Semiconductor package socket and method of manufacturing the same, and semiconductor package

Abstract

A socket for a semiconductor package capable of sufficiently ensuring a flat area of an element mounting surface is provided. The socket includes a hole portion formed with a through-hole passing through from a first surface to a second surface, and a metal block including a pedestal portion inserted into the through-hole and a columnar portion protruding from the pedestal portion, the columnar portion having a portion protruding from the first surface, the columnar portion including an element mounting surface for mounting a semiconductor element, and in plan view, an outer peripheral portion of the pedestal portion is exposed around the columnar portion.

Description

Technical Field

[0001] The present invention relates to a socket for semiconductor packaging, a method for manufacturing the same, and a semiconductor package. Background Art

[0002] There is a known structure: in a socket for semiconductor packaging for mounting a light-emitting element, for example, a metal block protruding from the upper surface of an eyelet in a disc shape is provided, and one surface of the metal block is used as an element mounting surface for mounting a semiconductor element. A plurality of through-holes for inserting lead terminals are provided in the eyelet, and the lead terminals are sealed by a sealing portion such as glass in the through-holes.

[0003] Patent Document 1: Japanese Patent Laid-Open No. 2004-235212

[0004] The element mounting surface for mounting a semiconductor element needs to be flat. Therefore, in a conventional socket for semiconductor packaging, for example, after a metal block is provided in an eyelet, a flat push (Japanese original text: 平押し) is performed by pressing from both sides with a metal mold across the element mounting surface and its opposite surface, and the element mounting surface is flattened by the flat push. However, in this method, the portion of the element mounting surface connected to the upper surface of the eyelet is prone to collapse and easily becomes R-shaped. As a result, it is difficult to sufficiently ensure a flat area of the element mounting surface. Summary of the Invention

[0005] The present invention has been made in view of the above points, and an object thereof is to provide a socket for semiconductor packaging that can sufficiently ensure a flat area of an element mounting surface.

[0006] The socket for semiconductor packaging of the present invention has: an eyelet in which through-holes penetrating from a first surface to a second surface are formed; a metal block including a pedestal portion and a columnar portion protruding from the pedestal portion, the pedestal portion being inserted into the through-hole, the columnar portion having a portion protruding from the first surface, the columnar portion including an element mounting surface for mounting a semiconductor element, and in a top view, an outer peripheral portion of the pedestal portion is exposed around the columnar portion.

[0007] According to the disclosed technology, a socket for semiconductor packaging that can sufficiently ensure a flat area of an element mounting surface can be provided. Brief Description of the Drawings

[0008] Figure 1 is a diagram exemplifying a socket for semiconductor packaging according to a first embodiment.

[0009] Figure 2 is Figure 1 a partially enlarged cross-sectional view of part B of (b) of

[0010] Figure 3This is a diagram (one of the examples) illustrating the main parts of the manufacturing process of the semiconductor packaging socket according to the first embodiment.

[0011] Figure 4 This is a diagram (second example) illustrating the main parts of the manufacturing process of the semiconductor packaging socket according to the first embodiment.

[0012] Figure 5 This is an example of measuring the flatness of the component mounting surface.

[0013] Figure 6 This is a diagram illustrating a semiconductor package according to a second embodiment.

[0014] Explanation of reference numerals in the attached figures

[0015] 1. Semiconductor packaging socket

[0016] 2 Semiconductor Packaging

[0017] 10-hole eye

[0018] 10a, 20a, 30a upper surface

[0019] 10b, 20b, 30b lower surface

[0020] 10c Inner wall surface

[0021] 10 through holes

[0022] 11, 12, 13 Notch

[0023] 20 Metal substrate

[0024] 30 metal blocks

[0025] 30c side view

[0026] 30r component mounting surface

[0027] 41 First Lead

[0028] 42 Second lead

[0029] 50 Sealing section

[0030] 110 Light-emitting element

[0031] 120 cover

[0032] 120x opening

[0033] 130 Adhesive

[0034] 140 Transparent Components Detailed Implementation

[0035] The following description, with reference to the accompanying drawings, illustrates the methods for carrying out the invention. It should be noted that in the drawings, the same reference numerals are used for the same constituent parts, and sometimes repeated descriptions are omitted.

