Mask Components

Abstract

The present invention provides a mask assembly, comprising: an outer frame; a first mask strip fixed to the outer frame, the first mask strip extending in a first direction; a second mask strip fixed to the outer frame and the first mask strip respectively, the second mask strip extending in a second direction different from the first direction, the first mask strip and the second mask strip forming a plurality of asymmetrically distributed openings; wherein the first mask strip has different widths in a third direction perpendicular to the main surface of the first mask strip, the first mask strip has a width on a side away from the outer frame greater than a width on a side close to the outer frame, and the thickness of the first mask strip in the third direction is greater than a preset value. Through the mask assembly of the present invention, the strength of the first mask strip is improved, and the problem of deformation of the first mask strip caused by the asymmetric force on the mask assembly is improved, thereby improving the yield and reliability of the product.

Description

[Technical field]

[0001] The invention relates to the field of display technology, and in particular to a mask assembly. [Background technology]

[0002] Organic Light Emitting Diode (OLED) has received a lot of attention and development due to its flexibility, fast response time, wide color gamut, and low energy consumption. OLED is composed of an anode, a cathode, and one or more layers of organic materials between the electrodes. The holes and electrons injected from the anode and cathode are combined in the organic light-emitting layer to form excitons, which emit light through radiation transition. However, the cost and yield of OLED have always been two major problems in the current industry, and different generations of lines have their own most economical sizes.

[0003] However, in the current OLED production lines, the cost of making molds for each product is high and the utilization rate of single-size layouts is not high.

[0004] Therefore, the prior art has defects and needs to be improved and developed. [Summary of the invention]

[0005] The present invention provides a mask plate assembly to improve the problem of mixed arrangement of products and improve the yield and reliability of products.

[0006] In order to solve the above problems, the present invention provides a mask plate assembly, comprising: an outer frame; a first mask strip fixed to the outer frame, the first mask strip extending along a first direction; a second mask strip fixed to the outer frame and the first mask strip respectively, the second mask strip extending along a second direction different from the first direction, the first mask strip and the second mask strip forming a plurality of asymmetrically distributed openings; wherein the first mask strip has different widths in a third direction perpendicular to a main surface of the first mask strip, the width of the first mask strip on a side away from the outer frame is greater than the width on a side close to the outer frame, and the thickness of the first mask strip in the third direction is greater than a preset value.

[0007] Wherein, the thickness of the first mask strip in the third direction ranges from 3 mm to 10 mm.

[0008] The material of the outer frame, the first mask strip and / or the second mask strip includes nickel-iron alloy or indium tile alloy.

[0009] Wherein, a cross-sectional shape of the first mask strip on a plane perpendicular to a main surface of the first mask strip comprises an inverted trapezoid.

[0010] The first mask strip has at least one notch in a cross section on a plane perpendicular to the main surface of the first mask strip, and the notch is located on a side of the first mask strip away from the outer frame. The notch is used to fix the second mask strip so that the upper surface of the first mask strip is highly consistent with the upper surface of the second mask strip.

[0011] The thickness of the second mask strip in the third direction ranges from 40um to 200um, and the height of the notch in the third direction ranges from 40um to 200um.

[0012] The angle between the hypotenuse of the inverted trapezoid and the horizontal direction is greater than or equal to 5° and less than 90°.

[0013] The outer frame, the first mask strip and the second mask strip are formed in one piece.

[0014] Wherein, the first mask strip, the second mask strip and / or the outer frame are fixed by threaded connection.

[0015] Wherein, a mask structure is arranged on the opening, and the mask structure is used to form a pixel.

[0016] The beneficial effects of the present invention are as follows: Different from the prior art, the present invention provides a mask assembly, comprising: an outer frame; a first mask strip fixed to the outer frame, the first mask strip extending in a first direction; a second mask strip fixed to the outer frame and the first mask strip respectively, the second mask strip extending in a second direction different from the first direction, the first mask strip and the second mask strip forming a plurality of asymmetrically distributed openings; wherein the first mask strip has different widths in a third direction perpendicular to the main surface of the first mask strip, the first mask strip has a width on a side away from the outer frame greater than a width on a side close to the outer frame, and the thickness of the first mask strip in the third direction is greater than a preset value. Through the mask assembly of the present invention, the strength of the first mask strip is improved, and the problem of deformation of the first mask strip caused by asymmetric force on the mask assembly is improved, thereby improving the yield and reliability of the product.

