Heating components and electronic atomization devices

Abstract

The present application discloses a heating component and an electronic atomization device, wherein the heating component includes a porous ceramic substrate, a heating layer and a first dielectric layer. The heating layer is bonded to the porous ceramic substrate, and the first dielectric layer is bonded to the surface of the heating layer away from the porous ceramic substrate. The first dielectric layer includes inorganic non-metallic materials in glass phase and non-glass phase. By arranging the first dielectric layer on the surface of the heating layer away from the porous ceramic substrate, the substrate to be atomized is blocked from contacting the heating layer, which greatly reduces the corrosion of the substrate to be atomized on the heating layer, prolongs the service life of the heating component, and further prolongs the service life of the electronic atomization device. Moreover, since the first dielectric layer blocks the corrosion of the substrate to be atomized on the heating layer, the heating layer can be made of a material without harmful heavy metals, which minimizes the safety hazards caused by the material of the heating layer in the heating component to the user of the electronic atomization device.

Description

Technical Field

[0001] The present application relates to the technical field of atomizers, and in particular to a heating component and an electronic atomization device. Background Art

[0002] Existing ceramic atomizer cores for electronic atomizers are mostly made by printing nickel-chromium or iron-chromium-aluminum on a porous ceramic substrate. The metal film on the ceramic atomizer core contains a high chromium content, typically around 20% by weight. This high chromium content is designed to ensure a protective chromium oxide passivation film forms on the metal film during use, preventing corrosion and failure during the atomization process.

[0003] It is well known that heavy metals (such as chromium) can accumulate in human organs such as the liver, kidneys, and lungs, causing damage to these organs. The presence of high levels of chromium and other harmful heavy metals in the metal film of the ceramic atomizer core poses a safety hazard to users of electronic atomizer devices. Furthermore, the metal film of the ceramic atomizer core is susceptible to corrosion, which reduces the service life of the electronic atomizer device. Summary of the Invention

[0004] In view of this, the present application provides a heating component and an electronic atomization device to solve the safety hazards brought to users of the electronic atomization device by the metal film of the ceramic atomization core in the prior art.

[0005] In order to solve the above technical problems, the first technical solution provided in this application is: providing a heating component, including: a porous ceramic substrate, a heating layer and a first dielectric layer; the heating layer is bonded to the porous ceramic substrate; the first dielectric layer is bonded to the surface of the heating layer away from the porous ceramic substrate; the first dielectric layer includes an inorganic non-metallic material of a glass phase and a non-glass phase.

[0006] The method further includes a second dielectric layer, which is bonded to the surface of the heating layer close to the porous ceramic substrate.

[0007] The method further includes a third dielectric layer, which is adhered to the surface of the first dielectric layer away from the heating layer; and a plurality of through holes are provided on the third dielectric layer.

[0008] The invention is characterized in that the weight percentage of the glass phase in the first dielectric layer, the second dielectric layer and the third dielectric layer is 77%-93%, and the weight percentage of the inorganic non-metallic material of the non-glass phase is 7%-23%.

[0009] The feature of the invention is that the glass phase is a SiO2-ZnO-BaO system.

[0010] Wherein, the non-glass phase inorganic non-metallic material is one or more of SiO2, Al2O3, and SiC, and the particle size of the inorganic non-metallic material is 1 μm-20 μm.

[0011] Wherein, the thickness of the first dielectric layer, the second dielectric layer and the third dielectric layer is 5 μm-60 μm.

[0012] The patterns of the first dielectric layer, the second dielectric layer and the third dielectric layer are the same.

[0013] The raw material of the heating layer is a metal or non-metal conductive phase, and the thickness of the heating layer is 5 μm-60 μm.

[0014] The raw material of the heating layer is one or more of silver-based alloy, nickel-based alloy, iron-based alloy, titanium-based alloy and zirconium-based alloy.

[0015] In order to solve the above technical problems, the second technical solution provided in this application is: to provide an electronic atomization device, including: a heating component, and the heating component is any one of the heating components described above.

[0016] Beneficial effects of the present application: Different from the prior art, the heating component in the present application includes a porous ceramic substrate, a heating layer and a first dielectric layer. The heating layer is bonded to the porous ceramic substrate, and the first dielectric layer is bonded to the surface of the heating layer away from the porous ceramic substrate. The first dielectric layer includes inorganic non-metallic materials in glass phase and non-glass phase and an organic carrier. By arranging the first dielectric layer on the surface of the heating layer away from the porous ceramic substrate, the substrate to be atomized is blocked from contacting the heating layer, which greatly reduces the corrosion of the substrate to be atomized on the heating layer, prolongs the service life of the heating component, and further prolongs the service life of the electronic atomization device; and because the first dielectric layer blocks the corrosion of the substrate to be atomized on the heating layer, the heating layer can be made of a material without harmful heavy metals, which minimizes the safety hazards caused by the material of the heating layer in the heating component to the user of the electronic atomization device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 It is a structural schematic diagram of the electronic atomization device provided by this application;

[0019] Figure 2 This is a structural diagram of the first embodiment of the heating component provided by this application;

[0020] Figure 3 This is a flow chart of a method for manufacturing a heating component in the first embodiment of the heating component provided by this application;

[0021] Figure 4 This is a schematic structural diagram of the second embodiment of the heating component provided by this application;

[0022] Figure 5 This is a flow chart of a method for manufacturing a heating component in the second embodiment of the heating component provided by this application;

[0023] Figure 6 is a topographical diagram of step S03 in the second embodiment of the heating component provided by the present invention;

[0024] Figure 7 is a topographical diagram of step S04 in the second embodiment of the heating component provided by the present invention;

[0025] Figure 8 This is a structural diagram of step S05 in the second embodiment of the heating component provided by the present invention;

[0026] Figure 9 This is a schematic structural diagram of the third embodiment of the heating component provided by this application;

[0027] Figure 10 This is a flow chart of a method for manufacturing a heating component in the third embodiment of the heating component provided in this application. DETAILED DESCRIPTION

[0028] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only intended to illustrate the present application and are not intended to limit the scope of the present application. Similarly, the following examples are only some examples of the present application and not all examples. All other examples obtained by those of ordinary skill in the art without creative work are intended to fall within the scope of protection of this application.

