away from the support plate or connecting plate, while the heat sinks closer to the ends extend shorter from the second surface of the support plate or connecting plate to the second surface away from the support plate or connecting plate, thereby forming an overall curved profile to maximize the utilization of the internal space of the photomask. In one embodiment, the multiple heat sinks 55 have the same shape and structure.

[0068] It should be noted that although Figure 4 Each heat sink 54 is shown to be formed in a W shape, and Figure 5 Each heat sink 55 shown is formed in a wavy shape. However, those skilled in the art will understand that only some of the heat sinks may be formed in a W-shape or a wavy shape, or some may be formed in a W-shape and some may be formed in a wavy shape.

[0069] In order to further increase the contact area between the heat sink and the air, and the heat sink generates disturbances in the air during the rotation process to form air convection to enhance the heat exchange effect between the fins and the air, an embodiment of the present invention provides Figure 6 Heat sink as shown. Figure 6 As shown, the heat dissipation members 56 are short tooth-shaped or thin sheet-shaped and are arranged at intervals on the second surface of the support plate or the connecting plate. Figure 6 The direction shown is defined as the direction parallel to the upper side or lower side of the support plate or the connecting plate as the X-axis direction or the horizontal direction, the direction perpendicular to the X-axis direction or the horizontal direction is the Z-axis direction or the longitudinal direction or the vertical direction, the direction perpendicular to both the X-axis and the Z-axis is the Y-axis direction, and the direction perpendicular to the X-axis and the Z-axis is the Y-axis direction. Figure 1-5 The heat dissipation elements in the embodiment shown are continuously distributed in different directions in the transverse direction. Figure 6The heat dissipation elements shown are discontinuously distributed along the X axis on the second surface of the support plate or the connecting plate. That is, a plurality of heat dissipation elements are arranged in any row along the X axis on the second surface of the support plate or the connecting plate. The plurality of heat dissipation elements in the same row are arranged at intervals and are preferably as follows: Figure 6 As shown, the heat sinks 56 are arranged at an angle A to the X-axis or the horizontal direction, for example, at an angle of 30 degrees, 45 degrees, or 120 degrees to the X-axis or the horizontal direction. In one embodiment, the angles formed by each heat sink in the same row and / or different rows with the X-axis or the horizontal direction are equal. In addition, it should be understood that the plurality of heat sinks 56 can be arranged on the second surface of the support plate or the connecting plate as shown. Figure 6 The arrangement shown may be in a certain pattern or may be irregular.

[0070] In addition, in order to match the inner wall of the cylindrical chamber inside the mask 10, the lengths of multiple heat dissipation elements 56 in the same row extending from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate are different, among which the heat dissipation elements arranged in the middle portion extend from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate for a longer length, and gradually decrease towards the two ends. That is, the heat dissipation elements closer to the middle portion extend from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate for a longer length, and the heat dissipation elements closer to the two ends extend from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate for a shorter length, thereby forming an arc-shaped profile as a whole to maximize the utilization of the internal space of the mask.

[0071] In order to further increase the contact area between the heat sink and the air, and the heat sink generates disturbances in the air during the rotation process to form air convection to enhance the heat exchange effect between the fins and the air, an embodiment of the present invention provides Figure 7 Heat sink shown. Figure 6 The heat sink shown is similar, Figure 7 The heat dissipation members 57 of the heat dissipation device shown are distributed at intervals on the second surface of the support plate or the connecting plate and arranged in a staggered tooth shape. Figure 7 The direction shown is defined as the direction parallel to the upper side or lower side of the support plate or the connecting plate as the X-axis direction or the horizontal direction, the direction perpendicular to the X-axis direction or the horizontal direction is the Z-axis direction or the longitudinal direction or the vertical direction, the direction perpendicular to both the X-axis and the Z-axis is the Y-axis direction, and the direction perpendicular to the X-axis and the Z-axis is the Y-axis direction. Figure 6 The heat sinks shown are distributed in a similar manner laterally. Figure 7 The heat dissipation elements shown are discontinuously distributed in the transverse direction on the second surface of the support plate or the connecting plate. That is, a plurality of heat dissipation elements are arranged in a row in the transverse direction on the second surface of the support plate or the connecting plate. The plurality of heat dissipation elements in the same row are arranged at intervals and are preferably arranged as follows. Figure 7As shown, the first heat sink in the same row is arranged at a first angle A1 to the X-axis, the second heat sink is arranged at a second angle A2 to the X-axis, the third heat sink is arranged at a first angle A1 to the X-axis or the horizontal direction, the fourth heat sink is arranged at a second angle A2 to the X-axis or the horizontal direction, and so on. That is, for the heat sinks in the same row, the odd-numbered heat sinks are arranged at the same first angle A1 to the X-axis or the horizontal direction, and the even-numbered heat sinks are arranged at the same second angle A2 to the X-axis or the horizontal direction. Preferably, the first angle A1 is an acute angle, such as 30 degrees or 45 degrees, and the second angle A2 is an obtuse angle, such as 135 degrees or 145 degrees, so that adjacent heat sinks in the same row are staggered. Preferably, the odd-numbered heat sinks in any row form the same first angle A1 with the X-axis or the horizontal direction, and the even-numbered heat sinks in any row form the same second angle A2 with the X-axis or the horizontal direction.