[0036] <First Implementation Method>

[0037] Figure 1 This is a diagram illustrating a semiconductor packaging socket according to an example of the first embodiment. Figure 1 (a) is a top view. Figure 1 (b) is along Figure 1 (a) is a cross-sectional view of line AA.

[0038] Reference Figure 1 The semiconductor packaging socket 1 of the first embodiment has an eyelet 10, a metal substrate 20, a metal block 30, a first lead 41, a second lead 42, and a sealing portion 50.

[0039] The eyelet portion 10 is a circular plate-shaped component. A through hole 10x is formed in the eyelet portion 10, extending from the upper surface 10a to the lower surface 10b.

[0040] It should be noted that, in this invention, "circular plate" refers to a shape that is approximately circular when viewed from above and has a predetermined thickness. The thickness relative to the diameter is not limited. Furthermore, this includes cases where recesses, protrusions, through holes, etc., are partially formed. Additionally, in this invention, "viewing from above" refers to observing the object from the normal direction of the upper surface 10a of the aperture portion 10, and "view shape" refers to the shape of the object when viewed from the normal direction of the upper surface 10a of the aperture portion 10.

[0041] In top view, notches 11, 12, and 13 are formed on the outer edge of the eyelet 10, with a shape that is recessed from the outer periphery to the center. Notches 11, 12, and 13 are, for example, recesses with a generally triangular or generally quadrilateral shape in top view. Notches 11 and 12 can be arranged opposite each other, for example.

[0042] Notches 11 and 12 can be used, for example, to determine the position of the mounting surface of the semiconductor device mounted on the semiconductor package socket 1. Notch 13 can be used, for example, to determine the position of the rotation direction of the semiconductor package socket 1. However, notches 11, 12, and 13 can be provided as needed.

[0043] The diameter of the eyelet 10 is not particularly limited and can be appropriately determined according to the purpose, for example, for The thickness of the eyelet 10 is not particularly limited and can be appropriately determined according to the purpose, for example, about 0.5 to 3 mm.

[0044] The eyelet 10 can be formed of a metallic material such as iron or stainless steel. The eyelet 10 can also be formed of a metallic material (e.g., a composite material) with multiple layers of metal (copper, iron, etc.) stacked on top of each other. A plating layer can be applied to the surface of the eyelet 10.

[0045] The metal substrate 20 is a component with a top-view shape that is slightly smaller than that of the eyelet 10 and is approximately circular. That is, in top view, the metal substrate 20 is smaller than the eyelet 10, and there is no portion of the metal substrate 20 that protrudes compared to the eyelet 10. No through-hole is formed in the metal substrate 20 except for the portions through which the first lead 41 and the second lead 42 pass. The metal substrate 20 is joined to the lower surface 10b of the eyelet 10 in a manner that closes one end of the through-hole 10x.

[0046] The thickness of the metal substrate 20 is thinner than the thickness of the eye portion 10, for example, by about 0.1 to 0.4 mm. The thermal conductivity of the metal substrate 20 is greater than or equal to that of the eye portion 10. For example, if the material of the eye portion 10 is iron, copper, which has a better thermal conductivity than the eye portion 10, can be used as the material of the metal substrate 20. In this case, the heat dissipation performance of the semiconductor packaging socket 1 can be improved.

[0047] When the material of the aperture 10 is iron, iron can also be used as the material of the metal substrate 20. Thus, when the aperture 10 and the metal substrate 20 are formed of the same material, their coefficients of thermal expansion are the same. Therefore, heat-based deformation of the aperture 10 and the metal substrate 20 can be suppressed, enabling the fabrication of a semiconductor package (see reference 1) that mounts a semiconductor element onto the semiconductor package socket 1. Figure 6 When this is done, it can improve the hermeticity of semiconductor packaging.