[0029] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. The terms "including" and "having" in the embodiments of this application and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0030] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] See also Figure 1 , is a structural schematic diagram of the electronic atomization device provided in this application.

[0032] The electronic atomization device can be used to atomize liquid matrices such as cigarette liquid and liquid medicine. The electronic atomization device includes an atomizer 1 and a power supply assembly 2 that are connected to each other.

[0033] The nebulizer 1 is used to store the matrix to be atomized and atomize the matrix to be atomized to form an aerosol that can be inhaled by the user. The nebulizer 1 can be used to atomize the matrix to be atomized and generate an aerosol for use in different fields, such as medical treatment, electronic aerosolization devices, etc. In a specific embodiment, the nebulizer 1 can be used in an electronic aerosolization device to atomize the matrix to be atomized and generate an aerosol for inhalation by the inhaler. The following embodiments are all taken as an example. Of course, in other embodiments, the nebulizer 1 can also be used in a hairspray device to atomize hairspray for hair styling; or in a medical device for treating upper and lower respiratory system diseases to atomize medical drugs. The nebulizer 1 includes a heating component 11 and a liquid reservoir 12. The liquid reservoir 12 is used to store the matrix to be atomized, and the heating component 11 is used to heat and atomize the matrix to be atomized in the liquid reservoir 12.

[0034] The power supply assembly 2 includes a battery 21, a controller 22 and an airflow sensor 23; the battery 21 is used to power the nebulizer 1 so that the nebulizer 1 can atomize the liquid matrix to form an aerosol; the controller 22 is used to control the operation of the nebulizer 1; the airflow sensor 23 is used to detect airflow changes in the electronic atomization device to start the electronic atomization device.

[0035] The atomizer 1 and the power supply assembly 2 can be integrated or detachably connected, depending on the specific needs.

[0036] See also Figure 2 , is a structural diagram of the first embodiment of the heating component provided in this application.

[0037] In this embodiment, the heating component 11 includes a porous ceramic substrate 13, a heating layer 14, and a first dielectric layer 15. The heating layer 14 is bonded to the porous ceramic substrate 13, and the first dielectric layer 15 is bonded to the surface of the heating layer 14 away from the porous ceramic substrate 13. The heating layer 14 can be a metal film, a metal wire, a metal mesh, or other heating circuit, which can be selected as needed. The first dielectric layer 15 can be a glass phase, a ceramic film layer, etc. that is stable in the substrate to be atomized or the atomized aerosol, and can block the contact between the substrate to be atomized or the atomized aerosol and the heating layer 14.

[0038] In this embodiment, the first dielectric layer 15 includes a glass phase and a non-glass phase inorganic non-metallic material. The glass phase accounts for 77% to 93% of the total weight of the first dielectric layer 15, and the non-glass phase inorganic non-metallic material accounts for 7% to 23% of the total weight of the first dielectric layer 15.

[0039] The first dielectric layer 15 is made by drying a first slurry. The first slurry includes a glass phase, an inorganic non-metallic material in a non-glass phase, and an organic carrier. The organic carrier includes a resin and a solvent. During the drying process of the first slurry, the organic carrier continues to evaporate. Therefore, the first dielectric layer 15 includes an inorganic non-metallic material in a glass phase and a non-glass phase. The difference between the first dielectric layer 15 and the first slurry is whether it contains an organic carrier. Among them, the inorganic non-metallic material in the non-glass phase is a high-melting-point inorganic non-metallic material (melting point greater than 1800°C), and its melting point is higher than the melting point of the glass phase.

[0040] In the first slurry, the weight percentage of the glass phase in the total weight of the first slurry is 50%-70%, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the first slurry is 5%-15%, and the weight percentage of the organic carrier in the total weight of the first slurry is 25%-35%.

[0041] In one embodiment, the glass phase is a SiO2-ZnO-BaO system, which can better match the porous ceramic matrix 13 to prevent the first slurry from generating stress during high-temperature sintering and causing microcracks in the first dielectric layer 15; the glass phase system is not limited to the SiO2-ZnO-BaO system, and other systems such as SiO2-CaO-ZnO, SiO2-ZnO-R2O, SiO2-B2O3, etc. can all be realized. The material of the glass phase can be specifically selected according to the porous ceramic matrix 13 and the sintering process of the first slurry.

[0042] In one embodiment, the inorganic non-metallic material of the non-glass phase includes SiO2, and the particle size of the inorganic non-metallic material of the non-glass phase is 1μm-20μm, which can better reduce the expansion and contraction of the first slurry during the high-temperature sintering process; the inorganic non-metallic material of the non-glass phase is not limited to SiO2, and Al2O3, ZrO2, SiC, etc. with similar functions can be realized. The inorganic non-metallic material of the non-glass phase can be selected according to needs.