[0072] In addition, in order to match the inner wall of the cylindrical chamber inside the mask 10, the lengths of the multiple heat dissipation members 57 extending from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate are different. Among them, the heat dissipation member arranged in the middle has a longer length extending from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate, and gradually decreases towards the two ends, thereby forming an arc-shaped profile as a whole to maximize the utilization of the internal space of the mask.

[0073] In order to further increase the contact area between the heat sink and the air, and the heat sink causes the air to be disturbed during the rotation process to form air convection to enhance the heat exchange effect between the fins and the air, an embodiment of the present invention further provides Figure 8 Heat sink as shown. Figure 8 As shown, the heat sink 80 of the present invention is formed in a pin-fin shape. Specifically, each heat sink 58 is formed into a cylinder, one end of which is connected to the second surface of the support plate or the connecting plate, and the other end protrudes away from the second surface of the support plate or the connecting plate. The plurality of heat sinks 58 are spaced apart and arranged in multiple rows on the second surface of the support plate or the connecting plate. Preferably, there is an equal spacing between two adjacent heat sinks 80 in the same row, and the row spacing between two adjacent rows is equal. It should be noted that, Figure 4 Similar to the multiple heat sinks 54 in the photomask 10, in order to match the inner wall of the cylindrical chamber inside the photomask 10, the multiple heat sinks 58 extend from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate at different lengths, among which the heat sink arranged in the middle extends from the second surface of the support plate or the connecting plate to the second surface away from the support plate or the connecting plate at a longer length, and gradually decreases towards both ends, thereby forming an arc-shaped profile as a whole to maximize the use of the internal space of the photomask.

[0074] Refer to the following Figure 9-10 A heat sink 50B according to another embodiment of the present invention will be described.

[0075] like Figure 9 As shown, the heat dissipation device 50B of this embodiment is Figure 2 The difference of the heat dissipation device 50 shown is that a connecting member 59 is provided between at least two adjacent heat dissipation elements 52 of this embodiment. Since the heat distribution between the heat dissipation elements may be uneven, for example, when the rotating bracket rotates around the base, the heat generated will be transferred to the heat dissipation element at the bottom. The temperature of the heat dissipation element at the bottom is generally higher than that of the heat dissipation element at the top. In this way, the heat will be too concentrated at the bottom, affecting the overall heat dissipation efficiency of the heat dissipation device. It should be understood that although Figure 9 In the embodiment shown, the heat sink is Figure 1-3 The flat and smooth sheet-shaped heat sink 52 is shown, but the heat sink can also be Figure 4-8 Any of the heat sinks shown.

[0076] It should be noted that the connector of the present invention not only conducts heat, evenly distributing it among the heat sinks, preventing some heat sinks from being heated while others are heated, and further enhancing overall heat conduction within the heat sinks, but also reduces stress in the portion of the heat sink that is away from the second surface of the support plate. Furthermore, the connector acts as a balancing block for the rotor structure within the entire machine, maintaining its dynamic balance.

[0077] Reference Figure 9 A connecting member 59 for heat conduction is provided between two adjacent heat sinks 52, away from the second surface of the support plate. The connecting member 59 can be, for example, a connecting column or a component of other shapes, such as a quadrangular prism. One end of the connecting member 59 is connected to the lower surface of the upper heat sink of the two adjacent heat sinks, and the other end is connected to the upper surface of the lower heat sink of the two adjacent heat sinks, so that heat is transferred between the two adjacent heat sinks through the connecting member 59, so that the heat of the heat sink with a higher temperature is transferred to the heat sink with a lower temperature, so that the heat of each heat sink is kept relatively uniform, thereby improving the overall heat conduction efficiency of the heat sink.

[0078] In one embodiment, an odd number of connectors may be arranged between two adjacent heat sinks. In this case, an intermediate connector is arranged in the middle of the heat sink along the X-axis, and the other connectors are symmetrically arranged on both sides of the intermediate connector.