[0048] The metal block 30 has a pedestal portion 31 and a columnar portion 32 protruding from the upper surface 31a of the pedestal portion 31. The pedestal portion 31 and the columnar portion 32 are integrally formed. The columnar portion 32 includes a component mounting surface 30r for mounting semiconductor components (e.g., light-emitting components such as lasers). The component mounting surface 30r is provided in a manner that is substantially perpendicular to the upper surface 10a of the eyelet portion 10. It should be noted that the upper surface 31a of the pedestal portion 31 is not limited to a flat surface.

[0049] The pedestal portion 31 is inserted into the through hole 10x of the eyelet portion 10 and engages with the metal substrate 20 within the through hole 10x. The columnar portion 32 has a portion protruding from the upper surface 10a of the eyelet portion 10. Most of the columnar portion 32 protrudes from the upper surface 10a of the eyelet portion 10. The entire portion of the columnar portion 32 may protrude from the upper surface 10a of the eyelet portion 10, but preferably the pedestal portion 31 side of the columnar portion 32 is located within the through hole 10x. The lower surface 30b of the metal block 30 is substantially flush with the lower surface 10b of the eyelet portion 10.

[0050] In top view, the outer periphery of the upper surface 31a of the pedestal portion 31 is exposed around the columnar portion 32. In the outer periphery of the upper surface 31a of the pedestal portion 31 exposed around the columnar portion 32, the width of the component mounting surface 30r side is narrower than the width of the other surfaces of the columnar portion 32. In other words, in top view, the center of the columnar portion 32 is offset relative to the center of the pedestal portion 31 along the AA line direction towards the first lead 41 and the second lead 42. In the outer periphery of the upper surface 31a of the pedestal portion 31 exposed around the columnar portion 32, the width of the component mounting surface 30r side is, for example, about 0.05 mm, and the width of the other surfaces of the columnar portion 32 is, for example, about 0.5 mm. By setting it to this shape, the area where the first lead 41 and the second lead 42 are disposed in the eyelet portion 10 can be sufficiently ensured.

[0051] In top view, the pedestal portion 31 is generally rectangular, but the corners at both ends of the first side (the side of the first lead 41 and the second lead 42) on the component mounting surface 30r side of the pedestal portion 31 are rounded, and the corners at both ends of the second side opposite to the first side are rounded with a larger radius than the corners at both ends of the first side. By setting the pedestal portion 31 to the above shape, it is easy to arrange the pedestal portion 31 along the shape of the eyelet portion 10.

[0052] In top view, the columnar portion 32 is roughly rectangular, but the corners of both ends of the first side on the component mounting surface 30r side of the columnar portion 32 are rounded, and the corners of both ends of the second side opposite to the first side are rounded to the same degree as the corners of the first side. The columnar portion 32 is used to mount and fix the semiconductor component when the semiconductor package socket 1 is used as a semiconductor package that mounts a semiconductor component, and also functions as a heat sink for dissipating heat emitted from the semiconductor component. By setting the columnar portion 32 to the above shape, the volume of the columnar portion 32 can be sufficiently ensured, thereby improving heat dissipation.

[0053] The distance between the upper surface 30a of the metal block 30 and the upper surface 10a of the eyelet 10 (the amount by which the columnar portion 32 protrudes from the upper surface 10a of the eyelet 10) is, for example, about 2 to 3 mm. A material with a higher thermal conductivity than the eyelet 10 can be used in the metal block 30. If the material of the eyelet 10 is iron, then, for example, the material of the metal block 30 is copper.

[0054] Figure 2 yes Figure 1 A partially enlarged sectional view of part B in (b). Figure 2 As shown, a portion of the preferred component mounting surface 30r is located within the through hole 10x. Due to manufacturing reasons, the base portion 31 side of the component mounting surface 30r on the metal block 30 becomes a collapsed area. This collapsed area is R-shaped and uneven. By having a portion of the component mounting surface 30r located within the through hole 10x, the collapsed area of ​​the component mounting surface 30r can be incorporated into the through hole 10x. Preferably, the entire collapsed area of ​​the component mounting surface 30r is located within the through hole 10x. Therefore, the area of ​​the flat region of the component mounting surface 30r protruding from the upper surface 10a of the eyelet portion 10 can be set to be larger. As a result, larger components can be mounted.