Brief Description of the Drawings

[0017] Figure 1 A schematic structural diagram of a deformed mask assembly provided in the related art;

[0018] Figure 2 A schematic structural diagram of a mask assembly provided in an embodiment of the present invention;

[0019] Figure 3 for Figure 2 Sectional view along C1-C1;

[0020] Figures 4a to 4g It is a structural schematic diagram of each step of a method for forming a mixed mask on a mask assembly in an embodiment of the present invention. [Specific implementation method]

[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly pointed out that the following examples are only used to illustrate the present invention, but are not intended to limit the scope of the present invention. Similarly, the following examples are only partial embodiments of the present invention rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0022] In addition, the terms first, second, third, etc. mentioned in the present invention can be used to describe various elements here, but these elements should not be limited to these terms. These terms are only used to distinguish these elements from each other. For example, without departing from the scope of the present application, the first can be called the second, and similarly, the second can be called the first. Therefore, the terms used are used to illustrate and understand the present invention, rather than to limit the present invention. In each of the accompanying drawings, units with similar structures are represented by the same reference numerals. For clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, some well-known parts may not be shown in the accompanying drawings.

[0023] In addition, in each of the drawings, units with similar structures are denoted by the same reference numerals. When one component is described as being "connected to" another component, the two can be understood to be directly "connected" or one component can be indirectly "connected to" another component through an intermediate component.

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings.

[0025] Organic Light Emitting Diode (OLED) has received a lot of attention and development due to its flexibility, fast response time, wide color gamut, and low energy consumption. OLED is composed of an anode, a cathode, and one or more layers of organic materials between the electrodes. The holes and electrons injected from the anode and cathode are combined in the organic light-emitting layer to form excitons, and the excitons radiate and transition to emit light. However, OLED cost and yield have always been two major problems in the current industry, and different generation lines have their own most economical sizes. Therefore, the reasonable and efficient layout of OLED large-generation production lines is of paramount importance. The resulting mixed product arrangement (for example, arranging pixel structures of different sizes on the same substrate) can greatly improve the product flexibility and substrate utilization of OLED large-generation lines.

[0026] At present, the mold opening cost of each product in the OLED production line is high, and the utilization rate of single-size layout is not high. There is an urgent need to arrange different sizes into the substrate to improve the utilization rate of the substrate and reduce costs. However, the masks required for evaporation film formation also face many restrictions in mixed arrangement. For example, when mixed arrangement is adopted, the mask strips on the mask plate will be subjected to asymmetric forces, causing the mask strips to deform, making the position accuracy of the mask strips exceed the specification, thereby affecting the yield of the formed product.

[0027] In the related art, in order to achieve mixed arrangement of products, the following method can be used: Figure 1 The mixed mask structure 100 shown. Among them, the mixed mask structure 100 includes a mask frame 110 and a mask plate (not marked in the figure), and the mask plate includes longitudinal mask strips 120 distributed in the vertical direction, and transverse mask strips 130 distributed in the horizontal direction. In general, the mask plate can be a metal mask plate (Fine Metal Mask, FMM). In the manufacture of OLED devices, a metal mask plate can be used for RGB pixel organic light-emitting layer (EL) evaporation treatment, and each opening on the metal mask plate corresponds to a pixel structure. The mask plate can be fixed to the desired position on the mask frame 110 by welding technology. When a non-mixed arrangement is adopted, the mask plate fixed on the mask frame 110 is arranged symmetrically, the mask plate will not be subjected to asymmetric and uneven tension, the mask plate will be less deformed, and the position accuracy of the mask plate will not exceed the specification. However, in actual production applications, no mixed arrangement is performed (only products of the same size are arranged on the same substrate), resulting in a reduced utilization rate of the substrate. For example, when using a large time line without mixing, the substrate utilization rate can only reach about 59% when the product size is 75 inches. However, when 75 inches and other sized products, such as 30 inches, are mixed together, the substrate utilization rate can reach more than 90%. Therefore, mixing large-sized products is inevitable, and the substrate utilization rate can be greatly improved by mixing products.