[0079] In another embodiment, an even number of connecting members may be arranged between two adjacent heat sinks. In this case, all the connecting members are symmetrically arranged about the center line of the heat sink along the X-axis direction.

[0080] It should be noted that the connector of the present invention can be made of copper, aluminum, aluminum alloy or other similar materials with low thermal resistance.

[0081] In one embodiment, the connecting member may be made of the same material as the heat sink.

[0082] In one embodiment, the connecting member may be a solid cubic structure, a solid cylindrical structure, or other three-dimensional structural deformations.

[0083] In addition, the connecting piece can be formed integrally with the heat sink, or it can be fixedly installed between two adjacent heat sinks as an independent component as needed.

[0084] While the preferred embodiments of the present invention have been described in detail above, it should be understood that, after reading the above teachings of the present invention, those skilled in the art may make various changes or modifications to the present invention. Such equivalents also fall within the scope of the claims appended hereto.

Claims

1. A laser radar heat dissipation device, characterized in that: The laser radar heat dissipation device includes a support plate and multiple heat sinks. The support plate has a first surface and a second surface relative to each other. The first surface is used to connect the transmitter circuit board of the laser radar and the first surface is in contact with the transmitter circuit board. The second surface is provided with the multiple heat sinks, and the multiple heat sinks are arranged at intervals on the support plate.

2. The laser radar heat dissipation device according to claim 1, characterized in that: The plurality of heat dissipating elements are integrally formed with the support plate, or the plurality of heat dissipating elements are separately formed and removably mounted on the second surface of the support plate.

3. The laser radar heat dissipation device according to claim 1, characterized in that: The plurality of heat dissipating elements are in the shape of thin sheets and are parallel to each other.

4. The laser radar heat dissipation device according to claim 3, characterized in that: The plurality of heat dissipating members have arc-shaped circumferences.

5. The laser radar heat dissipation device according to claim 3, characterized in that: The width of the heat sink at the connection portion with the support plate is the same as that of the support plate. After protruding a certain distance away from the support plate, the width of the heat sink gradually decreases to form an arc-shaped periphery.

6. The laser radar heat dissipation device according to claim 1, characterized in that: At least one of the plurality of heat dissipating members forms a continuous W-shape or a wave-shape on the support plate.

7. The laser radar heat dissipation device according to claim 1, characterized in that: The plurality of heat dissipating elements are arranged in a plurality of rows on the support plate, and a plurality of heat dissipating elements are arranged in each row at intervals.

8. The laser radar heat dissipation device according to claim 1, characterized in that: The laser radar heat dissipation device also includes a connecting plate integrally formed with the multiple heat sinks, the multiple heat sinks are connected by the connecting plate and arranged in multiple rows on the connecting plate, and multiple heat sinks are arranged in each row at intervals, and the connecting plate is separately formed from the support plate and connected to the second surface of the support plate.

9. The laser radar heat dissipation device according to claim 7, characterized in that: The plurality of heat dissipating elements in each row are arranged at an angle A to the horizontal direction, wherein the angle A formed by each heat dissipating element in the same row and in different rows to the horizontal direction is equal.

10. The laser radar heat dissipation device according to claim 7, characterized in that: The odd-numbered heat sinks in each row are arranged at the same first angle A1 to the horizontal direction, and the even-numbered heat sinks in each row are arranged at the same second angle A2 to the horizontal direction, so that two adjacent heat sinks in the same row are staggered.

11. The laser radar heat dissipation device according to claim 7 or 8, characterized in that: The length of the heat sink in the middle of the same row is greater than the length of the heat sinks on both sides, forming an arc-shaped profile as a whole.

12. The laser radar heat dissipation device according to claim 1, characterized in that: At least one connecting member is provided between at least two adjacent first and second heat sinks of the plurality of heat sinks, one end of the connecting member is connected to the first heat sink, and the other end of the connecting member is connected to the second heat sink.

13. A laser radar, characterized in that: The laser radar comprises a light cover, a laser, a lens barrel, a transmitting end circuit board and the heat dissipation device according to any one of claims 1 to 12. The interior of the mask forms a cavity, and the laser, lens barrel, emission end circuit board and heat dissipation device are arranged in the cavity, wherein The transmitting end circuit board has a first surface and a second surface relative to each other, the first surface of the transmitting end circuit board is connected to the laser, the second surface of the transmitting end circuit board is connected to the first surface of the support plate, and the lens barrel cooperates with the laser and is connected to the external optical path through the light shield.

14. The laser radar according to claim 13, characterized in that The FR4 layer of the transmitting end circuit board is compressed.

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