[0043] In one embodiment, the organic vehicle includes a resin and a solvent. The resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate. Both terpineol and butyl carbitol acetate are good solvents for ethyl cellulose. The combination of terpineol and butyl carbitol acetate can regulate the volatility and leveling properties of the first slurry. At the same time, terpineol and butyl carbitol acetate can adjust the viscosity of the organic vehicle. The appropriate viscosity can fully wet the glass phase and non-glass phase inorganic non-metallic materials, thereby improving the printability of the first slurry. The weight percentage of terpineol to the total weight of the organic vehicle is 50%-70%, the mass percentage of butyl carbitol acetate to the total weight of the organic vehicle is 27%-42%, and the weight percentage of ethyl cellulose to the total weight of the organic vehicle is 3%-8%. In other embodiments, the resin can also be cellulose acetate butyrate, acrylic resin, polyvinyl butyral, etc.; the solvent can also be butyl carbitol, diethylene glycol dibutyl ether, triethylene glycol butyl ether, alcohol ester dodecahydrate, tributyl citrate, tripropylene glycol butyl ether, etc.; the specific material composition of the resin and solvent can be selected as needed.

[0044] There are many systems of substrates to be atomized. The pH value of the substrate to be atomized is usually 3.9-10.2, and the atomization temperature is usually 200-350°C. The substrate to be atomized is extremely corrosive at the atomization temperature. In order to reduce the corrosiveness of the substrate to be atomized to the heating layer 14, it is usually achieved by increasing the chromium content in the raw materials of the heating layer 14 so that a protective chromium oxide passivation film is formed on the surface of the heating layer 14. Chromium is a harmful heavy metal. The accumulation of heavy metals in human organs such as the liver, kidneys, and lungs will cause damage to the corresponding organs, posing a threat to the health of the user. Moreover, after the heating layer 14 is corroded by the substrate to be atomized, the performance of the heating layer 14 is affected, making it impossible for the heating layer 14 to accurately respond to the control signal of the controller 22. There is a difference between the temperature actually reached by heating the heating layer 14 and the temperature required to be reached by the controller 22, or the temperature actually reached by heating the heating layer 14 is unstable, which affects the concentration of volatile aroma in the aerosol, thereby affecting the consistency of the taste of the atomized aerosol and reducing the user's experience.

[0045] In the present application, the material of the first dielectric layer 15 enables it to exist stably in the substrate to be atomized or the atomized aerosol, and is almost uncorroded by the substrate to be atomized or the atomized aerosol. By attaching the first dielectric layer 15 to the surface of the heating layer 14 away from the porous ceramic substrate 13, since both the heating layer 14 and the first dielectric layer 15 are dense layers, the first dielectric layer 15 can block the substrate to be atomized or the atomized aerosol from contacting the heating layer 14, greatly reducing the corrosion of the substrate to be atomized or the atomized aerosol on the heating layer 14 and extending its service life; thereby reducing the requirements for the heavy metal content (such as chromium) in the heating layer 14 material.

[0046] By setting the first dielectric layer 15 to protect the heating layer 14, the heating layer 14 can use any metal or non-metal conductive phase that meets the functional standards, greatly improving product safety; even in order to cut off the safety hazards caused by harmful heavy metals or reduce costs, a metal or non-metal conductive phase without harmful heavy metals can be selected.

[0047] In the embodiment of the present application, the material of the heating layer 14 does not contain toxic heavy metals; the heating layer 14 can be made of biomedical materials, such as titanium-based alloys, zirconium-based alloys, nickel-based alloys, silver-based alloys, iron-based alloys, etc., so that the heating layer 14 is easy to sinter, has high safety, and has excellent dry and wet burning properties.

[0048] See also Figure 3 , is a flow chart of a method for manufacturing a heating component in the first embodiment of the heating component provided in this application.

[0049] The manufacturing method of the heating component 11 includes:

[0050] Step S01: obtaining a porous ceramic substrate.

[0051] Specifically, ceramic powder is prepared, and the porous ceramic matrix 13 is manufactured by screen printing and sintering.

[0052] Step S02: forming a heating layer on the surface of the porous ceramic.

[0053] Specifically, the raw materials used to form the heating layer 14 are made into a resistor paste; the resistor paste is screen-printed onto the surface of the porous ceramic substrate 13; and the porous ceramic substrate 13 and the resistor paste are dried at a predetermined temperature (60-80°C) in an air atmosphere to form the heating layer 14 on the surface of the porous ceramic substrate 13. In this embodiment, the resistor paste is primarily composed of nickel. The thickness of the heating layer 14 is 5 μm to 60 μm.

[0054] Step S03: forming a first dielectric layer on the surface of the heating layer away from the porous ceramic substrate.

[0055] Specifically, the raw materials used to form the first dielectric layer 15 are made into a first slurry; the first slurry is screen-printed on the surface of the heating layer 14 away from the porous ceramic substrate 13; in an air atmosphere, the porous ceramic substrate 13, the heating layer 14 and the first slurry are dried at a certain temperature (60-80°C) to form the first dielectric layer 15 on the surface of the heating layer 14 away from the porous ceramic substrate 13. The thickness of the first dielectric layer 15 is 5μm-60μm, and the resistance value is 0.7Ω-0.9Ω.