[0028] However, when mixed product arrangement is used, the mask will be subjected to pulling forces of different magnitudes and directions, resulting in unknown and unavoidable formation of the mask. Figure 1 FIG. 1 is a schematic diagram of the structure of a deformed mask assembly. When the longitudinal mask strip 120 in the mask is subjected to different pulling forces from the left and right transverse mask strips 130, the longitudinal mask strip 120 is deformed, affecting the accuracy of the mask structure 100. Then, one or more masks (not shown in the figure) are arranged on the deformed mixed mask structure 100, and the evaporation holes (not shown in the figure) on the masks are used to form a pixel structure corresponding to the size of the evaporation holes by evaporation treatment, which will affect the size accuracy and yield of the formed pixel structure, thereby affecting the yield and reliability of the product.

[0029] Based on this, Figure 2 As shown, the present invention provides a mask plate assembly 200, including: an outer frame 210; a first mask strip 220 fixed to the outer frame 210, the first mask strip 220 extending along a first direction; a second mask strip 230 fixed to the outer frame 210 and the first mask strip 220 respectively, the second mask strip 230 extending along a second direction different from the first direction, and the first mask strip 220 and the second mask strip 230 form a plurality of asymmetrically distributed openings; wherein, the first mask strip 220 has different widths in a third direction (Z direction) perpendicular to the main surface of the first mask strip 220, the width of the first mask strip 220 on the side away from the outer frame 210 is greater than the width on the side close to the outer frame 210, and the thickness of the first mask strip 220 in the third direction (Z direction) is greater than a preset value.

[0030] As can be seen from the above, OLED is composed of an anode, a cathode, and one or more layers of organic materials between the electrodes. The holes and electrons injected from the anode and the cathode are combined in the organic light-emitting layer to form excitons, and the excitons radiate and transition to emit light. In the OLED, the thin film of the one or more layers of organic materials can be an organic light-emitting layer (EL), through which red (R), green (G) and blue (B) light can be emitted, thereby realizing a full-color image display. Among them, the organic light-emitting layers with different colors of red (R), green (G) and blue (B) can be arranged as sub-pixels on a substrate, that is, the organic light-emitting layer can be used as a pixel in the OLED, and the pixel includes a plurality of red (R), green (G) and blue (B) sub-pixels. The method for forming the organic light-emitting layer (EL) includes using a patterned mask plate, and forming it by a photolithography process or an evaporation process. Since the organic light-emitting layer is sensitive to humidity, it is difficult to form the organic light-emitting layer by a photolithography process. In order to solve this problem, a mask with a specific pattern can be used, a mask with evaporation holes can be set on the mask, and an evaporation process can be performed in a vacuum to form an organic light-emitting layer of a required size.

[0031] Specifically, Figure 2As shown, the mask assembly 200 includes an outer frame 210, a first mask strip 220 and a second mask strip 230. The outer frame 210 serves as the basis of the mask assembly 200 and can play a supporting role. The first mask strip 220 extends along a first direction. Generally, the first direction can be a vertical direction, that is, a Y direction. Generally, the first mask strip 220 can be fixed on the outer frame 210. The second mask strip 230 extends along a second direction different from the first direction. Generally, the second direction can be a horizontal direction, that is, an X direction. Generally, one end of the second mask strip 230 is fixed on the outer frame 210, and the other end is fixed on the first mask strip 220. A plurality of asymmetrically distributed openings are formed by the first mask strip 220 and the second mask strip 230, and the openings are used to form thin films of different sizes through subsequent evaporation processing to achieve mixed arrangement of products to improve the utilization rate of the substrate.