[0055] return Figure 1 As described above, the first lead 41 and the second lead 42 are inserted into the through hole of the through hole portion 10 and the metal substrate 20 in the thickness direction with their length direction facing the thickness direction. The first lead 41 and the second lead 42 are sealed around the through hole portion 10 by the sealing portion 50. A portion of the first lead 41 and the second lead 42 protrudes from the upper surface 10a of the through hole portion and the lower surface 20b of the metal substrate 20. The amount by which the first lead 41 and the second lead 42 protrude from the lower surface 20b of the metal substrate 20 is, for example, about 6 to 7 mm.

[0056] The first lead 41 and the second lead 42 are formed, for example, of a metal of 50% iron-nickel alloy, Kovar alloy, etc., and the sealing portion 50 is formed, for example, of an insulating material such as glass. The first lead 41 and the second lead 42 are electrically connected, for example, to a semiconductor element mounted on the semiconductor package socket 1. It should be noted that the number of leads can be increased depending on the specifications of the mounted semiconductor element.

[0057] Figure 3 as well as Figure 4 This diagram illustrates the main parts of the manufacturing process of a semiconductor packaging socket according to the first embodiment.

[0058] First, such as Figure 3As shown, a metal block 30 is fabricated, comprising a base portion 31 and a columnar portion 32 protruding from the base portion 31. To fabricate the metal block 30, for example, a rod-shaped material is drawn to form a predetermined shape, and then cut to create a single sheet. Each single sheet of material becomes the base portion 31 and the columnar portion 32. Then, a metal mold is used to shape each single sheet of material. Specifically, for each single sheet of material, the portion forming the columnar portion 32 is pressed from the periphery using the metal mold, flattening the portion that becomes the component mounting surface 30r. As a result, the pressed portion becomes smaller than the unpressed portion. That is, the pressed portion becomes the columnar portion 32, and the unpressed portion becomes the base portion 31, thus completing the process. Figure 3 The shape. In top view, the outer periphery of the pedestal portion 31 is exposed around the columnar portion 32. It should be noted that flatness here refers to a surface with a flatness of approximately 0.005 mm MAX. It should be noted that in Figure 3 In the image, a pear-skin pattern is used to show the flat portion of the component mounting surface 30r.

[0059] Next, as Figure 4 As shown in (a), an eyelet 10 is formed by stamping or the like, having a through hole 10x extending from the upper surface 10a to the lower surface 10b and a through hole for lead insertion. A first lead 41 and a second lead 42 are inserted into the through hole for lead insertion, and a sealing part 50 seals the area around the first lead 41 and the second lead 42 within the through hole.

[0060] Next, as Figure 4 As shown in (b), a metal bonding material (not shown) is disposed on the upper surface 20a of the metal substrate 20, and further disposed on the metal bonding material. Figure 4 The structure shown in (a) is as follows. The base portion 31 of the metal block 30 is inserted into the through hole 10x of the eyelet portion 10, and is arranged such that at least a portion of the columnar portion 32 protrudes from the upper surface 10a of the eyelet portion 10. The lower surface 30b of the metal block 30 is in contact with a metal bonding material.

[0061] Next, as Figure 4As shown in (c), the metal bonding material is heated to a temperature higher than its melting point to melt it, and then solidified. At this time, the eyelet 10 and the metal block 30 can be pressed against the metal substrate 20. Since the metal bonding material becomes thinner in a substantially uniform manner due to melting, the lower surface 30b of the metal block 30 becomes substantially flush with the lower surface 10b of the eyelet 10. In addition, a portion of the molten metal bonding material enters the gap between the side surface of the pedestal portion 31 (i.e., a portion of the side surface 30c of the metal block 30) and the inner wall surface 10c of the through hole 10x of the eyelet 10 due to capillary action, and solidifies while filling the gap. Thus, the eyelet 10, the metal substrate 20, and the metal block 30 are joined together.