[0056] The first slurry includes a glass phase, a non-glass phase inorganic non-metallic material, and an organic vehicle, and the organic vehicle includes a resin and a solvent. In this embodiment, the glass phase is a SiO2-ZnO-BaO system, and the glass phase accounts for 50%-70% by weight of the total weight of the first slurry. The non-glass phase inorganic non-metallic material includes SiO2, the particle size of the non-glass phase inorganic non-metallic material is 1μm-20μm, and the non-glass phase inorganic non-metallic material accounts for 5%-15% by weight of the total weight of the first slurry. The organic vehicle accounts for 25%-35% by weight of the total weight of the first slurry. The organic vehicle includes a resin and a solvent, the resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate, with the ethyl cellulose accounting for 3%-8% by weight of the total weight of the organic vehicle, the terpineol accounting for 50%-70% by weight of the total weight of the organic vehicle, and the butyl carbitol acetate accounting for 27%-42% by weight of the total weight of the organic vehicle.

[0057] Step S04: forming the porous ceramic substrate, the heating layer and the first dielectric layer into an integral structure by sintering.

[0058] Specifically, the porous ceramic substrate 13, the heating layer 14, and the first dielectric layer 15 are sintered at a certain temperature (maximum temperature: 1100°C, sintering time: 30 minutes). That is, a co-firing process is used to form the porous ceramic substrate 13, the heating layer 14, and the first dielectric layer 15 into an integral structure. The first dielectric layer 15 and the heating layer 14 have the same pattern.

[0059] In other embodiments, the porous ceramic substrate 13, the heating layer 14 and the first dielectric layer 15 can be formed by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., or a combination of multiple processes can be used; the porous ceramic substrate 13, the heating layer 14 and the first dielectric layer 15 can also be formed into an integrated structure using a non-co-firing process, which can be selected according to needs.

[0060] It is understandable that pins need to be set on the heating layer 14 of the heating component 11 to electrically connect with the battery 21, and the pins are coated with silver paste to prevent the pins from being corroded by the matrix to be atomized or the atomized aerosol, thereby playing a protective role; other metal coatings can also be used to protect the pins, and the selection can be made according to needs.

[0061] The heating component 11, heating component No. 1 and heating component No. 2 in the first embodiment are compared to prove the pros and cons of their performances. Among them, heating component No. 1 is composed of a porous ceramic substrate 13 and a heating layer 14, wherein the main material of the heating layer 14 is nickel; heating component No. 2 is composed of a porous ceramic substrate 13 and a heating layer 14, wherein the main material of the heating layer 14 is nickel-chromium. For the convenience of statistics, the heating component 11 in the first embodiment of the present application is referred to as heating component No. 3; heating component No. 3 is composed of a porous ceramic substrate 13, a heating layer 14 and a first dielectric layer 15, wherein the material of the heating layer 14 is nickel, and the main material of the first dielectric layer 15 is Si-Zn-Ba glass system.

[0062] Experiment 1: Heating components No. 1, No. 2, and No. 3 were immersed in 4% acetic acid for immersion experiments. The experimental results are shown in Table 1.

[0063] Table 1 4% acetic acid immersion results

[0064] Fever group Ni leaching amount in 4% acetic acid (μg / ml) Number Three Below the instrument detection limit Number Two 16.20 Number One 19.00

[0065] Experiment 2: Heating components No. 1, No. 2, and No. 3 were immersed in 57 mg of mango-scented atomized matrix for immersion experiments. The experimental results are shown in Table 2.

[0066] Table 2 Mango 57mg e-liquid immersion results

[0067] Heating components Ni content extracted from mango e-liquid (g / ml) Cr content extracted from mango e-liquid (g / ml) Number Three Below the instrument detection limit none Number Two 3.0 1 Number One 3.50 none

[0068] Experiment 3: Heating components No. 1, No. 2, and No. 3 were subjected to life test experiments under the conditions of constant power of 6.5W, 3s on and 8s off, and 50 cycles in air. The experimental results are shown in Table 3.

[0069] Table 3 Dry burning life test

[0070] Heating components Test results Number Three 50 times without burning, no change in resistance after cooling Number Two Burned out after 12 times Number One 50 times without burning, no change in resistance after cooling

[0071] Experiment 4: Heating components No. 1, No. 2, and No. 3 were subjected to life test experiments under the conditions of power 6.5W, 3S on and 8S off, and 50 cycles in propylene glycol. The test conditions are: constant power 6.5W, 3S on and 8S off, and 200 cycle life tests in propylene glycol. The experimental results are shown in Table 4.

[0072] Table 4 Wet burning life test

[0073] Heating components Test results Number Three 200 times without failure, normal smoke volume Number Two 200 times without failure, normal smoke volume Number One 200 times without failure, normal smoke volume

[0074] The experimental results in Tables 1 and 2 show that the metal ion dissolution of the heating component 11 (heating component No. 3) of the first embodiment of the present application is significantly reduced or undetectable. The experimental results in Tables 3 and 4 show that the service life of the heating component 11 (heating component No. 3) of the first embodiment of the present application is longer than that of the existing heating component 11. Therefore, the heating component 11 of the present application can significantly reduce the safety hazards posed to users by the heating layer 14 material.

[0075] See also Figure 4 , is a structural diagram of the second embodiment of the heating component provided in this application.

[0076] In the second embodiment, the structure of the heating component 11 is substantially the same as that in the first embodiment, except that the heating component 11 further includes a second dielectric layer 16 .

[0077] In this embodiment, the heating component 11 includes a porous ceramic substrate 13, a heating layer 14, a first dielectric layer 15, and a second dielectric layer 16. The second dielectric layer 16 is laminated to the surface of the heating layer 14 near the porous ceramic substrate 13, and the second dielectric layer 16 is laminated to the porous ceramic substrate 13. The second dielectric layer 16 can be a glass phase, an inorganic non-metallic composite material, a ceramic film layer, etc. that is stable in the substrate to be atomized or the atomized aerosol, and can block the contact between the substrate to be atomized or the atomized aerosol and the heating layer 14, and improve the film-base bonding strength of the heating layer 14 (that is, the bonding strength between the heating layer 14 and other components in the heating component).