[0032] In addition, it should be noted that an organic light-emitting layer can be formed by the mask assembly 200 , and other thin films can also be formed by the mask assembly 200 , without any particular limitation.

[0033] Specifically, Figure 3 As shown, the first mask strip 220 has different widths in a third direction (Z direction) perpendicular to the main surface of the first mask strip 220, the width W1 of the first mask strip 220 on the side away from the outer frame 210 (i.e., the upper surface of the first mask strip 220) is greater than the width W2 on the side close to the outer frame 210 (i.e., the lower surface of the first mask strip 220), and the thickness H1 of the first mask strip 220 in the third direction (Z direction) is greater than a preset value.

[0034] In the related art, generally, the first mask strip 220 adopts a cross section with the same width on the upper surface and the lower surface. When the evaporation treatment is performed later, it is easy for the lower surface near the first mask strip 220 to not be completely filled by evaporation, resulting in the formation of gaps near the lower surface of the first mask strip 220, affecting the yield and reliability of the product. By adopting the first mask strip 220 with a width W1 on the side away from the outer frame 210 (i.e., the upper surface of the first mask strip 220) greater than the width W2 on the side close to the outer frame 210 (i.e., the lower surface of the first mask strip 220), and then adjusting the evaporation angle during the evaporation process, it is possible to avoid the problem that the lower surface near the first mask strip 220 is not completely filled by evaporation, resulting in the formation of gaps near the lower surface of the first mask strip 220, improve the uniformity of film formation, reduce the size of the uneven film formation area, and improve the yield and reliability of the product.

[0035] In addition, it should be noted that the cross-sectional shape of the first mask strip 220 on a plane perpendicular to the main surface of the first mask strip 220 is not particularly limited, as long as the width W1 of the upper surface of the first mask strip 220 is greater than the width W2 of the lower surface of the first mask strip 220.

[0036] In addition, as can be seen from the above, when the products are mixed, the mask will be subjected to pulling forces from different directions and different sizes, resulting in unknown and unavoidable formation of the mask. By adopting the thickness H1 of the first mask strip 220 in the third direction (Z direction) to be greater than the preset value, the strength of the first mask strip 220 is improved, and deformation is avoided when the first mask strip 220 is subjected to asymmetric pulling force, and the dimensional accuracy of the mask assembly 200 is avoided from exceeding the specification, ensuring the quality of the subsequent mixed mask set on the mask assembly 200, thereby improving the yield and reliability of the product.

[0037] According to the above, in the embodiment of the present invention, the strength of the first mask strip 220 is improved through the mask assembly 200 of the present invention, and the problem of deformation of the first mask strip 220 due to the asymmetric force on the mask assembly 200 is improved, thereby ensuring the quality of the subsequent mixed mask set on the mask assembly 200, thereby improving the yield and reliability of the product.

[0038] The thickness H1 of the first mask strip 220 in the third direction (Z direction) is in the range of 3 mm to 10 mm.

[0039] Specifically, the thickness H1 in the third direction (Z direction) is greater than the preset value to improve the strength of the first mask strip 220 and prevent the first mask strip 220 from deforming when subjected to an asymmetric force. The preset value can be set according to the actual needs of the mask assembly 200, and the thickness H1 of the first mask strip 220 can be set as small as possible while satisfying the stress intensity. Preferably, the thickness H1 of the first mask strip 220 ranges from 3 mm to 10 mm.

[0040] The material of the outer frame 210, the first mask strip 220 and / or the second mask strip 230 includes nickel-iron alloy or indium watt alloy.

[0041] Specifically, it can be seen from the above that the mask assembly 200 can be applied to the subsequent evaporation process. In order to further ensure the strength of the mask assembly 200, a material with a small expansion coefficient and high strength during the evaporation process can be selected to effectively improve the quality of the mask assembly 200. Preferably, the material of the outer frame 210, the first mask strip 220 and / or the second mask strip 230 can be a nickel-iron alloy or an indium tile alloy. Specifically preferably, the material of the outer frame 210, the first mask strip 220 and / or the second mask strip 230 can be an indium tile alloy.