[0062] Thus, the lower surface 30b of the metal block 30 is bonded to the upper surface 20a of the metal substrate 20 via a metal bonding material, and the side surface 30c of the metal block 30 is bonded to the inner wall surface 10c of the through hole 10x of the eye portion 10 via a metal bonding material. Additionally, the lower surface 10b of the eye portion 10 is bonded to the upper surface 20a of the metal substrate 20 via a metal bonding material. As described above, the semiconductor packaging socket 1 is completed.

[0063] It should be noted that the manufacturing process of a semiconductor package in which a semiconductor element is mounted in a semiconductor package socket 1 may include a process involving heating to approximately 300°C. Therefore, as the metal bonding material for joining the eyelet 10, the metal substrate 20, and the metal block 30, a material with a melting point of 350°C or higher is preferably selected. For example, silver solder with a melting point of approximately 800°C can be used as the metal bonding material.

[0064] However, in conventional semiconductor packaging sockets, this process is not performed. Figure 3 The forming process described in the illustrated steps. In contrast, in... Figure 4 After step (c), a flat-pushing process is performed, pressing down from both sides using a metal mold across the component mounting surface and its opposite side to flatten the component mounting surface. However, in this method, the portion of the component mounting surface that connects to the upper surface of the eyelet tends to collapse and become R-shaped, making it difficult to adequately ensure a flat area for the component mounting surface. Furthermore, in this method, there is a concern that stress during the flat-pushing process could be transferred to the sealing portion that seals the lead terminals, potentially causing cracks in the sealing portion.

[0065] In contrast, in the semiconductor packaging socket 1, since the device mounting surface is flattened by forming the metal block in a single-piece state, a planarization process is not required. That is, a metal block 30 including a base portion 31 and a columnar portion 32 protruding from the base portion 31 is pre-fabricated, and a structure is configured such that the base portion 31 is inserted into the through hole 10x of the eye portion 10, and the columnar portion 32 has a portion protruding from the upper surface 10a of the eye portion 10. Thus, the semiconductor packaging socket 1 can achieve a region that sufficiently ensures the flatness of the device mounting surface 30r. Furthermore, the problem of cracks forming in the sealing portion 50 can be eliminated. Additionally, as... Figure 2 As shown, when the component mounting surface 30r is formed to be lower than the upper surface 10a of the eye portion 10, the flat area of ​​the component mounting surface 30r can be further ensured to be larger.

[0066] Figure 5 This is an example of measuring the flatness of the component mounting surface. Figure 5 The left half shows the data for the un-flattened component mounting surface of a conventional semiconductor packaging socket, serving as a comparative example. Additionally, Figure 5 The right half shows the data for the component mounting surface of the semiconductor packaging socket 1 in this embodiment. An upward arrow is shown on each side. Figure 5 The upper left and upper right halves indicate the locations where flatness was measured. Furthermore, in... Figure 5 The lower left and lower right halves, the x-axis represents the... Figure 5 The position of the arrow in the upper half of the image is shown, where "0" on the horizontal axis corresponds to the root of the arrow, and "2.0mm" on the horizontal axis roughly corresponds to the tip of the arrow. Additionally, in... Figure 5 The lower left and lower right halves of the axis represent the height of the flat portion at the root of the arrow when its height is "0". In this example, in Figure 5 In the comparative example chart in the lower left half, compared to... Figure 5 Compared to the lower right half of the diagram in this embodiment, the tip of the arrow is approximately 80 μm lower. If... Figure 5 The left half and Figure 5 Comparing the right half, it can be seen that, compared with conventional semiconductor package sockets, the semiconductor package socket 1 has a smaller collapsed edge area on the component mounting surface. That is, in the semiconductor package socket 1, even without flattening, a larger flat area can be ensured on the component mounting surface 30r. Furthermore, in the semiconductor package socket 1, since the collapsed edge area can be configured to be lower than the upper surface 10a of the aperture portion 10, a larger flat area can be further ensured on the component mounting surface 30r.