[0078] In this embodiment, the second dielectric layer 16 includes a glass phase and a non-glass phase of an inorganic non-metallic material. The glass phase accounts for 77% to 93% of the total weight of the second dielectric layer 16, and the non-glass phase of the inorganic non-metallic material accounts for 7% to 23% of the total weight of the second dielectric layer 16.

[0079] The second dielectric layer 16 is made by drying the second slurry. The second slurry includes a glass phase, a non-glass phase inorganic non-metallic material and an organic carrier. The organic carrier includes a resin and a solvent. During the drying process of the second slurry, the organic carrier continues to volatilize. Therefore, the second dielectric layer 16 includes a glass phase and a non-glass phase inorganic non-metallic material. The difference between the second dielectric layer 16 and the second slurry is whether it contains an organic carrier. Among them, the non-glass phase inorganic non-metallic material is a high-melting-point inorganic non-metallic material (melting point greater than 1800°C), and its melting point is higher than the melting point of the glass phase. The components and proportions of the second slurry and the first slurry are basically the same and will not be repeated.

[0080] By setting a second dielectric layer 16 between the heating layer 14 and the porous ceramic substrate 13, the second dielectric layer 16 is a dense layer that blocks the contact between the substrate to be atomized on the surface of the porous ceramic substrate 13 near the heating layer 14 and the heating layer 14, thereby greatly slowing down the corrosion of the substrate to be atomized on the heating layer 14. At the same time, the second dielectric layer 16 includes a first surface and a second surface that are arranged opposite to each other. The first surface is arranged in contact with the heating layer 14, and the second surface is arranged in contact with the porous ceramic substrate 13. The bonding strength between the second dielectric layer 16 and the heating layer 14 and the porous ceramic substrate 13 is greater than the bonding strength between the heating layer 14 and the porous ceramic substrate 13. Therefore, the bonding strength between the heating layer 14 and the porous ceramic substrate 13 is improved by the second dielectric layer 16, that is, the bonding strength of the membrane base is improved, thereby reducing the risk of the heating layer 14 falling off, that is, improving the adverse effects caused by thermal vibration. It can be understood that the non-glass phase inorganic non-metallic material in the second dielectric layer 16 acts as a skeleton, which can improve the matching and bonding strength of the membrane base.

[0081] It is understood that the ratio of the various components in the second dielectric layer 16 can be selected based on the thermal expansion coefficients of the porous ceramic substrate 13 and the heating layer 14 to improve the bonding strength of the membrane substrate while reducing the risk of the heating layer 14 falling off, thereby improving the adverse effects of thermal vibration. If the surface of the heating layer 14 near the porous ceramic substrate 13 is less corroded by the substrate to be atomized, the bonding strength between the heating layer 14 and the porous ceramic substrate 13 is strong, and the impact of thermal vibration on the membrane substrate is small, it is possible to choose not to set the second dielectric layer 16 between the heating layer 14 and the porous ceramic substrate 13. The setting of the second dielectric layer 16 is selected according to specific needs.

[0082] The materials of the first dielectric layer 15 and the second dielectric layer 16 enable them to exist stably in the substrate to be atomized or the atomized aerosol, and are almost uncorroded by the substrate to be atomized or the atomized aerosol. By arranging the second dielectric layer 16 between the heating layer 14 and the porous ceramic substrate 13, and arranging the first dielectric layer 15 in contact with the surface of the heating layer 14 away from the porous ceramic substrate 13, since the heating layer 14 and the first dielectric layer 15 and the second dielectric layer 16 are all dense layers, the first dielectric layer 15 and the second dielectric layer 16 can block the substrate to be atomized or the atomized aerosol from contacting the heating layer 14, greatly reducing the corrosion of the substrate to be atomized or the atomized aerosol on the heating layer 14, and extending its service life; and reducing the requirements for the heavy metal content (such as chromium) in the heating layer 14 material. By providing the first dielectric layer 15 and the second dielectric layer 16 to protect the heating layer 14, the heating layer 14 can be made of any metal or non-metal conductive phase that meets the functional standards, thereby greatly improving product safety. In order to cut off the safety hazards brought by harmful heavy metals or reduce costs, a metal or non-metal conductive phase without harmful heavy metals can even be selected.

[0083] In this embodiment, the material of the heating layer 14 does not contain toxic heavy metals; the heating layer 14 can be made of biomedical materials, such as titanium-based alloys, zirconium-based alloys, nickel-based alloys, silver-based alloys, iron-based alloys, etc., so that the heating layer 14 is easy to sinter, has high safety, and has excellent dry and wet burning properties.

[0084] See also Figure 5 , is a flow chart of a method for manufacturing a heating component in the second embodiment of the heating component provided in this application.

[0085] The manufacturing method of the heating component 11 includes:

[0086] Step S01: obtaining a porous ceramic substrate.

[0087] Specifically, ceramic powder is prepared, and the porous ceramic matrix 13 is manufactured by screen printing and sintering.

[0088] Step S02: forming a second dielectric layer on the surface of the porous ceramic.