[0042] The cross-sectional shape of the first mask strip 220 on a plane (XZ plane) perpendicular to the main surface of the first mask strip 220 includes an inverted trapezoid.

[0043] Specifically, Figure 3 As shown, Figure 2 A cross-sectional view taken along the middle line C1-C1. As can be seen from the above, the uniformity of the thin film formed by evaporation using the mask assembly 200 can be improved by designing the cross section of the first mask strip 220 while satisfying the strength. Preferably, the cross-sectional shape of the first mask strip 220 on the plane (XZ plane) perpendicular to the main surface of the first mask strip 220 includes an inverted trapezoid. By forming a first mask strip 220 having a cross-sectional shape including an inverted trapezoid, the parameters in the evaporation process can be adjusted, for example, the evaporation angle can be adjusted, and an angle parallel to the hypotenuse in the inverted trapezoid can be selected, so that the problem of forming a gap near the lower surface of the first mask strip 220 due to incomplete evaporation filling can be avoided, so that the uniformity of the thin film formed by evaporation is better, the size of the uneven film forming area is reduced, and the yield and reliability of the product are improved. Specifically preferably, the inverted trapezoid can be a symmetrical figure, for example, the inverted trapezoid is symmetrical along the third direction (Z direction) perpendicular to the main surface of the first mask strip 220.

[0044] The included angle α between the hypotenuse of the inverted trapezoid and the horizontal direction is greater than or equal to 5° and less than 90°.

[0045] Specifically, the cross-sectional shape of the first mask strip 220 can be designed. For example, when the cross-sectional shape is an inverted trapezoid, the angle (tape angle) between the hypotenuse in the inverted trapezoid and the horizontal direction can be designed to improve the uniformity of the thin film formed by evaporation, reduce the size of the uneven film forming area, and improve the yield and reliability of the product. Preferably, the angle α between the hypotenuse of the inverted trapezoid and the horizontal direction is greater than or equal to 5° and less than 90°.

[0046] Among them, the cross-section of the first mask strip 220 on the plane (XZ plane) perpendicular to the main surface of the first mask strip 220 has at least one notch 221, and the notch 221 is located on the side of the first mask strip 220 away from the outer frame 210. The notch 221 is used to fix the second mask strip 230 so that the upper surface of the first mask strip 220 and the upper surface of the second mask strip 230 are highly consistent.

[0047] Specifically, Figure 3As shown, a notch 221 can be formed on the first mask strip 220, and the notch 221 is located on the side of the first mask strip 220 away from the outer frame 210 (i.e., the upper surface of the first mask strip 220), that is, a step is formed on the upper surface of the first mask strip 220, and the notch 221 is used to fix the second mask strip 230 so that the upper surface of the first mask strip 220 and the upper surface of the second mask strip 230 are highly consistent. After the mask assembly 200 is formed, a glass substrate or a mask will be arranged on the mask assembly 200, and the upper surface of the first mask strip 220 and the upper surface of the second mask strip 230 are highly consistent, which is conducive to the subsequent arrangement of other structures on the mask assembly 200.

[0048] In addition, it should be noted that the cross-sectional shape of the notch 221 on the first mask strip 220 in the XZ plane can be a rectangle or other shapes, as long as it can be achieved that after the second mask strip 230 is fixed on the first mask strip 220, the upper surface of the first mask strip 220 and the upper surface of the second mask strip 230 are highly consistent, without any special limitation.

[0049] In addition, it should be noted that the number of notches 221 on the first mask strip 220 is not particularly limited, and is designed according to the number of second mask strips 230 to be fixed as needed. For example, when the first mask strip 220 only needs to fix one second mask strip 230 at the same position, a notch 221 can be formed in the area corresponding to the position on the upper surface of the first mask strip 220 for fixing the second mask strip 230. For example, when the first mask strip 220 needs to be fixed with the second mask strips 230 on the left and right sides at the same position, two notches 221 can be formed in the area corresponding to the position on the upper surface of the first mask strip 220, and the notches 221 are respectively used to fix the second mask strips 230 located on the left and right sides. When two notches 221 are formed at the same position of the first mask strip 220, in order to further reduce the influence of asymmetric forces on the first mask strip 220, the two notches 221 can be symmetrically arranged about the Z direction.