[0067] Furthermore, in the semiconductor packaging socket 1, a metal substrate 20 with a thermal conductivity greater than or equal to that of the eye 10 is bonded to the lower surface 10b of the eye portion 10 in a manner that closes one end of the through hole 10x. One end of the metal block 30 (lower surface 30b side) is inserted into the through hole 10x and bonded to the metal substrate 20 within the through hole 10x, while the other end (upper surface 30a side) protrudes from the upper surface 10a of the eye portion 10. Additionally, the lower surface 30b of the metal block 30 is substantially flush with the lower surface 10b of the eye portion 10.

[0068] With this structure, the lower surface 30b of the metal block 30 can be positioned close to the metal substrate 20 of the heat sink when the semiconductor element is mounted on the metal block 30. Furthermore, by inserting the metal block 30 into the through-hole 10x, the volume of the metal block 30 can be increased. As a result, the heat dissipation performance of the semiconductor packaging socket 1 can be improved.

[0069] <Second Implementation Method>

[0070] In the second embodiment, an example of a semiconductor package for a light-emitting element, in which a semiconductor element is mounted in a semiconductor package socket according to the first embodiment, is shown. It should be noted that in the second embodiment, descriptions of components identical to those in the already described embodiments are sometimes omitted.

[0071] Figure 6 This is a diagram illustrating a semiconductor package according to an example of a second embodiment. Figure 6 (a) is a top view. Figure 6 (b) is along Figure 6 (a) is a cross-sectional view of the BB line.

[0072] Reference Figure 6 Semiconductor package 2 has a semiconductor package socket 1 (see reference). Figure 1 (etc.), light-emitting element 110, cover 120, adhesive 130, and transparent component 140.

[0073] The light-emitting element 110 is, for example, a semiconductor laser chip with a wavelength of 405 nm, 650 nm, or 780 nm. The light-emitting element 110 is fixed to the element mounting surface 30r of the metal block 30 with one end facing upwards (towards the transparent component 140) and the other end facing downwards (towards the upper surface 10a of the aperture portion 10). In the semiconductor package 2, for example, the light-emitting element 110 is mounted such that the position of the light-emitting point of the light-emitting element 110 in top view is approximately aligned with the center of the upper surface 10a of the aperture portion 10. The electrodes (not shown) of the light-emitting element 110 are connected to the first lead 41 and the second lead 42, for example, via bonding wires.

[0074] The cover 120 is formed of a metal such as iron or copper, and has an opening 120x (window) in approximately the center when viewed from above. The transparent component 140 is formed of glass, and is bonded to the inner side of the opening 120 via an adhesive 130 made of a low-melting-point glass or the like, in a manner that closes the opening 120x. The cover 120, to which the transparent component 140 is bonded via the adhesive 130, is joined to the vicinity of the outer edge of the upper surface 10a of the opening 10 via welding or the like, thereby providing an airtight seal for the light-emitting element 110.

[0075] Light (e.g., laser light) emitted from one end face of the self-emissive element 110 passes through the transparent member 140 within the opening 120x and is emitted to the outside of the semiconductor package 2. It should be noted that the light emitted from the other end face of the self-emissive element 110 can be received by a photodiode, thereby allowing the amount of light emitted by the light-emitting element 110 to be observed. The amount of light received by the photodiode is controlled by a circuit disposed outside the semiconductor package 2, thereby ensuring a constant amount of light emitted from the semiconductor package 2 regardless of ambient temperature or other factors.

[0076] In this way, the light-emitting element 110 can be mounted on the element mounting surface 30r of the semiconductor packaging socket 1 to realize the semiconductor package 2. Compared with conventional semiconductor packaging sockets, the flat area of ​​the element mounting surface of the semiconductor packaging socket 1 is larger, so the mounting of the light-emitting element 110 is easier in the semiconductor package 2. In addition, compared with conventional semiconductor packaging sockets, the semiconductor packaging socket 1 has excellent heat dissipation performance, so the heat emitted by the light-emitting element 110 can be efficiently dissipated to the outside in the semiconductor package 2.