[0089] Specifically, the raw materials for forming the second dielectric layer 16 are made into a second slurry; the second slurry is screen-printed on the surface of the porous ceramic substrate 13; the porous ceramic substrate 13 and the first slurry are dried at a certain temperature (60-80°C) in an air atmosphere to form the second dielectric layer 16 on the surface of the porous ceramic substrate 13. The thickness of the second dielectric layer 16 is 5μm-60μm.

[0090] The second slurry includes a glassy phase, a non-glassy inorganic non-metallic material, and an organic vehicle, and the organic vehicle includes a resin and a solvent. In this embodiment, the glassy phase is a SiO2-ZnO-BaO system, and the glassy phase accounts for 50%-70% of the total weight of the second slurry. The non-glassy inorganic non-metallic material includes SiO2, has a particle size of 1μm-20μm, and accounts for 5%-15% of the total weight of the second slurry. The organic vehicle accounts for 25%-35% of the total weight of the second slurry. The organic vehicle includes a resin and a solvent, wherein the resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate, wherein the ethyl cellulose accounts for 3%-8% of the total weight of the organic vehicle, the terpineol accounts for 50%-70% of the total weight of the organic vehicle, and the butyl carbitol acetate accounts for 27%-42% of the total weight of the organic vehicle.

[0091] Step S03: forming a heating layer on the second dielectric layer away from the surface of the porous ceramic substrate.

[0092] Specifically, the raw materials used to form the heating layer 14 are made into a resistor paste; the resistor paste is screen-printed on the surface of the second dielectric layer 16 away from the porous ceramic substrate 13; the porous ceramic substrate 13, the second dielectric layer 16, and the resistor paste are dried at a certain temperature (60-80°C) in an air atmosphere to form the heating layer 14 on the surface of the second dielectric layer 16 away from the porous ceramic substrate 13. In this embodiment, the main component of the resistor paste is nickel. The thickness of the heating layer 14 is 5μm-60μm, such as Figure 6 As shown ( Figure 6 is a topographic diagram of step S03 in the second embodiment of the heating component provided by the present invention).

[0093] Step S04: forming a first dielectric layer on the surface of the heating layer away from the porous ceramic substrate.

[0094] Specifically, the raw materials for forming the first dielectric layer 15 are made into a first slurry; the first slurry is screen-printed on the surface of the heating layer 14 away from the porous ceramic substrate 13; the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first slurry are dried at a certain temperature (60-80°C) in an air atmosphere to form the first dielectric layer 15 on the surface of the heating layer 14 away from the porous ceramic substrate 13. The thickness of the first dielectric layer 15 is 5μm-60μm, and the resistance value is 0.7Ω-0.9Ω. Figure 7 As shown ( Figure 7 is a topographical diagram of step S04 in the second embodiment of the heating component provided by the present invention).

[0095] The first slurry includes a glass phase, a non-glass phase inorganic non-metallic material, and an organic vehicle, and the organic vehicle includes a resin and a solvent. In this embodiment, the glass phase is a SiO2-ZnO-BaO system, and the glass phase accounts for 50%-70% by weight of the total weight of the first slurry. The non-glass phase inorganic non-metallic material includes SiO2, the particle size of the non-glass phase inorganic non-metallic material is 1μm-20μm, and the non-glass phase inorganic non-metallic material accounts for 5%-15% by weight of the total weight of the first slurry. The organic vehicle accounts for 25%-35% by weight of the total weight of the first slurry. The organic vehicle includes a resin and a solvent, the resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate, with the ethyl cellulose accounting for 3%-8% by weight of the total weight of the organic vehicle, the terpineol accounting for 50%-70% by weight of the total weight of the organic vehicle, and the butyl carbitol acetate accounting for 27%-42% by weight of the total weight of the organic vehicle.

[0096] Step S05: forming the porous ceramic substrate, the second dielectric layer, the heating layer and the first dielectric layer into an integral structure by sintering.

[0097] Specifically, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first dielectric layer 15 are sintered at a certain temperature (the highest temperature is 1100° C., and the sintering time is 30 minutes). That is, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first dielectric layer 15 are formed into an integral structure by a co-firing process. Figure 8 As shown ( Figure 8 1 is a structural diagram of step S05 in the second embodiment of the heating component provided by the present invention. The second dielectric layer 16, the heating layer 14 and the first dielectric layer 15 have the same pattern.

[0098] In other embodiments, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first dielectric layer 15 can be formed by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., or a combination of multiple processes can be used; the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first dielectric layer 15 can also be formed into an integrated structure using a non-co-firing process, which can be selected according to needs.

[0099] See also Figure 9 , is a structural diagram of the third embodiment of the heating component provided in this application.

[0100] In the third embodiment, the structure of the heating component 11 is substantially the same as that in the second embodiment, except that the heating component 11 further includes a third dielectric layer 17 .

[0101] In this embodiment, the heating component 11 includes a porous ceramic substrate 13, a heating layer 14, a first dielectric layer 15, a second dielectric layer 16 and a third dielectric layer 17. The third dielectric layer 17 is attached to the surface of the second dielectric layer 16 away from the heating layer 14. A plurality of through holes are provided on the third dielectric layer 17 so that the third dielectric layer 17 forms a grid shape, thereby increasing the atomization area of ​​the atomization surface of the heating component 11. Usually, the substrate to be atomized enters the porous ceramic substrate 13 through the surface of the porous ceramic substrate 13 away from the heating layer 14, and the porous ceramic substrate 13 utilizes its capillary force to guide the substrate to be atomized from the surface of the porous ceramic substrate 13 away from the heating layer 14 to the surface close to the heating layer 14. After the substrate to be atomized reaches the surface of the porous ceramic substrate 13 close to the heating layer 14, since the first dielectric layer 15, the heating layer 14 and the second dielectric layer 16 are all dense layers, the through holes on the third dielectric layer 17 can be used to store the substrate to be atomized, which can prevent the heating component 11 from dry burning and reduce the temperature of the heating layer 14 to a certain extent. The third medium layer 17 can be a glass phase, an inorganic non-metallic composite material, a ceramic film layer, etc. that is stable in the substrate to be atomized or the atomized aerosol.