[0050] The thickness W3 of the second mask strip 230 in the third direction is in the range of 40 um to 200 um, and the height H2 of the notch 221 in the third direction is in the range of 40 um to 200 um.

[0051] Specifically, it can be seen from the above that the upper surface of the first mask strip 220 and the upper surface of the second mask strip 230 can be designed to be consistent in height. In order to ensure the strength of the mask assembly 200, preferably, the thickness W3 of the second mask strip 230 in the third direction ranges from 40um to 200um, and the height H2 of the notch 221 in the third direction ranges from 40um to 200um. In addition, in order to ensure the strength of the first mask strip 220, the width W4 of the notch 221 can range from 5mm to 15mm.

[0052] The outer frame 210 and the first mask strips 220 and the second mask strips 230 are formed in one piece.

[0053] Specifically, in general, the first mask strip 220, the second mask strip 230 and the outer frame 210 can be fixed by welding technology. In order to further ensure the strength of the mask assembly 200, the outer frame 210, the first mask strip 220 and the second mask strip 230 can be formed by integral molding to improve the overall strength of the mask assembly 200, reduce the deformation of the mask assembly 200, and thus improve the yield and reliability of the product.

[0054] The first mask strips 220 , the second mask strips 230 and / or the outer frame 210 are fixed by threaded connection.

[0055] In addition, unlike the one-piece molding method, the first mask strip 220, the second mask strip 230 and / or the outer frame 210 can also be connected by other fixing methods to further ensure the strength of the mask assembly 200. For example, the first mask strip 220, the second mask strip 230 and / or the outer frame 210 are fixed by threaded connection to fix the first mask strip 220 and the second mask strip 230 at the required position on the outer frame 210.

[0056] Wherein, a mask is arranged on the opening, and the mask is used to form a pixel structure.

[0057] Specifically, after forming the mask assembly 200 in the embodiment of the present invention, one or more masks may be provided on the opening of the mask assembly 200, and the mask may be provided with evaporation holes, through which a pixel structure may be formed during evaporation treatment. The pixel structure may be an RGB sub-pixel structure in an organic light-emitting layer, and in an OLED, red (R), green (G) and blue (B) light is emitted through the organic light-emitting layer to realize full-color image display.

[0058] Specifically, after forming the mask assembly 200 in the embodiment of the present invention, masks of different sizes can be set on the mask assembly 200, and pixel structures of different sizes can be formed by masks of different sizes, and the utilization rate of the substrate can be improved by mixing products. The process of forming the mask of the mixed product arrangement can be: first, as Figure 4a and 4b As shown, a plurality of first masks 240 are successively fixed on the mask assembly 200, and the first masks 240 have first evaporation holes 241, and an organic light-emitting layer of pixels corresponding to the size of the first evaporation holes 241 can be formed later through the first evaporation holes 241. In particular, since there will be tension from the mask assembly 200 on the first mask 240 when the first mask 240 is fixed on the mask assembly 200, first buffer holes 242 can be formed on both outer sides of the first mask 240 to improve the stress distribution of the first mask 240 structure and avoid deformation of the first evaporation holes 241 on the first mask 240. Secondly, as Figure 4c and 4d As shown, the redundant parts on the left and right sides of the first mask 240 are removed respectively, so that the two side edges of the first mask 240 are flush with the outer frame 210 and the first mask strip 220. The redundant parts on both sides of the first mask 240 can be removed by laser process.