[0077] It should be noted that, although the second embodiment shows an example of mounting a light-emitting element 110 in the semiconductor package socket 1, it is not limited to this. Other heat-generating semiconductor elements besides the light-emitting element can be mounted in the semiconductor package socket 1. Furthermore, the semiconductor package with the semiconductor element mounted in the semiconductor package socket 1 can be used for various sensors, inflators, etc.

[0078] While the preferred embodiments have been described in detail above, they are not limited to the embodiments described above. Various modifications and substitutions can be applied to the embodiments without exceeding the scope of the claims.

Claims

1. A semiconductor packaging socket, comprising: The eyelet portion has a through hole extending from the first surface to the second surface; and A metal block, comprising a pedestal portion and a columnar portion protruding from the pedestal portion. The aforementioned pedestal portion is inserted into the aforementioned through hole, and the aforementioned columnar portion has a portion protruding from the aforementioned first surface. The aforementioned columnar portion includes a component mounting surface for mounting semiconductor components. In a top view, the outer periphery of the aforementioned pedestal portion is exposed around the aforementioned columnar portion. The aforementioned base portion of the mounting surface of the aforementioned component is a collapsed edge area. All of the aforementioned collapsed areas are located within the aforementioned through holes.

2. The semiconductor packaging socket according to claim 1, wherein, In the outer periphery of the pedestal portion exposed around the columnar portion, the width of the component mounting surface is narrower than the width of the other surfaces of the columnar portion.

3. The semiconductor packaging socket according to claim 1 or 2, wherein, In a top view, the aforementioned pedestal portion is generally rectangular. The corners at both ends of the first side of the aforementioned pedestal portion on the component mounting surface side are rounded, and the corners at both ends of the second side opposite to the first side are rounded with a radius larger than that of the corners at both ends of the first side.

4. The semiconductor packaging socket according to claim 1 or 2, wherein, It also has a metal substrate that is joined to the second surface in such a way that one end of the aforementioned through hole is closed. The aforementioned pedestal portion is inserted into the aforementioned through hole and is joined to the aforementioned metal substrate within the aforementioned through hole.

5. The semiconductor packaging socket according to claim 4, wherein, The thermal conductivity of the aforementioned metal substrate is greater than or equal to the thermal conductivity of the aforementioned aperture.

6. The semiconductor packaging socket according to claim 1, wherein, The aforementioned aperture includes a through hole that extends through the aperture, and a lead electrically connected to the aforementioned semiconductor element is inserted into the through hole.

7. A semiconductor package having: Semiconductor packaging socket according to any one of claims 1 to 6; and Semiconductor components mounted on the mounting surface of the aforementioned components.

8. A method for manufacturing a semiconductor packaging socket, comprising: The hole-eye manufacturing process involves creating a hole-eye with a through hole extending from the first surface to the second surface. The metal block manufacturing process involves manufacturing a metal block having a pedestal portion and a columnar portion protruding from the pedestal portion. as well as In the joining process, the pedestal portion is inserted into the through hole, and the metal block is joined to the eyelet portion in such a way that at least a portion of the columnar portion protrudes from the first surface. The above-mentioned metal block manufacturing process includes: The single-piece process involves drawing a rod-shaped material to form a specified shape, and then cutting it into single pieces. as well as In the planarization process, for each of the aforementioned monolithic materials, a metal mold is used to press the portion forming the columnar portion from the periphery, thereby planarizing the portion that becomes the mounting surface for mounting semiconductor devices. The pedestal portion side of the mounting surface becomes a collapsed edge area. In the aforementioned planarization process, from a top view, the outer periphery of the aforementioned pedestal portion is exposed around the aforementioned columnar portion. In the above-mentioned joining process, the entire collapsed area is located within the above-mentioned through hole.

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