[0102] In this embodiment, the third dielectric layer 17 includes a glass phase and a non-glass phase inorganic non-metallic material. The glass phase accounts for 77% to 93% of the total weight of the third dielectric layer 17, and the non-glass phase inorganic non-metallic material accounts for 7% to 23% of the total weight of the third dielectric layer 17.

[0103] The third dielectric layer 17 is made by drying the third slurry. The third slurry includes a glass phase, a non-glass phase inorganic non-metallic material and an organic carrier. The organic carrier includes a resin and a solvent. During the drying process of the third slurry, the organic carrier continues to volatilize. Therefore, the third dielectric layer 17 includes a glass phase and a non-glass phase inorganic non-metallic material. The difference between the third dielectric layer 17 and the third slurry is whether it contains an organic carrier. Among them, the non-glass phase inorganic non-metallic material is a high-melting-point inorganic non-metallic material (melting point greater than 1800°C), and its melting point is higher than the melting point of the glass phase. The components and proportions of the third slurry and the first slurry are basically the same and will not be repeated.

[0104] See also Figure 10 , is a flow chart of a method for manufacturing a heating component in the third embodiment of the heating component provided in this application.

[0105] The manufacturing method of the heating component 11 includes:

[0106] Step S01: obtaining a porous ceramic substrate.

[0107] Specifically, ceramic powder is prepared, and the porous ceramic matrix 13 is manufactured by screen printing and sintering.

[0108] Step S02: forming a second dielectric layer on the surface of the porous ceramic.

[0109] Specifically, the raw materials for forming the second dielectric layer 16 are made into a second slurry; the second slurry is screen-printed on the surface of the porous ceramic substrate 13; the porous ceramic substrate 13 and the first slurry are dried at a certain temperature (60-80°C) in an air atmosphere to form the second dielectric layer 16 on the surface of the porous ceramic substrate 13. The thickness of the second dielectric layer 16 is 5μm-60μm.

[0110] The second slurry includes a glassy phase, a non-glassy inorganic non-metallic material, and an organic vehicle, and the organic vehicle includes a resin and a solvent. In this embodiment, the glassy phase is a SiO2-ZnO-BaO system, and the glassy phase accounts for 50%-70% of the total weight of the second slurry. The non-glassy inorganic non-metallic material includes SiO2, has a particle size of 1μm-20μm, and accounts for 5%-15% of the total weight of the second slurry. The organic vehicle accounts for 25%-35% of the total weight of the second slurry. The organic vehicle includes a resin and a solvent, wherein the resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate, wherein the ethyl cellulose accounts for 3%-8% of the total weight of the organic vehicle, the terpineol accounts for 50%-70% of the total weight of the organic vehicle, and the butyl carbitol acetate accounts for 27%-42% of the total weight of the organic vehicle.

[0111] Step S03: forming a heating layer on the second dielectric layer away from the surface of the porous ceramic substrate.

[0112] Specifically, the raw materials used to form the heating layer 14 are made into a resistor paste; the resistor paste is screen-printed onto the surface of the second dielectric layer 16, distal from the porous ceramic substrate 13. The porous ceramic substrate 13, the second dielectric layer 16, and the resistor paste are then dried at a predetermined temperature (60-80°C) in an air atmosphere to form the heating layer 14 on the surface of the second dielectric layer 16, distal from the porous ceramic substrate 13. In this embodiment, the resistor paste primarily comprises nickel. The thickness of the heating layer 14 ranges from 5 μm to 60 μm.

[0113] Step S04: forming a first dielectric layer on the surface of the heating layer away from the porous ceramic substrate.

[0114] Specifically, the raw materials used to form the first dielectric layer 15 are made into a first slurry; the first slurry is screen-printed on the surface of the heating layer 14 away from the porous ceramic substrate 13; in an air atmosphere, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first slurry are dried at a certain temperature (60-80°C) to form the first dielectric layer 15 on the surface of the heating layer 14 away from the porous ceramic substrate 13. The thickness of the first dielectric layer 15 is 5μm-60μm, and the resistance value is 0.7Ω-0.9Ω.

[0115] The first slurry includes a glass phase, a non-glass phase inorganic non-metallic material, and an organic vehicle, and the organic vehicle includes a resin and a solvent. In this embodiment, the glass phase is a SiO2-ZnO-BaO system, and the glass phase accounts for 50%-70% by weight of the total weight of the first slurry. The non-glass phase inorganic non-metallic material includes SiO2, the particle size of the non-glass phase inorganic non-metallic material is 1μm-20μm, and the non-glass phase inorganic non-metallic material accounts for 5%-15% by weight of the total weight of the first slurry. The organic vehicle accounts for 25%-35% by weight of the total weight of the first slurry. The organic vehicle includes a resin and a solvent, the resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate, with the ethyl cellulose accounting for 3%-8% by weight of the total weight of the organic vehicle, the terpineol accounting for 50%-70% by weight of the total weight of the organic vehicle, and the butyl carbitol acetate accounting for 27%-42% by weight of the total weight of the organic vehicle.