[0059] Then, if Figure 4e and 4f As shown, a plurality of second masks 250 are successively arranged on the mask assembly 200, and the second masks 250 have second evaporation holes 251, and an organic light-emitting layer of pixels corresponding to the size of the second evaporation holes 251 can be formed subsequently through the second evaporation holes 251. The sizes of the first evaporation holes 241 on the first mask 240 and the second evaporation holes 251 on the second mask 250 are different, that is, products of different sizes can be mixed on the same mask assembly 200 (corresponding to the same substrate) to improve the utilization rate of the substrate. Second buffer holes 252 can also be formed on both outer sides of the second mask 250 to improve the stress distribution of the second mask 250 structure and avoid deformation of the second evaporation holes 251 on the second mask 250. The material of the first mask 240 and / or the second mask 250 can be nickel-iron alloy or indium watt alloy. Finally, as Figure 4g As shown, the redundant parts on the left and right sides of the second mask 250 are removed respectively, so that the two side edges of the second mask 250 are flush with the first mask strip 220 and the outer frame 210 respectively, so as to achieve the mixing of products of different sizes on the same mask assembly 200 to improve the utilization rate of the substrate.

[0060] It should be understood that the terms first and second are only used to distinguish the first mask 240 from the second mask 250 , the first evaporation hole 241 from the second evaporation hole 251 , and the first buffer hole 242 from the second buffer hole 252 , and there is no particular limitation.

[0061] As can be seen from the above, the present invention provides a mask assembly, including: an outer frame; a first mask strip fixed to the outer frame, the first mask strip extending in a first direction; a second mask strip fixed to the outer frame and the first mask strip respectively, the second mask strip extending in a second direction different from the first direction, the first mask strip and the second mask strip forming a plurality of asymmetrically distributed openings; wherein the first mask strip has different widths in a third direction perpendicular to the main surface of the first mask strip, the first mask strip has a width on the side away from the outer frame greater than the width on the side close to the outer frame, and the thickness of the first mask strip in the third direction is greater than a preset value. Through the mask assembly of the present invention, the strength of the first mask strip is improved, and the problem of deformation of the first mask strip caused by the asymmetric force on the mask assembly is improved, thereby improving the yield and reliability of the product.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A mask assembly, It is characterized in that include: External frame; a first mask strip fixed to the outer frame, the first mask strip extending along a first direction; a second mask strip respectively fixed to the outer frame and the first mask strip, the second mask strip extending along a second direction different from the first direction, the first mask strip and the second mask strip forming a plurality of asymmetrically distributed openings; The first mask strip has different widths in a third direction perpendicular to the main surface of the first mask strip, the width of the first mask strip on a side away from the outer frame is greater than the width on a side close to the outer frame, and the thickness of the first mask strip in the third direction is greater than a preset value; The first mask strip has at least one notch in a cross section on a plane perpendicular to a main surface of the first mask strip, and the notch is located on a side of the first mask strip away from the outer frame, and the notch is used to fix the second mask strip so that the upper surface of the first mask strip is highly consistent with the upper surface of the second mask strip.

2. The mask assembly according to claim 1, It is characterized in that The thickness of the first mask strip in the third direction ranges from 3 mm to 10 mm.

3. The mask assembly according to claim 1, It is characterized in that The material of the outer frame, the first mask strip and / or the second mask strip includes nickel-iron alloy or indium watt alloy.

4. The mask assembly according to claim 1, It is characterized in that A cross-sectional shape of the first mask stripe on a plane perpendicular to a major surface of the first mask stripe includes an inverted trapezoid.

5. The mask assembly according to claim 4, It is characterized in that The thickness of the second mask strip in the third direction ranges from 40um to 200um, and the height of the notch in the third direction ranges from 40um to 200um.

6. The mask assembly according to claim 4, It is characterized in that The angle between the hypotenuse of the inverted trapezoid and the horizontal direction is greater than or equal to 5° and less than 90°.

7. The mask assembly according to claim 1, It is characterized in that The outer frame is formed with the first mask strip and the second mask strip by integral molding.

8. The mask assembly according to claim 1, It is characterized in that The first mask strip, the second mask strip and / or the outer frame are fixed by threaded connection.

9. The mask assembly according to claim 1, It is characterized in that A mask is arranged on the opening, and the mask is used to form a pixel structure.

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