[0116] Step S05: forming a third dielectric layer on the surface of the first dielectric layer away from the heating layer.

[0117] Specifically, the raw materials used to form the third dielectric layer 17 are made into a third slurry; the third slurry is screen-printed on the surface of the first dielectric layer 15 away from the heating layer 14; in an air atmosphere, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14, the first dielectric layer 15 and the third slurry are dried at a certain temperature (60-80°C) to form the third dielectric layer 17 on the surface of the first dielectric layer 15 away from the heating layer 14, and the thickness of the third dielectric layer 17 is 5μm-60μm.

[0118] The third slurry includes a glassy phase, a non-glassy inorganic non-metallic material, and an organic vehicle. The organic vehicle includes a resin and a solvent. In this embodiment, the glassy phase is a SiO2-ZnO-BaO system, and the glassy phase accounts for 50%-70% of the total weight of the third slurry. The non-glassy inorganic non-metallic material includes SiO2, has a particle size of 1μm-20μm, and accounts for 5%-15% of the total weight of the third slurry. The organic vehicle accounts for 25%-35% of the total weight of the third slurry. The organic vehicle includes a resin and a solvent. The resin includes ethyl cellulose, and the solvent includes a system of terpineol and butyl carbitol acetate. The ethyl cellulose accounts for 3%-8% of the total weight of the organic vehicle, the terpineol accounts for 50%-70% of the total weight of the organic vehicle, and the butyl carbitol acetate accounts for 27%-42% of the total weight of the organic vehicle.

[0119] Step S06: forming the porous ceramic substrate, the second dielectric layer, the heating layer, the first dielectric layer and the third dielectric layer into an integral structure by sintering.

[0120] Specifically, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14, the first dielectric layer 15, and the third dielectric layer 17 are sintered at a certain temperature (maximum temperature is 1100°C, sintering time is 30 minutes). That is, a co-firing process is used to form the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14, the first dielectric layer 15, and the third dielectric layer 17 into an integral structure. The second dielectric layer 16, the heating layer 14, the first dielectric layer 15, and the third dielectric layer 17 have the same pattern.

[0121] In other embodiments, the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14, the first dielectric layer 15 and the third dielectric layer 17 can be formed by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., or a combination of multiple processes can be used; the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14, the first dielectric layer 15 and the third dielectric layer 17 can also be formed into an integrated structure by a non-co-firing process, which can be selected according to needs.

[0122] The heating component in the present application includes a porous ceramic substrate, a heating layer and a first dielectric layer. The heating layer is bonded to the porous ceramic substrate, and the first dielectric layer is bonded to the surface of the heating layer away from the porous ceramic substrate. The first dielectric layer includes inorganic non-metallic materials in glass phase and non-glass phase and an organic carrier. By arranging the first dielectric layer on the surface of the heating layer away from the porous ceramic substrate, the substrate to be atomized is blocked from contacting the heating layer, which greatly reduces the corrosion of the substrate to be atomized on the heating layer, prolongs the service life of the heating component, and further prolongs the service life of the electronic atomization device; and because the first dielectric layer blocks the corrosion of the substrate to be atomized on the heating layer, the heating layer can be made of a material without harmful heavy metals, which minimizes the safety hazards caused by the material of the heating layer in the heating component to the user of the electronic atomization device.

[0123] The above description is only part of the embodiments of the present application and does not limit the scope of protection of the present application. Any equivalent device or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly used in other related technical fields, are also included in the scope of patent protection of this application.

Claims

1. A heating component for an electronic atomization device, characterized in that: include: Porous ceramic matrix: A heating layer is provided in contact with the porous ceramic substrate; a first dielectric layer, disposed on a surface of the heating layer away from the porous ceramic substrate, the first dielectric layer being used to prevent the substrate to be atomized or the atomized aerosol from contacting the heating layer; a second dielectric layer, the second dielectric layer being bonded to a surface of the heating layer close to the porous ceramic substrate; a third dielectric layer, the third dielectric layer being attached to a surface of the first dielectric layer away from the heating layer; the third dielectric layer being provided with a plurality of through holes; The first dielectric layer, the second dielectric layer and the third dielectric layer all include inorganic non-metallic materials in glass phase and non-glass phase.

2. The heating component according to claim 1, characterized in that The weight percentage of the glass phase in the first dielectric layer, the second dielectric layer and the third dielectric layer is 77%-93%, and the weight percentage of the inorganic non-metallic material in the non-glass phase is 7%-23%.

3. The heating component according to claim 2, characterized in that The glass phase is a SiO2-ZnO-BaO system.

4. The heating component according to claim 2, characterized in that The non-glass phase inorganic non-metallic material is one or more of SiO2, Al2O3, and SiC, and the particle size of the inorganic non-metallic material is 1 μm-20 μm.

5. The heating component according to claim 1, characterized in that The thickness of the first dielectric layer, the second dielectric layer and the third dielectric layer is 5 μm-60 μm.

6. The heating component according to claim 1, characterized in that The patterns of the first dielectric layer, the second dielectric layer and the third dielectric layer are the same.

7. The heating component according to claim 1, characterized in that The raw material of the heating layer is a metal or non-metal conductive phase, and the thickness of the heating layer is 5 μm-60 μm.

8. The heating component according to claim 7, characterized in that: The raw material of the heating layer is one or more of silver-based alloy, nickel-based alloy, iron-based alloy, titanium-based alloy and zirconium-based alloy.

9. An electronic atomization device, characterized in that: It comprises a heating component, and the heating component is the heating component according to any one of claims 1 to 8.

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